Structure of substrate supporting table, and plasma processing apparatus

Structure of substrate support table and plasma processing device

The present invention relates to a structure of a substrate support table that supports a substrate on an upper surface and can move up and down, and also relates to a plasma processing apparatus having the structure of the substrate support table.

Among the processing apparatuses that perform desired processing under vacuum, as pioneers, there is known an apparatus capable of changing the position of a substrate to be processed (Patent Documents 1 and 2). For example, plasma processing equipment used to manufacture semiconductor devices, specifically, plasma CVD (Chemical Vapor Deposition) equipment, plasma etching equipment, well-known equipment is equipped with: relative to the plasma can adjust the position of the substrate The substrate support table. In such a plasma processing device, by adjusting the distance between the substrate and the plasma, the processing rate, in-plane uniformity, and plasma damage can be adjusted to a desired state, and a higher degree of freedom can be achieved. Plasma processing device.

[Advanced Technical Literature]

[Patent Document 1] Japanese Patent Application Publication No. 2003-229408

[Patent Document 2] JP 2003-289068 A

<p>Fig. 3 is a cross-sectional view showing a conventional plasma processing device. First, the outline and problems will be explained. In addition, in Figure 3, the plasma generating mechanism, the gas supply mechanism, the vacuum mechanism, etc. are omitted from the illustration.</p><p>As shown in Fig. 3, the conventional plasma processing apparatus 30 places the substrate 37 on the mounting table 36 arranged inside the vacuum processing chamber 31, and uses the plasma generated in the vacuum processing chamber 31 P, apply the desired plasma treatment to the substrate 37. During plasma processing, the position of the substrate 37 can be adjusted with respect to the plasma P by the driving mechanism 38.</p><p>The drive mechanism 38 specifically includes a drive member 34 that supports the mounting table 36 from below, a drive plate 33 that supports the drive member 34, and a plurality of ball screws 35 that movably support the drive plate 33, and By rotating the ball screw 35, the drive plate 33, the drive member 34, the mounting table 36, and the substrate 37 are moved up and down. As a result, the position of the substrate 37 can be adjusted with respect to the plasma P. In addition, between the bottom of the vacuum processing chamber 31 and the drive plate 33, a telescopic hose 32 is provided. With the telescopic hose 32, the interior of the vacuum processing chamber 31 is kept in vacuum and the drive mechanism 38 can be moved up and down. .</p><p>As shown in FIG. 3, the conventional plasma processing apparatus 30 has a structure in which the telescopic hose 3 is arranged directly below the mounting table 36, but such a structure has the following problems.</p><p>(1) Telescopic hoses are generally made of stainless steel. However, when exposed to corrosive gases at high temperatures, corrosion continues, which will shorten the life span or cause metal contamination. In particular, in plasma processing equipment, it is very common to set the mounting table at a high temperature of about 400°C, as an etching gas (cleaning gas), and because it uses NF₃, CF₄, SF₆Corrosive gas, so use the flexible hose in a corrosive environment.</p><p>(2) In order to avoid corrosion, it is only necessary to install a telescopic hose away from corrosive gas or high-temperature parts. However, if the distance between the mounting table and the telescopic hose is extended (please refer to Figure 3), the volume and weight of the driving part will increase, which will place a heavy burden on the driving mechanism. In addition, when the volume and weight of the driving part increase, the workability during maintenance and repair will deteriorate, and the burden of maintenance and repair will increase.</p><p>(3) The products produced by the plasma treatment will adhere to the surface of the component parts inside the vacuum processing chamber, and when it adheres to the surface of the telescopic hose, the telescopic hose itself will expand and contract to make the attached The product peels off and becomes a major factor in the generation of dust particles.</p><p>The present invention is developed in view of the above-mentioned problems, and its purpose is to provide a structure of a substrate support table that can suppress the corrosion of the telescopic hose and the dust from the telescopic hose, and reduce the volume and weight of the driven part. And plasma processing device.</p>

<p>The structure of the substrate support table of the first invention to solve the above-mentioned problems is used in a processing device that uses corrosive gas in a vacuum vessel, and has a substrate support that has a drive mechanism to change the position of the substrate to be processed The structure of the table is characterized by having a cylindrical inner tube, a telescopic hose, a cylindrical outer tube, a disc-shaped mounting table, a covering member, and a driving member. The inner tube is the first intermediary. One end of the sealing member is installed around the opening of the inner wall of the vacuum container; the telescopic hose is arranged on the outer peripheral side of the inner cylinder, and the second sealing member is interposed so that one end is installed on the The other end side of the inner tube; the outer tube is arranged on the outer peripheral side of the telescopic hose, and a third sealing member is interposed so that one end side is attached to the other end side of the telescopic hose; the mounting table, It is used to mount the above-mentioned substrate and interpose a fourth sealing member to close the opening at the other end of the outer cylinder; the covering member is made of a corrosion-resistant material, It is installed in close contact with the outer cylinder in a manner of covering the entire surface of the outer cylinder; the driving member is installed on the back of the mounting table through the opening and the inside of the inner cylinder, and is driven by the driving mechanism Driven by.</p><p>The structure of the substrate support table of the second invention to solve the above-mentioned problems is used in a processing device that uses corrosive gas in a vacuum vessel, and has a substrate support that has a drive mechanism to change the position of the substrate to be processed The structure of the table is characterized by having a cylindrical inner tube, a telescopic hose, a cylindrical outer tube, a disc-shaped mounting table, a covering member, and a driving member. The inner tube is the first intermediary. The sealing member has its lower end installed around the opening of the inner wall of the vacuum container; the telescopic hose is arranged on the outer peripheral side of the inner cylinder, and the second sealing member is interposed so that the upper end is installed on the The upper end side of the inner tube; the outer tube is arranged on the outer peripheral side of the telescopic hose, and the third sealing member is interposed so that the lower end side is attached to the lower end side of the telescopic hose; the mounting table is used The substrate is mounted and the fourth sealing member is interposed to close the opening on the upper end side of the outer cylinder. The coating member is formed of a corrosion-resistant material and covered with The entire surface of the outer cylinder is covered in close contact with the outer cylinder; the driving member is installed on the back of the mounting table through the opening and the inside of the inner cylinder, and is driven by the driving mechanism.</p><p>That is, with the structure of the substrate support table described in the above-mentioned first and second inventions, while maintaining the vacuum on the side of the vacuum vessel, the side is arranged concentrically from the inside in order: a cylindrical inner tube, flexible and flexible Tube, outer cylinder, and covering member. In addition, the driven part driven by the driving member is a member between the telescopic hose and the mounting table, that is, only the telescopic hose, the outer tube, the covering member, and the mounting table are driven.</p><p>The structure of the substrate support table of the third invention to solve the above-mentioned problems is the structure of the substrate support table of the above-mentioned first and second inventions, in which at least one of the following is fused: the inner cylinder and the above-mentioned expansion and contraction It is characterized by fusion between the hoses in place of the second sealing member, and fusion between the flexible hose and the outer cylinder in place of the third sealing member.</p><p>The structure of the substrate support table of the fourth invention to solve the above-mentioned problems is the structure of the substrate support table of the above-mentioned first and second inventions, wherein, further, a circle formed of a corrosion-resistant material It is characterized by that a cylindrical exterior structural member is provided on the outer peripheral side of the covering member so as to cover the entire surface of the covering member.</p><p>The structure of the substrate support table of the fifth invention for solving the above-mentioned problems is the structure of the substrate support table according to the above-mentioned first and second inventions, wherein the processing device is a plasma processing device as a feature.</p><p>In addition, a plasma processing apparatus according to a sixth invention for solving the above-mentioned problems is characterized by having the structure of the substrate support table described in the above-mentioned first and second inventions.</p>

<p>According to the first to third inventions, since the inner tube, the telescopic hose, the outer tube, and the covering member are arranged concentrically from the inside in sequence, the telescopic hose can be received by the outer tube and the covering member. It protects and is not easy to be exposed to corrosive gases, so it can inhibit the corrosion of the flexible hose and also inhibit the metal pollution caused by corrosion. In particular, when the mounting table is set at a high temperature, for example, when the temperature is controlled at 400°C, the telescopic hose may be corroded by high temperature, but there is an outer tube and bag between the mounting table and the telescopic hose. The temperature of the covering member and the telescopic hose itself will not become high, so high temperature corrosion can also be suppressed, and metal contamination caused by high temperature corrosion can also be suppressed. In addition, the driven part driven by the driving member has only the telescopic hose, the outer tube, the covering member, and the mounting table. Therefore, compared with the conventional technology, the volume and weight of the driven part can be reduced. Reduce the burden on the telescopic hose or drive mechanism. Furthermore, when a malfunction occurs in the drive mechanism, when the mounting table is pushed to the vacuum side by the atmosphere on the back of the mounting table, since the flexible hose changes in the direction of contraction, the flexible hose will not stretch and break. , And can maintain the safety of the device. Based on the above effects, the performance and reliability of the structure of the substrate support table can be improved.</p><p>According to the fourth invention, since the outer structural member formed of a corrosion-resistant material is further provided on the outer peripheral side of the covering member, the corrosion of the expansion hose can be further suppressed.</p><p>According to the fifth and sixth inventions, by applying the structure of the substrate support table described in the first to second inventions to a plasma processing apparatus, the surface of the telescopic hose is protected inside the outer cylinder, the covering member, etc. , It is not easy to adhere to the products generated by the plasma treatment, so even if the flexible hose expands and contracts, the generation of dust particles itself is less.</p>

The embodiment examples of the structure of the substrate support table of the present invention will be described with reference to Figs. 1 to 2. In addition, although the plasma CVD apparatus is exemplified as an example, it is not limited to the plasma CVD apparatus, and can also be applied to the plasma etching apparatus. Furthermore, as long as it is a support that moves in a vacuum container to support the processing object It can also be applied to other devices under such conditions.

(Example 1)

Figures 1 and 2 are cross-sectional views of an example of the embodiment of the structure of the substrate support table of the present invention. Figure 1 is a diagram showing the substrate support table positioned below the plasma CVD apparatus; Figure 2 is a diagram showing the substrate support table at the upper position. In addition, in Figs. 1 and 2, illustrations of the plasma generating mechanism, gas supply mechanism, vacuum mechanism, etc. are omitted.

In this embodiment, the plasma processing apparatus 10 has: a vacuum processing chamber (vacuum container) 11 in which a vacuum is applied, and a disk-shaped disk arranged inside the vacuum processing chamber 11 for mounting a substrate 17 Mounting table 16.

In addition, the mounting table 16 is supported by the following supporting structure. Specifically, it has: a cylindrical inner tube 12, a telescopic hose 13, and a cylindrical outer tube 14; the inner tube 12 becomes a lower flange 12a on the lower end side (or one end side) Is installed around the opening 11b of the bottom 11a (or inner wall) of the vacuum processing chamber 11; the telescopic hose 13 is arranged on the outer peripheral side of the inner cylinder 12, and it becomes the upper end side (or one end) ( Or one end side) is attached to the lower flange 13b which becomes the lower end side (or the other end side) of the telescopic hose 13, and blocks the opening on the upper end side (or the other end side) of the outer tube 14 In this way, the mounting table 16 is attached to the upper flange 14a. In addition, on the outer periphery of the outer cylinder 14, a covering member 15 (covering member) capable of covering the entire surface of the outer cylinder 14 in close contact with the outer peripheral surface is provided. That is, directly below the mounting table 16, the inner tube 12 is arranged on the innermost peripheral side, and is arranged concentrically from the inside: cylindrical inner tubes 12 with mutually different diameters are flexible and flexible. The structure of the tube 13, the outer tube 14, and the covering member 15.

In addition, between the bottom portion 11a and the lower flange 12a, a sealing member (first sealing member) such as an O-ring is interposed and attached. Similarly, between the inner cylinder 12 and the upper flange 13a, an intermediate O-ring or other sealing member (second sealing member) is installed, and between the lower flange 13b and the outer cylinder 14 is an intermediate O-ring. A sealing member (third sealing member) such as an O-ring is installed between the upper flange 14a and the mounting table 16 and a sealing member (fourth sealing member) such as an O-ring is interposed. That is, the vacuum processing chamber 11, the inner tube 12, the telescopic hose 13, the outer tube 14, and the mounting table 16 are installed with an intermediary sealing member between each other. By such a configuration, the inside of the vacuum processing chamber 11 is held in The vacuum can simultaneously perform up and down movement by the drive mechanism 24 described later. In addition, for the inner tube 12, the telescopic hose 13, and the outer tube 14, at least one of the inner tube 12 and the telescopic hose 13 and between the telescopic hose 13 and the outer tube 14 may be used so as not to leak. The ground is integrated by welding and is kept in a vacuum.

In addition, among the inner tube 12, the telescopic hose 13, and the outer tube 14, in order to maintain a structure capable of supporting the mounting table 16 even at high temperatures, at least the outer tube 14 is made of a metal or alloy with a higher melting point. For example, it is preferably made of stainless steel. In addition, in order to avoid high temperature corrosion of the outer cylinder 14 caused by corrosive gas, the covering member 15 is made of a material having corrosion resistance, for example, aluminum whose surface is processed with an aluminum oxide film, or , High-purity alumina and other ceramic materials are formed. In particular, since the mounting table 16 is set at a high temperature of about 400°C, the part directly in contact with the upper flange 14a of the mounting table 16 should preferably be in close contact with the covering member 15 without a gap. . For example, as shown in Figures 1 and 2, when the upper flange 14a protrudes from the outer peripheral side, the upper end 15a of the covering member 15 is also formed in accordance with this shape, in a seamless and close contact manner To implement. As a result, it is possible to prevent the outer cylinder 14 from being exposed to corrosive gas as much as possible.

In addition, a cylindrical skirt member (external structure member) 18 may be provided on the outer peripheral side of the covering member 15 so as to cover the entire covering member 15. The skirt member 18, like the covering member 15, is made of a corrosion-resistant material, for example, aluminum whose surface is processed with an aluminum oxide film, or ceramics such as high-purity aluminum oxide. The material is formed. By providing the skirt member 18, the gas flowing on the outer peripheral side can be rectified, and the gas can be prevented from entering the outer cylinder 14, the telescopic hose 13, and the inner cylinder 12. As a result, the outer cylinder 14 and the telescopic soft can be prevented. Corrosion of the tube 13 and the inner cylinder 12 prevents metal contamination caused by corrosion, and at the same time extends the life of these products.

In addition, the mounting table 16 can be moved up and down by the drive mechanism 24. The drive mechanism 24 specifically includes: a drive member 21 that passes through the opening 11b and the inside of the inner tube 12 and is mounted on the back surface of the mounting table 16, and a drive plate 22 that supports the drive member 21, and movably supports The plurality of ball screws 23 of the drive plate 22 rotate the ball screws 23 to move the drive plate 22, the drive member 21, the mounting table 16, and the base plate 17 up and down, thereby changing the position of the base plate 17.

In the case of placing the substrate 17 on the mounting table 16, as shown in Figure 1, the mounting table 16 is placed at a lower position, and a robot arm not shown is used to place the substrate through the gate 20. . On the other hand, when plasma processing is applied to the substrate 17 placed on the mounting table 16, as shown in FIG. The position of the slurry P is used for plasma processing that can obtain the required process results.

By setting the structure as described above, even if the mounting table 16 is heated to about 400°C, the outer cylinder 14 can be protected by the covering member 15, reducing the possibility of high-temperature parts being exposed to corrosive gas, and inhibiting high-temperature corrosion . In addition, since the telescopic hose 13 and the inner tube 12 are far away from the path of the mounting table 16, heat is not easily conducted, so it does not become high temperature, and even if exposed to corrosive gas, high temperature corrosion can be suppressed. Therefore, for the inner tube 12, the telescopic hose 13, and the outer tube 14 made of metal components, the high temperature corrosion of these components can be suppressed, so the product life of these components can be prolonged, and the product life from the Metal contamination of other components.

In addition, by setting it to the above-mentioned structure, since the flexible hose 13 that can be stretched when the substrate 17 is transported is shortened when the substrate 17 is subjected to plasma processing, the product or product attached to the surface of the flexible hose 13 There are fewer by-products. Particularly, in the case of a plasma CVD apparatus, since the film formed on the surface of the flexible hose 13 is reduced, the dust particles generated mainly due to the film peeling of the film forming film are reduced.

Moreover, by setting it to the above-mentioned structure, the back surface of the mounting table 16 can be set to atmospheric pressure. In the case of a plasma processing apparatus, the mounting table 16 is provided with an electrostatic adsorption electrode for electrostatically adsorbing the substrate 17, a bias electrode for applying a bias to the substrate 17, and heating for heating the substrate 17. Various components such as a flow path of a refrigerant for temperature control of the substrate 17, and a temperature sensor for detecting the temperature of the substrate 17 and the mounting table 16. Discharge can be prevented by setting the connecting parts of these components under atmospheric pressure to apply high voltage to the electrostatic adsorption electrode, bias electrode, heater, etc. In addition, if the refrigerant leaks with respect to the connecting part of the flow path, it will not be contaminated by the side of the vacuum processing chamber 11 because it leaks to the atmosphere.

In addition, by setting it to the above-mentioned structure, the upper flange 13a of the telescopic hose 13 is used as the boundary, and only the side of the mounting table 16 is moved up and down, and the side of the inner tube 12 is fixed, so the vacuum processing chamber can be reduced in size. The volume and weight of the driven part inside 11 can reduce the burden on the driving mechanism 24. In addition, in the event of a failure of the drive mechanism 24, even if the pressure formed by atmospheric pressure acts on the back of the mounting table 16, in this case, since the telescopic hose 13 is moved in the contraction direction, it is compared to extension. The direction is a safe state, and there will be no situation that causes the expansion hose 13 to break.

[Industrial availability]

The present invention is very suitable for plasma processing equipment such as plasma CVD equipment or plasma etching equipment used in the manufacture of semiconductor devices, but as long as it uses a flexible hose for the driving part in a vacuum container, and is relatively flexible If the hose is a device with corrosive gas used in a vacuum container, it is not limited to the manufacture of semiconductor devices, but can also be applied to devices that manufacture other items.

<p>10. . . Plasma CVD device</p><p>11. . . Vacuum processing chamber</p><p>11a. . . bottom</p><p>11b. . . Opening</p><p>12. . . Inner tube</p><p>12a. . . Lower flange</p><p>13. . . Telescopic hose</p><p>13a. . . Upper flange</p><p>13b. . . Lower flange</p><p>14. . . Outer tube</p><p>14a. . . Upper flange</p><p>15. . . Cladding member</p><p>15a. . . Upper end</p><p>16. . . Mounting table</p><p>17. . . Substrate</p><p>18. . . Skirt member</p><p>20. . . Gate</p><p>twenty one. . . Support tube</p><p>twenty two. . . Driver board</p><p>twenty three. . . Ball screw</p><p>twenty four. . . Drive mechanism</p>

Fig. 1 is a cross-sectional view showing an example of the structure of the substrate support table of the present invention, and illustrates the substrate support table moved to a lower position in the plasma CVD apparatus.

Fig. 2 is a cross-sectional view showing an example of the structure of the substrate support table of the present invention, and illustrates the substrate support table moved to the upper position in the plasma CVD apparatus.

Figure 3 is a cross-sectional view of a conventional plasma processing device.