Two-layered laminate having metal foil cladded on its one surface, method for production of the laminate, single-sided printed wiring board, and method for production of the wiring board
Abstract
PROVIDED ARE A METAL FOIL SINGLE-CLAD TWO-PLY LAMINATE WHICH COMPRISES TWO PAIRS OF STRUCTURES EACH COMPRISING ONE PREPREG OR A LAMINATE OF TWO OR MORE PREPREGS CLADDED WITH A METAL FOIL ON ONE SURFACE THEREOF, WHEREIN THE TWO PAIRS OF STRUCTURES ARE LAMINATED ON EACH OTHER THROUGH THERMAL COMPRESSION VIA A RELEASE MATERIAL PUT THEREBETWEEN SO THAT EACH PREPREG FACES INWARD, AND WHEREIN THE RELEASE MATERIAL IS A FILM OF A RESIN MATERIAL OR THE LIKE AND ITS THICKNESS IS FROM 10 TO 200 ?M, AND THE THERMAL SHRINKAGE OF THE RELEASE MATERIAL AT THE TEMPERATURE OF THE THERMAL COMPRESSION TREATMENT IS AT MOST 1.5%; AND A METHOD FOR PRODUCING THE LAMINATE. ALSO DISCLOSED ARE A SINGLE-SIDED PRINTED WIRING BOARD AND ITS PRODUCTION METHOD USING THE METAL FOIL SINGLE-CLAD TWO-PLY LAMINATE.
Term
No projected expiry on record.
- Priority and filed
- Published
- Today
8 members in 5 offices
Priority claims4
| Document | Office | Kind | Date |
|---|---|---|---|
| 2008097808 | Japan | – | |
| 2008097808 | Japan | A | |
| 2008097808 | – | – | – |
| JP20080097808 | – | – | – |
Members8
| Document | Office | Kind | |
|---|---|---|---|
| JP4293278B1 | Japan | B1 | |
| WO2009122589A1 | World Intellectual Property Organization (WIPO) | A1 | |
| JP2009248409A | Japan | A | |
| CN101983126A | China | A | |
| US2011108310A1 | United States of America | A1 | |
| CN101983126B | China | B | |
| MY155884AThis record | Malaysia | A | |
| US10051743B2 | United States of America | B2 |
Numbers
- Publication
- MY-155884-A
- Publication, DOCDB
- 155884
- Publication, EPODOC
- MY155884
- Application
- 201004613
- Application, DOCDB
- PI20104613
- Application, EPODOC
- MY2010PI04613
Titles
- English
- TWO-LAYERED LAMINATE HAVING METAL FOIL CLADDED ON ITS ONE SURFACE, METHOD FOR PRODUCTION OF THE LAMINATE, SINGLE-SIDED PRINTED WIRING BOARD, AND METHOD FOR PRODUCTION OF THE WIRING BOARD
Classification
- CPC, 8
- H05K3/022
- H05K3/0097
- H05K3/06
- H05K3/244
- H05K2201/0355
- H05K2203/1536
- Y10T29/49124
- Y10T428/269
- IPC, 1
- B32B15 01