Physical vapor deposition method
Abstract
PURPOSE:To form a uniform hard film with high adhesion by cleaning the surface of a tool, each of parts or the like by sputtering with H2 or a gaseous mixture of H2 with an inert gas and by physically vapor-depositing a solid soln. of a hard compound on the cleaned surface. CONSTITUTION:The surface of a cutting tool, each of wear resistant parts or a decoration is cleaned by sputtering with H2 or an atmospheric gas contg. >=20, especially >=50vol% H2. A solid soln. of a C, N or O compound of a IVa, Va or VIa group metal in the periodic table and/or >=1 kind of compound such as Al2O3 is physically vapor-deposited on the cleaned surface to form a single or multiple layer. The optimum physical vapor deposition method is an ion plating method. When the substrate is a gear cutting tool or a forming tool made of high speed steel and having a complex shape, the effect is shown especially, and the resistances to wear, melt sticking, corrosion, etc. are enhanced.

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Projected expiry passed 6 November 2000, 25.9 years ago.
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Every citation, both ways
| Document | Relation | Office | Cited during |
|---|---|---|---|
| JP2012110894A | Cited by | Japan | Search report |
| JPS63105964A | Cited by | Japan | Search report |
| US5436071A | Cited by | United States of America | Search report |
| JP2015193913A | Cited by | Japan | Search report |
| JPS63134654A | Cited by | Japan | Search report |
| JP2012110894A | Cited by | Japan | Examiner |
Numbers
- Application
- 15658480
Titles
- English
- PHYSICAL VAPOR DEPOSITION METHOD
Classification
- CPC, 3
- B23P15/28
- C23C14/022
- C23C30/005
- IPC, 6
- C23F4 00
- B23P15 28
- C23C14 02
- C23C14 06
- C23C14 08
- C23C30 00