Devices including near field transducer and adhesion layer

DEVICES INCLUDING NEAR FIELD TRANSDUCER AND ADHESION LAYER

Heated magnetic recording (herein referred to as "HAMR") technology, 1 Tbit/inch²It is a promising way to increase the storage density beyond. HAMR heads may use near field transducers (NFTs) to heat the magnetic recording layers. Poor adhesion between the surrounding structures in the HAMR head and the materials of the NFT can lead to failure during processing or use. Therefore, there is a continuing need to reduce such failures.

near field transducer (NFT); write poles; at least one dielectric material positioned between the NFT and the write pole; and an adhesive layer positioned between the NFT and the at least one dielectric material.

In addition, energy sources; an NFT configured to receive energy from an energy source; fill pole; at least one dielectric material positioned between the NFT and the write pole; and an adhesive layer positioned between the NFT and the at least one dielectric material.

In addition, energy sources; a waveguide configured to receive energy from the energy source and couple it to the NFT; an NFT configured to receive energy from the waveguide; fill pole; at least one dielectric material positioned between the NFT and the write pole; and an adhesive layer positioned between the NFT and the at least one dielectric material.

1 is a perspective view of a magnetic disk drive that may include HAMR devices. 2 is a cross-sectional view of a vertical HAMR magnetic recording head and associated recording medium. 3A, 3B, and 3C are views of at least a portion of a magnetic device including a disclosed top adhesive layer, and FIG. 3A is a drawing from ABS; 3B is a side view; and Fig. 3c is a perspective view. 4A, 4B, and 4C are views of at least a portion of a magnetic device including at least a portion of the disclosed top and bottom adhesive layers, and FIG. 4A is a drawing from ABS; 4B is a side view; and Fig. 4c is a perspective view. 5A, 5B, and 5C are diagrams of at least a portion of a magnetic device comprising a top, bottom and side adhesive layer as disclosed; FIG. 5A is a drawing from ABS; 5B is a side view; and Figure 5c is a perspective view. 6A, 6B, and 6C are diagrams of at least a portion of a magnetic device including a disclosed top and side adhesive layer, FIG. 6A is a drawing from ABS; 6B is a side view; and Fig. 6c is a perspective view. 7A, 7B, and 7C are diagrams of at least a portion of a magnetic device including a bottom and side adhesive layer as disclosed; FIG. 7A is a drawing from ABS; 7B is a side view; and Figure 7c is a perspective view. 8 depicts a side view of an exemplary stack used to practice the disclosed examples. The drawings are not necessarily to scale. Like numbers used in the drawings refer to like components. It will be understood, however, that the use of numbers to refer to components in a presented figure is not intended to limit the components in other figures labeled with the same number.

DETAILED DESCRIPTION In the following description, reference is made to a set of accompanying drawings that form a part hereof and are shown by way of example of several specific embodiments. It will be understood that other embodiments may be contemplated or constructed without departing from the scope or spirit of the present disclosure. Accordingly, the following detailed description is not to be taken in a limiting sense.

Unless otherwise indicated, all numbers expressing feature sizes, quantities, and physical properties used in the specification and claims are to be understood as being modified in all instances by the term "about." Accordingly, unless otherwise indicated, the numerical parameters set forth in the foregoing specification and appended claims are approximations that may vary according to the characteristics sought by those skilled in the art using the teachings disclosed herein.

Recitation of numerical ranges by endpoints includes all numbers subsumed within that range (eg, 1 to 5 inclusive of 1, 1.5, 2, 2.75, 3, 3.80, 4, and 5) and Any range within that range is included.

As used in this specification and the appended claims, the singular forms encompass embodiments having plural referents, unless the context clearly dictates otherwise. As used in this specification and the appended claims, the term "or" is generally employed in its meaning to include "and/or" unless the context clearly dictates otherwise.

Terms such as "include", "including" and the like mean, but are not limited to, encompassing, i.e., including but not exclusive. "top" and "bottom" (or other terms such as "above" and "below") are used strictly for relative descriptions and any overall orientation of the article in which the described element is located It should be noted that this does not mean that

1 is a perspective view of a disk drive 10 including an actuation system for positioning a slider 12 over a track 14 of a magnetic medium 16 . The specific configuration of the disk drive 10 is shown for ease of description and is not intended to limit the scope of the present disclosure in any way. The disk drive 10 includes a voice coil motor 18 arranged to rotate an actuator arm 20 on a spindle about an axis 22 . A load beam 24 is connected to the actuator arm 20 at the head mounting block 26 . Suspension 28 is connected to the end of load beam 24 and slider 12 is attached to suspension 28 . The magnetic medium 16 rotates around the axis 30 so that the windage meets the slider 12 and aloft remains a small distance on the surface of the magnetic medium 16 . Each track 14 of the magnetic medium 16 is formatted into an array of data storage cells for storing data. The slider 12 holds a magnetic device or transducer (not shown in FIG. 1 ) for reading and/or writing data on the tracks 14 of the magnetic medium 16 . The magnetic transducer uses additional electromagnetic energy to heat the surface of the medium 16 to facilitate writing by a process called heated magnetic recording (HAMR).

The HAMR transducer includes a magnetic writer for generating a magnetic field for writing to a magnetic medium (eg, magnetic medium 16 ) and an optical device for heating a portion of the magnetic medium near the write field. (optical device). 2 is a cross-sectional view of a portion of a magnetic device, eg, a HAMR magnetic device 40 and an associated magnetic storage medium 42 . The HAMR magnetic device 40 includes a write pole 44 and a return pole 46 coupled by a pedestal 48 . A coil 50 comprising conductors 52 , 54 surrounds the pedestal and is supported by an insulator 56 . As shown, magnetic storage medium 42 is a vertical magnetic medium comprising a magnetic hard storage layer 62 and a lower soft magnetic underlayer 64, but other types of media, such as It may be a patterned medium. The current in the coil induces a magnetic field in the pedestal and poles. The magnetic flux 58 leaves the writing head at the air bearing surface (ABS) 60 , and magnetizes portions of the magnetic hard layer 62 of the storage medium 42 enclosed within the region 58 . is used to change The near field transducer 66 is positioned adjacent the write pole 44 near the air bearing surface 60 . The near field transducer 66 is coupled to a waveguide 68 that receives electromagnetic waves from an energy source, such as a laser. The electric field at the end of the near field transducer 66 heats a portion 69 of the magnetic hard layer 62 such that the magnetic field from the write pole can affect the magnetization of the storage medium, resulting in coercivity. used to further lower

The magnetic devices disclosed herein may also include other structures. The magnetic devices disclosed herein may also be incorporated into larger devices. For example, sliders as disclosed herein may include magnetic devices. Exemplary sliders may include a slider body having a leading edge, a trailing edge, and an air bearing surface. The write pole, read pole, optical near field transducer and contact pad (and optional heat sink) may then be positioned on (or within) the slider body. These exemplary sliders may be attached to a suspension that may be integrated into a disk drive, for example.

3A shows a simplified air bearing surface (ABS) diagram of a portion of a magnetic device. The magnetic device 300 may include a write pole 305 (which may have features as discussed above) and a near field transducer (NFT) 310 . Write pole 305 and NFT 310 are generally surrounded by dielectric material 316 . In some embodiments, the layer between the write pole 305 and the NFT 310 may be referred to as an NFT to pole spacing (NPS) layer, and the layer between the NFT and the core (not shown in FIG. 3A ) is the CNS ( It may be referred to as a core to NFT spacing) layer. Dielectric material 316 may also be described as cladding materials or cladding layers. The materials of the NPS layer and the CNS layer need not be the same and may be, for example, oxides.

Although the NFT 310 shown in FIG. 3 may be described as having a two-part structure, the described embodiments may include NFTs of any type or structure (eg, plasmonic gap type NFTs; or peg and disk type NFTs, which may also be referred to as "lollipop" type NFTs. Typically, NFT 310 is, for example, gold (Au), gold (Au) doped with another material (eg, AuGe), silver (Ag), silver (Ag) doped with another material ( For example, it may be made of materials such as AgGe), copper (Cu), and aluminum (Al). In some embodiments, NFT 310 is also disclosed in U.S. Patent Publication No. 2011/0205863, filed February 23, 2011, entitled "HAMR NFT Materials with Improved Thermal Stability, the disclosure of which is incorporated herein by reference. incorporated). 3a and 3b; 4a and 4b; 5a and 5b; 6a and 6b; and the NFT shown in 7a and 7b is a simplified illustration and includes lollipop type (also called peg and disk type) NFT structures; and gap type NFT structures.

In some embodiments, the magnetic device 300 may also include a top adhesive layer 340 . The top adhesive layer 340 may also be described as a seed layer. As such, the top adhesive layer 340 can advantageously enhance the structural integrity of the NFT 310 to dielectric 316 interface by increasing the adhesion of one material to another. The material of the top adhesive layer 340 should also be aware of the plasmonic properties and requirements of the NFT 310 . 3B shows a side view containing and displaying essentially the same components, showing the top adhesive layer 340 between the NFT 310 and the dielectric material 316 .

FIG. 3C shows a partial perspective view of a portion of the magnetic device that more specifically shows more components of the example magnetic device 300 . This figure depicts the dielectric material 316 shown in FIGS. 3A and 3B . As such, this exemplary magnetic device 300 includes a front cladding 315 , 320 , a bottom cladding 325 , and a top cladding 330 . Generally, in the described embodiment, the NFT 310 is completely surrounded by cladding materials, which is shown in the previous figures as dielectric material 316 . At least one cladding layer (and in this embodiment, front cladding 315, 320, bottom cladding 325, and top cladding 330) generally comprises a dielectric material having a low refractive index (relative to the material of the NFT). can be formed with Exemplary materials are<img file="KR101738552B1_D0001.tif" /> and <img file="KR101738552B1_D0002.tif" />may include. Materials disclosed in U.S. Patent Publication No. 2011/0205864, filed on February 23, 2011, entitled "Optical Waveguide Clad Material," the disclosure of which is incorporated herein by reference to the extent not contradictory, also includes: cladding 315 , 320 , floor cladding 325 , and top cladding 330 , or some combination thereof. In embodiments, the cladding layers are, for example,<img file="KR101738552B1_D0003.tif" /> or <img file="KR101738552B1_D0004.tif" />is made with

It can often be difficult to adhere the NFT 310 well to the surrounding cladding layers. If the NFT 310 does not have good adhesion to the material surrounding it, the magnetic device may fail during processing or operation of the magnetic device. Accordingly, the disclosed magnetic devices include a top adhesive layer 340 . It should be noted that the top adhesive layer 340 may, but need not, be a single layer. The phrase "top adhesion layer" may be used in this exemplary embodiment to refer to more than one structure or layer positioned between the NFT and the top cladding layer. The disclosed top adhesive layer may generally be positioned between an adjacent surrounding cladding layer and the surface of the NFT.

4A, 4B, and 4C show another exemplary embodiment of the disclosed magnetic device. The magnetic device includes adhesive layers on at least some of the facing surfaces of the NFT, ie, top and bottom. This exemplary magnetic device is more specifically a write pole 405 , an NFT 410 , a dielectric material 416 (front cladding 415 , 420 in FIG. 4C , a bottom cladding 425 , and a top cladding 430 ). shown), a top adhesive layer 440 and a bottom adhesive layer 450 . The bottom adhesive layer 450 may be made of the same or similar materials as the top adhesive layer, and may have the same or similar characteristics (eg, thickness, discontinuities, etc.). However, the bottom adhesive layer 450 need not be the same material and/or have the same characteristics as the top adhesive layer 440 .

5A, 5B, and 5C show another exemplary embodiment of the disclosed magnetic device. This magnetic device includes adhesive layers on or around all surfaces of the NFT, namely the top, and bottom and sides. Here, it should be noted that the bottom surfaces of the NFT may, in some embodiments, include sides indicated by side adhesion layers 560 . Since the NFT material may be deposited in the trench (lined first with the adhesive layer material in these embodiments), the sides may be considered as part of the floor. This exemplary magnetic device is more specifically as a write pole 505 , an NFT 510 , a dielectric material 516 (front cladding 515 , 520 in FIG. 5C , a bottom cladding 525 , and a top cladding 530 ). shown), a top adhesive layer 540 , a bottom adhesive layer 550 , and a side adhesive layer 560 . The bottom adhesive layer 550 may be made of the same or similar materials as the top adhesive layer 540 , and/or the side adhesive layer 560 and have the same or similar characteristics (eg, thickness, discontinuities, etc.) ) can have However, the bottom adhesive layer 550 need not be of the same material and/or have the same characteristics as the top adhesive layer 540 and/or the side adhesive layer 560 . It should be noted that although the top adhesive layer 540 , the bottom adhesive layer 550 and the side adhesive layer 560 are all shown as a single material, this need not be the case and in fact the various elements need not be in contact with each other at all.

6A, 6B, and 6C show another exemplary embodiment of the disclosed magnetic device. The magnetic device includes adhesive layers on or near the top and sides of the NFT. It should be noted here that the sides may be considered as part of the floor, as the NFT material may be deposited into the trench (lined first with an adhesive layer material in these embodiments). In such an embodiment, only the sides of the gaps (eg in the case of a gap type NFT) will have an adhesive layer material deposited thereon. This exemplary magnetic device is more specifically a write pole 605 , an NFT 610 , a dielectric material 616 (in FIG. 6C , a front cladding 615 and 620 , a bottom cladding 625 , and a top cladding 630 ). shown), a top adhesive layer 640 and a side adhesive layer 660 . The top adhesive layer 640 may be made of the same or similar materials as the side adhesive layer 660 and may have the same or similar characteristics (eg, thickness, discontinuities, etc.). However, the top adhesive layer 640 need not be of the same material and/or have the same characteristics as the side adhesive layer 660 . It should be noted that while both the top adhesive layer 640 and the side adhesive layer 660 are shown as a single material, this need not be the case and in fact the various elements need not be in contact with each other at all.

7A, 7B, and 7C show another exemplary embodiment of the disclosed magnetic device. The magnetic device includes adhesive layers at or near the bottom and sides of the NFT. It should be noted herein that the sides may be considered as part of the floor, as the NFT material may be deposited in the trench (in these embodiments, first lined with an adhesive layer material). In this embodiment, both the sides of the gaps and the bottom of the gaps (eg, in the case of a gap type NFT) will have an adhesive layer material deposited thereon. This exemplary magnetic device is more specifically described as a write pole 705 , an NFT 710 , a dielectric material 716 (in FIG. 7C , a front cladding 715 and 720 , a bottom cladding 725 , and a top cladding 730 ). ), a bottom adhesive layer 750 and a side adhesive layer 760 . The bottom adhesive layer 750 may be made of the same or similar materials as the side adhesive layer 760 and may have the same or similar characteristics (eg, thickness, discontinuities, etc.). However, the bottom adhesive layer 750 need not be of the same material and/or have the same characteristics as the side adhesive layer 760 . It should be noted that although the bottom adhesive layer 750 and the side adhesive layer 760 are both shown as a single material, this need not be the case and in fact the various elements need not be in contact with each other at all.

Any of the adhesive layers (top, bottom, side or combinations thereof) are independently selected from 2.5 Å to 50 Å; 5 Å to 30 Å; Alternatively, it may have a thickness of 5 Å to 20 Å. Any of the adhesive layers (top, bottom, side or combinations thereof) can also be independently described as discontinuous or continuous. The disclosed discontinuous adhesive layers may be described as being composed of multiple "islands" of metallic material. However, the islands may, but need not, have disparate sizes and shapes. Although it need not be, the islands can be virtually entirely irregular. The disclosed discontinuous adhesive layers may be described as being less than a monolayer thickness, or may have an average thickness that is less than a monolayer thickness. It will be understood that the material of the disclosed discontinuous adhesive layers may not be present over the entire surface of the structure, but may be on top of the structure. The disclosed continuous adhesive layers may include a material that diffuses over the entire area of the layer. The disclosed continuous adhesive layers may be described as being at least a monolayer thickness or greater, or may have an average thickness that is at least a monolayer thickness. Both the disclosed discontinuous and continuous adhesive layers can be described as average thickness.

The average thickness of the adhesive layer can be measured, for example, by transmission electron microscopy (TEM) or X-ray reflectivity (XRR), or x-ray photoelectron spectroscopy (XPS). The thickness can be determined using calibration from standard samples with known thicknesses.

The disclosed adhesive layers are generally capable of providing enhanced chemical bonding to adjacent layers (eg, cladding layer and NTF material); with limited interface interactions or no interface interactions; with acceptable levels of NFT coupling efficiency loss; or materials having some combination thereof.

In some embodiments, materials capable of providing enhanced chemical bonding to the cladding layer are materials having an at least partially filled conduction band or, in some embodiments, an empty conduction band. can be explained. An empty conduction band can make it easier for the material to accept additional electrons and form chemical bonds with oxygen (from the cladding material). Materials are also early 3d transition metals with large populations of unfilled states at the Fermi level, and electrons from the cladding material (e.g. For example, oxide anions (oxygen atoms) can be described as those that can participate in donor-acceptor type bonding (which can transfer to the unfilled 3d states of the discontinuous metal layer). . Materials that can provide enhanced chemical bonding to the cladding layer can also be described as materials that have a greater negative heat for the formation of their oxides. These materials will have a better chance of bonding well with oxide substrates, as this bonding may be thermodynamically favored. These materials are, for example, zirconium (Zr), titanium (Ti), yttrium (Y), scandium (Sc), aluminum (Al), ruthenium (Ru), vanadium (V), silicon (Si), germanium ( Ge), tantalum (Ta), and tin (Sn). In some embodiments, the top adhesive layers, the side adhesive layers, or both, are independently made of Zr, Ti, Y, Sc, Al, Ru, V, Si, Ge, Ta, Sn, or combinations thereof. can get In some embodiments, the top adhesive layers, the side adhesive layers, the bottom adhesive layers, or any combination thereof are, independently, Zr, Ti, Y, Sc, Al, Ru, V, Si, Ge, Ta, Sn, or a combination thereof.

In some embodiments, the disclosed adhesive layers include cobalt (Co), nickel (Ni), chromium (Cr), tungsten (W), titanium tungsten (TiW), molybdenum (Mo), magnesium (Mg), niobium (Nb). ), hafnium (Hf), zinc (Zn), or some combination thereof. In some embodiments, the top adhesive layers, the side adhesive layers, the bottom adhesive layers, or any combination thereof are independently Co, Ni, Cr, W, TiW, Mo, Mg, Nb, Hf, Zn, or any combination thereof. can be made in combination. In some embodiments, the relatively bad optical properties of Co, Ni, Cr, W, TiW, Mo, Mg, Nb, Hf, Zn, or combinations thereof, are such that the thickness of these adhesive layers is relatively low. ), for example not exceeding 25 Å, or not exceeding 10 Å.

In some embodiments, the disclosed adhesive layers may be made of a nitride such as, for example, titanium nitride (TiN), zirconium nitride (ZrN), tantalum nitride (TaN), hafnium nitride (HfN), or some combination thereof. have. In some embodiments, the top adhesive layers, side adhesive layers, bottom adhesive layers, or any combination thereof may be independently made of TiN, ZrN, TaN, HfN, or a combination thereof. In some embodiments, TiN, ZrN, TaN, HfN or combinations thereof may be weakly plasmonic and thus confer a relatively lower optical penalty, which means that the thickness of these adhesive layers is may be slightly thicker (eg not more than 50 Angstroms or not more than 20 Angstroms).

In some embodiments, the disclosed adhesive layers are made of oxides, such as transparent oxides, such as, for example, indium oxide (In₂0₃), tin oxide (Sn0₂), In₂0₃-Sn0₂ solid solution of (ITO), zinc oxide (ZnO), aluminum (Al) doped ZnO, gallium (Ga) doped ZnO, or some combination thereof. In some embodiments, the top adhesive layers, the side adhesive layers, the bottom adhesive layers, or any combination thereof are independently, In₂0₃, Sn0₂, ITO, ZnO, Al doped ZnO, Ga doped ZnO, or combinations thereof. In some embodiments,₂0₃, Sn0₂, ITO, ZnO, Al doped ZnO, Ga doped ZnO, or combinations thereof can be weakly plasmonic and thus confer a relatively lower optical penalty, which means that the thickness of these adhesive layers is slightly higher can be thick (eg, not more than 50 Angstroms or not more than 20 Angstroms).

In some embodiments, the disclosed adhesive layers contain sulfides, such as, for example, Zr, Zn, Ti, Co, silver (Ag), copper (Cu), indium (In), cadmium (Cd), Sn, bismuth. sulfides of (Bi), lead (Pb), selenium (Se), iron (Fe), and Mo; or their binary sulfides. In some embodiments, the top adhesive layers, the side adhesive layers, the bottom adhesive layers, or any combination thereof are, independently, Zr, Zn, Ti, Co, Ag, Cu, In, Cd, Sn, Bi, Pb, sulfides of Se, Fe, or Mo; or their binary sulfides.

In some embodiments, the disclosed adhesive layers may also be made of, for example, silicon carbide (SiC), hydrogenated silicon carbide (SiC:H), or combinations thereof.

Materials with limited or no interface interactions generally include materials with or without minimal diffusion into the NFT and/or cladding materials. These materials also generally do not have intermetallic formations. Preferably the material will retain these properties up to temperatures of about 400°C. This may allow (or secure) good thermal stability and minimal relief to the optical properties of the NFT material.

Materials that provide acceptable levels of NFT coupling efficiency losses are also desired. Such materials may generally have relatively high refractive indices. At the interface of the NFT material and the cladding material layer, the presence of a non-plasmonic material layer, for example the adhesive layer disclosed in some embodiments, will "dampen" the interface's ability to support surface plasmons. , which can lead to weaker electric field emission from the NFT.

Also disclosed herein are devices comprising a near field transducer and a write pole (eg, 310 and 305 in FIG. 3A ). These exemplary devices may also include an NFT to pole spacer or spacing (NPS) layer, a core to NFT spacer or spacing (CNS) layer, or both (oxide doped with a dopant, e.g., SiO2).₂made with) may be included. Exemplary dopants may include, for example, Ta, Ti, Nb, Hf, or combinations thereof. These layers of NPS, CNS, or both will provide good adhesion to the NFT material, but still provide acceptable or even good optical properties. A desired refractive index (eg, n &lt; 1.6) can be used to control the doping level in the material.

Methods of making devices comprising the disclosed adhesive layers vary depending on the location of the adhesive layer (ie, bottom, side, top). In embodiments where a bottom and/or side adhesive layer is used, a bottom and/or side adhesive layer is deposited, followed by an NFT material deposited, followed by a cladding or dielectric material. The bottom and/or side adhesive layers are then formed of an NFT material and an underlying dielectric material (eg, a bottom cladding layer and a front cladding layer, with reference to FIG. 3 , a bottom cladding layer 325 and a front cladding layer 315 and 320))) affects the adhesion between In embodiments where a top adhesive layer is used, the top adhesive layer material is deposited onto the NFT material, for example after being deposited in the trench (lined or not lined with the disclosed adhesive layer material). The top adhesive layer then affects the adhesion between the NFT material and the overlying dielectric material (eg top cladding layer, eg top cladding layer 330 with reference to FIG. 3 ).

An exemplary method of forming the disclosed adhesive layers may include magnetron sputtering using an ultralow deposition rate. In some embodiments, the process targets a thickness that is less than the thickness of the metal monolayer and a discontinuous layer is formed.

One exemplary method of forming the disclosed adhesive layers is in-situ deposition, wherein the adhesive layer and the NFT layer, or the adhesive layer and the top oxide layer, are deposited without vacuum breakage. This method prevents oxidation of the adhesive layer, which can impair the adhesive properties of the adhesive layer.

Another exemplary method of forming the disclosed adhesion layers may include low-energy processes such as chemical vapor deposition (CVD) or atomic layer deposition (ALD). When using these techniques, the high metal surface free energy relative to the material of the cladding layer and the absence of adatom mobility cause a more or less (or in embodiments, very) regular distribution of small diameter islands to be grown. can do it This promotes topographical interlocking at the NFT/cladding layer interface. The island-like film structure also promotes "activated dewetting" of the material (here, ambient metal deposition) followed by rapid segregation of the film into islands. thermal annealing).

Another exemplary method of forming the disclosed adhesive layers may include the deposition of a protective layer of an oxide layer different from the desired oxide as the NPS after the adhesive layer(s) are formed. This may cause the vacuum to break prior to deposition of the dielectric material layer.

Adhesive layers are thought to provide enhanced chemical bonding, nanoscale topography, limited interface interactions (diffusion, intermetallic formation), or some combination thereof, to improve adhesion between the NFT and the at least one cladding layer. do. Because of the discontinuous nature of some embodiments of the adhesive layer, and/or the small thickness of the continuous layer in other embodiments of the adhesive layer, the material of the adhesive layer only accounts for a small fraction of the active plasmonic interface of the NFT. occupy This allows the adhesion to be enhanced without adversely affecting the optical properties of the NFT.

The processes for forming the adhesive layer can be easily integrated into the overall manufacturing process of the magnetic device. Overall, the use of the disclosed adhesive layers can reduce or eliminate yield loss due to delamination of the NFT and contribute to increased NFT lifetime during operation of the magnetic device, with very little impact on current formation processes for the magnetic device. can

examples

Although the present disclosure is not so limited, an appreciation of various aspects of the present disclosure will be gained through a discussion of the examples provided below.

<b>Ex</b><b>-</b><b>situ</b><b> Adhesion in the process (</b><b>Adhesion</b><b></b><b>in</b><b></b><b>Ex</b><b>-</b><b>Situ</b><b></b><b>Processes</b><b>)</b>

The layer structure shown in Fig. 8 was fabricated. The bottom oxide layer represents the CNS layer (ie, the core to NFT space layer) in the disclosed devices and was 50 nm TaSiOx. The bottom adhesive layer is represented by the first Zr layer. The 25 nm gold layer represents the NFT layer in the disclosed devices. In some of the embodiments, the top adhesive layer is a second Zr layer. The Zr layer was formed ex-situ. The top oxide layer, which represents the NFT to pole space (NPS) layer of the disclosed devices, is itself physically vapor deposited (PVD) SiO₂floor; 5nm SiO in PVD flash₂ and 25 nm tetra-ethyl-ortho-silicate (TEOS) SiO₂; And a three-layer structure of 30 nm TaSiOx is included.

A sheet film tape test was performed on the structures to determine whether the structures had delaminated. Sheet film testing is performed by depositing a film on a wafer, then applying tape (sticky at the bottom) onto the film and pulling it off. Strongly adhered films will remain bonded to the substrate and the tape will pull off without peeling. Films that adhere poorly will pull off the film with the tape.

Table 1 shows the various stacks that were tested and the results obtained. All stacks tested in Table 1 included a bottom adhesive layer of 5 Å Zr. All stacks were subjected to rapid thermal annealing (RTA) at 350° C. for 15 minutes. All stacks appear visually good before the tape test is performed.

<tables num="1"><table><tgroup cols="4"><colspec align="center" colname="col1" colnum="1" colwidth="847" /><colspec align="center" colname="col2" colnum="2" colwidth="2122" /><colspec align="center" colname="col3" colnum="3" colwidth="2197" /><colspec align="center" colname="col4" colnum="4" colwidth="6522" /><tbody><row><entry align="center" colname="col1">No.</entry><entry align="center" colname="col2">Zr top adhesive layer thickness (Å)</entry><entry align="center" colname="col3">NPS type</entry><entry align="center" colname="col4">tape test</entry></row><row><entry align="center" colname="col1">1</entry><entry align="center" colname="col2">0</entry><entry align="center" colname="col3">TEOS-SiO₂</entry><entry align="center" colname="col4">SiO₂ Membrane pulled off easily with tape</entry></row><row><entry align="center" colname="col1">2</entry><entry align="center" colname="col2">5</entry><entry align="center" colname="col3">TEOS-SiO₂</entry><entry align="center" colname="col4">SiO₂can be pulled off with tape on some locations - minimal peel</entry></row><row><entry align="center" colname="col1">3</entry><entry align="center" colname="col2">10</entry><entry align="center" colname="col3">TEOS-SiO₂</entry><entry align="center" colname="col4">No peel-tape test passed</entry></row><row><entry align="center" colname="col1">4</entry><entry align="center" colname="col2">20</entry><entry align="center" colname="col3">TEOS-SiO₂</entry><entry align="center" colname="col4">No peel-tape test passed</entry></row><row><entry align="center" colname="col1">5</entry><entry align="center" colname="col2">30</entry><entry align="center" colname="col3">TEOS-SiO₂</entry><entry align="center" colname="col4">No peel-tape test passed</entry></row><row><entry align="center" colname="col1">6</entry><entry align="center" colname="col2">40</entry><entry align="center" colname="col3">TEOS-SiO₂</entry><entry align="center" colname="col4">No peel-tape test passed</entry></row><row><entry align="center" colname="col1">7</entry><entry align="center" colname="col2">50</entry><entry align="center" colname="col3">TEOS-SiO₂</entry><entry align="center" colname="col4">No peel-tape test passed</entry></row><row><entry align="center" colname="col1">8</entry><entry align="center" colname="col2">0</entry><entry align="center" colname="col3">PVD-SiO₂</entry><entry align="center" colname="col4">SiO₂can be pulled off with tape on some locations - minimal peel</entry></row><row><entry align="center" colname="col1">9</entry><entry align="center" colname="col2">5</entry><entry align="center" colname="col3">PVD-SiO₂</entry><entry align="center" colname="col4">No peel-tape test passed</entry></row><row><entry align="center" colname="col1">10</entry><entry align="center" colname="col2">0</entry><entry align="center" colname="col3">TaSiOx</entry><entry align="center" colname="col4">No peel-tape test passed</entry></row><row><entry align="center" colname="col1">11</entry><entry align="center" colname="col2">5</entry><entry align="center" colname="col3">TaSiOx</entry><entry align="center" colname="col4">No peel-tape test passed</entry></row></tbody></tgroup></table></tables>

<b>Adhesion in an in-situ process (</b><b>Adhesion</b><b></b><b>in</b><b></b><b>In</b><b>-</b><b>Situ</b><b></b><b>Processes</b><b>)</b>

The stacks in Table 2 were Si/Si0 using in-situ processes to deposit the top adhesion layer.₂It was prepared on a /TaSiOx 50nm/Zr 5Å/Au 25nm stack. This means that the vacuum was not broken between the deposition of the 25 nm gold layer and the top Zr layer (representing the top adhesion layer). Each stack has a second duplicate ran, which is provided directly below the first. The stacks were annealed at different conditions presented in Table 2. For clarity, in Table 2, the first 4 (8 if overlapping) entries do not contain a top adhesive layer and the last 4 (8 if overlapping) entries contain a top adhesive layer do.

<tables num="2"><table><tgroup cols="6"><colspec align="left" colname="col1" colnum="1" colwidth="782" /><colspec align="center" colname="col2" colnum="2" colwidth="1882" /><colspec align="center" colname="col3" colnum="3" colwidth="2807" /><colspec align="center" colname="col4" colnum="4" colwidth="1857" /><colspec align="center" colname="col5" colnum="5" colwidth="1582" /><colspec align="center" colname="col6" colnum="6" colwidth="1782" /><tbody><row><entry align="left" colname="col1" /><entry align="left" colname="col2" /><entry align="center" nameend="col6" namest="col3">tape test results</entry></row><row><entry align="left" colname="col1">No.</entry><entry align="center" colname="col2">additional layers</entry><entry align="center" colname="col3">Immediately after deposition (As deposited)</entry><entry align="center" colname="col4">RAT at 225°C for 15 min.</entry><entry align="center" colname="col5">Vacuum annealing at 225°C for 3 hours</entry><entry align="center" colname="col6">300°C air annealing for 15 minutes</entry></row><row><entry align="left" colname="col1">12</entry><entry align="left" colname="col2"><img file="KR101738552B1_D0005.tif" /></entry><entry align="left" colname="col3">90-100% peel</entry><entry align="left" colname="col4">X</entry><entry align="left" colname="col5">X</entry><entry align="left" colname="col6">X</entry></row><row><entry align="left" colname="col1">13</entry><entry align="left" colname="col2">overlap</entry><entry align="left" colname="col3">90-100% peel</entry><entry align="left" colname="col4">X</entry><entry align="left" colname="col5">X</entry><entry align="left" colname="col6">X</entry></row><row><entry align="left" colname="col1">14</entry><entry align="left" colname="col2"><img file="KR101738552B1_D0006.tif" /></entry><entry align="left" colname="col3">100% peel</entry><entry align="left" colname="col4">X</entry><entry align="left" colname="col5">X</entry><entry align="left" colname="col6">X</entry></row><row><entry align="left" colname="col1">15</entry><entry align="left" colname="col2">overlap</entry><entry align="left" colname="col3">100% peel</entry><entry align="left" colname="col4">X</entry><entry align="left" colname="col5">X</entry><entry align="left" colname="col6">X</entry></row><row><entry align="left" colname="col1">16</entry><entry align="left" colname="col2"><img file="KR101738552B1_D0007.tif" /></entry><entry align="left" colname="col3">100% peel</entry><entry align="left" colname="col4">X</entry><entry align="left" colname="col5">X</entry><entry align="left" colname="col6">X</entry></row><row><entry align="left" colname="col1">17</entry><entry align="left" colname="col2">overlap</entry><entry align="left" colname="col3">100% peel</entry><entry align="left" colname="col4">X</entry><entry align="left" colname="col5">X</entry><entry align="left" colname="col6">X</entry></row><row><entry align="left" colname="col1">18</entry><entry align="left" colname="col2"><img file="KR101738552B1_D0008.tif" /></entry><entry align="left" colname="col3">0% peel</entry><entry align="left" colname="col4">0% peel</entry><entry align="left" colname="col5">0% peel</entry><entry align="left" colname="col6">0% peel</entry></row><row><entry align="left" colname="col1">19</entry><entry align="left" colname="col2">overlap</entry><entry align="left" colname="col3">One location exhibits delamination, while other locations show 0%</entry><entry align="left" colname="col4" /><entry align="left" colname="col5" /><entry align="left" colname="col6" /></row><row><entry align="left" colname="col1">20</entry><entry align="left" colname="col2"><img file="KR101738552B1_D0009.tif" /></entry><entry align="left" colname="col3">One location exhibits delamination, while other locations show 0%</entry><entry align="left" colname="col4">One location exhibits delamination, while other locations show 0%</entry><entry align="left" colname="col5">Other locations are 0%</entry><entry align="left" colname="col6">Started to show more delamination (10-20%)</entry></row><row><entry align="left" colname="col1">21</entry><entry align="left" colname="col2">overlap</entry><entry align="left" colname="col3">One location exhibits delamination, while other locations show 0%</entry><entry align="left" colname="col4" /><entry align="left" colname="col5" /><entry align="left" colname="col6" /></row><row><entry align="left" colname="col1">22</entry><entry align="left" colname="col2"><img file="KR101738552B1_D0010.tif" /></entry><entry align="left" colname="col3">5-10% peel near wafer edge, but 0% at other locations</entry><entry align="left" colname="col4">5-10% peel near wafer edge, but 0% at other locations</entry><entry align="left" colname="col5">Started to show more delamination (50-60%)</entry><entry align="left" colname="col6">90-100% peel</entry></row><row><entry align="left" colname="col1">23</entry><entry align="left" colname="col2">overlap</entry><entry align="left" colname="col3">0% peel</entry><entry align="left" colname="col4" /><entry align="left" colname="col5" /><entry align="left" colname="col6" /></row><row><entry align="left" colname="col1">24</entry><entry align="left" colname="col2"><img file="KR101738552B1_D0011.tif" /></entry><entry align="left" colname="col3">5-10% peel near wafer edge, but 0% at other locations</entry><entry align="left" colname="col4">5-10% peel near wafer edge, but 0% at other locations</entry><entry align="left" colname="col5">Started to show more delamination (50-60%)</entry><entry align="left" colname="col6">90-100% peel</entry></row><row><entry align="left" colname="col1">25</entry><entry align="left" colname="col2">overlap</entry><entry align="left" colname="col3">0% peel</entry><entry align="left" colname="col4" /><entry align="left" colname="col5" /><entry align="left" colname="col6" /></row><row><entry align="left" colname="col1">26</entry><entry align="left" colname="col2"><img file="KR101738552B1_D0012.tif" /></entry><entry align="left" colname="col3">0% peel</entry><entry align="left" colname="col4">One location exhibits delamination, while other locations show 0%</entry><entry align="left" colname="col5">X (wafer breakage)</entry><entry align="left" colname="col6">X</entry></row><row><entry align="left" colname="col1">27</entry><entry align="left" colname="col2">overlap</entry><entry align="left" colname="col3">0% peel</entry><entry align="left" colname="col4">0% peel</entry><entry align="left" colname="col5">0% peel</entry><entry align="left" colname="col6">0% peel</entry></row></tbody></tgroup></table></tables>

FC = flash <img file="KR101738552B1_D0013.tif" />

LTC=LDR tetra-ethyl-ortho-silicate<img file="KR101738552B1_D0014.tif" />

<b>optical properties</b>

The optical properties for Examples 12, 14, 18, 20, 22, and 26 from Table 2 were determined by ellipsometry as deposited and after annealing under various conditions, the refractive index (n) and extinction coefficient (<img file="KR101738552B1_D0015.tif" />) was evaluated by measuring The data is shown in Table 3 below.

<tables num="3"><table><tgroup cols="7"><colspec align="center" colname="col1" colnum="1" colwidth="689" /><colspec align="center" colname="col2" colnum="2" colwidth="1389" /><colspec align="center" colname="col3" colnum="3" colwidth="1602" /><colspec align="center" colname="col4" colnum="4" colwidth="1889" /><colspec align="center" colname="col5" colnum="5" colwidth="1702" /><colspec align="center" colname="col6" colnum="6" colwidth="1889" /><colspec align="center" colname="col7" colnum="7" colwidth="1527" /><tbody><row><entry align="center" colname="col1" /><entry align="center" nameend="col3" namest="col2">immediately after deposition</entry><entry align="center" nameend="col5" namest="col4">RTA at 225°C for 15 min.</entry><entry align="center" nameend="col7" namest="col6">RTA at 300 °C for 15 min.</entry></row><row><entry align="center" colname="col1" /><entry align="center" colname="col2">n</entry><entry align="center" colname="col3">k</entry><entry align="center" colname="col4">n</entry><entry align="center" colname="col5">k</entry><entry align="center" colname="col6">n</entry><entry align="center" colname="col7">k</entry></row><row><entry align="center" colname="col1">12</entry><entry align="center" colname="col2">0.23</entry><entry align="center" colname="col3">5.51</entry><entry align="center" colname="col4">0.178</entry><entry align="center" colname="col5">5.5</entry><entry align="center" colname="col6">0.173</entry><entry align="center" colname="col7">5.5</entry></row><row><entry align="center" colname="col1">14</entry><entry align="center" colname="col2">0.23</entry><entry align="center" colname="col3">5.5</entry><entry align="center" colname="col4">0.175</entry><entry align="center" colname="col5">5.5</entry><entry align="center" colname="col6">0.171</entry><entry align="center" colname="col7">5.5</entry></row><row><entry align="center" colname="col1">18</entry><entry align="center" colname="col2">0.27</entry><entry align="center" colname="col3">5.54</entry><entry align="center" colname="col4">0.231</entry><entry align="center" colname="col5">5.54</entry><entry align="center" colname="col6">0.22</entry><entry align="center" colname="col7">5.52</entry></row><row><entry align="center" colname="col1">20</entry><entry align="center" colname="col2">0.33</entry><entry align="center" colname="col3">5.56</entry><entry align="center" colname="col4">0.31</entry><entry align="center" colname="col5">5.57</entry><entry align="center" colname="col6">0.294</entry><entry align="center" colname="col7">5.51</entry></row><row><entry align="center" colname="col1">22</entry><entry align="center" colname="col2">0.35</entry><entry align="center" colname="col3">5.58</entry><entry align="center" colname="col4">0.28</entry><entry align="center" colname="col5">5.53</entry><entry align="center" colname="col6">0.267</entry><entry align="center" colname="col7">5.52</entry></row><row><entry align="center" colname="col1">26</entry><entry align="center" colname="col2">0.26</entry><entry align="center" colname="col3">5.52</entry><entry align="center" colname="col4">0.23</entry><entry align="center" colname="col5">5.54</entry><entry align="center" colname="col6">0.213</entry><entry align="center" colname="col7">5.5</entry></row></tbody></tgroup></table></tables>

Accordingly, embodiments of "INTERLAYER FOR DEVICE INCLUDING NFT AND CLADDING LAYERS" are disclosed. The implementations disclosed above and other implementations fall within the scope of the following claims. Those skilled in the art will recognize that the present disclosure may be practiced with embodiments other than those disclosed. The disclosed embodiments are provided for purposes of illustration and not limitation.