Rfid packaging and attachment methods and devices.

(54) Title: METHODS AND DEVICES FOR PACKAGING AND RFID CONNECTION.

(54) Title: RFID PACKAGING AND ATTACHMENT METHODS AND DEVICES.

(57) Summary

An exemplary RFID-activated electrically conductive signaling includes (1) an electrically conductive article including a hole and (2) an assembled device that is connected to the electrically conductive article in order to provide RFID functionality to the electrically conductive article. An example kit includes (1) an RFID IC array that includes conductive wires adjacent to an integrated circuit; (2) an insert connected to the RFID IC array; and (3) a connecting device capable of connecting the RFID IC array-insert combination with electrically conductive signaling, such that the RFID IC array is positioned to extend at least a portion of a hole in the signaling and to connect, electrically, the integrated circuit with electrically conductive signaling. An example method involves supplying an assembled device that includes an RFID IC array and insert and mating the assembled device with electrically conductive signaling.

(57) Abstract

One exemplary electrically conductive, RFID-enabled signage includes (1) an electrically conductive article including an opening and (2) an assembled device that¡s coupled to the electrically conductive article to provide RFID functionality to the electrically conductive article. One exemplary kit includes (1) an RFID IC arrangement including conductive leads adjacent to an integrated circuit; (2) an insert attached to the RFID IC arrangement; and (3) an attachment device capable of attaching the RFID IC arrangement-insert combination to an electrically conductive signage such that the RFID IC arrangement is positioned to span at least a portion of an opening ¡n the signage and to electrically couple the! Integrated circuit to the electrically conductive signage. One exemplary method involves providing an assembled device including and RFID IC arrangement and an insert and coupling the assembled device with an electrically conductive signage.

METHODS AND DEVICES FOR PACKAGING AND RFID CONNECTION

Field of the Invention

The present disclosure relates to multiple modalities of a signaling article having radio frequency response characteristics, methods of making and using the signaling article, and replacement kits.

Background of the Invention

Radio frequency identification technology, sometimes referred to as RFID technology, has a variety of commercial applications and is typically used for object identification and tracking.

United States Patent Publication No. 2008-0258875 (United States Patent Application No. 12 / 106,107 assigned to the signer of the present application) describes various methods of coupling RFID functionality with signaling, such as, for example, a metal signal, so that signaling can be associated with the data stored in the RFID integrated circuit that is attached to or integrated with the metal signal. This method involves connecting or coupling RFID functionality to a signaling by forming a slot, hole, or aperture in the signaling and using this slot, hole, or aperture to act as an antenna for a

REF. 221734 RFID integrated circuit that is physically coupled with signaling. This skewed cut, hole, or aperture creates what can be referred to as a slot antenna, which has radiation pattern properties similar to those of a dipole antenna. Selection of the length and width of the slot, hole or aperture may be based on the desired direction and / or radiation direction pattern of the electrically conductive RFID activated signaling article that is formed when the RFID integrated circuit is coupled with the electrically conductive element.

United States Patent Publication No.

2008-0258875 also describes various devices that have RFID functionality. An apparatus is an electrically conductive RFID activated signaling article that includes a slot antenna having an electrically conductive element which in turn includes a hole; and an RFID integrated circuit coupled to the substrate. The slot antenna operates as an RFID antenna, and the electrically conductive element includes at least one of an electrically conductive substrate or electrically conductive coating.

Summary of the Invention

The inventors of the present disclosure recognized the many advantages offered by the methods and apparatus written in the United States Patent Publication.

United No. 2008-0258875. This description shows additional features and devices that could be used, for example, with the apparatuses written in US Patent Publication No. 20080258875. This description also describes additional or alternative methods of making and using RFID-activated apparatuses. The present description refers to numerous modalities and numerous implementations of each modality.

One embodiment is an RFID-activated electrically conductive signaling, comprising an electrically conductive article including a hole and at least one of an electrically conductive substrate or electrically conductive coating and an assembled device capable of being physically coupled with the electrically conductive article in order to to provide RFID functionality with the electrically conductive article. The assembled device includes (1) an RFID IC arrangement comprising an integrated circuit adjacent conductive wires and (2) an insert having a shape and size that allows the insert to be placed within the hole. The assembled device is physically coupled with the electrically conductive article such that the RFID IC array extends at least a portion of the hole and electrically couples the integrated circuit with the electrically conductive article to drive a slot antenna.

Another embodiment is an RFID-activated electrically conductive signaling that includes (1) an electrically conductive article which in turn includes a hole and at least one of an electrically conductive substrate or electrically conductive coating and (2) an assembled device capable of being physically coupled with the electrically conductive article to provide RFID functionality to the electrically conductive article. The assembled device includes an RFID IC arrangement comprising an integrated circuit adjacent to conductive wires. The RFID IC array is commonly referred to as a strip or interposer. The IC array is connected to an insert that has a shape and size that allows the insert to fit inside the hole. When the assembled device is physically coupled with the electrically conductive article, the RFID IC array extends at least a portion of the hole and electrically couples the integrated circuit with the electrically conductive article to drive or move a slot antenna. In some implementations of this embodiment, the strip may include at least one capacitive adapter.

In some embodiments, at least one of the electrically conductive article and the assembled device includes an alignment configuration that facilitates precise alignment of the electrically conductive article and the assembled device. An example alignment configuration comprises the hole having a predetermined shape; and the shape of the insert corresponds to the predetermined shape of the hole so that the insert is placed inside the hole facilitating precise alignment of the electrically conductive article and the assembled device. Another exemplary alignment configuration comprises instructions printed on at least one of the electrically conductive article and the assembled device that facilitates precise alignment of the assembled device and the electrically conductive article.

In some embodiments, the assembled device further includes an adhesive material having an adhesive surface and a non-adhesive surface, at least a portion of the adhesive surface in direct physical contact with at least one of the RFID IC array and the insert and the remaining portion of the adhesive surface capable of connecting with the electrically conductive article. At least a portion of the adhesive is preferably conductive. The adhesive material could include a release liner that facilitates connection of the adhesive material to one or more of the RFID IC array, insert, or electrically conductive article.

Another embodiment of the present disclosure is an assembled device capable of being physically coupled with an electrically conductive article including a hole. The assembled device is capable of providing RFID functionality to the electrically conductive article, such that the article is converted to RFID-activated electrically conductive signaling. The assembled device includes (1) an RFID IC or strip arrangement that includes an integrated circuit adjacent to conductive wires; (2) an insert having a shape and size that allows it to be placed inside the hole; and (3) a connecting device and capable of connecting the RFID IC array-insert combination to the electrically conductive article such that the RFID IC array is positioned to extend at least a portion of the hole and to engage, electrically, the integrated circuit with the electrically conductive article in order to move or drive a slot antenna. An example connection device is a protective layer with an adhesive layer.

In some embodiments, at least one of the electrically conductive article or assembled device includes an alignment configuration that facilitates precise alignment of the assembled device article.

example comprises the electrically conductive and the

A hole alignment configuration having a predetermined shape; and the shape of the insert corresponds to the predetermined shape of the hole so that the insert is placed inside the hole facilitating precise alignment of the electrically conductive article and the assembled device. Another exemplary alignment configuration comprises instructions printed on at least one of the electrically conductive article and the assembled device that facilitates precise alignment of the assembled device and the electrically conductive article.

Another embodiment of the present disclosure is a kit comprising (1) an RFID IC arrangement that includes an integrated circuit adjacent conductive wires; (2) an insert capable of connecting to the RFID IC array; and (3) a connecting device capable of connecting the RFID IC array-insert combination with electrically conductive signaling such that the RFID IC array is positioned to extend at least a portion of a hole in the signaling and to engage, in electrical form, the integrated circuit with electrically conductive signaling to move or drive a slot antenna.

Another embodiment of the present disclosure is a method of forming an RFID activated electrically conductive signaling comprising: (1) providing an electrically conductive signaling including a hole and at least one of an electrically conductive substrate or an electrically conductive coating; (2) providing an assembled device that includes (a) an RFID IC array or strip that includes conductive wires adjacent to an integrated circuit; and (b) an insert having a shape and size that allows the insert to be placed inside the hole; and (3) inserting the assembled device into the electrically conductive signaling port in a position that provides RFID functionality to the electrically conductive article.

Brief Description of the Figures

Figure la is a schematic top view of one embodiment of an RFID activated traffic signaling article.

Figures Ib and Le are exploded top views of two alternative modalities of the RFID-activated traffic signaling article of Figure la.

Figure 2 is a schematic top view of an assembled device for coupling, in capacitive form, of an RFID integrated circuit with a signaling including an aperture.

Figure 3 is a schematic top view of each part of an example assembled device.

Figure 4 is a schematic top view of a sample coupled together RFID IC array-insert combination.

Figure 5 is a schematic top view of the RFID-IC array-insert combination of Figure 4 coupled with a protective layer.

Figure 6 is a schematic side view showing an example assembled device connected to a metal sign.

Figure 7 is a schematic top view showing an alternative embodiment of an insert.

Detailed description of the invention

Figure la is a schematic top view of a speed limit metal signal 10 that includes a radiofrequency response element 12. Figures Ib and are exploded views of two alternative modalities of the portion of signal 10 that includes the radio frequency response element 12. In Figure Ib, the signal 10 includes a slanted cut, hole or rectangular opening 14 having a first side 16 and a second side 18. Opening 14 is made on a larger surface of a substrate. An integrated circuit 22 (or chip) is connected with a conductive wire 24, this is commonly referred to as a strip 26 or an interposer. The integrated circuit 22 is electrically coupled with the conductive wires of the RFID strip 26. The conductive wires are in turn coupled with the electrically conductive signaling. The conductive wires could be parts of a unitary continuous layer of conductive material that forms the antenna structure or could be separate parts.

Strip 26 is connected to signal 10, so that strip 26 is located through a horizontal axis of opening 14, so that RFID integrated circuit 22 is located within or adjacent to opening 14. Strip 26 it could have electrically direct contact with conductive signaling or it could be capacitively coupled with signaling. Preferably, the conductive wires in strip 26 are flexible and could provide electrical and / or physical connection of the RFID integrated circuit to the signaling. Consequently, strip 26 electrically (and could be physically) tie the metal or conductive portion of signal 10 with RFID integrated circuit 22. Because strip 26 can be directly placed through aperture 14 and aperture 14 acts as a slot antenna, the provision of a separate antenna may not be required in some embodiments.

In some embodiments, strip 26 could also include a substrate to support the RFID integrated circuit and / or conductive wires. In another possible variation, the RFID integrated circuit and conductive wires could be supported by a separate substrate for processing purposes, and this separate substrate could remain with the integrated circuit and wires once the integrated circuit and wires are coupled with the antenna, or they could be removed. Strip 26 could include conductive wires of any shape and size, including, for example, arms of the types described, for example, in the

United States Patent No. 7,

298,330.

In the

Figure le, the conductive wires in the strip include two capacitive adapters at either terminal end of the strip 26.

Capacitive adapters provide an additional tuning element for the antenna design, which could improve the overall performance and read range of RFID activated signaling. Because there is no matching network of discrete components for the IC, the aperture antenna must be self-designed to provide conjugate match. Typically, this is accomplished by choosing the appropriate aperture size and power point (the position at which an integrated circuit is electrically coupled with the antenna). However, changing the aperture size and power point can affect both the real and imaginary parts of the impedance. Because aperture antennas designed for signaling are typically highly inductive, capacitive adapters can be used to decrease this inductance without affecting the actual part of the aperture impedance.

The preferred size of the capacitive adapters can be determined using the parallel plate approximation because the gap between the adapters and the signaling is relatively small. In this way,

C = é * A / d where έ is the dielectric permittivity, C is the capacitance of the capacitive adapter, A is the area of ​​the capacitive adapter, and d is the distance between the capacitive adapter and the signal.

In both modes shown in Figures Ib and Le, an RFID reader (not shown) induces signals through the opening that directs the strip with the RFID integrated circuit. It is important that there is no additional metal inside or covering the opening. Thus, non-metallic reflective material coating or other dielectric material coating could be used in this area, such as, for example, Diamond Grade ™ reflective coating manufactured by 3M Company of St. Paul, Minnesota. Alternately, a companion opening could be cut into the metallic reflective coating.

In some preferred implementations, strip 26 is relatively level with signal 10 (see, for example, Figure 6) so that RFID chip 22 is positioned within aperture 14. This facilitates stacking of multiple signals one at a time. on top of each other without causing injury or damage with the integrated circuit

RFID connected or associated with the signal. In some embodiments, the strip 26 has a minimum thickness, for example, a thickness of approximately 0.5 to 5 thousandths.

Those of skill in the art will appreciate that many changes can be made to the modality shown in Figures Ib and without departing from the spirit of the concept. For example, although strip 26 is shown connected to the front face of signal 10 in Figures la, Ib, and le, strip 26 can also be connected to the rear face of signal 10 (not shown) or within the signal thickness 10. Also, opening 14 need not be rectangular in shape; aperture 14 can be of any desired shape (eg, tapered grooves and annular rings) and can be placed at any desirable location on sign 10 including the use of multiple grooves or series of grooves. Additionally, the signaling could include a series of openings, which could increase the directivity of the antenna and the reading interval, as well as could modify the radiation pattern. Furthermore, signal 10 need not be a rectangular speed limit signal, although it may be of any configuration or form of signaling. Additionally, strip 26 can be configured differently (eg, wider, shorter, longer, thinner with arms as described for example in

United States Patent No. 7, 298,330) than that shown in Figures la, Ib and le.

The present application also relates to various devices, kits (once assembled), and methods that affect the convenient and / or accurate connection and alignment of an RFID IC with a signaling (including, for example, electrically conductive signaling) that it has an opening or hole of the type described, for example, in US Patent Publication No. 20080258875.

At least some preferred embodiments relate to an assembled device or kit (once assembled) that can be connected to a signaling to create an RFID activated signaling. An embodiment of this assembled device 50 is shown in Figures 2-5. Assembled device 50 includes (1) a strip 26 or interposer that includes an integrated circuit 22 or chip; (2) conductive wires 24 extending from integrated circuit 22 or chip; and (3) capacitive adapters 40. This portion of the assembled device will be referred to as IC array 52. ​​IC array 52 is mated to an insert 54 which is preferably of a shape and size that is positioned within opening 14 of signal 10. A protective layer 56 including an adhesive layer coated on a generally flat material is placed on top of the insert 54 and the IC arrangement 52, so that the adhesive layer is in physical contact with at least one insert portion 54 and / or at least a portion of the IC 52 arrangement. Some preferred example adhesives include, but are not limited to, those that can bond with metals, high and low surface energy materials, turned textures and surfaces, powder coatings and lightly oily metals and those that are resistant to harsh environments .

Protective layer 56 helps protect RFID IC from the environment and other physical stresses, which can be especially useful when signaling is outside signaling. Preferably, the length and width of the protective layer 56 is greater than the length and width of the insert 54 and the opening 14, so that the protective layer 56 could be placed directly adjacent to the signal 10, so that the adhesive layer is in direct physical contact with the surface of the signal 10. In this way, the protective layer 56 fixes the insert 54 and the IC 52 arrangement in the signal 10.

Insert 54 can be formed of any suitable material, although it is preferably a non-conductive non-interference material such as, for example, plastic. Exemplary plastics include, for example, ABS, acetal, acrylic, fluoropolymers, nylon, polycarbonate, polyester, polyetherimide, polyethylene, polypropylene, and polystyrene. Preferably, insert 54 is firm enough to resist permanent deformation when a slight compression force is applied thereto. This firmness helps maintain the shape of the RFID IC and the coating material in the signage (if it were

<td>Present).</td><td>In</td><td>some modalities</td><td>of</td><td>example,</td><td>the</td><td>insert</td><td> 54</td>

<td>is formed</td><td>of</td><td>material you have</td><td>a</td><td>firmness</td><td>to the</td><td>less than</td><td> 5</td>

<td colspan="3">PSI where firmness is measured</td><td>by</td><td>the force</td><td>of</td><td colspan="2">compression</td>

(% deformation), which is the amount of pressure required to compress the foam to a given percentage of its thickness (when the value of psi is higher, the firmness is higher).

An alternative insert is shown in Figure 7 and includes a PC single sided copper clad card as the insert. Common PC card materials include, for example, FR4 or Rogers hardness substrates. The process of developing this modality could include the following steps: (1) purchasing a PC single-sided copper cladding card; (2) chemically etching or coating one or more traces 82 on the insert / PC card in order to create the interconnect (etching or grinding involves removal of at least some amount of the copper); (3) cut the insert / PC card to the desired shape and size; and (4) connect the chip integrated circuit with them. Optionally, copper tabs, wire ties, or the like can be used to create capacitive adapters 40. Those of skill in the art will appreciate that this alternative embodiment, or components or methods thereof, can be used in connection with the modalities discussed above.

In some implementations, the protective layer 56 could also include identifying information. For example, a barcode could be printed on the adhesive material, as shown in Figure 6. This identifying information could be printed, for example, by thermal printing, ink jet printing, flexo printing, hot stamping. , letterpress printing, thermal transfer printing and screen printing. Where inkjet printing methods are used, resin slats may be preferred for optimum durability.

Preferably, the RFID IC array and insert are located within aperture 14 so that RFID IC 22 does not extend appreciably above any of the larger area of ​​signaling 10, as shown. in Figure 6.

Aperture antennas designed for use with electrically conductive signaling are often highly tuned to ensure optimum performance, so changing the power point (s) will affect both the actual and imaginary parts of the impedance. Consequently, it is important to ensure that the feeding points are located, correctly or precisely. Because the assembly described above has three separate parts that are coupled together (the IC arrangement, the insert and the protective layer), and because each of these three parts has a support in the correct positioning of the integrated circuit, Two positioning processes are important when using the assembly described above: (1) positioning the IC array on / adjacent to the insert; and (2) position the insert in / on the opening.

Considering the step of positioning the IC array on / adjacent to the insert, some preferred implementations could include a strip placement configuration that aids in the precise alignment of the IC array on the insert. An example strip placement configuration 70 (shown in Figure 3) is a mark on insert 54 denoting the preferred placement of IC array 52. In this implementation, IC array 52 can be aligned with insert 54 by aligning strip 26 with a mark on insert 54 (Figure 4), and then placing the IC array / insert combination adjacent to the protective layer. tora or label material (Figure 5) to form an assembled device that has the necessary impedance match with the integrated circuit. The IC array, insert, and connecting device (eg, a protective layer that includes an adhesive material) can be manufactured in a roll-to-roll process and can be sold as an assembled device. The assembled devices described herein could be connected or attached with electrically conductive signaling when the signaling is manufactured / assembled or could be applied at a later point in the life of the signaling.

As shown and described in detail in United States Patent Publication No. 20080258875, strip 26 includes a first major side, a second major side, a first minor side, and a second minor side. When strip 26 is located adjacent to marking 10, the first minor side of strip 26 is located adjacent to the upper major surface of opening 14, and the second minor side of strip 26 is situated adjacent to the lower major surface opening 14. Accordingly, strip 26 is connected to signaling 10, so that strip 26 is located across the horizontal axis of opening 14 and so that RFID integrated circuit 22 is located within or adjacent to opening 14. The Strip 26 could have electrically direct contact with conductive signaling, or could be capacitively coupled with signaling. Preferably, strip 26 is a flexible substrate that provides electrical (and possibly physical) connection of the RFID integrated circuit to signaling. Consequently, the strip 26 electrically (and could be physically) couples the metal of the signal 10 with the RFID integrated circuit 22. Because strip 26 can be directly placed through aperture 14, since aperture 14 acts as a slot antenna, a separate antenna might not be required in some embodiments. Any suitable commercially available RFID integrated circuit could be used in connection with the modalities of the present application. The integrated circuit can be purchased pre-packaged or manufactured. Commercially available example integrated circuits include those sold by NXP of the Netherlands.

Regarding the insert positioning step in / on the aperture, some preferred implementations include an alignment setup that assists the user in insert alignment and aperture to ensure that the RFID IC insert / array combination is installed in the correct location and make the necessary electrical contact with the signaling. An example alignment configuration is an identification instruction or configuration (for example, text or symbols that guide the user to correctly align parts) formed on one of the insert or marking that favors the correct alignment of the arrangement combination / insert IC inside the opening. For example, the insert could have an arrow printed on it that directs the user how to properly fit the parts together and thus ensure correct orientation during installation.

Another example alignment configuration is the formation of an insert having a predetermined shape and size that is placed in a specifically configured and dimensioned opening to ensure parts are correctly oriented. A unique example form is shown, for example, in Figures 3-5 in which insert 54 has an 8 0 notch at one of its terminal ends. The opening in which this insert would be placed would have a corresponding shape that could facilitate the insertion and correct alignment of the insert within the opening. Some preferred alignment configurations allow the insert to be physically coupled to the aperture in only one mode.

Signaling 10 could include as its substrate an electrically conductive material or a non-conductive material. Exemplary electrically conductive materials include, for example, a metal plate, such as, for example, an aluminum plate. Example non-conductive materials include, for example, wood or

<td>plastic.</td><td>Wherein the signaling substrate comprises a</td>

<td>material</td><td>non-conductive, the electrical conductivity of</td>

<td>Article</td><td>Complete RFID activated signaling</td>

Electrically conductive could, for example, come from an electrically conductive coating placed on at least a portion of the signaling article, such as, for example, a retroreflective metallic coating. For purposes of this application, coating with a metal vapor coating (eg, aluminum) is considered conductive, although the level of conductivity may be minimal. Exemplary metallized coatings include, for example, the following commercially available products, the 3290T series of coating products; the CW80 series of coating products; a high intensity bead liner, such as, for example, the 3870 series of liner products; a high intensity flexible coating, such as, for example, the 3810 series, the 3840 series, and the 31x barricade coating products; and the driving license plate or validation, all of which are sold by 3M Company of St. Paul, Minnesota. Additionally, any type of prismatic coating products that include a vapor coating could be considered a conductive coating, such as, for example, the 985 Conspicuity coating sold by the 3M Company. Exemplary non-conductive coating products include, but are not limited to, prismatic coating products that are not steam coated such as, for example, the HIP ™ 3930 series, the DG series³™ 4000, VIP ™ 3900 series, 983 conspicuity series, 3910 CWZ ™ prismatic series, and RS20 and RS30 series coiled signs, all sold by 3M Company.

Those of skill in the art will appreciate that the use of the protective layer 56 is simply an exemplary method of connecting the RFID array and / or insert with a signaling.

The assembled devices described above can be sold preassembled or as separate parts (in a kit) that are assembled by the user. In the latter implementation, the kit could include instructions as to the preferred ways of assembling the separate parts to form the assembled device.

Another embodiment of the present disclosure is a method of forming an RFID-activated electrically conductive signaling. An example method includes the following steps. The first stage involves supplying an electrically conductive signaling that includes a hole. The signaling can be electrically conductive due to one or more of the presence of an electrically conductive substrate or electrically conductive coating. The second stage involves supplying an assembled device that includes (a) an RFID IC array or strip that includes conductive wires adjacent to or coupled to an integrated circuit; and (b) an insert having a shape and size that allows the insert to be placed within the hole in electrically conductive signaling. The assembled device or kit (when assembled) can be of any of the types described in the numerous modalities and implementations above. The third stage involves inserting the assembled device into the electrically conductive signaling port in a position that provides RFID functionality to the electrically conductive article. Additional optional steps include the use of an RFID reader that reads the information contained in the RFID integrated circuit; installing the RFID activated signal at the desired location; and replacing the assembled device by removing the assembled device from the signage and installing a new assembled device. Instructions could be provided as preferred ways of attaching the assembled device to electrically conductive signaling.

The methods, devices, and kits of the present application have numerous advantages and benefits: (1) the devices described herein protect the circuit

<img file="MX2011007264A_D0001.tif" />

Integrated RFID environment; (2) the devices and kits allow for easy removal and replacement of the RFID integrated circuit without requiring signal removal; and (3) the alignment and marking configurations provide a means to align the RFID integrated circuit power points in the right place, even when performed by workers with little knowledge or experience in the area of ​​technology.

The objectives and advantages of the present application are further illustrated through the following examples, although the particular materials and quantities thereof indicated in the examples, as well as other conditions and details, are not to be construed as unduly limiting the invention, since those skilled in the art will recognize that other parameters, materials and equipment could be used.

EXAMPLE 1

An assembled device was formed as follows.

A layer of the front side printing last hand (Material of

Polyester Label # 7868 3M, sold by 3M

Company of

St. Paul, Minnesota, which is a glossy white polyester print front face label material) was obtained. Next, a barcode was printed on the printing front face using an ink jet printer. A layer of adhesive (# 350 acrylic adhesive manufactured by 3M Company; 29 microns thick) was applied to the front face of the print. Using the copper tape (EMI 1181 Copper Clad Tape available from 3M Company), capacitive adapters measuring 12.7mm by 12.7mm with a 3mm by 3mm extension along one side were formed. The capacitive adapters were connected to a NXP Model G2XM IC available from NXP, Eindhoven, The Netherlands by soldering tin and lead of the 3mm by 3mm extension on each capacitive adapter with the 3mm by 3mm mating adapter at each end of the NXP IC strip. The NXP IC with coupled capacitive adapters was then positioned across the width of the insert in a position (a position that in the construction of the assembled device could coincide with the determined position of the power point of a specific type of signal in which the assembled device could be placed). The print front face with the adhesive layer facing down was centered on the insert with the NXP IC positioned, causing the insert and the NXP IC to adhere to the adhesive layer of the print face layer.

The bottom (exposed) sides of the capacitive adapters were coated with a non-conductive adhesive (3M Transfer Tape # 467-MP, manufactured by the 3M Company) to provide both separation and adhesion between the capacitive adapters and the signal to create the capacitive coupling between the two. This adhesive layer connects the RFID strip to the signal.

Those skilled in the art will appreciate that many changes could be made in the details of the modalities described above without departing from the underlying principles thereof. Therefore, the scope of the present application is to be determined only by the following claims.

It is noted that in relation to this date, the best method known by the applicant to put the aforementioned invention into practice is the one that is clear from the present description of the invention.