Mounting construction of semiconductor device

PURPOSE:To enable a high density interconnection with a less occupation area for mounting by burrying a chip with a bump into a recess of an insulation circuit substrate with a resin with the face up in such a manner as to be flush in the surface with the substrate. CONSTITUTION:An IC body 4 is housed in a housing section 2 of a substrate 1 made of a resin and ceramics with the face up and burried with the resin 6. A bump 5 is exposed by lapping along with a smooth surface of the substrate 1. Then, a metal thin film 7 is deposited while a through hole 3 is made conductive and a wiring is formed with a resist pattern 8. Finally, covering with Au or the like 9 provents the oxidation of the metal film 7 and improves the junction property. This enables full utilization of the surface of the substrate thereby affording a high density wiring with a less occupation area.