NO972759D0

Method for measuring structures in a fingerprint with a linear sensor

Abstract

Method for measuring structures in a fingerprint or the like mark, comprising measuring a selected characteristic of the surface of the fingerprint using a sensor array comprising a plurality of sensors (1), being placed in contact with, or near, a portion of the surface, comprising measuring said characteristics in at least one line of measuring points along an elongated portion of the surface at selected time intervals, with the sensor array an essentially one-dimensional array, and moving the surface relative to the sensor array in a direction perpendicular to the sensor array direction, so that the measurements are taken in different parts of the surface thus providing a set of lines of measuring points wherein at least one measurement is provided each part of the surface in the direction of movement, characterized by compensating the movement of said finger by adjusting, in a time interval given, the number of lines of measuring points for providing a new set of lines of measuring points and combining said new set of lines of measuring points which are to provide a two dimensional representation of said characteristics of the surface.

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DocumentOfficeKind
NO972759D0This recordNorwayD0
NO972759LNorwayL
WO9858342A1World Intellectual Property Organization (WIPO)A1
AU8041498AAustraliaA
NO304766B1NorwayB1
EP0988614A1European Patent Office (EPO)A1
JP2002505778AJapanA
EP1304646A2European Patent Office (EPO)A2
EP1304646A3European Patent Office (EPO)A3
EP0988614B1European Patent Office (EPO)B1
AT276547TAustriaT
ATE276547T1AustriaT1
DE69826274D1GermanyD1
US2004213441A1United States of AmericaA1
DE69826274T2GermanyT2
EP1304646B1European Patent Office (EPO)B1
AT317144TAustriaT
ATE317144T1AustriaT1
DE69833337D1GermanyD1
US7054471B2United States of AmericaB2
PT1304646EPortugalE
DK1304646T3DenmarkT3
ES2258129T3SpainT3
US7110577B1United States of AmericaB1
DE69833337T2GermanyT2
US2007009142A1United States of AmericaA1
US7333639B2United States of AmericaB2
JP4051093B2JapanB2
EP1304646B2European Patent Office (EPO)B2
DK1304646T4DenmarkT4
ES2258129T5SpainT5
DE69833337T3GermanyT3