Electronic control enclosure

TECHNICAL FIELD OF THE INVENTION [0001] The present invention relates generally to electronic control units and more specifically to an electronic control enclosure housing the electronic components of an electronic control unit, which cover is adapted to dissipate heat from inside the housing.

BACKGROUND OF THE INVENTION [0002] Electronic control units are typically used in various applications to control electronic or electrical devices and are accordingly made of many electronic components. Often, electronic components are attached to the printed circuit board to both create an electrical connection between the components and to keep the components in a tightly grouped assembly. To protect electronic components from damage due to impacts from external objects and to facilitate the separation and attachment of the electronic control unit, the components are also often housed in a protective shielding housing.

[0003] In some applications, the electronic control unit must be placed in a particularly onerous environment. For example, the electronic control unit may be located in or on a vehicle or similar transport mechanism to control, for example, timing and engine operation. Such use may expose the electronic control unit to dust and dirt in the air, which, if allowed into the protective housing, may damage the electronic components. Therefore, it is often desirable for the enclosure to be sealed from the environment. However, since the electronic components located in the shielding housing usually generate thermal energy during operation that could potentially damage the components, measures must be taken to cool these components.

Document US 6.094.349 A shows an electrical device that includes a housing having an opening on the front side which is closed by a cover. The printed circuit board arranges the electronic components and is connected to the housing.

BRIEF SUMMARY OF THE INVENTION [0004] The invention relates to a method for making an electronic control cover. The electronic control cover is used for protective storage and thermal storage of the control unit components. The electronic control cover includes a shielding housing that defines an internal chamber in which electronic energy can be removed and protected electrical components. To create an electrical connection between the electrical components and one or more external electrical sources, the electronic control cover may also include a front assembly and a ground assembly. The front assembly includes a front plate in which sockets are created in which electrical wires and plugs from external sources can be inserted. A ground assembly is attached to the front assembly with a ground assembly that has conductive pathways formed thereon. Various components are attached to the ground in an integrated manner that form the electronic control unit. Between these elements are electronic components that, because they produce thermal energy during their operation, contain exposed heat transfer surfaces for dissipating thermal energy. Discrete transistors such as devices are examples of such electronic components

MOSFET.

[0005] To remove the heat generated from electronic components in one aspect of the invention, the electronic control unit includes a heat sink having both an inner surface exposed to the inner chamber and an outer surface exposed on the outer side of the screening enclosure. The heat sink can through the protective housing. In other embodiments, the screening enclosure may be a heat transfer material such as metal, and the heat sink is integral with the screening enclosure. When the front assembly is inserted into the inner chamber, the electronic components attached to the ground line up along the heat sink. To ensure that thermal energy is properly transferred from the examples passed from electronic components to the heat sink and thus removed from the inner chamber to the outer surface, a spring is located inside the inner chamber that presses the heat transfer surfaces towards the inner surfaces.

[0006] In another aspect of the invention, the heat sink may be formed as part of the front assembly. The electronic components are attached to or otherwise directly contact the heat sink. The ground with its electrical paths is also attached to the front assembly and an electrical connection is created between the electronic components and the ground. As soon as the front assembly is inserted into the inner chamber, the heat generated by the electronic components is transferred by heat sinks to the exposed parts of the front assembly, where thermal energy is dissipated to the external environment.

[0007] An advantage of the invention is that it provides an electronic control cover for protecting in a protected manner the electronic components of the electronic control unit. Another advantage is that the invention removes thermal energy produced by electronic components and transfers this thermal energy outside the electronic control cover. Another advantage is that the invention is adapted to improve the transfer of thermal energy between the exposed heat transfer surface of electronic components and the heat sink. These and other advantages and features of the invention will be apparent from the above detailed description and drawings.

BRIEF DESCRIPTION OF THE DRAWINGS [0008] Figure 1 is a perspective view from above of an electronic control cover for the protective storage of electronic components of an electronic control unit comprising two connected cables.

[0009] Figure 2 is a bottom perspective view of the electronic control cover of Figure 1, showing the outer surfaces of two heat sinks for transferring heat from the inner chamber, [0010] Figure 3 is a top view of the electronic control cover of claim 1.

[0011] Figure 4 is an exploded view of the electronic control cover of claim 1, showing parts of the electronic control cover comprising electronic components.

[0012] Figure 5 is a cross-sectional view taken along the lines 5-5 of Figure 3, showing the end assembly sealing the enclosure housing relative to the environment.

[0013] Figure 6 is a perspective view of the electronic control cover of Figure 1, showing the front assembly and the attached ground assembly inserted in the cover housing.

[0014] Figure 7 is a perspective view of the spring plate for pressing electronic components against the heat sinks in the cover of the electronic control of Figure 1.

[0015] Figure 8 is a cross-sectional view of the electronic control cover taken along the line 8-8 in Figure 3.

[0016] Figure 9 is a perspective view from above of the electronic control cover with the upper wall removed and the front assembly and substrate assembly inserted substantially into the preloaded position.

[0017] Figure 10 is a perspective view from above of the electronic control cover with the top wall removed and the front assembly and substrate assembly fully inserted into the load position.

[0018] Figure 11 is a top perspective view of another embodiment of an electronic control casing for protective storage of electronic components of an electronic control unit.

[0019] Figure 12 is a top perspective view of the electronic control cover of Figure 11, showing the front assembly and the ground assembly being inserted into the containment housing.

[0020] Figure 13 is a cross-sectional view taken along the lines 13-13 of Figure 11, showing the front assembly and the ground assembly inserted in the containment housing.

[0021] Figure 14 is a cross-sectional view taken along the line 14-14 of Figure 11, with the front assembly and the ground assembly inserted in the containment housing.

[0022] Figure 15 is a perspective view from the first side of the electronic control cover with the side removed to depict the front assembly and the ground assembly as being substantially inserted into the preloaded position.

[0023] Figure 16 is a perspective view from the first side of the electronic control cover with the side removed to depict the front assembly and the ground assembly as fully inserted into the load position.

[0024] Figure 17 is a perspective view of the spring plate for pressing electronic components against the heat sinks in the cover of the electronic control of Figure 11.

[0025] Figure 18 is a front perspective view of another embodiment of an electronic control casing for protective storage of electronic components of an electronic control unit.

[0026] Figure 19 is a top view of the electronic control cover of Figure 18.

[0027] Figure 20 is a top perspective view of the enclosure housing defining an inner chamber in which the electronic components of the electronic control cover of Fig. 18 receive.

[0028] Figure 21 is a bottom perspective view of the screening housing shown in Figure 20.

[0029] Figure 22 is a cross-sectional view taken along line 22-22 of Figure 19, showing the front assembly and the ground assembly inserted in the containment housing.

[0030] Figure 23 is a detailed view of the indicated area of ​​Figure 22, showing the ground assembly as being substantially inserted into the containment housing into a preloaded position.

[0031] Figure 24 is a detailed view of the indicated area of ​​Figure 22, showing the ground assembly as fully inserted into the containment housing into the load position.

[0032] Figure 25 is a top perspective view of another embodiment of an electronic control casing for protective storage of electronic components of an electronic control unit.

[0033] Figure 26 is a rear perspective view of the front assembly and the ground assembly of the electronic control cover of Figure 25.

[0034] Figure 27 is a side view of the front assembly and the ground assembly of Figure 26.

[0035] Figure 28 is an exploded view of the front assembly and the ground assembly of Figure 26.

[0036] Figure 29 is a perspective view of another embodiment.

[0037] Figure 30 is a cross-sectional view of the embodiment shown in Fig. 29.

DETAILED DESCRIPTION OF THE INVENTION [0038] With reference to the drawings in which similar reference numerals refer to similar elements, Figures 1, 2 and 3 show the external appearance of an embodiment of the electronic control cover 100 for an electronic control unit designed in accordance with the teachings of the present invention. The electronic control unit can be used to control external electrical devices. The electrical components and components forming the electronic control unit are located inside the electronic control cover 100 where they are protected from the external environment. To create a connection between the internal components and components and the electric devices located outside, one or more electric wires 102, which are terminated with plugs 103, are connected to the cover 100 of the electronic control.

[0039] The electronic control cover 100 may be attached to a panel 104 located near the external electrical devices by one or more connectors 106, although in other embodiments, the electronic control cover may be attached by other suitable fastening methods. With reference to Figures 1, 2 and 3, the electronic control cover 100 preferably has a generally rectangular, low height shape so that the electronic control unit will not interfere with other devices located in the surrounding environment. Since the elements and components forming the electronic control unit are kept protected under the cover 100 of the electronic control, the electronic control unit can be protected in harsh or dirty environments, such as the automotive engine compartment.

[0040] Various parts are shown in Fig. 4 that form the electronic control cover 100. To designate the inner chamber 112 for electronic components, a shielding housing 110 is used. The shielding housing 110 has an upper wall 114, an opposite bottom wall 116, a first and second side wall 118, 119, which extend between the upper and lower wall 114, 116. The top, bottom and side walls are integrally connected and arranged substantially perpendicular to each other to form a rectangular shape of the electronic control cover. To cover the inner chamber 112, the rear wall 120 extends adjacent to and is also integrally connected to the top wall, bottom wall and side walls. It should be noted that the terms "upper", "lower", "side" and "rear" are exemplary only and are not intended to limit the orientation of the enclosure or the electronic control cover in any way.

[0041] The screening enclosure may be made of any material, such as, for example, molded plastic, which preferably exhibits corrosion resistance properties. To shield the components of the electronic control unit that are located in the inner chamber from electromagnetic interference, the inner surfaces of the top, bottom and side walls can be coated with electromagnetic interference (EMI) shielding material. In other embodiments, the shielding housing may be made of a metallic material.

Supporting arms with sloping catches [0042] To gain access to the inner chamber, a portion of the shielding housing 110, opposite the rear wall 120, is formed as an opening 126. The opening 126 is defined by a rectangular rim 128, which is formed by the forwardmost edges of the upper wall, bottom and side walls 114, 116, 118, 119.

latching 130, terminated 132, extend from each side wall 118, 119 and protrudes forward from the rim 128. To attach the electronic control cover to the panel, from each side wall 118, 119, one or more mounting projections protrude from the bottom wall 116 134, through which the connectors 106 can be inserted.

[0043] To cover the opening 126 while creating an electronic connection to the inner chamber 112, the electronic control cover also includes a front assembly 140. The front assembly 140 has a generally flat front plate 142 that has a size that fits into the opening 126 and fits inside the periphery 128 One or more electrical terminals 144 pass through the front plate 142 and they are held by the front plate in a predetermined arrangement. To protect the outer parts of terminals 144 from damage and to align the plugs with the terminals on the front plate

103 with 142 arranged one or more socket walls 146 that surround the terminals.

[0044] The front plates 142 and socket walls 146 may be made of any suitable material, such as plastic, cast aluminum or magnesium. To secure the front assembly 140 to the shielding housing 110, latch latches 148 protrude from each side of the front plate 142. When the front plate 142 is aligned with the rim 128 that defines the opening 126, the latch latches 148 are similarly aligned with the latch arms 130 . Referring to Figures 2 and 4, when the front assembly 140 and the shielding housing 110 are moved together, the cantilever latch arms 130 enter and pass through the slots 150 defined by the latch latches 148. The latch latches 148 and the inclined latches 132 at the end of the latch arms 130 are adapted to initially deflect the cantilever latching arms 130 outward from the side walls 118, 119. However, as soon as the front plate 142 is within the periphery 128, it should be noted that the inclined catches 132 extend around and engage with the latch catches 148, thus holding the front assembly and the shielding housing together. It should be noted that, using the appropriate tools, the inclined catches 132 may be disengaged from the latch catches 148 to remove the front assembly from the shielding housing. It should also be noted that in other embodiments, the latch arms may be on the front plate and the latch latches may be on the shielding housing.

[0045] To seal the inner chamber 112 relative to the environment when the front assembly and the containment housing are held together, with reference to Fig. 5, the peripheral seal 152 is located between the front plate 142 and the rim 128. The peripheral seal 152 can be made of any suitable material such as natural or elastomeric rubber. To facilitate the positioning and seating of the peripheral seal 152, the rim 128 is formed with a sealing surface 154 that can slope backwards into the inner chamber 112. The seal 152 may have a C-shaped cross section that includes a central portion 153, internal leg 155 and an outer leg 157. The seal 152 may include protrusions 158 and / or recesses 159 that assist in forming a seal between the housing and the front plate. A circumferential gasket may be positioned opposite the periphery of the containment housing before the front plate and the containment housing are held together. The seal 152 fits onto the sealing surface 154 and the inner periphery of the housing. The front plate 142 includes a complementary projection 156 protruding from the side of the front plate opposite the receptacle walls 146. The projection 156 can be tilted backward inwards of the internal chamber 112. As can be seen, when the front plate 142 is embedded within the periphery 128, the peripheral seal 152 is compressed between the projection 156 and the sealing surface 154. Since the inner chamber is sealed to the environment, dust and dirt from the outside environment cannot get into the enclosure housing.

[0046] With reference to Fig. 4, to mount and interconnect the various electronic components of the electronic control unit, the electronic control cover includes a substrate assembly 160. The substrate assembly 160 is disposed around the substrate 162, such as the printed circuit board on which they are formed. electrically conductive circuit paths. Substrate 162 has a generally flat shape with opposing first and second surfaces 168, 169. The substrate 162 can be rigidly attached to the front assembly 140 so as to extend backwards from the bottom edge of the front plate 142.

[0047] As shown in Figures 4 and 5, to create an electrical connection between the conductors of the external devices and the ground assembly 162, the terminals 144 include terminal wires 161 on the rear side of the front plate 142, which are formed with right angles directing the terminals towards the ground. . The terminal 161 wires are soldered to and form an electrical contact with the conductive circuit paths on the ground 162. To prevent crosstalk or inductive interference between terminals 144, in an embodiment, the front assembly 140 may also include an induction ferrite filter block through which terminal wires 161 pass. As noted by industry experts, the filter block physically separates the terminal wires while at the same time shielding the terminals from electromagnetic and inductive interference.

[0048] The electronic components that form the electronic control unit are attached to the ground 162 so that the electronic components electrically connect to the conductive paths of the circuit. A typical electronic component in an electronic control unit is a discrete transistor that, as is well known to those skilled in the industry, acts as an electrical switch. One type of transistor particularly suitable for the electronic control unit is a half-transistor with the structure: metal, oxide, semiconductor (MOSFET). The MOSFET includes one or more legs, such as a gate, source or drain, which are soldered to the leg holes located in the substrate 162. Referring to Fig. 4, since such MOSFET 164 devices generate thermal energy during their operation, which, if not removed, may adversely affect and possibly damage the MOSFET device, the MOSFET device may include an exposed heat transfer surface 166 made of a heat conducting material.

[0049] Referring to Fig. 6, in the embodiment shown in the drawing, the MOSFET 164 devices protrude vertically from the first surface 168 and are arranged in two rows 170, 171 extending from a position approximately near the front plate 142 in the rearward direction. Rows 170, 171 are positioned along the first and second side edges 172, 174 of the substrate 162 so that the heat transfer surfaces 166 are directed outward. Inside the rows 170, 171, the MOSFET 164 devices are generally spaced apart.

[0050] The one or more spring plate 178 that is attached to the ground 162 is also part of the ground assembly 160 as shown in Figures 4 and 6. With reference to Fig. 7, the spring plate 178 is a generally flat, elongated structure that it can be made of any suitable material, such as extruded metal sheet. To maintain MOSFET spacing, the spring plate 178 includes a plurality of spacer elements 180 that extend along the length of the spring plate. The width of the translation elements 180 is approximately equal to the distance over which the MOSFET devices are spaced, while the distance between the sandwich elements is approximately equal to the width of the MOSFET device. A plurality of connecting elements 182, which are also formed in the spring plate 178, are located between the spacer elements 180 and are intended for individual contact with MOSFET devices.

[0051] As shown in Fig. 6, when attached to substrate 162, spring plates 178 extend along rows 170, 171 of MOSFET devices 164 with spacer elements and holding elements suitably connected to MOSFET devices. Referring to Fig. 7, to attach the spring plate 178 to the ground 162, one or more mounting protrusions 184 protrudes from the spring plate 178 that can enter into complementary slots in the ground. One of the mounting protrusions 184 may also include a locking protrusion 186 for locking the spring plate 178 in a vertical position on the substrate 162.

[0052] As shown in Fig. 6, to place MOSFET devices 164 in the inner chamber 112 so that they are protected in a protected manner inside the enclosure 110, the ground assembly 160 is inserted through the opening 112 towards the rear wall 120 until the front plate 142 will join the rim 128. The housing 110 may include raised surfaces or rails 187, 189 for supporting the substrate 162 as shown in Figures 5, 6 and 8. With reference to Fig. 8, when inserted into the inner chamber 112, the substrate 162 extends laterally between the first and second side walls 118, 119, the first surface 168 being opposite and spaced from the top wall 114 and the second surface 169 being opposite the bottom wall 116. Due to of the sealed connection between the end assembly and the opening, the electronic components 164 are all sealed to the surroundings within the internal chamber 112.

[0053] The attachment of the peripheral seal to the periphery prior to joining the front plate to the shielding housing, as described above, facilitates assembly of the ground assembly by allowing reflow soldering or wave soldering. In particular, as noted by specialists in the industry, the terminal wiring from the front assembly is attached to the ground paths. The front assembly and the ground assembly can then be subjected to reflow soldering or wave soldering operations that permanently fix the terminal wires and electrical components to the ground in such a way as to create an electrical connection between the various parts. Because the perimeter seal is securely seated on the housing shielding that is not solderable, the perimeter gasket will remain intact.

[0054] To remove thermal energy from the electronic components and thus prevent overheating of the sealed internal chamber, in accordance with an aspect of the present invention, the enclosure housing includes one or more heat sinks. In embodiments where the shielding enclosure is made of plastic, the heat sinks may pass through the shielding enclosure. In embodiments with plastic housings, the heat sinks are made of a suitable heat-conducting material, such as aluminum, magnesium, zinc or their alloys, or of heat-conducting plastic, and are arranged in a shielding housing so as to dissipate heat energy from the chamber internal to the external environment. In embodiments where the shielding enclosure is a thermally conductive material such as metal, the heat sinks may be integral with the shielding enclosure. The heat conducting material may be aluminum, magnesium, zinc or their alloys, or heat conducting plastic.

[0055] Referring to Fig. 8, the first and second heat sink 190, 192 are shown, which pass through the bottom wall 116 and are therefore partly located inside the inner chamber 112. Accordingly, each heat sink 190, 192 has an inner surface 196 that is exposed inside the inner chamber 112 and an outer surface 198 that is exposed along the outer side of the bottom wall 116 as shown in Figures 2 and 8. Referring to Figures 8, 9 and 10, the elongated first and second heat sink 190, 192 extends along the height of the first and second side walls 118, 119 so that the inner surfaces 196 are opposite each other through the substrate 162. To accommodate and support the heat sinks 190 , 192, slots can be formed through the bottom wall 120 to which the heat sinks are adhered by means of epoxy resin.

[0056] With reference to Figures 6 and 8, due to the arrangement of MOSFET devices 164 along the first and second edges 172, 174 of the substrate 162 when the substrate assembly is inserted into the inner chamber 112, rows 170, 171 of the MOSFET devices are aligned with elongated heat sinks 190, 192. In addition, the exposed heat transfer surfaces 166 of the MOSFET devices are opposite and adjacent to the internal surfaces 196 of heat sinks 190, 192. The heat energy generated by MOSFET 164 devices is thus dissipated from the heat transfer surface 166 by heat sinks 190, 192 to the outer surfaces 198.

[0057] To ensure that thermal energy is properly transferred from the electronic components 164 to the heat sinks 190, 192, in accordance with another aspect of the invention, the spring pads 178 can push MOSFET 164 devices toward the inner surfaces 196. To cause spring pads 178 to press MOSFET 164 devices, with reference to Figures 8, 9 and 10, the enclosure housing 110 includes an embossing 200 protruding into the internal chamber 112. In the embodiment shown, the embossing 200 protrudes from the top wall 114 towards the bottom wall 116 and can be formed when the screen housing is extruded. The embossing 200 includes a first edge 202 that is oriented toward and spaced from the first side wall 118 and further includes a second edge 204 that is oriented toward and spaced from the second side wall 119. In addition, the first and second edges 202, 204 extend substantially parallel to the first and second side walls 118, 119.

[0058] When the ground assembly is inserted into the inner chamber as shown in Fig. 8, MOSFET devices 164 are located in the spaces between the first and second edges 202, 204 and the first and second side walls 118, 119. The embossing 200 contacts the spring plates 178, pressing the spring plates towards the first and second side walls 118, 119 respectively. Due to the arrangement of MOSFET 164 devices on substrate 162, heat transfer surfaces 166 are pressed against internal surfaces 196 of heat sinks 190, 192 thereby ensuring that the heat energy generated is properly dissipated.

[0059] To insert the ground assembly into the inner chamber 112 without damaging the MOSFET 164 devices, the embossing 200 and spring pads 178 are adapted to engage together only when the ground assembly is fully inserted into the loaded position. To achieve this, as shown in Figures 9 and 10, both the first and second edges 202, 204 include a step 206 that divides the first and second edges into the first and second edge parts 208, 210. The first edge portion 208 is spaced further away from the first and second side walls 118, 119 than the second edge portion 210 is distant. In addition, the first edge portion 208 is spaced from the rear wall 120 while the second edge portion 210 is near the rear wall. In addition, referring to Fig. 7, the spring plate 178 also includes a first and second compression element 212, 214 that projects from the spring plate 178. Furthermore, the first compression element 212 protrudes further from the spring plate plane 178 than the second compression element 214, the first compression element being located more forward on the spring plate than the second compression element. The first and second compression members can be formed by moving a portion of the spring plate through an extrusion operation.

[0060] Referring to Fig. 9, it should be noted that when the substrate assembly is inserted, the smaller second compression element 214 loosely enters the gap between the first edge portion 208 and the respective side wall. This position is known as the pre-load position, which occurs over a significant range of insertion of the ground assembly, where the embossing and spring plate do not press MOSFET devices to a great extent towards the heat sinks. Accordingly, as will be known to those skilled in the art, the electronic control cover exhibits a zero insertion force effect in which no significant resistance is encountered when the substrate assembly is inserted into the preloaded position. However, with reference to Fig. 10, when the second compression element 214 passes over the step 206 and engages with the second edge portion 210, the spring plate 178 is facing the respective side wall and opposite the MOSFET 164 devices. In addition, as soon as the ground assembly is fully inserted, the larger first compression element 212 engages the first edge portion 208, similarly causing the spring plate 178 to press the MOSFET 164 devices against the heat sinks 190, 192. This is known as a loaded position in which only the substrate assembly is fully inserted, the embossing and spring plate significantly push the devices towards the heat sinks.

[0061] Because MOSFET 194 devices are in contact with heat sinks 164 after the compression components and edge portions are turned on, the destructive slipping of heat transfer surfaces 166 over internal surfaces 196 is reduced. Edge parts and compressed elements can only be adapted to join on the last 0.1 inch of insertion. In an embodiment, to assist the transfer of thermal energy from MOSFET devices, a thermally conductive paste, glue or pad may be placed between the heat transfer surfaces and the internal surfaces. The paste or thermally conductive pads can further reduce destructive slipping.

[0062] In another embodiment, the heat sinks may be removed from the shielding housing if heat sinks are not needed. The holes in the housing where the heat sinks pass through the housing will be covered with housing material. For example, Figures 29 and 30 show one embodiment with the heat sinks removed from the embodiment shown in Figures 8 and 9. If desired, the heat sinks may be removed from other embodiments, respectively.

[0063] In addition, the screening enclosure may include a channel for communicating with the ground. Referring to Figures 29 and 30, housing 610 may include channels 680, 682 that will engage with substrate 662. Channels 680, 682 may assist in preventing vertical movement of substrate 662 if the housing is subjected to movement.

[0064] In Figures 11 to 16 another embodiment of the electronic control cover 300 is illustrated which houses the components of the electronic control unit. As shown in Fig. 11, the electronic control cover 300 generally has a rectangular, low height shape so that the electronic control unit will not interfere with other devices located in the same environment. With reference to Fig. 12 the electronic control cover 300 includes a cover housing 302 that defines an internal chamber 304 into which electronic components may be inserted. Shielding housing 302 has an upper wall 310, an opposite bottom wall 312, and first and second side walls 314, 316 that extend between the upper and lower walls. Rear wall 318 extends transversely and is connected to the rear edge of the top, bottom and side walls to surround the enclosure 302. The enclosure can be made of molded plastic. In other embodiments, the shielding enclosure may be made of a thermally conductive material such as metal.

[0065] To gain access to the inner chamber 304, the front portion of the cover housing 302, opposite the rear wall 318, is formed as an opening 320. The opening 320 is defined by a rim 322, which is formed by the foremost edges of the upper, bottom and walls side 310, 312, 314, 316. To form the electronic connection to the electronic components inside the shielding housing 302, while shielding the inner chamber 304, a front assembly 330 was used as part of the electronic control shield 300. The front assembly 330 includes a front plate 332 that can enter into the opening 320 so as to seal the inner chamber 304 from the surroundings. From the front plate 332 one or more wall 334 of the socket into which the plugs may enter is forward. To attach the front assembly 330 to the enclosure 302, latch arms 324 and latch latches 336 are used, which operate as described above.

[0066] To mount and interconnect the various electronic components of the electronic control unit, the electronic control cover 300 includes a substrate assembly 340. The substrate assembly 340 has a generally flat substrate 342 having a first surface 344 and an opposite second surface 345 to which the electronic components can be attached such as MOSFET 350 devices. In the embodiment shown, the MOSFET 350 devices are arranged in two rows 352, 354, each of which extends from the front plate 332 backward along the first and second side edges 346, 347 of the ground 342. MOSFET 350 devices are laid horizontally flat , with their heat transfer surfaces 356 adjacent to substrate 342. Furthermore, substrate 342 is rigidly attached to and extends backward from front plate 332 of front assembly 330.

[0067] To remove heat generated by devices

MOSFET 350, referring to Fig. 12, the electronic control cover 300 includes a first heat sink 360 and a second heat sink 362. The first and second heat sink 360, 362 can pass through the bottom wall 312 so as to generally pass through the respective first and second side walls 314, 316. In the embodiment shown in Figures 13, 14, 15 and 16, both the first and second heat sink 360, 362 have an inner surface 364 and an outer surface 366. The inner surface 364 is generally parallel and slightly shifted above the bottom wall 312, while the outer surface 366 is parallel to and shifted below the bottom wall. With reference to Fig.

14 when the substrate assembly is inserted into the inner chamber

304, substrate 342 extends between first and second side walls 314, 316 and covers the inner surface 364 of heat sinks 360, 362. In other embodiments, the shielding enclosure may be made of a heat conducting material, such as metal, and the radiator is integral with the shielding enclosure .

[0068] Referring to Fig. 14, to transfer heat energy generated by MOSFET devices 350 to radiators 360, 362, substrate 342 includes a plurality of holes 370 located between first and second surfaces 344, 345 that are in alignment with surfaces 356 heat transfer MOSFET devices. Each hole 370 has a heat conducting element 372, such as solder or other low melting heat transfer material, which contacts both heat transfer surfaces 356 and inner surface 364. Accordingly, heat transfer elements 372 transfer heat through substrate 342.

[0069] To ensure adequate thermal contact between MOSFET 350 devices and heat conducting elements 372, as shown in Figures 14, 15 and 16, the electronic control cover includes spring plates 380 and extrusions 390, 392, which are adapted to engage with each other . Referring to Fig. 17, the spring plate 380 includes an elongated compression bar 382 that terminates at one end of the attachment tip 384. The attachment terminal 384 bends approximately ninety degrees to the orientation of the compression bar 382. From the compression bar 382, ​​the first and second compression components 386, 388 protrude, the first compression component protruding a further distance from the compression platform than the second compression component. In addition, the first compression element 386 is located farther from the attachment tip 384 than the second compression element 388. The spring plate 380 can be made of any suitable material, such as, for example, metal sheet that has been extruded and molded.

[0070] With reference to Figures 15 and 16, the spring plates 380 are attached to the ground 342 so that the compression bar 382 extends over the MOSFET devices 350 and the attachment tip 384 is attached to the ground, generally towards the rear of the inner chamber 304. To engage spring plates 380, referring to Fig. 14, first and second embossments 390, 392 extend along the respective first and second side walls 314, 316, protruding from the top wall 310 toward the bottom wall 312. As shown in Figures 15 and 16, both embossments 390, 392 include a bottom edge 394 , which is generally parallel to and spaced from bottom wall 312 and substrate 342. Lower edge 394 is further divided by a fusion 396 into a first lower edge portion 398 and a second lower edge portion 399, wherein the first lower edge portion is further from the lower surface 312 than the second lower edge portion.

[0071] As it results from Figures 15 and 16, when the substrate assembly 330 is inserted into the inner chamber 304, the substrate 342, MOSFET devices 350, and the spring plate 380 enter the space between the lower edge 394 and the lower wall 312. To avoid damage to the devices MOSFET 350 during insertion, spring plate 380 and extrusions 390, 392 are adapted to engage together only when the substrate 342 is fully inserted into the loaded position. With reference to Fig. 15, when the ground assembly 330 is initially inserted, the smaller second compression 388 loosely enters the gap between the first lower edge portion 398 and the lower surface 312. This position is the position under the preload that occurs over a significant range of insertion of the ground assembly, where the embossing and spring plates do not press MOSFET devices to a large extent towards heat sinks. Accordingly, as mentioned above, the electronic control cover exhibits the effect of zero insertion force when inserting the ground assembly into a position under preload.

[0072] Referring to Fig. 16, when the second compression element 388 passes under the step 396 and engages with the second bottom edge portion 399, the spring plate 380 is directed towards the bottom surface 312 and downwards onto the MOSFET 350 devices. In addition, when only the ground assembly 330 is fully inserted, the larger first compression member 386 engages the first lower edge portion 398, similarly causing the spring plate 380 to press the MOSFET 350 devices against the heat sink 360. This position is a loaded position that occurs after the substrate assembly has been fully inserted, where the embossing and spring plates significantly push MOSFET devices towards the heat sinks. With reference to Fig. 14, pressing the MOSFET devices 350 towards the heat sinks 360, 362 places the heat conducting elements 372 located in the openings 370 under compressive forces between heat transfer surfaces 356 and internal surfaces 364, thereby transferring the generated heat energy from the internal chamber. In some embodiments, to assist in the dissipation of heat energy, a thermally conductive paste, glue or pad may be placed between the heat transfer surfaces and the internal surfaces.

[0073] With reference to Figures 18 and 19, another embodiment of an electronic control cover 400 that houses components of an electronic control unit is shown. The electronic control cover 400 is generally rectangular, low in height so as not to interfere with other external devices located in the same environment. To attach the electronic control cover 400 to the panel, the mounting protrusion 406 protrudes from the sides of the electronic control cover through which the connectors can be inserted.

[0074] To protect the electronic components of the electronic control unit with reference to Figs. 20 and 21, a cover housing 402 is provided that defines the inner chamber 404. The cover housing 402 has a top wall 410, an opposite bottom wall 412, and first and second side wall 414, 416, which extend between the upper and lower walls. Rear wall 418 extends across the rear of the screening enclosure 402, and is connected to the rear edge of the top wall, bottom wall and side walls 410, 412, 414, 416. To access the internal chamber 404, the front of the screening enclosure 402, opposite the rear wall 418 is formed as an aperture 420 defined by a rim 422 that is formed by the front edges of the top and bottom walls and side walls 410, 412, 414, 416. The groove 424 is located on the inside of each side wall 414, 416, located near the bottom wall 412 and extending along the bottom wall. Cover housing 402 may be made of molded plastic. or other suitable material such as metal.

[0075] To shield the inner chamber and provide electrical connection to the electronic components contained therein, with reference to Fig. 22, the electronic control cover 400 includes a front assembly 430 that can enter into the opening 420 and is bounded by a rim 422. The front assembly 430 includes a front plate 432 from which one or more of the receptacle walls 434 extends. Socket walls 434 surround in a protective manner a plurality of terminals 436 that extend through the front plate 432 and are adapted to insert plugs from external electrical devices. The substrate assembly 440 is attached to and extends from the bottom of the front plate 432. The substrate assembly 440 includes a substantially flat substrate 442 having a first surface 444, an opposite second surface 446, and conductive electric paths formed thereon. The substrate 442, when inserted into the inner chamber 404, extends backwards and is substantially parallel to the bottom wall 412, the first surface 444 facing the top wall 410. To position the substrate 442 inside the inner chamber 404, with reference to Figs 20, it should be noted that the edges of the substrate may penetrate into the grooves 424 formed in the side walls.

[0076] Referring to Fig. 22, a plurality of electronic components such as MOSFET 450 devices are mounted close to, and aligned with, substrate edge 448 on substrate 442. The exposed heat transfer surfaces 452 of MOSFET 450 devices are mounted near the first surface 444 of the ground and facing rear wall 418. To remove thermal energy generated by MOSFET devices, the electronic control cover 402 includes a heat sink 460 that can pass through the bottom wall 412 to contact the heat transfer surfaces 452. The heat sink 460 thus transfers thermal energy from the devices to the outer surface 462 of the heat sink, which is exposed along the outside of the screening enclosure 402. In other embodiments, the shielding enclosure may be made of a heat conducting material such as metal, and the heat sink is integral with the shielding enclosure.

[0077] To facilitate the transfer of thermal energy between MOSFET devices and the heat sink, the exposed heat transfer surfaces of the MOSFET devices are pressed against the heat sink by spring force. In particular, as shown in Figures 23 and 24, a portion of the heat sink 460 is located inside the inner chamber 404 by a vertical transition arm 464 that passes through the bottom wall 412. Connected to the transition arm and extending forward from the transition arm 464 is a contact arm 466 that extends parallel to and is distant from the bottom wall 412. Preferably, the transition arm 464 and the contact arm 466 extend along the length of the rear edge 448 of substrate 442. A circular shape locator 468 is located at the free end of the contact arm 466, which projects downwardly towards the bottom wall 412. The heat sink 460 may include a plurality of locators 468 spaced relative to each other along the length of the contact arm 466. Also a leaf spring 474 located near the bottom wall 412 that bends upwardly towards and generally aligned with the contact arm 466 is provided.

[0078] Referring to Fig. 24, when the substrate 442 is fully inserted into the inner chamber 404, the rear edge of the substrate 448 is located between the contact arm 466 and the lower surface 412, with the heat transfer surfaces 452 of the MOSFET 450 devices located below the contact arms. In addition, leaf spring 474 pushes substrate 442 up, thereby pressing heat transfer surface 452 to contact arm 466. To assist in the dissipation of heat energy, in some embodiments, a thermally conductive paste, glue or pad may be placed between the heat transfer surfaces and the internal surfaces.

[0079] Referring to Fig. 23, to facilitate the insertion of the substrate 422 under the contact arm 466 without damaging the surface 452, it should be noted that the locator 468 will contact the rear edge 448 and the locator 468 will tilt the substrate 442 down toward the bottom surface 412 This bias presses the ground 442 against the leaf spring 474, while creating a gap between contact arm 466 and heat transfer surface 452 allowing movement between them. The gap is indicated by arrows 476 in Fig. 23. This position is a preload position in which the leaf spring cannot press the MOSFET device against the heat sink. To eliminate the gap; substrate 442 includes one or more recesses 459 located in the first surface slightly moved forward relative to the rear edge 448. As soon as substrate 442 is fully inserted as shown in Fig. 23, recess 459 aligns with and adopts locator 468 allowing leaf spring 474 to protrude from the ground upwards. Accordingly, there is contact and a corresponding transfer of thermal energy occurs between heat transfer surfaces 452 and contact arm 466. This position is the load position in which the leaf spring presses the MOSFET device against the heat sinks.

[0080] Fig. 25 shows another embodiment of an electronic control cover 500 that houses the components of the electronic control unit. The electronic control cover 500 is generally rectangular, low in height so as not to interfere with other devices that may be located in the same environment. To attach the electronic control cover 500 to the panel, one or more mounting protrusions 506 protrude from the sides through which the connectors can be inserted. The electronic control cover 500 defines an internal chamber in which electronic components that form the electronic control unit can be kept under protection.

[0081] With reference to Fig. 26, to attach and interconnect the various electronic components of the electronic control unit in a manner that facilitates their insertion into the inner chamber, a front assembly 530 to which a backward assembly 540 is attached is attached . Front assembly 530 includes a flat front plate 532 from which one or more of the receptacle walls 534 extends forwardly that surround a plurality of terminals 536. All clamps 536 include a clamp wire 537 protruding backwards from the front plate 532, which is formed with right angles directing the clamp wires downwards to contact the ground assembly.

The front plate 532 and socket walls 534 are preferably made of heat-conducting material, such as cast aluminum, magnesium, zinc or their alloys, or of heat-conducting plastic.

[0082] Substrate assembly 540 includes a substantially flat substrate 542 having an upper surface 544, an opposite lower surface 546, and a plurality of conductive circuit paths formed thereon, such as a printed circuit board. Electronic components such as, for example, MOSFET 550 devices with exposed heat transfer surfaces 552 are also part of the ground assembly 540, and are electrically connected to circuit paths on the ground 542.

[0083] To remove heat generated by devices

MOSFET, in accordance with another aspect of the present invention, front assembly 530 also includes one or more heat sinks 560. For example, as shown in Figures 26, 27 and 28, the heat sinks 560 are shaped as elongated parallel rails that are integrally connected to and extend back from the front 532 plate. In addition, in the embodiment shown, the heat sinks 560 generally have L-shaped cross-sections, including the first longer strip 562 and the second shorter strip 564. The heat sinks 560 are arranged such that the shorter strips 564 are located adjacent the top surface 544 of the ground. 542. Because the heat sinks 560 and the front plate 532 are integrally connected and made of heat conducting material, the heat sinks 560 dissipate heat from the inner chamber to the exposed front plate 532, which accordingly acts as the outer surfaces described above. To dissipate thermal energy to the environment, with reference to Fig. 27, front plate 532 may include one or more protruding ribs 538.

[0084] To transfer thermal energy from MOSFET 550 devices to heat sinks 560, heat transfer surfaces 552 are placed in direct physical contact with the heat sinks. Referring to Figures 26 and 28, MOSFET 550 devices are arranged with heat transfer surfaces 552 either flat against the ground 542 or protruding vertically from the ground. For MOSFET 550 devices laid flat, the heat transfer surface 552 is sandwiched between the heat sink 560 and the top surface 54 4, and can be secured with a connector 557, thereby ensuring adequate heat transfer. For these MOSFET 550 devices arranged vertically, heat transfer extends with longer strips 562 to 560 heatsinks and is attached to them by a connector 558, providing similarly adequate heat transfer.

surfaces are contiguous

552 nad [0085] Accordingly, the present invention provides an electronic control cover for the electronic control unit. The electronic control cover includes a shielding housing defining an internal chamber for the electronic components of the control unit. The screening enclosure can be shielded and sealed from the surrounding environment by a front assembly through which an electrical connection can be made. To remove thermal energy generated by the electronic components in the inner chamber, the electronic control cover includes one or more heat sinks that have external surfaces exposed outside the electronic control cover. In various embodiments, the heat sink may pass through the shielding housing or the heat sink may be integrally formed with the shielding housing. In embodiments where the heat sink and screening enclosure are integral and the screening enclosure is made of metallic material, the entire screening enclosure may absorb and dissipate thermal energy generated by the electronic components. Additionally, to ensure good thermal contact between the electronic components and heat sinks, the housing may contain components that press the electronic components and heat sinks into contact.

[0086] The use of the terms "a", "an" and "the" and similar references in the context of describing the invention (especially in the context of the following claims) should be understood to include both the singular and the plural, unless otherwise indicated herein otherwise, or the context clearly denies it. The terms "containing", "having", "including" and "enclosing" should be understood as open (i.e. meaning "including but not limited to") phrases, unless otherwise indicated. The listing of value ranges in this document is intended to serve only as a shortened way of individually referring to each separate value within the range, unless otherwise indicated herein, and each separate value is included in the description as if it were individually mentioned in it. All of the methods listed herein may be performed in any convenient order, unless otherwise indicated herein or the context expressly denies this. The use of any and all examples, or an exemplary language (for example, "such as") used herein is for the purpose of better illuminating the invention and does not limit the scope of the invention, unless otherwise stated. No statement made herein should be construed. as indicating a non-proprietary element as essential for the practical application of the invention.

[0087] Preferred embodiments of the present invention have been described herein, including the best manner known to inventors of the invention. Changes to these preferred embodiments may become apparent to those of ordinary skill in the art upon reading the prior description. The inventors expect that those skilled in the art will apply such changes as are appropriate, and the inventors expect the invention to find practical application other than as specifically described herein. Accordingly, the present invention includes all modifications and equivalents of the substance as contained in the claims appended hereto as permitted by applicable law. Furthermore, any combination of the above-described elements in all possible variations is encompassed by the invention unless otherwise indicated herein or the context expressly denies it.

Cinch Connectors, Inc.

Proxy:

POLSERVICE kancelaria Rzeczników Patentowych sp. Z o. O. Ul. Bluszczańska 73

00-712 WARSAW

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Blacksmith

EW

78P31793EN00 ΕΡ 2 367 413 BI