Apparatus, electronic device and mobile device configured sense fingerprints

Devices, electronic devices and mobile devices configured to sense fingerprints

APPARATUS, ELECTRONIC DEVICE AND MOBILE DEVICE CONFIGURED TO SENSE FINGERPRINTS

<b>Cross references to related applications</b>

This application claims the U.S. Provisional Application No. 61/649,217 filed on May 18, 2012 called "Capacitive Sensor Packaging" and the U.S. Provisional Application filed on June 29, 2012 called "Capacitive Sensor Packaging" The priority of No. 61/666,607, and the U.S. Non-Provisional Application No. 13/842,920 named "Capacitive Sensor Packaging" filed on March 15, 2013, each of which is cited in its entirety Incorporated into this article.

This application is generally related to the circuit and packaging of the fingerprint sensor.

Capacitive sensing of fingerprints may allow responses to (on the one hand) one or more of the capacitive plates in the fingerprint recognition sensor and (on the other hand) the ridges and valleys of the users finger (such as the skin of the users finger, or It is possible that the different capacitance between the subcutaneous layer of the user's finger is measured to collect fingerprint information.

Sometimes the measurement of capacitance involves the introduction of charge on the skin of the user's finger. This can have the effect that only a small amount of charge can be introduced without making the user feel the charge (sometimes it will cause tingling or other perceptible effects on the skin of the user's finger).

Sometimes the measurement of capacitance involves a relatively small capacitance difference between (on the one hand) the capacitive plate of the fingerprint recognition sensor and (on the other hand) the ridges and valleys of the user's finger. For example, this will involve placing the user's finger as close as possible to the capacitive plate. This can have restricted fingerprint recognition Recognize the effect of sensor design flexibility.

Sometimes the measurement of capacitance involves positioning the user's finger relative to the fingerprint recognition sensor. For example, the user's finger may have to be placed in the conductive ring, which significantly limits the size and location of the fingerprint recognition sensor. This can also have the effect of limiting the design flexibility of the fingerprint recognition sensor.

Sometimes the measurement of capacitance involves capacitive coupling with a part of the user's finger that is not part of the skin. For example, capacitive coupling (or other fingerprint recognition sensing) may involve the subcutaneous layer of the user's finger. This may involve introducing a relatively large charge to conduct the capacitive coupling. As described in part above, this may have the effect that the user may feel the charge (sometimes causing tingling or other perceptible effects in a part of the user's finger).

Each of these examples and other possible considerations can cause problems for fingerprint recognition sensors and devices incorporating fingerprint recognition sensors (such as computing devices that use fingerprint recognition for authentication). The fingerprint recognition sensor may be limited in size or location or whether it can be relatively easily combined with other elements of the device incorporating the fingerprint recognition sensor. For the first example, this may have the effect that the fingerprint recognition sensor may not be easily incorporated into certain types of devices, such as relatively small devices like smartphones and touchpads. For the second example, this may have the effect that may require the fingerprint recognition sensor to be relatively fragile or otherwise subject to improper design constraints.

This application provides technologies including circuits and designs that can receive information about fingerprint images and can be incorporated into devices that use fingerprint recognition.

In one embodiment, the technology includes providing a fingerprint recognition sensor placed under other components, but the fingerprint recognition sensor is still placed relatively close to the user's finger during fingerprint recognition. The circuit can be placed under the button or under the display element, but the amount of distance between the one or more capacitive plates and the user's finger is reduced. For some examples, the circuit can be placed under the device element, where the fingerprint recognition sensor circuit itself is in one of the following ways One or more with reduced vertical spacing: (1) Use bond wires placed from the top of the circuit through one or more vias of the silicon wafer to couple the fingerprint recognition sensor circuit, (2) The fingerprint recognition sensor circuit is coupled to the fingerprint recognition sensor circuit using bonding wires placed through one or more trenches of the silicon wafer through the edge of the circuit, (3) the fingerprint recognition sensor circuit is encapsulated in at least partially removed In addition to plastic moldings, and (4) use compressed soldering elements (such as encapsulated solder balls) to couple the fingerprint recognition sensor circuit to other circuits.

In one embodiment, the circuit may embody or use a technology that uses components of the device to assist the fingerprint recognition sensor in fingerprint recognition. For some examples, one or more device elements may be used to place the circuit, where the one or more device elements assist the fingerprint recognition sensor circuit by one or more of the following methods: (1) In one of the devices The capacitive element is coupled to the side or close to the button or other device element, (2) The circuit element of the auxiliary fingerprint recognition sensor (or included in the fingerprint recognition sensor) is printed on the lower side of the button or other device element, ( 3) Couple the fingerprint recognition sensor circuit element to the button or other device elements that improve the electric field of the coupled fingerprint recognition sensor (such as an anisotropic element including sapphire or another substance), and (4) use a transparent Or semi-transparent buttons or other device elements perform optical sensing or infrared sensing in addition to capacitive sensing to assist the fingerprint recognition sensor circuit or be included in the fingerprint recognition sensor circuit.

In one embodiment, the circuit includes a technique for assisting a user by using components of a device including a fingerprint recognition sensor circuit when the fingerprint recognition sensor is used. For some examples, the circuit may be arranged using a device element, where the device element is arranged to assist the user by one or more of the following: (1) Use a button or other device at least in part The recessed shape formed by the component is used to help position the users finger for fingerprint recognition when using the fingerprint recognition sensor circuit, and the fingerprint recognition circuit is placed under buttons or other device components, and (2) the fingerprint recognition circuit is placed To provide tactile feedback on the one-touch response to press the button.

Although a number of embodiments are disclosed (including variants of a number of embodiments), but familiar with this technique Other embodiments of the present invention will be apparent to the skilled practitioner from the following [Embodiments], [Embodiments] show and describe illustrative embodiments of the present invention. As will be understood, the present invention can be modified in various obvious aspects without departing from the spirit and scope of the present invention. Therefore, the drawings and [implementations] should be regarded as illustrative in nature and not restrictive.

<p>100device</p><p>102Fingerprint Recognition Sensor</p><p>104 button</p><p>106Protective Glass Cover (CG) Frame</p><p>107Protective glass cover</p><p>108Button hole</p><p>110Screw holder</p><p>112Lens</p><p>114Grounding ring</p><p>115Button flange</p><p>116Flexible components</p><p>117Flexible components</p><p>118Tactile Dome Switch</p><p>120switch seal</p><p>122Button support plate</p><p>200Button Assembly</p><p>202Ink layer</p><p>204peripheral sealant</p><p>206Liquid laminated layer</p><p>208Silicon Package</p><p>210 Primer</p><p>212Reinforcement element</p><p>214Liquid adhesive</p><p>216VHB belt</p><p>218Touch switch (button switch)</p><p>302 Ridge and valley</p><p>304User's finger</p><p>306Concave shape</p><p>307Flat shape</p><p>308Silicon Wafer</p><p>310Circuit</p><p>312Structure</p><p>314Combination line</p><p>316Edge trench</p><p>318Solder Ball</p><p>700Sample lattice structure</p><p>702critical plane</p>

Although this specification ends with the scope of the patent application that specifically points out and clearly claims to be regarded as the subject matter of the present invention, it is believed that the present invention will be better understood according to the following description in conjunction with the accompanying drawings, in which: Figure 1 shows that it is included in A conceptual diagram of the fingerprint recognition sensor in a part of the device.

Figure 2 shows a conceptual diagram of the button assembly as partially described with reference to Figure 1, which shows the laminated layer.

Fig. 3 shows another conceptual diagram of the button assembly as partially described with reference to Fig. 1, which shows a fingerprint recognition sensor.

4A and 4B show another conceptual diagram of the button assembly as partially described with reference to FIG. 1, which shows a fingerprint recognition sensor.

FIG. 5 shows a conceptual diagram of a device having the button assembly as partially described with reference to FIG. 1, which shows a fingerprint recognition sensor.

Fig. 6 shows another conceptual diagram of a button assembly having a concave design with a flat lens.

Figure 7 generally shows a sample lattice structure 700 of sapphire.

The embodiments described herein generally disclose various structures and methods for packaging a sensor such as a capacitive sensor. The embodiments can disclose various placements of sensors, structures surrounding the sensors, connecting structures (electrical, physical or both) for the sensors, methods and structures for enhancing the imaging of the sensors, for The method and structure of holding the sensor, when the sensor itself The method and structure used to guide the hand guide to a proper position above the sensor when it cannot be seen by the user, and the like.

The embodiments described herein generally discuss the placement of the sensor in a recess in a frame (such as a protective glass cover, a sapphire element, or a lens). In other embodiments, the sensor may be embedded in a structure or housing (such as a plastic structure) of an electronic device or other suitable device. As yet another option, the frame may include an opening in which the sensor is placed, and plastic or another material overmolded over the sensor. In this embodiment, the overmolded or overflow material can replace any of the lenses mentioned herein.

figure 1

FIG. 1 shows a conceptual diagram of the fingerprint recognition sensor 102 included in a part of the device 100.

An exploded view of a portion of the device 100 shows an assembly of parts that are arranged to form the fingerprint recognition sensor 102 circuit and position the sensor 102 circuit under the push button. Although this application describes a specific combination of a specific push button and a specific sensor 102 circuit, in the context of the present invention, there is no specific requirement for any such limitation. For example, the push button may be placed slightly off-center with respect to the fingerprint recognition sensor 102 circuit. The effect is that the push button can still be effectively used for its purpose, while the sensor 102 circuit is still located nearby as specified by the user's hand Operate in combination. After reading this application, those skilled in the art will recognize that many other and additional example combinations will be within the scope and spirit of the present invention, will be usable, and will not require further invention or undue experimentation.

The protective glass cover (CG) frame 106 is arranged to be coupled to the protective glass cover 107 of the smartphone, the touch panel, the part of the mobile computing device, the input mechanism, the keys of the keyboard, the part of the input or output device housing, the vehicle, The panel or body of an appliance or the like, a touch screen or other device 100, and is arranged to be coupled to the frame of the device 100. (In many embodiments, the device 100 is some form of mobile computing device.) Protective glass cover frame 106 includes a button hole 108 arranged to locate a push button, and also includes a button hole 108 arranged to match the position of an external screw and arranged to receive horizontal screws for holding the protective glass cover frame 106 to the bottom plate when constructing the assembly (Described further below) at the appropriate location of one or more screw holders 110.

The button hole 108 in the protective glass cover frame 106 is arranged to hold a button 104 (which can form the top element of the push button, as described below), as shown in the figure. The button 104 is arranged to fit in the button hole 108. The button 104 includes a lens 112, and at least a part of the lens 112 helps to form a concave shape and has the effect of guiding the user's hand to the button 104. The concave shape can likewise be formed at least in part by a chamfer in the ground ring. In one embodiment, the button 104 may be made of one or more of the following materials or their equivalents: alumina, glass or chemically treated glass, sapphire, chemically treated compounds having at least some of its properties, Or another compound with similar properties. The lens 112 is placed in the ground ring 114. In one embodiment, the ground ring 114 can be used to shield electromagnetic effects, and has the effect of providing capacitive isolation or other electromagnetic isolation. In the figure, the ground ring 114 is shown as having a cylindrical edge that holds the lens 112, and a bottom plate that can be aligned or oriented within the device 100 when the assembly is constructed.

The button 104 is arranged above a fingerprint recognition sensor 102 circuit and is coupled to the fingerprint recognition sensor 102 circuit. In one embodiment, the circuit of the fingerprint recognition sensor 102 is relatively rectangular, and has the effect of sensing a two-dimensional (2D) image of a user's fingerprint. However, in an alternative embodiment, the fingerprint recognition sensor 102 circuit may be arranged in another shape (such as a circular or hexagonal shape that may also be suitable for receiving 2D fingerprint image information).

As described below, the fingerprint recognition sensor 102 includes a silicon wafer 308 on which a fingerprint recognition circuit is disposed, and the fingerprint recognition circuit is electrically coupled to other components of the device 100. The fingerprint recognition circuit is placed relatively close to the users finger. The effect is that the fingerprint recognition circuit can collect fingerprint images that respond to the ridges and valleys of the users finger in response to the measurement of the capacitance at each point on the users finger News. The following further describes the fingerprint recognition circuit and device Electrical coupling between other components of the component 100.

As described above, although this application mainly describes an assembly in which the fingerprint recognition sensor 102 circuit is arranged for capacitive coupling with the skin of the users finger, in the context of the present invention, there is no Specific requirements for this restriction. For example, the circuit of the fingerprint recognition sensor 102 may be capacitively coupled or electromagnetically coupled to the subcutaneous part of the user's finger. In addition, the fingerprint recognition sensor 102 circuit may be used to perform optical sensing, infrared sensing, or other sensing of the user's fingerprint, and may itself be related to the skin of the user's finger, the subcutaneous part of the user's finger, or to indicate the user's fingerprint. Some other feature is coupled to work in combination or in combination.

In one embodiment, the fingerprint recognition sensor 102 includes an integrated circuit, which includes one or more capacitive plates arranged in a two-dimensional (2D) array, and each capacitive plate is arranged to collect responses to At least some fingerprint image information of the ridges and valleys of the user's finger at one or more pixels in the array. This has the following effect: Although each capacitive plate collects fingerprint image information of one or more pixels in the array, their collection of capacitive plates collectively receives the 2D array of fingerprint image information. For example, the 2D array of fingerprint image information can be used to determine the substantial features of the users fingerprint, which can be used to register the users fingerprint in the database for later use, or the The other substantial features are compared with the registered fingerprint image information to identify the user's fingerprint and may respond to the fingerprint image information to identify the user.

The fingerprint recognition circuit is arranged above the flexible element 116 and is coupled to the flexible element 116. The flexible element 116 is arranged to receive any force imposed on the button 104 by the user's finger and transmit the force to the tactile hemisphere Switch 118 (described further below). The flexible element 116 is also arranged to receive electrical signals (such as fingerprint image information) from the fingerprint recognition sensor 102 and transmit these electrical signals from the fingerprint recognition sensor 102 to the processor.

The flexible element 116 is arranged above the tactile dome switch 118 and is coupled to the tactile dome switch 118. The tactile dome switch 118 receives the button 104 imposed by the user's finger Any force above transmits an electrical signal indicating that the user's finger has pressed the button 104 to the button-pressing circuit, and optionally provides tactile feedback to the user's finger to indicate that the button 104 has been pressed.

As further described herein, arranging the tactile dome switch 118 and the fingerprint recognition sensor 102 in a row has the effect of recognizing the user's fingerprint when the user designates his hand on the button 104. For example, the user may designate his hand to be located on the button 104 as part of the power-on or start-up sequence of the device 100. At this time, the device 100 may simultaneously (A) press the power-on or start-up sequence, and (B) receive information about Fingerprint image recognition of the user's finger, such as for user registration or authentication.

The tactile dome switch 118 is arranged above the switch seal 120 and is coupled to the switch seal 120. The switch seal 120 holds the tactile dome switch 118 and is held in place by the button support plate 122. The button support plate 122 is coupled to the bottom plate and is held in place by one or more vertical screws. As described above, the bottom plate and the protective glass cover frame 106 are also held in place by one or more horizontal screws. In one embodiment, the bottom plate also has other elements, such as holes for interfacing with other device elements, such as microphone jacks or other elements.

After reading this application, those familiar with the art will realize that this particular arrangement of the assembly as described is not absolutely necessary, and many variations thereof will be usable and will fall within the scope and spirit of the present invention , And will not require further invention or excessive experimentation.

In a specific embodiment, the circuit of the fingerprint recognition sensor 102 and the tactile hemispherical switch 118 are positioned in relatively vertical alignment, allowing the device 100 to combine the function of simultaneously receiving fingerprint image information and button press information.

figure 2

FIG. 2 shows a conceptual diagram of the button assembly 200 as partially described with reference to FIG. 1, which shows the laminated layer.

The button assembly 200 as described with reference to FIG. 1 includes the lens 112 as described above, which A concave shape is formed at least partly by a part of the lens 112 to guide the user's hand to the button 104. As described above, the lens 112 is disposed in the ground ring 114, and the ground ring 114 optionally includes a button flange 115 surrounding the side of the button 104. In an embodiment, again for the purpose of guiding the user's hand onto the button 104, the button flange 115 may also have a portion of the concave shape formed at least partially by the button flange 115.

An ink assembly (including 2 to 5 ink layers 202 in one embodiment) is disposed under the lens 112. In one embodiment, the ink assembly can be printed on the lens 112, vapor deposited on the lens 112, or coated by another technique. This has the following effect: the original semi-transparent button 104 can be made opaque, so that the components of the fingerprint recognition sensor will not be directly seen by the user. A thermally activated film and peripheral sealant 204 are used to couple the lens 112 to the ground ring 114 at the edge of the lens 112.

As described above, the fingerprint recognition sensor circuit is disposed under the lens 112. The liquid laminated layer 206 is disposed under the lens 112 to be coupled to the fingerprint recognition sensor circuit. The fingerprint recognition sensor circuit includes a silicon package 208, which includes a silicon circuit layer, solder (shown in more detail below), and primer 210 (shown in more detail below).

As further described herein, the fingerprint recognition sensor circuit exhibits capacitive coupling with the ridges and valleys of the user's finger (such as at the skin of the user's finger), the effect of which is that the fingerprint recognition sensor receives 2D fingerprint image information. According to the 2D fingerprint image information, it can be determined whether the fingerprint is the fingerprint of the user or the fingerprint of some other person. As mentioned above, the fingerprint recognition sensor circuit may also exhibit or instead exhibit capacitive coupling with another part of the user's finger (such as the subcutaneous layer of the finger) or with another feature of the user's finger.

As described above, the fingerprint recognition circuit is disposed above and coupled to the flexible element 116. The flexible element 116 is coupled to the reinforcing element 212. The edge of the ground ring 114 holding the lens 112 is coupled to the reinforcing element 212 using a liquid adhesive 214. The reinforcing element is arranged above the high-strength bonding belt (such as VHB belt 216) and coupled to the high-strength bonding belt, and the high-strength bonding belt is arranged above the flexible element 117 and coupled to the flexible element 117 and It is coupled to a tactile switch (button switch) 218.

After reading this application, those familiar with the art will realize that the assembly as described provides a fingerprint recognition sensor with a relatively small distance from the users finger and a relatively small stack height, while at the same time without In the case of further invention or excessive experimentation, the user is allowed to access the push button or other components of the device using the fingerprint recognition sensor.

In the first specific embodiment, the assembly as described above includes a concave shape that has the effect of guiding the user's hand to a position in which the fingerprint recognition sensor can have a superior effect. The concave shape is at least partially formed by a part of the shape of the button 104 (including the lens 112) and (as the case may be) a part of the shape of the ground ring 114. As described above, the fingerprint recognition sensor is placed under the button 104, and its effect is that when the user's finger is guided into the concave shape, the user's finger is well positioned for fingerprint recognition.

In the second specific embodiment, the assembly as described above includes a tactile push button at the bottom of the stack of elements, the effect of which is that the fingerprint recognition sensor can respond to a fingerprint that is relatively close to the users finger The epidermal positioning has a superior effect, and at the same time, the user can use the push button and also has a tactile feedback effect derived from pressing or releasing the push button. As described in this article, the arrangement method (A) where the push button and the fingerprint recognition sensor circuit are stacked substantially vertically allows the device to accept the push button operation from the user and simultaneously execute the operation on the user's finger pressing the button 104 Fingerprint recognition, and (B) allows the device to exhibit relative superiority between the fingerprint recognition sensor circuit and the users finger without pressing the button or placing the fingerprint recognition sensor circuit too far away from the users finger The capacitive coupling.

image 3

FIG. 3 shows another conceptual diagram of the button assembly 200 as partially described with reference to FIG. 1, which shows a fingerprint recognition sensor.

A set of ridges and valleys 302 of the user's fingerprint are shown as being placed on the button assembly 200 Above, the ridges and valleys 302 have the property that the ridge of the user's fingerprint is relatively close to the outer surface of the button 104 and the valley of the user's fingerprint is relatively far from the outer surface of the button 104. As described above, the fingerprint recognition sensor circuit exhibits capacitive coupling with the ridges and valleys 302 of the users finger (such as at the skin of the users finger 304), where the fingerprint recognition sensor circuit is positioned relatively close to the The epidermis of finger 304.

3 similarly shows the button assembly 200 as described with reference to FIG. 1, which includes a concave shape 306 formed at least in part by a part of the shape of the lens 112 to guide the user's finger 304 to the button 104, and includes The structure used for the ground ring 114, the ground ring 114 optionally includes a part of the concave shape 306 again used to guide the user's finger 304 to the button 104. Figure 3 similarly shows the ink assembly arranged under the lens 112 and coupled to the lens 112. The effect is to make the originally translucent button 104 opaque, so that the components of the fingerprint recognition sensor will not be directly seen by the user . FIG. 3 similarly shows the fingerprint recognition sensor arranged under the lens 112 and coupled to the lens 112.

The fingerprint recognition sensor includes a silicon wafer 308 that is imprinted with one or more capacitive plates for measuring (on the one hand) and (on the other hand) the users fingerprint (such as the users finger). A circuit 310 of the capacitance between the ridges and valleys 302 on the skin of 304 has the effect of providing fingerprint image information about the ridges and valleys 302 of the user's finger 304. The ground ring 114 provides electrical insulation. The effect is that the measured capacitance is between the user's finger 304 and the fingerprint recognition sensor, rather than between any other object and the fingerprint recognition sensor. The ground ring 114 can be formed adjacent to or close to the lens 112 of the button 104. As an example, the ground ring 114 may be incorporated into a structure 312 (such as the button flange 115) for supporting or integrating the ground ring 114, or formed on one side of the structure 312.

In one embodiment, the silicon wafer 308 includes one or more silicon vias (TSV), which are arranged to provide a circuit 310 arranged on the top of the silicon wafer 308 (on the one hand) and on the top of the silicon wafer 308 (on the other hand) Electrical connections between circuits under the silicon wafer or on the side of the silicon wafer. This has the following effect: the bonding wire 314 does not need to be arched upwards from the surface of the silicon wafer 308 to transfer the circuit 310 from the silicon wafer Circle 308 is connected elsewhere.

Using the bonding wire 314 that arches upward from the surface of the silicon wafer 308 would originally occupy the vertical space between the silicon wafer 308 and the object immediately above the silicon wafer 308. Use silicon vias to connect the circuit 310 placed on the top of the silicon wafer 308 to another location (such as the circuit on the bottom of the silicon wafer 308, or the circuit on the side of the silicon wafer 308). It requires more fingerprint recognition sensors. The effect of less vertical space is that the fingerprint recognition sensor can be placed closer to the user's finger 304 and can have relatively better resolution and effectiveness.

In one embodiment (which may be used at the same time as the embodiment with silicon vias), the silicon wafer 308 includes one or more edge trenches 316 (that is, from (on the one hand) a circuit placed on top of the silicon wafer 308 310 to (on the other hand) trenches etched or excavated through the silicon wafer 308 for circuits placed on one side of the silicon wafer 308). This also has the effect that the bonding wire 314 does not need to be arched upward from the surface of the silicon wafer 308 to connect the circuit 310 from the silicon wafer to other places. As described above, reducing the need to arch the bond line 314 upward from the surface of the silicon wafer 308 reduces the amount of vertical space required between the user's finger 304 and the fingerprint recognition sensor.

In one embodiment (again, it may be used simultaneously with the other embodiments described above), by encapsulating the silicon wafer 308 in a plastic resin (or alternatively, in a ceramic), followed by removing the plastic The top of the resin up to the wiring of the circuit 310 placed on the top of the silicon wafer 308 is almost exposed or alternatively only just exposed to the extent that the silicon wafer 308 is constructed. This has the effect that the manufactured silicon wafer 308 uses as little vertical space as possible to a reasonable extent, because the amount of additional vertical space used by the wafer package of the finger recognition sensor is relatively limited.

In one embodiment, a silicon wafer 308 is constructed, which includes a collection of solder balls 318 that are randomly (or pseudo-randomly) placed and coupled to the wafer 308. Optionally, the solder balls 318 need not include actual solder, but may include other conductive materials (such as gold), other deformable metals, or other conductive or semiconductive materials that can deform in response to a physical process (such as pressure). The solder ball 318 may be encapsulated in a plastic resin, followed by compressing the layer of the solder ball 318 and the plastic resin to the extent that the solder ball 318 and the plastic resin are compressed. This plastic resin is essentially squeezed The effect of being far away from the solder ball 318 and the solder ball 318 placed to conduct electrical signals between the silicon wafer 308 and other components (such as the button 104). Because the solder balls 318 (or other materials) are horizontally dispersed in its layer, this also has its layer function to conduct from the upper layer to the lower layer without any horizontal conduction across or within the layer The effect.

In the case where the silicon wafer 308 is coupled to the button 104, this has the effect of increasing the conduction between the capacitive plate of the silicon wafer 308 and the surface of the button 104. Attributable to the reduction in the distance between the skin of the user's finger 304 and the silicon wafer 308, this has the effect of increasing the capacitance between the user's finger 304 and the silicon wafer 308. This in turn allows the fingerprint recognition sensor to achieve superior capacitive sensing of the user's fingerprint image information.

Figure 4A and Figure 4B

4A and 4B show another conceptual diagram of the button assembly 200 as partially described with reference to FIG. 1, which shows a fingerprint recognition sensor.

4A and 4B show the side cross-sectional view of the button 104 and the fingerprint recognition sensor (FIG. 4A) and the top view of the fingerprint recognition sensor silicon wafer 308 (FIG. 4B).

As described above, the button 104 includes a lens 112 (which can be constructed of a variety of materials, such as glass, alumina, plastic, resin, and the like), which has a concave shape that guides the user's hand onto the button 104 306. As described above, the lens 112 is disposed in the ground ring 114 (eg, constructed of anodized aluminum (such as SOS aluminum)). As described above, the ground ring 114 provides electrical insulation. The effect is that the measured capacitance is between the user's finger and the fingerprint recognition sensor, rather than between any other object and the fingerprint recognition sensor.

The ground ring 114 is shown in the figure as having a cylindrical edge that holds the lens 112, and a bottom plate that can be aligned or oriented within the device when the assembly is constructed. In an alternative embodiment, one or more capacitive plates (instead of the ground ring 114) can be placed on one side of the user's finger, which has the ability to provide capacitive isolation, so that only between the user's finger and the fingerprint recognition sensor The effect of capacitive coupling occurs between. For example, the capacitive plate can be positioned around the fingerprint recognition sensor This has the effect of surrounding the fingerprint recognition sensor with capacitive isolation. Similarly, the capacitive plate can be placed near the casing of the device or inside the casing of the device (such as the casing of a smartphone or other device), which also has the effect of surrounding the fingerprint recognition sensor with capacitive isolation.

As described above, an ink layer 202 is disposed under the lens 112 and coupled to the lens 112.

In one embodiment, the fingerprint recognition sensor includes a collection of capacitive plates arranged in a 2D array, the 2D array including a density of about 300 dots per inch (dpi) or a density near (or as appropriate, larger or Smaller density) pixels, which have the effect of providing 2D fingerprint image information about the user's finger. In one embodiment, the 2D fingerprint image includes a set of grayscale values (each pixel corresponds to one or more of these values), which has a function of providing a 2D set of grayscale values to be sent to the processor for fingerprint recognition effect.

As described above, in one embodiment, a silicon wafer 308 assembly is constructed, which includes randomly (or pseudo-randomly) placed and coupled to the wafer 308 and encapsulated in a compression layer of plastic resin A collection of solder balls 318. Even when placed randomly or pseudo-randomly, the set of solder balls 318 still provides electrical connectivity between the silicon wafer 308 and other circuits (such as the flexible components 116 or 117 described below, or both). Substantially uniform measurement.

As shown in the figure, the solder balls 318 or other materials can be placed in one or more of the following: (A) A layer above the silicon wafer 308, the effect of which is that the silicon wafer 308 is at least partially electrically Is coupled to the layer above it; (B) a layer below the silicon wafer 308, the effect of which is that the silicon wafer 308 is electrically coupled to the layer below it at least partially.

As described above, the flexible element 116 or 117 is coupled to the silicon wafer 308, the effect of which is that the silicon wafer 308 can be pressed down when the button 104 is pressed, and there is no substantial danger to the structure of the wafer 308. This figure shows the connector assembly between the flexible element 116 or 117 and the silicon wafer 308. The effect is that when the button 104 is pressed down, the flexible element 116 or 117 flexes, causing the wafer 308 to be pressed down. Without structural strain.

As described above, the support plate 122 is positioned under the wafer 308 and coupled to the wafer 308. The hemispherical structure is positioned under the support plate 122 and is coupled to the support plate 122 so as to provide a tactile response to the user when the button 104 is pressed.

Figure 5

FIG. 5 shows a conceptual diagram showing the relationship between the button assembly 200 and the fingerprint recognition sensor 102.

In one embodiment, the button 104 includes a material as described above (such as processed glass or sapphire), at least partially forming a concave shape depression to direct the user's finger to the best use of fingerprint recognition sensing The component guided in the center of the device circuit. For example, as shown in the figure, a portion of the device 100 that is relatively close to the user may include a relatively large button element (shown as a horizontally oriented rectangle) overlying a relatively concave-shaped depression ( Shown as a dotted circle), the recess is overlaid with a fingerprint recognition sensor circuit (shown as a square approximately the same size as the dotted circle). This has the effect that the user can easily locate the fingerprint recognition sensor circuit by touching or touching, and can easily orient his finger relative to the fingerprint recognition sensor circuit. This also has the effect that the fingerprint recognition sensor circuit can be made substantially larger than it would have if it were to be installed in the circular ground ring surrounding the push button. This is because the users finger is opposed to The fingerprint recognition sensor is positioned fairly well.

In one embodiment, there is no specific requirement for a specific ground ring. The device 100 may include a capacitive plate or a ground element positioned on the side of the fingerprint recognition sensor circuit, the effect of which is that the fingerprint recognition sensor circuit exhibits capacitive isolation, and the effect is that the fingerprint recognition sensor circuit has a gap with the users finger The capacitive coupling of the skin, rather than the capacitive coupling with an external electromagnetic interference source. For example, the device 100 may include a capacitive plate or a ground element in one or more of the following ways: (A) directly on the side of the fingerprint recognition sensor circuit, located inside the device 100 and close to the push button; (B) On the side of the device housing or the sub-housing that includes the push button; or (C) is positioned on the device housing in other ways or includes the push button On or inside the outer shell of the button.

In one embodiment, there is no specific requirement for a physical tactile sensor (such as a spring or other tactile element) used to press a button. For example, the device 100 may include one or more sensors capable of determining whether the user is pressing the protective glass cover 107 (such as whether the user is pressing the concave recess on the protective glass cover 107 indicating where to press). . As described above, the indentation indicating where to press is also helpful to designate the user's hand above the fingerprint recognition sensor circuit.

In the first example, the device 100 may include one or more sensors that can determine whether the user is pressing the protective glass cover 107 by measuring the area ratio of the fingerprint area of the user touching the glass. These sensors can respond to the area of the protective glass cover 107 covered by the users fingerprint. The effect is that when the user presses the protective glass cover 107 harder, the area covered by the users fingers will be relatively small. The point (when just touched) changes to a relatively large area (when pressing harder) and to a relatively maximum area (when the user's finger is substantially completely pressed on the protective glass cover 107).

In the second example, the device 100 may include the ability to determine whether the user is pressing the protective glass cover 107 by measuring the ratio of the ridge of the fingerprint area where the user touches the glass (or is placed relatively close to the glass) Of one or more sensors. These sensors can respond to the number of ridges of the users fingerprint. The effect is that when the user presses the protective glass cover 107 harder, the number of ridges of the users fingerprint will be reduced from a relatively small number (when just touched Time) to a relatively large number (when pressing harder) and to a relatively maximum number (when the user's fingers are substantially completely pressed on the protective glass cover 107).

In a third example, the device 100 may include one or more sensors that can use a strain gauge (with optional compensation for temperature) to determine whether the user is pressing the protective glass cover 107. These sensors can measure the corresponding variable that acts on the protective glass cover 107 due to the pressure of the user's finger. The effect is that when the user presses the protective glass cover 107 harder, the amount of strain will be from the relative minimum (When just touched) to a relatively large value (when harder When pressing on the ground) and to a relative maximum value (when the user's finger is substantially completely pressed on the protective glass cover 107).

In some embodiments, a rigid substrate may be used in addition to the flexible element 116, or instead of the flexible element 116, a rigid substrate may be used. In these embodiments, the sensor can be attached to the rigid substrate and placed under the lens. A tactile switch or other pressure-sensitive feedback device can be attached to the underside of the rigid substrate. Alternatively, the pressure-sensitive feedback device or switch may be mounted to another circuit element (such as another rigid substrate) with the downside down, with the first rigid substrate serving as the bottom support plate.

In one embodiment, the fingerprint recognition sensor circuit may utilize one or more of the electrical characteristics of the button 104 (such as the anisotropy of the button material (such as alumina, sapphire or another anisotropic material)) to Allows the fingerprint recognition sensor circuit to better sense the epidermis of the user's finger (or as appropriate, the subcutaneous part of the user's finger). This has the following effects: the fingerprint recognition sensor circuit will exhibit relatively superior capacitive coupling with the user's finger due to the anisotropy of the button material, and the effect is that the fingerprint recognition sensor circuit will obtain relatively superior fingerprint image information gather. Similarly, when applicable, the fingerprint recognition sensor circuit can utilize other electromagnetic properties of the button material to exhibit relatively superior capacitive coupling with the user's finger due to the other electromagnetic properties of the button material.

It should be understood that an anisotropic dielectric material may be used to form one or more layers above the capacitive sensor, such as a protective glass cover 107 or a button surface layer. The anisotropic dielectric can reduce the blur that would otherwise be introduced by the distance between the capacitive fingerprint sensor array and the surface (or subsurface) of the finger. For example, orienting a sapphire layer covering or extending between the finger and the capacitive sensor array can enhance imaging. The sapphire layer can be oriented so that one of its axes perpendicular to its C plane (such as the M plane and the A plane) is between the sensor imaging array and the finger to be imaged or close to the surface of the finger. Between stretches. Generally speaking, the sapphire axis perpendicular to the C-plane may have a higher dielectric constant than the direction parallel to the C-plane, and thus enhance capacitive sensing and/or imaging. Although single crystal or Polycrystalline sapphire, but certain embodiments may specifically use single crystal sapphire. FIG. 7 generally shows a sample lattice structure 700 of sapphire, in which the critical plane 702 (in this case, the C plane) is oriented as the top surface.

In one embodiment, the fingerprint recognition sensor circuit may include an element coupled to the button 104, the effect of which is that the fingerprint recognition sensor circuit may utilize the additional physical and electrical characteristics of the button 104.

For the first example, the fingerprint recognition sensor circuit may include circuit elements printed on the surface of the button 104 (such as the bottom surface that is located away from the user's fingers and is therefore relatively invulnerable to damage).

For the second example, the fingerprint recognition sensor circuit may include circuit elements deposited on the surface of the button 104. In these examples, etching, sputtering, or other techniques for integrating semiconductor circuits on surfaces that are relatively non-conductive may be used to deposit these circuit elements.

In one embodiment, an optical element (such as an optical element using the transparent characteristic of the button 104) may be used to assist the fingerprint recognition sensor circuit. For example, the optical element can obtain an optical view of the skin of the user's finger (whether it is determined to be a still picture, a sequence of still pictures, or a video sequence). In one example, the optical view can be processed with respect to the detected optical differences between the ridges and valleys of the user's fingers, such as any shadow differences that may exist. The shadow difference can be due to ambient light or due to an optical (or optionally, infrared or another applicable electromagnetic frequency) source within the device 100.

In one embodiment, the fingerprint recognition sensor circuit can be assisted by infrared sensing elements (such as elements that use the transparent or semi-transparent characteristics of the button 104). For example, the infrared sensor element can obtain an infrared view of the epidermis of the user's finger or the subcutaneous part of the user's finger (whether it is determined to be a still picture, a sequence of still pictures, or a video sequence). In one example, the difference in infrared light detected between the ridges and valleys of the users finger (such as any temperature difference or infrared frequency difference that may exist) can be processed. Infrared view. The temperature difference or the infrared frequency difference can be attributed to the internal temperature of the user's finger or due to the optical, infrared, or other applicable electromagnetic frequency sources in the device 100.

In these examples, the capacitive coupling between the fingerprint recognition sensor circuit and the skin of the user's finger, and any optical information or infrared information can be combined to form a unified set of fingerprint image information. Or, in these examples, the capacitive coupling between the fingerprint recognition sensor circuit and the skin of the users finger, and any optical information or infrared information can be processed separately to recognize the users fingerprint. Among them, One or more are needed, or weighted as the case may be, to achieve identification of the user's fingerprint.

Certain aspects of the embodiments described in the present invention may be provided as computer program products or software, which may include, for example, computer-readable storage media or non-transitory machine-readable media on which instructions are stored, such instructions It can be used to program a computer system (or other electronic devices) to execute the processing procedure according to the present invention. A non-transitory machine-readable medium includes any mechanism for storing information in a form (e.g., software, processing application) readable by a machine (e.g., computer). Non-transitory machine-readable media can take the following forms (but not limited to): magnetic storage media (for example, floppy disks, video tapes, etc.); optical storage media (for example, CD-ROM); magneto-optical storage media; Read memory (ROM); random access memory (RAM); erasable programmable memory (for example, EPROM and EEPROM); flash memory; etc.

FIG. 6 shows another conceptual diagram of the button assembly 200 as partially described with reference to FIG. 1, which shows a fingerprint recognition sensor.

FIG. 6 similarly shows a button assembly 200 having a substantially flat or planar lens 112, which may be slightly recessed with respect to the protective glass cover 107 of an electronic device (such as device 100), as described with reference to FIG. 1. In this design, the lens 112 has a flat shape 307 formed at least partly by a part of the shape of the lens 112 to accommodate the user's finger on the button 104. The button 104 includes a ground ring 114, and optionally includes relatively A part of the flat shape 307 arranged flush with the lens 112, slightly concave, or slightly bulged. FIG. 3 similarly shows the fingerprint recognition sensor disposed under the lens 112 and coupled to the lens 112.

Although the present invention has been described with reference to various embodiments, it should be understood that these embodiments are illustrative, and the scope of the present invention is not limited to these embodiments. Many changes, modifications, additions and improvements are possible. More generally, the embodiments according to the present invention are described in the context of specific embodiments. The functionality may be procedurally separated or combined in different ways in various embodiments of the present invention, or the functionality may be described in different terms. These and other changes, modifications, additions and improvements may be within the scope of the present invention as defined in the scope of the following patent applications.