Thermal resistor fluid ejection assembly

Description

BACKGROUND

[0001] An inkjet printer is an example of a fluid ejection device that provides for the ejection of a fluid drop in a drop-on-demand (DOD) mode. In typical DOD inkjet printers, the print heads eject droplets of fluid (e.g., ink) through a plurality of nozzles, towards a print medium, such as a sheet of paper, to print an image on the print medium. The nozzles are typically arranged in one or more rows such that an appropriate sequence of ejecting ink from the nozzles causes a mark or other images to be printed on the print medium as the printhead and print medium move relative to each other.

[0002] One example of a DOD printer is a thermal inkjet (TIJ) printer. In a TIJ printer, the printhead includes a resistance heater in a fluid-filled chamber that vaporizes the fluid to form a rapidly growing bubble that pushes the droplet through the printhead nozzle. The electric current flowing through the heating element creates heat that evaporates some of the fluid inside the chamber. As the heating element cools, the steam bubble collapses, drawing more fluid from the reservoir into the chamber, allowing another drop to be ejected through the nozzle.

[0003] Unfortunately, the thermal and electrical failures of the TIJ printhead ejection mechanism (ie, overheating the fluid to create a vapor bubble) result in a number of drawbacks that add cost and degrade the overall print quality of TIJ printers. One disadvantage, for example, is the reduction of the ejection efficiency with the operating time of the jet ink pen due to build-up of deposits (kogi) on the ejection surface of the resistance heater. Another disadvantage, when increasing droplet rate or ejection speed (e.g., to increase image resolution while maintaining page print speed), is that the printhead may overheat, creating a vapor jam condition, preventing further ink ejection and potentially damaging the the print head. Another disadvantage is that the large electronics and power rails that power the thermally inefficient resistance heater element take up costly space on the silicon substrate in the TIJ print head.

US 2002/130924 A1 describes a structure for an bubble-type inkjet print head. The nozzle plate is positioned at a predetermined distance from the ground and is perforated by a predetermined number of nozzle holes. The structure is surrounded by walls inside which a common ink chamber is formed. There are a series of retainers on the ground beneath each nozzle opening. One of the retaining elements surrounds the edge of the nozzle opening, while the other is directly below the perforation. During operation of the printhead, the surrounding element forms a toroidal bubble, creating a virtual or virtual chamber inside the toroid, separate from the rest of the common chamber. After creating a toroidal bubble, the resistor under the perforation forms a larger bubble which ejects ink through the nozzle orifice.

JP H08 300660 A discloses an inkjet write head.

US 6,454,397 B1 discloses an inkjet head and a method for controlling it.

JP 2002-067321 A discloses an inkjet head suitable for containing a plurality of heating resistors arranged and disposed on an insulating substrate having an enamel layer.

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ΕΡ 2 910 380 Β1

JP -1306-134988 A discloses a bubble inkjet printhead comprising an insulating substrate on which heating resistors are made, the insulating substrate being comb-shaped.

SHORT DESCRIPTION OF THE DRAWING FIGURES

[0004] The present embodiments will be described by way of example with reference to the accompanying drawing figures in which:

FIG. 1 shows an example of an inkjet pen suitable for use with a fluid ejection assembly according to the embodiment;

FIG. 2A shows a cross-sectional view of a portion of the fluid ejection assembly according to the embodiment;

FIG. 2B is a cross-sectional view of a portion of the fluid ejection assembly of FIG. 2A, rotated 90 degrees according to an embodiment;

FIG. 2C shows a cross-sectional view of a portion of the fluid ejection assembly in use according to an embodiment;

FIG. 2D shows resistance heating elements electrically connected in series in a portion of an electrical circuit, according to an embodiment;

FIG. 3 shows an enlarged cross-sectional view of an example of a portion of a three-dimensional retaining structure according to an embodiment;

FIGURES 4A, 4B and 4C are top views of a stop structure having a different number of stop members according to an exemplary embodiment;

FIG. 5 is a plan view of a retaining structure with abutments whose widths are not the same as the spacing between members, according to an exemplary embodiment;

FIGURES 6A, 6B, 6C, and 6D are plan views of abutments with a plurality of different abutment width configurations and spacing, according to an exemplary embodiment;

FIGURES 7A, 7B and 7C show a cross-sectional view of a shoulder structure with different values ​​of the height of the comb teeth, according to an exemplary embodiment;

FIG. 8 is a cross-sectional view of a support structure whose comb teeth have chamfered corners, according to an exemplary embodiment;

FIG. 9 is a block diagram of a basic fluid ejection device according to an embodiment.

DETAILED DESCRIPTION

Summary of the problem and solution

[0005] As mentioned above, thermal inkjet (TIJ) printers suffer from various drawbacks generally related to thermal and electrical inefficiencies in the ejection mechanism of a TIJ printhead. The thermal and electrical inefficiencies are more specifically depicted as temperature heterogeneity along the nucleating surface of the TIJ resistance heating element (i.e. the contact point of the resistor / fluid where the formation of the vapor bubble takes place), which results in the need to supply more energy to the heating element. However, increasing the energy supply

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The 2 910 380 Β1 ejector to the resistance heater TIJ, in order to overcome the problem of temperature heterogeneity, presents various other problems.

[0006] One such problem affects the droplet rate of fluid (i.e., ejection speed) of the TIJ printhead. A higher ejection rate is beneficial as it allows for higher image resolution, faster page printing, or both. However, ineffective energy transfer from the nucleation surface of the resistance heater TIJ to the fluid (e.g., ink) results in residual heat which raises the temperature of the printhead. Increasing the frequency of droplet ejection increases the amount of energy that is delivered to the heating element over a given period of time. Thus, the additional residual heat created by increasing the droplet ejection frequency accordingly raises the temperature of the printhead, ultimately creating a vapor lock condition (overheating), preventing further ink ejection and potentially damaging the printhead. Accordingly, ineffective energy transfer from the surface of the resistance heating element to the ink results in the need to limit or reduce the frequency of droplet ejection, which is a significant drawback, for example, for the publishing market where high speeds are required.

[0007] The ineffective energy transfer from the surface of the TIJ resistance heater to the ink also increases the overall cost of the inkjet-printing systems. Large FETs and power rails are required to provide more energy to drive large TIJ thermally inefficient resistor assemblies. The large jigs and rails not only take up valuable space on the silicon substrate, but also the associated parasitic elements ultimately limit the miniaturization of the printhead matrix. Thus, the greater wear of the silicon surface required for inefficient TIJ resistors means that silicon still accounts for a significant percentage of the total cost of many inkjet printing systems.

[0008] Increasing the ejection energy in a TIJ resistor to overcome temperature heterogeneity along its nucleation surface also raises another problem with the resulting higher surface temperatures of the TIJ resistor. Although the overall temperature rise at the nucleation surface preserves some desirable characteristics of the ejected fluid drop, such as drop weight, drop velocity, drop trajectory, and droplet shape, it adversely increases kogation. Kogacja is the accumulation of sediment (kogi) on the surface of the resistor. Over time, kogation adversely affects fluid droplet characteristics, such as droplet weight, droplet velocity, droplet trajectory, and droplet shape, and ultimately reduces overall print quality on TIJ printing systems.

[0009] Solutions to the problems of thermal inefficiency and heterogeneity in the prior art TIJ resistance heating elements include changing both the TIJ resistor and the ejected fluid (ink). However, such solutions have disadvantages. For example, the design of the suspended resistor allows both sides of a thin film immersed resistor to be heated, improving heat / energy transfer by increasing the surface area of ​​the resistor in contact with the fluid. However, the sensitive thin-film matrix may not withstand exposure to violent nucleation during droplet ejection and requires special manufacturing processes that increase costs. Another example is a toroidal-shaped resistor with the middle zone removed, allegedly improving the resistor's performance and removing hot spots typical of TIJ resistors. However, the variation in the length of the electric paths necessary for the curved geometry of the toroid results in problems of current density and homogeneity.

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ΕΡ 2 910 380 Β1 current density, which ultimately leads to hot spots which cause temperature heterogeneity along the resistor. The prior art solutions to kogation mainly involve adjusting the ink composition to obtain a chemical composition that is less reactive with the operation of the printhead. However, this solution significantly increases cost while reducing the number of fluids / inks available for use in TIJ printheads, which ultimately limits the market for printing products for TIJ printing systems.

[0010] Embodiments of the present disclosure help overcome the drawbacks of TIJ devices (e.g., thermal and electrical inefficiencies) of temperature heterogeneity along the nucleation surface of a TIJ resistor, generally due to a TIJ resistor structure that employs a plurality of parallel resistors whose widths and distances are between them are individually selected to obtain a uniform temperature along the nucleation surface. The resulting TIJ retaining structure is a three-dimensional structure with recesses or channels provided between the individual crests or teeth of the comb. The three-dimensional surface and the variable widths and spacing of the resistors improve the temperature uniformity along the nucleation surface of the TIJ resistor, as well as increase the nucleation surface area per unit area of ​​the resistor material. The larger nucleation surface area and improved temperature uniformity along the nucleation surface improve the efficiency of energy or heat transfer between the TIJ resistive structure and the fluid. In turn, the improved thermal efficiency and uniformity reduces the amount of energy required to eject each drop of fluid, which has many advantages including, for example, the ability to increase the frequency of droplet ejection without inducing a vapor plug condition, the ability to reduce the FET and width of the supply rails, allowing for bolder miniaturization and cost reduction of silicon, and reduced cogation, which improves droplet ejection efficiency during TIJ printhead operation.

[0011] In one embodiment, the fluid ejecting heating resistor assembly comprises an insulating substrate with first and second electrodes provided on the substrate. A plurality of individual resistance elements of different width are arranged in parallel on the substrate and electrically connected with a first end to the first electrode and at least a second end to the second electrode.

[0012] In another embodiment, the fluid ejection device includes a fluid ejection assembly including a stop structure with a plurality of stop elements. The resistive structure is formed as an upper layer with an uneven nucleation surface having protruding ridges separated by recessed channels for evaporating the fluid upon heating of the resistors. The width of each protruding ridge corresponds to the associated resistance element lying below the nucleation surface.

[0013] In another embodiment, the heating resistor structure comprises a plurality of parallel-connected resistance elements of different widths. Each stop is spaced from the next. A thin cavitation layer is formed over the stop elements and the spacing between them, so that a ridge is formed over the stop element and a channel is formed over each gap, the cavitation layer forms a nucleation surface, transferring heat from the stop element to vaporize the fluid in the chamber and eject a drop of fluid from the chamber.

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EP 2 910 380-1 Illustrative Embodiments

[0014] In FIG. 1 shows an example of an inkjet pen 100 suitable for use with the fluid ejecting assembly 102 of the embodiment disclosed herein. In this embodiment, fluid ejection assembly 102 is disclosed as a printhead 102 ejecting a droplet of fluid. The inkjet pen 100 includes a pen cartridge body 104, a printhead 102, and electrical contacts 106. Individual fluid drop generators 200 (e.g., see FIG. 2) inside printhead 102, electrical signals are supplied by contacts 106 to eject fluid droplets from selected nozzles 108. The fluid may be any suitable fluid used in the printing process, such as various printing fluids, inks, premixes, fixers and the like. In some examples, the fluid may be a fluid other than a printing fluid. The pen 100 may contain its own source of fluid within the cartridge body 104 or it may receive fluid from an external source (not shown), such as, for example, a fluid reservoir connected to the pen 100 by a tube. The feathers 100 containing their own fluid sources are typically discarded when the fluid source is exhausted.

[0015] In FIG. 2A is a cross-sectional view of a portion of the fluid ejection assembly 102 in accordance with an embodiment of the disclosure. In FIG. 2B is a cross-sectional view of the same portion of the fluid ejection assembly 102 of FIG. 2A, rotated 90 degrees according to an embodiment of the disclosure. Part of the fluid ejection assembly 102 is shown as a single fluid drop generator assembly 200. The fluid drop generator assembly 200 includes a rigid lower substrate 202 and a rigid (or resilient) nozzle top plate 204 that has a nozzle outlet 206 through which fluid droplets are ejected. Substrate 202 is typically a silicon substrate that has an oxide layer 208 on its top surface. The thin multilayer 210 generally includes an oxide layer, a metal layer defining a plurality of individual resistance heating / ejection elements 212, tracks 214 of conductive electrodes (FIG. 2B), passivating layer 216, cavitation layer 218 (e.g., tantalum). The thin multilayer 210 forms a three-dimensional abutment structure 300 with recesses or channels formed between the individual ridges or teeth of the comb, which is described in more detail with reference to FIGURES 3 to 8.

[0016] The fluid drop generator assembly 200 also includes a series of sidewalls, such as sidewalls 220A and 220B, labeled together as sidewalls 220. The sidewalls 220 separate the lower substrate 202 from the nozzle plate 204. Lower substrate 202, nozzle plate 204 and walls side 220 define a fluid chamber 222 that contains fluid for fluid droplet ejection through the mouth of the nozzle 206. In sidewall 220B is a fluid inlet 224 receiving fluid that eventually discharges as droplets through the nozzle outlet 206. The location of fluid inlet 224 is not limited to sidewall 220B. In other embodiments, for example, the fluid inlet 224 may be located on the other side walls 208 or the lower substrate 202, or there may be multiple fluid inlets located on the various side walls 220 or substrate 202.

[0017] In FIG. 2C is a cross-sectional view of a portion of the fluid ejection assembly 102 in use according to an embodiment of the disclosure. In operation, the drop generator 200 ejects fluid droplets 226 through the nozzle 206 by passing an electric current through the resistors 212. The individual resistors 212 are electrically connected in parallel between the conductive paths of electrodes 214 as generally shown in the electrical circuit diagram of FIG. 2D. The current 232 flowing through the resistors 212 generates heat i

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ΕΡ 2,910,380 Β1 vaporizes a small portion of the fluid 226 on the surface of the counter structure 300 (i.e., the contact between the tantalum cavitation layer 218 and the fluid near the resistance heating elements 212 where vapor bubble formation occurs) inside the ejection chamber 222. When a current pulse is applied, the heat created by the stops 212, forms a rapidly expanding vapor bubble 228 which pushes a small drop of fluid 230 through the nozzle 206 of the ejection chamber. As the resistors 212 cool, the vapor bubble collapses rapidly, drawing more fluid 226 through the inlet 224 into the ejection chamber 222, allowing another droplet 226 to be ejected through the nozzle 206.

[0018] In FIG. 3 is an enlarged cross-sectional view of an example of a portion of a three-dimensional retaining structure 300, according to an embodiment of the disclosure. The number of stop elements 212 within a given support structure 300 is different. Although a significant improvement in temperature homogeneity along the nucleation surface of the abutment structure 300 has been achieved by using the abutment structure 300 with 6 or 7 abutments 212 (resulting in a significant improvement in thermal and electrical efficiency), the number of elements 212 in the structure 300 may well exceed this range, depending on the required nucleation surface area, as well as the choice of width, spacing and height of the abutments.

[0019] There is a gap 302 between each stop 212 in the support structure 300. Generally, the width 304 of each stop 212 and the gap 304 between each 212 are different. The widths of the stop elements 212 and the spacing 302 naturally vary with the number of elements 212 present in the structure 300. For example, for a given retaining structure 300 with a specific width, as the number of elements 212 in the structure 300 increases, the width of the elements 304 and / or the spacing 302 between the elements 212 decreases. Additionally, however, the width of the elements 304 and the gaps 302 may also vary individually along the structure 300 in a manner that is independent of the number of elements 212 in the structure 300. For example, in a retaining structure 300 that includes 7 thrust members 212, individual or all of the 7 members may have widths 304 that differ from each other. Similar to the individual stop elements 212, the size of the gaps 302 between the stop elements 212 may also vary individually along the structure 300 in a manner that is independent of the number of elements 212 in the structure 300. Moreover, each counter element 212 present in the counter structure 300 forms a comb tooth structure which has a height 306 which also varies. Thus, there are three variable dimensions in the retaining structure 300. They include the width of each stop 212, the spacing 302 between each stop 212, and the height 306 of each comb tooth structure associated with each stop 212.

[0020] Generally, the varying member widths, spacing and height along the abutment crest provide a tailored heat profile. Different numbers of stop elements 212, different widths 304 and spacing 302 between the stop elements 212, and different heights 306 of the comb teeth improve the thermal energy transfer efficiency between the stop elements 212 and the fluid 226, and allow a significant degree of control over the temperature distribution along the nucleation surface of the resistance structure 300. so that temperature homogeneity can be maximized. More specifically, as shown in FIG. 3, the three-dimensional resistive structure 300 increases the value of the nucleation area 308 relative to the entire surface area of ​​the resistors 212, which increases the amount of energy transferred to the fluid 226 (and reduces energy loss as heat).

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EP 2 910 380 Β1 residual in the print head). The increased value of the nucleation area 308 and the ability to control its distance from the active resistors 212 (i.e., by varying the width 304, the spacing 302, and the height 306 of the comb teeth) provide great control over thermal energy distribution and temperature uniformity along the entire surface of the support structure 300.

[0021] The specific and relative dimensions of the width 304 and the spacing 302 between the abutments 212 and the height 306 of the comb teeth, improving the thermal efficiency and temperature uniformity along the surface of the abutment structure 300, have a different effect on the fluid droplet ejection efficiency of the drop generator 200. For example, the ejection performance of a drop of fluid (i.e. desired drop weight, drop velocity, drop trajectory, drop shape) typically improve with decreasing width 304 and spacing 302 between thrust members 212. Currently, the range is between 0.25 and 3.00 micrometers (pm) for both width 304 of the thrust member 212 as well as the spacing 302 between elements provide the greatest performance benefit. The current height range 306 providing a significant impact is between 0.25 pm and 1.00 pm. However, these ranges should not be considered limiting and a larger range (e.g., a lower restriction) is provided as related manufacturing techniques improve. Thus, major advantages may exist even for smaller dimensions such as, for example, about 0.1 µm.

[0022] FIGURES 4A, 4B, and 4C are top views of support structures 300 having a different number of stop members 212, in accordance with embodiments of the disclosure. As stated above, abutment structures 300 depicted with the number of abutment elements 212 are merely examples and are not intended to limit the number of elements 212 that may be present in the abutment structure 300. Thus, the number of items 212 in each structure 300 may be greater than the provided examples. Correspondingly, for example, the retaining structure 300 in FIG. 4A has two stop members 212. In FIGURES 4B and 4C, the support structures 300 have three and four stoppers 212, respectively. In addition to showing that the retaining structures 300 may have a different number of retaining members 212, FIGURES 4A-4C are intended to show how the width 304 of the members 212 and the spacing 304 between the members vary depending on the number of members 212 present in the structure 300. As it increases, from two to four, the number of stop elements 212 decreases in width 304 and spacing 302 between elements 212.

[0023] Although the support structures 300 in FIGURES 4A-4C show examples where the widths 304 of the elements 212 and the gaps 302 are equal, in other embodiments, the widths 304 and the gaps 302 are different. For example, FIG. 5 is a plan view of a retaining structure 300 with abutments 212 whose widths 304 are not the same as the gaps 302 between the members 212, according to an embodiment of the disclosure. In this example, all the widths 304 of the elements 212 are equal and all the gaps 302 between the elements 212 are equal, but the widths are not equal to the gaps. Specifically, the widths 304 of the elements are wider than the gaps 302. However, in other embodiments, the widths 304 of the elements 212 are narrower than the gaps 302 between the elements.

[0024] FIGURES 6A, 6B, 6C, and 6D are a top view of a retaining structure 300 with a plurality of different configurations of the width 304 of the stop members 212 and the spacing 302 between the elements, in accordance with embodiments of the disclosure. In the embodiment shown in FIG. 6A, the seven abutments 212 are separated by six gaps 302 along the surface of the abutment structure 300. The widths 304 of the members 212 are wider closer to the edge of the structure 300 and narrower near the center. The gaps 302 are uniform along the structure 300. In the embodiment shown

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EP 2 910 380 Β1 in FIG. 6B, the seven abutments 212 are also separated by six gaps 302 along the surface of the abutment structure 300. However, the widths 304 of the members 212 are narrower towards the edge of the structure 300 and wider near the center. Again, the gaps 302 are uniform along structure 300. In the embodiment shown in FIG. 6C, four abutments 212 are separated by three gaps 302 along the surface of the abutment structure 300. In this case, both the widths 304 of the elements 212 and the spacing 302 between the elements taper near the center of the structure 300 and widen near the edge of the structure. In the embodiment shown in FIG. 6D, five abutments 212 are separated by four gaps 302 along the surface of the abutment structure 300. In this case, the widths 304 of the elements 212 narrow near the center of the structure 300 and widen near the edges, while the gaps 302 between the elements widen near the center of the structure 300 and taper near the edges. Accordingly, in fact, any configurations of the thrust members 212, width 304, and spacing 302 along structure 300 are possible to achieve optimal uniform temperature along structure 300 and optimal efficiency of thermal energy transfer between structure and fluid 226.

[0025] FIGURES 7A, 7B, and 7C are a cross-sectional view of an abutment structure 300 that illustrates the dimensional variation in comb tooth height 306, in accordance with embodiments of the disclosure. Height 306 is the distance from the surface of the abutment structure 300 (i.e., the surface of the tantalum cavitation layer 218) at the top 700 of the comb tooth to the surface of the abutment structure 300 at the bottom 702 of the comb tooth. Like the width 304 and the spacing 302 of the stop members 212, the height 306 of the comb teeth is variable. Changing the width 304, spacing 302, and height 306 of the comb tooth structure 300 provides control over the size of the nucleation surface area 308 and its distance (i.e., proximity) to the abutments 212. Thus, changing the height dimension 306 also helps optimize temperature uniformity and thermal energy transfer efficiency. along the surface of the retaining structure 300. Moreover, limiting or minimizing the height 306 can also help control or select the duration of the resistor.

[0026] In the embodiment shown in FIG. 7A, the height 306 of the comb tooth structure of the abutment structure 300 has an exemplary upper limit, while in the embodiment shown in FIG. 7B, height 306 has an exemplary lower limit. As noted above, the current height range 306 between 0.25 µm and 1.00 µm provides the most significant performance benefits, but this range is not limiting as it may be advantageous to use other heights. For example, reducing the height to, for example, 0.00 µm (ie flat nucleation surface) may have the effect of optimizing the lifetime of the resistor. In FIG. 7C shows a counter structure 300 in which the height 306 of the comb teeth varies along the surface of the structure 300. Thus, just as along a particular counter structure 300, the widths 304 and the spacing 302 of the abutments may vary, so also the height 306 of the comb teeth can vary.

[0027] In FIG. 8 is a cross-sectional view of a counter structure 300 whose comb teeth have male horns, according to an embodiment of the disclosure. The trained corners 800 of the comb teeth (i.e. the structure of the tantalum cavitation layer 218) increase the nucleation area of ​​the abutment structure 300. Additionally, the trained corners 800 also adjust the distance of the nucleation surfaces from the individual abutments 212 to provide additional temperature uniformity along the surface of the structure 300. Without the chamfer 800, the sharp corners of the comb teeth are further spaced from the elements 212 and thus have a greater temperature difference than these regions.

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ΕΡ 2,910,380 Β1 surfaces that are uniformly close to the abutments 212. As shown in FIG. 8, the shape of the underlying passivating layer 216 may also reflect the chamfered shape of the corners 800. Moreover, generally after the thin-film deposition process, the thin layers on the steep, vertical side walls of the comb teeth typically have about half the layer thickness on top of the horizontal surface. This difference in coverage of the layer of vertical side walls shortens the length of the thermal path from the abutments 212 to the channels or gaps 302, which aids lateral heat transfer from the members to the channels or gaps 302.

[0028] In FIG. 9 is a block diagram of a basic fluid ejection device according to an embodiment of the disclosure. Fluid ejecting device 900 includes an electronic controller 902 and a fluid ejecting assembly 102. The fluid ejecting assembly 102 may be any embodiment of the fluid ejecting assembly 102 described, illustrated, and / or contemplated in this disclosure. Electronic controller 902 typically includes a processor, firmware, and other electronic instruments to communicate and control assembly 102 to eject fluid droplets in a precise manner.

[0029] In one embodiment, the fluid ejection device 900 may be an inkjet printer. As such, fluid ejection device 900 may include a fluid / ink supply assembly and source 904 for supplying fluid to the fluid ejecting assembly 102, a medium transfer assembly 906 for supplying a medium adopting the fluid droplet pattern to be ejected, and a power source 908. Generally, electronic controller 902 receives data 910. from a native system such as a computer. The data reflects, for example, a document and / or a file to be printed and is a print job that includes one or more print job commands and / or command parameters. From the data, the electronic controller 902 determines a drop pattern to be ejected that creates characters, symbols, and / or other graphics or images.

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ΕΡ 2 910 380 Β1