Cooling unit for cooling a heat generating component and electronic apparatus having the cooling unit
Abstract
An electronic apparatus comprises a housing foraccommodating a heat generating component and a displayunlt supported by the housing. A heat receivlng headthermally connected to the heat generating component isaccommodated inside the houslng. A heat radlator isdlSPoSed in the display unit. A heat receivlng headand the heat radiator are connected to each otherthrough a circulating path for circulating coolingmedium. The circulating path is provided wlth anintermediate cooling unit. Before cooling mediumheated by heat transfer by the heat receiving headreaches the heat radiator, the intermediate coolingunit forces cooling medium to be cooled.
Term
No projected expiry on record.
- Priority
- Filed
- Granted
- Today
20 claims: 15 independent, 5 dependent
- 1一種冷卻單元,用於一電子設備中,該電子設備具有容納一產熱構件的一電腦主體,以及由該電腦主體支撐的一顯示單元,該冷卻單元包含:一熱接收部份,熱連接於該產熱構件,並且被收容在該電腦主體中;一熱交換部份,安裝在該顯示單元上;循環機構,用來在該熱接收部份與該熱交換部份之間循環冷卻介質,該循環機構具有用來將被該熱接收部份加熱的冷卻介質引至該熱交換部份的一管線;及中間冷卻機構,安裝於該管線,該中間冷卻機構強制從該熱接收部份流至該熱交換部份的被加熱的冷卻介質被冷卻。
- 2如申請專利範圍第1項所述的冷卻單元,其中該中間冷卻機構包含具有被加熱的冷卻介質在其內流動的一路徑的一主體,以及用來供應冷卻空氣至該主體的一風扇。
- 3如申請專利範圍第2項所述的冷卻單元,其中該主體包含該冷卻空氣在其內流動的一冷卻空氣路徑,以及暴露在該冷卻空氣路徑上的多個散熱片,該冷卻空氣路徑熱連接於該路徑。
- 4如申請專利範圍第2項所述的冷卻單元,其中該循環機構包含用來強制該冷卻介質在該熱接收部份與該熱交換部份之間循環的一泵,以及用來吸收從該泵排出的該冷卻介質的脈動的一蓄壓器。
- 5如申請專利範圍第4項所述的冷卻單元,其中該泵及該蓄壓器成整體地結合在該主體中。
- 6一種電子設備,包含:一殼體,容納一產熱構件;一顯示單元,由該殼體支撐;一熱接收部份,收容在該殼體中,並且熱連接於該產熱構件;一熱交換部份,安裝在該顯示單元上;循環機構,用來在該熱接收部份與該熱交換部份之間循環冷卻介質,該循環機構被設置遍及該殼體及該顯示單元,並且具有用來將被該熱接收部份加熱的冷卻介質引至該熱交換部份的一管線;及中間冷卻機構,安裝於該循環機構的該管線,該中間冷卻機構強制從該熱接收部份流至該熱交換部份的被加熱的冷卻介質被冷卻。
- 7如申請專利範圍第6項所述的電子設備,其中該顯示單元含有結合顯示面板的一顯示殼體,該熱交換部份具有由該顯示殼體支撐的熱傳導散熱板,並且該散熱板設置有用來引導被加熱的冷卻介質的散熱路徑。
- 8如申請專利範圍第6項所述的電子設備,其中該循環機構包含用來強制該冷卻介質在該熱接收部份與該熱交換部份之間循環的一泵,並且該中間冷卻機構含有具有被加熱的冷卻介質在其內流動的一路徑的一主體,以及用來供應冷卻空氣至該主體的一風扇。
- 9如申請專利範圍第8項所述的電子設備,其中當該電子設備的電源被打開時,該循環機構的該泵被驅動,並且當該產熱構件的溫度達到一預定值時,該風扇被驅動。
- 10如申請專利範圍第9項所述的電子設備,其中當該顯示單元的溫度達到一預定值時,該風扇被驅動。
- 11一種電子設備,包含:一第一殼體,容納一產熱構件;一第二殼體,經由一鉸鏈裝置而可拆卸地軸接在該第一殼體的一後端上,該鉸鏈裝置具有於該第一殼體的寬度方向延伸的一鉸鏈軸,並且該第二殼體具有當該第二殼體旋轉成為從該第一殼體的該後端站立的姿勢時指向該第一殼體的背側的一後表面;一熱接收部份,收容在該第一殼體內部,並且熱連接於該產熱構件;一熱交換部份,安裝在該第二殼體上,該熱交換部份可被取出至該後表面的外部;及循環機構,用來在該熱接收部份與該熱交換部份之間循環冷卻介質,該循環機構包含用來將被該熱接收部份加熱的冷卻介質引至該熱交換部份的一第一管線,以及用來將藉著利用該熱交換部份的熱交換而被冷卻的冷卻介質引至該熱接收部份的一第二管線,該第一及第二管線經由該鉸鏈軸的背側而設置遍及該第一殼體的內部及該第二殼體的內部,該第二殼體的該後表面具有在相應於該第一及第二管線的位置處的至少一開口部份,該開口部份由一可移去蓋件覆蓋。
- 12如申請專利範圍第11項所述的電子設備,其中該第一及第二管線的每一個的經過該鉸鏈軸的後方的至少一部份具有撓性。
- 13如申請專利範圍第11項所述的電子設備,其中該第一及第二管線的在該第一殼體與該第二殼體之間延伸的部份被設置成為於該第一及第二殼體的寬度方向互相間隔分開。
- 14如申請專利範圍第12項所述的電子設備,其中該熱交換部份含有熱傳導散熱板,其具有用來引導被加熱的冷卻介質的一散熱路徑,並且該第二殼體於其一後表面含有一安裝孔,而該散熱板被埋置在該安裝孔中,該安裝孔連續至該開口部份。
- 15如申請專利範圍第14項所述的電子設備,其中該散熱板在與該散熱路徑相反之側的一表面被具有比散熱板低的導熱係數的一保護層覆蓋,並且該保護層經由該安裝孔而暴露於該第二殼體之外。
- 16如申請專利範圍第I4項所述的電子設備,其中該蓋件成整體地設置有用來覆蓋該散熱板的一蓋部份,該蓋部份可拆卸地裝配在該安裝孔中。
- 17如申請專利範圍第11項所述的電子設備,另外包含安裝於該第一管線的中途的中間冷卻機構,該中間冷卻機構強制從該熱接收部份流至該熱交換部份的被加熱的冷卻介質被冷卻。
- 18一種電子設備,包含:一殼體,收容一產熱構件,並且可被向上打開;一顯示單元,由該殼體支撐;一熱接收部份,收容在該殼體內,並且熱連接於該產熱構件;一熱交換部份,安裝在該顯示單元上;及循環機構,用來在該熱接收部份與該熱交換部份之間循環冷卻介質,該循環機構包含用來將被該熱接收部份加熱的冷卻介質引至該熱交換部份的一第一管線,以及用來將藉著利用該熱交換部份的熱交換而被冷卻的冷卻介質引至該熱接收部份的一第二管線,該第一及第二管線被設置遍及該殼體的內部以及該顯示單元的內部,並且在該殼體內部被分成上游部份及下游部份,該上游部份與該下游部份經由一接頭而可拆卸地連接,該接頭具有用來在該第一及第二管線被分成該上游部份及該下游部份時關閉該第一及第二管線的關閉機構。
- 19如申請專利範圍第18項所述的電子設備,其中該顯示單元具有於其寬度方向互相間隔分開地設置的一對腿部,該腿部由該殼體可旋轉地支撐。
- 20如申請專利範圍第19項所述的電子設備,其中該第一及第二管線被放置通過該腿部的至少之一的內部,並且在該腿部的內部互相熱絕緣。
Independent claims20
307 paragraphs, as filed
Cooling unit for cooling heat-generating components and electronic equipment containing the cooling unit
<p>1. . . Portable computer</p><p>2. . . Computer main body</p><p>3. . . Display unit</p><p>4. . . First shell</p><p>4a. . . Bottom wall</p><p>4b. . . Upper wall</p><p>4c. . . Sidewall</p><p>4d. . . Front wall</p><p>4e. . . Back wall</p><p>5. . . Base</p><p>6. . . Top cover</p><p>8. . . Protruding part</p><p>9. . . keyboard</p><p>10a. . . Display support part</p><p>10b. . . Display support part</p><p>11. . . Circuit board</p><p>12. . . Semiconductor packaging</p><p>13. . . Substrate</p><p>14. . . IC chip</p><p>15. . . Soft solder ball</p><p>17. . . Display case</p><p>18. . . LCD panel</p><p>19. . . Opening part</p><p>20. . . Front surface</p><p>twenty one. . . Back surface</p><p>23a. . . Legs</p><p>23b. . . Legs</p><p>twenty four. . . Hinge device</p><p>25. . . First bracket</p><p>26. . . Second bracket</p><p>27. . . Hinge shaft</p><p>28. . . Shaft part</p><p>30. . . Cooling unit</p><p>31. . . Heat receiving head</p><p>32. . . heat sink</p><p>33. . . Cycle path</p><p>34. . . Heat transfer enclosure</p><p>35. . . Guide wall</p><p>36. . . Refrigerant flow path</p><p>37. . . Refrigerant inlet</p><p>38. . . Refrigerant export</p><p>39. . . Screw</p><p>40. . . Heat transfer sheet</p><p>43a. . . The first heat sink</p><p>43b. . . Second heat sink</p><p>44. . . Recessed part</p><p>45. . . Heat dissipation path</p><p>46. . . Refrigerant inlet</p><p>47. . . Refrigerant export</p><p>50. . . First pipeline</p><p>51. . . Second pipeline</p><p>52. . . Expandable telescopic tube</p><p>54. . . Installation port</p><p>55a. . . Assembly detent</p><p>55b. . . Assembly detent</p><p>56. . . Screw</p><p>57. . . The protective layer</p><p>60a. . . Opening part</p><p>60b. . . Opening part</p><p>61. . . Cover</p><p>62. . . Assembly system</p><p>63. . . Screw</p><p>70. . . Intercooling unit</p><p>71. . . main body</p><p>72. . . First recessed part</p><p>73. . . Bottom plate</p><p>74. . . Refrigerant path</p><p>76. . . Pump</p><p>77. . . Pressure accumulator</p><p>78. . . Pressure accumulation chamber</p><p>79. . . Diaphragm</p><p>81. . . Refrigerant export</p><p>83. . . Second recessed part</p><p>84. . . Headboard</p><p>85. . . Cooling air path</p><p>86. . . Cooling air outlet</p><p>87. . . exhaust vent</p><p>88. . . heat sink</p><p>90. . . Electric fan</p><p>91a. . . Temperature sensor</p><p>91b. . . Temperature sensor</p><p>100. . . Connection panel</p><p>110. . . Connection panel</p><p>120. . . Cooling unit</p><p>121a. . . Display support part</p><p>121b. . . Display support part</p><p>122. . . Guide</p><p>123. . . heat sink</p><p>124. . . Cycle path</p><p>125. . . Flat heat sink</p><p>126. . . Curved heat pipe</p><p>127. . . Refrigerant inlet</p><p>128. . . Refrigerant export</p><p>130. . . First pipeline</p><p>130a. . . Upstream part</p><p>130b. . . Downstream</p><p>131. . . Second pipeline</p><p>131a. . . Upstream part</p><p>131b. . . Downstream</p><p>132. . . Pump</p><p>133a. . . Middle part</p><p>133b. . . Middle part</p><p>134. . . Holder</p><p>135a. . . First support tube</p><p>135b. . . Second support tube</p><p>136. . . pillar</p><p>137. . . Thermal insulation gap</p><p>140. . . Connector</p><p>141. . . The first joint part</p><p>142. . . The second joint part</p><p>145. . . Hollow cylindrical body</p><p>146. . . Refrigerant flow path</p><p>147. . . Valve hole</p><p>148. . . Pressure bar</p><p>149. . . Valve body</p><p>150. . . spring</p><p>152. . . Hollow cylindrical body</p><p>153. . . Refrigerant flow path</p><p>154. . . Assembly hole</p><p>155. . . Pressure protrusion</p><p>157. . . Dividing wall</p><p>156. . . Valve hole</p><p>158. . . Valve body</p><p>159. . . spring</p><p>X1. . . Axis</p>
The drawings combined in the specification and becoming a part of the specification show the embodiments of the present invention, and together with the general description given above and the detailed description of the embodiments given below are used to explain the principle of the present invention.
FIG. 1 is a perspective view of a portable computer according to a first embodiment of the invention.
2 is a perspective view of a cover for covering the opening of the display housing according to the first embodiment of the present invention.
3 is a cross-sectional view of a portable computer with a liquid cooling type cooling unit according to the first embodiment of the present invention.
4 is a cross-sectional view of the portable computer, showing the second pipe insertion path when the display unit is rotated to its open position in the first embodiment of the present invention.
5 is a cross-sectional view of the portable computer according to the first embodiment of the present invention, showing the joint structure between the computer main body and the display unit.
6 is a cross-sectional view of the portable computer, showing the second pipe insertion path when the display unit is rotated to its closed position in the first embodiment of the present invention.
FIG. 7 is a cross-sectional view of the portable computer, showing a state in which the cover member is removed from the display housing in the first embodiment of the present invention.
8 is a cross-sectional view showing the positional relationship between the heat receiving head and the semiconductor package in the first embodiment of the present invention.
Fig. 9 is a cross-sectional view of the heat receiving head, showing the internal structure of the heat transfer cover in the first embodiment of the present invention.
Fig. 10 is a cross-sectional view of the heat sink used in the first embodiment of the present invention.
Fig. 11 is a cross-sectional view of the intercooling unit, showing the positional relationship between the refrigerant path and the cooling air path in the first embodiment of the present invention.
Fig. 12 is a flowchart showing the electric fan control system of the first embodiment of the present invention.
FIG. 13 is a cross-sectional view of the portable computer, showing a state in which the heat sink is removed from the display housing in the first embodiment of the present invention.
Fig. 14 is a perspective view of a portable computer according to a second embodiment of the present invention.
15 is a perspective view of a portable computer according to the third embodiment of the present invention.
16 is a cross-sectional view of a portable computer with a liquid cooling type cooling unit according to a fourth embodiment of the present invention.
Fig. 17 is a perspective view of a holder used to maintain a fixed interval between the first pipeline and the second pipeline in the fourth embodiment of the present invention.
18A is a cross-sectional view of the joint, showing the state where the first joint part and the second joint part are joined together in the fourth embodiment of the present invention.
18B is a cross-sectional view of the joint, showing a state where the first joint part and the second joint part are separated from each other in the fourth embodiment of the present invention.
Background of the invention
1. Field of the Invention The present invention relates to a cooling unit for forcing a heat generating member such as a semiconductor package to be cooled by a liquid cooling medium, and an electronic device provided with the cooling unit, such as a portable computer.
2. Description of the related art Electronic equipment such as a portable computer has a micro-processing unit (MPU) for processing multimedia information such as characters, sounds, and animations. With the current increasing processing rate and multi-functions, this MPU tends to increase heat generation during its operation. Therefore, in order to ensure the stable operation of the MPU, the heat dissipation performance of the MPU must be strengthened.
Conventionally, a portable computer carrying an MPU that generates a large amount of heat is equipped with an air cooling type cooling unit for forcing the MPU to be cooled. The cooling unit has a heat sink thermally connected to the MPU, and an electric fan for supplying cooling air to the heat sink.
In this cooling unit, the heat from the MPU is transferred to the heat sink through the flow of cooling air, and then is discharged to the outside of the computer. Therefore, because the cooling air acts as a cooling medium for removing heat from the MPU according to the conventional cooling method, the cooling performance of the MPU mostly depends on the air feeding performance of the electric fan. If the feeding amount of cooling air is increased in order to enhance the cooling performance of the MPU, the rotation amount of the electric fan increases, which may cause a problem of large noise. In addition, because the casing used to combine the MPU and the electric fan in the portable computer is designed to be very thin to become a small body, it is difficult to ensure that there is a large housing with excellent air feeding performance inside the casing. Space for electric fan and ideal air feed path.
In the near future, it is expected that the processing rate of MPUs used in portable computers will be further accelerated, and MPUs will become multifunctional, and with this trend, the heat generation of MPUs will increase dramatically. Therefore, the traditional forced air cooling system has concerns about insufficient cooling capacity of the MPU or reaching its limit.
As for the means to improve this situation, for example, Japanese Patent Application Publication No. 7-142886 discloses a so-called liquid cooling system, which uses a liquid having a higher specific heat than air as a heat transfer medium.
According to this new cooling system, a heat receiving head thermally connected to the MPU is provided inside the casing, and a heat dissipation head is provided inside the display casing supported by this casing. The heat receiving head and the heat dissipating head are connected to each other via a circulation pipe in which a liquid cooling medium flows.
Because according to this cooling system, the cooling medium circulates between the heat receiving head and the heat sink head, the heat from the MPU is transferred to the heat sink head, and then is transferred to the heat sink head via the cooling medium. The heat transferred to the radiating head is discharged to the atmosphere by diffusion through heat conduction to the display case. Therefore, the heat sink is thermally connected to the display case, and the display case is composed of a metal material having excellent thermal conductivity.
Therefore, compared with the traditional forced air cooling system, this liquid cooling system can transfer the heat of the MPU more effectively, thereby improving the cooling performance of the MPU.
At the same time, the heat transferred from the heat sink to the MPU of the display housing is discharged from the surface of the display housing to the atmosphere through natural convection and thermal radiation. Therefore, when the heat transferred to the display case increases, the surface temperature of the display case increases. As a result, if the user touches the surface of the display case when opening/closing the display case or carrying the computer, he may feel uncomfortable or hot.
In addition, according to the liquid cooling system, the heat dissipation head inside the display casing is connected to the heat receiving head inside the casing via a circulation pipe. Therefore, if the display housing must be removed from the housing to perform maintenance on the inside of the display housing, the heat receiving head thermally connected to the MPU must be temporarily removed from the housing. However, the removal of the periphery of this precision MPU Not only will the MPU be damaged, but also the positional relationship between the heat-receiving head and the MPU will be improper when the heat-receiving head is installed. Therefore, this is quite undesirable in terms of the maintenance reliability of the thermal connection between the MPU and the thermal receiving head.
If the MPU is installed in a difficult-to-access location, such as the back surface of a circuit board, do not have to carry out the troublesome work of disassembling the casing and taking out the circuit board. From the viewpoint of operational efficiency, this work can be regarded as very inappropriate, so there is still room for improvement on this point.
Summary of Invention
The first object of the present invention is to provide a cooling unit and an electronic device that can prevent the surface temperature of the display unit from increasing.
The second object of the present invention is to provide an electronic device that allows the second housing to be removed from the first housing without releasing the thermal connection between the heat receiving portion and the heat generating member, and which can be easily removed It is disassembled/reassembled and the reliability of heat conduction is desirably maintained.
In order to achieve the above-mentioned first object, according to the first aspect of the present invention, a cooling unit is provided for use in an electronic device. The electronic device has a computer body that houses a heat-generating structure and a computer body supported A display unit, the cooling unit includes a heat receiving part, thermally connected to the heat generating member, and is housed in the computer main body; a heat exchange part installed on the display unit; a circulation mechanism for A cooling medium is circulated between the heat receiving part and the heat exchange part, and the circulation mechanism has a pipeline for guiding the cooling medium heated by the heat receiving part to the heat exchange part; and an intermediate cooling mechanism, Installed in the pipeline, the intermediate cooling mechanism forces the heated cooling medium flowing from the heat receiving part to the heat exchange part to be cooled.
In addition, in order to achieve the above-mentioned first object, according to a second aspect of the present invention, an electronic device is provided, which includes a housing for accommodating a heat generating member; a display unit supported by the housing; and a heat receiving part, Housed in the casing and thermally connected to the heat generating member; a heat exchange part installed on the display unit; a circulation mechanism for circulating cooling between the heat receiving part and the heat exchange part Medium, the circulation mechanism is provided throughout the casing and the display unit, and has a pipeline for guiding the cooling medium heated by the heat receiving part to the heat exchange part; and an intermediate cooling mechanism installed in the The pipeline of the circulation mechanism, and the intermediate cooling mechanism forces the heated cooling medium flowing from the heat receiving part to the heat exchange part to be cooled.
With this structure, the heat from the heat generating member is transferred to the cooling medium through the heat receiving part. This heat is transferred to the heat exchange part through the flow of the cooling medium. The cooling medium cooled by the heat exchange using the heat exchange part returns to the heat receiving part, and receives heat from the heat generating member again. By repeating this cycle, the heat from the heat generating member is effectively transferred to the display unit and discharged to the atmosphere.
The cooling medium heated by the heat conduction from the heat receiving part is cooled by the intermediate cooling mechanism before it reaches the heat exchange part. In this way, the temperature of the cooling medium guided by the heat exchange part can be lowered. In this way, even if the heat from the heat generating member is discharged from the display unit, the surface temperature of the display unit can be suppressed, so that the adverse effect on the user who uses the electronic device can be reduced to a level without any problems.
In order to achieve the above-mentioned second object, according to a third aspect of the present invention, an electronic device is provided, which includes a first housing for accommodating a heat-generating member; On a rear end of the first housing, the hinge device has a hinge shaft extending in the width direction of the first housing, and the second housing has a function that when the second housing rotates, it becomes free from the first housing The rear end of the body points to a rear surface of the back side of the first housing when the posture of the body is standing; a heat receiving part is housed in the first housing and is thermally connected to the heat generating member; a heat exchange Part, mounted on the second housing, the heat exchange part can be taken out to the outside of the rear surface; and a circulation mechanism for circulating a cooling medium between the heat receiving part and the heat exchange part The circulation mechanism includes a first pipeline for guiding the cooling medium heated by the heat receiving part to the heat exchanging part, and a first pipeline for cooling by heat exchange by the heat exchanging part The cooling medium is led to a second pipeline of the heat receiving part. The first and second pipelines are arranged throughout the interior of the first housing and the interior of the second housing through the back side of the hinge shaft. The rear surface of the second shell has at least one opening at a position corresponding to the first and second pipelines, and the opening is covered by a removable cover.
With this structure, the heat from the heat generating member is transferred to the cooling medium through the heat receiving part. This heat is transferred to the heat exchange part through the cooling medium flowing through the first pipeline. The cooling medium cooled by the heat exchange by the heat exchange part returns to the heat receiving part through the second pipeline, and receives heat from the heat generating member again. By repeating this cycle, the heat from the heat-generating member is effectively transferred to the second housing and discharged to the atmosphere.
To remove the second housing from the first housing, first, the cover member covering the opening of the second housing is removed to expose the first and The second pipeline. Subsequently, the heat exchange part is taken out in the direction of the rear surface of the second housing, and the first and second pipelines of the heat exchange part are taken out to the outside of the opening part. Therefore, when the first and second pipelines are connected under the heat exchange part, the heat exchange part can be taken out of the second housing. Finally, the hinge device is removed from the first housing, thereby separating the second housing from the first housing.
In order to mount the second housing on the first housing, the second housing is mounted on the first housing via a hinge device. Then, the heat exchange part is installed on the second housing in the direction of the rear surface of the second housing. Secondly, the first and second pipelines that continue to the heat exchange part are inserted into the second housing through the opening, and then the opening is covered by the cover. As a result, the first housing and the second housing are connected to each other <sub>,</sub> And complete the installation of the heat exchange part on the second shell.
Therefore, when the second housing is removed from the first housing, it is not necessary to release the thermal connection between the heat receiving part and the heat generating member. In this way, the troublesome work of disassembling or reassembling the parts corresponding to the heat-generating member and the heat-receiving part is not required, thereby facilitating the removal of the second housing. In addition, no unreasonable force is applied to the heat-generating member, and the positional relationship between the heat-generating member and the heat receiving part does not change, so the reliability of the thermal connection between the two can be maintained.
In order to achieve the above-mentioned second object, according to a fourth aspect of the present invention, an electronic device is provided, which includes a housing for accommodating a heat-generating member and capable of being opened upward; a display unit supported by the housing; The receiving part is housed in the casing and is thermally connected to the heat generating member; a heat exchange part is installed on the display unit; and a circulation mechanism is used to connect the heat receiving part and the heat exchange part The cooling medium is circulated between the circulation mechanism, and the circulation mechanism includes a first pipeline for guiding the cooling medium heated by the heat receiving part to the heat exchanging part, and for transferring the heat by using the heat exchanging part. The exchanged and cooled cooling medium is led to a second pipeline of the heat receiving part. The first and second pipelines are arranged throughout the inside of the casing and the inside of the display unit, and are passed inside the casing. Divided into an upstream part and a downstream part. The upstream part and the downstream part are detachably connected via a joint. The joint is used to divide the first and second pipelines into the upstream part and the downstream part. Close the closing mechanism of the first and second pipelines at the same time.
With this structure, the heat from the heat generating member is transferred to the cooling medium through the heat receiving part. This heat is transferred to the heat exchange part through the cooling medium flowing through the first pipeline. The cooling medium cooled by the heat exchange using the heat exchange part returns to the heat receiving part through the second pipeline, and receives heat from the heat generating member again. By repeating this cycle, the heat from the heat-generating member is effectively transferred to the second housing and discharged to the atmosphere.
In order to remove the second housing from the first housing, the first housing is opened upward to expose the first and second pipelines leading to the inside of the first housing. Secondly, the first and second pipelines extending throughout the heat receiving part and the heat exchanging part are divided inside the first housing. Therefore, when the second housing with the heat exchange part is removed from the first housing, the first and second pipelines will not form any obstacles, and the thermal connection between the heat receiving part and the heat generating member is not necessary released. As a result, there is no need for troublesome work of disassembling/reassembling parts corresponding to the heat generating member and the heat receiving part, thereby facilitating the removal of the second housing. In addition, no unreasonable force is applied to the heat-generating member, and the positional relationship between the heat-generating member and the heat receiving part does not change, so the reliability of the thermal connection between the two can be maintained.
In addition, if the upstream and downstream parts of the first and second pipelines are separated from each other, the first and second pipelines are automatically closed. Therefore, no cooling medium will leak from the first and second pipelines, and no special work for sealing the first and second pipelines is required.
Other objects and advantages of the present invention will be presented in the following description, and some of them will be obvious from the description, or they can be learned by implementing the present invention. The purpose and advantages of the present invention can be realized and achieved by the following specifically indicated equipment and combinations of incoming calls.
Schematic description
The drawings combined in the specification and becoming a part of the specification show the embodiments of the present invention, and together with the general description given above and the detailed description of the embodiments given below are used to explain the principle of the present invention.
FIG. 1 is a perspective view of a portable computer according to a first embodiment of the invention.
2 is a perspective view of a cover for covering the opening of the display housing according to the first embodiment of the present invention.
3 is a cross-sectional view of a portable computer with a liquid cooling type cooling unit according to the first embodiment of the present invention.
4 is a cross-sectional view of the portable computer, showing the second pipe insertion path when the display unit is rotated to its open position in the first embodiment of the present invention.
5 is a cross-sectional view of the portable computer according to the first embodiment of the present invention, showing the joint structure between the computer main body and the display unit.
6 is a cross-sectional view of the portable computer, showing the second pipe insertion path when the display unit is rotated to its closed position in the first embodiment of the present invention.
FIG. 7 is a cross-sectional view of the portable computer, showing a state in which the cover member is removed from the display housing in the first embodiment of the present invention.
8 is a cross-sectional view showing the positional relationship between the heat receiving head and the semiconductor package in the first embodiment of the present invention.
Fig. 9 is a cross-sectional view of the heat receiving head, showing the internal structure of the heat transfer cover in the first embodiment of the present invention.
Fig. 10 is a cross-sectional view of the heat sink used in the first embodiment of the present invention.
Fig. 11 is a cross-sectional view of the intercooling unit, showing the positional relationship between the refrigerant path and the cooling air path in the first embodiment of the present invention.
Fig. 12 is a flowchart showing the electric fan control system of the first embodiment of the present invention.
FIG. 13 is a cross-sectional view of the portable computer, showing a state in which the heat sink is removed from the display housing in the first embodiment of the present invention.
Fig. 14 is a perspective view of a portable computer according to a second embodiment of the present invention.
15 is a perspective view of a portable computer according to the third embodiment of the present invention.
16 is a cross-sectional view of a portable computer with a liquid cooling type cooling unit according to a fourth embodiment of the present invention.
Fig. 17 is a perspective view of a holder used to maintain a fixed interval between the first pipeline and the second pipeline in the fourth embodiment of the present invention.
18A is a cross-sectional view of the joint, showing the state where the first joint part and the second joint part are joined together in the fourth embodiment of the present invention.
18B is a cross-sectional view of the joint, showing a state where the first joint part and the second joint part are separated from each other in the fourth embodiment of the present invention.
Symbol description of main components
1. . . Portable computer
2. . . Computer main body
3. . . Display unit
4. . . First shell
4a. . . Bottom wall
4b. . . Upper wall
4c. . . Sidewall
4d. . . Front wall
4e. . . Back wall
5. . . Base
6. . . Top cover
8. . . Protruding part
9. . . keyboard
10a. . . Display support part
10b. . . Display support part
11. . . Circuit board
12. . . Semiconductor packaging
13. . . Substrate
14. . . IC chip
15. . . Soft solder ball
17. . . Display case
18. . . LCD panel
19. . . Opening part
20. . . Front surface
twenty one. . . Back surface
23a. . . Legs
23b. . . Legs
twenty four. . . Hinge device
25. . . First bracket
26. . . Second bracket
27. . . Hinge shaft
28. . . Shaft part
30. . . Cooling unit
31. . . Heat receiving head
32. . . heat sink
33. . . Cycle path
34. . . Heat transfer enclosure
35. . . Guide wall
36. . . Refrigerant flow path
37. . . Refrigerant inlet
38. . . Refrigerant export
39. . . Screw
40. . . Heat transfer sheet
43a. . . The first heat sink
43b. . . Second heat sink
44. . . Recessed part
45. . . Heat dissipation path
46. . . Refrigerant inlet
47. . . Refrigerant export
50. . . First pipeline
51. . . Second pipeline
52. . . Expandable telescopic tube
54. . . Installation port
55a. . . Assembly detent
55b. . . Assembly detent
56. . . Screw
57. . . The protective layer
60a. . . Opening part
60b. . . Opening part
61. . . Cover
62. . . Assembly system
63. . . Screw
70. . . Intercooling unit
71. . . main body
72. . . First recessed part
73. . . Bottom plate
74. . . Refrigerant path
76. . . Pump
77. . . Pressure accumulator
78. . . Pressure accumulation chamber
79. . . Diaphragm
81. . . Refrigerant export
83. . . Second recessed part
84. . . Headboard
85. . . Cooling air path
86. . . Cooling air outlet
87. . . exhaust vent
88. . . heat sink
90. . . Electric fan
91a. . . Temperature sensor
91b. . . Temperature sensor
100. . . Connection panel
110. . . Connection panel
120. . . Cooling unit
121a. . . Display support part
121b. . . Display support part
122. . . Guide
123. . . heat sink
124. . . Cycle path
125. . . Flat heat sink
126. . . Curved heat pipe
127. . . Refrigerant inlet
128. . . Refrigerant export
130. . . First pipeline
130a. . . Upstream part
130b. . . Downstream
131. . . Second pipeline
131a. . . Upstream part
131b. . . Downstream
132. . . Pump
133a. . . Middle part
133b. . . Middle part
134. . . Holder
135a. . . First support tube
135b. . . Second support tube
136. . . pillar
137. . . Thermal insulation gap
140. . . Connector
141. . . The first joint part
142. . . The second joint part
145. . . Hollow cylindrical body
146. . . Refrigerant flow path
147. . . Valve hole
148. . . Pressure bar
149. . . Valve body
150. . . spring
152. . . Hollow cylindrical body
153. . . Refrigerant flow path
154. . . Assembly hole
155. . . Pressure protrusion
157. . . Dividing wall
156. . . Valve hole
158. . . Valve body
159. . . spring
X1. . . Axis
Detailed description of the invention
Hereinafter, the first embodiment of the present invention applied to a portable computer will be described with reference to FIGS. 1 to 13.
Figures 1 and 3 show the portable computer 1 which becomes the electronic device described in this specification. The portable computer 1 includes a computer main body 2 and a display unit 3 supported by the computer main body 2.
The computer main body 2 has a first housing 4 made of synthetic resin. The first housing 4 is a flat box including a bottom wall 4a, an upper wall 4b, a right/left side wall 4c, a front wall 4d, and a rear and 4e. The first housing 4 is made up of a base 5 with a bottom wall 4a and a top cover 6 with an upper wall 4b. The top cover 6 is detachably installed on the base 5. In this way, by removing the top cover 5 from the base 6, the first housing 4 opens upward.
A hollow protruding portion 8 protruding upward is formed at the rear end portion of the upper wall 4 b of the first housing 4. The protruding portion 8 extends in the width direction of the first housing 4 behind the keyboard 9. The protruding portion 8 has display supporting portions 10a and 10b on both ends thereof. The display supporting parts 10 and 10 are constructed in the form of recesses that continuously open to the front side, the upper side, and the back side of the protruding part 8. The bottom of each of the display supporting parts 10a and 10b is located on the lower side of the upper wall 4b, as shown in FIG. 4.
As shown in FIGS. 3 and 4, the circuit board 11 is housed in the inside of the first housing 4. The circuit board 11 is arranged parallel to the bottom wall 4 a of the first housing 4. The semiconductor package 12 is mounted on the left end portion of the top surface of the circuit board 11 as a heat generating member.
The semiconductor package 12 includes a micro processing unit (MPU), which functions as the center of the portable computer 1. As shown in FIG. 8, the semiconductor package 12 includes a rectangular substrate 13 and an IC chip 14 soldered on the top surface of the substrate 13. The substrate 13 is soldered to the top surface of the circuit board 11 via a plurality of solder balls 15. In such a semiconductor package 12, the power consumption during its operation has been increased with the current enhanced processing rate and multi-functions, so that the heat generated from the IC chip has been so great that the chip must be cooled.
As shown in FIGS. 1 and 3, the display unit 3 includes a display housing 17 serving as a second housing, and a liquid crystal display panel 18 housed in the display housing 17. The display housing 17 is made of, for example, a synthetic resin material, and is constructed in the form of a flat box body, and has a front surface 20 formed with an opening portion 19 and a rear surface 21 opposite to the front surface 20. The liquid crystal display panel 18 has a display screen (end display) for displaying information such as characters and images. The display screen is exposed outside the display housing 17 through the opening portion 19.
The display housing 17 has a pair of legs 23a and 23b protruding from the end portions thereof. The legs 23a and 23b are hollow, and are spaced apart from each other in the width direction of the display housing 17. The leg portions 23a and 23 are 9 to the display supporting portions 10a and 10b of the first housing 4.
The right leg 23a is supported by the first housing 4 via the hinge device 24. The hinge device 24 includes a first bracket 25, a second bracket 26, and a hinge shaft 27. As shown in FIG. 5, the first bracket 25 is screwed to the top ends of a plurality of sleeve portions 28 extending upward from the bottom wall a. The rear end portion of the first bracket 25 is led to the inside of the protruding portion 8 on the right side of the display supporting portion 10a. As shown in FIG. 4, the second bracket 26 is screwed to the inner surface at the right end of the front surface 20 of the display housing 17. The end portion of the second bracket 26 is led to the inside of the right leg 23a. The chain shaft 27 stretches between the rear end portion of the first bracket 25 and the end portion of the second bracket 26 so that it passes through a side surface of the leg portion 23a and a side surface of the display support portion 10a. Therefore, the chain shaft 27 is horizontally arranged along the width direction of the first housing 4 and the display housing 17.
One end portion of the hinge shaft 27 is rotatably connected with the rear end portion of the first bracket 25. The other end portion of the hinge shaft 27 is fixed to the end portion of the second bracket 26. A friction type brake mechanism (not shown) using, for example, a corrugated washer is built in the joint portion between the chain shaft 27 and the first bracket 25. This braking mechanism restricts the free rotation of the hinge shaft 27.
In this way, the display unit 3 can rotate about the hinge shaft 27. In more detail, the display unit 3 is rotatably supported on the first housing 4 relative to the hinge shaft 27, and can be rotated from the display unit downward to the closed position of the cover keyboard 9 until it rises to expose the keyboard 9 and Shows the open position of the screen. When the display unit 3 rotates to the open position, the rear surface 21 of the display housing 17 points to the rear side of the portable computer 1.
As shown in FIG. 3, the portable computer 1 incorporates a liquid cooling type cooling unit 30 for forcing the semiconductor package 12 to be cooled. The cooling unit 30 includes a heat receiving head 31 as a heat receiving part, a radiator 32 as a heat exchange part, and a circulation path 33 as a circulation mechanism.
As shown in FIGS. 8 and 9, the heat receiving head 31 is housed in the first housing 4. This heat receiving head 31 has a heat transfer cover 34. The heat transfer cover 34 is made of a metal material having excellent thermal conductivity, such as an aluminum alloy. This heat transfer cover 34 is constructed in the form of a flat box having a larger plane than the semiconductor package 12.
The heat transfer cover 34 contains a plurality of guide walls 35 inside. The guide walls 35 are arranged in parallel with each other with a gap between each two, so that the inside of the heat transfer cover 34 is divided into a plurality of refrigerant flow paths 36. The heat transfer cover 34 has a refrigerant inlet 37 and a refrigerant outlet 38. The refrigerant inlet 37 is located at the upstream end of the refrigerant flow path 36. The refrigerant outlet 38 is located at the downstream end of the refrigerant flow path 36.
The heat transfer cover 34 is supported on the top surface of the circuit board 11 with screws 39 through its four corners. The heat transfer enclosure 34 traverses the semiconductor package 12 and is opposite to the circuit board 11. The heat transfer sheet 40 is provided between the center portion on the bottom surface of the heat transfer cover 34 and the IC chip 14 of the semiconductor package 12. The heat transfer cover 34 is pressed against the IC chip 14 via the leaf spring 41 so that the heat transfer sheet 40 is sandwiched between the heat transfer cover 34 and the IC chip 14. In this way, the heat transfer cover 34 is in thermal contact with the IC chip 14 via the heat transfer sheet 40.
As shown in FIGS. 3 and 4, the heat sink 32 is housed in the inside of the display case 17. The heat sink 32 has first and second heat dissipation plates 43a and 43b. The first and second heat dissipation plates 43a and 43b are made of a metal material having excellent thermal conductivity, such as aluminum alloy, and have approximately the same size as the liquid crystal display panel 18.
As shown in FIG. 10, the first heat dissipation plate 43a and the second heat dissipation plate 43b overlap each other. The second heat dissipation plate 43b has a recessed portion 44 which opens on the surface mated with the first heat dissipation plate 43a. The concave portion 44 is formed zigzag on the entire surface of the second heat dissipation plate 43b. The concave portion 44 and the surface mated with the first heat dissipation plate 43a form a heat dissipation path 45 together. The heat dissipation path 45 has a refrigerant inlet 46 and a refrigerant outlet 47. The refrigerant inlet 46 opens in the left leg 23b inside the display housing 17. The refrigerant outlet 47 opens in the right leg 23a inside the display housing 17. In this way, the refrigerant inlet 46 and the refrigerant outlet 47 are spaced apart from each other in the width direction of the display housing 17.
The above-mentioned circulation path 33 has a first pipeline 50 and a second pipeline 51. The first and second pipelines 50 and 51 are made of metal pipes such as stainless steel.
The first pipeline 50 connects the refrigerant outlet 38 of the heat receiving head 31 to the refrigerant inlet 46 of the radiator 32. The first pipeline 50 extends toward the display support portion 10 b on the left side of the first housing 4. After the front end of the first pipeline portion 50 passes through the front surface of the display support portion 10b on the left side and the front surface of the leg portion 23b, it is led into the display housing 17.
The second pipeline 51 connects the refrigerant inlet 37 of the heat receiving head 31 to the refrigerant outlet 47 of the radiator 32. After the second pipeline 51 is led to the right side along the front wall 4d inside the first housing 4, it extends toward the display support portion 10a on the right side. After the front end of the second pipeline 51 passes through the front surface of the display support portion 10a on the right side and the front surface of the leg portion 23a, it is led to the leg portion 23b and then into the display housing 17.
Therefore, the refrigerant flow path 36 of the heat receiving head 31 is connected to the heat dissipation path 45 of the radiator 32 via the first and second pipelines 50 and 51. The refrigerant flow path 36, the heat dissipation path 45, and the first/second lines 50 and 51 are filled with a liquid cooling medium, such as water or fluorocarbon.
As shown in FIGS. 3 and 5, the portions of the first and second pipelines 50 and 51 that pass through the legs 23a and 23b of the display housing 17 are constituted by flexible expandable telescopic tubes 52. The telescopic tube 52 is bent into a circular form around the hinge shaft 27 and is arranged behind the hinge shaft 27.
In this way, the telescopic tubes 52 of the first and second pipelines 50 and 51 can be freely deformed in the direction around the hinge axis 27. Therefore, the first and second pipelines 50 and 51 are smoothly deformed following the rotation of the display unit 3 from its closed position to its open position to absorb the stress applied to the first and second pipelines 50 and 51 when the display unit 3 rotates. curve.
As shown in FIG. 1, the display housing 17 has an installation port 54 opening in the rear surface 21 thereof. The installation port 54 is located at the rear of the liquid crystal display panel 18 and has a size matching the heat sink 32. The first heat dissipation plate 43a of the heat sink 32 has a lower edge portion adjacent to the legs 23 and 23b of the display housing 17, and an upper edge portion located on the opposite side of the lower edge portion. A pair of assembly pawls 55a and 55 are formed on the upper edge portion of the first heat dissipation plate 43a. These assembly pawls 55 and 55b are spaced apart from each other in the width direction of the display housing 17.
The heat sink 32 is fitted to the mounting opening 54 from the rear surface 21 of the display housing 17. Therefore, the assembly pawls 55 and 55b of the radiator 32 are detachably hooked on the opening edge portion of the installation opening 54. In addition, the first and second heat dissipation plates 43a and 43b are fixed to the inner surface of the display housing 17 with screws 56 through two positions on the lower edge portion. As such, the heat sink 32 is held so that it is in contact with the inner surface of the display housing 17 so that it is thermally connected to the display housing 17.
As shown in FIG. 4, the surface of the first heat dissipation plate 43 of the heat sink 32 opposite to the second heat dissipation plate 43 b is covered by a protective layer 57. The protective layer 57 is made of synthetic resin having a lower thermal conductivity than the first and second heat dissipation plates 43a and 43b. When the heat sink 32 is fixed to the display housing 17, the protective layer 57 is exposed to the outside of the display housing 17 through the installation opening 54 and is located on the same plane as the rear surface 21 of the display housing 17.
As shown in FIG. 1, the rear surface 21 of the display housing 17 has a pair of opening portions 60a and 60b at positions corresponding to the legs 23 and 23b. The opening portions 60 and 60b are opposite to the telescopic tubes 52 of the first and second pipelines 50 and 51. The ends of the opening parts 60 a and 60 b reach the front ends of the legs 23 and 23, and the other ends of the opening parts 60 a and 60 b are continuous to the installation opening 54. In this way, the opening portions 60a and 60b are large enough to take out the telescopic tube 52.
The opening portions 60 and 60b are covered by a removable cover 61 made of synthetic resin. The cover 61 is assembled to the opening portions 60a and 60b so that the assembling pawl 62 at each end is hooked on the aforementioned heat sink 32. The other end of the cover 61 is fixed to the tips of the legs 23a and 23b via screws 63.
Thus, if the engagement between the assembly pawl 62 and the heat sink 32 is released by removing the screw 63, as shown in FIG. 7, the cover 61 can be removed from the display housing 17, thereby opening the opening portion 60a and 60b. As a result, the telescopic tube 52 inserted into the inside of the leg portions 23 and 23b is exposed toward the rear surface 21 of the display housing 17 through the opening portions 60 and 60b.
As shown in FIGS. 3 and 11, the above-mentioned cooling unit 30 is equipped with an intermediate cooling unit 70 as an intermediate cooling mechanism. The intermediate cooling unit 70 is located in the middle of the first pipeline 50 and is housed in the first housing 4. The intermediate cooling unit 70 includes a main body 71 and an electric fan 90.
The main body 71 is made of a metal material having excellent thermal conductivity, such as aluminum alloy, and is screwed to the top surface on the left end portion of the circuit board 11. The main body 71 has a first concave portion 72 that opens downward. The opening end of the first concave portion 72 is sealed by the bottom plate 73. The bottom plate 73 cooperates with the first concave portion 72 to form a refrigerant path 74, and the refrigerant path 74 extends in the depth direction of the first housing 4.
The pump 76 and the accumulator 77 are integrally built in the main body 71 of the intercooling unit 70. The suction end of the pump 76 is continuously connected to the refrigerant outlet 38 of the heat receiving head 31 through the upstream portion of the first pipeline 50. The discharge end of the pump 76 continues to the refrigerant path 74 via the accumulator 77. The pump 76 is driven while the power of the portable computer 1 is turned on, and then pressurizes the cooling medium and supplies it to the accumulator 77.
As shown in FIG. 11, the accumulator 77 has a pressure accumulation chamber 78 for accumulating the cooling medium discharged from the pump 76. The pressure accumulation chamber 78 is formed on the side portion of the main body 71. A part of the peripheral wall of the pressure accumulation chamber 78 is composed of a diaphragm 79 that is elastically deformable. If the cooling medium discharged from the pump 76 is supplied to the pressure accumulation chamber 78, the diaphragm 79 is elastically deformed corresponding to the discharge pressure of the cooling medium, so that the capacity of the pressure accumulation chamber 78 is changed. As a result, the pulsation of the cooling medium accompanying the driving of the pump 76 is absorbed, thereby adjusting the discharge pressure of the cooling medium to a fixed level. This cooling medium is supplied to the cooling medium path 74 through the communication port 80 formed in the main body 71. The refrigerant path 74 communicates with a refrigerant outlet 81 formed in the main body 71. The refrigerant outlet 81 is connected to the refrigerant inlet 46 of the radiator 32 through the downstream portion of the first pipeline 50.
Therefore, the cooling medium supplied from the pump 76 to the refrigerant path 74 of the intermediate cooling unit 70 is introduced to the radiator 32 via the downstream portion of the first pipeline 50. After the cooling medium flows through the heat dissipation path 45 of the radiator 32, it is led to the heat receiving head 31 via the second pipeline 51, and then from there, it returns to the pump 76 via the upstream portion of the first pipeline 50 Suction end. In this way, the cooling medium is forced to circulate between the heat receiving head 31 and the radiator 32.
As shown in FIG. 11, 71 has a second concave portion 83 that opens upward. The opening end of the second concave portion 83 is sealed by the head plate 84. The head plate 84 cooperates with the second concave portion 83 to form a cooling air path 85. The cooling air path 85 is adjacent to the refrigerant path 74 beyond the main body 71 and is thermally connected to this refrigerant path 74. The cooling air path 85 extends in the width direction of the first housing 4. This cooling air path 85 has a cooling air outlet 86. The cooling air outlet 86 is opposite to the air outlet 87 opened in the side wall 4c on the left side of the first housing 4.
The main body 71 has a plurality of radiating fins 88 protruding from the bottom of the second concave portion 83. These radiating fins 88 face the cooling air path 85 so as to extend linearly along the cooling air path 85.
As shown in FIG. 3, the aforementioned electric fan 90 is integrally built in the main body 71. The electric fan 90 is located on the opposite side of the cooling air path 85 to the cooling air outlet 86 to feed the cooling air through the cooling air path 85. According to this embodiment, when the temperature of the semiconductor package 12 and the temperature of the display housing 17 reach respective predetermined values, the electric fan 90 is driven. Therefore, the heat receiving head 31 and the heat sink 32 thermally connected to the semiconductor package 12 are equipped with temperature sensors 91a and 91b, respectively. 90 electric fans are driven by temperature signals from temperature sensors 91a and 91b.
Next, the cooling operation of the semiconductor package 12 will be described below with reference to FIG. 12.
As shown in FIG. 12, the power of the portable computer 1 is turned on in step S1. Therefore, in step S2, the pump 76 of the cooling unit 30 is driven so that the cooling medium starts to circulate between the heat receiving head 31 and the radiator 32.
If the IC chip 14 of the semiconductor package 12 is heated during the operation of the portable computer 1, the heat of the IC chip 14 is transferred to the heat transfer cover 34 of the heat receiving head 31. The heat of the IC chip 14 transferred to the heat transfer cover 34 is transferred to the cooling medium flowing through the cooling medium flow path 36. After the heat exchange at the heat receiving head 31, the heated cooling medium is guided to the radiator via the upstream portion of the first pipeline 50, the refrigerant path 74 of the intercooling unit 70, and the downstream portion of the first pipeline 50 32. In this way, the heat of the IC chip 14 is transferred to the heat sink 32 via the flow of the cooling medium.
The cooling medium introduced to the radiator 32 flows through the tortuous heat dissipation path 45. During this flow, the heat absorbed by the cooling medium is transferred to the first and second heat dissipation plates 43a and 43b. Part of the heat transferred to the first and second heat dissipation plates 43 and 43b is diffused to the display casing 17 by heat transfer, so that it is discharged from the surface of the display casing 17 into the atmosphere.
The protective layer 57 covering the first heat dissipation plate 43 a is exposed to the outside of the display casing 17 through the installation opening 54 on the rear surface 21 of the display casing 17. Therefore, most of the heat transferred to the first heat dissipation plate 43a is discharged from the surface of the protective layer 57 to the atmosphere.
The cooling medium cooled by the heat exchange by the radiator 32 returns to the suction end of the pump 76 via the second line 51. After this cooling medium is pressurized by the pump 76, it is supplied to the cooling medium flow path 36 of the heat receiving head 31 via the accumulator 77.
While the power of the portable computer 1 is kept on, the temperature of the semiconductor package 12 and the display housing 17 are monitored by the temperature sensors 91a and 91b. In this way, as long as the power of the portable computer 1 is kept on, the temperature of the semiconductor package 12 is checked in step S3. When the temperature of the semiconductor package 12 reaches a predetermined level, the process proceeds to step S4, in which the electric fan 90 of the intermediate cooling unit 70 is started.
If the electric fan 90 is driven, the air inside the first housing 4 becomes cooling air and then is fed to the cooling air path 85. Because the cooling air path 85 is thermally connected to the refrigerant path 74, a part of the heat of the cooling medium flowing through the refrigerant path 74 is taken away by the flow of the cooling air flowing through the cooling air path 85, and is discharged through the exhaust port 87 It is discharged to the outside of the first housing 4. In this way, the cooling medium heated by the heat receiving head 31 is cooled before it reaches the radiator 32, and thus the temperature of the cooling medium fed to the radiator 32 is kept relatively low.
Unless the temperature of the semiconductor package 12 checked in step 3 reaches a predetermined value, the process proceeds to step S5 where the temperature of the display housing 17 is checked. Because the pump 76 of the intermediate cooling unit 70 will continue to be driven as long as the power of the portable computer 1 is kept on, the cooling medium continues to transfer the heat of the semiconductor package 12 to the display housing 17. In this way, even if the temperature of the semiconductor package 12 does not reach the predetermined value, when the temperature of the display housing 17 reaches the predetermined value, the process proceeds to step S4, in which the electric fan 90 is started.
Therefore, a part of the heat of the cooling medium flowing through the cooling medium path 74 is taken away by the flow of the cooling air flowing through the cooling air path 85. As a result, the temperature of the cooling medium fed to the radiator 32 decreases, so that the amount of heat transferred from the radiator 32 to the display housing 17 is reduced.
After the driving of the electric fan 90 is also started, the temperature of the semiconductor package 12 and the display case 17 are continuously checked in steps S6 and S7. Here, if it is determined that the temperatures of the semiconductor package 12 and the display case 17 are above the predetermined value, the process proceeds to step S8. In step S8, the processing rate of the semiconductor package 12 is temporarily reduced to reduce the power consumption of the semiconductor package 12, thereby suppressing the generation of heat in the IC chip 14.
According to this portable computer 1, the cooling medium is forced to circulate between the heat receiving head 31 and the heat sink 32, thereby effectively transferring the heat of the semiconductor package 12 to the display housing 17, and discharging it to the atmosphere. Therefore, compared with the conventional general forced air cooling system, the heat dissipation of the semiconductor package 12 can be improved, and thus can reasonably correspond to the increase in heat generation.
In addition, according to the above configuration, the cooling medium heated by the heat receiving head 31 is cooled via the intermediate cooling unit 70 before it reaches the radiator 32. In this way, the temperature of the cooling medium fed to the radiator 32 can be lowered, so that the surface temperature of the display housing 17 that receives the heat of the radiator 32 can be suppressed. In this way, if the operator touches the surface of the display housing 17 with his hand when adjusting the standing angle of the display unit 3 or carrying the portable computer 1, he will never feel that he is suddenly burnt, thus reducing the safety during use. The thermal effect of the portable computer 1 on the human body.
Simultaneously with the power of the portable computer 1 being turned on, the circulation of the cooling medium starts to transfer the heat of the semiconductor package 12 to the heat sink 32. In this way, the temperature of the semiconductor package 12 has not risen. When the low/medium load is too high, the operation of the electric fan 90 can be stopped or the rotation rate can be suppressed, so that a quiet operation can be achieved.
In addition, because the pump 76 and the accumulator 77 are built in the main body 71 of the intercooling unit 70, the structure including the movable part can be processed as a single unit. In this way, it is easy to integrate the cooling unit 30 into the first casing 4, thereby improving the efficiency of the assembling operation of the portable computer 1.
In addition, a first line 50 for introducing the cooling medium heated by the heat receiving head 31 to the radiator 32 and a second line 51 for returning the cooling medium cooled by the radiator 32 to the heat receiving head 31 are provided On the left and right legs 23a and 23b of the display housing 17. In this way, at the stretched part of the first and second pipelines 50 and 51 between the first housing 4 and the display housing 17, the first and second pipelines 50 and 51 can be kept spaced apart from each other so that The two are thermally separated. In this way, undesired heat exchange between the first pipeline 50 and the second pipeline 51 can be prevented, thereby improving the heat transfer efficiency from the heat receiving head 31 to the radiator 32.
On the other hand, the procedure for removing the display unit 3 from the first casing 4 in the portable computer 1 having the above-mentioned structure will be described below.
First, as shown in FIG. 6, the display unit 3 is rotated to the closed position, so that the screw 63 fixing the cover 61 is exposed toward the rear side of the display support portions 10a and 10b. Next, the screws 63 are loosened to release the cover 61 fixed by the screws 63. Then, the engagement between the assembly pawl 62 and the heat sink 32 is released, and the cover 61 is removed from the display housing 17. Therefore, as shown in FIG. 7, the opening portions 60 and 60b are opened so that the telescopic tube 52 inserted into the inside of the leg portions 23 and 23b is exposed toward the rear surface 21 of the display housing 17 through the opening portions 60 and 60b.
Next, the screws 56 that fix the first and second heat dissipation plates 43a and 43b to the display housing 17 are loosened to release the engagement between the heat sink 32 and the display housing 17. Subsequently, the assembly pawls 55 and 55b of the heat sink 32 are separated from the opening edge portion of the mounting opening 54 and then the heat sink 32 is taken out in the direction of the rear surface 21 of the display housing 17 through the mounting opening 54. The procedure for removing the radiator 32 can be executed regardless of whether the display unit 3 is rotated to its closed position or open position.
Because the openings 60a and 60b are transported to the mounting port 54, the first and second pipelines 50 and 51 of the radiator 32 can be moved toward the legs 23 and 23b while the radiator 32 is removed from the mounting port 54. The rear side is pulled out of the opening portions 60a and 60b. Since the second pipeline 51 is provided behind the hinge shaft 57 at this time, the hinge shaft 27 will not become an obstacle when the second pipeline 51 is taken out of the leg 23a.
In this way, as shown in FIG. 13, after the first and second pipelines 50 and 51 are connected under the radiator 32, the radiator 32 can be pulled out toward the rear side of the display unit 17.
Next, by taking the top cover 6 of the first housing 4 out of the base 5, the first bracket 25 of the hinge device 24 fixed to the base 5 is exposed. Finally, the screw fixation between the first bracket 25 and the sleeve portion 28 is released, and the display unit 3 together with the hinge device 24 is taken out toward the upper side of the base 5. In this way, the display unit and the computer main body 2 can be separated from each other.
When the display unit 3 is installed on the computer main body 2, the first bracket 25 of the hinge device 24 is screwed to the sleeve portion 28 of the base 5 before the top cover 6 is installed on the base 5. Then, the top cover 6 is installed on the base 5 to cover the first bracket 25 with this top cover 6.
Secondly, the heat sink 32 is installed together with the installation opening 54 of the rear surface 21 of the display housing 17 so that the assembling pawls 55a and 55b of the first heat dissipation plate 43a are hooked on the opening edge portion of the installation opening 54. In addition, the lower edge portions of the first and second heat dissipation plates 43 and 43b are fixed to the display housing 17 with screws 56. Subsequently, the first and second pipelines 50 and 51 carried to the radiator 32 are inserted into the inside of the legs 23a and 23b through the opening portions 60a and 60b.
Finally, the cover 61 is assembled with the opening parts 60 and 60b, and the cover 61 is fixed to the legs 23a and 23b with screws 63. Therefore, the computer main body and the display unit 3 are rotatably connected to each other, thereby completing the integration of the heat sink 32 in the display housing 17.
With this structure, the heat sink 32 housed in the display housing 17 can be taken out of the rear surface 21 of the display housing 17 together with the first and second pipelines 50 and 51. Therefore, after the heat sink 32 is taken out of the display housing 17, the display unit 3 can be taken out of the first housing 4 or installed in the first housing 4.
Therefore, when attaching the display unit 3 to the first housing 4 and removing the display unit 3 from the first housing 4, it is not necessary to release the thermal connection between the heat receiving head 31 and the semiconductor package 12 or to be thermally connected again, so that There is no need for a disassembly/assembly procedure for the thermal connection part between the heat receiving head 31 and the semiconductor package 12.
Therefore, no unreasonable force is applied to the precision semiconductor package 12, and the positional relationship between the semiconductor package 12 and the heat receiving head 31 does not change, so that the reliability of heat conduction is desirably maintained.
In addition, the telescopic tube 52 of the second pipeline 51 is provided behind the hinge shaft 27 inside the leg 23a. Therefore, when the display unit 3 is rotated to the closed position, the curvature of the telescopic tube 52 can be suppressed to be quite small, as shown in FIG. 5. As a result, when the display unit 3 rotates, an unreasonable bending force is not applied to the telescopic tube 52, thereby improving the durability of the telescopic tube 52.
Meanwhile, according to the first embodiment, when the temperature of the semiconductor package and the temperature of the display case reach their predetermined values, the electric fan is started. However, the present invention is not limited to this. For example, the air volume of the cooling air or the flow rate of the cooling medium can also be adjusted according to the temperature signal output from the temperature sensor.
In addition, the pump and the accumulator do not always have to be built with the intercooling unit, and the pump and the accumulator can be installed in the middle of the second pipeline. Because of this structure, the cooling medium cooled by the radiator is introduced to the pump and the accumulator, so the thermal influence on the pump and the accumulator can be suppressed, thereby improving the reliability of operation.
The present invention is not limited to the first embodiment described above. Next, the second embodiment of the present invention shown in FIG. 14 will be described.
The difference between the second embodiment and the first embodiment is that the lids 61 covering the opening portions 60 and 60b at the legs 23a and 23b are connected to each other via a connecting panel 100. The other basic structure of the portable computer 1 is the same as that of the first embodiment.
The connecting panel 100 is an elongated plate extending in the width direction of the display housing 17. The connecting panel 100 is detachably assembled to the end portion of the mounting opening 54 of the display housing 17 adjacent to the legs 23 and 23b, and functions as a cover for partially covering the mounting opening 54. The connecting panel 100 is located on the same plane as the rear surface 21 of the display housing 17 and the protective layer 57 of the heat sink 32.
Figure 15 shows the third embodiment of the present invention.
This third embodiment is a further development of the second precious embodiment. According to the third embodiment, the connection panel 100 used to connect the cover 61 is large enough to cover the installation opening 54 entirely. The connecting panel 100 is detachably assembled on the mounting opening 54 so that it overlaps the first heat dissipation plate 32 a of the heat sink 32 supported by the display housing 17. As such, the first heat dissipation plate 43a of the heat sink 32 is not equipped with any protective layer as shown in the first embodiment, and this connection panel 100 functions as a protective layer covering the first heat dissipation plate 43a.
In addition, Figures 16 to 18 show a fourth embodiment of the present invention.
According to the fourth embodiment, the structure of the cooling unit 120 for mainly cooling the semiconductor package 12 is the same as that of the first embodiment, and the other basic structure of the portable computer 1 is the same as that of the first embodiment. Therefore, for the fourth embodiment, the same reference numerals denote the same components as those of the first embodiment, and the description thereof is omitted.
As shown in FIG. 16, the protruding portion 8 located at the rear end portion of the first housing 4 is constructed so that its two ends are opposite to the width direction of the first housing 4 in the width direction of the first housing 4. The side wall 4c is located inside. A pair of display supporting parts 121 and 121 are formed at the rear end of the first housing 4, which are defined by the two end surfaces of the protruding part 8 and the top surface of the upper wall 4b.
The legs 23 and 23b of the display housing 17 are led to the display supporting portions 121a and 121b. These legs 23 and 23 have side surfaces opposite to both end surfaces of the protruding portion 8.
The hinge shaft 27 of the hinge device 24 extends horizontally so that it passes through the right end surface of the protruding part and the right side surface of the leg 23a. The leg 23b located on the left side opposite to the hinge device 24 has a cylindrical guide 122 protruding from its side toward the left end surface of the protruding portion 8. The guide 122 rotatably passes through the left end surface of the protruding portion 8 so that it opens inside the protruding portion 8. In this way, the inside of the first housing 4 and the inside of the display housing 17 communicate with each other via the guide 122 and the left leg 23b.
The cooling unit 120 for cooling the semiconductor package 12 includes a heat receiving head 31 housed in the first housing 4, a heat sink 123 housed in the display housing 17, and a heat sink 123 for connecting the heat receiving head 31 and the heat sink 123. Circulation path 124.
The heat sink 123 has a flat heat dissipation plate 125 and a meandering heat dissipation pipe 126. The heat dissipation plate 125 is made of, for example, a metal material having excellent thermal conductivity, such as an aluminum alloy. The heat dissipation plate 125 is fixed to the inner surface of the display housing 17 by a fixing mechanism such as screws, adhesives, and the like behind the liquid crystal display panel 18 so that it is thermally connected to the display housing 17.
The heat pipe 126 is made of aluminum alloy or copper-based metal material with excellent thermal conductivity. The heat dissipation pipe 126 is fixed to the heat dissipation plate 125 by a bonding or soldering mechanism, so that it is thermally connected to the heat dissipation plate 125. The heat pipe 126 is equipped with a refrigerant inlet 127 and a refrigerant outlet 128. The refrigerant inlet 127 and the refrigerant outlet 128 are located at the left end of the heat spreader 123.
The circulation path 124 includes a first pipeline 130 and a second pipeline 131. These pipelines 130 and 131 are made of flexible materials such as silicone resin. The first pipeline 130 is used to connect the refrigerant outlet 38 of the heat receiving head 31 to the refrigerant inlet 127 of the heat dissipation pipe 126. After the inside of the first housing is led to the left end of the protruding portion 8, the first pipeline 130 is led to the display housing 17 through the guide 122 on the left and the inside of the leg 23b. The second pipeline 131 is used to connect the refrigerant outlet 128 of the heat dissipation pipe 126 to the refrigerant inlet 37 of the heat receiving head 31. After the inside of the first housing is led to the left end portion of the protruding portion 8, the second pipeline 131 is led to the inside of the display housing 17 via the guide 122 on the left side and the leg 23b.
In this way, the refrigerant flow path 36 of the heat receiving head 31 is connected to the heat dissipation pipe 126 of the radiator 123 via the first and second pipelines 130 and 131. The refrigerant flow path 36, the radiating pipe 126, and the first/second pipelines 130 and 131 are filled with a liquid cooling medium.
The pump 132 is installed in the middle of the second pipeline 131. When the power of the portable computer 1 is turned on, the pump 132 is activated, thereby sending the cooling medium to the heat receiving head 31. As a result, the cooling medium is guided from the heat receiving project 31 to the radiator 123 via the first pipeline 130, and after flowing through the heat dissipation pipe 126 in the radiator 123, it returns to the pump 132 via the second pipeline 131.
As shown in FIG. 16, the first and second pipelines 130 and 131 have intermediate portions 133a and 133b. The middle portions 133 and 133 are between the protruding portion 8 and the leg portion 23b of the display housing 17. The middle portions 133a and 133b extend horizontally along the axis X1 of the hinge shaft 27, so that they are arranged parallel to each other with a gap therebetween.
The middle parts 133a and 133b of the first and second pipelines 130 and 131 are provided with a holding member 134 for keeping the gap between the middle parts 133a and 133b fixed. The holder 134 is made of a material that is difficult to transmit heat. As shown in FIG. 17, the holding member 134 has a first support tube 135a and a second support tube 135b. The first support tube 135a supports the middle portion 133a of the first pipeline 130 in an axial direction rotatably. The second support tube 135b supports the middle portion 133b of the second pipeline 131 rotatably in the axial direction.
The first and second support tubes 135a and 135b are connected via a pair of pillars 136. The pillar 136 extends in the diameter direction of the first and second support tubes 135a and 135b so that it is disposed between the two end portions of the support tubes 135a and 135b. In this way, the first and second support tubes 135a and 135b are arranged parallel to each other across the thermal insulation gap 137.
As shown in FIG. 16, the first and second pipelines 130 and 131 are divided into upstream parts 130a and 131a and downstream parts 130b and 131b inside the first housing 4. The upstream parts 130 a and 131 a and the downstream parts 130 and 131 are detachably joined through a joint 140. As shown in FIGS. 18A and 18B, the joint 140 has a first joint part 141 and a second joint part 142. The first joint part 141 is connected to the downstream part 130 b of the first pipeline 130 and the upstream part 131 a of the second pipeline 131. The second joint part 142 is connected to the upstream part 130 a of the first pipeline 130 and the downstream part 131 b of the second pipeline 131.
The first concubine part 141 has a hollow cylindrical body 145. A pair of refrigerant flow paths 146 are formed inside the main body 145. The refrigerant flow path 146 is connected to the downstream portion 130 of the first pipeline 130 and the upstream portion 131 a of the second pipeline 131. Each of the refrigerant flow paths 146 has a valve hole 147 opened at one end of the body 145. A pair of pressing rods 148 protruding from the main body 145 through the opening edge portion of the valve hole 147 are provided at the front end of the main body 145.
The spherical valve body 149 is housed in each refrigerant flow path 146, and is used as a closing mechanism. The valve body 149 is supported by the body 145 and can be approached and separated from the switch hole 147, and is always pressed against the valve hole 147 by the spring 150. In this way, when the first joint part 141 is separated from the second joint part 142, the valve body 149 maintains firm contact with the opening edge portion of the valve hole 147, thereby closing the valve hole 147.
The second joint part 142 has a hollow cylindrical body 152. A pair of refrigerant flow paths 153 are formed inside the main body 152. The refrigerant flow path 153 is connected to the upstream portion 130 of the first pipeline 130 and the downstream portion 131 b of the second pipeline 131. Each of the refrigerant flow paths 153 has an assembly hole 154 which opens at the front end of the main body 152. The body 145 of the first joint part 141 is removably and detachably fixed to the assembly hole 154.
As shown in FIG. 18B, the pressure protrusion 155 and the partition wall 157 with the valve hole 156 are provided in the middle part of the refrigerant flow path 153. The protrusion 155 extends toward the fitting hole 154. The partition wall 157 is opposed to the fitting hole 154 across the pressing protrusion 155. The spherical valve body 158 is housed between the partition wall 157 and the other end of the refrigerant flow path 153 to form a closing mechanism. The valve body 158 is supported by the body 152 and can approach and leave the valve hole 156, and is permanently pressed against the valve hole 156 by the spring 159. In this way, when the first joint part 141 is separated from the second joint part 142, the valve body 158 maintains firm contact with the opening edge portion of the valve hole 156, thereby closing the shut hole 156.
As shown in FIG. 18A, when the body 145 of the first joint part 141 is fitted into the fitting hole 154 of the second joint part 142, the pressing protrusion 155 of the second joint part 142 enters the first joint part 141 Valve hole 147. The protrusion 155 hits the valve body 149. Therefore, even with the force of the spring 150, the valve body 149 is pushed away from the opening edge portion of the switch hole 147. The valve hole 147 is thus opened.
at the same time <sub>,</sub> The pressing rod 148 of the body 145 passes through the periphery of the pressing protrusion 155 and enters the valve hole 156 of the joint part 142. The pressing rod 148 hits the valve body 158. As a result, the valve body 158 is pushed against the force of the spring 159 to leave the opening edge portion of the valve hole 156. The valve hole 156 is thus opened.
Because the first joint part 141 and the second joint part 142 are connected, the refrigerant flow paths 146 and 153 communicate with each other through the valve holes 147 and 156.
When the first joint part 141 is separated from the second joint part 142, as shown in FIG. 18B, the valve body 149 is no longer pressed by the pressing protrusion 155. At the same time, the valve body 158 is no longer pressed by the pressing rod 148. Therefore, the valve bodies 149 and 158 are pressed against the opening edge portions of the valve holes 147 and 156 by the springs 150 and 159. The valve bodies 149 and 158 seal the valve holes 147 and 156. Therefore, the refrigerant flow paths 146 and 153 that continue to the first and second pipelines 130 and 131 are automatically closed, thereby preventing leakage of the cooling medium.
If the IC chip 14 of the semiconductor package 12 is heated by force in the portable computer 1 having this structure, the heat of the IC chip 14 is transferred to the heat transfer cover 34 of the heat receiving head 31. Since the cooling medium is supplied to the cooling medium flow path 36 of this heat transfer cover 34, the heat transferred to the heat transfer cover 34 is transferred from the heat transfer cover 34 to the cooling medium flowing through the cooling medium flow path 36. After being heated by the heat exchange using the heat receiving head 31, the cooling medium is led to the heat sink 123 of the display unit through the first pipeline 130, so that the heat of the IC chip 14 is transferred to the heat sink through the flow of the cooling medium 123.
The cooling medium introduced to the radiator 123 flows along the tortuous heat dissipation pipe 126. In this flow process, the heat absorbed by the cooling medium is transferred to the heat dissipation pipe 126, and is diffused by heat conduction to the heat dissipation plate 125. Since the heat dissipation plate 125 is thermally connected to the display case 17, the heat transferred to the heat dissipation plate 125 is diffused by heat conduction to the display case 17, and then is discharged from the surface of the display case 17 to the atmosphere.
The cooling medium cooled by the heat exchange by the heat dissipation pipe 126 returns to the pump 132 via the second line 131, is pressurized by the pump 132, and is supplied to the heat receiving head 31.
There is a first line 130 in which a cooling medium heated by heat exchange by the heat receiving head 31 flows, and a second line 131 in which a cooling medium cooled by heat exchange by the radiator 123 flows inside. It extends between the first housing 4 and the display housing 17. Then, the middle portion 133a of the first pipeline 130 and the middle portion 133b of the second pipeline 131 are held by the first and second support tubes 135a and 135b of the holding member 134. Therefore, the gap between the first pipeline 130 and the second pipeline 131 remains fixed, and the gap between the first pipeline 130 and the second pipeline 131 is heated by the gap 137 between the first support pipe 135a and the second support pipe 135b. Blocked.
In this way, although the first line 130 in which the heated cooling medium flows and the second line 131 in which the cooled cooling medium flows through the guide 122, they are joined to each other, but the adjacent lines can be prevented There is unwanted heat exchange between 130 and 131. Therefore, the heat transfer efficiency from the heat receiving head 31 to the heat sink 123 can be improved and the heat dissipation performance of the semiconductor package 12 can be maintained.
On the other hand, the following describes a procedure for taking out the display unit 3 from the first casing 4 of the portable computer 1 having this structure.
First, the top cover of the first housing 4 is removed from the base 5 to expose the first and second pipelines 130 and 131 and the joint 140 contained in the first housing 4.
Secondly, the first joint part 141 and the second joint part 142 of the joint 140 are separated from each other, and the first and second pipelines 130 and 131 are divided into the upstream part 130a and 131a and the downstream part inside the first housing 4 Parts 130b and 131b. Therefore, the circulation path 124 is divided between the first housing and the display unit 3. As such, while the heat receiving head 31 is maintained under the first housing 4, the display unit 3 may be removed from the first housing 4, or may be installed on the first housing 4.
Therefore, when attaching the display unit 3 to the first housing 4 or detaching the display unit 3 from the first housing 4, it is not necessary to release the thermal connection between the heat receiving head 31 and the semiconductor package 12 or to be thermally connected again, Therefore, there is no need for a disassembly/assembly procedure for the thermal connection part between the heat receiving head 31 and the semiconductor package 12. Therefore, no unreasonable force is applied to the precision semiconductor package 12, and the positional relationship between the semiconductor package 12 and the heat receiving head 31 does not change, and thus it is desirable to maintain the reliability of heat transfer.
In addition, if the first joint part 141 is separated from the second joint part 142, the valve holes 147 and 156 in the joint parts 141 and 142 are automatically blocked by the valve bodies 149 and 158. In this way, the leakage of the cooling medium can be prevented, and there is no need for any special procedures for sealing the partition between the first and second pipelines 130 and 131.
Those who are familiar with this technology can easily think of other advantages and modifications. Therefore, the invention in its broadest aspects is not limited to the specific details and representative embodiments shown and described herein. Therefore, various modifications can be implemented without departing from the spirit or scope of the concept of the present invention defined by the accompanying patent application scope and its equivalents.
13 members in 4 offices
Priority claims2
| Document | Office | Kind | Date |
|---|---|---|---|
| 2000287691 | Japan | – | |
| 2000287691 | Japan | A |
Members13
| Document | Office | Kind | |
|---|---|---|---|
| US2002039279A1 | United States of America | A1 | |
| JP2002099356A | Japan | A | |
| CN1366448A | China | A | |
| TW511451BThis record | Taiwan Province of China | B | |
| US6510052B2 | United States of America | B2 | |
| US2003072134A1 | United States of America | A1 | |
| US2004057207A1 | United States of America | A1 | |
| US6728102B2 | United States of America | B2 | |
| US2004085734A1 | United States of America | A1 | |
| US6751095B2 | United States of America | B2 | |
| US6920043B1 | United States of America | B1 | |
| US2005174714A1 | United States of America | A1 | |
| CN1251048C | China | C |
2 legal events, as the office reported them to INPADOC
Over the term
Point at a mark for the eventEvents
| Event | Code | |
|---|---|---|
| Annulment or lapse of patent due to non-payment of feesLapsedMM4A | MM4A | |
| Issue of patent certificate for granted invention patentGrantedGD4A | GD4A |
Numbers
- Publication
- 511451
- Application
- 90122499
Titles4
- Chinese
- 用於冷卻產熱構件之冷卻單元及包含此冷卻單元之電子設備
- English
- COOLING UNIT FOR COOLING A HEAT GENERATINGCOMPONENT AND ELECTRONIC APPARATUS HAVING THE COOLING UNIT
- Unlabeled
- 用於冷卻產熱構件之冷卻單元及包含此冷卻單元之電子設備
- Unlabeled
- Cooling unit for cooling heat-generating components and electronic equipment containing the cooling unit
Classification
- CPC, 3
- G06F1/203
- F28D1/0308
- F28D2021/0029
- IPC, 5
- F28D1 03
- F28D15 02
- G06F1 20
- H05K7 20
- H10W40 47