Systems and methods relating to a thermoelectric heat exchange system

European).

PL-PAT-2012-850

EP 2 847 524 B1

Systems and methods concerning thermoelectric heat exchange system

Field of disclosure [0002] The present disclosure relates to thermoelectric heat exchangers in a thermoelectric system and their control.

Background of the disclosure [0003] Currently, many refrigeration systems are based on vapor compression and use thermostatically controlled control in the work cycle. However, typical refrigeration systems based on vapor compression are not dynamic enough to meet both the stable state and transition state requirements, such as during cooling or return to normal conditions. Accordingly, systems based on vapor compression tend to have excessive cooling capacities that far exceed the requirements for extracting the heat required during operation in a stable state. Although the additional efficiency provided by the additional cooling capacities provides for greater cooling efficiency, the large current surges prevailing during the start up require greater efficiency and as a result more expensive components to handle such loads. Also, large current surges and loads that are subject to control in the work cycle, cause excessive wear of components, thus potentially leading to premature failures. Then, due to the very nature of their control, thermodynamic limitations and product performance requirements, refrigeration systems based on vapor compression have less than optimal efficiency.

[0004] A disadvantage of the sub-optimal performance of refrigeration systems based on vapor compression concerns the precise temperature control in the refrigeration chamber. Typically, when the temperature in the refrigeration chamber exceeds a certain value, the refrigeration system based on the compression of the vapors is activated and remains in operation until the temperature in the refrigeration chamber drops below a certain value. When the refrigeration chamber reaches a temperature below a certain value, the refrigeration system based on the compression of the vapors turns off. However, in spite of all the excessive wear mentioned above, this type of control will typically exhibit a relatively large control range and a relatively large interior temperature stratification due to the desire to minimize energy consumption and allow operation in a variety of environmental conditions.

JP 2001/330339 discloses a method for controlling a heat exchanger comprising a plurality of thermocouple (TEC) thermostatic cells to maintain a predetermined chamber temperature, including receiving temperature data describing the temperature of the chamber, and selectively controlling two or more subsets of TEC cells in many TEC cells based on chamber temperature, according to the preamble of claim 1.

[0005] There is still a need for accurate temperature control in the refrigeration chamber that would maximize the efficiency of the components used to extract heat from the refrigeration chamber. In addition, there is a need for a system and method that would allow individual selection of components and thus yields in the refrigeration system based on the cooling needs of the refrigeration chamber.

Summary [0006] The present disclosure relates to a method for controlling a heat exchanger according to claim 1 and a refrigeration system according to claim 15. Some embodiments concern the mounting of a two-phase heat exchanger in a thermoelectric system. Generally, a two-phase heat exchanger is mounted at an angle to the vertical. In one embodiment, the angle is in the range from 2 degrees to 88, inclusive, from the vertical. In another embodiment, the angle is in the range from 6 degrees to 84 degrees, inclusive, from the vertical. In yet another embodiment, the angle is in the range from degrees to 78 degrees, inclusive, from the vertical. In one preferred embodiment, the angle is selected in such a way that the working fluid hits directly the area of ​​the largest thermal flux in the two-phase heat exchanger. In this way,

[0007] Those skilled in the art will appreciate the scope of the disclosure and will recognize its additional aspects by reading the following detailed description of preferred embodiments in conjunction with the accompanying drawings.

Brief Description of the Drawings [0008] The attached figures of the drawing covered herein and forming part of the present description illustrate several aspects of the disclosure and together with the description serve to explain the principles of the disclosure.

Figure 1 shows a thermoelectric refrigeration system including a cooling chamber, a heat exchanger containing a cartridge that contains a plurality of thermocouple cells (TEC) located between the cold side and heat side heat sink, and a controller that controls the TECs to maintain the temperature set point in the refrigeration chamber, according to one embodiment of the present disclosure;

Figure 2 is a graph illustrating cooling efficiency and cooling efficiency of a TEC cell as a function of the input current of a TEC cell;

Figure 3 is a more detailed illustration of the cassette of Figure 1, wherein the cassette comprises TECs disposed on the joining plate that allows selective control of a plurality of different subsets of TECs in a TEC link network according to one embodiment of the disclosure;

Figure 4 is a more detailed illustration of the cassette of Figure 1, wherein the cassette comprises TECs disposed on the joining plate that allows selective control of a plurality of different subsets of TECs in a TEC cell grid according to another embodiment of the present disclosure; Figure 5 is a more detailed illustration of the cassette of Figure 1, wherein the cassette comprises TECs disposed on the combining plate that allows selective control of a plurality of different subsets of TECs, according to another embodiment of the disclosure;

Figure 6 is a more detailed illustration of the cassette of Figure 1, wherein the cassette comprises a single TEC link placed on the interconnect plate, according to another embodiment of the present disclosure;

Figure 7 is a more detailed illustration of the cassette of Figure 1, wherein the cassette comprises four TEC cells located on the interconnecting plate, according to another embodiment of the present disclosure; Figure 8 is a more detailed illustration of the cassette of Figure 1, wherein the cassette comprises six TEC links disposed on the combination plate, in accordance with another embodiment of the present disclosure;

Figure 9 shows the joining plate of Figure 3, without TEC links, according to one embodiment of the present disclosure;

Figure 10 illustrates the joining plate of Figure 4, without TEC links, according to another embodiment of the present disclosure;

Figure 11 shows the joining plate of Figure 5, without a TEC cell, according to another embodiment of the present disclosure;

Figure 12 illustrates the joining plate of Figure 6, without a TEC cell, according to another embodiment of the present disclosure;

Figure 13 p illustrates the joining plate of Figure 7, without TEC links, according to another embodiment of the present disclosure;

Figure 14 shows the joining plate of Figure 8, without TEC links, according to another embodiment of the present disclosure;

Figure 15 illustrates an example of one system component system depicting different operating states, inputs and outputs of the controller of Figure 1, according to one embodiment of the disclosure; Figure 16 is a more detailed illustration of the operation of the controller of Figure 1 while operating in the various operating conditions of Figure 15, according to one embodiment of the present disclosure; Figure 17 illustrates a method of operating the controller of Figure 1 to maintain the temperature of the refrigeration chamber in accordance with a preset temperature value according to one embodiment of the present disclosure;

Figure 18 illustrates a method of operating the controller of Figure 1 to maintain the temperature of a refrigeration chamber in accordance with a preset temperature value according to another embodiment of the present disclosure;

Figure 19 illustrates a method of operating the controller of Figure 1 to monitor the temperature of one or more components of the heat exchanger of Figure 1 to detect the temperature state too high and, in response, take action to lower the temperature of one or more components of the heat exchanger, according to one embodiment of the present disclosure;

Figures 20A to 20C illustrate a thermoelectric refrigeration system including a plurality of parallel heat exchangers, according to another embodiment of the present disclosure;

Figure 21 illustrates a thermoelectric refrigeration system that includes two refrigeration chambers, each comprising separate thermally coupled radiators, according to another embodiment of the present disclosure;

Figure 22 is a more detailed illustration of the heat exchanger of Figure 1, according to one embodiment of the present disclosure;

Figures 23 and 24 graphically illustrate the phenomenon of the "thermal diode" of the receiving circuit and the donor circuit coupled to the heat exchanger of Figure 22, according to one embodiment of the present disclosure;

Figure 25 shows the "thermal diode" phenomenon of a hybrid heat exchanger, according to one embodiment of the disclosure;

Figures 26 to 29 are schematic illustrations of a cold side heat sink configuration of Figures 1 and 21, according to one embodiment of the present disclosure;

Figure 30 illustrates a heat exchanger comprising physically separated heat side and cold side heat sinks that are thermally coupled by means of a heat conduit in accordance with one embodiment of the present disclosure;

Figure 31 is a schematic illustration of the heat flow in the heat exchanger of Figure 30, according to one embodiment of the present disclosure;

Figures 32 and 33 illustrate embodiments of a thermoelectric refrigeration system that uses the heat exchanger of Figure 30;

Figure 34 illustrates the installation of a two-phase heat exchanger at an angle deviating from the vertical, according to one embodiment of the present disclosure;

Figure 35 illustrates one particular example of Figure 34, wherein a two-phase heat exchanger is mounted at a particular angle, which is optimized for a given embodiment of a two-phase heat exchanger;

Figures 36A and 36B show the encapsulation of the two-phase heat exchanger of Figure 34, according to one embodiment of the present disclosure;

Figures 37A and 37B illustrate mounting a two-phase heat exchanger of Figures 34, 36A and 36B on a wall of a thermoelectric system (e.g., thermoelectric wall of a refrigeration system) such that the angle of a two-phase heat exchanger is maintained, according to one embodiment of the present disclosure; and

Figure 38 is a block diagram of the controller of Figure 1, according to one embodiment of the disclosure.

Detailed Description [0009] The implementation examples presented below represent the necessary information to enable those skilled in the art to practice the embodiments and illustrate the best mode of practicing the embodiments. Having read the following description in the light of the attached figures, those skilled in the art will understand the concepts of disclosure and will recognize the applications of these concepts not included herein in particular.

[0010] It should be noted that, although the first, second and the like terms may be used herein to describe various elements, these elements should not be limited to these terms. These terms are used only to distinguish one element from another. For example, the first element may be named the second element and likewise, the second element may be named the first element, without departing from the scope of the present disclosure. As used herein, the term "and / or" includes any and all combinations of one or more related, specified items. [0011] Relative terms, such as "under" or "over", or "upper", or "lower", or "horizontal", or "vertical", can be used herein to describe the relationship of one element, layer or area from another element, layer or area as shown in the Figures. It should be understood that these terms as well as those discussed above are intended to cover various orientations of the apparatus in addition to the orientation shown in the Figures. [0012] The terminology used herein is for the purpose of describing particular embodiments only and is not intended to limit the disclosure. As used herein, the singular shall also include the plural unless the context clearly dictates otherwise. Furthermore, it should be understood that the terms "comprising", "comprising", "includes" and / or "comprising", in the present use define the presence of spoken features, integers, steps, operations, elements and / or components, but does not exclude the presence or otherwise of adding one or more features, integers, steps, operations, elements, components and / or groups thereof.

[0013] Unless defined otherwise, all terms used herein (including technical and scientific terms) have the same meaning as commonly understood by one of ordinary skill in the art to which the disclosure belongs. Furthermore, it should be understood that the terms used herein should be construed to be of significance consistent with their meaning in the context of this description and the related art and should not be interpreted in idealized or over formal terms, unless expressly defined herein.

[0014] Figure 1 illustrates a thermoelectric refrigeration system 100 according to one embodiment of the present disclosure. As shown, the thermoelectric refrigeration system 100 comprises a refrigeration chamber 102, a heat exchanger 104 and a controller 106 that controls the cooling within the refrigeration chamber 102. The heat exchanger 104 comprises a heat side radiator 108 and a cold side heat sink 110, and the cassette 112 comprises a plurality of thermocouple cells (TEC), each TEC cell comprising a cold side that is thermally coupled to the cold side heatsink 110 and a hot side that is thermally coupled with a heat side of 108 radiators. The TEC cells are preferably thin-film devices. When one or more TEC cells are activated by the controller 106, the activated TEC cells operate to heat the heat sink 108 of the hot side and cool the cold side heat sink 110 so as to facilitate the transfer of heat to extract heat from the refrigeration chamber 102. In particular, when one or more TEC cells are activated, the heat side radiator 108 is heated to thereby form an evaporator and the cold side radiator 110 is cooled to thereby form a condenser.

[0015] By acting as a condenser, the cold side radiator 110 facilitates the extraction of heat from the refrigeration chamber 102 by means of a receiving loop 114 coupled to the cold side of the radiator 110. The receiving circuit 114 is thermally coupled to the inner wall 115 of the thermoelectric refrigeration system 100. The inner wall 115 defines the refrigeration chamber 102. In one embodiment, the receiving circuit 114 is either integrated with the inner wall 115 or integrated directly with the surface of the inner wall 115. The receiving circuit 114 is formed by any type of hydraulic conduits that allow the flow or movement of the cooling medium (e.g., two-phase coolant) through the circuit 114 host. Thanks to the thermal coupling of the receiving circuit 114 and the inner wall 115, the coolant extracts heat from the refrigeration chamber 102 when the cooling medium flows through the receiving circuit 114. The receiving circuit 114 can be formed, for example, from copper pipes, plastic pipes, stainless steel pipes, aluminum pipes, etc.

[0016] The condenser formed by the cold side heat sink 110 and the recipient circuit 114 operates according to any suitable heat transfer technique. In one preferred embodiment, the recipient circuit 114 operates in accordance with the thermosiphon principles (i.e., acts as a thermoswitch) in such a way that the cooling medium moves from the cold side radiator 110 through the reception circuit 114 and back to the cold side heat sink 110 to thereby cool the refrigeration chamber 102 using two passive, passive heat transfer. In particular, the passive heat exchange occurs through natural convection between the cooling medium in the receiving circuit 114 and the refrigeration chamber 102. In one embodiment, the cooling medium is in a liquid state when the coolant is in thermal contact with the refrigeration chamber 102. In particular, passive heat exchange occurs between the environment in the refrigeration chamber 102 and the refrigerant in the receiving circuit 114 so that the temperature in the refrigeration chamber 102 decreases and the temperature of the coolant increases and / or undergoes a phase change. When the temperature of the cooling medium increases, the density of the cooling medium is reduced, e.g. by evaporation. As a result, the cooling medium moves in the upward direction due to the buoyancy forces in the receiving circuit 114 in the direction of the heat exchanger 104 and in particular in the direction of the cold side radiator 110. The cooling medium is in thermal contact with the cold side heatsink 110, during which heat exchange occurs between the cooling medium and the cold side 110. When heat exchange occurs between the cooling medium and the cold side heatsink 110, the cooling agent condenses and flows again through the receiving circuit 114 as a result of gravity to extract additional heat from the refrigeration chamber 102. In this way, in some embodiments, the receiving cycle 114 acts as a cooker when cooling the refrigeration chamber 102.

[0017] As stated above, the heat exchanger 104 includes a cassette 112 positioned between the heat side heat sink 108 and the cold side heat sink 110. The TEC cells in the cassette 112 have warm sides (i.e., pages that are warm during the operation of the TEC cells) that are thermally coupled to the heat side radiator 108 and the cold side (i.e., pages that are cold during the operation of the TEC cells), which are thermally coupled with a cold side heatsink 110. The TEC cells inside the cassette 112 efficiently facilitate the transfer of heat between the cold side radiator 110 and the heat side heat sink 108. In particular, when heat transfer occurs between the cooling medium in the receiving circuit 114 and the cold side heat sink 110, active TECs transmit heat between the cold side radiator 110 and the heat side heat sink 108.

[0018] By acting as an evaporator, the heat side radiator 108 facilitates heat dissipation into the environment outside the refrigeration chamber 102 via the recirculation circuit 116 coupled to the heat side radiator 108. The feed circuit 116 is thermally coupled to the outer wall 118 or the outer shell of the thermoelectric refrigeration system 100. The outer wall 118 is in direct thermal contact with the environment outside the refrigeration chamber 102. Furthermore, the outer wall 118 is thermally insulated from the receiving loop 114 and the inner wall 115 (and thus the refrigeration chamber 102) by, for example, suitable insulation. In one embodiment, the transfer circuit 116 is integrated with the outer wall 118 or integrated with the surface of the outer wall 118. The feed circuit 116 is formed from any type of hydraulic conduits that allow the heat transfer medium (e.g., two-phase coolant) to flow or travel through the recirculation circuit 116. Due to the thermal coupling of the return circuit 116 and the external environment, the heat transfer medium releases heat to the external environment when the heat transfer medium flows through the circulation circuit 116. The feed circuit 116 may be formed, for example, from copper pipes, plastic pipes, stainless steel pipes, aluminum pipes, etc. the heat transfer medium transfers the heat to the external environment when the heat transfer medium flows through the circulation circuit 116. The feed circuit 116 may be formed, for example, from copper pipes, plastic pipes, stainless steel pipes, aluminum pipes, etc. the heat transfer medium transfers the heat to the external environment when the heat transfer medium flows through the circulation circuit 116. The feed circuit 116 may be formed, for example, from copper pipes, plastic pipes, stainless steel pipes, aluminum pipes, etc.

[0019] The evaporator formed by the heat side heat sink 108 and the recirculation circuit 116 operates according to any suitable heat transfer technique. In one preferred embodiment, the recirculation cycle 116 operates according to thermosiphon principles (i.e., acts as a thermoswitch), so that the heat transfer medium moves from the heat side heat sink 108 through the heating circuit 116 to and back to the heat side heat sink 108 so that release heat using two-phase passive heat transfer. In particular, the heat side heat sink 108 transmits the heat received from the cold side heat sink 110 to the heat transfer medium in the release circuit 116. When heat is transferred to the heat transfer medium, the heat transfer medium changes its state of aggregation and travels through the circulation circuit 116 and is in thermal contact with the outer wall 118 in such a way that heat is released into the environment outside the refrigeration chamber 102. When the heat transfer medium in the circulation circuit 116 is in direct thermal contact with the outer wall 118, passive heat exchange occurs between the heat transfer medium in the circulation circuit 116 and the external environment. As is well known, passive heat exchange causes the heat transfer medium to condense in the circulation circuit 116, so that the heat transfer medium moves back to the heat exchanger 104 due to gravity forces. In this way, the recirculation circuit 116 acts as a condenser when transferring heat to the environment outside the refrigeration chamber 102.

[0020] As discussed in more detail above, in one preferred embodiment, the heat exchanger 104 is not in direct thermal contact with the refrigeration chamber 102, and instead is thermally isolated from the refrigeration chamber 102. Likewise, the heat exchanger 104 is not in direct contact with the outer wall 118 and is thermally insulated from the outer wall 118. Accordingly, as will be explained below, the heat exchanger 104 is thermally insulated from both the refrigeration chamber 102 and the exterior wall. walls 118 of a thermoelectric refrigeration system 100. Importantly, this ensures the occurrence of the "thermal diode" phenomenon, by which the escape of heat back to the refrigeration chamber 102 is prevented when the TEC cells are deactivated.

[0021] The controller 106 operates to control the TEC cells inside the cassette 112 to maintain the desired preset temperature values ​​in the refrigeration chamber 102. In general, the controller 106 operates to selectively activate / deactivate TEC cells, selectively control internal TEC links and / or selectively control the TEC cell duty cycle to maintain the desired set temperature. Further, in preferred embodiments, the controller 106 is adapted to be a separate or independent control of one or more, and in some embodiments, two or more subsets of TECs, each subset comprising one or more different TECs. In this way, for example, if there are four TEC cells in the cassette 112, controller 106 may be adapted to separately control the first individual TEC cell, the second individual TEC cell and the group of two TEC cells (i.e. the first and second individual TEC cells, and a group of two TEC cells). In this way, the controller may, for example, selectively activate one, two, three or four TEC cells, independently, with maximized efficiency, according to the demand.

[0022] Continuing this example, the controller 106 may be adapted for separate and selective control: (1) activation / deactivation of the first individual TEC cell, the input current of the first individual TEC cell and / or the work cycle of the first individual TEC cell; (2) activating / deactivating the second individual TEC cell, the input current of the second individual TEC cell and / or the work cycle of the second individual TEC cell; and (3) activation / deactivation of a group of two TEC cells, an input current of a group of two TEC cells and / or a work cycle of a group of two TEC cells. By using separate selective control of the various subsets of the TEC cells, the controller 106 preferably controls the TEC links to improve the thermoelectric efficiency of the refrigeration system 100. For example, the controller 106 can control the TEC links for maximizing efficiency when in stable mode, such as when the refrigeration chamber 102 is in a preset temperature value or in a predetermined range of set temperature values. However, during cooling or recovery, the controller 106 may control the TEC links to achieve the desired operation, such as maximizing the extraction of heat from the refrigeration chamber 102, providing a trade-off between the times and efficiency of cooling / recovery, etc.

[0023] Before proceeding, it will be advantageous to briefly discuss cooling performance relative to the input current and efficiency characteristics of the input current characteristics of the TEC cell. In this context, Figure 2 is a graph illustrating the cooling capacity (Q) and cooling efficiency (COP) of a TEC cell as a function of the input current of a TEC cell. The cooling efficiency is more particularly represented by the COP (Coefficient of Performance). As illustrated in Figure 2, when the input current (I) of the TEC cell increases, the cooling capacity of the TEC cell also increases. The point on the cooling capacity curve (Q) that corresponds to the location of the maximum heat received by the TEC cell is labeled Qmax. Thus, when the TEC cell operates with Qmax, the TEC cell receives the largest possible amount of heat. The TEC cell operates with Qmax when the corresponding maximum current Imax is passed through the TEC link. Figure 2 also illustrates COP of the TEC cell as a function of current. In refrigeration applications, the COP of the TEC cell is the ratio of the heat received to the amount of work entering the TEC cell for the heat to be received. The amount of heat or the efficiency (Q) at which the COP of the TEC cell is maximized is designated as QCOPmax. The TEC cell operates with QCOPmax when the ICOPmax current is passed through the TEC link. In this way, the efficiency, or COP, of the TEC cell is maximized when the ICOPmax current is passed through the TEC cell, so that the TEC cell operates with the QCOPmax. COP of the TEC cell is the ratio of heat received to the amount of work input to the TEC cell for the heat to be received. The amount of heat or the efficiency (Q) at which the COP of the TEC cell is maximized is designated as QCOPmax. The TEC cell operates with QCOPmax when the ICOPmax current is passed through the TEC link. In this way, the efficiency, or COP, of the TEC cell is maximized when the ICOPmax current is passed through the TEC cell, so that the TEC cell operates with the QCOPmax. COP of the TEC cell is the ratio of heat received to the amount of work input to the TEC cell for the heat to be received. The amount of heat or the efficiency (Q) at which the COP of the TEC cell is maximized is designated as QCOPmax. The TEC cell operates with QCOPmax when the ICOPmax current is passed through the TEC link. In this way, the efficiency, or COP, of the TEC cell is maximized when the ICOPmax current is passed through the TEC cell, so that the TEC cell operates with the QCOPmax.

[0024] As discussed in more detail below, in preferred embodiments, the controller 106 controls the TEC cells in the cassette 112 such that during operation in a stable state, one or more of the TEC links is activated and operates with QCOPmax, while the remaining links TECs are deactivated in order to maximize efficiency. The number of activated TEC cells, and vice versa, the number of deactivated TEC cells is determined by the demand. Conversely, during cooling or recovery, one or more and potentially all of the TEC cells in the cassette 112 are activated and operate according to the desired performance profile. One example of the desired performance profile is the situation in which all of the TEC cells are activated and operate with Qmax to minimize the cooling or recovery time. However, the desired performance profile may alternatively provide a trade-off between the time of cooling or recovery and the efficiency at which, for example, all TECs are activated and operate at a point between QCOPmax and Qmax. It should be noted that, as discussed previously, the control of TECs is not limited to these examples.

[0025] As stated above, Figure 2 illustrates the cooling capacity and cooling efficiency of a single TEC cell. By increasing the number of TEC cells, the heat removal efficiency is linearly increased without affecting the working COP of the thermoelectric refrigeration system 100 utilizing TEC cells. Thus, if the thermoelectric refrigeration system 100 comprises four TEC cells, the heat absorption capacity of the thermoelectric refrigeration system 100 is increased fourfold compared to the embodiment of the thermoelectric refrigeration system 100 that contains one TEC cell, while allowing the entire system, in some preferred examples. implementation, operated between QCOPmax and Qmax.

[0026] It should be noted that although passing electrical current through the TEC cell and Figure 2 is discussed in the context of cooling, the same principles apply in the context of heat recovery / power generation when the TEC cells are used to produce power or current, under the influence of heat. .

TEC Cassette Before discussing the details of the operation of the controller 106 for separate and selective control of the TECs, it is preferable to discuss embodiments of the cassette 112 of Figure 1 that allows separate and selective control of the TEC cells. It should be noted that although the following discussion of the cassette 112 is in the context of the thermoelectric refrigeration system 100 of Figure 1, the cassette 112 is not limited to its use in the thermoelectric refrigeration system of Figure 1, or generally for thermoelectric cooling. For example, cassette 112 may be used in heat recovery applications or in power generation.

[0028] As stated above, the TEC cells in the cassette 112 are used to control the temperature of the refrigeration chamber 102. In order to provide the desired cooling capacity for many refrigeration applications, the thermoelectric refrigeration system 100 uses many TEC cells. The use of many TECs is advantageous compared to the use of one large TEC cell, since many TECs can be controlled separately to provide the desired performance under varying conditions. In contrast, one over-dimensioned TEC cell that is designed to maximize the desired yield for cooling or returning to the normal state does not offer this flexibility. For example, under stable conditions, one O-shaped TEC will typically operate at a low efficiency point, which corresponds to a low COP value. In other words, the TEC over-dimensional link will work with low efficiency. In contrast, the controller 106 is adapted to separately and selectively control the subsets of the TEC cells in the cassette 112 to maximize efficiency under stable condition conditions.

[0029] Figures 3 to 5 illustrate embodiments of cassette 112 that allows the controller to separately and selectively control subsets of TECs in accordance with the desired control method. However, it should be noted that the embodiments of Figures 3 to 5 are only examples. The cassette 112 may be configured to comprise any number of TEC links and to allow any number of TEC cell subsets to be controlled separately. Each subset contains generally one or more TEC links. In addition, different subsets may contain the same number or different numbers of TECs.

[0030] In the embodiment of Figure 3, the cassette 112 comprises TEC cells 120a to 120f (more commonly referred to collectively as TEC 120 cells and individually as TEC 120 cells) placed on the connecting plate 122. TEC 120 cells are thin-film devices. Some non-limiting examples of TEC thin film cells are disclosed in US Pat. No. 8,216,871, METHOD FOR THIN FILM THERMOELECTRIC MODULE FABRICATION. The bonding plate 122 includes electrically conductive paths 124a to 124d (more generally collectively referred to herein as lanes 124 and individually lane 124), which define four subsets of TECs from 120a to 120f. In particular, the links TEC 120a and 120b are electrically connected to each other in series with the path 124a and, as such, form the first subset of the TEC 120 cells. Similarly, link TEC 120f) by controlling the current flowing in path 124c. In this way, using, for example, TEC cells 120a and 120b, controller 106 can selectively activate / deactivate TEC 120a and 120b cells by either removing current from path 124a (deactivation), or by passing current through path 124a (activation), selectively increasing or reduce the current through path 124a when TEC cells 120a and 120b are activated and / or control the current passed through path 124a to control the operating cycle of TEC cells 120a and 120b when TEC cells 120a and 120b are activated (e.g. by modulating the current pulse width).

[0031] The splice plate 122 includes apertures 126a and 126b (more commonly referred to collectively as apertures 126 and individually aperture 126) that expose the bottom surface of the TECs from 120a to 120f. When located between the hot side heat sink 108 (Figure 1) and the cold side cooling radiator 110 (Figure 1), the openings 126a and 126b allow thermal coupling of the lower faces of the TECs from 120a to 120f with a suitable heatsink 108 or 110.

[0032] According to embodiments of the present disclosure, in operation, the controller 106 can selectively activate or deactivate any combination of subsets of TEC 120 cells by passing or removing current from the corresponding paths 124a to 124d. In addition, the controller 106 can control the work pointsactive TEC 120 cells by controlling the magnitude of current passed through the respective paths 124a to 124d. For example, if only the first subset of TEC 120 cells is to be activated and to operate with QCOPmax while operating in a stable state, controller 106 passes ICOPmax current through path 124a to thereby activate TEC 120a and 120b cells and operate over TEC 120a and 120b cells with QCOPmax and clears the current in other paths 124b to 124d, to thereby deactivate other TECs from 120c to 120f.

[0033] In the embodiment shown with reference to Figure 3, the cassette 112 comprises TEC cells 120a to 120f. According to embodiments of the present disclosure, the cassette 112 may comprise any number of TEC 120 cells. For example, in the embodiment shown with reference to Figure 4, the cassette 112 includes a combiner 122 comprising only two cells TEC 120, cells TEC 120e and 120f. In this embodiment, the controller 106 (Figure 1) can individually control the TEC 120e and 120f cells by controlling the currents passed through the respective paths 124d and 124c, respectively. As another example, the cassette 112 may comprise only four TEC 120 cells, such as TEC cells 120c to 120f, as shown with reference to Figure 5. In this embodiment, the connection plate 122 includes paths 124b to 124d, which pass the current through the TEC cells from 120c to 120f, respectively. In addition, corresponding subsets of the TEC 120 cells may be controlled by the controller 106 by passing corresponding currents in paths 124b to 124d.

[0034] While Figures 3 and 5 illustrate embodiments of cassette 112 that allows selective control of different TEC cells in cassette 112, Figures 6 to 8 illustrate embodiments of cassette 112 that may be used if selective control is not needed. In these embodiments, the input current of the TECs and / or the working cycle of the TECs can vary to provide the desired performance, desired efficiency or some trade-off between performance and efficiency. In particular, Figure 6 illustrates an embodiment of cassette 112 that includes a connection board 128 and one link TEC 130 located on the connection board 128. A hole 131 in the connecting plate 128 reveals the bottom surface of the TEC 130 cell.

[0035] Figure 7 illustrates an embodiment of the cassette 112, which is similar to the cassette of Figure 6, but wherein the cassette 112 comprises four TEC cells. In particular, the cassette 112 comprises a connecting plate 134 and four TEC 136 cells located on the connecting plate 134. On the connection plate 134 there are openings 137 for uncovering the lower surfaces of the TEC 136 cells. Again, the controller 112 can control the efficiency and efficiency of the TEC 136 cells by controlling the current passed through the TEC 136 cells and / or the TEC 136 cell cycle by an electrically conductive path 138 on connecting plate 134.

[0036] Figure 8 illustrates yet another example of cassette 112, which is similar to cassette of Figures 6 and 7, but in which cassette 112 contains six TEC links. In particular, the cassette 112 comprises a connecting plate 140 and six TEC 142 cells arranged on the connecting plate 140. On the connection plate 140 there are openings 143 for uncovering the lower surfaces of the TEC 142 cells. Again, the controller 112 can control the efficiency and efficiency of the TEC 142 cells by controlling the current passed through the TEC 142 cells and / or the TEC 142 cell work cycle through an electrically conductive path 144 on the connecting plate 140. It should be noted that the embodiments of Figures 6 to 8 are examples only. The cassette 112 may be configured to comprise any number of TEC cells or conductive paths in a serial or parallel configuration.

[0037] Figures 9 to 14 illustrate the plates 122, 128, 134 and 140 connecting to Figures 3 to 8, respectively, but without TEC links affixed to the joining plates. Figures 9 to 14 illustrate more clearly the openings 126, 131, 137 and 143 in the joining plates that expose the lower surfaces of the TEC links or, in other words, allow thermal coupling between the bottom surfaces of the TECs and the respective heat sinks 108 or 110. Figures 9 to 14 also illustrate contacts 146, 148, 150 and 152 that allow electrical and mechanical coupling between the bonding plates 122, 128, 134 and 140 to the respective TEC cells.

Selective Control of TEC Cells [0038] Following is a detailed discussion of embodiments of controller 106 from Figure 1. For purposes of this discussion, cassette 112 is cassette 112 in Figure 3 that allows selective control of many different subsets of TEC 120 cells. however, it is noted that the use of the cassette 112 of Figure 3 is only an example.

[0039] Figure 15 illustrates the operation of the controller 106 according to one embodiment of the present disclosure. As shown, the controller 106 receives temperature data from the temperature inputs 154 and 156. Temperature inputs 154 and 156 can be temperature sensors of any type. Temperature data includes the temperature (TCH) of the refrigeration chamber 102 and the temperature (TR) on the discharge side, or the warm side, of the heat exchanger 104. The heat exchanger return side 104 is the heat side of the heat exchanger 104. Thus, for example, the temperature (TR) may be the temperature of the heat side heat sink 108. Based on the temperature data, the controller 106 determines the current mode of operation of the thermoelectric refrigeration system 100. In this embodiment, the operation mode is one of the 158 cooling mode, the stable mode state 160, 162 of the excessive temperature and 163 return to normal. The cooling mode 158 generally appears when the thermoelectric refrigeration system 100 is on for the first time. The steady state mode 160 occurs when the temperature of the refrigeration chamber 102 is equal to or close to the desired set temperature value. In particular, the temperature of the refrigerating chamber 102 is equal to or close to the desired set temperature value when the temperature of the refrigerating chamber 102 is in a predetermined stable condition range, which includes a predetermined temperature value (e.g., a set temperature of the refrigerating chamber 102 ± 2 degrees). The excessive temperature mode 162 occurs when the temperature on the heat exchanger heat transfer side 104 is above a predetermined maximum allowed temperature. The over-temperature mode 162 is a safety mode during which the temperature of the heat exchanger side 104 of the heat exchanger 104, and therefore the heat side of the TEC 120 cells, is reduced in order to protect the TEC 120 cells from damage. Finally, the recovery mode 163 occurs when the temperature of the refrigeration chamber 102 increases beyond the steady state due to, for example, heat transfer to the refrigeration chamber 102, when the refrigerator door 102, etc. is opened.

Operation of the controller 106 in different modes 158, 160, 162 and 163 in one embodiment of the present disclosure is illustrated in Figure 16. As shown in Figure 16, while operating in the cooling mode 158, the controller 106 controls the currents of all TEC 120 cells at such that all TEC 120 cells operate at a power level between QCOPmax and Qmax according to the requirements of the desired performance profile. In other words, the controller 106 causes a current of magnitude between I COPmax and Imax to be passed through all TEC 120 cells. The controller 106 determines when the thermoelectric refrigeration system is in cooling mode 158 based on, for example, its initial inclusion, as then, when the thermoelectric refrigeration system 100 is first purchased or after the thermoelectric refrigeration system 100 is switched on after it has been disconnected from the power supply. The controller 106 maintains all TEC 120 cells at a power level between QCOPmax and Qmax until the temperature of the refrigeration chamber 102 is lowered to a preset temperature or within an acceptable temperature range as shown with reference to 164. When the refrigeration chamber 102 is cooled to The controller 106 controls the operation of the TEC 120 cells in such a way that all of the TEC 120 cells operate with QCOPmax, by making the ICOPmax current pass through all of the TEC 120 cells. In addition, the controller 106 can reduce the number of TEC 120 cells that are activated,

[0041] As mentioned above, based on the temperature data, the controller 106 also determines when the thermoelectric refrigeration system 100 is in the steady state state 160. The thermoelectric refrigeration system 100 is in the 160stable state mode if the temperature of the refrigeration chamber 102 is equal to the set temperature value or is within a pre-set range of the set temperature value. In stable state mode 160, controller 106 sets the desired number of TEC 120 cells to QCOPmax, as required. In this example, all of the TEC 120 cells operate with the QCOPmax in the stable state mode 160. In mode 160 of the stable state, if QCOPmax> Q ascending, as shown based on 166, the temperature of the refrigeration chamber 102 will continue to decrease.

In this case, the controller 106 reduces the duty cycle of the activated cells of the TEC 120, as shown with reference to 168. Conversely, if QCOPmax <Q assent, as shown with reference to 170, the temperature of the refrigeration chamber 102 will increase. In this case, the controller 106 increases the number of active available TEC 120 cells as possible and then the current passed to the active TEC 120 cells to a value between I COPmax and Imax, as shown with reference to 172. It should be noted that Q to the amount of heat escaping into the refrigeration chamber 102, such as when the heat passes through the door seal of the refrigeration chamber 102, through the natural conduction of heat through the refrigeration chamber 102, etc.

[0042] As mentioned above, the controller 106 also determines if the refrigeration chamber 102 is in over- temperature mode 162, based on the temperature data from the temperature entry 156. During the operation of the thermoelectric refrigeration system 100, the temperature of the heat exchanger side 104 is monitored to ensure that the temperature on the heat exchanger 104 does not exceed a predetermined maximum allowable temperature. The temperature of the heat exchanger side 104 may exceed a predetermined maximum allowed temperature, e.g., when the refrigeration chamber 102 does not cool, such as when the refrigerator door 102 is not properly closed, etc.

[0043] If controller 106 determines that the temperature at the heat exchanger 104 passes above the preset maximum allowable temperature, at operation 174, controller 106 reduces the temperature on the heat exchanger 104's exit side by deactivating some or all of the TEC 120 cells that allow cooling , or by reducing the current through the TEC 120 cells. For example, if all of the TEC cells operate either with QCOPmax or with Qmax, the controller 106 may deactivate one or more TEC 120 cells or preferably all of the TEC 120 cells. In another example, if the TEC cells 120a, 120b, 120e and 120f operate with Qmax, the controller 106 can deactivate the TEC cells 120e and 120f, so that only the TEC cells 120a and 120b operate with Qmax and allow extracting heat from the refrigeration chamber 102.In another example, if the TEC cells 120a to 120d operate with QCOPmax, the controller 106 can deactivate the TEC 120c and 120d cells and then also activate the TEC 120e to maintain the temperature of the refrigeration chamber 102 as close as possible to the set temperature without damaging the cassette 112. It should be noted that the controller 106 may deactivate any number of active TEC 120 cells and activate any number of inactive TEC 120 cells in response to determining that the temperature of the heat exchanger 104 exceeds the maximum allowed temperature.It should be noted that the controller 106 can deactivate any number of active TEC 120 cells and activate any number of inactive TEC 120 cells in response to determining that the temperature of the heat exchanger 104 exceeds the maximum allowable temperature.It should be noted that the controller 106 can deactivate any number of active TEC 120 cells and activate any number of inactive TEC 120 cells in response to determining that the temperature of the heat exchanger 104 exceeds the maximum allowable temperature.

[0044] As mentioned above, if controller 106 determines that the temperature of the heat exchanger 104 exceeds a predetermined maximum allowed temperature, the controller 106 can reduce the current being passed through the TEC 120 cells, besides or alternatively to deactivate some or all of the TEC 120 cells. further illustrating this functionality, if all of the TEC 120 cells operate, either with QCOPmax or with Qmax, the controller 106 can reduce the magnitude of current passed through each of the TEC 120 cells. For example, if all of the TEC 120 cells operate with Qmax, the controller 106 can reduce the current from Imax to a value that is between I COPmax and Imax. In addition, if all of the TEC 120 cells operate from QCOPmax or Qmax, the controller 106 can reduce only the current being passed through some of the TEC 120 cells, to reduce the temperature of the heat exchanger 104. In a further embodiment, the controller 106 may also deactivate some of the TEC 120 cells and at the same time reduce the current in some or all of the TEC 120 cells that are still active if the temperature of the heat exchanger 104 exceeds a predetermined maximum allowable temperature.

[0045] In recovery mode 163, controller 106 switches active TEC 120 from operation with QCOPmax to operation with Qmax, as shown under action 175. Normal state return mode 163 appears when in operation in steady state mode the controller 106 from the temperature input 154 receives the temperature data indicating that in a short period of time the temperature in the refrigeration chamber 102 has risen significantly above the set temperature value. In particular, the thermoelectric refrigeration system 100 may enter the recovery mode 163 when the temperature in the refrigeration chamber 102 increases above the upper threshold value of the stable temperature range (e.g., increases above a predetermined temperature value plus a predetermined value that defines the upper limit). threshold value of the desired stable state range).

[0046] It should be noted that the control systems 164, 166, 168, 170, 172, 174 and 175 illustrated in Figure 16 for the various modes 158, 160, 162 and 163 are only examples. The manner in which the controller 106 controls the TEC 120 cells in each of the modes 158, 160, 162 and 163 may vary depending on the particular implementation. Generally, as discussed above, the controller 106 controls the TEC 120 cells to reduce the temperature of the refrigeration chamber 102 when it is either in the cooling mode 158 or in the recovery mode 163. The exact way it is implemented can change. For example, if the performance profile is such that a minimum cooling or recovery time is desired, the controller 106 can activate all of the TEC 120 cells with Qmax in a 100% duty cycle (always on). Contrary, if a trade-off between a cooling or recovery time and efficiency is desired, the controller 106 may, for example, activate all of the TEC 120 cells with QCOPmax in a 100% duty cycle (always on) or anywhere between QCOPmax and Qmax. In the stable state 160, the controller 106 generally operates to maintain the set temperature in an efficient manner. For example, the controller 106 may power the desired number of TEC 120 cells (e.g., all of the TEC 120 cells or less than all of the TEC 120 cells) with QCOPmax, according to the load. The preset number of TEC 120 cells is the number of TEC 120 cells that is required to maintain the set temperature value when operating with QCOPmax or near. If not all of the TEC 120 cells are needed in 160th stable mode, unnecessary TEC 120 cells are deactivated. The controller 106 may fine tune the operation of the activated TEC 120 cells to accurately maintain the set temperature, e.g., by slightly increasing or decreasing the input current of the activated TEC 120 cells such that the activated TEC 120 cells operate slightly above QCOPmax or by increasing or decreasing the cycle working activated TEC 120 cells to compensate for the delivery.

Returning to Figure 15, the thermoelectric refrigeration system 100 also includes a user interface 176 (UI), a power supply 178, accessories (acc) 180, and electronic power circuits 182. The user interface 176 allows the user to enter various control parameters associated with the thermoelectric refrigeration system 100. These control parameters include a predetermined temperature value of the refrigeration chamber 102. In some embodiments, the control parameters may additionally include values ​​for a steady-state temperature range. It should be noted that in some embodiments the user interface 176 may further allow a user or manufacturer of the thermoelectric refrigeration system 100 to define the maximum allowable temperature for the heat exchanger heat removal side 104, current values ​​associated with I COPmax and Imax and / or similar. However, it should be noted that some or all of the control parameters may be programmed or hardware-coded in the controller 106.

The power supply source 178 provides power to the controller 106, accessories 180 and electronic power systems 182. Accessory 180 may be a chamber light or a communication module to provide enhanced capabilities. In an embodiment in which the accessories 180 is a communication module, the accessories 180 may communicate with remote devices, such as, but not limited to: a mobile telephone, a remotely located computing device or even other devices and thermoelectric refrigeration systems. In an embodiment in which the accessories 180 communicate with a mobile telephone or a remotely located counting device, the accessories 180 may provide additional operational parameters (e.g., temperature data) of the thermoelectric refrigeration system 100 and the refrigeration chamber 102 to the remote device or object.

[0049] The electronic power systems 182 generally operate to supply current to the TEC 120 cells in response to control data from the controller 106. In particular, the electronic control systems 182 provide power independently to each of the cell subsets TEC 120. In one embodiment, controlled there are also working cycles of various subsets of TEC 120 cells. In this case, the electronic control systems 182 may have the function of pulse width modulation by means of which the working cycles of the various subsets of the TEC 120 cells are controlled.

[0050] With reference to Figure 17, a method of operation of the controller 106 is illustrated to maintain the refrigeration chamber 102 at a preset temperature value according to one embodiment of the present disclosure. Initially, the temperature data corresponding to the temperature in the refrigeration chamber 102 and the temperature on the heat exchanger heat transfer side 104 (stage 1000) are received. For example, a thermocouple or any other type of temperature sensor can be used to determine the temperature of the refrigeration chamber 102 and to provide the temperature from the temperature data to the controller 106 in step 1000 via temperature input 154. Also,

[0051] In response to the reception of temperature data, the controller 106 selectively controls the TECs based on temperature data (step 1002). Generally, the controller 106 selectively controls one or more, and in some preferred embodiments, two or more subsets of TECs based on temperature data and a set temperature value for the refrigeration chamber 102. Using the TEC 120 cells in the cassette 112 of Figure 3 as an example, the controller 106 selectively or separately controls the various subsets of the TEC 120 cells. More particularly, as discussed above, the controller 106 determines if the thermoelectric refrigeration system is in cooling mode 158, mode 160 a stable state, or a return mode to the normal state, based on temperature data and a set temperature value for the refrigeration chamber 102. If controller 106 determines that thermoelectric refrigeration system 100 is either in cooling mode 158 or in recovery mode 163, controller 106 controls the TEC 120 cells to reduce the temperature of the refrigeration chamber 102 or by activating the TEC 120 cells that are currently inactivated by increasing the current passed through the activated TEC 120 cells and / or by increasing the duty cycle of the activated TEC 120 cells. If the controller 106 determines that the thermoelectric refrigeration system 100 is in the stable state 160, the controller 106 controls the TEC 120 cells to maintain the set temperature. In the 160stable mode, the controller 106 may, for example, activate or deactivate various subsets of the TEC 120 cells,

[0052] As an example, if the temperature data indicates that the thermoelectric refrigeration system is in the recovery mode 163, while the TEC cells 120a, 120b and 120e operate with QCOPmax in the steady state mode, the controller 106 can activate additional subsets of inactive cells. TEC 120c, 120d and 120f and supply newly activated TEC 120 cells with QCOPmax. If additional cooling capacity is needed, the controller 106 can increase the current through the active TEC 120a, 120b, 120c, 120d, 120e and 120f cells to Imax in order to reduce the temperature of the refrigeration chamber 102 to the set temperature as quickly as possible. After selectively controlling the TEC 120 cells with the Qmax controller 106, the method returns to step 1000 and the controller 106 receives the temperature data again. Returning to the example, if the temperatures obtained in step 1000 indicate that the refrigeration chamber 102 has been cooled to a preset temperature value, the controller 106 reduces the current being passed through the TEC cells 120a, 120b and 120e from Imax to ICOPmax, so that the TEC cells 120a, 120b and 120e operate with QCOPmax in mode 160 of the stable state in step 1002. In addition, the controller 120 inactivates the TEC 120c, 120d and 120f cells, which in this example are unused in mode 160 of the stable state. The controller 106 continuously repeats this procedure to maintain the set temperature in the refrigeration chamber 102. 120b and 120e operate with QCOPmax in the stable state 160 in step 1002. In addition, the controller 120 inactivates the TEC 120c, 120d and 120f cells, which in this example are unused in the stable state mode 160. The controller 106 continuously repeats this procedure to maintain the set temperature in the refrigeration chamber 102. 120b and 120e operate with QCOPmax in the stable state 160 in step 1002. In addition, the controller 120 inactivates the TEC 120c, 120d and 120f cells, which in this example are unused in the stable state mode 160. The controller 106 continuously repeats this procedure to maintain the set temperature in the refrigeration chamber 102.

[0053] In other words, in one embodiment, the controller 106 is configured or adapted to control the TEC 120 cells in accordance with a plurality of control methods. The control methods include independent control of activation and deactivation of the various subsets of the TEC 120 cells, independent control of the current passed through each subset of the TEC 120 cells and / or independent control of the work cycle of each subset of the TEC 120 cells. In operation, the controller 106 selects one or more control methods in based on the temperature of the refrigeration chamber 102 and, in some embodiments, the temperature on the heat exchanger side 104, as well as the desired performance profile. The desired performance profile can be programmed or hardware coded in the controller 106. The desired performance profile dictates, how TEC 120 cells are controlled (eg maximum efficiency, maximum efficiency or between maximum efficiency and maximum efficiency) in different modes of operation. When control method (s) are (are) already selected, the controller 106 controls the various subsets of the TEC 120 cells in accordance with the selected method (s) of control. In this way, the controller 106 can control any combination of activation / deactivation, current and duty cycle for each mode of operation.

[0054] For example, in the stable state mode 160, the controller 106 may select a method for controlling the activation / deactivation of the TEC 120 cells based on the temperature of the refrigeration chamber 102 and the desired efficiency profile for maximizing efficiency in the stable state 160. In this case, the controller 106 then activates one or more cell subsets TEC 120 and, in some embodiments, deactivates one or more subsets of the TEC 120 cells. In addition, the controller 106 may choose to control the current and / or duty cycle of the activated TEC 120 cells. in mode 160 of the stable state, in which case the controller 106 independently controls the current transmitted by each of the activated subsets of the TEC 120 cells and / or the working cycle of each of the activated subsets of the TEC 120 cells. Continuing this example, in the recovery mode 163 or in the cooling mode 158, the controller 106 may select a method for controlling the activation / deactivation of the TEC 120 cells based on the temperature of the refrigeration chamber 102 and the desired performance profile (e.g., minimizing the cooling or recovery time). In this case, the controller 106 activates additional subsets of the TEC 120 cells not activated in the stable state mode 160. In addition, the controller 106 can select the current and / or duty cycle of the activated subsets of TEC 120 cells in the cooling mode 158 or in the recovery mode 163, in which case the controller 106 independently controls the current of each of the activated cell subsets TEC 120 and /. or the working cycle of each of the activated subsets of TEC 120 cells. controller 106 may select a method for controlling the activation / deactivation of TEC 120 cells based on the temperature of the refrigeration chamber 102 and the desired performance profile (e.g., minimizing the cooling or recovery time). In this case, the controller 106 activates additional subsets of the TEC 120 cells not activated in the stable state mode 160. In addition, the controller 106 can select the current and / or duty cycle of the activated subsets of TEC 120 cells in the cooling mode 158 or in the recovery mode 163, in which case the controller 106 independently controls the current of each of the activated cell subsets TEC 120 and /. or the working cycle of each of the activated subsets of TEC 120 cells. controller 106 may select a method for controlling the activation / deactivation of TEC 120 cells based on the temperature of the refrigeration chamber 102 and the desired performance profile (e.g., minimizing the cooling or recovery time). In this case, the controller 106 activates additional subsets of the TEC 120 cells not activated in the stable state mode 160. In addition, the controller 106 can select the current and / or duty cycle of the activated subsets of TEC 120 cells in the cooling mode 158 or in the recovery mode 163, in which case the controller 106 independently controls the current of each of the activated cell subsets TEC 120 and /. or the working cycle of each of the activated subsets of TEC 120 cells. minimizing the time of cooling down or returning to the normal state). In this case, the controller 106 activates additional subsets of the TEC 120 cells not activated in the stable state mode 160. In addition, the controller 106 can select the current and / or duty cycle of the activated subsets of TEC 120 cells in the cooling mode 158 or in the recovery mode 163, in which case the controller 106 independently controls the current of each of the activated cell subsets TEC 120 and /. or the working cycle of each of the activated subsets of TEC 120 cells. minimizing the time of cooling down or returning to the normal state). In this case, the controller 106 activates additional subsets of the TEC 120 cells not activated in the stable state mode 160. In addition, the controller 106 can select the current and / or duty cycle of the activated subsets of TEC 120 cells in the cooling mode 158 or in the recovery mode 163, in which case the controller 106 independently controls the current of each of the activated cell subsets TEC 120 and /. or the working cycle of each of the activated subsets of TEC 120 cells.

[0055] Figure 18 is a flowchart that illustrates a method of operating controller 106 to maintain the refrigeration chamber 102 at a preset temperature value according to another embodiment of the present disclosure. First, the temperature data for the refrigeration chamber 102 and the heat exchanger heat transfer side 104 are taken (step 1100). After receiving the temperature data, the controller 106 determines if the temperature of the refrigerating chamber 102 is greater than the upper threshold of the steady state range for the temperature of the refrigeration chamber 102 (step 1102). The stable state range is an acceptable temperature range for the refrigeration chamber 102 that includes the set temperature value. As an example, the range of the stable state can be a set temperature value plus or minus a predetermined deviation (eg 2 degrees).

[0056] If the temperature of the refrigeration chamber 102 is not above the lower threshold of the steady state range, the process returns to step 1100. However, if the temperature of the refrigeration chamber 102 is below the lower threshold of the steady state range, the controller 106 controls the TEC 120 cells to increase the temperature. a refrigeration chamber 102 (step 1106). Depending on the particular embodiment, the controller 106 increases the temperature of the refrigeration chamber 102 by deactivating one or more TEC cells, reducing the current being passed through one or more TEC 120 cells and / or reducing the duty cycle of one or more TEC 120 cells. 106 may selectively control various subsets of TEC 120 cells, controller 106 has substantial flexibility in the choice of method, in which the temperature in the refrigeration chamber 102 is increased. After controlling the TEC 120 cells to increase the temperature of the refrigeration chamber 102, the method returns to step 1100 and is repeated.

[0057] Returning to step 1102, if the temperature of the refrigeration chamber 102 is greater than the upper threshold of the steady state range, the controller 106 determines if the temperature of the refrigerating chamber 102 is greater than the predetermined maximum allowable temperature for the refrigeration chamber 102 (step 1108). If so, the procedure proceeds to step 1112. If not, the controller 106 controls the TEC 120 cells to reduce the temperature of the refrigeration chamber 102 (step 1110). The controller 106 controls the TEC 120 cells to reduce the temperature of the refrigeration chamber 102 by activating one or more previously deactivated TEC 120 cells, increasing the current through one or more activated TEC 120 cells from ICOPmax to a value greater than ICOPmax (e.g., I max) . activating the third subset of the TEC 120 cells to operate with QCOPmax or with a higher capacity than QCOPmax with the desired operating cycle (e.g. always on) and / or activating the fourth cell subset TEC 120 to operate with QCOPmax or with a higher efficiency than QCOPmax in the desired cycle working (eg always on). [0058] Next, depending on whether we follow the "yes" path of step 1108 or step 1110, the controller 106 determines whether the temperature of the heat exchanger heat transfer side 104 is greater than the predetermined maximum allowable temperature for the heat exchanger heat removal side 104 (step 1112). If so, the controller 106 controls the TEC 120 cells to lower the temperature of the heat exchanger components (step 1114). In particular, the controller 106 controls the TEC 120 cells to lower the temperature of the heat exchanger components 104 at the return side (e.g. heat sink 108 on the hot side). Lowering the temperature of the heat exchanger components 104 can be achieved by deactivating some or all of the TEC 120 cells by reducing the current being passed through some or all of the TEC 120 cells or by combining them. The process then returns to step 1100 and is repeated.

[0059] However, if the temperature on the heat exchanger 104 does not exceed the preset maximum temperature allowed, the controller 106 controls the TECs to reduce the temperature of the refrigeration tub 102 (step 1116). As discussed above, the controller 106 controls the TEC 120 cells to reduce the temperature of the refrigeration chamber 102 by activating one or more previously deactivated TEC 120 cells, increasing the current through one or more activated TEC 120 cells from ICOPmax to a value greater than ICOPmax ( e.g., max) and / or increasing the duty cycle of one or more activated TEC 120 cells. For example, if before the step 1116 the first subset of TECs (i.e., TEC cells 120a and 120b) is activated and operates with QCOPmax, but the remaining TEC 120 cells are inactivated, controller 106 can reduce the temperature of the refrigeration chamber 102 by increasing the current passed through the first subset of TEC 120 cells from ICOPmax to a value greater than ICOPmax (e.g., Imax) increasing the duty cycle of the first subset of TEC 120 cells, activating the second. a subset of TEC 120 cells to operate with QCOPmax or with a higher capacity than QCOPmax with a desired duty cycle (e.g., always on), activating the third subset of TEC 120 cells to operate with QCOPmax or higher than QCOPmax with desired cycle (e.g. . always on) and / or activating the fourth subset of TEC 120 cells to operate with QCOPmax or higher capacity than QCOPmax with the desired operating cycle (e.g. always on). After reducing the temperature of the refrigeration chamber 102 in step 1116,

[0060] For example, let us assume that the temperature data indicates that the refrigeration chamber 102 is at a temperature of 0.9 ° C and the return side of the heat exchanger 104 is at 19 ° C. In addition, for this example, the set temperature for the refrigeration chamber 102 is 2.2 ° C, the upper limit of the stable mode range is 5.0 ° C, the lower limit of the stable mode range is 1.0 ° C, the maximum allowed temperature in the refrigeration chamber 102 is 15 ° C, and the maximum allowable temperature on the heat exchanger side 104 is 20 ° C. In this example, the controller 106 first determines that the temperature of the refrigeration chamber 102 (0.9 ° C) does not exceed the upper threshold of the steady state range (5.0 ° C). Thus, the controller 106 executes step 1104, in which the controller 106 determines, that the temperature of the refrigerating chamber (0.9 ° C) is lower than the lower threshold of the steady-state range (1.0 ° C). Accordingly, the controller 106 performs step 1106 to increase the temperature of the refrigeration chamber 102. After step 1106, the controller 106 returns to step 1100 to receive updated temperature data and continue the process.

[0061] In another example, let us assume that the temperature data indicates that the temperature in the refrigeration chamber 102 is 14 ° C and the temperature of the heat exchanger side 104 is 18 ° C. In addition, in this example, the set temperature for the refrigeration chamber 102 is 2.2 ° C, the upper limit of the steady-state mode range is 5.0 ° C, the lower threshold of the steady-state mode range is 1.0 ° C, the maximum allowed the temperature in the refrigeration chamber 102 is 15 ° C, and the maximum allowable temperature on the heat exchanger side 104 is 20 ° C. In this example, the controller 106 determines that the temperature of the refrigeration chamber 102 (14 ° C) exceeds the upper threshold of the steady-state range (5.0 ° C). Thus, the controller 106 implements step 1108, in which the controller 106 determines, that the temperature of the refrigeration chamber 102 (14 ° C) is below the maximum allowed temperature in the refrigeration chamber 102 (15 ° C). Accordingly, the controller 106 performs step 1110 to thereby reduce the temperature of the refrigeration chamber 102. [0062] In the third example, the temperature data indicates that the temperature of the refrigeration chamber 102 is 17 ° C and the temperature of the heat exchanger 104 is 22 ° C. In addition, in this example, the set temperature for the refrigeration chamber 102 is 2.2 ° C, the upper threshold value of the steady state range is 5.0 ° C, the lower threshold value of the steady state range is 1.0 ° C, the maximum allowed chamber temperature The cooling system is at 15 ° C and the maximum allowed temperature of the heat exchanger side 104 is 20 ° C. In step 1102, the controller 106 determines that the temperature of the refrigeration chamber 102 is above the upper threshold of the steady state range. In this regard, the controller 106 implements step 1108, in which the controller 106 determines that the temperature of the refrigeration chamber 102 (17 ° C) exceeds the maximum allowed temperature in the refrigeration chamber 102 (15 ° C). Accordingly, the controller 106 executes step 1112, in which the controller 106 determines whether the temperature of the heat exchanger heat transfer side 104 exceeds the maximum allowable temperature on the heat exchanger 104 return side. According to an embodiment of the present disclosure, the maximum allowable temperature on the exchanging side of the heat exchanger 104 is the temperature above which the components of the heat exchanger 104 can be overheated and damaged. An example of a situation wherein the temperature of the heat exchanger return side 104 exceeds the maximum allowable temperature on the heat exchanger return side 104 is the case where there is a very large heat leakage in the refrigeration chamber 102, such as when the refrigerator door 102 is left open. In a situation in which the door of the refrigeration chamber 102 is left open, the thermoelectric refrigeration system 100 attempts to lower the temperature of the refrigerating chamber 102 to a preset temperature value. In this case, because there is a very large heat escape, the heat exchanger components 104 may not be able to lower the temperature of the refrigeration chamber 102 and may be overloaded and therefore overheated (i.e. the maximum allowable temperature on the heat exchanger side 104 may be exceeded) ). Another example of a situation where the temperature on the heat exchanger 104 is above the maximum allowable temperature on the heat exchanger 104 is the case where there is no proper heat transfer between the receiving circuit 114 and the refrigeration chamber 102 as if there is a blockage in circuit 114 to the host when there is a problem with the refrigerant circuit of the recipient circuit 114, etc. In the third example, the temperature on the heat exchanger side 104 (22 ° C) exceeds the maximum allowable temperature on the heat exchanger side 104 (20 ° C). Accordingly, the controller 106 implements step 1114, in which the controller 106 reduces the temperature of the heat exchanger components 104. in which the temperature at the heat exchanger 104 is above the maximum allowable temperature on the heat exchanger 104 is the case where there is no proper heat transfer between the receiving circuit and the refrigeration chamber 102, such as when there is a blockage in the receiving circuit 114 when it occurs a problem with the cooling medium of the recipient circuit 114. In a third example, the temperature on the heat exchanger side 104 (22 ° C) exceeds the maximum allowable temperature on the heat exchanger side 104 (20 ° C). Accordingly, the controller 106 implements step 1114, in which the controller 106 reduces the temperature of the heat exchanger components 104. in which the temperature at the heat exchanger 104 is above the maximum allowable temperature on the heat exchanger 104 is the case where there is no proper heat transfer between the receiving circuit and the refrigeration chamber 102, such as when there is a blockage in the receiving circuit 114 when it occurs a problem with the cooling medium of the recipient circuit 114. In a third example, the temperature on the heat exchanger side 104 (22 ° C) exceeds the maximum allowable temperature on the heat exchanger side 104 (20 ° C). Accordingly, the controller 106 implements step 1114, in which the controller 106 reduces the temperature of the heat exchanger components 104. if there is no proper transfer of heat between the receiving circuit 114 and the refrigeration chamber 102, such as when there is a blockage in the receiving circuit 114 when there is a problem with the cooling medium 114 of the recipient circuit, etc. In the third example, the temperature at the heat exchanger side 104 (22 ° C) exceeds the maximum allowable temperature on the heat exchanger side 104 (20 ° C). Accordingly, the controller 106 implements step 1114, in which the controller 106 reduces the temperature of the heat exchanger components 104. if there is no proper transfer of heat between the receiving circuit 114 and the refrigeration chamber 102, such as when there is a blockage in the receiving circuit 114 when there is a problem with the cooling medium 114 of the recipient circuit, etc. In the third example, the temperature at the heat exchanger side 104 (22 ° C) exceeds the maximum allowable temperature on the heat exchanger side 104 (20 ° C). Accordingly, the controller 106 implements step 1114, in which the controller 106 reduces the temperature of the heat exchanger components 104. the temperature on the heat exchanger side 104 (22 ° C) exceeds the maximum allowable temperature on the heat exchanger side 104 (20 ° C). Accordingly, the controller 106 implements step 1114, in which the controller 106 reduces the temperature of the heat exchanger components 104. the temperature on the heat exchanger side 104 (22 ° C) exceeds the maximum allowable temperature on the heat exchanger side 104 (20 ° C). Accordingly, the controller 106 implements step 1114, in which the controller 106 reduces the temperature of the heat exchanger components 104.

[0063] Figure 19 is a flowchart illustrating a method of operating controller 106 to monitor the temperature on the heat exchanging side 104 of a heat exchanger 104 according to one embodiment of the present disclosure. First, the controller 106 receives temperature data (step 1200). In one embodiment, the temperature data corresponds to the temperature on the heat exchanger 104 return side. After receiving the temperature data, the controller 106 determines whether the temperature at the heat exchanger 104 is above the maximum allowable temperature on the heat exchanger 104, as described above with reference to step 1112 of Figure 18 (step 1202). If the temperature on the heat exchanger side 104 does not exceed the maximum allowed temperature, the method returns to step 1200 and is repeated.

Many parallel heat exchange systems [0064] In the embodiments described above, the thermoelectric refrigeration system 100 comprises a single heat exchange system (i.e. a single heat exchanger 104, a single take-up circuit 114 and a single return circuit 116). Figures 20A to 20C illustrate another embodiment of a thermoelectric refrigeration system 100 that includes two parallel heat exchange systems. It should be noted that although two parallel heat exchange systems are illustrated in the embodiment of Figures 20A to 20C, any number of two or more parallel heat exchange systems may be used. As shown in Figure 20A, the two parallel heat exchange systems are the same as the heat exchange system of Figure 1. In particular, the first heat exchange system includes a heat exchanger 104a that includes a heat side heat sink 108a, a cold side heat sink 110a, a cassette 112a positioned between the heat side heat sinks 108a and 110a, receive circuit coupled to the cold side heat radiator 110a and recirculation circuit 116a coupled to the heat side 110a. 108a hot side. The cassette 112a includes one or more TEC cells and preferably a plurality of TECs that are selectively controlled by the controller 106. In some preferred embodiments, the TECs are located on the combining plate that allows selective and independent control of one or more, preferably two or more subsets of TECs in the manner described above with reference to cassette 112 of Figure 1. Likewise, the second heat exchange system comprises a heat exchanger 104b, which comprises a heat side heat sink 108b, a cold side heat sink 110b, a cassette 112b located between the heat side heat sinks and cold side 108b and 110b, receive circuit coupled to the cold side heat sink 110b and the feed circuit 116b coupled to the heat side heat sink 108b. The cassette 112a includes one or more TEC cells and preferably a plurality of TECs that are selectively controlled by the controller 106. In some preferred embodiments, the TECs are located on the combining plate that allows selective and independent control of one or more, preferably two or more subsets of TECs in the manner described above with reference to cassette 112 of Figure 1. The operation of the two parallel heat transfer systems of Figure 20A and the control of the TECs in cassettes 112a and 112b are the same,

[0065] Parallel heat exchange systems provide an additional degree of freedom to the controller 106 when controlling the TEC links in the cassettes 112a and 112b. More particularly, in addition to the selective and independent control of one or more and preferably two or more subsets of TEC cells in the cassette 112 a, the controller 106 is also adapted for selectively and independently controlling one or more, preferably two or more subsets. TEC cells in cassette 112b, regardless of the subset (s) of TEC cells in cassette 112a. In one example, while operating in a stable state, the controller 106 may activate some or all of TEC cells in the cassette 112a, preferably with or near (e.g., slightly above or potentially below) QCOPmax and deactivate all of the TECs in the cassette 112b, as shown in Figure 20B. Conversely, during the cooling or recovery operation, the controller 106 may activate any previously deactivated TEC cells in the cassette 112a and activate some or potentially all of the TEC cells in the cassette 112b, as illustrated in Figure 20C. During cooling or return to normal state, the activated TECs preferably operate with QCOPmax, Qmax or with a certain value between QCOPmax and Qmax.

[0066] One non-limiting advantage of parallel heat exchangers 104a and 104b is the ability to completely isolate a large number of TEC cell subsets while providing high recovery efficiency without the parasitic losses associated with deactivated TECs located in the same heat exchanger 104a, 104b, as active TEC cells. Another non-limiting advantage of parallel heat exchangers 104a and 104b is related to efficiency maximization by better balancing different control regimes for significant volume / heat dissipation areas of the heat exchanger.

Cascade heat exchangers [0067] In a further embodiment of the present disclosure, TEC cell meshes can be cascaded to maintain different refrigeration chambers at different set temperature values. In one embodiment, the single thermoelectric refrigeration system may comprise a first refrigeration chamber and a second refrigeration chamber, each having a different set temperature value. In one embodiment, the first set of TEC cells (e.g., TEC cells in the first cartridge) provides cooling to the first refrigeration chamber. In addition, the second set of TEC cells (e.g., the second cassette) provides cooling to the second cooling chamber, the temperature set point of the second cooling chamber being lower than the first cooling chamber. In this embodiment, the first and second sets of TEC links are thermally coupled to each other by means of cascade heat sinks. In this embodiment, while cooling the first refrigeration chamber, the first set of TECs extracts the heat from the first refrigeration chamber and acts to return the extracted heat to the environment outside the first refrigeration chamber. In this embodiment, while cooling the second refrigeration chamber, the second set of TECs extracts the heat from the second cooling chamber and then acts to return the extracted heat to the first set of TEC cells. In this case, the first set of TEC cells operates to return the extracted heat from the second refrigeration chamber to the environment outside the first and second refrigeration chambers. In this embodiment, the first set of TECs can operate independently of the second set of TECs. In particular, the first set temperature value may be different from the second set temperature value. In addition, the operation modes of each of the refrigeration chambers may be different (e.g., the first cooling chamber may be in a cooling state, while the second cooling chamber is in a stable state due to the opening of the first refrigerator chamber).

[0068] In this context, Figure 21 illustrates a thermoelectric refrigeration system 188 comprising cooling chambers 186 and 188 according to an embodiment of the present disclosure. In this embodiment, the refrigeration chambers 186 and 188 have different setpoint temperatures. For example, if the thermoelectric refrigeration system 184 is a home refrigerator, the refrigeration chamber 186 may correspond to a freezer and the refrigeration chamber 188 may correspond to a refrigerator. The thermoelectric refrigeration system 184 also includes a heat exchanger 190 according to yet another embodiment of the present disclosure. In this case, the heat exchanger 190 includes a heat side heat sink 192 and two cold side heat sinks, namely, a cold side radiator 194 and a cold side heat sink 196.

[0069] Heat exchanger 190 also includes cassettes 204 and 206. Cassette 204 thermally engages both the cold side radiator 194 and the hot side heat sink 196. Cassette 204 includes the TECs described above with reference to cassette 112 of Figure 1, in which the cold side of the TECs is thermally coupled to the cold side radiator 194 and the heat side of the TECs is thermally coupled to the cold side heat sink 196. In addition, the TEC cells located in the cassette 204 may include any number of TEC links as described above with reference to Figures 3 to 8. The TECs in the cassette 204 facilitate heat transfer between the cold side radiator 194 and the cold side radiator 196. Heat,

[0070] The cassette 206 is located between the heat side heat radiator 192 and the cold side heat sink 196. The cassette 206 includes the TECs described above with respect to the cassette 112 of Figure 1, wherein the cold side of the TEC links is thermally coupled to the cold side heatsink 196, and the heat side of the TECs is thermally coupled to the heat side heat radiator 192. The TEC cells in cassette 206 facilitate heat transfer between the cold side radiator 196 and the hot side heat sink 192. Furthermore, the TEC cells located in the cassette 206 may comprise any number of TEC links as described above with reference to Figures 3 to 8. In this embodiment, the heat transferred between the cold side radiator 196 and the heat side heat sink 192 is extracted from the chamber 188 by means of a refrigerating circuit 210 and,

[0071] Each of the receiving circuits 208 and 210 operates in a similar manner to that described above with respect to the receiving cycle 114 of Figure 1. In particular, as described above with respect to the receiving cycle 114, each of the recipient circuits 208 and 210 facilitates extraction heat from the cooling chamber (ie, respectively, a refrigeration chamber 186 or 188). The TECs in each of the cassettes 204 and 206 can be controlled separately. In this way, in other words, the subsets of the TEC cells in each of the cassettes 204 and 206 are separately controllable in order to maintain the set temperature values ​​in the refrigeration chambers 186 and 188.

[0072] As mentioned above, each of cassettes 204 and 206 comprises TEC cells having the above-described functionality. In one embodiment of the present disclosure, cassette 206 includes a larger number of TEC links than cassette 204 so that cassette 206 can facilitate heat transfer from both receiving circuits 208 and 210. For example, if one or more subsets of the TEC cells in the cartridge 204 are activated, the TEC cells in the cartridge 206 must be controlled to have sufficient capacity to transfer the heat extracted through the receiving circuit 208 as well as the heat extracted through the receiving circuit 210. For example, if the four TEC cells in the cartridge 204 operate with QCOPmax, more than the four TEC cells in cassette 206 should also work with QCOPmax to provide a tapping efficiency for transferring heat transmitted by the activated TEC cells in cassette 204. In addition, if heat is also to be extracted through the receiving circuit 210, the TEC cells in cassette 206 are furthermore, controlled to provide additional efficiency for extracting the desired amount of heat by means of the recipient circuit 210. [0073] During operation of the thermoelectric refrigeration system 184, the controller 212 controls the TEC cells located inside the cassettes 204 and 206 to maintain the desired set temperature values ​​in the refrigeration chambers 186 and 188. In particular, in order to maintain the desired set temperature value inside the refrigeration chamber 186, the controller 212 controls the TEC cells located in the cassettes 204 and 206 based on the temperature in the refrigeration chamber 186 and, in some embodiments, the temperature on the heat exchanger 190 return side, as described above with reference to Figures 15 to 19. Thus, in In one embodiment, the controller 212 receives temperature data for both the refrigeration chamber 186 and the heat exchanger 190 return side and selectively controls the TEC cells located within the cassettes 204 and 206 to maintain the desired set temperature in the refrigeration chamber 186. Generally, the controller 212 detects an operating mode (i.e. stable mode, recovery, cooling, etc.) and then activates / deactivates TEC cells in cassettes 204 and 206,

[0074] For example, if the refrigeration chamber 186 is at a predetermined temperature value, the controller 212 controls the TECs inside the cassette 204 in such a way that the predetermined number of TECs required for operating in stable state of the refrigeration chamber 186 operates with QCOPmax. In this example, cassette 204 includes four TEC cells and three of the four TEC cells operate with QCOPmax. In addition, in the stable state of the refrigeration chamber 186, the controller 212 controls three or more TEC cells within the cartridge 206 such that the active TEC cells in the cartridge 204 operate with the QCOPmax in association with and supporting the three TEC cells in the cartridge 204 that operate with QCOPmax. In this example, if the controller 212 then detects that the refrigeration chamber 186 is in the recovery mode, the controller 212 selectively controls the TEC cells within the cartridge 204 to lower the temperature of the refrigeration chamber 186 to a predetermined temperature value. For example, the controller 212 may activate all of the four TEC cells in the cartridge 204 in such a way that all TEC cells in the cartridge 204 operate with Qmax. Furthermore, when the controller 212 activates all four of the TEC cells in the cartridge 204 with Qmax, the controller 212 also activates more TEC cells in the cartridge 206 to support the additional performance provided by the newly activated TECs in the cartridge 204.

[0075] As mentioned above, the thermoelectric refrigeration system 188 also includes a refrigeration chamber 188 in which the recipient circuit 210 facilitates the extraction of heat from the refrigeration chamber 188 as described above with respect to the receiving circuit 114 of Figure 1. The take-up circuit 210 is coupled with the cold side heatsink 196 in such a way that the cold side radiator 196 transmits the heat extracted from the refrigeration chamber 188 to the circuit 198, giving by means of the cassette 206 and the TEC cells placed therein. In this way, the circulation circuit 198 operates for the purpose of transferring the heat extracted from the refrigeration chamber 186 and the cooling chamber 188. As mentioned above, cassette 206 includes TEC cells that operate in conjunction with TEC cells located in cassette 204. In this case, cassette 206 includes additional TEC links,

[0076] In addition to controlling the TEC links located inside the cartridge 206 to promote heat transfer through the activated TECs located inside the cassette 204, the controller 212 selectively controls the TEC cells located inside the cassette 206 to maintain the desired temperature set within the refrigeration chamber 188 in accordance with the methods from Figures 15 to 19 described above. In this way, the controller 212 receives temperature data from the refrigeration chamber 188 and selectively controls the TECs located within the cassette 206, respectively. For example, in steady state mode, the controller 212 selects the TEC cells inside the refrigeration chamber 206 that does not facilitate heat transfer associated with the chamber. 186 cooling, so that the selected TEC cells work with QCOPmax. Continuing this example, when the driver 212 detects, that the refrigeration chamber 188 is in the recovery mode, in one embodiment, the controller 212 controls the selected TEC cells such that the selected TECs operate with Qmax. In addition, the controller 212 may select additional TEC cells that are not activated, such that these additional TECs operate with Qmax or at a certain point between QCOPmax and Qmax. In this situation, if the cassette 206 contains ten TEC links and four of the TEC links facilitate the transfer of heat associated with the refrigeration chamber 186, in the stable cooling chamber 188 mode, from the remaining TECs, the controller 212 can select three of the remaining TECs to operate. with QCOPmax. But,

[0077] In the above situation, from the activated TEC cells in cassette 206, four acted with QCOPmax to facilitate heat transfer from the refrigeration chamber 186. It should be noted that in the above situation, when the refrigeration chamber 188 was in recovery mode, according to embodiments of the present disclosure, the controller 212 was able to control four TEC cells that assisted heat transfer, heat extracted from the cooling chamber 18 in such a way that these four TEC cells worked with Qmax. In this case, the four TEC cells are still operating in order to keep the refrigeration chamber 186 at the set temperature (since the TEC cells only need to work with QCOPmax) while at the same time they support the temperature reduction of the refrigeration chamber 188 to a preset temperature (additional heat, which can be extracted between a point associated with QCOPmax and Qmax as shown with reference to Figure 2). It should be noted that all of the TEC cells in the cassette 206 may be controlled to operate with Qmax, when the refrigeration chamber 188 and the refrigeration chamber 188 are in recovery mode.

Thermal diode phenomenon and thermal insulation of the heat exchange system [0078] In some preferred embodiments of the present disclosure, the heat exchange systems disclosed here also provide for the phenomenon of thermal diode and thermal insulation of the heat exchanger from the refrigeration chamber (s) and external environment. This is advantageous because the phenomenon of the thermal diode and the thermal insulation of the heat exchanger (s) prevent or at least minimize the release of heat back from the ambient environment via the heat exchanger (s) to the refrigeration chamber (s). In this regard, Figure 22 illustrates one embodiment of the heat exchanger 104 of Figure 1, in which the heat exchanger 104 is thermally isolated from the refrigeration chamber 102 and the outer wall 118 of the thermoelectric refrigeration system 100 in a way,

[0079] As mentioned above with reference to Figure 1, the heat exchanger 104 includes a cold side heat sink 110 and a heat side heat sink 108, the cassette being positioned between the cold side radiator 110 and the hot side radiator 108. As shown in Figure 22, to provide heat insulation of the heat exchanger 104, the heat exchanger 104 is physically separated from and physically attached to the inner wall 115 by means of spacer elements 220. In particular, the spacer elements 220 engage the cold side heatsink 110 and the inner wall 115 so that the heat and thermal distances 220 separate the heat exchanger 104 from the inner wall 115 and simultaneously fix the heat exchanger 104 in the thermoelectric refrigeration system 100. According to one embodiment of the present disclosure, spacer elements 220 may be formed of any type of material that minimizes thermal conductivity, such as any material with low thermal conductivity, including ceramics, plastics, or the like. Furthermore, as can be seen with reference to Figure 22, a heat exchanger 104 is arranged between the inner wall 115 and the outer wall 118 (and therefore a refrigeration chamber 102), the heat exchanger 104 being also thermally insulated from the inner wall 115 and the outer wall. 118 by means of insulation 222.

[0080] When the heat insulation of the heat exchanger 104 is related to the phenomenon of the thermal diode provided by the circuit 114 and 116 receiving and returning heat from the external environment and heat exchanger 104 to the refrigeration chamber 102 when all TEC cells located in the cassette 112 are deactivated or are in the off state during the control of the working cycle. In one embodiment, the receiving and return circuits 114 and 116 operate according to thermosiphon principles (i.e., thermosiphons) and, as such, provide the thermal diode phenomenon. This phenomenon of the thermal diode is illustrated with reference to Figures 23 and 24. Figure 23 illustrates the transfer of heat through the heat exchange system, when one or more of the TEC cells in the heat exchanger 104 are activated or in the on state during the control of the operating cycle. As illustrated, when one or more of the TEC cells are turned on, the cooling medium in the receiving circuit 114 is condensed by the heat side radiator 110 of the cold heat exchanger 104 so that the liquefied coolant flows through the recipient circuit 114 by means of gravity. When flowing through the receiving circuit 114, the coolant extracts heat from the refrigeration chamber 102. The extracted heat evaporates the cooling agent. The evaporated coolant then returns to the heat sink of the cold side 110 of the heat exchanger 104 by means of buoyancy forces. This process is continued to facilitate the extraction of heat from the refrigeration chamber 102. On the contrary, on the side of donation, the heat exchange medium in the release circuit 116 is vaporized by the heat sink 108 of the warm heat exchanger 104 side. The evaporated heat transfer medium flows through the circulation circuit 116 by means of buoyancy forces, so that heat is released into the outside environmentNego. Due to this heat dissipation, the heat transfer medium is condensed and the condensed heat exchange medium returns to the heat side heat sink 108 by means of gravity. This process is continued in order to ensure the release of heat to the external environment.

[0081] When all TEC cells in the heat exchanger 104 are deactivated or in the off state during the cycle control, the receiving and return circuits 114 and 116 prevent heat transfer through the reception and return circuits 114 and 116 towards the refrigeration chamber 102 as shown in FIG. Figure 24. In particular, when all of the TEC cells are deactivated or in the off state during control of the duty cycle, the heat sink 110 of the cold heat exchanger 104 is no longer cold enough to condense the coolant in the reception circuit 114. As such, the cooling medium in the receiving circuit 114 receives evaporation and collects on the cold side heat sink 110, thereby preventing further heat transfer through the receiving circuit 114. Hence, it can be seen that the receiving circuit 114 provides a transfer from the refrigeration chamber 102 (i.e., extracting heat) but prevents the transfer of heat towards the refrigeration chamber 102 (i.e., the release of heat back into the refrigeration chamber 102). In this way, the receiving circuit 114 ensures the phenomenon of a thermal diode. In a similar manner, the heat side radiator 108 is no longer sufficiently warm to vaporize the heat exchange medium in the circulation circuit 116. As such, the heat exchange medium in the recirculation circuit 116 condenses and collects on the heat side heat sink 108, thereby preventing further heat transfer through the circulation circuit 116. Hence, it can be seen that the recirculation circuit 116 provides heat transfer from the heat exchanger 104 (i.e., heat acquisition), but prevents the transfer of heat towards the heat exchanger 104 (i.e.

exiting heat from the external environment back to the heat exchanger 104). In this way, the recirculation circuit 116 ensures the phenomenon of a thermal diode. Importantly, the thermal insulation of the heat exchanger 104 and the phenomenon of the thermal diode of the recipient and return circuit 114 and 116 enable: (1) deactivation of all TEC cells in the heat exchanger 104 without or with minimal heat return to the refrigeration chamber 102 and (2) controlling the working cycle of the TEC cells in the heat exchanger 104 without or with minimal heat transfer to the refrigeration chamber 102.

[0082] It is worth noting that although the heat exchange system of Figure 1 includes both recipient and receiving circuits 114 and 116, the present disclosure is not limited thereto. The heat exchange system may alternatively be a hybrid system that includes a receiving circuit 114 on the heat exchanger side 104 and an alternative heat exchange mechanism (e.g., a rib and fan) on the heat exchanger side 104. In this alternative embodiment, the receiving circuit 114 still provides the phenomenon of a thermal diode and prevents the heat from returning to the refrigeration chamber 102 when all of the TEC cells in the heat exchanger 104 are deactivated or in the off state during the cycle control as shown in Figure 25. As another alternative solution, the heat transfer system may be a hybrid system that includes a circuit 116 for giving heat exchanger 104 an alternative heat exchange mechanism (e.g., a rib and a fan) on the heat exchanger side 104. In this alternative embodiment, the recirculation circuit 116 provides the phenomenon of a thermal diode that prevents the heat from escaping from the external environment to the heat exchanger 104. [0083] Figure 26 illustrates the thermal insulation of heat exchanger 190 of Figure 21 according to one embodiment of the present disclosure. In this case, the heat exchanger 190 connects to the inner wall 200, which defines the refrigeration chamber 188 by means of the spacer elements 220. In particular, the spacer elements 220 engage the cold side radiator 194 and the inner wall 200 in such a way, that the heat and thermal distances 220 separate the heat exchanger 190 from the refrigeration chamber 188 and at the same time fix the heat exchanger 190 in a thermoelectric refrigeration system 184. The insulation 222 around the heat exchanger 190 thermally insulates the heat exchanger 190 from the refrigeration chamber 188 and the outer wall 202. Furthermore, in a similar manner to that described above, each of the circulating circuit 198 and receiving circuits 208 and 210 provides for the phenomenon of a thermal diode. It is worth noting that in this embodiment, there are two receiving circuits, namely receiving circuits 208 and 210, each of which provides a thermal diode phenomenon that prevents the heat from escaping back into the respective cooling chambers 186 and 188. Accordingly,

Configuration of Heat Sinks [0084] As mentioned above with reference to Figure 1, the receiving cycle 114 transfers the heat extracted from the refrigeration chamber 102 to the cold side heat sink 110 and the heat side radiator 108 transfers the heat extracted to the receiving circuit 116. Figure 27 is a schematic illustration of a cold side radiator 110 according to one embodiment of the present disclosure. It should be noted that although this discussion focuses on the cold side heat sink 110, this discussion applies equally to the cold side heat sinks 194 and 196 as well as the hot side heat radiators 108 and 192. The cold side radiator 110 includes two inlet / outlet connections 226/228, through which the coolant enters into and out of the cold side heat sink 110 after heat transfer through the refrigeration chamber 102 and / or one of the activated TEC cells of the TEC 120 cell mesh in the cassette 112. In particular, when the cooling medium flows into the inlet / outlet connections 226 / 228, the refrigerant contains heat extracted from the refrigeration chamber 102. The heat extracted from the refrigeration chamber 102 is transferred to the cooling medium by thermal convection, conduction and radiation and then to the cold side radiator 110 by means of thermal convection, conduction and radiation between the cooling medium and the cooling side 110 of the cold side. The heat extracted is then passed to the grid of the TEC 120 cells by ribs 230 located on the cold side heat sink 110 to the plate 232, as shown with reference to Figure 28,

[0085] As shown with reference to Figure 27, each of the ribs 230 has an elongated shape and suitably extends in length from L1 to L4. Furthermore, as can be seen with reference to Figure 28, the ribs 230 extend in height h and are spaced from each other in width w. In this way, each of the ribs 230 has an effective surface area for heat transfer, which is a function of length from L1 to L4 and height h. It should be noted that although the cold side radiator 110 is described to include ribs 230 having the configuration and dimensions mentioned above, the cold side radiator 110 may have ribs in any configuration and may have dimensions depending on thermal loads and space constraints. In some embodiments, the configuration and dimensions of the ribs 230 may be a function of the type of coolant used in the receiving circuit 114 and the temperature difference between the refrigeration chamber 102, the heat exchanger 104 and the ambient temperature. In addition, the dimensions and configuration of the ribs 230 may also be a function of the fluid pressures in the receiving circuit 114 and the release circuit 116 and any heat leakage in the thermoelectric refrigeration system 100.

[0086] Figure 29 illustrates another embodiment of a cold side heat sink 110 that includes a heat sink 234. In one embodiment, the thermoelectric refrigeration system 100 does not include a return manifold 116, but instead a heat radiator 234 where the thermoelectric refrigeration system 100 includes a fan (not shown) that discharges the heat absorbed by the heat radiator 234 into the external environment outside the thermoelectric refrigeration system 100. . Furthermore, in a further embodiment of the present disclosure, the thermoelectric refrigeration system 100 may include both a heat sink 234 and a recirculation circuit 116, thereby forming a hybrid configuration,

Separated Heat Exchanger Some embodiments of the present disclosure maximize, or at least increase, the thermoelectric capacity of the cooling system by increasing the available surface area of ​​the inner wall of the refrigeration chamber and / or the available surface area of ​​the outer wall that is accessible to heat through the circuits respectively receiving and donating. Generally, these embodiments are provided by a heat exchanger having physically separated or disconnected, heat and cold side radiators that are thermally coupled through the heat conduit. In one embodiment, the cassette containing the TECs is physically attached to the cold side radiator, wherein the heat conduit thermally couples the warm side of the TEC cells to the heat side of the heat sink.

[0088] In this regard, Figure 30 illustrates one embodiment of a heat exchanger that includes a heat conduit 236 that allows physical separation of the cold side heat sink 110 from the heat side heat sink 108. According to embodiments of the present disclosure, the thermal conduit 236 may be any device suitable for conduction of heat between the cold side radiator 110 and the hot side heat sink 108. Examples of devices that can be used for a thermal conduit 236 include a conventional heat pipe, wherein the heat conduit enables passive heat transfer downward from the cold side radiator 110 to the heat side heat sink 108.

[0089] In an alternative embodiment, the thermal conduit 236 may include a convection coupling that operates in conjunction with the plenum to facilitate heat transfer between the cold side radiator 110 and the heat side heat sink 108. Furthermore, in another embodiment, the thermal conduit 236 may comprise a fluid circuit including a heat exchange fluid, the pump pumping the heat exchange fluid between the cold side heat radiator 110 and the hot side heat radiator 108. In an embodiment in which the heat conduit 236 comprises a fluid circuit, the heat transfer fluid raises heat from the cold side radiator 110 to the heat side heat sink 108. In addition, the heat conduit 236 can transfer heat by direct conduction,

The thermal conduit 236 is physically and thermally coupled to the cassette 112, using any well-known technique, such as a spacer plate, wherein the spacer plate connects to the TEC 120 cells located inside the cassette 112. As mentioned above, during the cooling of the chamber 102 in the cooling chamber, the heat from the refrigeration chamber 102 is thermally transferred to the recipient circuit 114. The heat from the receiving circuit 114 is then thermally transferred to the TEC 120 cells located inside the cassette 112, also as described above. The heat is transferred from the TEC 120 cells to the thermal conduit 236, and the thermal conduit 236 transfers the heat to the heat side heat sink 108. In addition, the heat conduit 236 physically and thermally couples the heat side radiator 108 using a well-known technique, such as a mechanical assembly 237 in which the heat conduit 236 engages directly with the heat side radiator 108. It should be noted that in an alternative embodiment, the thermal conduit 236 is connected directly to the heat side heat sink 108 in such a way that the mechanical assembly 237 is not needed. It should be noted that although the cassette 112 is shown as thermally coupled to the cold side of the radiator 110 in such a way that the heat conduit 236 thermally engages the cassette 112 and the heat side heat sink 108, the cassette 112 can be thermally coupled to the heat side radiator 108 in such that the thermal conduit 236 can directly thermally engage the cold side heatsink 110 and the cassette 112 when the cassette 112 is coupled to the heat side heat sink 108. It should be noted that any methodology can be used to separate the cold side heat sink 110 from the heat side heat sink 108 when the cold side heat sink 110 and the heat side heat sink 108 are thermally coupled to each other. For example, the cold side radiator 110 and the heat side heat sink 108 may be coupled conductively and convectionally. Furthermore, the cold side radiator 110 and the heat side heat sink 108 may be thermally coupled using a circulation circuit with a pump or may be coupled to each other with radiation.

[0091] Figure 31 is a diagram illustrating the heat flow for the heat exchanger 104 of Figure 30 according to one embodiment of the present disclosure. In particular, the heat is extracted from the refrigeration chamber 102, as determined by Q-AMCING-EC and then moved to the heat conduit 236, as indicated by Q-AMPING. The heat conduit 236 then transfers the heat to the return circuit 116 as marked by the QODDING-WE, the heat being ultimately discharged into the environment outside the refrigeration chamber 102, as shown under QODDICTION. [0092] In embodiments where the heat conduit 236 separates the cold side radiator 110 from the heat side heat sink 108, the cold side heat sink 110 is spaced from the heat side heat sink 108 so that, in one embodiment, The cold side radiator 110 is located in the upper part of the thermoelectric refrigeration system 100, and the heat side heat sink 108 is located in the lower part of the thermoelectric refrigeration system 100 as shown with reference to Figures 32 and 33. In embodiments where the cold side heat sink 110 is located in the upper part of the thermoelectric refrigeration system 100, the receiver circuit 238 may surround a larger surface area of ​​the refrigeration chamber 102 in such a way that more heat is transferred between the refrigeration and refrigeration chamber 102 in the receiving circuit 238, i.e. a larger surface area between the refrigeration chamber 102 and the receiving circuit 238. In particular, because the receiving circuit 238 connects thermally to a major part of the refrigeration chamber 102,

[0093] In addition, in embodiments where the heat side radiator 108 is located at the bottom of the thermoelectric refrigeration system 100, the donor circuit 240 may extend from the bottom of the thermoelectric refrigeration system 100 to the top of the thermoelectric refrigeration system 100 as shown in reference to Figures 32 and 33, in such a way that the recirculation cycle 240 has a larger surface area exposed to the outside of the refrigeration chamber 102. In this case, more heat may be transferred between the circulation circuit 240 and the environment outside the refrigeration chamber 102, again thanks to the advantage i.e. a larger surface area between the circulation circuit 240 and the ambient atmosphere, which is outside the chamber

102 refrigeration. It should be noted that although Figures 32 and 33 illustrate a cold side radiator 110 located at the top of the thermoelectric refrigeration system 100 and a heat side heat radiator 108 located at the bottom of the thermoelectric refrigeration system 100, in embodiments comprising a heat conduit 236, the cold side heat sink 110 may be located at any location in the thermoelectric refrigeration system 100, and the heat side heat sink 108 may be located at any location of the thermoelectric refrigeration system 100, the distance between the cold side radiator 110 and the heat side heat radiator 108 being maximized relative to the physical dimensions of the device in which examples are realized the implementation of this disclosure. With reference to heat pipe 236,

Fastening a two-phase heat exchanger [0094] Traditionally, heat exchangers are mounted vertically to provide maximum fluid velocity in two-phase gravity-assisted heat exchange systems. However, the vertical configuration generates a horizontal thermal gradient between the heat pump delivery or receiving surfaces and the outermost surfaces of the heat exchanger. The inventors have found that by fixing the heat exchanger at an angle deviated from the vertical, the gradients can be minimized, thus maximizing the efficiency for a given surface area and system structure.

[0095] Figures 34 to 37B relate to the attachment of a dual-phase heat exchanger 242 in a thermoelectric system according to embodiments of the present disclosure. The thermoelectric system in which the two-phase heat exchanger 242 is fixed may be a thermoelectric refrigeration system, such as or similar to the one described above, or some other type of thermoelectric system (e.g., a thermoelectric power generator). As shown in Figure 34, a two-phase heat exchanger 242 includes a heat side heat sink 244, a cold side heat sink 246, and one or more TEC 248 cells disposed therebetween. In particular, the TEC 248 cells are positioned in such a way that the heat sides of the TEC 248 cells are physically and thermally coupled to the heat dissipater 250, wherein the heat dissipater 250 is either part of the heat sink heat sink 244, or it is physically and thermally coupled to a hot side heat sink. In a similar manner, the cold sides of the TEC 248 cells are physically and thermally coupled to the heat dissipater 252, wherein the heat dissipater 252 is either part of the cold side heat sink 246, or is physically and thermally coupled to the cold side heat sink 246.

[0096] The cold side radiator 244 comprises a chamber 254 having an inlet connection 256. In this embodiment, the inlet pipe 258 is connected to the inlet port 256. The inlet pipe 258 may be coupled to any suitable heat exchange mechanism. In one embodiment, the inlet pipe 258 is connected to a breathing circuit that operates according to thermosiphon principles, such as the embodiments of the donor circuit described above. The chamber 254 is filled with a working fluid. In operation, when the TEC 248 cells are active, the hot sides of the TEC 248 cells vaporize the work fluid 260 and the vaporized working fluid is transported upward through the inlet port 25 to the inlet tube 258 by means of buoyancy forces. After passing through the inlet pipe 258,

[0097] In a similar manner, the cold side radiator 246 comprises a chamber 262 having an inlet connection 264. In this embodiment, the inlet pipe 266 is connected to the inlet port 264. The inlet pipe 266 may be coupled to any suitable heat exchange mechanism. In one embodiment, the inlet pipe 266 is coupled to a receiving circuit that operates in accordance with the thermosiphon principles, such as, for example, embodiments of the receiving circuit described above. In operation, when the TEC 248 cells are active, the cold sides of the TEC 248 cells condense the working fluid in the chamber 262. The liquefied working fluid then flows from the chamber 262 through the inlet port 264 to the inlet pipe 266 by means of gravity. After passing through the inlet pipe 266,

[0098] As shown, a two-phase heat exchanger 242 is mounted at an angle (α) to the vertical. First, the angle (α) is selected to ensure that the fluid 260 operating in the chamber 254 of the heat sink 244 directly hits the area 268 of the maximum heat flow on the wall 254 of the chamber at the heat dissipator 250 and the sides of the warm cells TEC 248. More particularly, the angle (α ) is selected in such a way that, when the TEC 248 cells are active, the working fluid level 270 in the chamber 254 (i.e., the working fluid level 260 in the chamber 254) is at or slightly above the region 268 of the maximum heat flux. As a result, the working fluid 260 must hit directly into the region 268 of the maximum thermal flux, which in turn improves the efficiency of the two-phase heat exchanger 142. In other words, by choosing the angle (α) in such a way, that the working fluid level 270 is at or above the region 268 of the maximum heat flux, the surface area 268 of the maximum heat flux that is in thermal contact with the working fluid 260 is increased, which in turn provides greater heat transfer efficiency from the warm cell sides TEC 128 for working fluid 260. For comparison, if a two-phase heat exchanger 242 is mounted vertically, with the same amount of working fluid, the working fluid level 270 in chamber 254 would fall well below the top of the maximum thermal flux region 268, which in turn reduces the surface area 268 of the maximum thermal flux that is in contact with the working fluid and therefore the efficiency of heat transfer from the TEC 248 hot sides to the working fluid.

[0099] The selection of the angle (α) in such a way that the working fluid level 270 is above or above the region 268 of the maximum thermal flux also separates the flow of the condensed working fluid from the flow of the vaporized working fluid. More particularly, as illustrated, droplets of condensed working fluid flow into chamber 254 of heat side heat sink 244 through inlet port 256. Due to the angle (α) at ​​which the two-phase heat exchanger 242 is mounted, droplets of condensed working fluid are attracted by gravity in such a way that they flow through the lower half of the inlet port 256 and then flow down the chamber wall 25 with heat dissipator 250 and TEC cells 248. In contrast, the vaporized working fluid flows up due to buoyancy forces and through the upper half of the inlet connection port 256. In this way,

[0100] In addition, the angle (α) is also selected to ensure that the vaporized working fluid in the chamber 262 of the cold side radiator 246 directly hits the region 272 of the maximum thermal flux on the wall of the chamber 262 at the heat dissipater 252 and the sides of the cold cells TEC 248. More particularly, due to the angle (α), gravitational forces cause droplets of condensed working fluid to drop from the chamber wall 262 at heat sink 252 and TEC 248 to the opposite wall 262. The droplets then flow through the lower half of the inlet 264 and the inlet pipe 266. . Conversely, the vaporized working fluid flows into the chamber 262 through the upper half of the inlet port 264 and flows up into the region 272 of the maximum heat flux.

[0101] The optimum angle (α) depends on various parameters, including the geometry of a two-phase heat exchanger 242 (e.g., height to width ratio of two-phase heat exchanger 242), location of TEC 248 cells in a two-phase heat exchanger 242, heat spreader structure 250 and 252, location and orientation of inlet ports 258 and 264 and inlet pipes 258 and 266, and geometry of any surface enlargement elements present in the two-phase heat exchanger 242. Each specific implementation of a two-phase heat exchanger 242 will have its own optimal angle value (α). In one embodiment, the angle (α) ranges from 2 degrees to 88 degrees, inclusive. In another embodiment, the angle (α) ranges from 6 degrees to 84 degrees, inclusive. In yet another embodiment, the angle (α) ranges from 12 degrees to 78 degrees, inclusive. Figure 35 illustrates one particular example of a two-phase heat exchanger 242 of Figure 34. In this example, the height of the two-phase heat exchanger 242 is 75 millimeters (mm) and the distance between the 244 warm side heat sink and the cold side heatsink 246 is 10 mm. In this example, the optimal angle (α) is 29 degrees. It should be noted that this example also illustrates threaded connections 274 and 276 and spacer elements 275 into which screws 278 can be screwed in for the purpose of physically attaching the heat side heat sink 244 and the cold side heat sink 246. Also, as discussed below, the screws 278 can be used to mount a two-phase heat exchanger 242 in a thermoelectric system so as to maintain the desired angle (α) relative to the vertical.

[0103] TEC cells, such as TEC 248 cells, are sensitive to degradation of performance and damage by the formation of a vapor condensate on the conductive legs of the modular assembly. For this reason, TEC cells are often filled with sealing material around the circumference of the TEC cells. This flooding introduces a thermal short circuit of the TEC cells, which reduces the efficiency and efficiency of the TEC cells. Figure 36A illustrates one embodiment of a two-phase heat exchanger 242 that provides insulation and protection against condensate formation of TEC 248 cell pairs, which in turn improves efficiency, heat pumping ability and efficiency of a two-phase heat exchanger 242 while simplifying production and reducing costs. It should be noted that the concepts of Figure 36A are not limited to the use of a two-phase heat exchanger 242. Rather,

[0104] As illustrated in Figure 36A, a two-phase heat exchanger 242 is surrounded by a suitable water-resistant 280, such as, for example, an expanded foam insulation matrix. In this embodiment, the two-phase heat exchanger 242 is surrounded in such a way that the two-phase heat exchanger 242 is kept at an angle (α) inside the water-resistant matrix 280. Furthermore, in this embodiment, a small pocket 282 of air or a similar gas with low conductivity or the empty space is created around the TEC 248 cells. The waterproof 280 warp screen eliminates the need to flood TEC 248 cells to minimize oxidation and damage through vapor condensation. In particular,

[0105] Figure 36B illustrates an embodiment in which a two-phase heat exchanger 242 is surrounded by a water-resistant matrix 280 in such a way that the two-phase heat exchanger 242 is vertical with respect to the enclosed structure. In this embodiment, a two-phase heat exchanger 242 is mounted using a corresponding fastening structure 284 that provides the desired angle (α) to the vertical. The fastening construction 284 is preferably thermally insulated (e.g., made of thermally insulating plastic material).

[0106] Figure 37A illustrates a biphasic dual heat exchanger 242 of Figure 36A mounted on a wall 285 of a thermoelectric system (e.g., an inner wall of a thermoelectric refrigeration system) in one embodiment of the present disclosure. The enclosed two-phase heat exchanger 242 can be mounted on the wall 285 using a suitable mechanism. For example, the screws 278 may extend from the enclosed two-phase heat exchanger 242 into the wall 285 or the wall mounting plate 285. However, again, any suitable mechanism may be used to attach the enclosed two-phase heat exchanger 242 to the wall 285. [0107] Figure 37B illustrates an embodiment of the enclosed two-phase heat exchanger 242 of Figure 36B, wherein the surrounded two-phase heat exchanger 242 is attached to the wall 285 of the thermoelectric system (e.g., to the inner wall of the thermoelectric refrigeration system) in such a way as to keep the angle (α) relative to the vertical. As shown, the biphasic heat exchanger 242 is attached to a thermoelectric system by means of a fastening structure 284 that maintains the relative orientation of the enclosed two-phase heat exchanger 242 (i.e., the fastening structure 284 maintains the angle (α) relative to the vertical). In one embodiment, the attachment structure 284 is a thermally insulating fastening construction 284 formed of a suitable material such as, for example, thermally insulating plastic material. The attachment structure 284 may be separate from or integrated with the enclosed two-phase heat exchanger 242. For example, in one embodiment, the enclosed two-phase heat exchanger 242 is screwed to the fastening structure 284, the fastening structure 284 being attached to or integrated with the corresponding wall of the thermoelectric system. As another example, the fastening construction 284 may be attached to the enclosed two-phase heat exchanger 242 and surrounded, at least in part, by the water-resistant matrix 280. The fastening construction 284 is then screwed or otherwise attached to the wall 285 of the thermoelectric system in such a way that it is retained desired angle (α) relative to the vertical.

[0108] Figure 38 is a block diagram of a controller 106 according to one embodiment of the present disclosure. The discussion is equally applicable to the controller 212. In this embodiment, the controller 106 includes a hardware processor 286 and memory 288 associated with a hardware processor 286. In one embodiment, the memory 288 stores instructions that allow the hardware processor 286 to perform the above-mentioned operations according to various embodiments of the present disclosure.

such that the thermoelectric refrigeration systems 100 and 184 described above can be used in heat recovery / power generation applications. Furthermore, it should be noted that although the processes described above have been described with reference to the thermoelectric refrigeration system 100, they can also be used in a thermoelectric refrigeration system 184. Thus, the methods described in detail above with reference to Figures 17 to 19 can be used in a thermoelectric refrigeration system 184.

Phononic Devices, Inc.

Proxy:

PL-PAT-2012-850

EP 2 847 524 B1