Manufacture of photo coupler

[Detailed Description of the Invention]

b) Field of the Invention The present invention relates to the manufacturing method of the optical joint machine with which the light emitting element and the photo acceptance unit were juxtaposed. Mouth conventional technology In the optical joint machine covered to lead tongue-shaped piece Oil by light emitting element 02, a photo acceptance unit (parallel arrangement of the optical semiconductor of the 121st grade is carried out, and it is light transmission resin 04), and light reflex resin 06 as conventionally shown in @1 figure, For light reflex resin 1[ii aiming at reflection and the improvement in withstand voltage, it is lead tongue-shaped piece alpha 11 (since 111 is being isolated, and also the comparatively wide range is covered and the surface area of Cut, the metal small-gage wire for wiring (13), and (13) is small). It is especially metal axis alpha 3 (the thing [ as ] for which light reflex resin (1G) was flipped in the circumference part of 131 and which do not carry out Si adhesion arose.). Since this serves as change of a light reflex side or light reflex layer thickness, it differs in an optical transfer characteristic for every optical joint machine, and it produces the resisting pressure fall of a dielectric breakdown, disconnecting only in the electric field in hundreds Porto, and neither is preferred. C) The object of an invention The present invention was made in order to change an above-mentioned point, and it provides the manufacturing method of the optical joint machine to which the Seduction mold method of reproducibility is applied especially. 2) Constitution of an invention After the present invention covers an optical semiconductor by light transmission resin, before carrying out the mold of it by light reflex resin, it immerses the field by the side of an OPTO semiconductor device in non-hardening resin, gets wet, To hurt a sex, and explains the present invention in detail based on an example below. Ho) EXAMPLE Drawing 2 (a) thru/or (d) is a flowchart explaining the Production method of the optical joint machine of a present invention example. A plurality of lead tongue-shaped pieces (1) by which the leadframe which consists of copper, iron, etc. first was isolated, and proximity arrangement was carried out, (1) ... Above, Optical semiconductors (2) and (2), such as a light emitting diode which consists of GaAs(es), and a photo-transistor which consists of Si(s), are laid in the field of the same side, and it wires by metal m line f3f3, such as a gold streak and a wire of aluminium. And To fight both optical semiconductors+21 (2) by light transmission resin (4) like silicon resin, Since this light transmission resin (4) determines light and a Crowded field and it is related to f It was direct target at the amount of optical transfer, As shown in Drawing 2 e, they are an optical semiconductor (2), (2), and its optical semiconductor (2) (2+ laying and coming out and covering only the tip of a certain lead tongue-shaped piece (1) and (1)). metal small-gage wire (3) and (3) carries out wire Ponding, and comes out, it may be more desirable not to cover a certain lead tongue-shaped piece (1) and (1), next it is shown in the figure (b) -- as -- the optical semiconductor (21(2) installation side is turned down, and it is immersed in unhardened resin (5) and pulls up.) of a lead tongue-shaped piece (1) and (1) Light reflex which mentions unhardened resin (5) below preferably! ll: Although it is the same material as resin, the resin which has the same affinity may be sufficient. These resin (5) is not laminated like a mold only by wetting the surface of the member which immersed. It is a metal small-gage wire (3) (31 and the light transmission resin (4) surface of the circumference of it get wet, and a sex becomes good.) especially by this process. Then, as shown in Drawing 2 (C), it is optical semiconductor+21 (light reflex resin (6), such as silicon resin in which the light reflex agent was mixed from the side which does not have 2+, is poured.). Although it becomes the predetermined shape which light reflex resin (6) flows below and covers the whole light transmission resin (4) surface at least with surface tension, it gets wet at the above-mentioned process, and the portion which became good [ a sex ] adheres certainly. Although it is Drawing 2 (d) which made it harden in this state, a mold is carried out once again by a black epoxy resin if needed, or it is a lead tongue-shaped piece (1) and (1)... Connecting part (11(1) ' is cut.) What) EFFECT OF THE INVENTION The process of carrying out an optical semiconductor device to the 1st page of a plurality of lead tongue-shaped pieces by which the present invention was isolated and proximity arrangement was carried out like the above, and covering an optical semiconductor by light transmission resin at least, The process which contacts the light transmission resin surface by the side of the field which carried out the optical semiconductor device at least to resin, Since it is a manufacturing method of the optical joint machine possessing the process of covering light transmission resin and the approaching lead tongue-shaped piece by light reflex resin, light reflex resin can improve [ reproducibility ] a mold certainly, withstand voltage can also secure more than 6000V1 second, as for it, an optical transfer characteristic is also stabilized, and it can be produced with sufficient yield Freezing.

[Brief Description of the Drawings]

Drawing 1 is a flowchart the sectional view of an optical joint machine and Drawing 2 (a) thru/or (d) explain the manufacturing method of optical combination g of a present invention example to be. (11 (1) ......... A lead tongue-shaped piece, (2), (2) ...... An optical semiconductor, (3), (3) ...... A metal small-gage wire, (4) (4+ ...... [ Light transmission resin, (5) ] .... - and resin, (6) ...... light reflex resin)) -42(