Filter, duplexer, and communications device
Abstract
A filter, duplexer, and a communications decicesignificantly reduces power lass due to the edge effect, andthe coupling structure between a resonator and an input oroutput terminal does not negaticely affect the reduction ofpower loss. A plurality of resonators is procided on adielectric substrate. Each of the resonators is constitutedof a multiple spiral transmission line assembly. on thecenters of multiple spiral transmission assemblies on theinput end and the output end, there are formed coupling padswhich are capaciticely coupled to associated multipletransmission line assemblies.
Term
No projected expiry on record.
- Priority
- Filed
- Granted
- Today
8 claims: 7 independent, 1 dependent
- 1507397 8 888 ABCD 經濟部智慧財產局員工消費合作社印製 六、申請專利範圍 1. 一種濾波器，其包括： 一諧振器，其包括一基板和一傳輸線組件，該傳輸線 組件是由繞該基板上特定點設置從而彼此不相交的複數個 螺旋傳輸線組成的，該複數個螺旋傳輸線的內端和外端實 質上分別限定該傳輸線組件的內圓周和外圓周；以及 一設置在該傳輸線組件的中心上的耦合襯墊，其與每 一個該複數個螺旋傳輸線電容耦合。 2. —種濾波器，其包括： 一諧振器，其包括一基板和一傳輸線組件，該傳輸線 組件是由彼此旋轉對稱地繞該基板上特定點設置從而彼此 不相交的複數個螺旋傳輸線組成的；以及 一設置在該傳輸線組件的中心上的耦合襯墊，其與每 一個該複數個螺旋傳輸線電容耦合。 ，一種濾波器，其包括： 一諧振器，其包括基板和傳輸線組件，該傳輸線組件 是由設置在該基板上的複數個螺旋傳輸線組成，該複數個 螺旋傳輸線的每一個在由角度軸和徑向向量軸限定的坐標 上或由單調增加線或由單調減小線代表，該複數個傳輸線 的每一個的線寬度不超過2ττ弧度的角寬度除以傳輸線的 數目，全部該傳輸線組件的寬度在任何徑向向量上不超過 2 7Γ弧度，以及 一設置在該傳輸線組件的中心上的耦合襯墊，其與每 一個該複數個螺旋傳輸線電容耦合。 4·如申請專利範圍第1至3項中任一項的濾波器，其 1 ---------- (請先閲讀背面之注意事項再填寫本頁) 訂 #1 本紙張尺度適用中國國家標準（CNS ) A4規格（210X297公釐） 507397 A8 驾 D8 … 補:为. 六、申請專利範圍 第089123266號專利申請案 申請專利範圍修正頁(第2頁) 中，該耦合襯墊形成在與該傳輸線組件相同的平面上。 5. 如申請專利範圍第1至3項中任一項的濾波器，其 中，該耦合襯墊係被設置使得於該傳輸線組件與介於該耦 合襯墊與該傳輸線組件之間的介電質構件部分重疊。 6. 如申請專利範圍第1至3項中任一項的濾波器，其 中，該基板層疊在另一基板上，後者設置有輸入端子和輸 出端子，該耦合襯墊經撞柱連接至電極，電極連接至輸入 端子和輸出端子中的一個。 7. —種雙工器，其特徵在於：包括如申請專利範圍第 1至6項中任一項之濾波器，作爲發射機濾波器和接收機 濾波器中的一個或二者。 8. —種通信裝置，其特徵在於：包括如申請專利範圍 第1至6項中任一項之瀘波器或是包括如申請專利範圍第 7項之雙工器。 ·(請先閲讀背面之注意事項再填寫本頁) 線 本紙張尺度適用中國國家標準(CNS)A4規格(210 X 297公釐)
155 paragraphs, as filed
Filters, duplexers and communication devices
Figure 1A is a plan view of a spiral transmission line.
Figure 1B is a plan view of a resonator incorporated in the filter of the present invention.
Figure 1C is a cross-sectional view of the filter.
Fig. 1D is an enlarged partial plan view of the filter.
Fig. 2A is a view showing an angular width of a transmission line.
Fig. 2B is a diagram showing a transmission line pattern with polar coordinate parameters on Cartesian coordinates.
Fig. 3A is a plan view of the resonator.
Figure 3B is a vertical cross-sectional view showing the distribution of electric and magnetic fields in the resonator.
Figure 3C is a vertical cross-sectional view showing the current density and the z component of the magnetic field in the resonator.
Fig. 4A is a plan view of another resonator.
Fig. 4B is a vertical sectional view showing the distribution of electric and magnetic fields in the resonator shown in Fig. 4A.
Fig. 4C is a vertical sectional view showing the current density and the z component of the magnetic field in the resonator shown in Fig. 4A.
Figure 5 is a vertical cross-sectional view of a plurality of microstrip transmission line assemblies used as a model.
Figure 6A is a magnetic field distribution diagram in the first model.
Figure 6B is a magnetic field distribution diagram in the second model.
Fig. 7A is a distribution diagram of the x component of the magnetic field in the first model.
Fig. 7B is a distribution diagram of the x component of the magnetic field in the second model.
Fig. 8A is a distribution diagram of the y component of the magnetic field in the first model.
Fig. 8B is a distribution diagram of the y component of the magnetic field in the second model.
Figure 9 is a graph of the y component of the magnetic field along the x-axis.
Figure 10 is a graph of current phase difference versus power loss.
Figure 11 is a plan view showing a plurality of spiral transmission line assemblies in the first embodiment of the present invention.
Fig. 12 is a perspective view of chopping according to the first embodiment.
Figure 13A is a plan view showing an improvement in the shape of the coupling pad.
Figure 13B is a plan view showing another modification of the shape of the coupling pad.
Figure 14A is a plan view showing an improvement in the coupling structure between the coupling pad and the plurality of helical transmission line assemblies.
Fig. 14B is a vertical sectional view taken along line AA of Fig. 14A.
Figure 15A is a plan view showing another modification of the coupling structure between the coupling pad and the plurality of helical transmission line assemblies.
Figure 15B is a vertical sectional view taken along line AA of Figure 15A.
Figure 16A is a plan view showing still another modification of the component coupling structure between the coupling pad and the plurality of spiral transmission lines.
Figure 16B is a vertical sectional view taken along line AA of Figure 16A.
Figure 17 is a perspective view of a filter in accordance with a second embodiment of the present invention.
Figure 18 is a perspective view of a filter in accordance with a third embodiment of the present invention.
Figure 19 is a perspective view of a filter in accordance with a fourth embodiment of the present invention.
Figure 20A is a plan view showing an improvement of the electrode connected to the coupling pad.
Fig. 20B is a vertical sectional view taken along line AA of Fig. 20A.
Figure 21A is a plan view showing another modification of the electrode connected to the coupling pad.
Figure 21B is a vertical sectional view taken along line AA of Figure 21A.
Figure 22 is a block diagram of a duplexer in accordance with the present invention.
Figure 23 is a block diagram of a communication device in accordance with the present invention.
The principle of the resonator used in the chopper according to the present invention will first be described with reference to Figs.
BACKGROUND OF THE INVENTION Field of the Invention
The invention relates to filters, duplexers and communication devices, in particular to filters, duplexers and communication devices used for radio communication or electromagnetic waves, such as transmission/reception in the microwave or millimeter wave band.
Related prior art
The hairpin resonator disclosed in Japanese Unexamined Patent Application Publication No. Hei No. 62-193302 is known as a resonator used in the microwave or millimeter wave band. The hairpin resonator is more densely structured than a resonator equipped with a linear transmission line.
Another known resonator which is also more dense in structure is the spiral resonator disclosed in Japanese Unexamined Patent Publication No. Hei 2-96402. The spiral resonator is equipped with a spiral transmission line to obtain a longer transmission line in a limited area, and a resonant capacitor is also provided to allow for a smaller overall size.
Each of the above two resonators has been implemented using a single half-wave transmission line. Therefore, in the above resonator, electric energy and magnetic energy are accumulated in respective regions on the dielectric substrate. More specifically, electric energy is accumulated near the open end of the half-wave transmission line, and magnetic resonators accumulating only one microstrip transmission line near the center of the half-wave transmission line cannot exempt the edge inherent in the microstrip transmission line. The characteristics caused by the effect are degraded. In particular, current is concentrated on the edges (side edges and top and bottom edges) of the transmission line as viewed in cross section. The use of thicker transmission lines does not eliminate the above problems.
Accordingly, it is an object of the present invention to provide a filter, a duplexer and a communication device in which the power loss caused by the edge effect is significantly reduced, wherein the coupling structure between the resonator and the input/output terminal does not adversely affect the edge effect The reduction.
To achieve this, in one aspect of the invention, a filter having a resonator and a coupling pad is provided. The resonator includes a substrate and a transmission line assembly. The transmission line assembly is composed of a plurality of spiral transmission lines disposed at specific points on the substrate so as not to intersect each other. The inner and outer ends of the plurality of helical transmission lines respectively define an inner circumference and an outer circumference of the transmission line assembly, respectively. A coupling pad is disposed on the center of the transmission line assembly and is capacitively coupled to each of the plurality of helical transmission lines.
In another aspect of the invention, a filter having a resonator and a coupling pad is provided. The resonator includes a substrate and a transmission line assembly. The transmission line assembly is composed of a plurality of spiral transmission lines that are rotationally symmetrically arranged with respect to a specific point on the substrate so as not to intersect each other. A coupling pad is disposed on the center of the transmission line and is capacitively coupled to each of the plurality of spiral transmission lines.
In still another aspect of the invention, a filter having a resonator and a coupling pad is provided. The resonator includes a substrate and a transmission line assembly. The transmission line assembly is composed of a plurality of transmission lines disposed on the substrate. Each of the plurality of transmission lines is represented by a coordinate defined by the angular axis and the radial vector axis, either as a monotonically increasing line or as a monotonically decreasing line. An angular width of each of the plurality of transmission lines that does not exceed 2π radians by the number of transmission lines. The width of all transmission line assemblies does not exceed an angular width of 2π radians on any radial vector. A coupling pad is disposed on the center of the transmission line assembly and is capacitively coupled to each of the plurality of helical transmission lines.
In any of the above structures, the spiral transmission lines substantially identical to each other are disposed adjacent to each other. A slight microscopic edge effect occurs at the edge of each transmission line. However, from a macro perspective, the side edges of the transmission line may be disregarded. Therefore, current concentration at the edge of the transmission line is significantly alleviated, reducing power consumption. The coupling pads are capacitively coupled to each transmission line by an equal amount of capacitance, so all transmission lines have the same oscillation frequency for the lowest loss.
The coupling pad can be formed on the same plane as the transmission line assembly. This allows both the coupling pad and the transmission line to be prepared in substantially one step.
The coupling pad can be disposed to partially overlap the transmission line assembly with a dielectric member interposed between the coupling pad and the transmission line assembly. This provides a greater capacitance between the coupling pad and each transmission line, thereby allowing for a smaller coupling pad. This increases the flexibility of the design.
A substrate may be laminated on another substrate providing an input end and an output end, the coupling pad being connected to the electrode via the bumper, and the electrode being connected to one of the input terminal or the output terminal. The purpose of this configuration is to allow the chopper to be more densely structured.
In another aspect of the invention, a duplexer having a filter (either one or both of a transmitter filter and a receiver filter) according to any of the above features is provided. The duplexer is densely structured and has low insertion loss.
In another aspect of the invention, a communication device having a filter according to any of the above features or a duplexer as described above is provided. Communication devices have low insertion loss and provide improved communication quality for, for example, noise and transmission rates.
Simple illustration
Figure 1A is a plan view of a spiral transmission line.
Figure 1B is a plan view of a resonator incorporated in the filter of the present invention.
Figure 1C is a cross-sectional view of the filter.
Fig. 1D is an enlarged partial plan view of the filter.
Fig. 2A is a view showing an angular width of a transmission line.
Fig. 2B is a diagram showing a transmission line pattern with polar coordinate parameters on Cartesian coordinates.
Fig. 3A is a plan view of the resonator.
Figure 3B is a vertical cross-sectional view showing the distribution of electric and magnetic fields in the resonator.
Figure 3C is a vertical cross-sectional view showing the current density and the z component of the magnetic field in the resonator.
Fig. 4A is a plan view of another resonator.
Fig. 4B is a vertical sectional view showing the distribution of electric and magnetic fields in the resonator shown in Fig. 4A.
Fig. 4C is a vertical sectional view showing the current density and the z component of the magnetic field in the resonator shown in Fig. 4A.
Figure 5 is a vertical cross-sectional view of a plurality of microstrip transmission line assemblies used as a model.
Figure 6A is a magnetic field distribution diagram in the first model.
Figure 6B is a magnetic field distribution diagram in the second model.
Fig. 7A is a distribution diagram of the x component of the magnetic field in the first model.
Fig. 7B is a distribution diagram of the x component of the magnetic field in the second model.
Fig. 8A is a distribution diagram of the y component of the magnetic field in the first model.
Fig. 8B is a distribution diagram of the y component of the magnetic field in the second model.
Figure 9 is a graph of the y component of the magnetic field along the x-axis.
Figure 10 is a graph of current phase difference versus power loss.
Figure 11 is a plan view showing a plurality of spiral transmission line assemblies in the first embodiment of the present invention.
Fig. 12 is a perspective view of chopping according to the first embodiment.
Figure 13A is a plan view showing an improvement in the shape of the coupling pad.
Figure 13B is a plan view showing another modification of the shape of the coupling pad.
Figure 14A is a plan view showing an improvement in the coupling structure between the coupling pad and the plurality of helical transmission line assemblies.
Fig. 14B is a vertical sectional view taken along line AA of Fig. 14A.
Figure 15A is a plan view showing another modification of the coupling structure between the coupling pad and the plurality of helical transmission line assemblies.
Figure 15B is a vertical sectional view taken along line AA of Figure 15A.
Figure 16A is a plan view showing still another modification of the component coupling structure between the coupling pad and the plurality of spiral transmission lines.
Figure 16B is a vertical sectional view taken along line AA of Figure 16A.
Figure 17 is a perspective view of a filter in accordance with a second embodiment of the present invention.
Figure 18 is a perspective view of a filter in accordance with a third embodiment of the present invention.
Figure 19 is a perspective view of a filter in accordance with a fourth embodiment of the present invention.
Figure 20A is a plan view showing an improvement of the electrode connected to the coupling pad.
Fig. 20B is a vertical sectional view taken along line AA of Fig. 20A.
Figure 21A is a plan view showing another modification of the electrode connected to the coupling pad.
Figure 21B is a vertical sectional view taken along line AA of Figure 21A.
Figure 22 is a block diagram of a duplexer in accordance with the present invention.
Figure 23 is a block diagram of a communication device in accordance with the present invention.
The principle of the resonator used in the chopper according to the present invention will first be described with reference to Figs.
1B, 1C, and 1D are a top plan view, a cross-sectional view, and an enlarged partial cross-sectional view, respectively, each of which shows the configuration of the resonator. Referring to them, a dielectric substrate 1 is shown; a plurality of spiral transmission line assemblies 2 composed of eight spiral transmission lines open at both ends, which are disposed on the top surface of the dielectric substrate 1; the dielectric substrate has been covered. 1 The ground electrode 3 of the entire bottom surface. The spiral transmission lines are coincident with each other, and the inner circumference and the outer circumference of the wire assembly 2 are spirally wound around the dielectric substrate 1. Figure 1A shows one of eight spiral transmission lines. The width of each spiral transmission line is substantially equal to its skin depth.
Referring to Figure 2B, the structure of the plurality of helical transmission line assemblies 2 shown in Figures 1A-1D is now represented using polar coordinate parameters. All eight spiral transmission lines have a common vector radius r1 at the inner end and a common vector radius r2 at the outer end. In addition, the eight spiral transmission lines are regularly spaced along the angular axis. Referring to Fig. 2A, the angular width of each spiral transmission line is represented by Δθ = θ2 - θ1, where θ1 is the angle of the left end on a given vector radius, and θ2 is the angle of the right end. The number of spiral transmission lines is n = 8, which can be derived from Δθ 2π / 8 (= π / 4) radians. Referring again to Figure 2B, the angular width θw of the entire plurality of helical transmission line assemblies 2 at a given vector radius rk is within 2π radians.
The spiral transmission lines are inductively and capacitively coupled to each other to serve as a single resonator (resonant line).
The spiral transmission lines do not have to have a common vector radius r1 and r2, are regularly spaced along the angular axis, and need not coincide with each other, however, the above features will provide advantages in device characteristics as well as in the manufacturing process, as described below.
Fig. 3A schematically shows a plurality of helical transmission line assemblies 2, not each of which is shown separately. Figure 3B shows the distribution of electric and magnetic fields on assembly 2, as seen in the cross-section taken from line AA in Figure 3A, when the charge on the inner and outer ends is at a maximum. Figure 3C shows the average of the current density on each transmission line and the z component (perpendicular to the paper plane) of the magnetic field passing through each space between adjacent transmission lines.
Microscopically, the current density is large at each edge of the transmission line, as shown in Figures 3B and 3C. However, from a macro perspective, the edge effect is significantly alleviated because currents of the same magnitude and phase flow through adjacent transmission lines.
Figure 4 is a comparative example in which the width of each transmission line is increased to twice the skin depth. The concentration of current is more pronounced than in Figure 3, and the reduction in power loss is negatively affected.
The distribution of the electric and magnetic fields shown in Figures 3A-4C cannot be obtained without three-dimensional analysis, and three-dimensional analysis requires a large amount of calculation. The results of the static magnetic field simulation are described below, which relate to the distribution of magnetic fields generated by a plurality of line current sources.
(simulation model)
Figure 5 shows a simulation of a plurality of line current sources.
Model 1 (current has the same phase and amplitude) (k = 1, 2, ... 'n) model 2 (phase difference of current varies between 0 ° and 180 °, amplitude varies with sine wave) ik = A sin {2k-1)π/2n} (k=1, 2, ...'n} (calculation of the distribution of the magnetic field) The distribution of the magnetic field is calculated according to Biot-Savart's law.
The magnetic vector generated by the line current source flowing through the point (p) on the xy plane and defining the flow in the z direction is expressed by the following equation (1).
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Therefore, the distribution of the magnetic field generated by a plurality of line current sources in this simulation model is obtained by the following equation (2).
<maths><img file="TW507397B_D0002.tif" /></maths>
In the above equation (2), Pk(m) is a coordinate value of the mirror position of Pk with respect to the ground electrode. A minus sign indicates that the current is flowing in the opposite direction.
(calculated example) parameters
Number of transmission lines: n = 20 total line width: w <sub>0</sub> =0.5mm substrate thickness h <sub>0</sub> =0.5mm line current source coordinate value xk=[{(2k-1)/2n}-(1/2)]w <sub>0</sub> Yk=h <sub>0</sub> (k-1, 2, ... 'n) Figs. 6A and 6B show the distribution of the magnetic fields of the model 1 and the model 2, respectively. Referring to Figures 6A and 6B, the vertical auxiliary line and the horizontal auxiliary line respectively represent the edges of the plurality of helical transmission line assemblies and the substrate surface. In Model 2, the isophase lines are not dense in both the x and y directions, so the power loss is smaller.
7A and 7B show the x component of the magnetic field in Model 1 and Model 2, respectively. Referring to Figures 7A and 7B, the vertical auxiliary line and the horizontal auxiliary line respectively represent the edges of the plurality of transmission line assemblies and the substrate surface. Model 2 provides better isolation and is therefore advantageous to integrate in, for example, a chopper.
8A and 8B show the y component of the magnetic field of Model 1 and Model 2, respectively. Referring to Figures 8A and 8B, the vertical auxiliary lines respectively represent the edges of the plurality of transmission line assemblies and the substrate surface. In Model 2, the concentration of the magnetic field at the edge of the transmission line is not strong, so the power loss is small.
When the phase difference of the current flowing through the adjacent transmission line at any point of the transmission line is the smallest, the suppression of the edge effect as above is maximized. Figure 10 shows the relationship between phase difference and power loss. The oscillation energy is most effectively maintained when the phase difference is 0°. The decrease in power loss when the phase difference is 90° is offset by the reactance current. When the phase difference is ±180°, the oscillation energy is reduced. Therefore, the range of ±45 is considered to be the effective range.
The principle of the design of a planar circuit resonator can be summarized as follows.
(1) A plurality of transmission lines that are identical to each other and insulated from each other are provided in a rotationally symmetric manner. Therefore, the physical length, electrical length and oscillation frequency of each transmission line are the same. Further, the iso-phase lines on the surface of the substrate are distributed such that concentric circles are formed, and electromagnetically, the edges are substantially absent, and thus the power loss caused by the edge effect is remarkably suppressed.
(2) The phase difference of the current flowing through the adjacent transmission line at any point of the transmission line should be minimized. The width of each transmission line and the spacing between adjacent transmission lines should be as small as possible and should be substantially constant at any point without any sudden bending. Each transmission line should be such that one part does not touch another part.
(3) The width of each transmission line should be no more than its skin depth. The magnetic fields at the edges of adjacent transmission lines interfere with each other such that the effective current is increased and the reactance current is reduced, thereby reducing power loss.
Next, the structure of a chopper according to a first embodiment of the present invention will be described with reference to Figs.
Figure 11 is an enlarged plan view of a plurality of helical transmission line assemblies 2. A coupling pad 9 is provided on the center of the assembly 2, which is an electrode coupled to the assembly 2. The spiral transmission lines of the assembly 2 are identical to each other and are arranged rotationally symmetrically with respect to each other on a specific point on the substrate so as not to intersect each other. The coupling pad 9 is a circle around a specific point and is not adjacent to any one of the spiral transmission lines. Thus, the coupling pad 9 is coupled to each inner end of the spiral transmission line by an equal amount of capacitance. The coupling coefficient between the assembly 2 and the coupling pad 9 depends on the radius of the coupling pad 9 and the gap between the coupling pad 9 and the assembly 2. The radius and clearance are determined by providing the coupling system required for a particular chopper.
Figure 12 is a perspective view of the entire chopper. Referring to Fig. 12, three sets of spiral transmission line assemblies 2a, 2b, and 2c are provided on the top surface of the dielectric substrate 1, and the substrate 1 may be, for example, an alumina ceramic substrate or a glass epoxy substrate. At the centers of the two head assemblies 2a and 2b, coupling pads 9a and 9b are formed, respectively. Solder pads 10a and 10b are also formed on the top surface of the dielectric substrate 1. The entire bottom surface of the dielectric substrate 1 is covered by the ground electrode 3a.
The dielectric substrate 1 is fixed to the substrate 6, which is either insulated or dielectric. On the substrate 6, input and output terminals 12a and 12b are formed, each of which extends from the top surface to the bottom surface thereof. Except where the input and output terminals 12a and 12b are formed, the entire bottom surface of the substrate 6 is substantially covered by the ground electrode 3b.
The coupling pads 9a and 9b are wire-bonded to the solder pads 10a and 10b, respectively, via the soldering leads 11a and 11b. Further, the solder pads 10a and 10b are wire-bonded to the input and output terminals 12a and 12b, respectively, via the soldering leads 11c and 11d. The electromagnetic shield, the dielectric substrate 1 and the solder leads 11a to 11d are covered by a metal cover 13 soldered to the top surface of the substrate 6 with an insulating flux. In Figure 12, the cover 13 is depicted in perspective.
According to the above structure, the coupling pad 9a is capacitively coupled to the plurality of spiral transmission line assemblies 2a. The plurality of helical transmission line assemblies 2a are inductively coupled to the plurality of helical transmission line assemblies 2c in the middle, thereby being inductively coupled to the plurality of helical transmission line assemblies 2b at the other end. A plurality of helical transmission line assemblies 2b are capacitively coupled to the coupling pads 9b. Input and output terminals 12a and 12b are electrically coupled to coupling pads 9a and 9b, respectively. Thus, filtering the coupling pads 9a and 9b between the input and output terminals 12a and 12b in accordance with the band pass characteristics determined by the three resonators may eliminate the need for the coupling pads 10a and 10b on the dielectric substrate 1. Directly coupled to the input and input terminals 12a and 12b.
In addition to the coupling pads 9a and 9b, a solder pad may be provided at the center of the plurality of spiral transmission line assemblies 2c to set the oscillation frequency of each of the components 2a, 2b and 2c.
Instead of the coupling pads 9a and 9b, capacitively coupled electrodes may be provided on the outer and adjacent positions of the outer circumferences of the components 2a and 2b, respectively.
13 to 16 show a modified example of the coupling structure between the plurality of helical transmission line assemblies 2 and the coupling pads 9, which function to provide a larger coupling capacitance between the assembly 2 and the coupling pads 9.
13A and 13B show a modification in which the shape of the coupling pad is changed. In Fig. 13A, the coupling pad is zigzag so that the gap with the assembly 2 is narrowed. In Fig. 13B, the teeth of the coupling pad 9 further extend into the space between adjacent pairs of helical transmission lines constituting the assembly 2.
14A to 16B show a modification in which a dielectric film 14 is provided between the assembly 2 and the coupling pad 9.
In Fig. 14A, a dielectric film 14 is formed around the coupling pad 9 and extends into a space between adjacent one end portions of the pair of spiral transmission lines. Fig. 14B shows a vertical sectional view taken along line AA of Fig. 14A. On the other hand, the dielectric film 14 can be formed around the coupling pad 9 to extend over the entire area where the component 2 is formed.
In Fig. 15A, a dielectric film 14 is formed in a circular shape covering the inner portion of the spiral transmission line, and a coupling pad 9 is formed on the dielectric film 14. Fig. 15B is a vertical sectional view taken along line AA of Fig. 15A.
In FIG. 16A, a coupling pad 9 is formed on a substrate in a circular shape to form a dielectric film 14 along an annular shape covering the circumference of the coupling pad 9, and a plurality of spiral transmission lines are formed on the substrate, through the dielectric film. 14 covers the circumference of the coupling pad 9. Fig. 16B is a vertical sectional view taken along line AA of Fig. 16A.
Next, a configuration of a filter according to a second embodiment of the present invention will be described with reference to FIG.
Referring to Fig. 17, three sets of a plurality of spiral transmission line assemblies 2a, 2b and 2c are disposed on the top surface of the dielectric substrate 1. At the center of the tip assemblies 2a and 2b, coupling pads 9a and 9b are formed, respectively. Solder pads 10a and 10b are also formed on the outer circumference of each of adjacent components 2a and 2b. The entire bottom surface of the dielectric substrate 1 is covered by the ground electrode 3a. The dielectric substrate 1 is fixed to the substrate 6, which is either insulated or dielectric. On the substrate 6, input and output terminals 12a and 12b are formed, each of which extends from the top surface to the bottom surface thereof. Except where the input and output terminals 12a and 12b are formed, the entire bottom surface of the substrate 6 is substantially covered by the ground electrode 3b.
Unlike the first embodiment shown in Fig. 12, the solder pads 9a and 9b are wire-bonded to each other via the solder leads 11e. Solder pads 10a and 10b are wire-bonded to input and output terminals 12a and 12b via solder leads 11c and 11d. The dielectric substrate 1 and the soldering leads 11a to 11d are covered by a metal cover 13 provided on the top surface of the substrate 6.
Coupling pads 9a and 9b are capacitively coupled to a plurality of helical transfer line assemblies 2a and 2b, respectively, and solder pads 10a and 10b are also capacitively coupled to a plurality of spiral transmission line assemblies 2a and 2b. Thus, the plurality of helical transmission line assemblies 2a and 2b are capacitively reacted, thereby attenuating components of a predetermined frequency.
On the other hand, it may be arranged such that the solder pads 10a and 10b are wire-bonded to each other, and the coupling pads 9a and 9b are wire-bonded to the input and output terminals 12a and 12b, respectively. It can also be arranged that either the input or the output is coupled to the other end by a coupling pad, the solder pad is connected to the input or output, and at the other end, the coupling pad is connected to the input. Or the output, using a solder pad to couple with the other end.
Next, a configuration of a filter according to a third embodiment of the present invention will be described with reference to FIG.
Referring to Fig. 18, three sets of a plurality of spiral transmission line assemblies 2a, 2b, and 2c are disposed on the top surface of the dielectric substrate 1. At the center of the tip assemblies 2a and 2b, coupling pads 9a and 9b are formed, respectively. On the dielectric substrate 1, input and output terminals 12a and 12b are also formed, each of which extends from its side to its bottom surface. The side surface and the bottom surface of the dielectric substrate 1 are substantially covered by the ground electrode 3a. Through holes 15a and 15b are formed through the dielectric substrate 1 for electrically connecting the coupling pads 9a and 9b to the input and output terminals 12a and 12b, respectively. An upper substrate 16 is also provided which is either insulative or dielectric, with its top and sides covered by a ground electrode 3c. By laminating the dielectric substrate 1 and the upper substrate 16 together as indicated by the arrows, three multi-spiral transmission line assemblies 2a, 2b and 2c are sandwiched therebetween, whereby the ground electrodes 3a and 3c are covered. Each of the transmission lines constituting the components 2a, 2b, and 2c functions as a ribbon transmission line. Thus, the signal is filtered between the input and output terminals 12a and 12b in accordance with the bandpass characteristics determined by the three resonators.
Next, a configuration of a filter according to a fourth embodiment of the present invention will be described with reference to FIG.
Referring to Fig. 19, three sets of a plurality of spiral transmission line assemblies 2a, 2b, and 2c are disposed on the top surface of the dielectric substrate 1. At the center of the tip assemblies 2a and 2b, coupling pads 9a and 9b are formed, respectively. On the top of the coupling pads 9a and 9b, conductive bumps 17a and 17b are formed, respectively. The side surface and the bottom surface of the dielectric substrate 1 are substantially covered by the ground electrode 3a. An upper substrate 16 is also provided (when mounted on the mounting plate, the top surface of the upper substrate 16 will function as a mounting surface). On the upper substrate 16, input and output terminals 12a and 12b are formed extending from the top surface thereof to the side surfaces thereof. The top surface and the side surface of the upper substrate 16 are covered by the ground electrode 3c except where the input and output terminals 12a and 12b are formed. On the bottom surface of the upper substrate 16, electrodes which are in contact with the bumps 17a and 17b are formed. The through holes 15a and 15b are formed through the upper substrate 16, and the electrodes are electrically connected to the input and output terminals 12a and 12b.
By laminating the dielectric substrate 1 and the upper substrate 16, the electrodes on the bottom surface of the upper substrate 16 are electrically connected to the coupling pads 9a and 9b via the bumps 17a and 17b, respectively. Thus, the signal between the input and output terminals 12a and 12b is filtered in accordance with the band pass characteristics determined by the three resonators.
Next, a modified example of the electrode connected to the coupling pad will be described with reference to Figs.
In FIG. 20A, a plurality of spiral transmission line assemblies 2 are formed on a dielectric substrate 1, such that a dielectric film 14 is formed to cover the inner end portion of the assembly 2 and extend beyond the outer end of the assembly 2 in one direction. On the dielectric film 14, a coupling pad 9 and an outer liner 18 extending therefrom are formed. Fig. 20B is a vertical sectional view taken along line AA of Fig. 20A.
In FIG. 21A, a coupling pad 9 and an outer liner 18 extending therefrom are formed on a dielectric substrate 1. The dielectric film 14 is formed so as to cover the outer end portion of the coupling pad 9 and the portion extending between the coupling pad 9 and the outer pad 18, and a plurality of spiral transmission line assemblies 2 are formed on the dielectric film 14. Fig. 21B is a vertical sectional view taken along line AA of Fig. 21A.
In the above structure, the coupling pad 9 is capacitively coupled to the inner end portion of the assembly 2, the outer pad 18 is used as an input or output terminal, or the electrode for electrically connecting the coupling pad 9 to the input or output terminal. Thus, there is no need to provide a space for the soldering leads, eliminating the complicated process of preparing the vias.
Figure 22 is a block diagram showing the structure of a duplexer according to the present invention. The duplexer includes a receive filter and a transmit filter, and each of the receive or transmit filters is constructed by mounting any of the above embodiments. A line for multiplexing the transmission signal and the reception signal and the reception signal, and input and output terminals are disposed on the substrate 6. A dielectric substrate of a transmission filter and a dielectric substrate of a reception filter are disposed on the substrate 6. Coupling pads associated with the input and output resonators of each filter are wire bonded to the multiplexed lines and input and output terminals disposed on the substrate 6. Therefore, interference between the transmitted signal and the received signal can be blocked, only the transmitted signal within the transmit band is fed to the antenna, and only the received signal within the receive band is fed to the receiver circuit.
Figure 23 is a block diagram showing the configuration of a communication device in accordance with the present invention. The communication device is equipped with a duplexer as described above. The transmitter circuit and the receiver circuit are disposed on the circuit board. The duplexer is mounted on the circuit board such that the transmitter circuit is connected to the TX terminal, the receiver circuit is connected to the RX terminal, and the antenna is connected to the ANT terminal.
Every citation, both ways
| Document | Relation | Office | Cited during |
|---|---|---|---|
| TWI449329B | Cited by | Taiwan Province of China | Examiner |
9 members in 6 offices
Priority claims4
| Document | Office | Kind | Date |
|---|---|---|---|
| 11348011 | Japan | – | |
| 34801199 | Japan | A | |
| 19990348011 | – | – | – |
| JP19990348011 | – | – | – |
Members9
| Document | Office | Kind | |
|---|---|---|---|
| US2001002806A1 | United States of America | A1 | |
| EP1109246A1 | European Patent Office (EPO) | A1 | |
| JP2001168610A | Japan | A | |
| KR20010062223A | Republic of Korea | A | |
| CN1305242A | China | A | |
| TW507397BThis record | Taiwan Province of China | B | |
| US6501345B2 | United States of America | B2 | |
| KR100431877B1 | Republic of Korea | B1 | |
| CN1159797C | China | C |
2 legal events, as the office reported them to INPADOC
Over the term
Point at a mark for the eventEvents
| Event | Code | |
|---|---|---|
| Annulment or lapse of patent due to non-payment of feesLapsedMM4A | MM4A | |
| Issue of patent certificate for granted invention patentGrantedGD4A | GD4A |
Numbers
- Publication
- 507397
- Publication, DOCDB
- 507397
- Publication, EPODOC
- TW507397B
- Application
- 89123266
- Application, DOCDB
- 89123266
- Application, EPODOC
- TW20000123266
Titles5
- Chinese
- 濾波器、雙工器及通訊裝置
- English
- FILTER, DUpLEXER, AND CONMUNICATIONSDEVICE
- English
- Filter, duplexer, and communications device
- Unlabeled
- 濾波器、雙工器及通訊裝置
- Unlabeled
- Filters, duplexers and communication devices
Classification
- CPC, 5
- H01P1/20381
- H01P1/203
- H01P1/2135
- H01P7/005
- H01P7/082
- IPC, 5
- H01P1 203
- H01P1 213
- H01P5 08
- H01P7 00
- H01P7 08