Protection panel having touch input function

Protection panel with touch input function

Protection panel having touch input function

The present invention relates to a protection panel with touch input function, which is provided with: a back side substrate, which is a first transparent resistive film, a pair of bus bars located on opposite sides of the first transparent resistive film, A pair of first terminals connected from the above-mentioned bus bar via a pull-out circuit will be formed on the surface side; and the surface side substrate, which is a pair of the second transparent resistive film, which is located on the opposite side of the second transparent resistive film The bus bar and a pair of second terminals connected from the above-mentioned bus bar via a pull-out circuit are formed on the back side, and the peripheral edge of the front side is decorated; and the first and second transparent resistive films are used. It can be arranged facing each other at a predetermined interval, and either one pair of the bus bars will be located on opposite sides of the X-axis direction of the transparent resistive film, and the other pair of the bus bars will be located on the Y of the transparent resistive film. The opposite side of the axis is used to connect the back side substrate and the front side substrate, thereby forming an analog coordinate such as the XY coordinate gradient of the operating position based on the potential gradient measurement based on the touch operation on the surface side substrate Input section.

The above-mentioned protection panel is to protect the display unit of the display device included in electronic equipment such as mobile phones, smart phones, PDAs, car satellite navigation devices, digital cameras, digital cameras, portable game consoles, and tablet tablets. One side can perform touch input operations corresponding to the displayed content, and is equipped with such electronic devices.

In recent years, in mobile phones or smartphones, which are examples of electronic devices equipped with the above-mentioned protective panels, in addition to the original call function, e-mail functions, Internet functions, etc., or in addition to these functions , It also has a photography function or music reproduction function. In an electronic device that seeks such a multi-function, it is conceivable that a switch corresponding to these functions is provided on the protection panel, thereby improving the operability.

However, in the conventional structure, in addition to a plurality of switches 12, as shown in FIG. 20, not only the terminals 5D for the analog coordinate input section are formed around the transparent resistive films 5A and 6A of the back side substrate 5 and the front side substrate 6 For 6D and the corresponding draw-wound circuits 5C, 6C, additional terminals 5K, 6K and corresponding draw-wound circuits 5F, 6F and the like for the switch 12 need to be additionally formed. Therefore, around the transparent resistive films 5A, 6A, it is necessary to ensure that a plurality of pull-wound circuits 5F, 6F and the like for the switch 12 can be additionally formed in a wide area while forming a complicated circuit. As a result, when the former configuration is applied to the protection panel, the size of the protection panel or the circuit configuration will be complicated.

The object of the present invention is to enable the switch to be equipped without increasing the size of the panel due to the additional formation of terminals for switches and corresponding pull-out circuits in a protective panel with a touch input function.

The present invention for achieving the above object is configured as a first characteristic includes a touch protective panel control input function, based includes: the back surface side of the substrate, which is transparent resistive film of the first line, located in this first transparent resistive film on the side of A pair of bus bars, a pair of first terminals connected from the above bus bar via a pull-out circuit, are formed on the surface side; and the surface side substrate, which is the second transparent resistive film, is located on the second transparent resistor A pair of bus bars on opposite sides of the film and a pair of second terminals connected from the above bus bar via a pull-out circuit are formed on the back side, and the peripheral edge of the front side is decorated with the above The first and second transparent resistive films can be opposed to each other at a predetermined interval, and one pair of the above-mentioned bus bars will be located on opposite sides of the X-axis direction of the above-mentioned transparent resistive film, and the other pair of the above-mentioned bus bars Will be located on the opposite side of the Y-axis direction of the transparent resistive film, connect the back side substrate and the front side substrate to form a touch operation on the front side substrate to measure the operating position based on the potential gradient The XY coordinate analog coordinate input section of the above-mentioned surface side substrate is characterized in that the second transparent resistive film is adjacent to the first transparent resistive film by enlarging the interval between a pair of the bus bars. The expansion area of the facing area is that the back side substrate is provided with contacts that can be connected to the pair of first terminals via a pull-out circuit so as to be parallel to the first transparent resistive film, and are connected to the back side In the case of the substrate and the surface-side substrate, the contact points are arranged so that the enlarged area of the second transparent resistive film can be opposed to each other at a predetermined interval, and the contact points and the enlargement of the second transparent resistive film Field, when a voltage is applied between the terminals to one of the back side substrate and the front side substrate, the contact point and the second transparent resistive film are detected based on the voltage detected by the other terminal The above-mentioned expanded area of contact with or without switch.

According to this characteristic structure, since it has a contact point that can be connected to a pair of first terminals via a pull-out circuit in a way that can be parallel to the first transparent resistive film, it can also be used as an analog coordinate input part in addition to a switch.ofterminals. This eliminates the need to additionally form switch-specific terminals and corresponding pull-out circuits around the transparent resistive films of the backside substrate and the front-side substrate. The corresponding draw-and-wind circuit, etc., causes the protection panel to increase in size or to complicate the circuit configuration.

The second feature of the present invention is a protective panel with a touch input function, which is provided with: a back side substrate, which is a first transparent resistive film, a pair of bus bars located on opposite sides of the first transparent resistive film, A pair of first terminals connected from the above-mentioned bus bar via a pull-out circuit is formed on the surface side; and the surface side substrate, which is the second transparent resistive film, is located on one of the opposite sides of the second transparent resistive film The pair of bus bars, and a pair of second terminals connected from the above bus bar via a pull-out circuit, are formed on the back side, and the peripheral edge of the front side is decorated to make the first and second transparent The resistive film can be opposed to each other at a predetermined interval, and either one pair of the above-mentioned bus bars will be located on the opposite side of the X-axis direction of the above-mentioned transparent resistive film, and the other pair of the above-mentioned bus bars will be located on the above-mentioned transparent resistive film The opposite side of the Y-axis direction is connected to the back side substrate and the front side substrate, thereby forming an analog coordinate of the XY coordinate of the operation position based on the potential gradient measurement based on the touch operation on the front side substrate The input section is characterized in that the surface side substrate has an enlarged area in which the second transparent resistive film is adjacent to the opposing area of the first transparent resistive film by enlarging the interval between a pair of the bus bars In the back side substrate, a third transparent resistive film that can be connected to the pair of first terminals so as to be juxtaposed with the first transparent resistive film is provided on the opposite side of the third transparent resistive film and is connected to the third transparent resistive film. A pair of parallel bus bars, when connecting the back side substrate and the front side substrate, the third transparent resistive film and the enlarged area of the second transparent resistive film are opposed to each other at a predetermined interval The third transparent resistive film and the expanded area of the second transparent resistive film form a configuration in which a voltage is applied to one of the back side substrate and the front side substrate to apply a voltage between the terminals according to the other The voltage detected by the terminal is a switch for detecting the presence or absence of contact between the third transparent resistive film and the expanded area of the second transparent resistive film.

According to this characteristic structure, it is provided with a third transparent resistive film that can be connected to a pair of first terminals in parallel with the first transparent resistive film, and a third transparent resistive film located opposite to the third transparent resistive film and connected to the above A pair of parallel bus bars, so in addition to having a switch, it can also be used with the same terminals as the analog coordinate input section. This eliminates the need to additionally form switch-specific terminals and corresponding pull-out circuits around the transparent resistive film of the back side substrate and the front-side substrate. Corresponding draw-and-wind circuits, etc., cause the protection panel to increase in size or the circuit configuration to complicate.

In addition, since the third transparent resistive film is arranged so as to be opposed to the enlarged area of the second transparent resistive film at a predetermined interval, the area where the third transparent resistive film and the second transparent resistive film oppose It is used as a touch input area which is different from the area where the first transparent resistive film and the second transparent resistive film oppose.

The third characteristic structure of the present invention is that in the invention described in the second characteristic structure, the expanded area of the second transparent resistive film is covered with the same material as the busbar at least except for the part constituting the switch.

According to this feature, since the surrounding area of the expanded area is covered with the same material as the busbar, the voltage value of the expanded area will be constant. As a result, usually the voltage value used in both the analog coordinate input section and the enlarged area arranged in such a way that the first transparent resistive film and the second transparent resistive film can be opposed to each other will only be used in the analog coordinate input section. use. That is, the voltage value used in the analog coordinate input unit will be larger than usual, and the resolution energy of the detected coordinate input will increase.

The fourth characteristic structure of the present invention is that in the invention described in the third characteristic structure, the portion between the analog coordinate input portion and the switch and covered with the same material as the bus bar is opened.

According to this feature, there is an opening in the part covered with the same material as the bus bar, so that the microphone hole, speaker, mechanical switch, etc., provided in the electronic device can face the outside between the analog coordinate input part and the switch , The degree of freedom of design will become higher.

The fifth characteristic configuration of the present invention is in the invention described in the above-mentioned first to fourth characteristic configurations, in each of the above-mentioned configurations, the circuit configuration on the surface of the backside substrate and the circuit configuration on the backside of the front-side substrate are The composition is changed.

According to this characteristic configuration, the circuit configuration of the back side substrate and the front side substrate can be changed to increase the degree of freedom of the circuit configuration of the back side substrate and the front side substrate.

[First Embodiment]

Hereinafter, the first embodiment of the mobile phone 1 which is an example of applying the protective panel A with a touch input function of the present invention to the electronic device B will be described based on the drawings as an example of the mode for implementing the present invention. In addition, in the description of the embodiment, symbols are assigned to the respective constituent elements according to the drawings, so ordinal numbers such as "1st", "2nd", and "3rd" described in the scope of the patent application are omitted.

In addition to the mobile phone 1, the electronic device B includes smart phones, PDAs, portable music players, car satellite navigation devices, digital cameras, digital video cameras, portable game consoles, and digital tablets.

FIG. 1 is an overall perspective view of the mobile phone 1. FIG. 2 is a cross-sectional bottom view of the main part of the mobile phone 1. As shown in FIG. As shown in these figures, the mobile phone 1 is configured to include a display device 3 having a display unit 3A such as liquid crystal or organic EL, and plural input keys 4 in a housing 2 made of synthetic resin. The housing 2 includes a front housing 2A on which a display window 2Aa and the like are formed on the front, and a back housing 2B equipped with a display device 3 and the like. The protective panel A is provided in the display window 2Aa of the front frame body portion 2A so as to be able to protect the display portion 3A of the display device 3.

The display window 2Aa of the front frame portion 2A is recessed so as to have a step that allows the protection panel A to be embedded. The bottom of the display window 2Aa is formed with an opening 2a that allows the display portion 3A of the display device 3 equipped on the back side frame portion 2B to face the outside, and a support frame 2b that supports the protection panel A.

The shape or size of the display window 2Aa can be variously changed in accordance with the shape or size of the protective panel A. The recessed depth of the display window 2Aa can be variously changed in accordance with the thickness of the protective panel A and the like. The shape or size of the opening 2a of the display window 2Aa can be variously changed in accordance with the shape or size of the display portion 3A. Here, the shapes of the display window 2Aa, the opening 2a, the display portion 3A, and the protective panel A are set to a rectangular shape or a substantially rectangular shape. In addition, the recessed depth of the display window 2Aa is set so that the surface of the housing 2 and the surface of the protective panel A can be formed at the same height.

The so-called touch input function of the protection panel A is a function of detecting the XY coordinates of the operating position based on the touch operation on the surface of the protection panel A and the potential gradient.

As shown in Figures 2 to 5, the protective panel A is a back side substrate 5 with a rectangular transparent resistive film 5A formed on the front side and a front side substrate 6 with a rectangular transparent resistive film 6A formed on the back side. The transparent resistive films 5A and 6A are arranged to face each other with a predetermined interval therebetween so as to have an air layer between the transparent resistive films 5A and 6A. In addition, the area facing the rectangular transparent resistive films 5A and 6A of the protective panel A functions as an analog coordinate input section Aa.

As shown in Figures 2 to 4 and Figure 5(a), the back side substrate 5 can be made of polycarbonate resin (PC), methacrylic resin (PMMA), acrylonitrile-styrene copolymer resin (AS), Acrylonitrile-butadiene-styrene copolymer resin (ABS), cellulose propionate resin (CP), polystyrene resin (PS), polyester resin, polyethylene resin (PE), etc. Transparency, rigidity, processing Good performance resin board. In particular, it is desirable to use polycarbonate resin (PC) or methacrylic resin (PMMA) with good transparency. The thickness of the resin plate can be selected in the range of 0.5 to 3.0 mm, and 1.0 mm is particularly desirable.

In addition, a glass plate with good strength and transmittance, such as soda glass, borosilicate glass, and tempered glass, can be used for the back side substrate 5. Once a strong glass plate is used, the thickness of the back side substrate 5 can be reduced, and the thickness of the protective panel A and the mobile phone 1 provided with the protective panel A can be reduced. The thickness of the glass plate can be selected in the range of 0.2 to 3.0 mm, and 1.0 mm is particularly preferred.

At the center of the lower edge of the peripheral edge of the back side substrate 5, four through holes 5a, 5b for energization penetrating the surface and back of the back side substrate 5 are formed in a straight line at predetermined intervals in the left and right directions. . On the surface side of the back side substrate 5, a pair of bus bars 5B parallel to opposite sides in the X-axis direction of the transparent resistive film 5A are formed together with the transparent resistive film 5A, and the pull-out circuit 5C located on the above-mentioned periphery is formed corresponding to the transparent resistive film 5A. A pair of terminals 5D, a frame-shaped bonding layer 5E, and the like are formed in the through hole 5a of the above-mentioned bus bar 5B.

The back side substrate 5 may not be directly formed on the surface side of the transparent resistive film 5A, the bus bar 5B, the pull-out circuit 5C, the terminal 5D, and the frame-shaped bonding layer 5E, etc., but a transparent insulating film formed thereon. Attached to the front side of the back side substrate 5, whereby the front side of the back side substrate 5 is provided with a transparent resistive film 5A, a bus bar 5B, a pull-out circuit 5C, a terminal 5D, a frame-shaped bonding layer 5E, and the like.

When using a transparent insulating film, the transparent insulating film can use engineering plastics such as polycarbonate, polyamide, polyetherketone, acrylic, polyethylene terephthalate, and polybutylene terephthalate. Resin films such as esters.

As shown in FIG. 2 to FIG. 4 and FIG. 5(b), the front side substrate 6 is a flexible transparent insulating film that bends when it is pushed with a finger or the like. Flexible transparent insulating film can use engineering plastics such as polycarbonate, polyamide, polyetherketone, acrylic, polyethylene terephthalate, polybutylene terephthalate, etc. The resin film.

On the back side of the surface-side substrate 6 is formed together with the transparent resistive film 6A, a pair of bus bars 6B parallel to the opposite sides of the transparent resistive film 6A in the Y-axis direction, and one pair located around the transparent resistive film 6A The winding circuit 6C, a pair of terminals 6D and the like facing the through hole 5b corresponding to the above-mentioned bus bar 6B, and the like. A design sheet 7 is attached to the surface side of the surface side substrate 6.

Each transparent resistive film 5A, 6A is made of metal oxide films such as tin oxide, indium oxide, antimony oxide, zinc oxide, cadmium oxide, indium tin oxide (ITO), and composite films mainly composed of these metal oxides. Or, a transparent conductive film composed of metal films such as gold, silver, copper, tin, nickel, aluminum, and palladium. In addition, each transparent resistive film 5A, 6A may be formed into a multilayer of two or more layers. The methods for forming the respective transparent resistive films 5A and 6A include a vacuum evaporation method, a sputtering method, an ion plating method, a CVD method, and the like.

On the surface of each of the transparent resistive films 5A, 6A, a plurality of fine dot-shaped spacers 8 can be formed to prevent erroneous contact when the transparent resistive films 5A, 6A are opposed to each other. Here, a plurality of spacers 8 are formed on the transparent resistive film 5A of the back substrate 5.

As the spacer 8, transparent photocurable resins such as epoxy acrylate or urethane acrylate, or transparent thermosetting resins such as polyester or epoxy resins can be used. In addition, a method of forming the spacer 8 includes a printing method such as screen printing, a photo process, and the like.

The bus bars 5B, 6B, the pull-out circuits 5C, 6C, and the terminals 5D, 6D can be formed using metals such as gold, silver, copper, and nickel, or conductive pastes such as carbon. The bus bars 5B, 6B, the pull-wound circuits 5C, 6C, and the terminals 5D, 6D are formed by printing methods such as screen printing, offset printing, gravure printing, flexographic printing, and photoresist methods. , Brushing method, etc.

Each busbar 5B, 6B is formed at the end as much as possible of the back side substrate 5 or the front side substrate 6. The central part of the back side substrate 5 and the front side substrate 6 is generally enlarged as much as possible to ensure a rectangular transparent resistive film 5A, 6A's target area. The areas facing the rectangular transparent resistive films 5A, 6A, that is, the area or shape of the input area or the display area, can be implemented according to the area or shape of the input area or display area of the electronic device B such as the mobile phone 1. Changes.

Design sheet 7 can be used in engineering plastics such as polycarbonate, polyamide, polyetherketone, acrylic, polyethylene terephthalate, polybutylene terephthalate, etc. The decoration layer 7B and the bonding layer 7C are formed on the back side of the film 7A. The thickness of the transparent film 7A can be selected from the range of 25 to 200 μm. In addition, a hard coat layer (not shown) (not shown) may be formed on the surface side thereof.

The materials used for the cured film layer include inorganic materials such as silicone-based resins, or organic materials such as acrylic epoxy-based, urethane-based thermosetting resins, or acrylic-based photocurable resins. It is appropriate that the thickness of the cured film layer is about 1 to 7 μm. As a method of forming the cured film layer, coating methods such as roll coating and spray coating, ordinary printing methods such as screen printing, offset printing, gravure printing, and flexographic printing can be used.

The cured film layer may be formed directly on the surface side of the transparent film 7A on which the decorative layer 7B and the bonding layer 7C are directly formed on the back side, or may be formed on the surface side of the transparent film 7A where the decorative layer 7B and the bonding layer 7C are directly formed on the back side. The transparent film 7A is different from the transparent film, and then the two of them are bonded together.

The design sheet 7 may be subjected to uneven processing, or a non-reflection treatment for preventing light reflection such as mixing fine particles such as silica or alumina as an extender pigment in the cured film layer.

The decorative layer 7B is formed with a rectangular transparent portion 7a at the center and a frame-shaped decorative portion 7b on the periphery. The area or shape of the transparent portion 7a can be implemented in accordance with the area or shape of the area facing the rectangular transparent resistive films 5A, 6A, that is, the area or shape of the input area or display area of the electronic device B such as the mobile phone 1 Various changes.

By forming the decoration layer 7B in this way, the peripheral portion 6E of the front substrate 6 can be decorated to cover the bus bars 5B, 6B of the back substrate 5 and the front substrate 6. Thereby, it is not necessary to form a frame edge portion for covering the bus bars 5B, 6B, etc., of the back side substrate 5 and the front side substrate 6 in the display window 2A of the housing 2, and this portion can reduce the thickness of the mobile phone 1.

The decorative layer 7B can be made of polyethylene resin, polyamide resin, polyester resin, polypropylene resin, polyurethane resin, polyvinyl acetal resin, and polyester urethane resin. Resin, alkyd resin, etc. are used as binders, and pigments or dyes of appropriate colors are used as coloring inks. In addition, the rectangular transparent portion 7a may be formed with a decorative layer 7B using transparent ink, or the decorative layer 7B may not be formed as the transparent portion 7a.

As a method of forming the decorative layer 7B, ordinary printing methods such as screen printing, offset printing, gravure printing, and flexographic printing can be used. Especially in order to perform multi-color printing or grayscale expression, the offset printing method or the gravure printing method can be applied.

The decoration layer 7B may be composed of a metal thin film layer, or a combination of a pattern printing layer and a metal thin film layer. The metal thin film layer expresses metallic luster as the decorative layer 7B, and is formed by a vacuum vapor deposition method, a sputtering method, an ion plating method, a gold plating method, or the like. In this case, metals such as aluminum, nickel, gold, platinum, ferrochrome, copper, tin, indium, silver, titanium, lead, zinc, and alloys or compounds thereof are used according to the metallic luster color to be expressed. The film thickness of the metal thin film layer is generally about 0.05 μm. In addition, when the metal thin film layer is provided, in order to improve the adhesion with other layers, a front anchor layer or a rear anchor layer may also be provided.

As the bonding layer 7C, a heat-sensitive or pressure-sensitive resin is suitably used. For example, when the surface-side substrate 6 and the design sheet 7 are polycarbonate-based or polyamide-based, polypropylene resin, polystyrene-based resin, polyamide-based resin, or the like may be used. In addition, when the surface-side substrate 6 and the design sheet 7 are made of propylene or polyethylene terephthalate, polyvinyl chloride, vinyl acetate, propylene copolymer, etc. may be used.

As a method of forming the bonding layer 7C, ordinary printing methods such as screen printing, offset printing, gravure printing, and flexographic printing can be used.

The surface side substrate 6 may be one that does not include the design sheet 7. When the design sheet 7 is not provided, a cured film layer can be formed on the surface side of the surface side substrate 6. When the non-reflective treatment is performed when the design sheet 7 is not provided, the surface side of the surface-side substrate 6 or the cured film layer may be unevenly processed, or fine particles such as extender pigment silica or aluminum oxide may be mixed in the cured film layer. And other methods.

As shown in FIG. 4, the back side frame portion 2B is equipped with four spring connector pins 9 at positions opposed to the through holes 5 a and 5 b of the back side substrate 5. Each spring connector pin 9 is electrically connected to an interface (not shown) of the display device 3.

The terminals 5D and 6D of the back substrate 5 and the front substrate 6 are electrically connected to the corresponding spring connector pins 9 through the through holes 5 a and 5 b of the back substrate 5.

In each through hole 5a, 5b, a conductive adhesive 10 composed of conductive paste is injected in such a way that it can electrically contact the corresponding terminals 5D, 6D. It is inserted so that it can be electrically connected to the conductive adhesive 10.

Each conductive pin 11 has a round flat head 11B formed at the other end 11B, and after being inserted into the corresponding through holes 5a, 5b, the head 11B is exposed on the back side of the front frame body 2A. Thereby, the touch input signal from each transparent resistive film 5A, 6A, etc. can be taken out to the back side of the front frame portion 2A. Then, when joining the front side frame portion 2A and the back side frame portion 2B, the head 11B of each conductive pin 11 has a spring that connects the terminal 5D of the back substrate 5 and the terminal 6D of the front substrate 6 to the corresponding spring. The function of the flat terminal 5F, 6F of the connector pin 9. Thereby, the touch input signal from each transparent resistive film 5A, 6A can be input to the display device 3.

The diameter of each through hole 5a, 5b is preferably 0.1 to 2.0 mm. If the diameter of each through hole 5a is smaller than 0.1 mm, there is a possibility that conduction cannot be ensured in each through hole 5a. If the diameter of each through hole 5a is larger than 2.0 mm, there is a possibility that the conductive bonding agent 10 cannot be well injected into each through hole 5a, 5b, and the amount of the conductive bonding agent 10 used increases, which is not economical.

The conductive paste used for the conductive bonding agent 10 may be silver paste or copper paste. The method of injecting the conductive adhesive 10 includes coating using a dispenser, screen printing, or the like. In addition to the injection of the conductive bonding agent 10, a film of electroless plating or electric field plating using nickel or the like may be formed on the inner wall of each through hole 5a, 5b.

In the conductive pin 11, the thickness of the head portion 11B is 20 to 200 μm. Instead of the head 11B, the conductive pin 11 may be a female type with a concave portion or a male type with a convex portion. As the conductive pin 11, metal pins such as copper, iron, nickel, aluminum, and stainless steel can be used. In the conductive pin 11, it is preferable to perform gold plating on at least the both ends of the conductive adhesive 10 or the spring connector pin 9 in contact.

It is also possible to replace the conductive pins 11 and adopt a flexible printed circuit (Flexible Print Circuit) in which a circuit made of copper foil is formed on one side of a polyimide film.

As shown in FIG. 5(b), in the surface-side substrate 6, the transparent resistive film 6A expands the distance between a pair of bus bars 6B on the lower side, thereby forming an enlarged area 6Ab, which is adjacent to the transparent resistive The opposing area 6Aa of the film 5A is underneath. Then, the draw-wound circuit 6C of the pair of terminals 6D of the front substrate 6 is formed so as to be able to pass the shortest path from the pair of bus bars 6B, respectively.

As shown in Figure 5(a), in the back side substrate 5, facing the enlarged area 6Ab, three contacts 5G and two resistors 5H are so that the resistors 5H can be located in the X-axis direction and The adjacent contacts 5G are formed with a predetermined interval therebetween. In addition, the drawing circuit 5C for the pair of terminals 5D of the back substrate 5 is formed with a circuit portion 5Ca such that the transparent resistive film 5A, three contacts 5G, and two resistors 5H are arranged in parallel.

Each contact point 5G is arranged to face the enlarged area 6Ab at a predetermined interval when connecting the back side substrate 5 and the front side substrate 6. The bonding layer 5E of the back side substrate 5 is formed to have an opening 5Ea that enables the contact point 5G facing each other to come into contact with the enlarged area 6Ab.

That is, the area 6Ab is enlarged by the opposing point 5G, so that when a voltage is applied between one terminal 5D (6D) of the back side substrate 5 and the front side substrate 6, it is determined by the other terminal 6D (5D). The detected voltage is used to detect the contact point 5G, and the switch 12 of the contact presence or absence of the expanded area 6Ab.

If the switch 12 is constructed in this way, it is possible to use the same terminal 5D as the analog coordinate input portion Aa, that is, it is not necessary to form additional terminals and dedicated switches around the transparent resistive films 5A and 6A of the back side substrate 5 and the front side substrate 6 The corresponding pull-out circuit, etc., can avoid the increase in the size of the protective panel A or the complexity of the circuit configuration caused by the additional formation of terminals for switches and the corresponding pull-out circuit around the transparent resistive films 5A, 6A.

Moreover, in the protection panel A provided with such a switch 12, once a voltage is applied between the terminals 5D of the back side substrate 5, when any switch 12 is touch-operated, the voltage that can be output from the terminal 6D of the front side substrate 6 The size is used to obtain the X coordinate of the switch 12 operated by the touch. In addition, when the analog coordinate input portion Aa opposed to the transparent resistive films 5A, 6A is touch-operated, the magnitude of the voltage output from the terminal 6D of the surface-side substrate 6 can be used to obtain the value of the touch operation position of the analog coordinate input portion Aa X coordinate.

Secondly, once a voltage is applied between the terminals 6D of the front substrate 6, when any switch 12 is touch-operated, the voltage output from the terminal 5D of the back substrate 5 can be used to recognize that any switch 12 is in the ON state. Moreover, when the analog coordinate input portion Aa is touch-operated, the Y coordinate of the touch operation position of the analog coordinate input portion Aa can be obtained from the magnitude of the voltage output from the terminal 5D of the back side substrate 5.

That is, when any switch 12 is touch-operated, the X coordinate of the touch operation position can be obtained by applying a voltage between the terminals 5D of the back substrate 5, and a voltage is applied between the terminals 6D of the front substrate 6 The acquired ON information of the touch operation is used to specify the switch 12 that is touched. In addition, when the analog coordinate input unit Aa is touch-operated, the X coordinate of the touch operation position obtained by applying a voltage between the terminals 5D of the back substrate 5 and the voltage applied between the terminals 6D of the front substrate 6 can be obtained. The Y coordinate of the acquired touch operation position is used to specify the touch operation position in the analog coordinate input part Aa.

Each contact 5G can be formed using metals such as gold, silver, copper, and nickel, or conductive pastes such as carbon. The method of forming each contact 5G includes printing methods such as screen printing, offset printing, gravure printing, and flexographic printing, photoresist method, brush coating method, and the like.

Each resistor 5H can be a metal oxide film such as tin oxide, indium oxide, antimony oxide, zinc oxide, cadmium oxide, indium tin oxide (ITO), etc., a composite film mainly composed of these metal oxides, or , Gold, silver, copper, tin, nickel, aluminum, palladium and other metal films. The method for forming each resistor 5H includes a vacuum vapor deposition method, a sputtering method, an ion plating method, a CVD method, and the like.

As shown in Fig. 1, the design sheet 7 has a pattern 7c showing the switch 12 formed in the decoration portion 7b of the decoration layer 7B corresponding to each contact point 5G.

Hereinafter, the structure of the protection panel A with the touch input function exemplified in this embodiment will be described in detail based on FIGS. 2 to 5.

First, an indium tin oxide film (hereinafter referred to (Referred to as ITO film for short).

Next, the PET film is cut into a thin plate so that the vertical and horizontal lengths of the PET film can be formed into a predetermined size, and then a resist is coated on the ITO film by screen printing, and the unnecessary part of the ITO film is removed by sulfuric acid. Rectangular transparent resistive film 6A.

After etching, the resist is removed by alkaline cleaning, and a pair of parallel bus bars 6B and a pair of bus bars 6B are formed by screen printing with silver paste on and around the opposite sides of the transparent resistive film 6A in the Y-axis direction. Wire the circuit 6C and a pair of terminals 6D. The path of each winding circuit 6C is set to be the shortest path that any winding circuit 6C can pass. The pair of electrodes 6D are arranged on the lower edge portion of the PET film so as to be able to be arranged at a predetermined interval in the left-right direction.

Thereby, it is possible to obtain a surface-side substrate 6 provided with a transparent resistive film 6A, a pair of bus bars 6B, a pair of pull-out circuits 6C, and a pair of terminals 6D on the back side [see FIG. 5(b)].

On the other hand, an ITO film was formed by sputtering on one side of a polycarbonate plate having a thickness of 1.0 mm formed so that the length of the vertical and horizontal lengths could be the same size as the surface-side substrate 6.

Then, the resist is applied in a pattern by screen printing on the ITO film, and the unnecessary part of the ITO film is removed with sulfuric acid, thereby forming a rectangular transparent resistive film 5A and two resistors 5H. The dimension of the transparent resistive film 5A in the Y-axis direction is approximately 4/5 shorter than that of the transparent resistive film 6A of the surface-side substrate 6, and the lower end of the transparent resistive film 5A is a short portion located inside the transparent resistive film 6A. In addition, the two resistors 5H are arranged and set between the lower edge portion of the polycarbonate plate and the transparent resistive film 5A so as to be able to be arranged at a predetermined interval in the left-right direction.

Next, on the entire surface of the transparent resistive film 5A, a plurality of fine dot-shaped spacers 8 are formed by screen printing using epoxy acrylate-based thermosetting resin. In addition, on the opposite sides of and around the X-axis direction of the transparent resistive film 5A, a pair of parallel bus bars 5B, a pull-out circuit 5C, a pair of terminals 5D, and three are formed by screen printing using silver paste. The contact point 5G. The three contacts 5G can be arranged at predetermined intervals in the left-right direction, and the resistor 5H can be positioned between adjacent contacts 5G, and can be opposed to the enlarged area 6Ab of the front substrate 6 Way to configure settings. The path of each pull-out circuit 5C is such that the pull-out circuit 5C from each bus 5B can pass through the shortest path, plus a method that can connect the paths. It has a circuit part 5Ca, that is, it can This circuit part 5Ca is set so that two resistors 5H and three contacts 5G are arranged in parallel with the transparent resistive film 5A in the order of arrangement in the left-right direction. A pair of terminals 5D are arranged on the lower left edge of the polycarbonate plate at a predetermined interval in the left-right direction, and can correspond to the terminal 6D on the front side substrate 6 at a predetermined interval on the right. Configure settings by way of location.

Then, on the peripheral edge of the polycarbonate plate, screen printing is used to apply an adhesive ink mainly composed of acrylate so as not to cover each contact point 5G, thereby forming a frame-shaped bonding layer 5E. In addition, four through holes 5a, 5b are drilled to form four through holes 5a, 5b in the center of the lower edge among the peripheral edges, so that they can be arranged in a straight line along the lower edge of the polycarbonate plate. The formation positions of the four through holes 5a, 5b are set so that two of the through holes 5a will penetrate through the corresponding terminal 5D, and the remaining two through holes 5b will be in contact with the corresponding surface side substrate 6 The terminal 6D is in an opposite position.

Thereby, it is possible to obtain a transparent resistive film 5A, a pair of bus bars 5B, three contacts 5G, two resistors 5H, a parallel pull-out circuit 5C, a pair of terminals 5D, and a bonding layer on the surface side. The back side substrate 5 of 5E [refer to FIG. 5(a)].

In addition, when it is desired to make the contact 5G light transmissive, the same materials and manufacturing methods as the resistor 5H can be used.

Next, the length of the transparent film composed of a roll-shaped PET film with a thickness of 125 μm can be cut into a thin plate with the same size as the front side substrate 6 and the back side substrate 5, and one side is printed by gravure printing. A decorative layer 7B having a rectangular transparent portion 7a in the center and a frame-shaped decorative portion 7b on the periphery and a bonding layer 7C composed of a transparent adhesive mainly composed of acrylate are formed.

At this time, the pattern 7c of the display switch 12 is formed in the corresponding position of the decoration part 7b and each contact point 5G of the back side board|substrate 5.

Thereby, the design sheet 7 in which the decorative layer 7B and the bonding layer 7C are formed on the back side can be obtained.

Then, the obtained design sheet 7 and the above-mentioned surface-side substrate 6 are formed with the non-ITO film forming surface (surface side) of the surface-side substrate 6 and the decorative layer of the design sheet 7 via the bonding layer 7C of the design sheet 7 The (rear side) can face each other, and the formation position of the enlarged area 6Ab of the front substrate 6 and the formation position of the pattern 7c of the design sheet 7 can correspond to each other, so that these entire surfaces can be attached.

Thereby, the decorated surface side board|substrate 6 which has the pattern 7c for opening and closing in the peripheral part 6E can be obtained.

Then, on the back side substrate 5, the front side substrate 6 where the design sheet 7 is bonded, the transparent resistive film 5A and the contact point 5G and the transparent resistive film 6A will face each other through the air layer, and the mutual bus bars 5B, 6B will face each other. Orthogonal, so that the surface side of the through hole 5b corresponding to each terminal 6D of the front substrate 6 can be blocked, and it can be bonded via the bonding layer 5E of the back substrate 5.

Next, on the terminal 5D, 6D side of each through-hole 5a, 5b, a silver paste as the conductive bonding agent 10 is injected by a dispenser.

After this injection, the through-holes 5a, 5b are pressed into each through hole 5a, 5b so that the conductive pin 11 with the head can reach the conductive bonding agent 10 by the ultrasonic melting of the ultrasonic pressing device. The flat terminals 5F and 6F that enable electrical connection between the terminals 5D and 6D of the back side substrate 5 and the front side substrate 6 and the spring connector pins 9 provided in the back side frame portion 2B can come from the transparent resistors It is possible to take out the touch input signal of the films 5A, 6A and the contact point 5G.

Thereby, a protection panel A having an analog coordinate input unit Aa and three switches 12 can be obtained (refer to FIGS. 1 to 5).

[Second Embodiment]

Hereinafter, a second embodiment in which the protective panel A equipped with the touch input function of the present invention is applied to the mobile phone 1 as an example of the electronic device B will be described based on the drawings.

In addition, in this second embodiment, the arrangement and structure of the switch 12 of the protection panel A are different from those of the first embodiment, and the other structures are the same as those in the first embodiment. Therefore, according to FIG. 1 The difference of the embodiment will be described.

Fig. 6(b) is the same diagram as Fig. 5(b). As shown in Fig. 6(a), in the back side substrate 5, the part facing the enlarged area 6Ab is not the three contacts 5G and the two resistors 5H as in the first embodiment, but It forms a rectangular transparent resistive film 5J. Moreover, the pull-out circuit 5C to the pair of terminals 5D of the back side substrate 5 is formed so that the transparent resistive film 5A and the transparent resistive film 5J can be arranged in parallel.

The rectangular transparent resistive film 5J is arranged to face the enlarged area 6Ab at a predetermined interval when connecting the back side substrate 5 and the front side substrate 6. The bonding layer 5E of the back side substrate 5 is formed to have three openings 5Ea that enable the opposing transparent resistive film 5J to come into contact with the enlarged area 6Ab.

That is, the area 6Ab is enlarged by the opposing rectangular transparent resistive film 5J, and a voltage is applied between one terminal 5D (6D) of the back side substrate 5 and the front side substrate 6 according to the The voltage detected by the terminal 6D (5D) detects the rectangular transparent resistive film 5J, and expands the switch 12 of the contact presence or absence of the area 6Ab. In addition, the transparent resistive film 5J may have a shape other than the rectangular shape.

If the switch 12 is constructed in this way, it is possible to use the same terminal 5D as the analog coordinate input portion Aa, that is, it is not necessary to form additional terminals and dedicated switches around the transparent resistive films 5A and 6A of the back side substrate 5 and the front side substrate 6 The corresponding pull-out circuit, etc., can avoid the increase in the size of the protective panel A and the complexity of the circuit configuration caused by the additional formation of terminals for switches and the corresponding pull-out circuit around the transparent resistive films 5A, 6A. In addition, since the penetration in the switch 12 is possible, the degree of freedom in designing the arrangement of lighting, LEDs, LCDs, etc. in the back is increased.

The rectangular transparent resistive film 5J is a metal oxide film made of tin oxide, indium oxide, antimony oxide, zinc oxide, cadmium oxide, indium tin oxide (ITO), etc., and a composite film mainly composed of these metal oxides , Or a transparent conductive film composed of metal films such as gold, silver, copper, tin, nickel, aluminum, and palladium. In addition, the transparent resistive film 5J may be formed into a multilayer of two or more layers. The method for forming the transparent resistive film 5J includes a vacuum evaporation method, a sputtering method, an ion plating method, a CVD method, and the like.

As shown in FIG. 1, the design sheet 7 is formed with a pattern 7c showing the switch 12 at the corresponding position of the decoration portion 7b of the decoration layer 7B and the opening 5Ea of the bonding layer 5E.

Hereinafter, the structure of the protection panel A having the touch input function exemplified in this embodiment will be described in detail based on FIG. 6.

First, on an ITO film of a PET film, a resist is applied in a pattern by screen printing, and unnecessary portions of the ITO film are removed with sulfuric acid, thereby forming a rectangular transparent resistive film 6A.

After etching, the resist is removed by alkaline cleaning. On and around the opposite sides of the transparent resistive film 6A in the Y-axis direction, a pair of parallel bus bars 6B and a pair are formed by screen printing with silver paste. The drawn circuit 6C and a pair of electrodes 6D. The path of each winding circuit 6C is set to be the shortest path that any winding circuit 6C can pass. The pair of electrodes 6D are arranged on the lower edge portion of the PET film so as to be able to be arranged at a predetermined interval in the left-right direction.

Thereby, it is possible to obtain a surface-side substrate 6 having a rectangular transparent resistive film 6A, a pair of bus bars 6B, a pair of pull-out circuits 6C, and a pair of electrodes 6D on the back side (refer to FIG. 6(b) )].

On the other hand, an ITO film was formed by sputtering on one side of a polycarbonate plate having a thickness of 1.0 mm formed so that the length of the vertical and horizontal lengths could be the same size as the surface-side substrate 6.

Then, on the ITO film, the resist is applied in a pattern by screen printing, and the unnecessary part of the ITO film is removed with sulfuric acid, thereby forming a rectangular transparent resistive film 5A and a rectangular transparent resistermembrane5J. The dimension of the rectangular transparent resistive film 5A in the Y-axis direction is approximately 4/5 shorter than that of the transparent resistive film 6A of the surface-side substrate 6, and the lower end of the transparent resistive film 5A is a short portion located inside the transparent resistive film 6A. In addition, the rectangular transparent resistive film 5J is arranged between the lower edge of the polycarbonate plate and the transparent resistive film 5A so as to be able to be arranged along the X-axis direction, and its length is set to be the same as the rectangular transparent resistive film. The dimensions of the film 5A in the Y-axis direction are the same.

Next, on the entire surface of the transparent resistive film 5A, a plurality of fine dot-shaped spacers 8 are formed by screen printing using epoxy acrylate-based thermosetting resin. In addition, a pair of parallel bus bars 5B, a draw circuit 5C, and a pair of electrodes 5D are formed by screen printing with silver paste on and around the opposite sides in the Y-axis direction of the transparent resistive films 5A and 5J. The pair of parallel bus bars 5B are not only the opposite sides of the rectangular transparent resistive film 5A in the X-axis direction, but also extend straight to the opposite sides of the rectangular transparent resistive film 5J in the X-axis direction. The resistive film 5A and the transparent resistive film 5J can be arranged side by side. In addition, the rectangular transparent resistive film 5J is arranged so as to be able to face the enlarged area 6Ab of the front substrate 6. The path of each wire loop circuit 5C is set in such a way that the wire loop circuits 5C from each bus bar 5B can form the shortest path through each. A pair of terminals 5D are arranged on the lower left edge of the polycarbonate plate at a predetermined interval in the left-right direction, and can correspond to the terminal 6D on the front side substrate 6 at a predetermined interval on the right. Configure settings by way of location.

Then, on the peripheral edge of the polycarbonate plate, the three circular areas arranged at predetermined intervals in the left and right direction are not covered on the rectangular transparent resistive film 5J, and then coated by screen printing. The adhesive ink with acrylic ester as the main component forms the frame-shaped bonding layer 5E. In addition, four through holes 5a, 5b are drilled to form four through holes 5a, 5b in the center of the lower edge among the peripheral edges, so that they can be arranged in a straight line along the lower edge of the polycarbonate plate. The formation positions of the four through holes 5a, 5b are set so that two of the through holes 5a will penetrate through the corresponding terminal 5D, and the remaining two through holes 5b will be in contact with the corresponding surface side substrate 6 The terminal 6D is in an opposite position.

Thereby, it is possible to obtain a back side substrate 5 with transparent resistive films 5A, 5J, a pair of bus bars 5B, a pair of pull-out circuits 5C, a pair of electrodes 5D, and a bonding layer 5E on the surface side (refer to FIG. 6 (a)].

Next, on one side of the PET film, it is formed by gravure printing: a decorative layer 7B with a rectangular transparent portion 7a in the center and a frame-shaped decorative portion 7b on the periphery, and acrylic ester as the main component The bonding layer 7C made of transparent adhesive.

At this time, the pattern 7 d of the display switch 12 is formed in the decorative portion 7 b corresponding to the opening 5Ea of the bonding layer 5E of the back side substrate 5.

Thereby, the design sheet 7 in which the decorative layer 7B and the bonding layer 7C are formed on the back side can be obtained.

Then, the obtained surface side substrate 6 and the design sheet 7 are formed with the non-ITO film forming surface (front side) of the surface side substrate 6 and the decorative layer forming surface of the design sheet 7 via the bonding layer 7C of the design sheet 7 ( The back side) can be opposed to each other, and the formation position of the enlarged area 6Ab of the front substrate 6 and the formation position of the pattern 7c of the design sheet 7 can correspond to each other, and these entire surfaces are bonded.

Thereby, the decorated surface side board|substrate 6 which has the pattern 7c for opening and closing in the peripheral part 6E can be obtained.

Then, on the back side substrate 5, the front side substrate 6 where the design sheet 7 is bonded, the rectangular transparent resistive films 5A, 5J and the transparent resistive film 6A are opposed to each other via the air layer, and the bus bars 5B are each other. , 6B will be perpendicular to each other, and the surface side of the through hole 5b corresponding to each electrode 6D of the front side substrate 6 can be blocked by bonding via the bonding layer 5E of the back side substrate 5.

Next, on the electrode 5D, 6D side of each through hole 5a, 5b, a silver paste as the conductive bonding agent 10 is injected by a dispenser.

After the injection, the through-holes 5a, 5b are pressed into each through hole 5a, 5b so that the conductive pin 11 with the head can reach the conductive bonding agent 10 by the ultrasonic melting of the ultrasonic pressing device. The flat terminals 5F, 6F that enable electrical connection between the terminals 5D and 6D of the back side substrate 5 and the front side substrate 6 and the spring connector pins 9 provided in the back side frame portion 2B can be made from rectangular shapes. It is possible to take out the touch input signal of the transparent resistive films 5A, 6A and the rectangular transparent resistive film 5J.

Thereby, a protection panel A (refer to FIG. 1) provided with an analog coordinate input part Aa and three switches 12 can be obtained.

[Different implementation mode]

(1) The number of switches 12 provided in the protection panel A can be variously changed. For example, the protection panel A may be provided with a row composed of a single switch 12 (refer to FIG. 7), or a row composed of two or more switches 12 may be provided. In addition, when the plurality of switches 12 are formed at the plurality of the above-mentioned contacts 5G, a resistor 5H may be provided between the contacts 5G.

In addition, in the protection panel A provided with a single switch 12, unlike the first and second embodiments, it is not specified which switch 12 is touch-operated. That is, in this case, the ON/OFF of the switch 12 is recognized from the magnitude of the voltage output from the terminal 5D of the back side substrate 5 obtained by applying a voltage between the terminals 6D of the front side substrate 6.

(2) In addition, the arrangement of the switch 12 included in the protection panel A can be changed as follows. For example, the switch 12 may be formed along the upper and lower edges of the protection panel A. That is, the transparent resistive film 6A has two enlarged areas 6Ab so as to be able to sandwich the opposing area 6Aa with the transparent resistive film 5A. Which of the enlarged areas 6Ab is related to the contact point 5G that opposes [Ref. Refer to Fig. 8] or a rectangular transparent resistive film 5J [Refer to Fig. 9]. In addition, the switch 12 may be formed only on the upper edge of the protection panel A.

In addition, a plurality of rows of switches 12 may be provided on the upper and lower side edges of the protection panel A. That is, the circuit part parallel to the above-mentioned transparent resistive film 5A including the contact point 5G has a configuration of two or more rows (refer to FIG. 10).

In addition, in the protection panel A provided with two or more rows of switches 12, when any one of the switches 12 is touch-operated, it differs from the first and second embodiments in that it is connected to the terminal 5D on the back side substrate 5 The X coordinate of the touch operation position obtained by applying a voltage between the terminals 6D of the surface side substrate 6 and the Y coordinate of the touch operation position obtained by applying a voltage between the terminals 6D of the front substrate 6 specify the switch 12 to be touched.

(3) In addition, the switch 12 included in the protection panel A can be changed variably [refer to FIG. 11]. For example, in the second embodiment, the frame-shaped bonding layer 5E may be formed so as not to cover the rectangular transparent resistive film 5J completely (see FIG. 12). In this case, dot-shaped spacers 8 may be formed on the rectangular transparent resistive film 5J. In addition, in the first embodiment, the interval between each contact 5G can be shortened, and the entire contact 5G group can be a variable switch. In addition, the protection panel A may be provided with both the switch 12 and the variable switch 12.

Then, if this protective panel A is equipped with an electronic device B having a photographic function such as a digital camera, the variable switch 12 can be used for a zoom switch, etc., which is based on the magnitude of the voltage that changes according to the touch operation position , Or the direction of the voltage change corresponding to the sliding touch operation to change the focus distance. Moreover, if this protective panel A is equipped with an electronic device B with a music reproduction function such as a portable music player, the variable switch 12 is used for a volume switch, etc., and it changes according to the position corresponding to the touch operation. The magnitude of the voltage or the direction of the voltage change corresponding to the sliding touch operation changes the volume.

Therefore, a switch suitable for the function of an electronic device equipped with this protection panel can be provided, and the operability of the electronic device can be improved.

(4) As shown in FIGS. 13 to 15, the enlarged area 6Ab of the transparent resistive film 6A of the second embodiment can be covered with the same material as the bus bar 6B except for at least the part constituting the switch 12.

When only a pair of bus bars 6B are provided as in the second embodiment, in the example shown in FIG. 6, the position detection in the Y-axis direction of the enlarged area 6Ab uses a voltage value between 4 and 5V, and the voltage value is between 4 and 5V. The position detection in the Y-axis direction of the input portion Aa uses a voltage value between 0 and 4V. On the other hand, as shown in FIGS. 13 and 15, when the frame-shaped conductive portion 6L made of the same material as the above-mentioned busbar 6B is used to surround the enlarged area 6Ab, the voltage value of the enlarged area 6Ab is formed constant, so as shown in FIG. In the example of FIG. 15, the position detection in the Y-axis direction of the analog coordinate input unit Aa uses a voltage value between 0 and 5V. That is, the voltage value used in the analog coordinate input unit Aa is larger than that in the second embodiment, so the resolution energy of the detected coordinate input becomes larger. In addition, when the bus bar is arranged in the middle instead of surrounding the surroundings as shown in FIG. 14, only the part of the middle bus bar 6M has a constant voltage value.

(5) Also, as shown in FIGS. 14 and 15, in the configuration of the previous item, the part between the analog coordinate input portion Aa and the switch 12 and covered with the same material as the busbar 6B can be set as openings 5c, 6c .

In the case of this embodiment, even if the transparent resistive film 6A is opened, there will be no detection failure caused by linear collapse. Therefore, the microphone hole, horn, mechanical switch, etc., provided in the housing 2 can be used in the above-mentioned analog coordinate input section. The space between Aa and the above-mentioned switch 12 faces the outside, and the degree of freedom of design becomes higher.

(6) Also, as shown in FIGS. 16 and 17, the enlarged area 6Ab of the transparent resistive film 6A can be set as an analog coordinate input portion Ab that is different from the analog coordinate input portion Aa of the opposed area 6Aa. In this case, for example, at a position facing the enlarged area 6Ab of the transparent resistive film 6A, the transparent resistive film 5J connected to the pair of terminals 5D is arranged in parallel with the transparent resistive film 5A to form an analog coordinate input section. Ab. In addition, an intermediate bus bar 6M coated with the same material as the bus bar 6B may be arranged between the opposed area 6Aa and the enlarged area 6Ab of the transparent resistive film 6A, and the intermediate bus bar 6M may be provided with openings 5c, 6c.

(7) Also, as shown in FIG. 18, the protective panel A may be formed into a shape having a space notched from either side of the left and right sides in the middle portion thereof, and the enlarged area 6Ab may be set to be different from the facing area 6Aa The analog coordinate input unit Ab is the analog coordinate input unit Aa. In this case, make the busbar 6B covered with the same material<img file="TWI474249B_D0001.tif" he="32" id="i0001" img-content="character" img-format="tif" inline="no" orientation="portrait" wi="33" />The middle bus bar 6M of the word shape is located between the facing area 6Aa and the enlarged area 6Ab. At a position facing the enlarged area 6Ab, the transparent resistive film 5J connected to the pair of terminals 5D is arranged so as to be parallel to the transparent resistive film 5A, thereby constituting the analog coordinate input portion Ab. In this way, even when a switch or the like is provided between the analog coordinate input portion Aa and the analog coordinate input portion Ab, it is not necessary to provide an opening in the intermediate bus M, and the protective panel A can be easily manufactured. In addition, the space between the analog coordinate input unit Aa and the analog coordinate input unit Ab is largely ensured on either side of the left and right, and the degree of freedom of the switches etc. to be arranged also increases.

(8) Also, as shown in FIG. 19, the protective panel A may be a shape having spaces on the left and right sides of its middle portion, and the enlarged area 6Ab may be set as an analog coordinate input portion Aa that is different from the opposed area 6Aa. It is analogous to the coordinate input part Ab. In this case, the H-shaped intermediate bus bar 6M covered with the same material as the bus bar 6B is interposed between the opposing area 6Aa and the enlarged area 6Ab. At a position facing the enlarged area 6Ab, the transparent resistive film 5J connected to the pair of terminals 5D is arranged so as to be parallel to the transparent resistive film 5A, thereby constituting the analog coordinate input portion Ab. In this way, even when a switch or the like is provided between the analog coordinate input portion Aa and the analog coordinate input portion Ab, it is not necessary to provide an opening in the intermediate bus M, and the protective panel A can be easily manufactured. In addition, the switches for the analog coordinate input unit Aa and the switches for the analog coordinate input unit Ab can be allocated to the left and right of the space between the analog coordinate input unit Aa and the analog coordinate input unit Ab, so that the operability of the electronic device B can be improved. promote.

(9) Furthermore, in each of the above embodiments, the circuit configuration on the front surface of the back side substrate 5 and the circuit configuration on the back surface of the front side substrate 6 can be changed.

In addition, the present invention is fully described in connection with preferred embodiments while referring to the drawings, but it is obvious that various modifications or corrections can be implemented for those who are familiar with the technology. Such deformation or correction is limited to the scope of the present invention without departing from the scope of the patent application.

[Industrial Utilization Possibility]

The present invention can be applied to electronic equipment equipped with a protective panel that protects electronic equipment such as mobile phones, smart phones, PDAs, car satellite navigation devices, digital cameras, digital cameras, portable game consoles, and digital tablets. The display unit of the display device provided in the, while allowing the operator to perform touch input corresponding to the display content.

<p>1. . . Mobile phone</p><p>2. . . framework</p><p>2A. . . Front frame</p><p>2B. . . Dorsal frame</p><p>2Aa. . . Display window</p><p>2a. . . Opening</p><p>2b. . . Support frame</p><p>3. . . Display device</p><p>3A. . . Display</p><p>4. . . Enter key</p><p>5. . . Back side substrate</p><p>5A, 6A. . . Transparent resistive film</p><p>5a, 5b. . . Through hole</p><p>5B, 6B. . . Busbar</p><p>5C, 6C. . . Pull circuit</p><p>5Ca. . . Circuit part</p><p>5D, 6D. . . Terminal</p><p>5E. . . Bonding layer</p><p>5Ea. . . Opening</p><p>5F, 6F. . . Flat terminal</p><p>5G. . . contact</p><p>5H. . . Resistor body</p><p>5J. . . Transparent resistive film</p><p>6. . . Surface side substrate</p><p>6Aa. . . Opposite field</p><p>6Ab. . . Expand the field</p><p>6E. . . Peripheral part</p><p>6M. . . Intermediate bus</p><p>7. . . Design sheet</p><p>7a. . . Transparency</p><p>7b. . . Decoration Department</p><p>7c. . . pattern</p><p>7B. . . Decorative layer</p><p>7C. . . Bonding layer</p><p>8. . . Spacer</p><p>9. . . Spring connector pin</p><p>10. . . Conductive bonding agent</p><p>11. . . Conductive pin</p><p>11B. . . head</p><p>12. . . switch</p><p>A. . . Protection panel</p><p>Aa. . . Analog coordinate input section</p>

Fig. 1 is a perspective view of the mobile phone according to the first embodiment.

Fig. 2 is a cross-sectional bottom view showing the main part of the configuration of the protective panel.

Fig. 3 is a vertical sectional bottom view showing the main part of the configuration of the protective panel.

Fig. 4 is a longitudinal sectional side view showing the configuration of the switch and the main part of the energization structure of the back side substrate.

Fig. 5 is a front view of the back side substrate and a back view of the front side substrate in the first embodiment.

Fig. 6 is a front view of a back side substrate and a back view of a front side substrate in the second embodiment.

Fig. 7 is a front view of a back side substrate and a back view of a front side substrate in another embodiment.

Fig. 8 is a front view of a back side substrate and a back view of a front side substrate in another embodiment.

Fig. 9 is a front view of a back side substrate and a back view of a front side substrate in another embodiment.

Fig. 10 is a front view of a back side substrate and a back view of a front side substrate in another embodiment.

Fig. 11 is a perspective view of a mobile phone equipped with a variable switch.

Fig. 12 is a front view of a back side substrate and a back view of a front side substrate in another embodiment.

Fig. 13 is a front view of a back side substrate and a back view of a front side substrate in another embodiment.

Fig. 14 is a front view of a back side substrate and a back view of a front side substrate in another embodiment.

Fig. 15 is a front view of a back side substrate and a back view of a front side substrate in another embodiment.

Fig. 16 is a perspective view of an electronic device provided with two coordinate input units.

Fig. 17 is a front view of a back side substrate and a back view of a front side substrate in another embodiment.

Fig. 18 is a front view of a back side substrate and a back view of a front side substrate in another embodiment.

Fig. 19 is a front view of a back side substrate and a back view of a front side substrate in another embodiment.

Fig. 20 is a front view of a conventional back side substrate and a back view of a front side substrate.