Method for mounting hybrid integrated circuit

[Detailed Description of the Invention]

[Field of the Invention] This invention relates to the mounting technology to electric circuit boards, such as a semiconductor and electronic parts. [Background of the Invention] When workability was excellent in the mounting process of a hybrid integrated circuit (hybrid IC) conventionally or Flonle dulling was used, electronic parts etc. could be mounted only in one side, but there was a fault that packaging density became low. considering various methods, in order to solve this fault, but piling up the back comrade of two electric circuit boards (1) which ff15 figure Like(ed) < A base(ed), and facing horseshoe-shaped metal fittings (2) across that side edge part -- both electrical link and fixation -- simultaneous -- Window like this -- its attention is most paid in things at present. As for (3), in a figure, a semiconductor and (5) are terminals electronic parts and (4). However, when horseshoe-shaped metal fittings (2) were used, it was needed also with Handa from the field of the Debt property of connection, and had led to the manufacture top cost rise. [Objects of the Invention] It aims at connecting two or more electric circuit boards simultaneously with fixation of other electronic parts using this invention beam Flonle dulling, and skipping a process, and attaining the miniaturization of a hybrid IC. [An indication of an invention] the portion to which the place made into the gist of this invention applied the solder paste on an electric circuit board -- with Handa -- setting up an easy mailbox It is a mounting method of the hybrid integrated circuit carrying other electric circuit boards via a solder paste, and unifying an up-and-down electric circuit board by Refluelder rings on post [ the ]. This invention is explained in plan 1 figure and Drawing 2 based on illustration To 1 example below. The solder paste (6) is applied to mount parts, such as electronic parts (3) of electric circuit board alpha, and the set-up terminal area of post (7) which come to the upper part and the bottom first. Establishment applies the solder pace (6) for the Standing-up terminal area which connects the upper end of post (7) set up to the electric circuit board (1) which comes to the upper part. Generally the Standing-up terminal area of post (7) is provided in four corners of an electric circuit board (1). And when the electric continuity between electric circuit boards (1) allotted up and down is required, the male part terminal area needs to be Turmill of an electric circuit. Mount parts which come to the upper part, such as electronic parts (3) of an electric circuit board (1), are provided in the upper surface. It continues, and electronic parts (3) etc. Tower and set up post (7), and it lays an up-and-down electric circuit board (1) on top of the mount part of electronic parts (3) and the Standing-up terminal area of post (7) which applied the above-mentioned solder paste (6). Using an easy metal of soldering of copper, iron, etc., the solder paste is applied also to the surface here if needed as post (7). If it puts into a reflow furnace and a solder paste is fused in the above-mentioned state, the connection unification through post (7) of Handa and an up-and-down electric circuit board (1), such as electronic parts (3), can be performed simultaneously. In order to make it flow through an up-and-down electric circuit board (1) electrically, it is necessary to connect the set-up terminal area of post (7) provided in the surface of the upper electric circuit board (1) by an electric circuit on top and through hole (8) like the example shown in Drawings 6 and 4, for example. Although the example shown in these Drawings 6 and 4 is an example in the case of Tower(ing) a small hybrid IC as one electronic parts to other large-sized hybrid ICs, Since the lead terminal was conventionally provided in the small electronic-parts side one by one in this case, it can also be said that it is in the advantage which can remove the work of this invention i If it is good. [Effect of the Invention] According to this invention, two or more electric circuit boards are simultaneously connectable like the above at the time of fixation by SOFLOON RUDERING, such as other electronic parts, and it can attain the miniaturization of A \ eve lid IC by superposition of an electric circuit board.

[Brief Description of the Drawings]

Applicant for a patent Matsushita Electric Works, Ltd. Representative patent attorney Bamboo Former Toshimaru (Two others) Drawing 1 3 Drawing 2 Drawing S Drawing 3 Second figure