Package for semiconductor device

[Detailed Description of the Invention]

This invention relates to improvement of the package for semiconductor devices. Drawing 1 is a sectional view showing the typical example of the conventional package for semiconductor devices, The die pad part by which f1+ was formed in the package body and (2) was formed in the central bottom, The inner lead part by which (3) was formed in the inner side edge part, the external lead by which (4) was pulled out from the inner lead part (3) in the exterior of package body fil, The semiconductor device by which (6) was mounted by the lid of the package and (6) was mounted by the die pad part (2), and (7) are metal small-gage wires which connect the surface electrode and inner lead (3) of a semiconductor device (6). With this conventional package, if connection by mount of a semiconductor device (6) and the metal small-gage wire (7) of that surface electrode and inner lead (3) is completed, in order to protect a semiconductor device (6), the upper part of package body fil is sealed with a lid (6). And diffusion of the heat which package body C1+ usually comprises ceramics, and a semiconductor device (6) generates during operation is insufficient, even if it attaches a heat dissipation device Take 9 separately -- O which was not effective -- this invention was made in view of the above points, and an object of an invention is to provide the package for semiconductor devices which was excellent in the heat dissipation characteristic by making a die pad part into heat pipe structure. Drawing 2 is a sectional view showing one example of this invention, below, the same numerals show a conventional example and an equivalent portion, and they avoid duplication of that explanation. The heat pipe which 1. (la) penetrated the package body, and (8) penetrated the bottom in the central part of the package body (1a), and adhered in the figure, and (2a) are the die pad parts provided in the upper surface of the heat pipe (8). Since it is structure company common knowledge of the heat pipe (8) itself, it does not explain in full detail. since the semiconductor device (6) is mounted on the heat pipe (8) in this example although mount % and the connection form of a semiconductor device (6), and the protection form with a lid (5) are the same as the conventional example of Drawing 1, a radiation effect is very thick -- it is -- . Drawing 3 is a sectional view showing other examples of this invention, and it is at this example, After mounting a semiconductor device (6) to the die pad part (2a) provided in the upper surface of the heat pipe (8), It is what connected the external lead (4) with the surface electrode by the metal small-gage wire (7), and carried out the mold of the terminal area with the upper part of a heat pipe (8), a semiconductor device (6), a metal small-gage wire (7), and the metal small-gage wire (7) of an external lead (4) by resin (9), This example as well as the example of Drawing 2 has the outstanding heat dissipation characteristic. A which becomes this invention as explained above; in A cage, a semiconductor device is mounted to one end face of a heat pipe, and since it was considered as the structure of exposing the other end of that heat pipe outside, the very good heat dissipation characteristic is acquired.

[Brief Description of the Drawings]

The sectional view and Drawing 3 in which the sectional view showing the package for semiconductor devices of the former [ Drawing / 1 ], W, and 2 figures show one example of this invention are a sectional view showing other examples of this invention. in a figure -- (la) -- a package body and (2a) -- a die pad part and (4) -- an external lead and +6 -- a lid and (6) -- a semiconductor device and (7) -- the metal small-gage wire for connection, and (8) -- Heatno (the eve and (9) are mold resin.) zero representative who shows a portion same [ same-among figure numerals ], or considerable the [ Kuzuno Trust-(besides one person) ] -- 1 figure figure 2 Drawing 3