Display motherboard and application thereof

Display motherboard and its application

The present invention relates to a liquid crystal display, and particularly to filling materials in the liquid crystal display.

Liquid crystal display has the advantages of high image quality, small size, light weight, low voltage drive, low power consumption and wide application range, so it has been widely used in portable TVs, mobile phones, camcorders, and notebook computers , Desktop monitors, and projection TVs and other consumer electronics or computer products have become the mainstream of displays.

The liquid crystal panel is one of the key components of the liquid crystal display. Traditionally, most manufacturers cut the glass substrate into a piece of panel unit, and then perform the required post-production process to complete the production of the liquid crystal panel. However, as the requirements of the current consumer market are getting higher and higher, this traditional manufacturing process is also forced to face a series of severe challenges.

For example, in traditional cutting of glass substrates, a cutter wheel is used to form cutting lines and median cracks on the surface, and then the glass substrate is split along the ribs. However, nowadays, the thickness of glass substrates is getting thinner and thinner. Therefore, when manufacturers use a knife wheel to traverse the glass substrates, the glass substrates often fail to provide sufficient support strength to allow ribs to form, resulting in poor glass cutting.

Therefore, one technical aspect of the present invention is to provide a display mother The board is used to solve the problems faced by the above-mentioned traditional manufacturing process.

An embodiment of the display motherboard of the present invention includes a first substrate, a second substrate, a plurality of cutting lines, and at least one photoresist support material. The second substrate is opposite to the first substrate. The cutting line is located on the first substrate and the second substrate. The above-mentioned cutting line separates the first substrate and the second substrate into at least one display panel unit. The photoresist support material is interposed between the first substrate and the second substrate. The above-mentioned photoresistive support material is overlapped with the cutting line, and the photoresistive support material is strip-shaped and surrounds the edge of the display panel unit.

In use, the user only needs to cut the first substrate and the second substrate along the cutting line of the display mother board to obtain a plurality of display panel units.

Another technical aspect of the present invention is to provide a display panel.

An embodiment of the display panel of the present invention includes a first substrate, a second substrate, and at least one photoresist support material. The second substrate is opposite to the first substrate. The photoresist support material is interposed between the first substrate and the second substrate. Wherein, the photoresistive support material overlaps the edge of at least one side of at least one of the first substrate and the second substrate, and the photoresistive support material is strip-shaped and surrounds the edges of the first substrate and the second substrate.

Figure 1 is a top view of an embodiment of the display motherboard of the present invention. Figure 2 shows a cross-sectional view along line 2 of Figure 1. As shown in the figure, the display motherboard 100 includes a first substrate 110, a second substrate 120, a plurality of cutting lines 130 and at least one photoresist support material 140. The second substrate 120 is disposed opposite to the first substrate 110. The cutting line 130 is located on the first substrate 110 and the second substrate 120 superior. The above-mentioned cutting line 130 separates the first substrate 110 and the second substrate 120 into at least one display panel unit 150. The photoresist support material 140 is interposed between the first substrate 110 and the second substrate 120. The above-mentioned photoresistive support material 140 and the cutting line 130 are overlapped and arranged, and the photoresistive support material 140 is strip-shaped and surrounds the edge of the display panel unit 150.

When forming the cutting line 130, the manufacturer can use a knife wheel to traverse the surfaces of the first substrate 110 and the second substrate 120 along the photoresist support material 140, so that the surfaces of the first substrate 110 and the second substrate 120 produce a cutting line 130. . At this time, since there is a photoresist support material 140 between the first substrate 110 and the second substrate 120, even if the thickness of the first substrate 110 and the second substrate 120 is slightly thinner, the photoresist support material 140 can also provide sufficient support , So that the ribs can be formed on the first substrate 110 and the second substrate 120. In this embodiment, the thickness Tg of the first substrate 110 and the second substrate 120 are preferably between about 50-300 μm, and the width Ts of the photoresist support material 140 is preferably between about 60-600 μm, but Not limited to this.

In this embodiment, the photoresist support material 140 may be formed on the first substrate 110, and the top of the photoresist support material 140 contacts the second substrate 120. Of course, the aforementioned photoresist support material 140 can also be modified to be formed on the second substrate 120, and the top of the photoresist support material 140 contacts the first substrate 110.

Specifically, the above-mentioned photoresist support material 140 can have the same material as the photo spacer, light shielding layer, flat layer or color resist in the visible area, and be formed at the same time. However, this does not limit the present invention. Those with ordinary knowledge in the technical field to which the present invention belongs can also form the photoresist support material 140 separately according to the manufacturing process, or by using photosensitive spacers, light-shielding layers, Any combination of flat layer or color resist is stacked to form.

As shown in FIG. 1, each display panel unit 150 includes a sealant 160, and the sealant 160 is interposed between the first substrate 110 and the second substrate 120 and located inside the photoresist support material 140. When the manufacturer manufactures the display mother board 100 as shown in FIG. 1, the liquid crystal dropping method (One Drop Filling; ODF) may be used to inject the liquid crystal. In this way, both the photoresist support material 140 and the sealant 160 can be of a closed rectangular shape, and no liquid crystal injection port or other openings need to be reserved. Since the photoresist support material 140 does not have any openings, when the cutter wheel forms all the cutting lines 130, the photoresist support material 140 can be fully supported without the problem of insufficient support at the openings.

In FIG. 1 and subsequent related drawings, the dashed line represents the cutting line 130 on the surface of the first substrate 110 that has not yet been cracked. In addition, although the sealant 160 should be covered by the first substrate 110 in Figure 1 and subsequent related drawings, in order to clearly mark the position of the sealant 160, the sealant 160 will still be shown in the drawings, but the inside Add a slash to avoid confusion.

In addition, although Figure 1 shows the photoresist support material 140 as a closed rectangle, this does not limit the present invention. Those skilled in the art to which the present invention pertains can choose the photoresist support material flexibly according to the manufacturing process. 140's implementation. For example, the photoresist support material 140 shown in FIG. 3 is in a strip shape, and is roughly arranged in a rectangular shape.

Specifically, the sealant 160 in FIG. 3 may have a liquid crystal injection port 162, and the photoresistive support member 140 has an opening 144 at a position corresponding to the liquid crystal injection port 162. In this way, when the manufacturer uses the display motherboard 100 shown in Figure 3 to make When the panel is displayed, the liquid crystal can be selectively injected through the opening 144 and the liquid crystal injection port 162.

In this embodiment, although the shape of the photoresist support material 140 is strip-shaped, the length of the photoresist support material 140 is preferably approximately equal to the length of the cutting line 130 to ensure that the cutter wheel forms all the cutting lines. At 130 hours, the support of the photoresist support material 140 can be fully obtained. For example, the length of the photoresist support material 142 is approximately equal to the length of the cutting line 132.

It should be understood that "approximately" is used to modify any amount that can be changed slightly, but such slight changes will not change its essence. For example, "The length of the photoresist support material 140 is approximately equal to the length of the cutting line 130." This description means that the length of the photoresist support material 140 is indeed equal to the length of the cutting line 130, as long as the cutter wheel is in When the cutting line 130 is formed, the photoresist support material 140 can provide the supporting function, and the length of the photoresist support material 140 can also be slightly larger or slightly smaller than the length of the cutting line 130.

Another technical aspect of the present invention is the cutting method of the above-mentioned display motherboard. An embodiment of the cutting method of the display motherboard includes the following steps (it should be understood that the steps mentioned in this embodiment can be adjusted according to actual needs, except for those whose order is specifically stated. It can even be performed at the same time or partly at the same time): (1) provide the display motherboard 100 as shown in FIG. 1 or FIG. 3; and (2) cut the first substrate 110 and the second substrate 120 along the cutting line 130.

Specifically, in the above step (2), the first substrate 110 and/or the second substrate 120 can be split by using a split rod to knock the first substrate 110 and/or the second substrate 120. But the essence of ordinary lobes Therefore, a large distance must be reserved between the cutting line 130 and the sealant 160 to prevent the split rod from hitting the sealant 160 and affect the splitting effect.

Please refer to Figure 2, if the thickness Tg of the first substrate 110 and the second substrate 120 are both about 50~300 μm, the manufacturer can choose to cut the first substrate 110 and/or the second substrate 120 with a cutter wheel, namely Splinter directly, without tapping with a splinter rod. Compared with knocking with a split rod, the distance D between the cutting line 130 (or the photoresist support material 140) and the sealant 160 can be greatly reduced. Relatively speaking, the visible area surrounded by the sealant 160 will increase. In this embodiment, the distance D between the cutting line 130 (or the photoresist support material 140) and the sealant 160 is about 0 to 1 mm.

Another technical aspect of the present invention is a display panel obtained by cutting the above-mentioned display mother board. The following will take Fig. 4 and Fig. 5 as examples to illustrate the technical content in detail. It should be understood that in the following description, the technical content that has been mentioned in the above embodiments will not be repeated, and only those who need further definition will be supplemented, and they will be described first.

FIG. 4 shows a top view of the display panel 155 obtained by cutting the display mother board 100 of FIG. 1. As shown in the figure, the display panel 155 includes a first substrate 110, a second substrate 120 and at least one photoresist support material 140. The second substrate 120 is disposed opposite to the first substrate 110. The photoresist support material 140 is interposed between the first substrate 110 and the second substrate 120. The photoresist support material 140 described above overlaps the edge of at least one side of at least one of the first substrate 110 and the second substrate 120, and the photoresist support material 140 is strip-shaped and surrounds the first substrate 110 and the second substrate. Two edges of the substrate 120.

Specifically, the photoresist support material 140 of this embodiment is a closed rectangle, It surrounds the edges of the first substrate 110 and the second substrate 120. That is, the photoresist support material 140 of this embodiment will overlap the edges of all sides of the first substrate 110 and the second substrate 120. For example, the photoresist support material 140 in FIG. 4 overlaps with the edge of the side 112 of the first substrate 110.

FIG. 5 shows a top view of the display panel 155 obtained by cutting the display motherboard 100 of FIG. 3. The difference between this embodiment and the previous embodiment is that the photoresist support material 140 of this embodiment is in the shape of a strip, and the length of the photoresist support material 140 is approximately equal to at least one of the first substrate 110 and the second substrate 120. One of the sides has the same length. For example, the photoresist support material 142 is approximately equal to the length of the side 112 of the first substrate 110.

Several experimental data will be listed below to illustrate that the photoresist support material can indeed provide effective support when the cutter wheel traverses the substrate, so that the ribs can be formed on the substrate smoothly.

In the following examples, the photoresist support material will be formed on the first substrate first, and then the first substrate and the second substrate will be combined. Then, the cutter wheel traverses the first substrate and the second substrate in sequence along the photoresist support material. The detailed process parameters are shown in Table 1, and the results are recorded in Table 2.

<tables><img file="TWI377397B_D0001.tif" /></tables><tables><img file="TWI377397B_D0002.tif" /></tables>

<tables><img file="TWI377397B_D0003.tif" /></tables>

The experimental results in Table 2 show that in all the examples, the ribs can be formed on the first substrate or the second substrate. That is to say, no matter the thickness of the first substrate/second substrate is 0.5 mm or 0.1 mm, as long as the photoresist support material is placed between the first substrate and the second substrate, the problem that the traditional ribs cannot be solved can be solved .

Although the present invention has been disclosed in the above embodiments, it is not intended to limit the present invention. Anyone familiar with the art can make various changes and modifications without departing from the spirit and scope of the present invention. Therefore, the protection of the present invention The scope shall be subject to the definition of the attached patent application scope.

<p>2Line segment</p><p>100Display Motherboard</p><p>110First substrate</p><p>112edge</p><p>120Second substrate</p><p>130Cutting line</p><p>132Cutting line</p><p>140Photoresist support material</p><p>142Photoresist support material</p><p>144Open</p><p>150Display Panel Unit</p><p>155Display Panel</p><p>160Frame glue</p><p>162Liquid crystal injection port</p><p>DDistance</p><p>TgThickness</p><p>TsWidth</p>

Figure 1 is a top view of an embodiment of the display motherboard of the present invention.

Figure 2 shows a cross-sectional view along line 2 of Figure 1.

Figure 3 is a top view of another embodiment of the display motherboard of the present invention.

Fig. 4 is a top view of the display panel obtained by cutting the display mother board of Fig. 1.

Fig. 5 is a top view of the display panel obtained by cutting the display mother board of Fig. 3.