Cooling structure for semiconductor device

[Detailed Description of the Invention]

[Summary of the Invention] Structure where the hermetic container itself provides with and carries out the self-cold of the cooling channel to an inside as the method of cooling a semiconductor chip for being immersed in a refrigerant and taking liquid cooling structure. [Industrial Application] The present invention relates to the cooling structure of the semiconductor device which carries out liquid cooling of the semiconductor device which becomes Mutually from LSI to a long time efficiently. The miniaturization of the element is advanced the 111st place, and, as for the semiconductor device which comprises many semiconductor chips as a method of improving the throughput of a Electricity w opportunity, increase of the number of elements is performed. That is, the electrode size and conductive pattern width which form a unit element child are reduced very much to the degree, - and the number of Jurisdiction increase and LSI, and Vl and SI are put in practical use. It is although the mounting method to the wiring board was also improved, it has stored in the hermetic seal package for every semiconductor chip and the wiring board was conventionally equipped with this, The method of equipping multilevel interconnection boards, such as ceramics, with LSI 1000 c;t ?i 81 piece knob as a future form, and making 1.51 Module, exchanging this and equipping a wiring board as a unit has come to be taken. Thus, it became huge [ the calorific value of a semiconductor device ] as a miniaturization and high-density-izing of the unit element child advanced, and by the conventional air cooling method, it became impossible to keep the temperature of an element to maximum-allowable-working-temperature within the limits. That is, conventionally, what was a maximum of about 3 W amounts to about 10 W in VLSI, and is in the calorific value of an IC chip utterly. Instead of the air cooling or the air cooling with blower of the former [ cooling method / of a semiconductor device ], liquid cooling is needed from the above thing. The present invention relates to an effective liquid cooling structure as Mutually at a long time. [Description of the Prior Art] About a superconducting element, it is publicly known, liquid nitrogen (N2), liquid helium ()Ie, etc. are used as a refrigerant, and the liquid cooling structure over electronic equipment is used, storing in a Juar bottle type container. However, a special use like the high-electron mobility transistor using gallium arsenide (GaAs) as an object for cooling of a semiconductor device may be maintained at another, then below 85 degreeC * it is not necessary to maintain at such low temperature, and are maximum allowable working temperature about the temperature of a chip. Then, the boiling point uses nondissociative solution as a refrigerant by the non-corrosiveness below this temperature, and the method of immersing a chip into this is taken. These conditions are not filled but it is used as a refrigerant, Off l Noon (02C13F 3. boiling point 49degreeC), various kinds of Fluo I:1 carbon, for example, C3F12(boiling point 30degreeC)lc6P14 etc., (boiling point 56degreeC), etc. Full ' and 41 Cocarbon mix the thing of various kinds of structural formulae, and can be adjusted [ of the boiling point ]. Now, if the example of the conventional liquid cooling structure is given, as shown in Drawing 2, two or more connectors 2 will be installed in the bottom of metal or liquid cooling container 1 made from a plastic, Multilayer ceramic substrate 4 in which many 1.SI chips 3 were carried is inserted in this, and it connects with an external circuit by connector connection. and -- two or more multilayer ceramic substrates 4 are immersed in refrigerant 5 -- the inside of liquid cooling container 1 -- the space of refrigerant 5 and the container upper part -- heat exchanger (Condenser) FifJ -- < -- the structure which it has and is cooled with water or other refrigerants is taken. However, although this cooling structure was excellent in cooling capacity at the beginning, it turned out that cold 141 capability declines gradually with progress of time. This reason has osmosis of non-condensable gas, such as air and oxygen, through liquid cooling container 1 while in use, It is because these non-condensable gases are condensed around heat exchanger 6 and liquefaction is blocked that the content of the impurities which there is generating of air, an owner m solvent, etc. from a multilayer ceramic substrate, a connector, etc. with the rise of solution temperature, therefore are contained in refrigerant 5 increases gradually, although not avoided. On the other hand, although cooling efficiency is inferior compared with the case where it installs in the position between refrigerant absentminded when heat exchanger 6 is installed into refrigerant 5, it is hardly dependent on impurities content, and cooling capacity hardly changes, even if time passes. It may provide so that refrigerant 5 may be directly touched in a heat exchanger as it shall be reliable in liquid cooling structure from the above fact. However, since the original state with little impurities content is not enough as cooling capacity as described previously, this improvement is required. [To \ As explained" 2, it becomes Acceptance it about the influence of problem] which an invention tends to solve, with the non-condensable gas contained in this when a heat exchanger required for a liquid cooling container is installed into a refrigerant. Therefore, although a heat exchanger may be installed into liquid for putting in practical use the liquid cooling container which was excellent in reliability, how cooling capacity is improved poses a problem. The hermetic container which carries out liquid cooling of the circuit board in which a plurality of semiconductor chips with a high degree of location were carried the problem of the means] above for solving c problem, Two or more projection parts which carry out the trap of the air bubbles which arise from the above-mentioned semiconductor chip to the inner wall of the container are obtained 6 fff, and it can have a cooling pipe between the inner wall of the container, and an outer wall, and can solve according to the cooling structure of the semiconductor device with which the container itself constitutes a cooling container. [Function] Although Crawling is also law on the other hand in a refrigerant about the pipe which let cooling water pass as a method of placing a heat exchanger into a refrigerant, the present invention cools the liquid cooling container itself. Since the problem in the case of cooling the LSI chip heated here does not remain for cooling the LSI chip itself but the low-boiling-point refrigerant is used, it is necessary to liquefy effectively the air bubbles boiled from the surface of an LSI chip. As for the present invention, a liquid cooling container consists of metal or plastics until now, and while the very thing itself had almost no cooling capacity, it gives cooling capacity to this container itself, and it improves cooling capacity markedly by considering it as the structure which is easy to carry out the trap of the air bubbles. [Example] While cooling pipe 8 in which Drawing 1 is a sectional view of the cooling structure concerning the present invention, and cooling water flows into metal liquid cooling container 7 embeds and is formed, They are the air bubbles which eaves-like projection part 9 is provided in the inside of a cooling container, boil from LSI chip 3, and surface to the undersurface of projection part 9 1 - It is constituted so that a lamp may be carried out. It sees and carries out and is easy, although it seems that there is no tel and is also Wins, the fact is easy, and it halves perpendicularly in a cooling pipe 8 existence position, and formation of this liquid cooling container 7 should just be taken as - and the structure which joins and welds both. Connector 2 is provided in the bottom of such a liquid cooling container 7, multilayer ceramic substrate 4 is inserted, refrigerant 5 is put in and sealed, and on the other hand, since jlll Do use If you miss and liquid cooling container 7 the very thing do 1 A zeta operation of cooling water with a heat exchanger at cooling Paivu 8, the cooling structure which was excellent in cooling capacity is utilizable. [Effect of the Invention] As described above, the present invention works as a heat exchanger which plays the cards of the air bubbles which the liquid cooling container itself boils from 1.81 A tip, and can put a cooling container with sufficient reliability in practical use by operation of the present invention.

[Brief Description of the Drawings]

the sectional view of the cooling structure which requires Drawing 1 for the present invention, and the sectional view of the cooling structure of the former [ Drawing / 2 ] -- it comes out. in a figure -- 1.7 -- liquid cooling container 3 -- an LSI chip and 4 -- a multilayer ceramic substrate and 5 -- a refrigerant and 6 -- heat exchanger 8 -- a cooling pipe and 9 -- a projection part -- it comes out.