PL2991944T3

Substrate provided with a stack having thermal properties

Abstract

This record has no abstract on file.

Term

7.6 yearsto projected expiry

Projected expiry 28 April 2034, counted from filing; an application has no term until it is granted.

  1. Priority
  2. Filed
  3. Published
  4. Today
  5. Projected expiry

23 members in 14 offices

This recordMember, by publication datePriority claim4 more offices are in the list below

Priority claims10

Priority claims
DocumentOfficeKindDate
1353972FranceA
1353972FranceA
14726182European Patent Office (EPO)A
2014051013FranceW
2014051013FranceW
1353972
147261820
EP20140726182
FR20130053972
WO2014FR51013

Members23

Family members, oldest first
DocumentOfficeKind
FR3005048A1FranceA1
WO2014177798A1World Intellectual Property Organization (WIPO)A1
CN104619669AChinaA
KR20160004280ARepublic of KoreaA
MX2015015046AMexicoA
EP2991944A1European Patent Office (EPO)A1
US2016124119A1United States of AmericaA1
JP2016520031AJapanA
CN104619669BChinaB
RU2015150968ARussian FederationA
BR112015026239A2BrazilA2
US9846264B2United States of AmericaB2
RU2015150968A3Russian FederationA3
RU2656284C2Russian FederationC2
JP6510491B2JapanB2
EP2991944B1European Patent Office (EPO)B1
PT2991944TPortugalT
PL2991944T3This recordPolandT3
KR102143824B1Republic of KoreaB1
ES2779726T3SpainT3
HUE048805T2HungaryT2
FR3005048B1FranceB1
BR112015026239B1BrazilB1