Nova Patents
PL1993829T3

Substrate comprising a stack of thin layers, the stack having thermal properties

Abstract

This record has no abstract on file.

Term

No projected expiry on record.

  1. Priority
  2. Filed
  3. Published
  4. Today

24 members in 14 offices

This recordMember, by publication datePriority claim4 more offices are in the list below

Priority claims8

Priority claims
DocumentOfficeKindDate
0650770FranceA
07731698European Patent Office (EPO)A
2007050881FranceW
0650770–––
077316982–––
EP20070731698–––
FR20060050770–––
WO2007FR50881–––

Members24

Family members, oldest first
DocumentOfficeKind
FR2898122A1FranceA1
CA2644862A1CanadaA1
WO2007101963A2World Intellectual Property Organization (WIPO)A2
WO2007101963A3World Intellectual Property Organization (WIPO)A3
KR20080101932ARepublic of KoreaA
EP1993829A2European Patent Office (EPO)A2
FR2898122B1FranceB1
EA200870317A1Eurasian Patent Organization (EAPO)A1
CN101395000AChinaA
US2009130409A1United States of AmericaA1
JP2009528973AJapanA
BRPI0708421A2BrazilA2
EA017637B1Eurasian Patent Organization (EAPO)B1
US8420207B2United States of AmericaB2
CN101395000BChinaB
JP5491736B2JapanB2
KR101400421B1Republic of KoreaB1
CA2644862CCanadaC
BRPI0708421B1BrazilB1
EP1993829B1European Patent Office (EPO)B1
DK1993829T3DenmarkT3
TR201811273T4TürkiyeT4
PT1993829TPortugalT
PL1993829T3This recordPolandT3