Contactless ID card and the manufacturing method thereof

Non-contact ID card and its manufacturing method

<p>2. . . Antenna circuit board</p><p>3a, 3b. . . Antenna electrode</p><p>4. . . IC chip</p><p>6. . . antenna</p><p>7. . . Plug-in board</p><p>8. . . Conductive adhesive material</p><p>9, 10. . . Substrate</p><p>11a, 11b. . . Enlarged electrode</p><p>12a, 12b. . . electrode</p><p>14. . . Insulating adhesive material</p><p>15. . . Wafer</p><p>31. . . Hole for chip embedding</p><p>35a, 35b. . . Next material</p>

Fig. 1 is a front view showing the laminated state of the substrates of the non-contact ID card of the present invention.

Figure 2 is a plan view of Figure 1;

Figure 3 is a front view of the plug-in substrate.

Fig. 4 is a plan view of Fig. 3.

Fig. 5 shows a wafer on which IC circuits are formed.

Figure 6 shows the slicing state of the wafer.

Fig. 7 shows the raw materials used to manufacture the interposer substrate, (A) is a plan view, and (B) is a front view.

Fig. 8 shows the state of inserting the IC chip into the chip embedding hole.

Figure 9 is an enlarged view of the main part of the plug-in substrate.

Fig. 10 is a front view showing another substrate laminated state of the non-contact ID card of the present invention.

Fig. 11 shows another example of the interposer substrate.

Figure 12 shows the plug-in. Another example of the substrate.

Fig. 13 shows the state of the squeezed laminated antenna circuit board and the plug-in board.

Fig. 14 shows the structure of a non-contact ID card manufacturing device.

Figure 15 shows the Z-Z arrow view of Figure 14.

Fig. 16 shows the connection state of the conventional non-contact ID card.

Fig. 17 is a plan view of the antenna forming part of Fig. 16;

[Field of Technology]

The invention relates to a non-contact ID (identification information) card and its manufacturing method.

[Background technique]

In the conventional technology, for example, in the way of pasting on the product, many barcodes are printed or pasted on card-shaped paper to obtain distinguishable information. This type of barcode is only printed on paper, so the production efficiency is very high and the price is low. .

On the other hand, IC (Integrated Circuit) chips are different from barcodes in that they not only display information, but also have a large amount of information and the information can be rewritten. In addition, IC wafers must be produced more efficiently to make them cheaper. Therefore, so-called non-contact ID cards or non-contact tags in which an IC chip is mounted on an antenna circuit board are used (hereinafter, these are collectively referred to as non-contact ID cards).

Like the conventional method, non-contact ID cards can read or write a large amount of information at the same time, and have high security, so they have wide applications for ID recognition or electronic checkout. Therefore, if the manufacturing cost can be reduced, its generalization can be greatly promoted.

However, the manufacturing of non-contact ID cards is generally shown in Figure 16, so that an anisotropic conductive film (ACF: Anisotropic Conductive Film) 1 is attached to the antenna electrode 3a, 3b of the antenna circuit board 2 and the IC chip 4 The protruding parts 5a, 5b are precisely adjusted in position, and hot pressing is performed in this state, that is, the two are joined together.

Therefore, high-precision coupler equipment is required, and the manufacturing cost (mainly assembly cost) will become high as a problem. In addition, as the IC chip 4 is further reduced in size and miniaturization and requires higher precision assembly technology, not only the bonder equipment will become more expensive, but also the production efficiency will be reduced. Therefore, it is necessary to prevent manufacturing The increase in cost will be difficult.

In addition, for the antenna electrodes 3a, 3b of the antenna circuit board 2, the protruding portions 5a, 5b of the IC chip 4 are bonded by thermal compression so that the antennas 6 are connected across, but the antenna 6 is composed of, for example, 6 turns, etc. A loop is formed (refer to FIG. 17), and antenna electrodes 3a, 3b are formed at both ends. Therefore, it is necessary to miniaturize the line width of the antenna 6 along with the miniaturization of the IC chip 4. Since a highly accurate antenna formation technology is required, it is also difficult to prevent an increase in manufacturing cost at this point.

The first object of the present invention is to provide a non-contact ID card and its manufacturing method. Even if the IC chip is miniaturized, the position of the electrode of the chip and the antenna electrode of the antenna circuit board can be easily adjusted, and non-contact ID can be prevented. The manufacturing cost of cards (mainly assembly cost) has increased.

In addition, the second object of the present invention is to provide non-contact ID cards and their manufacturing methods, which are used to obtain non-contact ID cards with a laminated structure of an antenna circuit substrate and a plug-in substrate, which can obtain insulation at a specified position and at the same time. Keep the electrode of the IC chip and the antenna electrode of the antenna circuit board in a good electrical connection state (maintain the conduction state).

[Summary of Invention]

The present invention to achieve the above-mentioned object is a non-contact ID card, which is characterized in that it has a structure including: an antenna circuit board on which an antenna is formed; and a plug-in substrate on which an IC chip is embedded. , Forming an enlarged electrode connected to the electrode of the IC chip; laminating the two substrates in such a way that the electrode of the antenna and the enlarged electrode are joined to each other.

According to this method, since the electrodes of the IC chip and the antenna are joined by sandwiching the enlarged electrode, and the two substrates are joined in this way, it will not be affected by the miniaturization of the IC chip. Simply adjust the position between the two electrodes, so that the manufacturing cost (mainly assembly cost) of non-contact ID cards can be prevented from increasing.

In the present invention, the electrode of the antenna and the enlarged electrode are joined, and the conductive adhesive material can also be used to join the antenna electrode and the enlarged electrode, or the base material of the antenna circuit board and the base material of the plug-in board can be used to The antenna electrode and the expansion electrode are directly joined.

In addition, an insulating adhesive material may be arranged between the base material of the antenna circuit board and the base material of the interposer substrate by sealing the antenna forming portion of the antenna circuit board and the electrode forming portion of the IC chip. In addition, the electrodes of the IC chip can also form the lower barrier metal layer.

By filling the insulating adhesive material between the antenna circuit board and the plug-in board, the insulation at the specified position and the bonding between the two boards can be strengthened. In addition, by forming the lower barrier metal layer (UBM layer) on the electrode of the IC chip, it can make The electrode of the IC chip and the antenna electrode of the antenna circuit board are maintained in a good electrical connection state (maintaining a conductive state). In addition, the base material of the plug-in board and the base material of the antenna circuit board may also be composed of a resin film.

On the other hand, the manufacturing method of the non-contact ID card of the present invention is characterized by the following: electrode forming process, forming an enlarged electrode connected to the electrode of the IC chip on the base material of the plug-in substrate in which the IC chip is embedded; In the process of laminating with the substrate, the two substrates are laminated in such a way that the electrode of the antenna formed on the base material of the antenna circuit substrate and the above-mentioned enlarged electrode are joined to each other.

According to this method, the enlarged electrode is formed on the base material of the interposer substrate in which the IC chip is embedded. Since the two substrates are laminated so that the enlarged electrode and the antenna electrode are joined, it is not affected by the miniaturization of the IC chip. As a result, the position between the two electrodes can be adjusted simply. Therefore, the increase in the manufacturing cost (mainly assembly cost) of non-contact ID cards can be prevented.

When an insulating adhesive material is inserted between the two substrates, the insulating adhesive material is attached to the interposer substrate after the electrode formation process by covering the electrode forming part of the IC chip through the adhesive material attachment process , And then stack the two substrates. In addition, the enlarged electrode can be easily formed by the screen printing method.

[Best form for implementing the present invention]

Hereinafter, the present invention will be described in detail with reference to the accompanying drawings.

In the present invention, the antenna circuit board and the plug-in board are laminated to form a non-contact ID card. Its form is as shown in Fig. 1 in front view, and as shown in Fig. 2 in its plan view. In these two figures, the antenna circuit board 2 on the lower side and the plug-in board 7 on the upper side are joined via a conductive adhesive 8 to be in a conductive state.

In addition, the antenna circuit board 2 is formed on a base 9 made of a resin film, and an antenna 6 and a pair of antenna electrodes 3a, 3b connected to the board are formed (see FIG. 17). On the other hand, the interposer substrate 7 has an IC embedded in a base 10 made of a resin film, and enlarged electrodes 11a, 11b are formed to be connected to a pair of electrodes of the IC chip 4.

In addition, the enlarged form of the plug-in substrate 7 is shown in Figures 3 and 4. In these two figures, one of the IC chip 4 counter electrodes 12a, 12b, for example, becomes an aluminum electrode, so that it is connected to the enlarged electrodes 11a, 11b. Lead part 11a ₁ ,11b ₁ . In this way, the plug-in substrate 7 is the substrate 10 on which the IC chip 4 is embedded, and the enlarged electrodes 11a, 11b connected to the electrodes 12a, 12b of the IC chip 4 are formed.

Therefore, when the interposer substrate 7 is stacked on the antenna circuit substrate 2 in a conductive state, the positions of the enlarged electrodes 11a, 11b and the antenna electrodes 3a, 3b can be easily adjusted. In addition, according to this method, the combination of non-contact ID cards can be performed manually. The operator uses an appropriate tool to hold the plug-in substrate 7 for stacking, or the operator directly holds the plug-in substrate 7 for stacking. . Therefore, even if the IC chip is miniaturized, the increase in manufacturing cost (mainly assembly cost) can be prevented.

In addition, the conductive adhesive 8 used to join the antenna circuit substrate 2 and the plug-in substrate 7 in a conductive state can be a paste or tape with adhesiveness or adhesiveness, or an anisotropy or isotropy. . By using adhesives, the plug-in substrate 7 laminated (assembled) on the antenna circuit substrate 2 can be easily removed as needed.

The aforementioned adhesive material 8 is pre-coated or pasted on the antenna electrodes 3a, 3b of the antenna circuit substrate 2 or the enlarged electrodes 11a, 11b of the plug-in substrate 7 before the two substrates are laminated. Generally, the antenna electrodes 3a, 3b of the antenna circuit board 2 are coated or pasted.

In addition, it is preferably used in combination with the coating or pasting of the conductive adhesive 8 to seal the antenna forming portion of the antenna circuit substrate 2 and the electrode forming portion of the IC crystal 4, and the substrate 9 and the substrate 9 of the antenna circuit substrate 2 and The sealing portion 13 between the base material 10 of the plug-in substrate 7 (refer to FIG. 1) is filled with an insulating adhesive material 14. In this way, short circuits can be prevented and the connection between the plug-in substrate 7 and the antenna circuit substrate 2 can be strengthened. Therefore, The enlarged electrodes 11a, 11b and the antenna electrodes 3a, 3b can maintain a good electrical connection state (conduction state).

The insulating adhesive material 14 is also the same as the conductive adhesive material 8, and a paste or tape having adhesiveness or adhesiveness can be used.

In addition, the enlarged electrodes 11a, 11b and the antenna 6 are preferably formed by a printing method (for example, a screen printing method) from the viewpoint of cost reduction. However, other printing methods (for example, offset printing, etc.) may be used as needed, and methods other than printing methods (for example, sputtering, etc.) may also be used for formation.

The conductive adhesive material 8 and the insulating adhesive material 14 are generally thermosetting, but others (such as room temperature curing type) can also be used. In the case of using the former, they are heated and fixed in a designated manufacturing process.

The electrodes 12a, 12b of the IC chip 4 are preferably formed with lower barrier metal layers (hereinafter referred to as UBM layers), which can be used to connect with the enlarged electrodes 11a, 11b.

The above-mentioned IC chip 4 can be manufactured in the manner described below. In Figure 5, first prepare a wafer 15 on which IC circuits for non-contact ID cards are formed, so that the electrodes 12a, 12b (such as aluminum electrodes) of the circuit are exposed, and a weak acid solution is used selectively The glass passivation film 22 (oxide film) is removed by etching.

Secondly, after the activation treatment, for example, immersion in an electroless nickel bath at 90°C for 20 minutes to form a nickel plating layer 17 of approximately 3 μm on the aluminum electrodes 12a, 12b, and then immerse in an electroless gold plating bath at 90°C for 10 minutes , A gold-plated layer 18 of about 0.1 μm is formed on the nickel-plated layer 17.

The nickel-plated layer 17 and the gold-plated layer 18 formed in this way can prevent the deterioration of the aluminum electrodes 12a, 12b, and can reliably connect the aluminum electrodes 12a, 12b to the external terminals. This is used as the UBM layer 19.

Next, using a screen printer, except for the aluminum electrodes 12a, 12b, the solder resist 20 is printed on the entire upper surface of the wafer 15, and then heated and hardened in a heating furnace, for example, to form an insulating layer with a thickness of 20 μm. In addition, heat-curing polyimide inks can also be used instead of solder resist.

Next, using a screen printer, the openings of the aluminum electrodes 12a, 12b (the parts where the resist 20 is not printed) are printed and filled with the conductive paste 21 with dispersed silver particles, and the conductive paste 21 is heated and hardened.

Next, the lower surface 23 of the wafer 15 (the surface where the IC circuit for non-contact ID cards is not formed) is polished, for example, after the thickness is processed to 50 μm, as shown in FIG. 6, the wafer 15 The upper surface (one side of the IC circuit for non-contact ID cards) is attached to the support film 24, and then the diamond knife 25 is rotated to slice the wafer 15 into a specified size (for example, 1.6mm×2.0 mm), the IC chip 4 obtained in this way is removed from the support film 24, and it can be arranged in a bracket made by nickel electroforming.

The IC chip 4 can also be manufactured by using other methods different from the above-mentioned methods. For example, by using these methods, a square aluminum electrode 12a with a size of 1.2mm×1.6mm and a side of 100μm is formed at the diagonal position. , 12b short IC chip 4. In addition, the front end of the diamond knife 25 can also be arranged in a V shape for slicing the wafer 15 to obtain an IC chip 4 with inclined sidewalls.

The plug-in substrate 7 can also be manufactured in the manner described below, for example. First, prepare the raw material 30, which is composed of a wide, wave-like resin film (for example, a polyester alloy film with a thickness of 100μm) as shown in the plan view in FIG. The chip embedding hole 31 becomes a designated pattern.

For example, a nickel-made metal mold formed with a plurality of protrusions similar in shape to the IC chip 4 is heated to 240°C and pressed onto the resin film for 30. After pressing for 10 seconds, the metal mold is rapidly cooled. After cooling to 80°C, the metal mold is opened, and the hole pitch is 10mm in length and width, the opening is 1.2mm×1.6mm, and the depth of 50μm is the wafer embedding hole 31 (see Figure 7(B)).

In addition, the processing method of the wafer embedding hole 31 may also use a laser abrasion method, a plasma etching method, a chemical etching method, and the like. However, it is best to use the pressing method with the best production efficiency.

The raw material 30 is not limited to the above-mentioned non-layered type, and a layered type may also be used. For example, a two-layer structure formed by laminating a first material made of a resin film and two materials made of a resin film or a metal foil can be used. In the case of a material with a two-layer structure, in order to facilitate hole processing, it is preferable to laminate the first material penetrating the wafer embedding hole 31 on the second material.

Next, the IC chip 4 is inserted and fixed in the chip embedding hole 31 of the raw material 30. At this time, as shown in FIG. 8, it is best to use a transfer pin to transfer a very small amount of low-viscosity epoxy resin 32 to the bottom of the chip embedding hole 31, and then insert the IC chip 4.

The IC chip 4 is inserted into the hole 31 for embedding the chip, and the inserted IC chip 4 is temporarily fixed by the resin 32 at the end that is never provided with one of the aluminum electrodes 12a and 12b. Then, the adhesive is filled in the gap between the side surface of the IC chip 4 and the side surface of the chip embedding hole 31 to fix it.

However, it is also possible to insert the IC chip 4 after the adhesive is applied to the bottom and side walls of the hole 31 for embedding the chip. In addition, it is preferable to make the discharge hole penetrate to the bottom of the hole 31 for embedding the wafer, and to vent the air when the adhesive is thermally hardened.

According to the method, the IC chip 4 can be buried in the raw material 30 in a form in which only the aluminum electrodes 12a and 12b are exposed. During this kind of burying, the IC chip 4 can be transported, for example, a nozzle with an outer diameter of 1.5mm and a suction hole of 0.5mm in the center (not shown in the figure) can be used to suck from the arranging bracket. And the IC chip 4 is taken out and inserted into the chip embedding hole 31 of the raw material 30.

In addition, in the case of obtaining the IC chip 4 having the inclined side wall as described above, the insertion of the IC chip 4 into the chip embedding hole 31 can be made easier. In other words, since the surface of the IC chip 4 is protected by an insulating layer, it can be processed in a large amount in the same way as general electronic parts. Among them, the IC chip 4 is supplied to the raw material 30 having a plurality of inclined chip embedding holes 31 formed on the side surface, and the raw material 30 is subjected to ultrasonic vibration, which can be used to insert the IC chip 4 into the chip embedding hole 31. In this case, if the sidewalls are inclined, since the IC chip 4 can be embedded smoothly, the production efficiency of the interposer substrate 7 can be particularly improved.

Next, the enlarged electrodes 11a, 11b connected to the aluminum electrodes 12a, 12b of the IC chip 4 are formed. That is, it is formed on the exposed surfaces of the aluminum electrodes 12a, 12b of the IC chip 4 embedded in the raw material 30, using a screen printer to print, for example, a conductive paste in which about 70% of silver particles are dispersed. This conductive paste is the same as the above-mentioned conductive paste 21 (refer to FIG. 5).

For example, it is possible to form a thickness of about 15 μm, and the lead portion 11a ₁ ,11b ₁ The width is 0.2mm, the size of the enlarged part is 3mm, and the distance between the enlarged part of one side and the enlarged part of the other side is 8mm enlarged electrodes 11a, 11b.

Next, the raw material 30 on which the enlarged electrodes 11a, 11b are formed is punched into a specified size, and the interposer substrate 7 can be obtained. For example, die cut into a size of 10mm. Fig. 9 shows an enlarged part of the interposer substrate 7 obtained in this way. In addition, it can be understood from the above that the base material 10 of the interposer substrate 7 is the same as the raw material 30.

On the other hand, the antenna circuit board 2 can be manufactured in the manner described below. Generally, a raw material of the same material as the above-mentioned raw material 30 is selected (for example, a polyester alloy film with a thickness of 100 μm). For this kind of material, the chip embedding hole 31 may not be provided, and the width may be processed to a specified size.

Use the reel-to-reel method to intermittently transfer this raw material, and print silver paste on the on-line plate, and form the antenna circuit (antenna 6 and antenna electrodes 3a, 3b) at regular intervals.

Then, it is punched into a specified size in the post process, and it can be punched into the unit size of the base material 9 for manufacturing. In addition, the process of punching the base material 9 into a unit size can be performed after assembling (bonding) the plug-in substrate 7 with the enlarged electrodes 11a, 11b formed on the raw material on which the antenna 6 and the antenna electrodes 3a, 3b are formed.

In this way, for example, an antenna 6 with a wiring width of 0.25mm, a pitch of 0.5mm, 6 turns, and an outermost circumference of 75mm×45mm can be formed, and the two ends of the antenna 6 are formed with a size of 3mm and a pitch of 8mm. Antenna electrodes 3a, 3b (refer to Fig. 17).

The base material 9 of the antenna circuit board 2 is not limited to the above-mentioned non-layered type, and a layered type may also be used. For example, a two-layer structure formed by laminating a first material made of a resin film and a second material made of a resin film or metal foil (for example, aluminum foil) can be used.

Then, the interposer substrate 7 is laminated on the obtained antenna circuit substrate 2. At this time, because the expansion electrodes 11a, 11b are formed on the plug-in substrate 7, the expansion electrodes 11a, 11b can be easily positioned on the antenna electrodes 3a, 3b of the antenna circuit substrate 2 by manual work, and the two substrates can overlap at the same time. .

Before performing such lamination, for example, a conductive adhesive 8 is applied to the antenna electrodes 3 a and 3 b, and an insulating adhesive 14 is filled in the sealing portion 13 (see FIG. 1 ). Then, after the lamination, the conductive adhesive 8 and the insulating adhesive 14 are heat-cured, for example, at 90° C. for 5 minutes to fix (join) the two.

The above-mentioned manual lamination can be carried out in the range of lamination accuracy of ±1.0mm to ±1.5mm. In this way, non-contact ID cards can be obtained. The non-contact ID cards are so-called inlets, and proper packaging can be used to sell products in the market.

In the present invention, the interposer substrate 7 and the antenna circuit substrate 2 may be laminated as shown in FIG. 10. In this figure, the form described is that the interposer substrate 7 is bonded to the antenna circuit substrate 2, and the insulating adhesive material 14 and the non-insulating adhesive materials 35a, 35b are pasted on the base material 10 of the interposer substrate 7.

In addition, the insulating adhesive material 14 is composed of an insulating adhesive tape, and the adhesive materials 35a and 35b are composed of a pressure sensitive adhesive tape. These insulating adhesive tapes and pressure-sensitive adhesive tapes are both double-sided tapes.

Therefore, by crimping the base material 9 of the antenna circuit board 2 with the plug-in board 7, the two boards can be easily bonded, and the antenna electrodes 3a, 3b of the antenna circuit board 2 and the plug-in board can be easily bonded. The enlarged electrodes 11a and 11b of the substrate 7 are in direct contact, and the bonding becomes a conductive state.

In the above, the insulating adhesive material 14 and the adhesive materials 35a, 35b are attached to the interposer substrate 7 side, but the insulating adhesive material 14 may be attached to the interposer substrate 7 side, and the adhesive material 35a, 35b is attached to the antenna circuit board 2 side.

In addition, the insulating adhesive material 14 may be attached to the antenna circuit board 2 side, and the adhesive materials 35a and 35b may be attached to the antenna circuit board 2 side. However, it is better to attach both to the side of the interposer substrate 7 so that they can be laminated with a simple operation.

In addition, the insulating adhesive material 14 and the adhesive materials 35a, 35b can also be in paste form, but since the tape-shaped adhesive is easier to apply than the paste-shaped adhesive, it is better to choose the tape-shaped adhesive.

In addition, the adhesive materials 35a, 35b are generally pressure-sensitive, but thermosetting or other materials can also be used. For example, normal temperature curing types can also be used. In the case of using a thermal curing type, the The designated project is heated and fixed. In addition, if necessary, the conductive adhesive 8 may be coated or pasted on the antenna electrode 6 or the enlarged electrodes 11a, 11b.

The plug-in substrate 7 of the present invention is not limited to the one shown in FIG. 9 described above, and it may be provided in other forms.

For example, as shown in FIG. 11, the glass passivation film 22 coated on the part other than the electrode of the wafer 15 is directly used as an insulating layer on the surface of the wafer, and the glass passivation film 22 is embedded as an insulating layer. On the base 10 of the interposer substrate 7 of the IC chip 4, enlarged electrodes 11a, 11b are formed.

In addition, as shown in FIG. 12, the substrate 10 of the interposer substrate 7 embedded with the IC chip 4 with the glass passivation film 22 as the insulating layer may be opened only in the part of the electrodes 12a and 12b. A photosensitive epoxy resin layer 36 is formed, and enlarged electrodes 11a, 11b are formed on the photosensitive epoxy resin layer 36. In addition, the solder resist 20 may be formed instead of the photosensitive epoxy resin layer 36 described above.

After the IC chip 4 is inserted and fixed in the chip embedding hole 31 of the raw material 30, for example, a screen printer is used to print the photosensitive epoxy resin layer 36 or its alternative solder resist 20 to a specified thickness Then, after the enlarged electrodes 11a, 11b are formed on the photosensitive epoxy resin layer 36 or solder resist 20 formed in this way, the raw material 30 is punched into the unit size of the base material 10, which can be used to produce Plug-in substrate 7 of the structure shown.

In addition, the interposer substrate 7 of FIGS. 9 and 12 uses the solder resist 20 or the epoxy resin layer 36 to protect the IC chip 4, so when compared with the interposer substrate 7 of FIG. It responds to the influence of heat and makes it easy to handle.

In addition, when comparing the plug-in substrate 7 of FIG. 9 with that of FIG. 12, the former is likely to generate a step between the upper surface of the substrate 10 (the surface on which the enlarged electrode 11a is formed) and the upper surface of the solder resist 20. The latter will not occur, so the latter is more advantageous when the enlarged electrodes 11a, 11b are formed there.

The printing method can also be formed by other methods. For example, it is also possible to form a metal film on the entire exposed surface (full surface) of the lead electrodes 12a, 12b of the IC chip 4 embedded in the raw material 30 by the aluminum sputtering method. After it is dried, it is exposed and developed to form a resist pattern mask, and then an aluminum etching solution is used to remove the lead in the opening of the mask to form the enlarged electrodes 11a, 11b.

In addition, the enlarged electrodes 11a, 11b and the antenna electrodes 3a, 3b can also be made of other materials as needed, and their shapes, sizes, and thicknesses can be appropriately determined.

In addition, the manufacturing method of the IC chip 4 may also use other methods. For example, use the above-mentioned wafer 15 with IC circuits for non-contact ID cards formed thereon, grind it to a specified thickness (for example, 50μm), apply a photoresist and dry it, and then use a photomask Only the part of the aluminum electrodes 12a, 12b is exposed and developed to remove the photoresist there, so that only the aluminum electrodes 12a, 12b are exposed.

Next, the wafer 15 is subjected to plasma treatment, after removing the oxide film on the surface of the aluminum electrode 12, a sputtering method is used to form a titanium-tungsten layer of a specified thickness (for example, 0.5 μm), and on the titanium-tungsten layer A metal of a specified thickness (for example, 0.05μm) is formed, and the photoresist is finally stripped. The titanium-tungsten layer and the metal are UBM layer 19.

Then, the diamond knife 25 is rotated to slice the wafer 15 into a specified size, and the IC chip 4 obtained in this way is removed from the support film 24.

In addition, the antenna circuit substrate 2 and the interposer substrate 7 are generally laminated from the upper side to the lower antenna circuit substrate 2, but the interposer substrate 7 may be joined to the upper antenna circuit substrate 2 from the lower side. .

At this time, the device for positioning the antenna circuit substrate 2 by the plug-in substrate 7 can be used, for example, to provide an L-shaped mark on the antenna circuit substrate 2 or to provide a guide pin to make the accuracy of lamination or bonding constant.

In addition, as shown in FIG. 13, a pair of upper and lower riveting tools 36a, 36b may be used to press the two substrates 2, 7 of the laminate to strengthen the joint. At the position where the plug-in substrate 7 is adhered to the antenna circuit board 2, apply an insulating adhesive that instantly hardens at room temperature. After the plug-in substrate 7 is pasted there, press the electrodes with riveting tools 36a, 36b, which can be used to assemble Contactless ID card. For example, if the antenna circuit is formed in advance for the bill of goods, etc., the plug-in substrate can be pasted as needed. The size and material of the antenna circuit board used to form the antenna circuit can be arbitrarily selected. In addition, the strip-shaped plug-in substrate can also be wound on a reel, unwinding and cutting the same as the bar code label as required, and used to stick it on the antenna circuit substrate.

In the present invention, as described above, since the electrodes 12a, 12b of the IC chip 4 and the electrodes 3a, 3b of the antenna 6 are joined by sandwiching the enlarged electrodes 11a, 11b, and the two substrates are laminated in this way, there is no Affected by the miniaturization of IC chips, the position between the two electrodes can be adjusted simply. Therefore, non-contact ID cards or non-contact ID cards such as non-contact tags can be manufactured by hand. The device shown in Figure 14 is used for manufacturing.

The manufacturing device is equipped with: antenna circuit board material unwinding machine 40, antenna circuit printer 41, heating furnace 42, plug-in board material unwinding machine 43, press cutting device 44, residual material coiler 45, plug-in type The substrate temporary sticking machine 46, the plug-in substrate transfer device 47, the plug-in substrate real sticking machine 48, the dryer 49, and the product winding machine 50.

In this manufacturing device, the antenna circuit (antenna 6 and electrodes 3a, 3b) is printed on the material 37 sent from the material unwinding machine 40 for the antenna circuit board by the antenna circuit printer 41, and then heated by the heating furnace 42. Used to fix the antenna circuit. In parallel with this, the press cutting device 44 is used to punch the raw material 30 sent from the raw material unwinding machine 43 for the plug-in substrate into the plug-in substrate 7 of a specified size, and the residual raw material coiler 45 is used to roll the punch-cut plug-in substrate. The remaining raw materials after 7 30.

The plug-in substrate 7 punched out from the raw material 30 is held by the plug-in substrate transfer device 47, and is transferred to the next position (stacking position), that is, to the upper side of the antenna circuit formed on the raw material 37. At this time, since the enlarged electrodes 11a, 11b are formed on the plug-in substrate 7, the position of the antenna circuit formed on the material 37 can be adjusted easily.

Then, the IC chip 4 is embedded in the raw material 30 sent from the plug-in substrate raw material unwinding machine 43, the enlarged electrodes 11a, 11b are formed, and the insulating adhesive material 14 and the adhesive material 35a, 35b are pasted (refer to FIG. 10), Then, the adhesive surface is protected by the protective tape 51, the raw material is wound on a reel in the previous process, and it is set in the raw material unwinding machine 40 for insert type substrates. In addition, when the raw material 30 is sent out, the protective tape 51 is wound up and peeled off from the raw material 30. In this way, the adhesive surface (the lower side of FIG. 10) between the insulating adhesive material 14 and the adhesive materials 35a and 35b is exposed.

The one shown in FIG. 15 is the transfer state of the plug-in substrate 7, but in this figure, the plug-in substrate transfer device 47 is provided with a slider 47c with a chuck, which is guided by a rail 47b fixed to the machine table 47a It moves toward the direction of the arrow in the figure; and sucks the belt 47e, sucks and holds the insert substrate 7 punched out from the raw material 30 with the sucker 47d, and transfers it to the slider 47c.

Therefore, when the chuck slider 47c grips the plug-in substrate 7 with the chuck and moves to the position shown by the chain line on the right, the plug-in substrate that moves upward is temporarily attached to the suction head 46a of the machine 46 and moves downward. , Is used to suck and hold the plug-in substrate 7, and secondly, after moving upward, it moves to the upper side of the raw material 37 on the right side. In this way, the interposer substrate 7 can be moved above the antenna circuit formed on the upper surface of the material 37, and then the suction head 46a can be moved downward to perform temporary bonding.

Then, the press cutting device 44 uses the lower metal mold 44a on the fixed side and the upper metal mold 44b on the movable side to punch out the insert substrate 7 from the raw material 30, and move the upper metal mold upward after the punching is completed. In this way, the shaft arm 47f of the suction belt 47e is rotated to move the suction device 47d toward the upper side of the lower metal mold 44a, and then the shaft arm 47f is moved downward.

Therefore, the plug-in substrate 7 punched out from the raw material 30 can be sucked and held by the sucker 47, and then the shaft arm 47 is moved and rotated upward to suck and hold the plug-in substrate 7 The mover 47 moves to the slider 47 with a gripper.

As described above, the suction device 47d and the suction head 46a are in contact with the upper surface of the substrate 10 shown in FIG. And hold, in addition, the above-mentioned chuck with chuck slider 47c holds the left and right ends of the substrate 10 (uncoated or pasted with the adhesive material 35a in FIG. 10) _， The left and right ends of 35b).

In addition, the raw material 30 stops the transfer during the punching or transfer of the interposer substrate 7, and starts the transfer when the period ends. In this way, raw materials are transferred intermittently. On the other hand, the raw material 37 is continuously transferred at a specified speed. In addition, the protrusions of the lower metal mold 44a and the recesses of the upper metal mold 44b are composed of adhesive materials 35a, 35b and insulating adhesive material 14 that are not easily adhered.

Next, the interposer substrate 7 moved above the bonding position is temporarily bonded to the raw material 37 by the interposer substrate temporary bonding machine 4b, that is, the insulating adhesive material 14 and the adhesive materials 35a, 35b are temporarily bonded, and then transferred Go to the position where the plug-in substrate is really stuck to the machine 48, where it is really stuck (real joined) by pressing, etc., and then the insulating adhesive material 14 and the adhesive materials 35a, 35b are thermally cured by the dryer 49, and the product is The coiler 50 takes up.

In addition, in order to increase the manufacturing speed, the press cutting device 44, the plug-in substrate transfer device 47, the plug-in substrate temporary attaching machine 46, and the plug-in substrate real attaching machine 48 can be constructed as a multi-head type.

According to one of the above-mentioned continuous production lines, high-precision couplers are not required, and non-contact ID cards can be manufactured at low prices and at high speed.

[Industrial Utilization Possibility]

According to the present invention described above, an interposer substrate in which an IC chip is embedded and an enlarged electrode formed with an electrode connected to the IC chip is used. Therefore, when the interposer substrate is in a conductive state to the antenna circuit substrate stack, Because the position of the enlarged electrode can be easily adjusted to the antenna electrode of the antenna circuit board, even when the IC chip is miniaturized, it can prevent the increase in the manufacturing cost (mainly assembly cost) of non-contact ID cards .

In addition, the sealing part between the antenna circuit board and the plug-in board is filled with an insulating adhesive material to strengthen the bonding of the two boards. By forming a lower barrier metal layer (UBM) on the electrode of the IC chip, it becomes an antenna. In the laminated structure of the circuit board and the plug-in board, the insulation at the specified position can also be obtained, and at the same time, the electrode of the IC chip and the antenna electrode of the antenna circuit board can be maintained in a good electrical connection state (maintained conduction state).

Symbol description of main components

2. . . Antenna circuit board

3a, 3b. . . Antenna electrode

4. . . IC chip

6. . . antenna

7. . . Plug-in board

8. . . Conductive adhesive material

9, 10. . . Substrate

11a, 11b. . . Enlarged electrode

12a, 12b. . . electrode

14. . . Insulating adhesive material

15. . . Wafer

31. . . Hole for chip embedding

35a, 35b. . . Next material

Schematic description

Fig. 1 is a front view showing the laminated state of the substrates of the non-contact ID card of the present invention.

Figure 2 is a plan view of Figure 1;

Figure 3 is a front view of the plug-in substrate.

Fig. 4 is a plan view of Fig. 3.

Fig. 5 shows a wafer on which IC circuits are formed.

Figure 6 shows the slicing state of the wafer.

Fig. 7 shows the raw materials used to manufacture the interposer substrate, (A) is a plan view, and (B) is a front view.

Fig. 8 shows the state of inserting the IC chip into the chip embedding hole.

Figure 9 is an enlarged view of the main part of the plug-in substrate.

Fig. 10 is a front view showing another substrate laminated state of the non-contact ID card of the present invention.

Fig. 11 shows another example of the interposer substrate.

Figure 12 shows the plug-in. Another example of the substrate.

Fig. 13 shows the state of the squeezed laminated antenna circuit board and the plug-in board.

Fig. 14 shows the structure of a non-contact ID card manufacturing device.

Figure 15 shows the Z-Z arrow view of Figure 14.

Fig. 16 shows the connection state of the conventional non-contact ID card.

Fig. 17 is a plan view of the antenna forming part of Fig. 16;