Copper alloy solder
Abstract
(57) [Abstract] Since this gazette is application data in front of an electronic application, the data of an abstract is not recorded.
Term
Term ended
Projected expiry passed 8 June 2004, 22.3 years ago.
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3 claims: 2 independent, 1 dependent
- 1[Claim(s)] 【特許請求の範囲】 1 Copper alloy solder by which 0.5~20% of cobalt being included by weight. 1 重量で0.5~20%のコバルトを含むことを特徴とする銅合金はんだ。 Solder given in the 1st paragraph characterized by comprising the following of a claim, It is division weight and is 88~97% of silver. It is weight and is 1~12% of cobalt. It is weight and is 0.05~0.5% of carbon especially O~0.6%. A solder ingredient usual to the remainder. 区 重量で88~97%の銀と、重量で1~12%のコバルトと、重量でO~0.6%、特に0.05~0.5%の炭素と、残部に通常のはんだ成分とを含む特許請求の範囲第1項に記載のはんだ。 & 重量で少なくとも91%の銅と、重量で2~8%のコバルトと、重量で0.4%までの炭素とを含む特許請求の範囲第1項に記載の銅合金はんだ。 Copper alloy solder given in the 1st paragraph characterized by comprising the following of a claim, & It is weight and is at least 91% of copper. It is weight and is 2~8% of cobalt. It is weight and is the carbon up to 0.4%.
- 37、 重量で92~96%の銅と、重量で4~8%のコバルトと、重量で0,05~0.6%(また特に0.05~Q、5%)の炭素とから成る非鉄合金。 A non-iron alloy comprising:7, It is weight and is 92~96% of copper. It is weight and is 4~8% of cobalt. It is weight and they are 0 and 05~0.6% (again especially 0.05~Q, 5%) of carbon. & Copper alloy solder given in any 1 paragraph of the 1~7th [ range ] paragraphs of an application for patent used for soldering steel to hard metal, especially WG-Go hard Affiliation. & 硬質金属、特にWG-Go硬質合属に鋼をはんだ付けするのに使用する特許請求の範囲第1~7項のいずれか1項に記載の銅合金はんだ。
Independent claims2
2 paragraphs, as filed
[Detailed Description of the Invention]
(Field of the Invention) The present invention relates to the copper alloy solder which has the character of copper alloy solder, especially reaction solder. since soldering is comparatively performed at high temperature as for this kind of solder -- with wax -- business -- also calling it wax -- Enemy and To 0 (PRIOR ART) Copper solder and copper alloy solder are known over many years as hard solder. It is known to use the solder material which comprises copper chiefly, and 40~60% of copper, and 0.2% of silicon [ a small amount of ] and the copper alloy solder the remainder is [ solder ] with zinc or additional nickel are also known, for example by weight in weight. Copper solder and copper alloy solder have the character to react with the steel which should be soldered, hard metal, etc., and since they form the compound which comprises a solid solution and/or regular composition by that cause, they are also called reaction solder. solder, such as this, -- especially -- the hard solder of Loose cast iron and hard metal -- that is, it is widely used for manufacture of machine parts, devices, instruments, tools, electric motors, etc. noting that it be wax - attached. the case of soldering of this alloy which carried out D relation and replaced Te, steel, the tungsten carbide cobalt alloy, or the cobalt binding material in part with other metal (for example, nickel) -- the inside of a vacuum or protective gas -- for example, more than [ 1100 degreeC ] -- as for soldering, work is comparatively done at high temperature. (Problem which an invention tends to solve) The result obtained is not completely satisfactory when soldering steel to hard metal, using known solder, such as this. For example, it produces, the dissociation phenomenon, i.e., the separation, along the particle boundary of steel, therefore static and dynamic strength fall. It decreases remarkably, especially the toughness of steel of a zone, i.e., the viscosity, that caused this dissociation. On the other hand, in the case of hard metal, a weak zone occurs by diffusion according to brittleness-izing of an edge zone, formation of an intermetallic compound, and the kill Kendall (Kirkendall) effect. When soldering especially steel to hard metal, the portion to which carbon decreased in number especially to some hard metal is produced, and it becomes a concavo-convex layer. For this reason, a bad result nonpermissible about especially shock stress is brought. (Means for solving a problem) It is a surprising thing to have discovered that faults, such as this, could be removed by using the copper alloy solder which contains 0.6~20% of cobalt by weight. This 1 of the quantity up to 0.8% which makes silicon and carbon exist in this alloy is made by the copper which constitutes the principal part of a solder alloy, and especially weight other than the above-mentioned cobalt. A solvent, a binding material, and/or the solvent in which especially soldering volatilizes at temperature in the case of powder solder, The organic compound which becomes instead of or exists besides carbon, the substance which increases intensity, metal, and nonmetallic and an organic matter can be added as Additives. [ the rate of the carbon which emits carbon and is existing under the conditions of soldering ] Especially, the composition of the ordinary solder which 0~0.6% of carbon (it is 0.05~0.5% of carbon at weight especially again) was preferred, and was first explained as Ah]--Li and the other remainders by 1~12% of cobalt and weight with 88~97% of copper and weight by weight may be added. It is preferred to contain the carbon up to 0.4% by 2~8% of cobalt and weight with 91% of copper and weight by weight at least especially. In one suitable operation, the carbon up to 0.6% is especially contained by 8~6% of cobalt, and weight with 94~97% of copper, and weight with weight. It is preferred that the content of cobalt is especially between the weight which soldering dissolves in the maximum at temperature as 1% by weight. The carbon which exists in present invention copper alloy solder can be made to exist as an organic substance which forms the suitable amount of carbon as a saturated Coo alloy as composition especially mixed when it was powdered solder. It is suitable to solder steel to the tungsten carbide cobalt hard monetary value where present invention steel alloy solder usually contains WO, Co, and C at a specific rate especially especially effective in soldering steel other than the solder of steel and cast iron to hard metal. It can also be used for soldering steel to titanium carbide or tantalum carbide base hard metal containing the metal of others like cobalt or nickel as a binding material. The present invention relates to at least 91% of copper, and the non-iron alloy which comprises 3~8 charge's cobalt, and the carbon of 0.05~0*5% of weight Te by weight by weight. In this case, it is good to include the carbon of 0.05~0 and 5 arc especially 0.05~0.6% by 4~8% of cobalt, and weight with 92~98% of copper, and weight by weight. Alloys, such as this, are used for soldering steel to hard metal like - tungsten carbide cobalt base metal especially as reaction solder, and are advantageous. (EXAMPLE) In the working tool of the rock which soldered the hard metal plate at the tip of a tool, or a stone, the intensity which soldered hard metal to steel was studied. The number of the holes punched using such ten tools soldered with copper solder and ten tools soldered with present invention solder was compared. The following result was obtained. the character of present invention solder is remarkably excellent from the above result -- it is clear. Patent appearance m person The Hilty Actenge / shaft zetaOr
Every citation, both ways
| Document | Relation | Office | Cited during |
|---|---|---|---|
| US6690544B2 | Cited by | United States of America | Applicant |
| US6278582B1 | Cited by | United States of America | Applicant |
| US6504680B2 | Cited by | United States of America | Applicant |
| JPS62259696A | Cited by | Japan | Search report |
10 members in 6 offices
Priority claims2
| Document | Office | Kind | Date |
|---|---|---|---|
| 3321437 | Germany | A | |
| P33214379 | Germany | – | – |
Members10
| Document | Office | Kind | |
|---|---|---|---|
| DK89484D0 | Denmark | D0 | |
| GB8405078D0 | United Kingdom | D0 | |
| DK89484A | Denmark | A | |
| GB2141439A | United Kingdom | A | |
| DE3321437A1 | Germany | A1 | |
| JPS609596AThis record | Japan | A | |
| US4518662A | United States of America | A | |
| GB2141439B | United Kingdom | B | |
| CH658215A5 | Switzerland | A5 | |
| DK171692B1 | Denmark | B1 |
Numbers
- Publication
- 60-9596
- Application
- 11677184
Titles2
- Japanese
- 【発明の名称】銅合金はんだ
- English
- COPPER ALLOY SOLDER
Classification
- CPC, 2
- B23K35/302
- Y10T428/1291
- IPC, 2
- C22C9 00
- B23K35 30