MY112147A
Process and apparatus for etching semiconductor wafers
Abstract
PROCESS FOR ETCHING A SEMICONDUCTOR WAFER WHICH INCLUDES THE STEPS OF ROTATING THE WAFER, AND CONTACTING THE ROTATING WAFER WITH A FLOWING FROTH, THE FROTH BEING FORMED, AT LEAST IN PART, BY THE EFFERVESCENCE OF A PRESSURIZED ETCHANT CONTAINING A DISSOLVED GAS.(FIG. 1)
Term
No projected expiry on record.
- Priority
- Filed
- Published
- Today
16 members in 10 offices
Priority claims2
| Document | Office | Kind | Date |
|---|---|---|---|
| 13398093 | United States of America | A | |
| 5340437 | United States of America | – |
Members16
| Document | Office | Kind | |
|---|---|---|---|
| US5340437A | United States of America | A | |
| WO9510850A1 | World Intellectual Property Organization (WIPO) | A1 | |
| EP0673545A1 | European Patent Office (EPO) | A1 | |
| KR950704809A | Republic of Korea | A | |
| CN1115588A | China | A | |
| JPH08502148A | Japan | A | |
| EP0673545A4 | European Patent Office (EPO) | A4 | |
| TW288167B | Taiwan Province of China | B | |
| SG46423A1 | Singapore | A1 | |
| EP0673545B1 | European Patent Office (EPO) | B1 | |
| DE69415298D1 | Germany | D1 | |
| KR0161794B1 | Republic of Korea | B1 | |
| CN1043278C | China | C | |
| DE69415298T2 | Germany | T2 | |
| JP3081246B2 | Japan | B2 | |
| MY112147AThis record | Malaysia | A |
Numbers
- Publication
- 112147
- Application
- 95001282
Titles
- English
- PROCESS AND APPARATUS FOR ETCHING SEMICONDUCTOR WAFERS
Classification
- CPC, 5
- H10P90/126
- H10P50/642
- H10P72/0426
- H10P72/0414
- H10P72/7618
- IPC, 4
- B44C1 22
- A61K31 415
- C07D233 06
- H10P95 00