Semiconductor device

[Detailed Description of the Invention]

(a) The technical field of an invention The present invention relates to the semiconductor device of the airtight structure which carries out glass closure, especially improves airtightness, and relates to the leadframe shape which can bear an external shock. (b) The technical background Usually, external Pig environment of the semiconductor device of which high-reliability is required, chemical and for example, considering it as the hermetic sealing structure where mechanical stress is not received, is common. There is Saldaepu (Cer-Dip) m which used glass for Sealing, such as a ceramic container which stored the semiconductor chip, and it is used abundantly from the profitableness of a cost side. Generally it becomes chemical and the cause from the outside in which the device design of the semiconductor device is made on the assumption that mechanical stress is eased by a semiconductor package that degradation and the circuit pattern on the surface of an element of airtight [ of a semiconductor package / poor ] are poor. Therefore, to consider it as the structure where it can bear enough to a mechanical shock or a heat shock is desired. (C) Conventional technology and a problem The sectional view in which Drawing 1 shows a Sir A dog type semiconductor device, and Drawing 2 are top views showing a notch There was semiconductor device for the upper surface of Drawing 1 part. Bonding connection of the pad for signal wire connection and leadframe 3 which mounted semiconductor chip 2 to four copies of medium fire of base 1 formed by heat-resistant insulating phases, such as ceramics, in Drawing 1, and it had around semiconductor chip 2 is made with wire 4. At base 1, glass closure is carried out and cap 5 of ceramics or metal is covered. A coating is given to the restraint portion of Ahead base 1 and cap 5 with sealing glass 6.7, and fusion fixation of What-A 1, leadframe 3, and the cap 5 is carried out in one by heating. Generating of the air bubbles of a glass sealed part poses a problem as the semiconductor package Accompany(ed) - stored at high integration of semiconductor chip 2 is enlarged and the number of bottles of terminal 8 for connection increases. The example is shown in Drawing 2. if air bubbles 8 are intercepted with the open air, an interval is maintained enough with the boundary and it is shut up in the inside of a closure field -- But -- it is desirable. It generates to the both ends which lengthened lead length of leadframe 3 notably [ a closure field is large, namely, ] as enlargement of a semiconductor package progresses in recent years. For this reason, Establishment considers projection 3a at the termination of leadframe 3 so that generated air bubbles 8 may not leak outside, but sufficient effect is not expectable. the atmosphere closes generating of Or \ Bubbles at the time of superposition of base 1 and cap 5, and, in the temperature distribution at the time of heating, dissolution of unevenness and Legacy 2 A also advances irregularly in lump Being or the semiconductor package formed into base 1 -- a cause of cellular generating, To fl, and ing. interval l with the open air used as big air bubbles in which air bubbles 8 arrive at a boundary with the open air ranging over between the leads of leadframe 3 case [ the open air ] namely, illustrated -- small -- Morning -- the external stress which is alike and takes and is added to a lead terminal stop a crack to a glass sealed part and the airtightness of a semiconductor device deteriorates -- a half -- bath -- the body -- an element -- the characteristic -- it is affected and becomes easy to damage by external @ Shock. (d) The object of an invention An object of the present invention is to measure offer [2 and airtight improvement for the leadframe shape which may shut up the air bubbles generated at the time of crow closure within closure in view of the above-mentioned point. (Constitution of e] invention) air bubbles which the above-mentioned object holds a plurality of leads in the present invention between a substrate and a lamina tecti which carry a semiconductor chip, paste up 1, the substrate, and this A rose board with glass, and arise in the case of glass closure -- Imperium j To be able to -- an interval of the lead adjacent [ like ] -- partial -- extensive To. Therefore, it can be reached. (f) The example of an invention The example of the present invention is explained in full detail with a drawing below. Drawing 3 is a top view of the semiconductor device which provides and constitutes the cavity part for cellular confinement between the leads of the leadframe which is one example of the present invention. Leadframe 11 makes it curve led type 1 in a figure, and it forms circle-shaped cavity part 12 in the closure field which maintained sufficient interval from the boundary with the open air. In the range which does not decrease this cavity part 12 Mounting area, taking greatly is desirable. It is made to shut up compulsorily air bubbles 13 generated at the time of the glass closure mentioned above in this cavity part 12. Since cavity part 12 is maintaining distance enough from the interface with the open air, it can take large interval l of the end face of air bubbles 13, and the external world, can maintain a glass seal part enough, and can maintain predetermined closure intensity. Without changing the shape of a A stiffness semiconductor bread cage into considering it as such a Ri-Do 7 Rehm structure, it can be coped with by changing leadframe shape, and airtightness improves. It is airtightness (carrying out on a Ke time) by considering it as the leadframe shape of the present invention, as beyond the effect of the Good (9) invention explained to details, when it is not restricted to this, the large opening interview could be taken and interval l with the external world could moreover be secured, although it was considered as approximate circle-shaped cavity part 12 in this example. The semiconductor device which can bear external stress is obtained.

[Brief Description of the Drawings]

Drawings 2 are a sectional view in which Drawing 1 shows a Sir tip type semiconductor device, and a top view showing a notch There was semiconductor device for the upper surface of Drawing 1 part, One in O figure which is a top view of the semiconductor device which Drawing 3 provides the cavity part for cellular confinement between the leads of the leadframe which is one example of the present invention, and it constitutes ... Base, 2 ... semiconductor chip, 3.11 ... leadframe, 4 ... wire, 5 ... a cap and 6*7 ... Sealing glass, 8.13 and air bubbles, 12 ... Cavity part.