Diffusion coupling x-ray target
Abstract
(57) [Abstract] Since this gazette is application data in front of an electronic application, the data of an abstract is not recorded.
Term
Term ended
Projected expiry passed 9 January 2007, 19.7 years ago.
- Priority
- Filed
- Published
- Projected expiry
- Today
23 claims: 23 independent, 0 dependent
- 1【特許請求の範囲】 1)X線ターゲット部材を支持部材に固着する固着方法において、 該支持部材の第1面と該X線ターゲット部材の第1面との間の界面に、該X線ターゲット部材の融点及び該支持部材の融点よりも融点の低いろう付け材を配し、 該ろう付け材の融点よりも低い温度で該ターゲット部材の該第1面と該支持部材の該第1面とに該ろう付け材を拡散させる 各工程から成る固着方法。
- 22)前記の拡散工程が、 該ターゲット部材と該支持部材とをそれぞれの第1面の間において一緒に加圧し、 該ターゲット部材を加熱し、該界面の該ろう付け材に対して該ターゲット部材を膨張させる各工程から成る特許請求の範囲第1項記載の固着方法。
- 33)前記加熱工程が、低電力の電子ビームをX線ターゲット部材に供給する工程を含む特許請求の範囲第2項記載の固着方法。
- 44)前記加熱工程が、X線ターゲット部材を高周波の電磁界にさらす工程を含む特許請求の範囲第2項記載の固着方法。
- 55)支時軸の横取付面にX線ターゲット部材を結合する方法において、 該横取付面にろう付け材を配し、 該ろう付け材及び該横取付面に該X線ターゲット部材を位置させ、 該取付面及び該X線ターゲット部材中に該ろう付け材を拡散させる 各工程から成る結合方法。
- 66)該拡散工程が該ろう付け材及び該取付面に該X線ターゲット部材を固定させる工程と、該ターゲット部材を加熱して該ターゲット部材を該ろう材及び取付面に対して膨張させる 工程とから成る特許請求の範囲第5項記載の結合方法。
- 77)該ろう付け材の融点よりも低い温度に該X線ターゲット部材を加熱する特許請求の範囲第6項記載の結合方法。
- 88)該X線ターゲット部材及び取付面が耐火金属から成る特許請求の範囲第5項記載の結合方法。
- 99)該ろう付け材がパラジウム/コバルト系である特許請求の範囲第8項記載の結合方法。
- 1010)該ろう付け材がパラジウム/ニッケル系である特許請求の範囲第8項記載の結合方法。
- 1111)ねじ端部を有する支持部材にX線ターゲット部材を結合する方法において、 該支持部材の取付面上にX線ターゲット部材を位置させ、 該ねじ端部とそれを受けいれるためのナットとの間の界面にろう付け材を配し、 該ねじ端部に該ナットを固着し、該ナットを該X線ターゲット部材に固着して該X線ターゲット部材を該取付面に固着し、 該ろう付け材の融点によりも低い温度に該X線ターゲット部材を加熱して該ろう付け材を該ナット及び該ねじ端部に拡散させる 各工程から成る結合方法。
- 1212)X線ターゲット部材と、 該X線ターゲット部材を支持するための支持手段と、 該X線ターゲット部材を該支持手段に固着するための固着手段と、 を有し、該固着手段は、該X線ターゲット部材の第1面と該支持手段の第1面との間の界面に配されたろう付け材を含み、該ろう付け材の第1部分は、該X線ターゲット部材の該第1面中に拡散され、該ろう付け材の第2部分は、該支持手段の該第1面中に拡散される、X線ターゲット組立体。
- 1313)該X線ターゲット部材及び該支持手段が耐火金属からできており、該ろう付け材は、該耐火金属の融点よりも低い融点をもつ特許請求の範囲第12項記載のX線ターゲット組立体。
- 1414)前記支持手段が、ステムと、該ステムに対して横方向に配されたフランジ部分とを有し、前記X線ターゲット部材は、その開口を経て延長する該ステム及び該フランジ部分上に配された特許請求の範囲第12項記載のX線ターゲット組立体。
- 1515)X線ターゲット部材と該フランジ部分との間の界面に前記ろう付け材を配した特許請求の範囲第14項記載のX線ターゲット組立体。
- 1616)X線ターゲット部材と該ステムとの間の界面に前記ろう付け材を配した特許請求の範囲第15項記載のX線ターゲット組立体。
- 1717)該ステムをねじ付けとし、該支持手段は、該ねじ付ステムを受入れるようにしたナットを含み、該ナットは、該X線ターゲット部材と係合するようにした特許請求の範囲第14項記載のX線ターゲット組立体。
- 1818)該ナットと該X線ターゲット部材との間の界面に前記ろう付け材を配した特許請求の範囲第17項記載のX線ターゲット組立体。
- 1919)該ステムのねじ付部分と該ナットとの間の界面にろう付け材を配した特許請求の範囲第18項記載のX線ターゲット組立体。
- 2020)空気抜きしたエンベロープと、 該エンベロープ中に配設されて回転軸線の回りに回動可能とした、回動可能なX線ターゲット組立体と を有し、該X線ターゲット組立体は、 (i)通し孔を備えたX線ターゲット部材と、(ii)該回転軸線に対して横方向に配された取付面と、該取付面上に配された該X線ターゲット部材の下面と、該X線ターゲット部材の該通し孔を経て該取付面から延長しているねじ付ステムとを含む、支持部材と、 (iii)該ねじ付ステムを受入れるようにされ、該ターゲット部材の上面と係合するナットと、(iv)該X線ターゲット部材を該支持部材に固着するための固着手段と、 を有し、該固着手段は、該X線ターゲット部材の下面と該取付面との間に配されたろう付け材を含み、該ろう付け材の第2部分は該X線ターゲット部材中に拡散され、該ろう付け材の第2部分は該支持部材の取付面に拡散される ようにしたX線筒。
- 2121)該X線ターゲット部材と該支持部材とが、TZM合金からできており、該ろう付け材はTZM合金よりも低融点の合金からできている特許請求の範囲第20項記載のX線筒。
- 2222)X線ターゲット部材を支持部材に固着するための固着方法において、 該X線のターゲット部材の融点及び支持部材の融点よりも低い融点をもつたろう付け材を、該支持部材の第1面と該ターゲット部材の第1面との間の界面に配し、 該ろう材の融点よりも低い温度において前記2つの第1面のうち少くとも一方に該ろう材を拡散させる 各工程から成る固着方法。
- 2323)X線ターゲット部材と、 該X線ターゲット部材の支持手段と、 該X線ターゲット部材を該支持手段に固着する固着手段と を含み、該固着手段は、該ターゲット部材の第1面と該支持手段の第1面との間の界面に配された材料を含み、該材料の一部分は、前記2つの第1面のうち少くとも一方に拡散される ようにしたX線ターゲット組立体。
Independent claims23
4 paragraphs, as filed
[Detailed Description of the Invention]
[Industrial Application] the present invention -- general -- 1 and an X ray pipe -- Co ' To BI L and - < -- it is i' -- the X ray pipe provided with the revolving X-rays target -- W -- it takes one. With the art concerned, it is sigma thread A as everyone knows : It has *A dropletzeta, various uses, and structure. In the X ray pipe of the form which changes, the electron beam of high energy is emitted from heating filament 6 A shave, and converges on the X ray discharge region of Anono 1 Do. X-ray Release: Including Interest like 2 and a tungsten rhenium alloy, this material answers that electronic B Beam which converged as mentioned above entered into it, and emits X-rays. Therefore, the anode is ordinarily called the X ray target. If the electron beam of high energy enters into an X ray target, a lot of heat will occur at an X ray target. This heat is harmful to the operation of structure 8 of a target, therefore an X ray pipe. Therefore, target Ano- Do is provided with a member like the disk which is attached on a supporting spindle and rotates with an electric motor in the conventional X ray pipe of this form. Typically, a disk and a supporting spindle are high-melting alloy metaphor Hachitan- Jill Conium-Mori7'7':/(TZM). It is made of an alloy. Focal suitcase (annular portion of the surface of disk which is made of tungsten rhenium which is X ray discharge material) K convergence of an electron beam is done. By rotating a target disk at the high speed of for example, 1100OORP, an electric motor is rotated so that the crowd of some focal tracks may be carried out to the course of the electron beam which converged. Therefore, since an electron beam enters into some focal tracks of X ray discharge nature, the remaining portion of a focal track can be cooled during the time taken to base some above-mentioned focal tracks on some courses of the electron beam which converged as for a rotation button, and to go into them again. The supporting spindle is provided with the flange fitting member which made the stem with a screw project in the conventional X ray pipe. A stem fits into the opening of the central part of X ray Target Disk, and this disk is engaging with the surface of a fitting member with a flange. xl target disk of a TZM alloy adheres to the supporting spindle of a TZM alloy by carrying out screw fastening of the Nut of TZ M fj money to a stem, and clamping 7 The X-rays target disk to a fitting member with a flange. Next, it carries out whether a strange or material of the undersurface of a disk to a small quantity to which the weight on the undersurface of a disk is moved is removed, and equilibrates a disk dynamically. Although this adherence device operates satisfactorily about the use which changes, about other uses, it turns out that a disk slips on a supporting spindle and it becomes disequilibrium by the high velocity revolution of a disk. the grade in which the target disk which became disequilibrium vibrates during rotation, and this vibration occasionally destroys an X ray pipe -- Dog listening -- . According to another publicly known X ray pipe, A stay of a supporting spindle is not provided with a screw part, and is produced, materials (called columbium), for example, niobium, other than a TZM alloy. A stem and a target disk are heated during manufacture and diffusion combination of the target is carried out by it at stem K, therefore a supporting spindle. Although this method of cling is satisfactory about the use which changes, the stem which is made of material like niobium is more nearly vulnerable than the stem manufactured from the fireproof alloy, for example, a TZM alloy, especially under high temperature which is usually experienced during use of an X ray part. therefore -- the slip which the stem and the target disk mentioned above being caused under such high temperature, and following on it -- a target -- disequilibrium -- Si and vibration take place. Stress added to diffusion combination between diffusion combination between a stem and a target stem is tensile stress or compression stress. This is stress of the most destructive form among mechanical stress to diffusion combination. If it is used for a long period of time, a little size of the opening of the target disk which it lets the stem of niobium pass and fits in will expand. This expansion brings a result which gives excessive tensile stress to the diffusion combination between the stem of niobium, and a target disk. [Problem(s) to be Solved by the Invention] An object of the present invention is to cancel the fault of such prior art. [Means for Solving the Problem] In an adherence method which adheres an X ray target member to a support member by the present invention, To an interface between the 1st page of the support member, and the 1st page of the X ray target member, Low soldering material of the melting point is allotted rather than the melting point of the X ray target member, and the melting point of the support member, and an adherence method which comprises each process which makes the 1st page of the target member and the 1st page of the support member diffuse the soldering material at a temperature lower than the melting point of the soldering material is provided. According to this adherence method, it is structurally combined with a support member and a target member forms a single compound structure. A target member stops therefore, receiving a slip substantially on a support member during rotation of an X ray target member. An alloy of palladium, nickel, or cobalt may be sufficient as soldering material. A target member and a support member can be used as fire-resistant metal or its alloy, for example, a titanium Zirconium-Moridzene (TZM) alloy. According to the desirable embodiment of the present invention, soldering material is allotted to a usurpation attachment side of a supporting spindle, The X ray target member is located in the soldering material and a field with usurpation, the target member is adhered to the soldering material and clamp face, and the target member is expanded to the soldering material and an attachment side, By diffusing the soldering material in the attachment side and a target member, a method of combining an X ray target member with a usurpation attachment side of a supporting spindle is provided. To a supporting spindle, since diffusion combination is formed between the surfaces carried out, stress of transverse direction K (in transverse direction [ Therefore receiving an axis-of-rotation line of a target member. ]) arrangement to which this diffusion combination is added is shear stress whose Hardness to diffusion combination is lower than tensile stress or compression stress. x Gland which includes an X ray target assembly object which can rotate around an axis-of-rotation line according to the present invention It is provided. A target assembly object which can rotate is provided with the following. X ray target member, A support means for supporting an X ray target member. A target member is equilibrated on this support means. A means to adhere a target member to a support means is further established. Including soldering material matched for an interface of the 1st page of a target member, and the 1st page of a support means with this adherence means, the 1st portion of this soldering material is diffused in the 1st page of a target member, and the 2nd portion of soldering material is diffused in the 1st page of a support means. Since a target member is substantially prevented from being slippery on a support member during rotation of an X ray assembly object according to this composition, a target member is prevented from becoming disequilibrium on a support member, and vibration of a target member under rotation is removed substantially. The feature and an advantage which the present invention mentioned above will become still clearer by detailed explanation of the following of a desirable example shown in an accompanying drawing. [Example] In Drawing 1, X-ray generator 1o including X ray part 12 is illustrated. X ray part 12 is electrically connected to bias unit 16 and high-voltage supply unit 18 which can be adjusted which can be adjusted and in which filament supply Unit 1-14. regulation is possible. X ray part 12 is provided with cathode assembly object 20 and X ray target assembly object 22 by the present invention which can be rotated. The details of X ray target assembly object 22 are explained in full detail behind. Target assembly object 22 which can rotate in This\ is with target member 24 (anode electrode 26 is included in this example), It remains for pointing out that target member 24 is allotted on clamp face 30 including support member 28 provided with clamp face 30 with which axis-of-rotation line 32 of target assembly object 22 was matched right-angled. It adheres to support member 28 by the fixing means containing soldering material 36 allotted between target member 24 The, target member 24, and clamp face 30. It is spread in target member 24 and support member 28 using the joint process by the present invention, and the 1st portion and the 2nd portion of soldering material 36 are this diffusion joint process, respectively, Wax material is prevented from being vapor-deposited by the Equi robe 38 A inside of an X ray pipe by being carried out at the temperature below the melting temperature of soldering material. This process is explained in full detail below. In order that target member 24 may not slip substantially on support member 28 between rotations of X ray target assembly object 22 according to this composition, Target member 24 is prevented from serving as disequilibrium on support member 28, therefore vibration of target member 24 under operation of X-ray generator 10 is canceled substantially. X ray part 12 is cylindrical En (Envelope rope 38 may be made from dielectric material, for example, nonlead glass, including rope 38.) in most. The end of Envelope rope 38 is provided with dent portion 40 by which the seal of the peripheral part was carried out to the end of metal color 42. The other end of color 42 adheres to one end of ordinary anode 90-Tarr 44 who has done it from a conductive material, for example, copper, airtightly as everyone knows. Anode 90-Tarr's 44 axis 46 is extended to the exterior of Envelope rope 38. A terminal means for electrically connecting anode 80-Tarr 14 to Pressure end 4 of high-voltage supply unit 18 which can be adjusted is formed. Support member 28 is in the inside of Envelope rope 38, From anode 90-Tarr's 44 inner side end, the conductive stem 48 Wo implication and stem 48 which have been made from the fireproof material, for example, a titanium zirconium- molybdenum (TZM) alloy, are extended to the longitudinal direction, and are electrically connected with this. Support member 28 is still made of Nut 54 The and this example from a fireproof metal, for example, a TZM alloy, including 5 Nut 54. Flange portion 50 of support member 28 is made of this example from a TZM alloy also including flange portion 50. It is formed at rotor 44 and a tip of stem 48 of the side opposite to in one. Flange portion 50 is stopping to clamp face 30. Anode 8 disk 26 Mutaget containing member:24 adheres to support member 28 in clamp face 30 of flange portion 50 of stem 48. Axis-of-rotation line 32 is matched with anode 9 disk 26 right-angled, and it is rotated by anode '' rotor 44 as everyone knows. The inner side end of anode disk 26 serves as K and shape of the breath trapezoid so that the perimeter edge may be approached and a curve annular target side or focal track 52 may be formed. Focal track 52 is made of material like tungsten or a tungsten rhenium alloy. From cathode assembly object 20 of a filament, along with course 2 Engineering, this material emits X-rays easily, when it is a receptacle about Bonn Byrd of incidence electron flow of high energy. However, other portions of anode disk 26 are made of this example from the conductive fireproof material, for example, a T Z M alloy, for the object explained below. Nut 54 of a TZM alloy engages with the end with a screw of stem 48 of a TZM alloy (refer to the 2nd figure), and is too laid in the upper surface of anode disk 26 of a TZM alloy. It can be rotated by anode disk 26. Focal track 52 is always positioned by the relation which countered cathode assembly object 20 and was separated after this, and inclines toward X ray transmission window 56 which aligned in the diameter direction of Envelope rope 38. It is supported fixed on cathode '' assembly object 20 The and the tip portion of the Continuous light angle of arm 58 in the air. The tip of reverse 4ii1 of arm 58 is sealed by the end of support Ninlinda- 60 by which for Arrangement was carried out in the direction of an axis. The other end of support cylinder 60 is the circumference (sealed as Along.) of dent portion 62 of Envelope rope 38. From this dent portion, To-A ゝline 64.66.68 of an electric terminal has extended airtightly. Lead 64.68 of the electric terminal is electrically connected to bias unit 16 and filament supply unit 14, respectively. Another output terminal of bias unit 16 is electrically connected to lead 66 [ the output terminal of filament supply unit 14 and the negative output terminal of high-voltage unit 18, and ]. In the inside of Envelope rope 38, Lee"M64.66.68 are extended in cathode assembly object 20 through medium size arm 58. Among the both ends of cathode filament 70 in cathode assembly object 20, lead 66.68 supplies AC signal on which the negative high-output voltage (for example, receiving ground voltage 1 60KVDC) of high-voltage supply unit 18 is overlapped. Cathode filament 70 answers by being heated by this AC signal and emitting electrons. High-voltage supply unit 18 supplies the positive high voltage (for example, +59KVDC) to axis 46 to ground voltage. This positive potential is supplied to anode disk 26 via conductive axis 46. anode rotor 44 and stem 46. Therefore, high voltage potential (for example, 120KVDC) exists between anode disk 2G and cathode filament 70, and attracts the electron emitted by cathode filament 70 toward anode disk 26. It is insulated in conductive main part 72 of cathode assembly object 20, and cathode filament 70 is attached. It seems that bias of the main part 72 is carried out by the well-known method in order that lead 64 may converge the electron sent out by filament 70 as an electron beam in accordance with course 21. Negative suitable direct-current voltage is transmitted as opposed to the 1 60KVDC signal supplied to lead 66, this beam enters into focal track 52 of anode 9 disk 26, from focal track 52, electronic Bonn Byrd is answered and X-rays are sent out through X ray transmission window 56. Anode rotor 44 (it is a rotor element of the induction motor which is not illustrated) rotates target member 24 around axis-of-rotation #32 during an operation, predetermined speed, for example, 1100OORP. Therefore, the electron beam which converged is since it Balance into the portion from which this focal suitcase differed continuously while annular focal suitcase 52 rotates in time 9 of axis-of-rotation line 32, Before an electron beam enters into the again same field, the cool time which changes is given to the field of focal track 52 in which the electron beam of high energy acted as Bonn Byrd. An electron beam will damage promptly by fire focal track 52 which is made of tungsten rhenium, and will stop radiation of the X-rays from X ray part 12, when not making this rotation perform. since the revolving speed which target assembly object 22 reaches is very high-speed, target assembly object 22 prevents vibration -- as (7I: if it is made to balance correctly and is Mustache, there is nothing.) It not only makes unstable discharge of the X-rays from X ray part 12 by changing the field of focal track 52 into which an electron beam enters, but this vibration damages X ray part 12, when vibration is intense. Therefore, target member 24 adheres to stem 48 of support member 28, and it removes a small amount of materials by grinding until it balances while target assembly object 22 rotates. However, when target member 24 slips behind, namely, the position on support member 28 is changed, target assembly object 22 serves as disequilibrium, and vibrates to time - transmigration. This situation often generates target member 24 only using one Nut 54, for example, Nut, in the X ray part by the prior art which adheres to stem 74. Next, the present invention including X ray target assembly object 22 using the method of fixing support member 28 so that the above-mentioned slip may be canceled substantially, and this method is explained with reference to Drawing 2. The expansion hole is used for Drawing 2 in order to make Ah Si and illustration clear with the sectional view showing target member 24 and support member 28. In this example, support member 28 which is made of a TZM alloy has stem 48 in which flange portion 50 was formed. Flange portion 50 is provided with almost circular clamp face 30 made to support so that target member 24 may be mentioned below. Neck portion 51 of stem 48 of support member 28 is previously extended from flange portion 50, and is stopping at the male screw end 53. Therefore, support member 28 accepts target member 24 (in this example, it has opening 27 of the central part including anode disk 26 of a TZM alloy), and it supports it. Neck portion 91 is selected so that it may have a small diameter for a while rather than opening 27 of the central part. anode disk 26 fits in for This(ing) and obtaining with that of male screw end 53 of stem 48, it fits into the surroundings of neck portion 51 just, and the bottom 29 is laid on clamp face 30. Before laying anode 8 disk 26 on support member 28, in this example, the layer of soldering material 36 of the shape of a ring or a washer is given on clamp face 30. Soldering material 36 is taken as a comparatively low metal of the melting point, for example, a palladium cobalt alloy, (Pa about [ -Co, / melting point ] 1238C), and a palladium nickel alloy (PdN1, melting point 1230U). The melting point of a TZM alloy is comparatively high, and is abbreviation 2600C. Anode disk 26 fits into support member 28, goes away between neck portion 51 and opening 27 of the central part, and is just Heart(ed) and made the surroundings of axis-of-rotation line 32 by fitting on support member 28. In this example, male screw end 53 of support member 28 is by Summer so that Nut 54 made from a TZM alloy may be accepted. Screw fastening of Nut 54 is carried out to male screw end 53, and it pressurizes anode disk 26 downward toward clamp face 30 of soldering material 36 and flange portion 50. Between anode 9 disk 26 of a comparatively hard TZM alloy, and flange portion 50 of a TZM alloy, this mechanical power compresses comparatively flexible soldering material, Soldering material 36 is changed so that it may become a member of the shape of a thin washer, and bottom 29 of anode 9 disk 26 is made close to clamp face 30. The size of the washer of soldering material 36 is selected so that a washer may not extend in a transverse direction previously from the fibular margin of flange portion 50, when soldering material 36 is compressed mechanically as mentioned above. T it is bolting strongly as mentioned above about Nut 54 of a Z M alloy -- heat a back private seal and target member 24. In this case, heating of 9 and target member 24 is realized by applying the electric power of the form of an electron beam to focal track 52 of anode disk 26. As another method, anode disk 26 may be inductively heated by exposing anode disk 26 to high frequency Electric mother world. Target assembly object 22 makes the minimum the opportunity for target member 24 to slip on support member 28, as it is not made to rotate preferably while having applied electric power to anode disk 26. Therefore, the electron beam applied to focal track 52, The heat which occurred in One anode disk 26 made into the beam of comparatively low electric power disappears through anode disk 26 by the conduction and radiation which pass along stem 48 of support member 28 so that focal suitcase 52 may not be damaged. However, it is not heated by the grade as Anouk 1 disk 26 that flange portion 50 and Nut 54 are the same. as for the reason, heat generates flange portion 50 and Nut 54 directly by induction heating or the electron beam to which the rise of temperature is applied by anode disk 26 only by conduction from anode disk 26 at 1 Monster, a trial, and anode disk 26 -- it is useless. The useless anode disk 26 answers the above-mentioned heat, and responds to bigger mechanical expansion than low-temperature flange portion 50 or Nut 54 of stem 48. Therefore, flange portion 50 and Nut 54 restrict the mechanical amount of expansion of target member 24, and make anode disk 26 of target member 24, flange portion 50, and the interface between Nut 54 generate mechanical, very big power. If it puts in another way, the washer of compressed soldering material 36 in the interface between bottom 29 of target member 24 and clamp face 30 of support member 28 will further be compressed by the expansion to which anode 8 disk 26 to flange portion 50 was restricted. Additive compression of t Octopus arises in high temperature for heating (and conduction, support member 28) of target member 24. Field 39 to which flange portions 50 of field 37 where anode disk 26 of target member 24 adjoined, and support member 28 adjoined with the combination of this mechanical big power and heat (for example, 1000C) is made to diffuse soldering material 36, and he is each other (C contact of is done.) about bottom 29 and clamp face 30. Therefore, it is while very powerful mechanical coupling is formed between target member 24 of a TZM alloy, and support member 28 of a TZM alloy and makes anode desk 26 fix on it, Target member 24 is substantially prevented from slipping on support member 28 between the high velocity revolutions of the target assembly object experienced during the operation of X-ray generator 10. It is found out that target assembly object 22 reaches at the temperature of the range of 1300t:! while using X-ray generator 10. (Typical soldering material 361, for example, Pa-G., which are used as a material of a washer in the present invention.) An alloy and a P a -N i alloy are equal to the category temperature range of target assembly object 22, or have the comparatively high steam pressure of a 10-torr order in the melting point lower than this and this hot operating temperature. The steam pressure of a TZM alloy is still more remarkably low, and lower than 10 Le. Therefore, if such soldering material is carried out all over X ray part 12 as for @ dew while using X ray part 12, the metal deposit containing soldering metal will be formed on the inside of Envelope rope 38 of the high steam pressure of soldering material. Therefore, an arc occurs between a high-voltage element (namely, an anode and can -Dopa) and the metal deposit on the surface of Envelope rope 38, and it degrades the performance of X ray part 12 in it. Target assembly object 22 manufactured by the fixing method by the present invention and this fixing method cancels the above-mentioned problem by making target member 24 of a TZM alloy, and support member 28 of a TZM alloy diffuse soldering material 36 at a temperature lower than the melting point of soldering material 36. Namely, mechanical power which target member 24 was heated by temperature lower than a temperature lower than the melting point of soldering material 36, answered this heating, and occurred in the interface between anode disk 26 and seven lunges 50, At a temperature lower than the melting point of soldering material 36, soldering material 3G is completely diffused all over field 37.39. - Material (7) 1 [ suitable as soldering material 36 as an example ] The Twice pd-co alloy A melting point is 1280tl:. between the diffusion joint processes mentioned above -- target member 24 -- about (for example, thing for which electric power is applied to focal track 52) -- it is only heated by 1000c. However, the mechanical big power which arose when expansion of anode disk 26 was restricted to the interface between bottom 29 of target member 24 and clamp face 30 of support member 28 by flange portion 5o and Nut 54 is combination with the above-mentioned temperature. Soldering material is completely diffused in the TZM alloy of anode disk 26, and flange portion 5o. If soldering material is spread to anode disk 26 of a TZM alloy, and field 37.39 of flange portion 50, it is the melting point of these fields, Although it is higher than the melting point (it is 1238C, for example when a Pd-CO alloy is used) of soldering material 36, it is lower than the melting point (2600C) of a TZM alloy. When target assembly object 22 by which diffusion combination was carried out reaches a very high temperature of 13000 or more at the time of the usual use of X ray part 12, soldering material exists only as a part of diffusion combination between target member 24 and support member 28. If it puts in another way, soldering material 36 of pd, -co, or Pd-N1 system does not exist all over X ray part 12 between X ray operations of X ray part 12, if it removes 39 in 37% of the field diffused with a TZM alloy. The steam pressure of a TZM alloy is very low, it is 1 [ lower than J torr of Ha ] at 1300C' therefore 4z+ of field 37*39, and a division, f r of 6 * steam pressure is low similarly, and it prevents deposition of the soldering material to the surface top of X ray Turret. Therefore, it prevents that soldering material 36 deposits to the inside of X ray part 12 by the 1 present invention by soldering target member 24 to support member 2B at a temperature lower than the melting point of soldering material 36, and is It is, an X ray target assembly object curses -- a part method -- and swerve and be alike -- X ray target assembly object 22 by which Si manufacture was carried out is provided. According to this composition, the diffusion combination for preventing the thing which prevent substantially that anode disk 26 of target member 24 slips on stem 48 of support member 28 and which it thing K Depends, and anode disk 26 serves as disequilibrium and vibrates on stem 26 during rotation, It is formed between target member 24 and support member 28. Soldering material 36 may be allocated in another interface between target member 24 and support member 28. For example, soldering material 36 can be allocated in the side of neck portion 51 of support member 28, or opening 2 Off 0 wall of the central part in contact with this neck portion 51. However, soldering! Since it can hear deposition of A"i nature and the metal mentioned above, Anode disc 26 should not be allotted to the wall part of opening 27 of the central part which does not contact neck portion 51 when it adheres to support member 28. The reason is for in such a case, soldering material's remaining in the original state (namely, Pd-0O or Pd-N1), and not diffusing it in target member 24 or support member 28. As another method, soldering material may be allotted to the interface between Nut 54 of a TZM alloy, and screw end 53 of a TZM alloy according to the screw thread of the interface of Nut 54 of a TZM alloy, and anode disk 26 of a TZM alloy, Nut 54, or male screw end 53. In both cases, it considers appropriately so that soldering material may be covered by the member of these TZM alloys, namely, so that it may not be exposed (therefore metal depositing and twisting on the side of X ray part 38 like). the mechanical power as opposed to [ in rotation of target assembly object 22 under operation of X ray part 12 ] the other target member 24 to the method of the outside of a diameter direction from axis-of-rotation line 32 -- it is based and centrifugal force is generated. this centrifugal force is expressed by Drawing 2 with arrow 33, and it has Energetic 2 tendency so that anode disk 26 may be separated from neck portion 51 -- come out and it is. centrifugal force 33 allots soldering material 3G on clamp face 30 clearly -- therefore, this diffusion combination is not used by forming diffusion combination in the interface of bottom 29 of target member 24, and clamp face 30 of support member 28 -- core fracture power is given. On the other hand, this centrifugal force 33 will give tension or compression stress to diffusion combination formed between the wall of opening 27 of the central part of anode disk 26, and neck portion 51 of support member 28. As everyone knows, the direction at the time of being subject to the core fracture power which is not carried out rather than the case where diffusion combination receives tensile stress or compression stress is hard to be destroyed. Therefore, diffusion combination formed between clamp face 30 and bottom 29 of anode disk 26 as shown in Drawing 2, It is more desirable and also conquers the problem of tensile-compression stress which occurs in a target assembly object (that in which the stem of a support member contains soldering material) which support member 28D stem 48 explained by the paragraph of the background of an invention of this specification that comprises soldering material. Although the desirable example of the present invention was described above, besides this specific composition, the present invention can change many things and it can carry it out. - As an example, soldering material other than P 6- G o or P d-N i may also be used. Suitable materials other than a T Z M alloy may be used for support member 28, Nut 54, and target member 24.
[Brief Description of the Drawings]
the abbreviated arrangement connection diagram of the X-ray generator incorporating the X ray target assembly object by the present invention which Drawing 1 manufactured in accordance with the adherence method according to the present invention, and Drawing 2 are examples in Drawing 1 -- it is an expanded sectional view of the X ray target assembly object of an X-ray generator. Explanations of letters or numerals 24 [ ... Attachment side (the 1st page of 28) 36 / ... Soldering material ] ... XI Meta- get material 28 ... Support member 29 ... Bottom (the 1st page of 24) 30 (Besides five persons)
Every citation, both ways
| Document | Relation | Office | Cited during |
|---|---|---|---|
| JP2011238549A | Cited by | Japan | Examiner |
| US7127035B2 | Cited by | United States of America | Applicant |
| JP2012099465A | Cited by | Japan | Examiner |
| JP2016526775A | Cited by | Japan | Search report |
| JP2011238549A | Cited by | Japan | Search report |
| JPH053008A | Cited by | Japan | Search report |
| CN108907630A | Cited by | China | Search report |
| JPS49116992A | Cites | Japan | Search report |
| JPS54597A | Cites | Japan | Search report |
5 priority claims, no other members on record
Priority claims5
| Document | Office | Kind | Date |
|---|---|---|---|
| 81769286 | United States of America | A | |
| 81769286 | United States of America | A | |
| 817692 | – | – | – |
| 817692 | United States of America | – | – |
| US19860817692 | – | – | – |
Numbers
- Publication
- 62-168317
- Publication, DOCDB
- S62168317
- Publication, EPODOC
- JPS62168317
- Application
- 62003101
- Application, DOCDB
- 310187
- Application, EPODOC
- JP19870003101
Titles2
- Japanese
- 【発明の名称】拡散結合X線タ-ゲツト
- English
- DIFFUSION COUPLING X-RAY TARGET
Classification
- CPC, 8
- C23C26/00
- B23K15/0046
- B23K20/023
- B23K20/22
- B23K35/322
- C23C10/30
- H01J35/108
- H01J2235/1013
- IPC, 8
- B23K15 00
- B23K20 02
- B23K20 22
- B23K35 32
- C23C10 30
- C23C26 00
- H01J9 14
- H01J35 10