Bonding device

[Detailed Description of the Invention]

[Field of the Invention] This invention relates to the bonding device which attaches various semiconductor chips to various substrates. [Description of the Prior Art] A thick film hybrid integrated circuit attaches the circuit element of semiconductor chips, such as IC, or others to the prescribed position of 1 circuit of 1 usual board, after it connects them to the circuit pattern currently formed in the substrate, is sealed with a metal cap etc. and manufactured. Although this thick film hybrid integrated circuit had many things of comparatively simple composition conventionally, the thing of complicated composition of having attached multiple semiconductor chips of the same kind or of a different kind is increasing with diversification and advanced features of use products. Attachment of the semiconductor chip to this circuit board, Usually, predetermined [ of the circuit board by which separation formation is carried out for every one thick film hybrid integrated circuit ] applies adhesives to 1 When, conveys this in a bonding position, welds by pressure the semiconductor chip supported by the bonding head to the above-mentioned adhesives application position, and is performed. Although the high-speed highly precise bonding device welded by pressure in die bonding of the usual semiconductor device as a series of lead flakers which formed a part for semiconductor device plurality in one are also is emitted as for yFJ, This bonding device is a device suitable for producing the semiconductor device of the same variety so much continuously, and control of each part, such as Conditioning of that pressurization power, is required for it when switching variety. Therefore, it is this kind to the bonding of the thick film hybrid integrated circuit from which it is various kind small-quantity production, and the thickness of a substrate changes with Take * Ri attachment and variety two or more sorts of semiconductor chips in which thickness differs in one substrate, If a device is used, the adjustment will take time and it will be easy to produce breakage or the shortage of adhesion of a semiconductor chip and a substrate. [Objects of the Invention] In the bonding device which carries out bonding of the part I article to the part II article, even if the kind of part I article changes, enabling it to perform bonding which suited it has this invention. [Summary of the Invention] A bonding arm is formed so that at least one of the collet of this may be supported, enabling free desorption, while positioning and storing two or more kinds of collets for making two or more kinds of part I articles support alternatively to Korets j and a stocker, and it is a control means of a control device. Cholera 1~ which corresponds to the part II article from the above-mentioned collet stocker according to the kind of part I article which carries out bonding is chosen, and it was made to make a bonding arm support. [Example] Hereinafter, the example of this invention is described with reference to drawings. The bonding head section (2) which Drawing 1 is a bonding device of a thick film hybrid integrated circuit, and carries out bonding of the semiconductor chip to a circuit board in the upper surface center part of a base (1), and this bonding head section (2) are adjoined, The dispensing head section (3) which carries out dispensing of the adhesives to a circuit board is provided. And a base (1) goes and the substrate feed section (4) which supplies a circuit board to this bonding head section (2) is on right-hand side, A base (1) goes, and the chip feed section (5) which supplies a semiconductor chip is provided in left-hand side, and also the control device (6) with which the program which controls operation of these each part in the lower part of a base (1) was incorporated is formed. In order that the above-mentioned substrate feed section (4) may supply a circuit board to a bonding head section (2), In order to take out the conveyor for substrate supply (8a) formed along with the bonding head section (2) and the dispensing head section (3), and the circuit board to which bonding of the semiconductor chip was carried out from the bonding head section (2-), A conveying machine consisting of the conveyor for substrate taking out (8b) it runs to a conveyor (8a), parallel, and an opposite direction, The loader (10a) which transfers the circuit board loaded into the magazine (9a) in the shape of multi stage on the above-mentioned conveyor (8a) from the lower berth, It consists of an unloader (10b) which stores the circuit board taken out from the bonding head section (2) by conveyor (8b) at the magazine (9b) which adjoins a magazine (9a) and is located. I-lei (12) in which multiple chip feed sections (5) aligned, and stored the semiconductor chip of the JR(s), The tray stocker (13) laid by more than one carrying out alignment positioning about the tray (12) which stored the semiconductor chip of a different kind or of the same kind, The robot (14) by which the pickup head which runs in the xY direction and takes up a necessary semiconductor chip from the arbitrary tray (12) on the above-mentioned tray stocker (13) was attached, The semiconductor chip taken up by the above-mentioned pickup head is carried, and it consists of rotation Transportation[(15) which carries out the direction Conveyance of this carried semiconductor chip of the grade 1a bonding head section (2) after adjusting. The rotation conveyance table (16) which 180 degrees of this rotation conveying machine (15) rotates at a time, It consists of a pair of position adjusting tables (17) which can rotate independently, respectively so that it may be provided on - diameter of this rotation conveyance table (16) and position adjustment of the laid semiconductor chip can be carried out, this rotation conveying machine i! (15) tops -- above-mentioned Position "-- the ITV camera (18) which detects the position of the semiconductor chip which was carried out as for a Place is installed on J1 table (F). The dispensing head with which semiconductor chip attachment of the circuit board by which the dispensing head section (3) was conveyed by this dispensing head section (3) by conveyor (8a) was carried in the position at the XY table which carries out dispensing of the adhesives, It consists of an ITV camera (20) carried in the same XY table that detects the position of the above-mentioned circuit board. A bonding head section (2) should be shown in Drawing 2, The bonding head (23) carried in the XY table (22) which carries out bonding of the semiconductor chip (T) to the circuit board (B) which dispensing of the adhesives was carried out from the dispensing head section (3), and was conveyed by conveyor (8a), The ITV camera (24) carried in the same XY table (22) that detects the position of the above-mentioned circuit board (B), It is installed between a conveyor (8a) and a bonding head (23), It consists of a collet stocker (27) which positions multiple collets (26) which carry out Breathing support of the semiconductor chip which is supported by the bonding arm (25) of the above-mentioned bonding head (23), enabling free desorption, and carries out bonding to a circuit board (n), and stores them. This bonding head section (2) is explained in full detail below. Drive bag which drives the bonding arm (25) which supports a collet (26) enabling free desorption, and this bonding arm (25) as the above-mentioned bonding head (23) is shown in Drawing 3! It has (29). The sending screw (31) supported enabling rotation of both ends free to hurrah 11 (30) of this bonding head (23) that this drive (29) extended in the up-and-down direction, and was fixed to the base (1), It has flexible region-Ke which took to Nut screwed in this sending screw (31), and was kicked as for With (three persons), and a motor (33) which rotates the above-mentioned sending screw (31). By the adjustment mechanism (34), this motor (33) is attached to the frame (30) so that position adjustment is possible. A sending screw (31) rotates credit by this motor (33) via the passed belt (37) to pulley (3G) l?ff attached to the output axis of a pulley (35), and Moh and Ri (33) attached to that upper end. The maintenance object (38) holding the base end of a bonding arm (25) is attached to the above-mentioned flexible region (32), and a pair of sliders (39) are inserted in parallel with a sending screw (31) between the both-sides boards of this maintenance object (38) and a frame (30). Thereby, a flexible region (32) moves in the up-and-down direction by rotation of a sending screw (31) in support of a bonding arm (25). A speed detector (40) which detects revolving speed of a motor (33) is attached to an output axis of the above-mentioned motor (33), and a position transducer (41) which detects a rotation angle of a motor (33) is attached to it at the side opposite [ the ] to. A position of a flexible region (32) which moves in the up-and-down direction by rotation of a sending screw (31) is detected from a rotation angle of a motor (33) with the above-mentioned position transducer (41), and speed of an attitude in the position is detected from revolving speed of a motor (33) with the above-mentioned speed detector (40). The slit plate (42) which extends in the up-and-down direction in parallel with a sending screw (31) is formed in the side of a flexible region (32), and, on the other hand, parallel installation of the three photocouplers (43a) (43c) ~ is carried out in the up-and-down direction at - side of the frame (30) corresponding to this slit plate (42). It is for these slit plates (42) and photocoupler (43a) (43C) ~ regulating the starting point and the maximum minimum of a move start of the up-and-down direction of a bonding arm (25) which were supported by the flexible region (32) (32), i.e., this flexible region, if a photocoupler (43a) detects the slit of a slit plate (42) -- the [ this / Off ] -- the signal sent out to a drIJ device (6) from the photo acceptance unit of 1 and a coupler (43a) -- a motor (rotation of : (3) stops and a flexible region (32) stops at the above-mentioned starting point.) moreover -- if a flexible region (32) moves forward (descent) and a photocoupler (43b) detects the slit of a slit plate (42) -- the [ this / Off ] -- the signal sent out to control device ' (6) from the photo acceptance unit of 1 and a coupler (43b), Rotation of a motor (33) stops, and a flexible region (32) descends a little, slowing down quickly according to the inertia of each part of a subsequent drive (29), and stops in contact with the lower A 1~spittle (44) provided in the frame (30). The flexible region (32) which similarly will go up if a photocoupler (43c) detects Surin 1~ of a slit plate (42), The bonding arm (25) which stops in contact with the top stopper which does not illustrate and which was supported by the flexible region (32) of this IW Motion table device 29, It projects horizontally from the front of a frame (30), and the collet fitting part (45) which supports cholera I-(26) enabling free desorption is provided at the tip. This cholera 1-fitting part (45) consists of the 1st supporter (4G) with which a collet (26) is attached as shown in Drawing 4, and the 2nd supporter (47) that is attached at the tip of a bonding arm (25) and supports this 1st supporter (46). The 1st supporter (46) of the above. A pair of penetration holes (49) which the base of a collet (26) and the tapered shape concave hole (48) which fits in were formed in the lower end side, and carried out the opening to this tapered shape bottom and side of the concave hole (48) in the upper end side (50) is formed. This penetration hole (49) is a vacuum suction hole for carrying out adsorption support of the collet (26) which fitted into the tapered shape concave hole (48). A penetration hole (50) is a vacuum adsorption hole for it being open for free passage with the cholera hole (51) which fitted into the tapered shape concave hole (48), and adsorbing a semiconductor chip (T). These penetration holes (49) In (50), it is a pipe (52). It is equipped with (53) and they are these pipes (52). Flexible hose (54) attached to (53) It is connected to the source of a vacuum via (55) and the electromagnetic valve which is not illustrated. A pair of concave holes (57) which swerve and equip the upper end part side of this 1st supporter (46) with a You 9 compression coil spring (56) are arranged in parallel and provided in the direction perpendicular to space. The end part is supported by the support pin (58) in which each press-fit coil spring (5G) with which This J Si concave holes (57) were equipped was attached to the bottom of each concave hole (57). The 2nd supporter (47). Pipe (52) of the 1st supporter (46) of the above Hose (54) attached to (53) It has a pair of support pins (60) which support the other end of the compression coil spring (5G) provided with (55) corresponding to an insertion To shake insertion hole (59) and each concave hole (57) of the 1st supporter (46) of the above. These 1st and 2nd supporters (46) (47), A pair of guide pins (61) attached to the both-sides side of the 1st supporter (46) ', The minor axis in which Both of the 2nd supporter (47) was provided by the side corresponding to the guide pin (61) of this 4' versus 1 is connected in the direction of l+I+ of the collet (26) supported by J:To and the 1st supporter (46) at the long hole (62) formed similarly to the diameter of a guide pin (61), enabling a free attitude. And when load is not added to the collet (26) which the 1st supporter (4G) was energized in the direction carried out between chickens from the 2nd supporter (47) with the above-mentioned compression coil spring (56), and was supported by the 1st supporter (46) of the above, It acts to the end of the major-axis direction of a long hole (62) as a Pressure 1 concubine of the guide pin (61). At least one of the long holes (62) provided in the both-sides side of the 2nd supporter (47) of the above An electric insulating plate and an electric conduction board are piled up, it attaches so that an electric conduction board may be insulated with the 2nd supporter (47) with this A a' board, as shown in Drawing 5, the long hole (62a) which has a diameter of a guide pin (61) and a minor axis of the same length in an electric insulating plate is formed, and it is to - right electrocardio board. The major axis is shorter than the major axis of this Crossing line length hole (62a), a minor axis forms a long hole (62b) longer than the minor axis of the long hole (62a) of this electric insulating plate in the same mind same axle, this electric conduction board is used as one electrode, and it is considering a guide pin (6I) as an electrode of another side □, It can use as a touch sensor which projects the attitude of the 1st supporter (61) to the 2nd supporter (62). A collet (26) makes a tip side a semiconductor chip support face, as shown in Drawing 6, and the fitting part (64) of the shape of a truncated cone which fits into the tapered shape concave hole (48) formed in the base end side at the 1st supporter (46) of the above-mentioned collet fitting part (45) is provided. The vacuum adsorption hole (65) which carries out an opening to the tip side established in order to carry out adsorption support of the semiconductor chip (T), the penetration hole (50) formed in the 1st supporter (46) when it extended in accordance with the central axis of cholera h (26), the opening of that base end side was carried out to the side of a fitting part (64) and this fitting part (64) was fitted into the tapered shape concave hole (48) of the 1st supporter (4G), and free passage To shake -- it is like. this vacuum adsorption hole (65) and a penetration hole (50) -- which free passage -- exact -- Here -- To be -- in order to make it like -- the side of a fitting part (64) It has the position mating face which the position mating face (66) from which the part was cut in respect of being parallel to a central axis was formed, and was formed in the shape to which the tapered shape concave hole (48) of the 1st supporter (4G) corresponds on the other hand. The thing of this position Fittel it was made to be mostly located in the central part is shown for the opening of the vacuum adsorption hole (65) especially in the drawing. According to the size of the semiconductor chip (T) in which this cholera h (26) carries out adsorption support, Into from which the size of a tip side differs is prepared for the thing of several ton+Rm. Two or more kinds of this collet (26) is stored by the cholera 1-stocker (26) installed before the bonding head (23). This collet stocker (26). As shown in Drawing 7 (A) and (0) figures, it is a constant interval at the 1 side side of a block member, The slot with the stage (67) which inserts the tip part of each collet (26) and the Nemoto portion of a fitting part (64) is formed, and it is a center & mark of compatibility (67), With the mark (68) provided in the specific related position to the specific position or compatibility (67) of this block member, addressing is carried out to the memory of Controller[(6). How to carry out operation of this bonding head section (2) to the next, and carry out bonding of the semiconductor chip (T) to a circuit board (B) is described. The collet (26) corresponding to the semiconductor chip (T) attached to the circuit board (B) conveyed by Transportation [(13a) shall be first supported by the bonding arm (25) of a bonding head (23). If the circuit board (B) to which dispensing of the adhesives was carried out in the dispensing head section (3) is conveyed by the Bond ink head part (2) with a conveying machine (8a), the ITV camera (24) first carried in this Bond ink head part (2) will detect that position. The detection information on this Engineering TV camera (24) is compared with a standard pattern in a control device (6), and the amount of position gaps is computed. On the other hand, when the detection information on this ITV camera (24) is sent out to a control device (6), a control device (6) is, A control signal is sent out to the XY table (22) which carries the bonding head (23), Rotation Transportation moves a bonding head (23) in the direction of (15), and it positions it correctly on cholera 1-the semiconductor chip by which ing position adjustment was carried out [ (26) ] in installation on the position adjusting table (17) of a rotation conveying machine (15) (T) supported by the bonding arm. The control signal sent out from a control device (6) after this positioning is completed, The motor (33) of a bonding head (23) sends, a screw (31) is rotated, and the bonding arm (25) supported by a flexible region (32) stopped in the starting point position and this flexible region (32) is advanced in the direction of the above-mentioned semiconductor chip (T) (descent). This forward speed is controlled by the signal acquired from the speed detector (40) attached to the motor (33) according to the program included in the control device (6). The position transducer (41) attached to the motor (33) detects the advance position, and makes the above-mentioned semiconductor chip (T) weld by pressure by fixed pressurization power by the collet (26) supported by the bonding arm (25). The 1st supporter (46) that supports cholera 1-(26) at this time resists energization of a compression coil spring (56) according to the above-mentioned pressurization power, and retreats a little. When cholera 1-(26) welds by pressure to a semiconductor chip (T), an electromagnetic valve is operated, the vacuum adsorption hole (51) of a collet (26) is connected to the source of a vacuum, and the tip side of a collet (6) is made to carry out adsorption support of the semiconductor chip (T) with the control signal sent out from a control device (6). When cholera I" (26) adsorbs a semiconductor chip (T), a motor (33) sends, a screw (31) is rotated and a flexible region (32) is made to starting point position many Return with the control signal sent out from a control device (6). The stop of a flexible region (32) in this starting point is performed based on the signal sent out from the photo acceptance unit of this Fo 1-white turnip (43a), when a photocoupler (43a) detects slit F;t (42). The control signal which will be sent out from a control device (6) based on the amount of position gaps computed from the detection information on the above-mentioned ITV camera (24) if a flexible region (32) returns to the starting point, An XY table (22) is moved and grade carries out [ Can ] of cholera 1-(26) which is carrying out adsorption support of the semiconductor chip (T) correctly on the semiconductor chip attaching position of the above-mentioned circuit board (Ro). And a flexible region (32) is advanced and the semiconductor chip (T) by which adsorption support was carried out at cholera 1-(26) is made to weld by pressure to the semiconductor chip fitting part of a circuit board (B) by fixed pressurization power by rotation of a motor (3:l). signal 1 (Based on -- divided.) sent out from a speed detector (40) and a position transducer (41) according to the program included in the control device (6) like the time of adjustment of the pressure welding power at this time carrying out adsorption support of the above-mentioned semiconductor chip (T)" The control signal which will be sent out from a control device (6) if the semiconductor chip (T) by which adsorption support was carried out is welded by pressure to cholera h (26) at circuit board (Ro). The above-mentioned electromagnetic valve is switched, air is introduced into a Vacuum suction 2a hole (51), and adsorption of a semiconductor chip (T) is canceled. And with the control signal sent out from a control device (6), a flexible region (32) is operated to a return or adsorption support of the following semiconductor chip (T) at the starting point. Exchange of the collet (26) supported by the bonding arm (25), DJ seen out from a control device (6) -- moving an XY table (22) from a double signal A collet fitting part (45) is moved onto a collet stocker (27), and the specific mark (68) formed in the specific position of a collet stocker (27) or this collet stocker (27) with -ITV camera (24) is detected. And the amount of position gaps is computed by comparing the detection information on this ITV camera (24) with the standard pattern memorized in the control device, Based on this amount of position gaps, it is Wit of a predetermined address about the collet (26) currently supported by the bonding arm (25). It positions correctly on (67). Appropriate after control device i! With the control signal sent out from (6), a motor (33) is made to rotate, a flexible region (32) is advanced, and the tip part of the collet (26) supported by the above-mentioned bonding arm (25) is inserted all over the slot (67) of a collet stocker (27). The signal by which advance of the flexible region in this case (32) is sent out according to the program included in the control device (6) from the speed detector (40) and position transducer (41) which were attached to the motor (33), It is controlled to stop, just before the fitting part (64) of a collet (26) contacts the upper surface of a collet stocker (27). When advance of this flexible region (31) stops, an electromagnetic valve is operated, air is introduced into 1 penetration hole (49), and vacuum adsorption support of a collet (26) is made to cancel with the control signal sent out from a control device (6). And this collet (26) that was carrying out vacuum adsorption support is stored in predetermined W (6, 7) of a collet stocker (27). If the collet (26) by which adsorption support was carried out is released, a flexible region (32) will be returned to the starting point with the control signal sent out from a control device (6). And an XY table (22) is moved and the tapered shape concave hole (48) of the collet fitting part (45) attached at the tip of a bonding arm (25) is correctly positioned on another collet (26) stored by the collet stocker (27). A flexible region (32) is advanced and the fitting part (64) of the above-mentioned collet (26) is made to insert into a tapered shape concave hole (48) with the control signal sent out from appropriate after control device F (6). Advance of the flexible region in this case (31) is the same as that of the case where the collet (26) which carried out [ above-mentioned ] adsorption support is stored to a collet stocker (27), According to the program included in the control device (6), it is controlled by the signal sent out from the speed detector (40) and position transducer (41) which were attached to the motor (33). By advance of this flexible region (32), a collet (26) fits in correctly, while position amendment is carried out by the position mating face formed in the both sides of this collet (26) and a tapered shape concave hole (48). If advance of this flexible region (32) stops, with the control signal sent out from a control device (6) next, an electromagnetic valve is operated, a penetration hole (49) is connected to the source of a vacuum, vacuum adsorption will be carried out and the collet (26) inserted in the tapered shape concave hole (48) will be supported. And a bonding arm (25) is retreated and it is made to return to the starting point with a flexible region (32). When the above-mentioned touch sensor is used in operation of this bonding head section (2), Both when attaching to a circuit board (B) the semiconductor chip (T) in which both in case the collet (26) supported by the bonding arm (25) carries out adsorption support of the semiconductor chip (T) were contacted and adsorption supported contact is detected. Advance of a subsequent flexible region (32) can be controlled and pressurization power when welding by pressure pressurization power and the semiconductor chip (T) by which adsorption support was carried out when carrying out adsorption support of the semiconductor chip (T) to circuit board CB can be controlled uniformly more correctly. When exchanging collets (26), contact with a collet (26), a collet stocker (27), or a collet fitting part (45) can be detected, and collets (26) can be exchanged more certainly. Two or more kinds of collets are prepared as mentioned above, and they are stored to the prescribed position of a stocker to cholera 1 the address was remembered to be by the control device, If exchange of this collet is controlled by a control device, according to g1 class of a semiconductor chip, a necessary collet can be chosen automatically, and always proper bonding can be performed. Bonding head. Since it is only supporting one collet, the weight saving of the bonding arm can be carried out, and it can be considered as a high-speed highly precise bonding device.

[Brief Description of the Drawings]

The perspective view and Drawing 2 in which Drawing 1 shows the whole bonding device of this invention are perspective views of that bonding head section, The sectional view in which Drawing 3 shows the structure of the bonding head, the sectional view in which Drawing 4 shows the structure of a collet fitting part, and Drawing 5 are [ the figure of a collet, Drawing 7 (A), and the (B) figure of the figure of a touch sensor and Drawing 6 ] the top views and front views of a collet stocker, respectively. (2) ... Bonding head section (3) ... Dispensing head section (4) ... Substrate feed section [ (5) ... Chip feed section (6) ... Control device ] (22) ... XY table (23) ... Bonding head (24) ... ITV camera (25) ... Bonding arm [ (26) ... Collet (27) ... Collet stocker (45) ] [ ... Cholera 1-fitting part ] (48) ... Tapered shape concave hole (40) (50) ... Penetration hole (51) ... Vacuum adsorption hole (56) ... Compression coil spring [ (64) ... Fitting part (67) ... Slot (mouth) ] [ ... Circuit board (T) ] [ ... Semiconductor chip representative ] [ Patent attorney Drawing / of the Inoue-man / 1 - ] Drawing 2 L Drawing 3 Drawing 4