Ball grid array connection device

Ball grid array connection device

Technical field

This creation is about the scope of electrical connectors. In particular, it relates to an interposer for connecting a ball grid array to a substrate.

Creative background

Recently, the driving force for smaller and more functional electronic devices has created a demand for miniaturization of all components, especially electrical connectors. The driving force of smaller electronic devices is also accompanied by the recent favorite of surface mount technology (SMT) to mount components on circuit boards. In order to meet the demand for increased terminal density in SMT, array connectors have been created, especially the "high-density connector" disclosed in US Patent No. 6,024,548, which is incorporated herein by reference, Ball Grid Array (BGA) connection The device has become a reliable and effective technology for the use of SMT to mount high-density electrical connectors on the substrate.

The BGA connector has an insulated connector housing. One side of the connector housing is a ball-bonded ball array matrix for connecting the conductive paths of the circuit substrate. The opposite side of the connector shell has a corresponding contact terminal matrix, which extends along the connector shell and is electrically connected to the solder balls. These contact terminals are designed to connect to other BGA connectors and also connect to another substrate. Therefore, the board-to-board interconnection of the device can be connected via the BGA. The connection between the BGA connector and the circuit substrate is by the so-called "reflow" The procedure is reached. In the reflow process, the solder ball is heated until it melts and then cools, so that a solder connection is achieved between the BGA and the substrate. Because the circuit substrate is typically a flat surface with etched circuits, the solder balls actually maintain their position during the reflow process.

Usually when using a BGA interconnect circuit substrate, an interposer is also used. Inside The interposer is an intermediate connection device that can be placed between the BGA connector and the circuit substrate. Using the interposer to connect and disconnect the BGA and the circuit substrate, the wear of the BGA connector and the etching circuit interface of the substrate can be reduced. In addition, the interposer can also provide other connections to the substrate. Unlike the substrate interface, the interposer cannot provide a flat fit for the BGA solder balls. For example, the interposer may be an array of solder balls, similar to a BGA connector. As a result, during the reflow process, the connection between the BGA and the interposer may drift, causing improper connection. The interposer can also have better heat absorption and retention of heat in the interposer to enable heat transfer from the precision electronic circuit components.

Therefore, there is a need to provide interposers, BGA connectors or other connector devices, which can be easily matched with BGA connectors or other similar connectors.

Creation content

This creation includes an interposer, BGA connector, or other connector device to provide electrical contact with the ball grid array connector. The new interposer includes a shell with contacts. The contact has first and second terminals. The interposer also includes a first terminal with a reflowable conductive material and a first body and a second body disposed on at least one contact. The first body and the second body provide a reflowable, electrical connection between a single body of conductive material for the interposer and the ball grid array connector. The contact can pass from the first surface of the housing to the second surface of the housing opposite to the first surface. The first terminal of the contact can be reached on the first surface of the housing, and the second terminal of the contact can be on the Reached on the opposite surface of the housing. The single body of the reflowable conductive material of the first body and the second body of the interposer and the ball grid array connector forms a solder connection during the reflow process. The interposer can also be packaged The third body including the reflowable conductive material is arranged on the first terminal of at least one contact, and the third body provides electrical contact between the interposer and the single body of the reflowable conductive material of the ball grid array connector, and provides Soldering connection to the ball grid array connector during the reflow process. The one or more bodies may be spherical in fact and/or conical or similar in size in fact.

FIG. 1 is a side view of an exemplary interposer 101, which provides electrical contact with a ball grid array (BGA) connector 103. As shown in FIG. Although Figure 1 is illustrated with an interposer, it should be understood that this creation can also be applied to other forms of connection devices, such as BGA connectors. As such, this creation is not limited to an interposer or other BGA connectors.

As shown in FIG. 1, the interposer 101 may be adapted to provide electrical contact with the BGA connector 103 and the substrate 104. The interposer 101 includes a housing 102. The housing 102 has a first surface 112 and a second surface 113. The first surface 112 can be used to provide electrical contact with the BGA connector 103. The second surface 113 may be adapted to provide electrical contact with the substrate 104.

The first surface 112 on the housing 102 includes a plurality of reflowable conductive materials or spheres disposed thereon to provide connection to the BGA connector 103. In particular, the first surface 112 includes a first body 106, a second body 107, and a third body 108. In addition, there may be an array of such bodies located on the first surface 112 of the housing 102. The first body 106, the second body 107 and the third body 108 can be close to each other to receive the BGA body 110 disposed on the BGA connector 103. In particular, the positions of the first body 106, the second body 107 and the third body 108 enable the BGA body 110 on the BGA connector 103 to be mounted on the interposer 101. Although Figure 1 shows a For a single BGA body, it should be understood that more than one BGA body can contact the body of the interposer.

In the reflow process, the BGA body 110 is placed on or near the top of the first body 106, the second body 107, and the third body 108. The reflow process heats the body, so that the reflowable conductive material starts to melt. As a result of the melting of the material, the BGA body 110 and the at least one first body 106, the second body 107 and the third body 108 are in welding contact. The first body 106, the second body 107, and the third body 108 are configured so that the BGA body 110 can be mounted on the bodies 106-108 before the reflow process. Because of the positions of the first body 106, the second body 107 and the third body 108, the BGA body 110 can be mounted on it, and the BGA body 110 can be prevented from moving during and/or before the reflow process. Therefore, the BGA body 110 can be connected to the first body 106, the second body 107 and the third body 108 by welding.

In order to facilitate the mounting of the BGA body 110 on the first body 106, the second body 107 and the third body 108, some or all of the bodies may actually be spherical or tapered. In addition, the BGA body 110 and the bodies 106-108 can be substantially similar in size to further facilitate proper connection and plane alignment (planarization). In addition, the number of bodies on the first surface 112 of the housing 102 can be changed according to the number, size, and size of the special bodies on the BGA connector 103 (ie, the BGA body 110). As such, this creation is not limited to any of these characteristics.

The contact 105 can make electrical contact with at least one of the first body 106, the second body 107 and the third body 108. The contact 105 has a first terminal and a second terminal. The first terminal provides an electrical contact point with one of the first body 106, the second body 107, and the third body 108. The second terminal provides a path and an electrical contact point with the fourth body 109. The contact 105 passes through the housing 102 from the first surface 112 to the second surface 113. this In addition, the contact 105 is also in electrical contact with the fourth body 109. As a result, the contact 105 can provide electrical conductors from at least one of the first body 106, the second body 107 and the third body 108 to the fourth body 109 through the housing 102. The position of the fourth body 109 can provide electrical contact with the contact pad 111 on the substrate 104. Therefore, during the reflow process, the fourth body 109 may be disposed near the contact pad 111 so as to provide a solder connection with the contact pad 111 during the reflow process. As a result, the interposer 101 can provide an electrical connection between the BGA connector 103 and the substrate 104.

FIG. 2 is a perspective view of the interposer 101 and the BGA connector 103, as discussed in FIG. 1. In addition, FIG. 3 is a plan view of the interposer 101 in FIG. 1. As can be seen from FIGS. 2 and 3, the first body 106, the second body 107 and the third body 108 can be in a hole 301 in the housing 102. The positions of the first body 106, the second body 107 and the third body 108 enable the BGA body 110 to be mounted on the first body 106, the second body 107 and the third body 108 before the reflow process. As a result, during and after the reflow process, the BGA body 110 is guided to contact the first body 106, the second body 107, and the third body 108. Therefore, it can be ensured that the BGA body 110 has at least one first body 106, a second body 107, and a third body. The three bodies 108 form a proper welding connection. In addition, because the first terminal of the contact 105 is in electrical contact with at least one first body 106, the second body 107 and the third body 108, the BGA body 110 (and the BGA connector 103) is in electrical contact with the first body of the contact 105 Electrical conduction can be provided between the two sides.

FIG. 4 is a side view of the interposer 101, the BGA connector 103 and the substrate 104, as discussed in FIG. 1. FIG. 4 illustrates in detail that the BGA connector 103 and the substrate 104 are mounted on the interposer 101 before the return process. FIG. 5 provides a perspective view of the electrical connection between the interposer 101 and the BGA connector 103. As shown in Figure 4 and Figure 5, the BGA connector 103 The above BGA body 110 is actually in contact with at least one of the first body 106, the second body 107 and the third body 108 before the reflow process. As discussed above, FIG. 4 further details the electrical connection between the BGA connector 103 and the substrate 104 provided by the contacts 105 on the body 106-109, 110 and the interposer 101. In particular, after the reflow process, the BGA connector 103 and the interposer 101 become electrically connected through the fusible connection of the BGA body 110 and the first body 106, the second body 107 and the third body 108. In addition, the bodies 106-108 on the first surface 112 of the interposer 101 are electrically connected to the contacts 105, and are electrically connected to the fourth body 109. The fourth body 109 and the contact pad 111 on the substrate 104 are in electrical contact, so that after the reflow process, the interposer 101 to the substrate 104 can be provided with conduction. Therefore, the conduction from the BGA connector 103 to the substrate 104 is conducted.

Although FIGS. 1 to 5 are discussed with reference to the interposer 101, it should be understood that this creation can be applied to other connection devices. For example, this creation can be adapted to BGA connectors that communicate with other BGA connectors. In this case, the BGA connector can be made similar to the interposer 101 and also includes a second housing. The BGA connector can have a first surface and a second surface, so that the second surface of the second housing can be adapted to be disconnected from the second terminal of a contact on the ball grid array connector, which is similar to the BGA connector , Well known to those skilled in this art. In addition, the second set of contacts can extend from the first surface of the second housing, and the second body of material can be arranged on the first contacts to connect the BGA connector to the second substrate.

FIG. 6 is a side view of another interposer 601 that provides electrical connection with a BGA connector 603. The interpolator 601 is similar to the interpolator 101 discussed in FIGS. 1 to 5. The interposer 601 has a first body 606, a second body 607 and a third body 608, all of which are actually tapered. Although this creation is not limited to the first A body 606, the second body 607, and the third body 608 have special shapes and sizes. The body can be spherical so that the BGA body 610 can be placed on the bodies 606-608 for contact before the reflow process. Therefore, during the subsequent reflow process, the BGA body 610 can be melt-connected with the at least one first body 606, the second body 607, and the third body 608. As for the interposer 101 discussed in FIGS. 1 to 5, the interposer 601 includes contacts 605 in electrical communication with the first body 606, the second body 607, the third body 608, and the fourth body 609. It should be understood that the contact 605 may not be needed.

7 and 8 are a side view and a perspective view of another interposer 701, respectively. The structure of the interposer 701 may eliminate the need for contacts (such as the contacts 605 in FIG. 6) to provide electrical connections from the first surface 712 to the second surface 713 of the housing 702. In particular, the interposer 701 can directly electrically connect the first body 706, the second body 707, and the third body 708 with the fourth body 709. Such direct electrical connection can be provided before the reflow process. Alternatively, this direct electrical connection can be provided during the reflow process, but the size of the fourth body 709 must be made so that it can be in contact with the first body 706, the second body 707, and the third body 708 before the reflow process. . The interposer 101 discussed in FIGS. 1 and 5, and the interposer 601 in FIG. 6, the first body 706, the second body 707, and the third body 708 on the first surface 712 of the interposer 701 provide An interface where the BGA body 710 is placed on each body on the first surface 712 before the reflow process. As a result, the interposer 701 provides an electrical connection to the substrate 704 from the BGA connector 703 through the first body 706, the second body 707, the third body 708, and the fourth body 709 without the need for the interposer 701. One contact. In addition, the fourth body 709 provides an electrical connection with the contact pad 711.

Although the three reflowable conductive bodies on the first surface of the interposer have been described in detail It should be understood that any number of reflowable bodies can be configured on it. For example, two bodies such as the first body 106 and the second body 107 can be disposed in the hole 301 on the housing 102, which is ideal. In addition, it is also ideal that four such reflowable bodies are arranged on the first surface 112 of the interposer 101. For this, it should be understood that this creation is not limited to the number of reflowable conductive bodies on the interposer 101. Conversely, the interposer 101 may include any number of reflowable conductive bodies required for devices connected to the interposer 101 such as the BGA connector 103.

It should be understood that the contact does not have to be electrically connected to the body disposed on the first surface. For example, in one embodiment, the contact 105 can be electrically connected to the first body 106. After the reflow process, the contact 105 is connected to the second body 107 and the third body 108 due to the fusible connection with the first body 106. It is an electrical connection. In addition, it should be understood that any number of holes 301 and any number of reflowable conductive materials in the holes can be located on the housing 102. For example, the holes 301 can form a matrix array to provide electrical connection with a ball grid array such as the BGA connector 103.

This creation is aimed at an electrical connection device that provides electrical contact with the BGA connector. It should be noted that the above examples are for illustrative purposes only, and do not have any intention to limit this creation. This creation has been illustrated with a certain embodiment, and it should be understood that the words and sentences used in the description are for narrative and explanation purposes and are not limited words and sentences. Although this creation is illustrated with an interposer, it should be understood that the technology and structure described can be applied to other types of electrical connectors. Although this creation describes some components on the electrical connector, it should be understood that the configuration described is only an example of the configuration, which can provide a new type of electrical connector. In accordance with this, this creation expects that other electrical connectors that are not described in this manual but can meet the requirements provided in the examples.

In addition, although this creation is explained with reference to special device materials and examples, This creation is not intended to be limited to the special conditions mentioned. On the contrary, this creation intends to expand all the equivalent functional system structures, methods and uses within the scope of the patent application. After understanding the essence of this creation, those skilled in this art will be able to make different modifications and changes that do not depart from the spirit and scope of this creation. Those skilled in this art should understand that the form and details of the embodiment of this creation can be modified and adapted in different ways without departing from the spirit and scope of this creation.

<p>101. . . Interpolator</p><p>102. . . shell</p><p>103. . . BGA connector</p><p>104. . . Substrate</p><p>105. . . contact</p><p>106. . . First ontology</p><p>107. . . Second ontology</p><p>108. . . Third ontology</p><p>109. . . Fourth ontology</p><p>110. . . Ball grid array body</p><p>111. . . Contact pad</p><p>112. . . First surface</p><p>113. . . Second surface</p><p>601. . . Interpolator</p><p>602. . . shell</p><p>603. . . Ball grid array connector</p><p>604. . . Substrate</p><p>605. . . contact</p><p>606. . . First ontology</p><p>607. . . Second ontology</p><p>608. . . Third ontology</p><p>609. . . Fourth ontology</p><p>610. . . Ball grid array body</p><p>611. . . Contact pad</p><p>701. . . Interpolator</p><p>702. . . shell</p><p>703. . . Ball grid array connector</p><p>704. . . Substrate</p><p>706. . . First ontology</p><p>707. . . Second ontology</p><p>708. . . Third ontology</p><p>709. . . Fourth ontology</p><p>710. . . Ball grid array body</p><p>711. . . Contact pad</p><p>712. . . First surface</p><p>713. . . Second surface</p>

For those skilled in this technology, the advantages and uses of this creation will be better understood after referring to the manual and drawings. In the figure: Figure 1 is a side view of the creation of the ball grid array connector; Figure 2 is Figure 1 Figure 3 is a plan view of the creative interposer; Figure 4 is a side view of the creative interposer connected to the ball grid array connector; Figure 5 is the creative figure 4 A three-dimensional view of the interposer; Figure 6 is a side view of another interposer for the ball grid array of the present creation; Figure 7 is a side view of another interposer of the ball grid array for the present creation; and Figure 8 It is a three-dimensional view of the interposer in FIG. 7.