Methods and apparatuses for drying electronic devices.
Abstract
Methods and apparatuses for drying electronic devices are disclosed. Embodiments include methods and apparatuses that heat and decrease pressure within the electronic device. Some embodiments increase and decrease pressure while adding heat. Other embodiments include a desiccator for removing moisture from the air being evacuated from the electronic device prior to the air reaching an evacuation pump. Further embodiments detect humidity within the low-pressure chamber and determine when to increase and/or decrease pressure based on the humidity. Still further embodiments determine that the device is sufficiently dry to restore proper function based on the detected humidity, and in some embodiments based on the changes in humidity while pressure is being increased and/or decreased. Still further alternate embodiments automatically control some or all aspects of the drying of the electronic device. Additional embodiment disinfect the electronic device.

Term
6.4 yearsleft in the term
Expires 1 February 2033.
- Priority
- Filed
- Granted
- Today
- Expires
33 claims: 5 independent, 28 dependent
- 1REIVINDICACIONES 1. Un método que comprende:colocar un dispositivo electrónico portátil, que se ha vuelto al menos 5 parcialmente inoperable debido a la invasión de humedad, en una cámara de baja presión;calentar el dispositivo electrónico portátil;disminuir la presión dentro de la cámara de baja presión;remover la humedad del interior del dispositivo electrónico portátil al 10 exterior del dispositivo electrónico portátil;incrementar la presión dentro de la cámara de baja presión después de disminuir la presión, comprendiendo, además, el incremento: medir la humedad dentro de la cámara de baja presión;incrementar la presión en la cámara después que la humedad 15 relativa ha disminuido y la velocidad de disminución de la humedad relativa se ha frenado;igualar la presión dentro de la cámara de baja presión con la presión al exterior de la cámara de baja presión;y retirar el dispositivo electrónico portátil de la cámara de baja presión. 20
- 2El método de conformidad con la reivindicación 1, caracterizado porque comprende detectar cuando se ha eliminado una cantidad de humedad del dispositivo electrónico portátil.
- 3El método de conformidad con la reivindicación 1, caracterizado porque la disminución de presión y el incremento de presión, se repiten 25 secuencialmente antes de retirar el dispositivo electrónico portátil.
- 4El método de conformidad con la reivinc ;* porque comprende controlar la disminución repetida de pre=> iuii y ci ii ivici iici uu u8 presión, de acuerdo con al menos un criterio predeterminado.
- 5El método de conformidad con la reivindicación 3, caracterizado porque comprende:detectar cuando una cantidad de humedad ha sido removida del dispositivo electrónico portátil;y detener la disminución repetida de presión e incrementar la presión después que se detecta.
- 6Un aparato que comprende;una cámara de baja presión que define un interior y teniendo el interior dimensionado y configurado para la colocación de un dispositivo electrónico en el interior y retirar el dispositivo electrónico del interior;una bomba de evacuación conectada a la cámara de baja presión;un calentador conectado a la cámara de baja presión;y un controlador conectado a la bomba de evacuación y al calentador, el controlador controla la remoción de humedad del dispositivo electrónico mediante el control de la bomba de evacuación para disminuir la presión dentro de la cámara de baja presión y controlar la operación del calentador para agregar calor al dispositivo electrónico.
- 7El aparato de conformidad con la reivindicación 6, caracterizado porque el controlador controla la bomba de evacuación para disminuir la presión dentro de la cámara de baja presión múltiples veces, y en donde la presión dentro de la cámara de baja presión se incrementa entre disminuciones de presión sucesivas dentro de la cámara de baja presión. 3' o
- 8El aparato de conformidad con la reivin< porque comprende al menos uno de:un sensor de humedad conectado a la cámara de baja presión y al controlador, en donde el controlador controla la bomba de evacuación para controlar la presión dentro de la cámara de baja presión con base por lo menos en parte en una señal recibida del sensor de humedad, en donde el sensor de humedad detecta valores máximos y mínimos de humedad a medida que la bomba de evacuación disminuye la presión dentro de la cámara de baja presión múltiples veces, y en donde el controlador determina que el dispositivo electrónico está lo suficientemente seco cuando la diferencia entre valores de humedad sucesivos máximos y mínimos es igual o menor que un valor;o una válvula conectada a la cámara de baja presión y al controlador, en donde la presión dentro de la cámara de baja presión se incrementa entre disminuciones de presión sucesivas dentro de la cámara de baja presión, por lo menos en parte, debido al controlador que controla la válvula para incrementar la presión dentro de la cámara de baja presión, en donde el controlador al menos uno de: controla la válvula para incrementar la presión dentro de la cámara de baja presión aproximadamente al mismo tiempo que el controlador controla la bomba de evacuación para detener la disminución de presión dentro de la cámara de baja presión;o controla la válvula para igualar la presión entre el interior de la cámara de baja presión y el exterior de la cámara de baja presión.
- 9El aparato de conformidad con la reivindicación 6, caracterizado porque al menos uno de:el dispositivo electrónico es colocado en una superficie resistente al calentamiento, o i ' * > es el aparato comprende, además, una puerta con¡ al menos uno de la cámara de baja presión o al interior.
- 10El aparato de conformidad con la reivindicación 6, caracterizado porque el controlador controla la bomba de evacuación para disminuir la presión dentro de la cámara de baja presión múltiples veces.
- 11El aparato de conformidad con la reivindicación 10, caracterizado porque la presión dentro de la cámara de baja presión se incrementa entre disminuciones de presión sucesivas dentro de la cámara de baja presión.
- 12El aparato de conformidad con la reivindicación 6, caracterizado porque comprende un sensor de presión conectado a la cámara de baja presión y al controlador, en donde el controlador controla la bomba de evacuación para controlar la presión dentro de la cámara de baja presión con base al menos en parte en una señal recibida del sensor de presión.
- 13El aparato de conformidad con la reivindicación 6, caracterizado porque comprende un sensor de humedad conectado a la cámara de baja presión y al controlador, en donde el controlador controla la bomba de evacuación para controlar la presión dentro de la cámara de baja presión con base al menos en parte en una señal recibida del sensor de humedad.
- 14El aparato de conformidad con la reivindicación 6, caracterizado porque comprende una válvula conectada a la cámara de baja presión y al controlador;en donde la presión dentro de la cámara de baja presión se incrementa entre disminuciones de presión sucesivas dentro de la cámara de baja presión, por lo menos en parte, debido al controlador que controla la válvula para cambiar la presión dentro de la cámara de baja presión. Ji» -J
- 15El aparato de conformidad con la reivindicación 6, caracterizado porque comprende un elemento de esterilización conectad ¿ presión, el elemento de esterilización esta configurado para eliminar gérmenes asociados con el dispositivo electrónico.
- 16El aparato de conformidad con la reivindicación 6, caracterizado 5 porque el calentador comprende una placa con la cual el dispositivo electrónico esta en contacto directo durante la remoción de humedad del dispositivo electrónico.
- 17El aparato de conformidad con la reivindicación 6, caracterizado porque el controlador controla la bomba de evacuación para detener la disminución de presión dentro de la cámara de baja presión cuando la velocidad a la cual la humedad 10 en la cámara de baja presión cambia disminuyendo o es aproximadamente cero.
- 18El aparato de conformidad con la reivindicación 6, caracterizado porque comprende un sensor de humedad conectado a la cámara de baja presión y al controlador.
- 19El aparato de conformidad con la reivindicación 18, caracterizado 15 porque el controlador controla la bomba de evacuación para controlar la presión dentro de la cámara de baja presión con base al menos en parte en una señal recibida del sensor de humedad.
- 20El aparato de conformidad con la reivindicación 19, caracterizado porque el sensor de humedad detecta valores de humedad máximos y mínimos en la 20 cámara de baja presión a medida que la bomba de evacuación disminuye la presión dentro de la cámara de baja presión múltiples veces.
- 21El aparato de conformidad con la reivindicación 20, caracterizado porque el controlador determina que el dispositivo electrónico está lo suficientemente seco cuando la diferencia entre valores de humedad sucesivos máximos y mínimos es 25 igual o menor que un valor.
- 22El aparato de conformidad con la reivlnt o porque comprende una válvula conecta a la cámara de baja presión y al controlador.
- 23El aparato de conformidad con la reivindicación 22, caracterizado porque la presión dentro de la cámara de baja presión se Incrementa entre 5 disminuciones de presión sucesivas dentro de la cámara de baja presión, por lo menos en parte, debido al controlador que controla la válvula para incrementar la presión dentro de la cámara de baja presión.
- 24El aparato de conformidad con la reivindicación 23, caracterizado porque el controlador controla la válvula para incrementar la presión dentro de la cámara 10 de baja presión aproximadamente al mismo tiempo que el controlador controla la bomba de evacuación para detener la disminución de presión dentro de la cámara de baja presión. 26. El aparato de conformidad con la reivindicación 24, caracterizado porque el controlador controla la válvula para igualar la presión entre el Interior de la 15 cámara de baja presión y afuera o al exterior de la cámara de baja presión. 26. El aparato de conformidad con la reivindicación 6, caracterizado porque el dispositivo electrónico es colocado en una superficie resistente al calentamiento conectada o comprendida en el calentador. 27. El aparato de conformidad con la reivindicación 26, caracterizado 20 porque el aparato comprende, además, una puerta conectada articuladamente a la cámara de baja presión. 28. El aparato de conformidad con la reivindicación 6, caracterizado porque el aparato comprende, además, una puerta conectada articuladamente a la cámara de baja presión.
- 2525 29. El método de conformidad con la reivindicación 1, caracterizado porque la humedad comprende una humedad relativa.
- 2630. El método de conformidad con la reivindicación 1, caracrerizado porque el dispositivo electrónico portátil es seleccionado de un grupo que consiste en un teléfono celular, un reproductor digital de música, un reloj, un buscapersonas, una 5 cámara, y una computadora portátil.
- 2731. El aparato de conformidad con la reivindicación 6, caracterizado porque el dispositivo electrónico es seleccionado de un grupo que consiste en un teléfono celular, un reproductor digital de música, un reloj, un buscapersonas, una cámara, y una computadora portátil. 10
- 2832. El aparato de conformidad con la reivindicación 6, caracterizado porque el dispositivo electrónico comprende un teléfono celular.
- 2933. El aparato de conformidad con la reivindicación 6, caracterizado porque el dispositivo electrónico comprende un reloj.
- 3034. El aparato de conformidad con la reivindicación 6, caracterizado 15 porque el dispositivo electrónico comprende una computadora portátil.
- 3135. El aparato de conformidad con la reivindicación 6, caracterizado porque el dispositivo electrónico es colocado en una superficie de calentamiento conectada o comprendida en el calentador.
- 3236. El aparato de conformidad con la reivindicación 35, caracterizado 20 porque la superficie de calentamiento se alimenta eléctricamente a través de cables de alimentación.
- 3337. El aparato de conformidad con la reivindicación 35, caracterizado porque la superficie de calentamiento está fabricada con ai menos un material que parcialmente es térmicamente conductor.
Independent claims33
313 paragraphs in 15 sections, as filed
(54) Title: METHODS AND DEVICES FOR DRYING ELECTRONIC DEVICES. (54) Title: METHODS AND APPARATUSES FOR DRYING ELECTRONIC DEVICES.
(57) Summary
Methods and apparatus for drying electronic devices are disclosed. Modalities include methods and apparatus that heat and decrease the pressure within the electronic device. Some modes increase and decrease pressure while adding heat. Other modes include a desiccator to remove moisture from the air that is evacuated from the electronic device before air reaches an evacuation pump. Additional modes detect humidity within the low pressure chamber and determine when to increase and / or decrease pressure based on humidity. Still further modalities determine that the device is dry enough to restore proper function based on detected humidity and in some modalities based on changes in humidity as pressure is increased and / or decreased. Still additional alternative modalities automatically control some or all aspects of the drying of the electronic device. Additional modalities disinfect the electronic device.
(57) Abstract
Methods and apparatuses for drying electronic devices are disclosed. Embodiments inelude methods and apparatuses that heat and decrease pressure within the electronic device. Some realizations increase and decrease pressure while adding heat. Other embodiments inelude a desiccator for removing moisture from the air being evacuated from the electronic device prior to the air reaching an evacuation pump. Further performing detect humidity within the low-pressure chamber and determine when to increase and / or decrease pressure based on the humidity. Still further realizations determine that the device is sufficiently dry to restore proper function based on the detected humidity, and in some realizations based on the changes in humidity while pressure is being increased and / or decreased. Still further altérnate performances automatically control some or all aspeets of the drying of the electronic device. Additional embodiment disinfect the electronic device.
PATENT TITLE No. 360647
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Classification:
Inventors):
REVIVE ELECTRONICS, LLC
12816 Whitebrldge Orive, Fishers, Indiana, 46037, USA
METHODS AND APPARATUS FOR DRYING ELECTRONIC DEVICES.
<sub>C</sub>| p.
CPC
F26B21 / 08; F26B5 / 04; F26B3 / 353; F26B9 / 00
F26B21 / 10; F26B21 / 083; F26B25 / 06;
F26B21 / 0:
F26B25 / 14 REUBEN QUINCEYZIELINSKI
<img file="MX360647B_D0001.tif" />
THE CHRISTOPHER TRUSTY in
Number
MX / a / 2014/009259
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<img file="MX360647B_D0003.tif" />
Validity: Twenty years
Expiration Date Issue Date:
The patent of reference
In accordance with the ai from the date of filing.
Who subscribes to the present title Itf (Diarto Oficia! De la Federación 25/01/2006, 06/05/2009, 06/01/2010, and 12<sup>c</sup> sections I and IIIII of the Regulations (07/28/2004 and 09/07/2007); articles 1 '3',
Industrial property (DOF 12/27/1999. Refoi faculties in Ice Deputy General Directors. Departmental Coordinators and other subordinates 07/29/2004, 08/04/2004 and 09/13/2007).
<img file="MX360647B_D0004.tif" />
the Industrial Property Law
0999. 01/26/2004, 06/16/2005, ios 1 °, 3 'fraction V subsection a), 4 ° adopted on 07/01/2002, 07/15/2004, Organic Statute of the Mexican Institute of
07); 1st. 3rd and 5th subsection a) of the Agreement that delegates Regional Policies, Divisional Subdirectors, (DOF 12/15/1999, amended on 02/04/2000, • has a validity period to maintain validity for the articles 6th fractions III on 08/02/1994. 10/25/1996, 12/26 /
1/2012. 04/09/2012. 06/01/2016 and 1
International:
2013
Number:
61/593,617 61/638,599
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Industrial lad, uripruriogables, told to 'eches.
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This letter is signed with an advanced electronic signature (FIEL), based on articles 7 BIS 2 of the Industrial Property Law; 3rd of its Regulations, and 1 section: III, 2 section V, 26 BIS and 26 TER of the Agreement: which establishes the guidelines for the use of the Portal for Payments and Electronic Services (PASE) of the Mexican Property Institute Industrial, in the procedures indicated.
THE DIVISIONAL DIRECTOR. PATENT
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NAHANNY CANAL REYES
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NAHANNY MARISOL CANAL REYES | 00001000000403252793 | Tax Administration Service | 1695 | jMX / 2Q19 / 1342jMX / a / 2014/009259 | Patent title PCT | 1223 | GAGV | Pág (s) 1 | 3xCTdNoHLqr7SN9WQ1s9qDN
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Arenal No. 550, Floor 1, Puebío Santa Mana Tepepan, Xochtmíico, '16020, Mexico City.
(55) 53340700 www.gob.rnx / irnpi
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MX / 2019/1342
METHODS AND APPARATUS FOR DRYING DEVICE______________
This application claims priority to provisional US Patent Application No. 61 / 593,617, filed on February 1, 2012 and 61 / 638,599, filed on April 26, 2012, all of which are incorporated herein by reference. .
FIELD OF THE INVENTION
The modalities of the present disclosure are generally concerned with the repair and maintenance of electronic devices and with the repair and maintenance of electronic devices that have been rendered at least partially inoperative due to moisture invasion.
BACKGROUND OF THE INVENTION
Electronic devices are frequently manufactured using ultra-precision parts for tight fitting and finishing dimensions that are designed to prevent moisture from entering the interior of the device. Many electronic devices are also manufactured to make disassembly by owners and / or users difficult without rendering the device inoperable even before drying attempts. With the continuous miniaturization of electronic components and
<img file="MX360647B_D0009.tif" />
day
IMPI g?
With increasingly powerful programming element applications, it is common for people today to carry multiple electronic devices, such as portable electronic devices. Cell phones 5 are currently more ubiquitous than landlines, and many people, on a daily basis around the world, inadvertently subject these devices to undesirable contact with water or other fluids. This occurs daily in, for example, bathrooms, kitchens, swimming pools, lakes, washing machines, or any other areas where various electronic devices (for example, small portable electronic devices) can be submerged in water or subjected to high humidity conditions. These electronic devices often have miniaturized solid state transistor memory 15 for capturing and storing digitized media in the form of telephone contact lists, email addresses, digitized photographs, digitized music, and the like.
BRIEF DESCRIPTION OF THE INVENTION
In conventional art, there are currently difficulties in removing moisture within an electronic device. Such devices can be heated to no avail, as moisture inside the device often cannot escape due to trayt_______________3 for removal. Without complete disassembly of the electronic device and using a combination of heat and air drying, the device cannot be properly dried once it is subjected to water and / or other wetting agents or fluids. Also, if heating is generally employed to dry the device and the heat exceeds the recommended maximums for the electronic components or other components, damage may occur, the device may become inoperable, and the owner's digitized data may be lost forever. A new type of drying system was found to be necessary to allow individuals and repair shops to dry electronic devices without disassembly, while retaining digitized data and / or while fully protecting the electronic device from corrosion.
The embodiments of the present invention are concerned with equipment and methods for drying materials by vacuum-pressure based on the decrease in vapor pressure and the boiling points of liquids. More particularly, certain embodiments of the invention are concerned with a vacuum chamber with a heated plate that can be automatically controlled to heat electronic components, such as an inoperable portable electronic device, via conduction, reducing
ΜΡΙ 'ΠΑΤΟ ΜΒλϊΟαΝΌ DT PROPERTY
<img file="MX360647B_D0010.tif" />
thereby the pressure temperature of. ¡^ R purposes of drying the device and making it operable again.
In certain embodiments, a plate that is electrically heated provides heat conduction to the portable electronic device that has been subjected to water or other undesirable wetting agents. This heated plate can form the base of a vacuum chamber from which air is selectively evacuated. The heated conductive plate can raise the overall temperature of the wet device through physical contact and the material's heat transfer coefficient. The heated conductive plate, being housed in a conductive box, radiates heat and can heat other portions of the vacuum chamber (eg, the exterior of the vacuum chamber) for simultaneous convection heating. The pressure within the vacuum chamber housing containing the wet electronic device can be simultaneously decreased. The decreased pressure provides an environment whereby liquid vapor pressures can be reduced, allowing for lower boiling points of any liquid or wetting agent within the chamber. The combination of a heated path (for example, a heated path) to the wet electronic device and decreased pressure results in
<img file="MX360647B_D0011.tif" />
and liquids are boiled in the form of a gas at lower temperatures, thereby preventing damage to the electronic components while drying. This drying occurs because the evaporation of the liquids to gases can more easily escape through the hermetic containers of the electronic device and through the tortuous paths established in the design and manufacture of the device. The water or wetting agent is essentially boiled at one time to a gas and thereafter evacuated from within the chamber housing.
Other modalities include a vacuum chamber with a heated plate under automatic control. The vacuum chamber is microprocessor controlled using various vacuum pressure and heat profiles for various electronic devices. This exemplary heated vacuum system provides a local condition to the electronic device that has been wetted and reduces the overall vapor pressure point, allowing the wetting agents to boil at a much lower temperature. This allows complete drying of the electronic device without damage to the device itself from excessive (high) temperatures.
Certain elements of the present invention address these and other needs and provide other important advantages.
present in or dependent particular claim.
This brief description of the invention ___ present a selection of the concepts that are described in additional detail in the detailed description and figures contained herein. This brief description of the invention is not intended to identify main or essential elements of the claimed subject matter. Some or all of the elements described may be corresponding independent claims, but should not be construed as a limitation unless expressly mentioned in a
Each embodiment described herein is not necessarily intended to address every object described herein and each embodiment does not necessarily include every item described. Other forms, modalities, objects, advantages, benefits, elements, and aspects of the present invention will become apparent to one of skill in the art from the detailed description and figures contained herein. Furthermore, the various apparatus and methods described in this brief description section of the invention, as well as elsewhere in this application, can be expressed as a large number of different combinations and sub-combinations. All such useful, novel and inventive combinations and sub-combinations are contemplated herein, it being recognized that the explicit expression of each of these combinations is unnecessary.
BRIEF DESCRIPTION OF THE FIGURES
Some of the figures shown herein may include dimensions or may have been created from scaled figures. However, such dimensions or relative scaling within a figure are by way of example only and will not be construed as limiting the scope of this invention.
Figure 1 is an isometric view of an electronic device drying apparatus in accordance with one embodiment of the present disclosure.
Figure 2 is an isometric bottom view of the electrically heated conduit plate element of the drying apparatus of the electronic device illustrated in Figure 1.
Figure 3 is an isometric sectional view of the element of the electrically heated conduit plate and vacuum chamber element illustrated in Figure 1.
Figure 4A is an isometric view of the electrically heated conduit plate element and vacuum chamber of Figure 1 in the open position.
Figure 4B is an isometric view of the electrically heated conduit plate element and vacuum chamber of Figure 1 in the closed position.
Figure 5 is a block diagram - _________ _n electronic control system and drying apparatus of the electronic device according to an embodiment of the present disclosure.
Figure 6A is a graphical representation of the vapor pressure curve of water at various vacuum pressures and temperatures and a target heating zone and evacuation drying zone in accordance with one embodiment of the present disclosure.
Figure 6B is a graphical representation of a water vapor pressure curve at a particular vacuum pressure illustrating heat loss as a result of latent heat of evaporation.
Figure 6C is a graphical representation of the water vapor pressure curve at a particular vacuum pressure illustrating the heat gain as a result of conduction plate heating.
Figure 7 is a graphical representation of the heated plate temperature and associated electronic device temperature with no vacuum applied in accordance with an embodiment of the present disclosure.
Figure 8A is a graph illustrating the heated plate temperature and temperature response of the electronic device associated with vacuum applied cyclically and then ventilated at atmospheric pressure for a period of time according to another ..._______ present disclosure.
Figure 8B is a graph illustrating the vacuum cyclically applied and then ventilated at atmospheric pressure for a period of time in accordance with another embodiment of the present disclosure.
Figure 8C is a graph illustrating the vacuum cyclically applied and then ventilated at atmospheric pressure with the response of the temperature of the electronic device superimposed over a period of time in accordance with another embodiment of the present disclosure.
Figure 9 is a graph illustrating the output of the relative humidity sensor that occurs during successive heating and vacuum cycles of the drying apparatus of the electronic device in accordance with an embodiment of the present invention.
Figure 10 is an isometric view of an electronic device and germicidal element drying apparatus according to another embodiment of the present disclosure.
Figure 11 is a block diagram illustrating an electronic control system, electronic device drying apparatus, and germicidal element in accordance with a further embodiment of the present disclosure.
Figure 12 is a block diagram of an illustrated regenerative desiccator with tri-directional solenoid valves in the open position for vacuuming an evacuation chamber in the state of ++++ moisture scrubbing according to another embodiment.
Figure 13 is a block diagram of the regenerative desiccator of Figure 12 illustrated with three-way solenoid valves in the closed position to for example provide an air purge to the desiccators.
DESCRIPTION OF THE ILLUSTRATED MODALITIES
For purposes of promoting an understanding of the principles of the invention, reference will now be made to selected embodiments illustrated in the figures and specific language will be used to describe them. However, it will be understood that no limitation of the scope of the invention is intended; Any further alterations and modifications of the disclosed or illustrated embodiments, and any further applications of the principles of the invention as illustrated herein are contemplated as would ordinarily be presented to the person skilled in the art with which this invention is concerned. At least one embodiment of the invention is shown in greater detail, although it will be apparent to those skilled in the relevant art that some elements or some combinations of elements may not be shown for the purpose of clarity.
Specific discussions,
ΜΡΙ
MEXICAN INSTITUTE DT LA ÍAOÍTEDAD
Any reference to invention in a reference to one embodiment of a family of inventions, no single embodiment includes elements that are necessarily included in all embodiments, unless stated otherwise. Furthermore, although references may be made to advantages provided by some embodiments of the present invention, other embodiments may not include these same advantages or may include different advantages. Any advantages described herein will not be construed as limiting any of the claims.
Specific quantities (spatial dimensions, temperatures, pressures, times, force, resistance, current, voltage, concentrations, wavelengths, frequencies, heat transfer coefficients, dimensionless parameters, etc.) may be used explicitly or implicitly herein, such specific amounts are presented as examples only and are approximate values, unless otherwise indicated.
Relevant to compositions of matter if present, are presented as examples only and do not limit the possibility of application of other compositions of matter, especially other compositions of matter with similar properties, unless otherwise indicated.
<img file="MX360647B_D0012.tif" />
The modalities of the present devices and equipment in general used to dry materials using reduced pressure. Modalities include methods and apparatus for drying (eg, automatic drying) of electronic devices (eg, portable electronic devices such as cell phones, digital music players, watches, pagers, cameras, tablet computers, and the like) after that these units have been subjected to water, high humidity conditions or other undesirable damaging wetting agents that render such devices inoperable. At least one embodiment provides a heated plate (eg, a user controlled heated plate) under vacuum that heats the portable electronic device and / or reduces the pressure to evaporate undesirable liquids at boiling points lower than atmospheric. Heat can also be applied by other means, such as heating other components of the vacuum chamber, or the gas (eg air) within the vacuum chamber. Heat and vacuum can be applied sequentially, simultaneously, or in various combinations of sequential and simultaneous operation.
The liquid evaporation point present inside the device is decreased based on the construction materials of the device that is heated in such a way ir> r τ * τ ................
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melting and / or glass transition temperature of such materials. Thus, the device that is subjected to the drying cycle under vacuum pressure can be safely dried and become functional again without damage to the device itself.
Referring first to Figure 1, an isometric diagram of a drying apparatus is shown, for example, an automatic portable electronic device drying apparatus 1, in accordance with an embodiment of the present invention. The drying apparatus of the electronic device 1 includes the enclosure 2, vacuum chamber 3, a heater (e.g. electrically heated conduit plate 16), an optional convection chamber 4 and an optional modem internet interface connector 12. An optional user interface for the electronic device drying apparatus 1 may be used, and may optionally consist of one or more of the following: input device selection switches 11, device selection indicator lights 15, timer display 14, power switch 19, start-stop switch 13 and audible indicator 20. The vacuum chamber 3 can be made, for example, of a polymeric plastic, glass or metal, with a thickness and geometry suitable to withstand a vacuum (decreased pressure). Vacuum chamber 3 can be
<img file="MX360647B_D0013.tif" />
Made of any material that is structurally rigid enough to withstand vacuum pressures and to maintain vacuum pressures within the structure, for example, it is sufficiently non-porous.
The heated conduit plate 16 can be electrically energized by means of heater power wires 10 and can be made of thermally conductive material and made of thickness appropriate to withstand high vacuum. In some embodiments, the electrically heated conduit plate 16 is made of aluminum, although other embodiments include plates made of copper, steel, iron, or other thermally conductive material, including but not limited to other metallic, plastic, or ceramic materials. The heated conduit plate 16 can be mounted inside the convection chamber 4 and coupled with the vacuum chamber 3 using for example an optional sealing O-ring 5. The air inside the vacuum chamber 3 is evacuated via the evacuation gate 7 and ventilated via the ventilation hole 6. The convection chamber 4, if used, can include the fan 9 to circulate the hot air inside the convection chamber 4.
Figure 2 illustrates the heated conduit plate 16 with a heat generator (eg, a thermal thin sheet resistance heater 21). The heated conduit plate 16 may also include temperature feedback 8, power connection of the thermal thin sheet resistance heater 10, evacuation gate 7 and / or vent 6. In one embodiment of the invention, the heated conduit plate 16 is a separate self-contained heating plate that sits on a vacuum chamber mounting plate.
Figure 3 illustrates the heated conduit plate 16 and the vacuum chamber 3 in an isometric sectional view. Vacuum chamber 3 is coupled to heated conduit plate 16 using sealing O-ring 5. Plate 16 supplies thermal energy both internally and externally to vacuum chamber 3 via the thin sheet metal resistance heater 21 attached to the bottom of plate 16 and is temperature controlled by temperature feedback sensor 8. The temperature feedback sensor 8 could be a thermistor, a semiconductor temperature sensor, or any one of a number of thermocouple types. Evacuation damper 7 and ventilation hole 6 are illustrated as through holes to facilitate pneumatic connection to the interior of vacuum chamber 3 using the underside of heated conduit plate 16.
Figures 4A and 4B illustrate the vacuum chamber 3 in the open state 17 and closed state 18. The _______ seal 5 engages with the sealing surface of the vacuum chamber 31 when the transition from open state 17 to closed state is made. 18. During the closed state
18, the evacuation gate 7 and the atmospheric ventilation hole 6 are sealed inside the vacuum chamber by virtue of being arranged within the diameter of the sealing O-ring 5.
Referring to Figure 5, the enclosure 1 of the drying apparatus of the electronic device is shown in an isometric view with the control scheme on the block diagram according to an embodiment of the present invention. A controller, for example microprocessor 44, is electrically connected to User Interface 47, memory 45, modem Internet interface circuit 46 and
<td rowspan="2">relay of distribution</td><td colspan="2">the pump</td><td colspan="2">evacuation 42</td><td rowspan="2">via the 48,</td><td rowspan="2">line line</td><td rowspan="2">of of</td>
<td>of</td><td>interface</td><td>of</td><td>user</td>
<td>distribution</td><td>of</td><td>interface</td><td>of</td><td>memory</td><td> 49,</td><td>line</td><td>of</td>
<td>distribution</td><td colspan="2">from interface to</td><td colspan="3">Modem Internet 51</td><td>and line</td><td>of</td>
evacuation pump relay control 66, respectively. The power supply 53 energizes the entire system by means of for example the positive power line 58 and negative ground line 55. The power lines of the thin foil resistance heater 10 are connected directly to the positive power line 58 and heated power line control transistor negative power line 54. The evacuation manifold 62 is connected to the evacuation pump 41, which is electrically controlled via the evacuation pump control line 68. The vacuum pressure sensor 43 is connected to the evacuation manifold 62 and produces output level signals. vacuum pressure via wire or vacuum pressure sensor signal line 52. A relative humidity sensor 61 can be pneumatically connected to evacuation manifold 62 and can produce analog voltage signals that relate to the relative humidity of evacuation manifold 62. Analog voltage signals are detected by the relative humidity signal line 61 to the control microprocessor 44. The convection chamber vent solenoid 57 is connected to the convection chamber vent manifold 64 and is controlled by control microprocessor 44 via the control signal from the convection chamber solenoid vent valve 56. Atmospheric vent solenoid valve 67 is connected to atmospheric vent manifold 75 and is controlled by control microprocessor 44 via the control signal wire of atmospheric solenoid vent valve 69.
Referring to Figures 6A-6C, a graphical representation of the water vapor pressure curve 74 is τ> ry * and ................
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MEXICAN INSTITUTE IB · ........... ΧΒΙίΒιίΥ ^ Ϊ »derived from pressure conversions of vaj ^ x relate the water temperature 72 and the vacuum pressure of the air surrounding the water 70. Using the example Illustrated in Figure 6B, water held at temperature 81 (approximately 40 ° C (104 degrees Fahrenheit)) will begin to boil at vacuum pressure 83 (approximately -68.6 cm Hg (27 inches Mercury)). Using the vapor pressure curve 74, a target or preferred heating and evacuation drying zone 76 for automatic drying of portable electronic devices was determined. The upper temperature limit of the evacuation drying zone 76 can be governed by the temperature at which the materials used to build the electronic device will be dried to begin to deform or melt. The lower temperature limit of the evacuation drying zone 76 can be governed by the ability of the evacuation pump 41 to generate the low pressure or the amount of time required for the evacuation pump 41 to obtain the low pressure.
Referring to Figure 7, a graphical representation of the heating curve of the heated conduit plate 80 which is heated to a temperature value on the temperature axis 85 for some time illustrated on the time axis 87 in accordance with one embodiment of the present invention. A portable electronic device that rests on the heated conduction plate 16 ___________ „heating curve of the heated conduction plate 80 and is generally heated according to the heating curve of device 82. The heating curve of device 82 is illustrated that it is delayed in time due to the variation in the thermal conduction coefficients.
Referring now to Figure 8A-8C, a graphical representation of the heating curve of heated conduit plate 80 is illustrated with the temperature axis 85 for some time on the time axis 87 together with the vacuum pressure axis 92 of according to another embodiment of the present invention. As a result of the changing vacuum pressure curve 98 and by virtue of the latent heat escaping due to evaporation of steam from the wet portable electronic device, the heating curve of the device 96 is produced.
When the moisture inside the device evaporates, the device would typically cool down due to the latent heat of evaporation. Adding heat to the process minimizes device cooling and helps improve the rate at which moisture can be removed from the device.
Referring to Figure 9, a graphical representation of the relative humidity sensor 61 is illustrated with the relative humidity axis 102 plotted against the time cycle axis 87 in accordance with a __________ present invention. As moisture evaporates in the portable electronic device, evaporation produces a relative humidity curve 100 that becomes progressively smaller and follows the reduction line 106. Relative humidity peaks 104 are successively decreased and eventually minimized to ambient humidity 108.
In one embodiment, the drying apparatus of the electronic device 1 operates as follows:
A portable electronic device that has become wet or exposed to moisture is inserted into convection chamber 4 by opening door 22 and placing the device under vacuum chamber 3 that has been lifted off heated conduit plate 16. The lifting of the vacuum chamber 3 can be done manually or with a lifting mechanism. Door 22 can be hinged on top of convection chamber 4. (Either one method or the other does not take or enhance the spirit or intent of the invention.)
To initiate a drying cycle operation, the user then pushes or activates an on-off switch 19 to turn on the drying apparatus 1. Once the apparatus 1 is on, the user selects, via device selection switches input (see Figures 1 and 5) the appropriate electronic device for drying. Control microprocessor 44 detects user switch selection
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<img file="MX360647B_D0014.tif" />
user interface distribution 48 by scrutinizing the input device selection switches 11 and subsequently recognizing the user selection by illuminating the appropriate input device selection indicator light 15 (Figure 1) for the appropriate selection. Microprocessor 44 houses programming elements in non-volatile memory 4 5 and communicates with the programming element codes in memory interface distribution line 49.
In an embodiment of the invention, memory 45 contains algorithms for the various portable electronic devices that can be dried by this invention - each algorithm contains temperature settings of the specific heated conduit plate 16 and the correct algorithm is automatically selected for the type of electronic device inserted into the device 1.
In one embodiment, processor 44 activates or turns on a heated conduit plate 16 via control transistor 54 that supplies power 53 to positive and negative supply lines 58 and 55, respectively, to the power wires of heater 10. This Power switching causes the thin sheet metal resistance heater 21 to generate heat via resistance heating. The thin sheet metal resistance heater 21, which is in ___ ___ laminated thermal contact a) the heated conduction plate 16, begins to heat up to the target temperature and by means of, for example, physical contact with the subject device, allows heat to flow into the device via thermal conduction. In certain embodiments, the target temperature for the heated plate is at least 21 ° C (70 degrees Fahrenheit) and at most 65.5 ° C (150 degrees Fahrenheit). In additional embodiments, the target temperature for the heated plate is at least about 43.3 ° C (110 degrees Fahrenheit) and at most about 49 ° C (120 degrees Fahrenheit).
In alternative embodiments, heating of the heated conduit plate 16 is carried out in alternative ways, such as by heating hot water, infrared lamps, incandescent lamps, gas or fuel flame, Fresnel lenses, steam, body heat human, hair dryers, fusible materials or heat produced by friction. Either of these heating methods would produce the heat necessary for the heated conduit plate 16 to transfer heat to a portable electronic device.
During operation, the microprocessor 44 scrutinizes the heated plate temperature sensor 8 (via the heated plate temperature sensor signal line 26) and supplies power to the plate 16 until the target temperature pl_____ __________i. Once the target temperature is obtained, microprocessor 44 starts a timer, based on variables in memory 45 via memory interface distribution line 49, which allows sufficient time for heated conduit plate 16 to transfer heat to the portable electronic device. In some embodiments, plate 16 has a heated conduit plate 80 heating profile that takes a finite time to obtain a target temperature. The heating profile 80 (Figure 7) is only one such algorithm and the target temperature can drop at any point on the temperature axis 85. As a result of the heated conduit plate 16 that transfers heat to the subject device, the device temperature profile 82. In general, the temperature profile of the portable electronic device 82 follows the heating profile of the heated conduit plate 80 and can generally fall anywhere on the temperature axis 85. Without further action, the heating profile of the heating plate Heated conduit 80 and the heating profile of the portable electronic device 82 would reach a quiescent point and would maintain these temperatures for a finite time over time 87. If power was discontinued to fixture 1, the
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During the heating cycle, the vacuum chamber 3 can be in open position 17 or closed position 18 as shown in Figures 4A and 4B. Either one or the other position has little effect on conductive heat transfer from the heated conduit plate 16 to the portable electronic device.
The convection chamber fan 9 can be energized (via the fan control signal line 24 electrically connected to the microprocessor 44) to circulate the air within the convection chamber 4 and outside the vacuum chamber 3. The Air inside the convection chamber 4 is heated, at least in part, by the radiated heat from the heated conduit plate 16. The convection chamber fan 9 provides circulation means for the air within the convection chamber 4 and helps maintain a relatively uniform heated air temperature within the convection chamber 4 and surrounding vacuum chamber 3. The microprocessor 44 You can close the atmospheric vent solenoid valve 67 by sending an electrical signal via the atmospheric vent solenoid valve control signal line 69.
In one embodiment of the invention, ___ „3 separate heating to control the heat within the convection chamber 4. These heating elements may be common electrical resistance heaters. In one embodiment, plate 16 can be used to heat convection chamber 4 without the need for a separate convection chamber heater.
In operation, the microprocessor 44 signals to the user, such as via the audible indicator 20 (Figures 1 and 5) that the heated conduction plate 4 has obtained the target temperature and can initiate an audible signal on the audible indicator 20 so that the user move vacuum chamber 3 from open position 17 to closed position 18 (see Figures 4A and 4B) in order to start the drying cycle. The start-stop switch 13 can then be depressed or activated by the user, after which the microprocessor 44 detects this action by scrutinizing the user interface distribution line 4 8 and sends a signal to the shut-off valve. convection ventilation solenoid 57 (via the convection chamber ventilation solenoid control signal wire
56), which then closes the atmospheric vent 6 by means of the pneumatically connected atmospheric vent manifold 64. The closure of the convection chamber vent solenoid valve 57 ensures that the vacuum chamber 3 is sealed when the ._______ begins - u indoor air.
After the electronic device is heated to a target temperature (or in alternative modes, when the heated plate reaches a target temperature) and after an optional time delay, the pressure within the vacuum chamber is decreased. In at least one embodiment, microprocessor 44 sends a control signal to motor relay 42 (via motor relay control signal line 66) to activate evacuation pump 41. The motor relay 42 energizes the evacuation pump 41 via the evacuation pump power line 68. After activation, the evacuation pump 41 begins to evacuate the air from inside the vacuum chamber 3 by means of the Evacuation gate 7, which is pneumatically connected to evacuation manifold 62. Microprocessor 44 can display elapsed time as a display timer 14 (Figure 1). As air evacuation proceeds within vacuum chamber 3, the vacuum chamber sealing surface 31 compresses the vacuum chamber sealing o-ring 5 against the surface of the heated conduit plate 16 to provide a Vacuum tight seal. Evacuation manifold 62 is pneumatically connected to a vacuum pressure sensor 43, which directs analog signals from
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As the air is evacuated, the microprocessor 44 scrutinizes the temperature of the heated conduit plate 16, the vacuum chamber evacuation pressure sensor 43, and the relative humidity sensor 61, via the temperature signal line 26, vacuum pressure signal line 52 and relative humidity signal line 65, respectively. During this evacuation process, the vapor pressure point of, for example, the water present on the surface of the components within the portable electronic device follows the known vapor pressure curve 74 as shown in Figures 6A-6C. In some embodiments, the algorithms of the microprocessor 44 have target temperature and target vacuum pressure variables that fall for example within a preferred vacuum drying target zone 76. Vacuum drying target zone 76 provides for evaporation of water at lower temperatures based on reduced pressure within chamber 4. Microprocessor 44 can monitor pressure (via vacuum pressure sensor 43) and relative humidity (via relative humidity sensor 61) and monitor the drying process accordingly.
As the pressure inside the chamber decreases.
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After the pressure inside the chamber has been decreased, it is again increased. This can occur after a predetermined amount of time or after a particular state is detected (such as the relative humidity getting or approaching a steady state value). The increase in pressure can be accomplished by microprocessor 44 which sends a signal to convection chamber vent solenoid valve 57 and atmospheric vent solenoid valve 67 (via the solenoid valve control signal convection chamber vent 56 and atmospheric solenoid valve control signal 69) and open. This causes air, which may be ambient air, to enter the atmospheric control solenoid valve 67 and thereby the vent convection chamber 4. The opening of the convection vent solenoid valve 57, which can occur simultaneously with the opening of the convection chamber vent valve 57 and / or atmospheric vent solenoid valve 67, allows heated air within the plenum chamber. convection 4 is pulled into vacuum chamber 3 by vacuum pump 41. Atmospheric air (eg ambient air) enters through evacuation chamber 41 which remains on and draws atmospheric air into vacuum chamber 3 via atmospheric vent manifold 64 and evacuation manifold 62.
After the relative humidity has been reduced (as optionally detected by the relative humidity sensor 61 and a feedback signal from the relative humidity sensor via the feedback line from the relative humidity sensor 65 to the microprocessor 44), the convection chamber vent solenoid 57 and atmospheric solenoid valve 67 can be closed, such as via the control signal of the convection chamber vent solenoid valve 56 and the control signal of the atmospheric solenoid valve 69 and the pressure within the vacuum chamber is again decreased.
This sequence can produce an evacuation chamber 98 profile curve (Figures 8B and 8C) that can be repeated based on the algorithm selected and controlled under the control of the microprocessor 44 programming elements. Repetitive vacuum cycles ( that it can be carried out under heating that the wetting agent is evaporated and forced to go from a liquid state to a gaseous state. This gaseous state of the water allows the resulting water vapor to escape through the tortuous paths of the electronic device, through which the liquid water cannot otherwise escape.
In at least one embodiment, microprocessor 44 detects peaks of relative humidity 104 (illustrated in Figure 9), such as by using a programming element algorithm that determines peaks by detecting a decrease or absence of the rate at which relative humidity is changing. When a relative humidity peak 104 is detected, the pressure within the vacuum chamber will be increased (such as by ventilating the vacuum chamber) and the relative humidity will decrease. Once the relative humidity reaches a minimum relative humidity 108 (which can be detected by a programming element algorithm similar to the algorithm described above), another cycle can be started by lowering the pressure within the vacuum chamber.
Referring now to Figures 8A and 8C, the directional graph arrow of response curve 96A generally results from heat gain when the system is in a purge air recovery mode, which allows the electronic device to gain hot. __ ™ directional graph of response curve 96B results in
<td>general heat</td><td>latent</td><td>of</td><td>evaporation when</td><td>the</td><td>system</td>
<td>is in mode</td><td>drying</td><td>to the</td><td>empty. Custom</td><td>than</td><td>cycles</td>
<td>consecutive</td><td>they carried</td><td>to</td><td colspan="2">out temperature</td><td>96 of</td>
The electronic device will tend to gradually increase and the changes in temperature between successive cycles will tend to decrease.
In some embodiments, microprocessor 44 continues this repetitive or cyclical heating and evacuation of the
<td>camera</td><td>of emptiness</td><td> 3,</td><td>producing</td><td>a curve</td><td>of</td><td>answer</td><td>of</td>
<td>humidity</td><td>relative</td><td> 100</td><td>(Figure 9)</td><td>. This curve</td><td>of</td><td>answer</td><td>of</td>
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of programming elements with cyclic relative humidity maxima 104 and cyclical minima 108 stored in registers within microprocessor 44. In alternative modes, the relative humidity maxima 104 and minima 108 will commonly follow a relative humidity drying profile 106A and 106B which are asymptomatically minimized over time to minima 109 and 110. Through one or more successive heating cycles 96 and evacuation cycles 98, as illustrated in Figure 8A-8C, the portable electronic device arranged within the vacuum chamber 3 is dried. Control algorithms in microprocessor 44 can determine when the difference in maximum relative humidity
104 and minimum relative humidity 108 est ^ specified tolerance to guarantee the deactivation or stop of the vacuum pump 41.
The system can automatically stop running consecutive drying cycles when one or more criteria are met. For example, the system may stop executing consecutive drying cycles when a parameter that changes as the device is dried approaches or reaches a steady state value or end value. In an exemplary mode, the system automatically stops executing consecutive drying cycles when the relative humidity falls below a certain level or approaches (or reaches) a steady state value. In another exemplary embodiment, the system automatically stops running consecutive drying cycles when the difference between the maximum and minimum relative humidity in one cycle falls below a certain level. In yet another exemplary embodiment, the system automatically stops performing consecutive drying cycles when the electronic device temperature 96 approaches or reaches a steady state value.
Referring again to Figures 1 and 5, microprocessor 44 can be remotely connected to the internet via, for example, a RJ11 modem internet connector 12 that is integrated into modem interface 46. Microprocessor 44 can thus send a signal from the Internet or go> r τ * τ ................
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telephone via the Internet interface of and Internet __r RJ11 12 to signal to the user that the processing cycle has been completed and the electronic device is sufficiently dry.
Thus, simultaneous conductive heating and vacuum drying can be obtained and tailored to specific electronic devices based on the materials of construction of the portable electronic component in order to dry without damage the various types of electronic devices on the market today.
In alternative embodiments, an optional desiccator 63 (Figure 5) can be connected to evacuation manifold 62 upstream of the evacuation pump 41. An exemplary site for desiccator 63 is downstream of relative humidity sensor 61 and upstream of the evacuation pump 41. When included, the desiccator 63 can absorb the moisture in the air coming from the vacuum chamber 3 before the humidity reaches the evacuation pump 41. In some embodiments, the desiccator 63 may be a replaceable cartridge or a regenerative type desiccator.
In modes where the evacuation pump is of the oil-using type, there may be a tendency for the oil in an evacuation pump to purify (or absorb) water from the air, which may lead to entrainment of the water into the evacuation, premature decomposition of oil in the evacuation pump and / or premature failure ~ _____ ~ evacuation itself. In modes where the evacuation pump is the oil-free type, high humidity conditions can also lead to premature pump failure. As such, advantages can be realized by removing the water (or possibly other constituents of the air) from the air with the desiccator 63 before the air reaches the evacuation pump 41.
Although many of the above modalities describe drying apparatus and methods that are automatically controlled, other modalities include drying apparatus and methods that are manually controlled. For example, in one embodiment, a user controls the application of heat to the wetted device, the application of vacuum to the wetted device, and release of vacuum to the wetted device.
A drying apparatus, for example, a drying apparatus of the automatic portable electronic device 200, is illustrated in FIG. 10 in accordance with another embodiment of the present invention. Many elements and components of drying apparatus 200 are similar to elements and components of drying apparatus 1, the same reference numbers are used to indicate elements and components that are similar between the two modes. Drying apparatus 200 includes a disinfection element, such as light
<img file="MX360647B_D0015.tif" />
ultraviolet (UV) germicide 202, which can kill germs. Light 202 can be mounted inside convection chamber 4 and controlled by a UV 204 germicidal light control signal. In one embodiment, the UV 202 germicidal light is mounted inside the convection chamber 4 and outside the vacuum chamber 3, with the UV radiation being emitted by the germicidal light 202 and passing through the chamber of vacuum 3, which can be made of UV light transmitting material (an example is acrylic plastic). In an alternative embodiment, the germicidal UV light 202 is mounted inside the vacuum chamber 3, which may have benefits in embodiments where the vacuum chamber 3 is made of a non-UV light transmitting material.
In one embodiment, the operation of the drying apparatus 200 is similar to the operation of the drying apparatus 1 as described above with the following changes and clarifications. Microprocessor 44 sends the control signal through the control line of the UV 204 germicidal lamp and energizes the UV 202 germicidal lamp, which may occur at or near activation of the heated conduit plate 16 by the microprocessor 44. In one embodiment, the UV 202 germicidal lamp will then emit UV waves at approximately the 254nm wavelength, which can penetrate the vacuum chamber 3, particularly in modalities
<img file="MX360647B_D0016.tif" />
where the vacuum chamber 3 is manufactured__<sub>£</sub>------- in a modality.
In still further embodiments, one or more desiccators 218 can be isolated from the evacuation manifold 62, which may have advantages when periodic maintenance is performed or automated maintenance cycles of the drying apparatus are performed. As an example, the embodiment illustrated in Figures 11-13 includes valves (eg, three-way air bleed solenoid valves 210 and 212) that can selectively connect and disconnect desiccator 218 from the evacuation manifold
62. Solenoid valve 210 is placed between relative humidity sensor 61 and desiccator 218, and solenoid valve 212 is placed between desiccator 218 and vacuum sensor 43. In the illustrated mode, three-way air bleed valves 210 and 212 have their common distribution gates pneumatically connected to desiccator 218. This common port connection provides simultaneous isolation of the desiccator 218 from the exhaust manifold 62 and disconnection of the exhaust manifold 62 and vacuum pump 41. This disconnection prevents moisture from the vacuum chamber 3 from reaching the vacuum pump 41 while that desiccator 63 is being regenerated. The operation of this modality is similar to the modality described in relation to Figure 5 with the following changes and clarifications.
An optional 22C desiccator heater <sub>2 </sub>Optional desiccator air 224 can be included. While the desiccator 218 is isolated from the evacuation manifold 62 and the vacuum pump 41, the desiccator 218 can be heated by the desiccator heater 220 without affecting the vacuum manifold 62 and associated pneumatic vacuum circuits. As the desiccant inside desiccator 218 is heated, for example to a target temperature, to bake the absorbed moisture, the purge pump 224 can modulate (for example, according to a maintenance control algorithm with a time and / or prescribed temperature profile ordered by microprocessor 44) to aid in the removal of moisture from desiccant 218. In certain embodiments, the target temperature for the desiccator heater is at least 93 ° C (200 degrees Fahrenheit) and at most 149 ° C (300 degrees Fahrenheit). In additional modes, the target temperature for the desiccator heater is approximately 121 ° C (250 degrees Fahrenheit).
As purge pump 224 is modulated, atmospheric air is forced along air path 235, through the desiccant agent housed inside desiccator 218, and the moisture laden air is expelled through the gate. atmospheric 238. An optional desiccator cooling fan 222 can be included (and optionally modulated by the microproc ^. ^^ u or reduce the temperature of the desiccant inside the desiccator 218 to an appropriate temperature so that the desiccant absorbs moisture rather than degassing the humidity.
When the drying cycle is started according to one embodiment, the atmospheric vent 6 is closed and the microprocessor 44 sends control signals via the three-way air bleed solenoid control line 214 to the bleed solenoid valves. 3-way air 210 and 212. This operation closes the 3-way air bleed solenoid valves 210 and 212 and allows the vacuum pump 41 to be pneumatically connected to the exhaust manifold 52. This pneumatic connection allows the evacuated air to flow along the directional air path 215, through the evacuation manifold 62 and through the desiccator 218 before leading to the vacuum pump 41. An advantage that can be realized by removing the humidity of the evacuated air before carrying the vacuum pump 41 is a dramatic decrease in the failure rate of the vacuum pump 41.
After the algorithm of the microprocessor 44 detects that the portable electronic device is dry, the microprocessor 44 can signal the system to enter a maintenance mode. Germicidal UV 202 light can be
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44. Microprocessor 44 energizes desiccator 220 via the shutdown control signal via desiccator heater power relay heater microprocessor 166 and desiccator heater power developer 228. Control signal 226 is the control signal for the relay 228. The temperature of the desiccator 218 can be sampled by the microprocessor 44 via the desiccator temperature probe 230 and the heating of the desiccator 218 can be controlled to a specified temperature that begins the baking of the moisture in the desiccant agent housed in the desiccator 218. The three-way air bleed solenoid valves 210 and 212 can be electrically switched via the three-way air bleed solenoid control line 202 when it is determined that sufficient drying has occurred, which may occur at a finite time specified by the microprocessor maintenance algorithm 44. An air purge pump 224 can then be started by microprocessor 44 via the air purge pump control signal 232 to flush moisture laden air through desiccator 218 and atmospheric vent gate 238. Microprocessor 44 You can use a timer in the maintenance algorithm to heat and purge moisture-laden air for a finite time. Once the optional maintenance cycle is complete, e44 can turn on the desiccant cooling fan 222 to cool the desiccator 218. The microprocessor 44 can then turn off the air purge pump 224 to prepare the system for optional drying and disinfection from another electronic device.
Referring now to Figure 12, desiccator 218 is shown with a desiccator heater 220, a desiccant temperature sensor 230, a desiccant cooling fan 222, and desiccant air bleed solenoid valves 210 and 212. The pump Vacuum 41 is connected to evacuation manifold 62 and air bleed pump 224 is pneumatically connected to air bleed solenoid valve 212 via air bleed manifold 240. Tri-directional air purge solenoid valves 210 and 212 are illustrated in the state to allow vacuum through desiccator 218 as shown by the directional air path.
Referring to Figure 13, the desiccator three-way air purge solenoid valves 210 and 212 are illustrated in a maintenance state, which allows air to flow from the back flushed air purge pump 224 along the Direction 235 through the desiccator and out via the bleed air damper 238. The bleed pump 224 can cause pressurized air to flow along the directional path ^ .. ^ „„
This preferred directional path of atmospheric air allows the desiccant to release moisture in a pneumatically isolated state and prevents moisture from entering the air bleed pump 224, which would occur if the air bleed pump were to pull the air out. through desiccator 218. Purge pump 224 can continue to blow air into directional path 235 for a time prescribed in microprocessor 44 maintenance control algorithm. In one embodiment, an in-line relative humidity sensor similar to the relative humidity sensor 61 is incorporated to detect when the desiccator 218 is dry enough.
As described above in at least one embodiment, the evacuation manifold 62 is disconnected from the vacuum pump 41 when the desiccator 218 is disconnected from the evacuation manifold 62. However, alternative modalities include an evacuation manifold 62 that remains connected pneumatically with the vacuum pump 41 when the desiccator 218 is disconnected from the evacuation manifold 62. This configuration may be useful in situations where desiccator 218 may be blocking air flow, such as when desiccator 218 has malfunctioned and operation of drying apparatus 200 is still desired.
In some embodiments, all of the actions described above are performed automatically so that the user can simply place an electronic device in the proper location and activate the drying device for the drying device to remove moisture from the electronic device.
Microprocessor 44 may be a microcontroller, a general-purpose microprocessor, or in general any type of controller that can perform the required control functions. Microprocessor 44 can read its program from memory 45 and can consist of one or more components configured as a single unit. Alternatively, when in a multi-component form, processor 44 may have one or more components remotely located relative to one another. One or more components of processor 44 may be of the electronic variety, including digital circuits, analog circuits, or both. In one embodiment, processor 44 is from a conventional integrated circuit microprocessor array, such as one or more CORE i7 HEXA processors from INTEL Corporation (450 Mission College Boulevard, Santa Clara, California 95052, USA), ATHLON or PHENOM processors from Advanced Micro Devices (One AMD Place, Sunnyvale, California 94088, USA), POWER8 processors from IBM Corporation. (1 New Orchard Road, Armonk, New York 10504, USA) or PIC Microcontrollers from Microchip Technologies (2355 West ir> r τ * τ ................
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Chandler Boulevard, Chandler, Arizona. ^ n alternative modes, one or more application specific integrated circuits (ASICs), reduced instruction set computation processors (RISC), general purpose microprocessors, programmable logic arrays, or other devices can be used alone or in combinations as They will introduce you to those experienced in art.
Also, memory 45 in various embodiments includes one or more types, such as solid state electronic memory, magnetic memory, or optical memory, just to name a few. By way of non-limiting example, memory 45 may include solid state electronic random access memory (RAM), sequentially accessible memory (SAM) (such as the first-in, first-out (FIFO) variety or the last-in-variety enter, first exit (LIFO)), programmable read-only memory (PROM), electrically programmable read-only memory (EPROM) or electrically erasable programmable read-only memory (EEPROM); an optical disc memory (such as a writable, rewritable, or read-only DVD or CD-ROM); a magnetically encoded drive, floppy disk, tape, or cartridge media; or a plurality and / or combination of these types of memory. Also, memory 45 can be volatile, nonvolatile, or a hybrid combination of volatile and nonvolatile varieties.
Memory 45 in various modes is encoded with executable programming instructions ρ ^ χ to perform the automated methods disclosed herein.
Various aspects of different modalities of the present disclosure are expressed in paragraphs XI, X2, X3, X4, X5,
X6 and X7 as follows:
XI. One embodiment of the present disclosure includes an electronic device drying apparatus for drying water damaged electronic components or other wetting agent damaged electronic components comprising: heated conduit plate means; vacuum chamber medium; evacuation pump means; convection oven medium; solenoid valve control means; a microprocessor controlled system for automatically controlled heating and evacuation; vacuum sensor means; humidity sensor means; and a switch arrangement for algorithm selection.
X2. Another embodiment of the present disclosure includes a method comprising: placing a portable electronic device that has been rendered at least partially inoperable due to moisture invasion into a low pressure chamber; heating of the electronic device; decrease the pressure inside the low pressure chamber; remove moisture from inside the portable electronic device to the outside of the electronic device ^. ^ _ ~<sub>_</sub>__ increase the pressure inside the low pressure chamber after lowering the pressure; equalize the pressure inside the low pressure chamber with the pressure outside the low pressure chamber; and remove the portable electronic device from the low pressure chamber.
X3. Another embodiment of the present disclosure includes an apparatus comprising: a low pressure chamber defining an interior, the low pressure chamber having an interior sized and configured for placement of an electronic device inside and removal of the electronic device from the interior ; an evacuation pump connected to the chamber; a heater connected to the camera; and a controller connected to the evacuation pump and heater, the controller controls the removal of moisture from the electronic device by controlling the evacuation pump to decrease the pressure within the low pressure chamber and controlling the operation of the heater to add heat to the Electronic device.
X4. Another embodiment of the present disclosure includes a device for removing moisture from an electronic device, substantially as described herein with reference to the accompanying figures.
X5. Another embodiment of the present disclosure includes a method of removing moisture from an electronic device, ir> r τ * τ ................
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substantially as described in __ reference to the attached figures.
X6. Another embodiment of the present disclosure includes a method of manufacturing a device, substantially as described herein, with reference to the accompanying figures.
X7. Another embodiment of the present disclosure includes an apparatus comprising: means for heating a device
<td>electronic, -</td><td>means for</td><td>reduce</td><td>the</td><td>Pressure</td><td>inside</td><td>of the</td>
<td>device</td><td>electronic; and</td><td>media</td><td>for</td><td>detect</td><td>when</td><td>a</td>
<td colspan="2">enough quantity of</td><td>humidity</td><td>he has</td><td colspan="2">been removed</td><td>of the</td>
Electronic device.
Still other modalities include the elements described in any of the previous statements XI, X2, X3, X4, X5, X6 and X7, as they are combined with one or more of the following aspects:
Regenerative desiccant means to automatically dry the desiccant.
Germicidal UV lamp means to disinfect portable electronic devices.
Wherein the heated conduit plate consists of a thin foil heater laminated to the metallic conduit plate.
Where the heated conductive plate metal thermal thin sheet heater is 3 watts.
Wherein the heated conduit plate uses a temperature feedback sensor.
Where the surface area of the heated conduit plate is between 25.8 cm<sup>2</sup> (4 square inches) and 9,677 cm<sup>2</sup> (1500 square inches).
Wherein the heated conduit plate is also used as a convection oven heater to heat the exterior of the vacuum chamber.
Where the convection oven is used to heat the exterior of the vacuum chamber to minimize condensation in the internal vacuum chamber once vaporization occurs.
Wherein the vacuum chamber is made of a vacuum classification material such as plastic, metal or glass.
Wherein the vacuum chamber is constructed in such a way to withstand vacuum pressures of up to 76 cm Hg (30 inches of mercury) below atmospheric pressure.
Where the volume of the vacuum chamber is between
0.25 liters and 12 liters.
Where the evacuation pump provides a minimum vacuum pressure of 48 cm Hg (19 inches of mercury) below atmospheric pressure.
Where the solenoid valves have a diameter of τ »ir ir% τ .............- O
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hole between 0.063 cm (0.025 inch) inch.
Wherein the solenoid valve is used to provide a path for atmospheric air to exchange heated air through a convection oven.
Wherein the microprocessor controller uses memory-stored algorithms for controlled vacuum drying.
Where the relative humidity sensor is pneumatically connected to the vacuum chamber and used to sample the relative humidity in real time.
Where the microprocessor controller uses relative humidity maxima and minima for controlled vacuum drying.
Wherein the microprocessor controller automatically controls the heated conduction temperature, vacuum pressure and cycle times.
Wherein the microprocessor controller uses a pressure sensor, temperature sensor, and relative humidity sensor as feedback to heated vacuum drying.
Where the microprocessor controller records performance data and can transmit it on an interface to
Modem Internet.
Wherein such a switch arrangement for algorithm selection provides a simple method of control.
Where the regenerative desiccator is
<img file="MX360647B_D0017.tif" />
25 W external thin sheet metal heaters to 1000 W.
Wherein the regenerative desiccator uses a fan and temperature signal to allow precise closed loop temperature control to bake the desiccant.
Wherein the regenerative desiccator uses three-way pneumatic valves to pneumatically isolate the direction of the switching air flow and path for the desiccant purge.
Where UV germicidal light emits UV radiation at a wavelength of 254 nm and a power range of between 1 W and 250 W to provide appropriate UV radiation to disinfect portable electronic devices.
Where UV germicidal light disinfects portable electronic devices for between 1 minute and 480 minutes.
Where the regenerative desiccator is heated from 49 ° C (120 ° F) to 260 ° C (500 ° F) in order to provide a drying medium.
Where the regenerative desiccator is heated from 5 minutes to 600 minutes to provide a long drying time.
Where the heated conduit plate is heated to between 21 ° C (70 ° F) and 93.3 ° C (200 ° F) to compensate for the loss due to latent heat from loss of evaporation.
Wherein the microprocessor controller records performance data and can transmit and receive performance data and programming element updates wirelessly on a cellular wireless network.
Where the microprocessor controller records performance data and can print results to a wireless Internet Protocol printer or a locally installed printer.
Where placement includes placing the portable electronic device on a plate and heating includes heating the plate to at least approximately 43.3 ° C (110 degrees Fahrenheit) and at most
49 ° C (120 degrees Fahrenheit).
Where the pressure drop includes lowering the pressure to at least about 71 cm Hg (28 inches of mercury) below the pressure outside the chamber.
Where pressure drop includes lowering the pressure to at least approximately 76 cm Hg (30 inches of mercury) below the pressure outside the chamber.
Where placement includes placing the device ir> r τ * τ ................
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portable electronic on a board, ---- includes heating the board to at least about 43.3 ° C (110 degrees Fahrenheit) and at most
120 degrees Fahrenheit (49 ° C) and the decrease in pressure includes lowering the pressure to at least approximately 71 cm Hg (28 inches of mercury) below the pressure outside the chamber.
Where the decrease in pressure and increase in pressure are repeated sequentially before the portable electronic device is removed.
Automatically control repeated pressure drop and pressure rise according to at least one predetermined criterion.
Detect when a sufficient amount of moisture has been removed from the electronic device.
Stop repeated pressure drop and pressure rise after detection.
Measure the relative humidity inside the chamber.
Increase the pressure in the chamber after the relative humidity has decreased and the rate of decrease of the relative humidity has slowed down.
Where the decrease in pressure and increase in pressure are repeated sequentially before the portable electronic device is removed.
Where the decrease in pressure begins when the
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INSTITUTO MEXICANO relative humidity has increased and increase in relative humidity has slowed down.
Where the repeated decrease in pressure and increase in pressure is stopped once the difference between a maximum sequential relative humidity and minimum relative humidity is within a predetermined tolerance.
Where the decrease in pressure and increase in repeated pressure is stopped once the relative humidity inside the chamber reaches a predetermined value.
Decrease the pressure inside the low pressure chamber using a pump.
The removal of moisture from the gas is removed from the chamber with a pump before gas reaches the pump.
Where moisture removal includes removing moisture using a desiccator containing desiccant.
Remove moisture from the drying agent.
Isolate the desiccant from the pump before removing moisture from the desiccant.
Reverse air flow through the desiccator while removing moisture from the desiccant.
Heating of the desiccant during removal of moisture from the drying agent.
Where the heating includes heating the desiccant to at least 93.3 ° C (200 degrees
<img file="MX360647B_D0018.tif" />
Fahrenheit) and at most 14 9 ° C (300 degrees Fah J- \ _XXXX \ _- L. U- /
Where heating includes heating the desiccant to approximately 121 ° C (250 degrees Fahrenheit).
Wherein the controller controls the evacuation pump to decrease the pressure within the low pressure chamber multiple times and where the pressure within the low pressure chamber increases between successive decreases in pressure.
A humidity sensor connected to the low pressure chamber and the controller, where the controller controls the evacuation pump to at least partially stop the decrease in pressure within the low pressure chamber based at least in part on signals received from the humidity sensor.
Wherein the controller controls the evacuation pump to stop the pressure drop within the low pressure chamber at least temporarily when the rate at which the relative humidity changes decreases or is approximately zero.
Wherein the controller controls the evacuation pump to begin to decrease the pressure within the low pressure chamber when the rate at which the relative humidity changes decreases or is approximately zero.
Where the humidity sensor detects maximum and minimum relative humidity values as the evacuation pump lowers the pressure within pressure multiple times and where the controller determines that the device is dry when the difference between the relative humidity values maximums and minimums is equal to or less than a default value.
A valve connected to the low-pressure chamber and controller, where the pressure within the low-pressure chamber increases between successive drops in pressure at least in part due to the controller controlling the valve to increase the pressure.
Wherein the controller controls the valve to increase the pressure with the low pressure chamber at approximately the same time as the controller controls the evacuation pump to stop decreasing the pressure within the low pressure chamber.
Wherein the controller controls the valve to equalize the pressure between the inside of the low pressure chamber and the outside of the low pressure chamber.
A temperature sensor connected to the heater and controller, where the controller controls the heater to maintain a predetermined temperature based at least in part on signals received from the pressure sensor.
A pressure sensor connected to the low pressure chamber and the controller, where the controller controls the evacuation pump to stop the pressure drop at least temporarily within 1- _______ pressure based at least in part on signals received from the pressure sensor.
Wherein the heater includes a plate with which the electronic device is in direct contact during the removal of moisture from the electronic device.
Disinfect the electronic device.
A UV lamp to disinfect the electronic device.
While the illustrated examples, representative embodiments and specific forms of the invention have been illustrated and described in detail in the figures and description above, they will be considered as illustrative and not restrictive or limiting. The description of particular elements in a modality does not imply that those particular elements are necessarily limited to that modality. The elements of one modality can be used in combination with elements of other modalities as understood by that of ordinary skill in art, whether explicitly described or not as such. Exemplary modalities have been shown and described and all changes and modifications that fall within the spirit of the invention are intended to be protected.
Contents15
35 sheets
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138 members in 15 offices
Priority claims5
| Document | Office | Kind | Date |
|---|---|---|---|
| 61593617 | United States of America | – | |
| 201261593617 | United States of America | P | |
| 61638599 | United States of America | – | |
| 201261638599 | United States of America | P | |
| 2013024277 | United States of America | W |
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| KR20140144679A | Republic of Korea | A | |
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1 legal event, as the office reported them to INPADOC
Events
| Event | Code | |
|---|---|---|
| Grant or registrationFG | FG |
Numbers
- Publication
- 360647
- Application
- 9259
Titles2
- Spanish
- METODOS Y APARATOS PARA SECAR DISPOSITIVOS ELECTRONICOS.
- English
- METHODS AND APPARATUSES FOR DRYING ELECTRONIC DEVICES.
Classification
- CPC, 14
- F26B3/353
- F26B5/044
- F26B21/331
- F26B21/33
- F26B3/32
- F26B5/04
- F26B9/06
- H05B1/02
- F26B9/003
- F26B25/06
- F26B25/14
- F26B25/22
- F26B21/35
- F26B3/00
- IPC, 6
- F26B21 08
- F26B5 04
- F26B21 33
- F26B3 353
- F26B9 00
- F26B21 35