Nova Patents
JPS609596A

Copper alloy solder

Abstract

(57) [Abstract] Since this gazette is application data in front of an electronic application, the data of an abstract is not recorded.

Term

Term ended

Projected expiry passed 8 June 2004, 22.3 years ago.

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3 claims: 2 independent, 1 dependent

  1. 1
    [Claim(s)] 【特許請求の範囲】 1 Copper alloy solder by which 0.5~20% of cobalt being included by weight. 1 重量で0.5~20%のコバルトを含むことを特徴とする銅合金はんだ。 Solder given in the 1st paragraph characterized by comprising the following of a claim, It is division weight and is 88~97% of silver. It is weight and is 1~12% of cobalt. It is weight and is 0.05~0.5% of carbon especially O~0.6%. A solder ingredient usual to the remainder. 区 重量で88~97%の銀と、重量で1~12%のコバルトと、重量でO~0.6%、特に0.05~0.5%の炭素と、残部に通常のはんだ成分とを含む特許請求の範囲第1項に記載のはんだ。 & 重量で少なくとも91%の銅と、重量で2~8%のコバルトと、重量で0.4%までの炭素とを含む特許請求の範囲第1項に記載の銅合金はんだ。 Copper alloy solder given in the 1st paragraph characterized by comprising the following of a claim, & It is weight and is at least 91% of copper. It is weight and is 2~8% of cobalt. It is weight and is the carbon up to 0.4%.
  2. 3
    7、 重量で92~96%の銅と、重量で4~8%のコバルトと、重量で0,05~0.6%(また特に0.05~Q、5%)の炭素とから成る非鉄合金。 A non-iron alloy comprising:7, It is weight and is 92~96% of copper. It is weight and is 4~8% of cobalt. It is weight and they are 0 and 05~0.6% (again especially 0.05~Q, 5%) of carbon. & Copper alloy solder given in any 1 paragraph of the 1~7th [ range ] paragraphs of an application for patent used for soldering steel to hard metal, especially WG-Go hard Affiliation. & 硬質金属、特にWG-Go硬質合属に鋼をはんだ付けするのに使用する特許請求の範囲第1~7項のいずれか1項に記載の銅合金はんだ。