TW555877B

A method of producing high aspect ratio domes by vapor deposition

Abstract

The present invention discloses a device and method for preparing high aspect ratio domes for improving the aerodynamic performance of missiles and airplanes. The device and method of the present invention also provide transmissive domes for infrared sensors used in navigation, locking and guidance systems. The device is used in a chemical vapor deposition furnace to chemically deposit materials on a mandrel to form a dome. The mandrel system of the device is arranged in the deposition chamber so that the gaseous reactant stream will not hit the mandrel. The reactant system diffuses onto the mandrel to form a dome with a high aspect ratio.

TW555877B, drawing sheet 1
Sheet 1 of 3

Term

No projected expiry on record.

  1. Priority
  2. Filed
  3. Granted
  4. Today

30 claims: 21 independent, 9 dependent

  1. 1
    An apparatus for manufacturing a chemical vapor deposition dome, comprising:a vapor deposition chamber having multiple sides, a bottom and a top, the bottom having a reactant port to receive a chemical reactant stream from a reactant source And the top has an exhaust port to remove unreacted reactants, and at least one convex mandrel is joined to one of the sides of the deposition chamber to cause the chemical reaction in the vapor deposition chamber The flow will not impact on the at least one convex mandrel. 1.一種製造化學汽相沉積圓頂之裝置,包括:汽相沉積腔室,具有多個側邊、一個底部及一個頂部,該底部具有反應物埠口以接納來自反應物源的化學反應物流,且該頂部具有排氣口以去除未反應的反應物,至少一根凸心軸接合至該沉積腔室之該多個邊之一者,以使該汽相沉積腔室中之該化學反應物流不會衝擊於該至少一根凸心軸上。
  2. 2
    The device of item 1 of the scope of patent application, wherein the at least one mandrel is oriented to one of the sides of the deposition chamber, so that the axis of the at least one mandrel is operated on the device The period is perpendicular to the reactant stream. 2.如申請專利範圍第1項之裝置,其中該至少一根心軸係定向於該沉積腔室之該多個側邊之一者,以使該至少一根心軸的軸線於該裝置操作期間係垂直於該反應物流。
  3. 3
    The device according to item 1 of the scope of patent application, further comprising an edge ring surrounding the at least one mandrel at the bottom of the mandrel, and the edge ring helps to remove the deposit on the mandrel after chemical deposition Of the dome. 3.如申請專利範圍第1項之裝置,進一步包括邊緣環,該邊緣環包圍該至少一根心軸於該心軸底部,該邊緣環在化學沉積後助於移除沉積於該心軸上之圓頂。
  4. 4
    The device according to item 1 of the scope of patent application, further comprising an isolation jig that supports the at least one mandrel on the one side of the plurality of sides in the deposition chamber to enable the reaction The flow does not impact the mandrel during the operation of the deposition chamber, the isolation clamp is fixed to the side by the deposition chamber coupling mechanism, and the at least one mandrel is fixed to the isolation by the isolation clamp coupling mechanism Fixture. 4.如申請專利範圍第1項之裝置,進一步包括隔離夾具,該隔離夾具支持該至少一根心軸於該沉積腔室中之該多個側邊之該一側邊上,以使該反應物流於該沉積腔室操作期間不會衝擊該心軸,該隔離夾具藉沉積腔室聯結機制而固定於該一側邊,以及該至少一根心軸係藉隔離夾具聯結機制而固定於該隔離夾具。
  5. 5
    The device as claimed in item 4 of the scope of patent application, wherein the isolation clamp coupling mechanism is a bolt, and the bolt connects the mandrel to the isolation clamp. 5.如申請專利範圍第4項之裝置,其中該隔離夾具聯結機制為螺栓,該螺栓係接合該心軸至該隔離夾具。
  6. 6
    The device according to item 4 of the scope of patent application, wherein the deposition chamber coupling mechanism has an arched configuration, so that the isolation fixture places the mandrel in the deposition chamber away from the chemical reactant path. 6.如申請專利範圍第4項之裝置,其中該沉積腔室聯結機制具有拱形構型,以使該隔離夾具將該心軸安置於該沉積腔室內偏離化學反應物路徑。
  7. 8
    7. The device as claimed in item 6 of the scope of patent application, wherein the arch has an arc angle of 30 degrees to 100 degrees. 7.如申請專利範圍第6項之裝置,其中該拱形具有30度至100度的弧角。
  8. 9
    8. The device of item 1 of the scope of patent application, further comprising an isolation clamp to fix the at least one mandrel to the side of the deposition chamber, the isolation clamp including a supporting mechanism adjacent to the bottom of the mandrel, A spindle holder is adjacent to the first point on the spindle flange, the flange surrounds the bottom of the spindle, and the second spindle holder is located on the opposite side of and adjacent to the first spindle holder At the second point of the flange, the first spindle holder is connected to the first end of the bottom plate by a first bottom plate coupling mechanism, and the second spindle holder is connected to the first end of the bottom plate by a second bottom plate coupling mechanism. The second end of the bottom plate, the first mandrel holder is joined to the deposition chamber by the first deposition chamber coupling mechanism at the distal end of the first bottom plate coupling mechanism, and the second mandrel holder is The second deposition chamber connection mechanism at the distal end of the second bottom plate connection mechanism is connected to the deposition chamber to fix the mandrel to the side of the deposition chamber. 8.如申請專利範圍第1項之裝置,進一步包括隔離夾具以固定該至少一根心軸至該沉積腔室的該一側邊,該隔離夾具包括毗鄰於該心軸底部的支持機制,第一心軸夾持器毗鄰於該心軸凸緣上的第一點,該凸緣係圍繞該心軸底部,第二心軸夾持器位於該第一心軸夾持器的對側且毗鄰該凸緣的第二點,該第一心軸夾持器係藉第一底板聯結機制而連結至該底板第一端,該第二心軸夾持器係藉第二底板聯結機制而接合到該底板的第二端,該第一心軸夾持器係藉該第一底板聯結機制遠端的第一沉積腔室聯結機制而接合到該沉積腔室,該第二心軸夾持器係藉該第二底板聯結機制遠端的第二沉積腔室聯結機制而接合到該沉積腔室,俾固定該心軸至該沉積腔室的該一側邊。
  9. 10
    9. The device of item 8 of the scope of patent application, wherein the first and second spindle holders contain first and second spindle holder flanges, and the flanges are connected to their respective spindle holders The holder contacts the first point and the second point of the flange of the mandrel to fix the mandrel to the supporting mechanism. 9.如申請專利範圍第8項之裝置,其中該第一及第二心軸夾持器含有第一及第二心軸夾持器凸緣,該凸緣係接續於其各別心軸夾持器以接觸該心軸凸緣的第一點及第二點,俾固定該心軸於該支持機制。
  10. 11
    10. The device of item 8 of the scope of patent application further includes an edge mechanism fixed to the flange of the first spindle holder and the flange of the second spindle holder, which rests against the flange of the spindle On the periphery, the edge mechanism forms a seam with the deposition material deposited on the mandrel to help remove the deposition dome from the mandrel. 10.如申請專利範圍第8項之裝置,進一步包括固定於該第一心軸夾持器凸緣及第二心軸夾持器凸緣的邊緣機制,其靠置於該心軸凸緣的周邊上,該邊緣機制形成接縫於沉積於該心軸上的沉積材料以助於自心軸移除沈積圓頂。
  11. 12
    11. The device of item 10 in the scope of patent application, wherein the edge mechanism is a ring, and the ring has a supporting bottom that is continuous with the wall surface and ends at the top with edges. 11.如申請專利範圍第10項之裝置,其中該邊緣機制為環,該環有個支持底部與壁面連續且止於具有邊緣的頂部。
  12. 13
    12. The device as claimed in item 11 of the scope of patent application, wherein the edge is a knife-shaped edge with an angle of 30 degrees to 90 degrees. 12.如申請專利範圍第11項之裝置,其中該邊緣係角度為30度至90度之刀狀緣。
  13. 14
    13. The device of item 11 in the scope of patent application, wherein the diameter of the ring is 50 cm to 100 cm. 13.如申請專利範圍第11項之裝置,其中該環直徑為50厘米至100厘米。
  14. 15
    14. For the device of item 11 in the scope of patent application, the wall thickness is in the range of 0.1 mm to 5 mm. 14.如申請專利範圍第11項之裝置,其中該壁厚度係於0.1毫米至5毫米之範圍。
  15. 16
    15. The device of item 11 in the scope of patent application, wherein the edge mechanism is composed of titanium, tantalum, aluminum, stainless steel or platinum. 15.如申請專利範圍第11項之裝置,其中該邊緣機制係由鈦、鉭、鋁、不鏽鋼或鉑構成。
  16. 17
    16. An apparatus for manufacturing a chemical vapor deposition dome, comprising:a vapor deposition chamber having a plurality of sides, a bottom and a top, the bottom having a reactant port to receive a chemical reactant stream from a reactant source , And the top has an exhaust port to remove unreacted reactants, a plurality of convex mandrels are joined to the plurality of sides of the vapor deposition chamber by an isolation clamp, and the isolation clamp arranges the mandrel on the deposition chamber. In the chamber so that the reactant stream does not impinge on the mandrel. 16.一種製造化學汽相沉積圓頂之裝置,包括:汽相沉積腔室,具有多個側邊、一個底部及一個頂部,該底部具有反應物埠口以接納來自反應物源的化學反應物流,且該頂部具有排氣口以去除未反應的反應物,多根凸心軸藉隔離夾具接合至該汽相沉積腔室的該多個側邊,該隔離夾具將該心軸配置於該沉積腔室中以使該反應物流不會衝擊於該心軸上。
  17. 18
    17. The device according to item 16 of the scope of patent application, further comprising a cylindrical casing covering the vapor deposition chamber, the cylindrical casing having a bottom and a top, and the bottom surrounds the reaction with a heating mechanism adjacent to the reactant The material source, and the top of the shell is in fluid communication with the exhaust port of the vapor phase deposition chamber, and the chamber heating mechanism is adjacent to the cylindrical shell to heat the vapor deposition chamber and the multiple cores axis. 17.如申請專利範圍第16項之裝置,進一步包括圓柱形殼體罩住該汽相沉積腔室,該圓柱形殼體具有底部及頂部,該底部環繞帶有毗鄰反應物加熱機制之該反應物源,以及該殼體之頂部係與該汽相沉積腔室之排氣口成流體連通關係,腔室加熱機制毗鄰於該圓柱形殼體以加熱該汽相沉積腔室及該多根心軸。
  18. 19
    18. The device of item 17 in the scope of the patent application, wherein the reactant source includes a distiller for containing molten metal and a gas injection mechanism for providing gaseous reactants and inert gas. 18.如申請專利範圍第17項之裝置,其中該反應物源包括用以容納熔融金屬的蒸餾器以及用以提供氣態反應物及惰性氣體的氣體噴射機制。
  19. 20
    19. A method for preparing a high aspect ratio dome, comprising the following steps:(a) providing at least one convex mandrel in a chemical vapor deposition chamber, so that the at least one convex mandrel is oriented in the deposition chamber , So that the reactant flow and convective air flow in the deposition chamber will not impact on the mandrel, (b) the reactant is generated in a gaseous state from the reactant source, and (c) the gaseous reactant is passed through the deposition chamber And pass the mandrel so that the gaseous reactant stream does not impact on the mandrel;and (d) deposit the gaseous reactant on the at least one mandrel through diffusion to form at least one having an aspect ratio greater than 0.1 Dome. 19.一種製備高縱橫比圓頂之方法,包括下列步驟:(a)提供至少一根凸心軸於化學汽相沉積腔室中,以使該至少一根凸心軸定向於該沉積腔室內,而令該沉積腔室裡的反應物流及對流氣流不會衝擊於該心軸上,(b)由反應物源產生呈氣態的反應物,(c)將該氣態反應物通過該沉積腔室及通過該心軸,以使該氣態反應物流不會衝擊於該心軸上;以及(d)經由擴散來沉積該氣態反應物於該至少一根心軸上以形成至少一個具有縱橫比大於0.1的圓頂。
  20. 26
    25. The method according to item 24 of the scope of patent application, wherein the thickness of the coating is 1500 to 3500 angstroms. 25.如申請專利範圍第24項之方法,其中該塗層之厚度為1500至3500埃。
  21. 28
    27. The method according to item 19 of the scope of patent application, wherein the reactant is at a temperature of 500°C to 1500°C. 27.如申請專利範圍第19項之方法,其中該反應物係於500℃至1500℃之溫度下。
Independent claims21