Device and method for recovering wafer from slicing machine

Description: TECHNICAL FIELD [Detailed description of the invention]

【0001】

[Industrial application field]

The present invention relates to a wafer recovery device and a wafer recovery method for recovering a wafer cut out from an ingot, which is arranged in a slicing machine.

【0002】

[Conventional technology]

Examples of conventional slicing machines are those shown in FIGS. 12 and 13. In the slicing machine 1 shown in FIG. 12, a ring-shaped inner peripheral blade 2 that is rotationally driven by a spindle (not shown) is mounted on a column (not shown), and a cutting blade 2a is formed over the entire inner peripheral edge thereof. Only a part of it is shown as a cross section. A wafer recovery device 3 is arranged inside the column, and the wafer recovery device 3 has a suction means 4 and a support mechanism 5 that supports the suction means 4 so as to be vertically movable. In the suction means 4 of the wafer recovery device 3, the other end of the arm 6 whose one end is fixedly held by the support mechanism 5 is fixed to the suction plate 7, and the other surface of the suction plate 7 is sucked to suck the wafer. Pad 8 is arranged. As shown in FIG. 13, four suction pads 8 are provided, and are attached to each corner of the substantially square surface of the suction plate 7. The suction port 8a in each suction pad 8 is connected to a suction machine (not shown) via the arm 6 of the support mechanism 5. As a result, air can be sucked from the suction port 8a of each pad 8 to suck the wafer. The support mechanism 5 is provided with a support member 10 that supports the arm 6 and a sliding slide member 11 that supports the support member 10 so as to be movable in the vertical direction.

【0003】

Further, an ingot 13 to be cut is adhesively fixed to the carbon bed 14 of the slicing machine 1 to form a work piece p. The ingot 13 is supported by the gripping means 16 in a state of being supported by the carbon bed 14 at a side surface portion along the longitudinal direction thereof, and the operation is controlled via the carbon bed 14. That is, it is sent into the cutting surface region of the inner peripheral blade 2 in the rotation axis direction (A direction), and then sent in the radial direction (B direction) of the inner peripheral blade 2. As a result, the ingot 13 is cut to a predetermined thickness together with the carbon bed 14 by the rotationally driven inner peripheral blade 2, and the wafer 15 is manufactured. Then, the wafer 15 is sequentially manufactured by repeatedly operating the workpiece p in the A direction and the B direction. By the way, in the wafer recovery device 3 of the slicing machine 1, the ingot 13 is cut by the inner peripheral blade 2 in order to prevent damage due to a recovery error of the wafer 15 as much as possible and increase the yield of wafer recovery. Meanwhile, the support member 10 of the suction means 4 is reciprocated in the vertical direction by following the vertical movement (movement in the B direction) of the ingot 13. As a result, the suction pad 8 is always held in a state of facing the wafer 15 to be cut while moving, and the suction pad 8 is continuously sucked from the suction port 8a, so that the wafer 15 is automatically transferred to the suction pad 8 before being cut off. It is adsorbed, and after cutting, it is collected by the suction means 4.

【0004】

[Problems to be Solved by the Invention]

However, in such a wafer recovery device 3, the suction means 4 must be made to follow and move up and down according to the vertical movement of the ingot 13 at the time of cutting, and therefore, the wafer 15 and the suction pad 8 must be moved up and down. There is a problem that it is difficult to balance the positions and the suction and cutting operations are inferior in certainty. Moreover, in order to improve the adsorption of the wafer and efficiently collect it, the angle of the adsorption pad 8 with respect to the surface of the inner peripheral blade 2 (instead of the end surface of the ingot) is measured in advance before the start of cutting the ingot, and the wafer is adsorbed. It was necessary to adjust the pad 8 so that it was parallel to the inner peripheral blade 2, and the measurement was performed using a feeler gauge or the like. However, it has been difficult to measure the gap between the inner peripheral blade 2 and the suction pad 8 using a feeler gauge over the entire circumference of the inner peripheral blade 2 corresponding to the end face of the ingot 13. In addition, accurate measurement was not possible due to misalignment of the inner peripheral blade 2 and deflection due to operation, and precise parallel adjustment was not possible.

【0005】

Further, when the wafer 15 is cut, the ingot 13 is in a state of being moved to the upper end side of the inner peripheral blade 2, so that it is behind the column and the inner peripheral blade 2, and the operator is attracted to the surface of the wafer 15 at the time of adsorption. The angle and posture of the pad 8 cannot be visually recognized. Therefore, also in this respect, when the suction pad 8 cannot be precisely adjusted to the suction position of the wafer 15, the wafer 15 cannot be sufficiently sucked by the suction pad 8, and the wafer 15 cannot be collected due to dropping or the like. There was also. For the above reasons, the wafer recovery rate of the wafer recovery device in the conventional slicing machine is only 90%. Therefore, when the workpiece is an expensive one such as a silicon single crystal ingot for manufacturing a semiconductor wafer, further improvement in the recovery rate is required.

【0006】

In view of such a problem, an object of the present invention is to provide a wafer recovery device for a slicing machine capable of improving the wafer recovery rate and almost certainly recovering the wafer.

【0007】

[Means for solving problems]

The wafer recovery device of the slicing machine according to the present invention can be used as a wafer by moving the workpiece relative to the inner peripheral blade that is rotationally driven around the rotation axis in a direction intersecting the rotation axis. In a slicing machine that cuts and sucks and collects this wafer by suction means, when cutting the work piece, the cutting of the wafer is completed by leaving a part of the work piece as the balance in an uncut state. It is characterized by being provided with a driving means, a suction means for sucking and gripping a stationary wafer having a remaining portion, and a remaining portion cutting means having a cutting edge for cutting the remaining portion.

【0008】

Further, the workpiece is formed by fixing a carbon bed along the longitudinal direction of the ingot, and the rest is formed on the carbon bed. The drive means is a work piece driving unit that moves the gripping means for gripping the work piece and moves the work piece with the remaining portion to a predetermined non-cutting position. Further, the driving means may be an inner peripheral blade driving unit that moves the member holding the inner peripheral blade and moves the inner peripheral blade to a predetermined non-cutting position while leaving the remaining portion. The wafer recovery device of the slicing machine according to the present invention can be used as a wafer by moving the workpiece relative to the inner peripheral blade that is rotationally driven around the rotation axis in a direction intersecting the rotation axis. In a wafer recovery device of a slicing machine that cuts and sucks and recovers this wafer by suction means, when the work piece is cut by the inner peripheral blade, a part of the work piece is left as an uncut state. A driving means for performing the first-stage cutting for temporarily ending the cutting of the wafer with the remaining portion, a second-stage cutting for cutting the remaining portion, and a suction means for sucking and gripping the stationary wafer with the remaining portion remaining. , Is provided. Further, the workpiece is formed by fixing a carbon bed along the longitudinal direction of the ingot, and the rest is formed on the carbon bed.

【0009】

In the wafer recovery method of the slicing machine according to the present invention, a wafer is formed by moving the workpiece relative to the inner peripheral blade that is rotationally driven around the rotation axis in a direction intersecting the rotation axis. In the wafer recovery method of a slicing machine in which a wafer is cut and the wafer is sucked and recovered by a suction means, the work piece is moved relative to the inner peripheral blade to cut the work piece and work. Cutting of the work piece is temporarily completed by leaving a part of the object as the remaining portion in an uncut state, and the end face of the stationary wafer with the remaining portion is sucked and gripped by operating the suction means, and then the remaining portion is held. It is characterized in that the wafer is separated from the work piece by cutting the wafer.

【0010】

In addition, the workpiece with the remaining portion left uncut is returned to a non-cutting position separated from the inner peripheral blade, and this remaining portion is cut by a residual cutting means separate from the inner peripheral blade. It is characterized by. Further, the relative movement of the workpiece with respect to the inner peripheral blade is stopped with the remaining portion left uncut, and after the wafer is attracted by the suction means, the workpiece moves relative to the inner peripheral blade in the same direction again. The rest may be cut by this. Further, the workpiece is formed by fixing a carbon bed along the longitudinal direction of the ingot, and the rest is formed on the carbon bed.

【0011】

Further, the wafer recovery device of the slicing machine according to the present invention moves the workpiece relative to the inner peripheral blade which is rotationally driven around the rotation axis in a direction intersecting the rotation axis. In a wafer recovery device of a slicing machine that is cut as a wafer and sucks and collects the wafer by a suction means, the suction means has a suction pad that sucks the surface of the wafer by an air suction machine, and the suction pad. A suction plate that supports the ball portion is connected to a ball portion that can move spherically, and a receiving portion that supports the ball portion so that the ball portion can move spherically is provided in the support mechanism, and a fixing member that fixes the ball portion to the receiving portion. It is characterized in that the suction plate can be adjusted and fixed at an arbitrary three-dimensional angle. Further, the angle of the suction pad is adjusted so as to come into contact with the end face of the workpiece.

【0012】

[Action]

By moving the workpiece relative to the rotationally driven inner peripheral blade by the driving means, the workpiece is cut by the inner peripheral blade, and the driving means leaves a part of the remaining portion uncut. In order to end the wafer cutting operation, the wafer in a state where a part of the wafer is connected to the workpiece can be reliably sucked and held by the suction means in a stationary state, and then the remaining portion is cut by the remaining cutting means to completely separate the wafer. ,to recover.

【0013】

Since the rest is formed on the carbon bed portion, the ingot is completely cut by the inner peripheral blade and does not adversely affect the quality of the wafer. The workpiece is moved by the workpiece drive unit, and the inner peripheral blade does not move. The inner peripheral blade is moved by the inner peripheral blade drive unit, and the workpiece does not move. When the workpiece is moved relative to the inner peripheral blade to cut, the wafer is cut in the first stage of cutting, leaving the rest uncut, and the stationary wafer is sucked and gripped by suction means. After that, as the second step, the remaining part is cut with the inner peripheral blade.

【0014】

The wafer is cut as a wafer by moving the workpiece relative to the inner peripheral blade that is driven to rotate, the remaining portion of the workpiece is left uncut, the cutting of the workpiece is temporarily completed, and the wafer is in a stationary state. The end face of the wafer is securely sucked and gripped by suction means, and then the rest is cut to completely separate the wafer from the workpiece. The balance is cut by the balance cutting means. The remaining portion is separated by moving the workpiece relative to the inner peripheral blade again. Prior to driving the slicing machine, the suction angle of the suction pad of the suction means is three-dimensionally adjusted by moving the ball part spherically with respect to the receiving part to ensure suction, and the fixing member. Try to fix with. By bringing the suction pad into contact with the end face of the work piece, it becomes parallel to this and the suction angle can be adjusted.

【0015】

[Example]

Hereinafter, an embodiment of the present invention will be described with reference to FIGS. 1 to 9, but the same reference numerals will be used for the same parts or members as in the above-mentioned prior art, and the description thereof will be omitted. FIG. 1 is a plan view of the remaining cutting means of the wafer recovery device, FIG. 2 is an enlarged view of the connecting plate portion of FIG. 1, FIG. 3 is an enlarged view of the driving portion of FIG. The view from the direction, FIG. 5 is a side view of the unloader part of the wafer recovery device, and the suction means is partially broken, and FIG. 6 is a view of the suction means of FIG. 5 at 90 degrees different angles. A side view of the part, FIG. 7 is a diagram showing the positional relationship between the inner peripheral blade and the suction plate, FIG. 8 is a block diagram of a main part of the drive system, and FIG. is there. In FIGS. 1 to 4, an inner peripheral blade 2 having a cutting edge 2a formed over the entire inner peripheral end is attached to the column 17 of the slicing machine 1, and the inner peripheral blade 2 is rotated by a drive motor (not shown). Then, the workpiece p to be fed is cut as the wafer 15.

【0016】

In this embodiment, the gripping means 16 drives and controls the carbon bed 14 to grip the ingot 13 attached to the rearmost end (lower side) in the cutting direction and cut it with the inner peripheral blade 2. When the gripping means 16 moves the workpiece p in the radial direction (arrow B direction) of the inner peripheral blade 2 at the time of cutting the wafer, the gripping means 16 does not move the workpiece p until the entire workpiece is separated, and after cutting the entire ingot 13. , The drive is controlled so as to end the movement for cutting at the position where the uncut portion (hereinafter referred to as the balance) 14a exists in a part of the lower side of the carbon bed 14. In the column 17, a residual cutting means 18 for cutting the remaining portion of the carbon bed 14 is provided. As shown in FIG. 1, the remaining portion cutting means 18 includes a cutting portion 19, a driving portion 20, a connecting plate portion 21 formed by integrally connecting the cutting portion 19 and the driving portion 20, and a connecting plate portion 21 formed in a substantially stepped shape. It has a grindstone shaft drive motor 23 that is attached to the drive portion 20 and rotates the grindstone 22 of the cutting portion 19. The remaining cutting means 18 is supported by the drive unit 20 so as to be horizontally movable with respect to the column 17.

【0017】

In the cutting portion 19, a housing 25 extending in the direction of the rotation axis of the inner peripheral blade 2 is provided, and the rear end thereof is connected to the output shaft of the grindstone shaft drive motor 23 via a drive wire or the like built in the tube 26. It is connected. A grindstone shaft 27 directly or indirectly connected to a drive wire or the like is provided at the tip of the housing 25, and the grindstone 22 described above for cutting off the remaining portion 14a of the carbon bed 14 is fixed to the tip of the grindstone shaft 27. The cutting portion 19 is arranged in the direction of the rotation axis of the inner peripheral blade 2, the grindstone shaft drive motor 23 is arranged in a direction substantially orthogonal to the rotation axis, and the grindstone 22 is the rotational force of the grindstone shaft drive motor 23. Is transmitted, and the rotation axis direction is changed by about 90 degrees to drive the rotation.

【0018】

Further, a coolant nozzle adjuster 28 is attached to the cutting portion 19, and coolant is supplied from the adjuster 28 to the grindstone 22 via a pipe. A flange 29 extending in the longitudinal direction of the housing 25 is fixed to one side of the housing 25 of the cutting portion 19, and the flange 29 and one end of the connecting plate portion 21 are connected via a slide cylinder 31. .. In this slide cylinder 31, as shown in the enlarged view of FIG. 2, the cylinder body 32 is fixed to one end of the connecting plate portion 21, and the cylinder cylinder 32a is inside the cylinder body 32 as the rotation axis of the inner peripheral blade 2. It is arranged so that it can move forward and backward in the direction. Further, a positioning block 33 whose one end is connected to the flange 29 is fixed to the tip of the cylinder cylinder 32a. By controlling the operation of the slide cylinder 31, the initial position where the grindstone 22 retracts from the position of the inner peripheral blade 2 (solid line position in FIG. 1) and the grindstone 22 are positioned on the surface of the inner peripheral blade 2. It is possible to advance and retreat to and from the remaining cutting position (two-dot chain line position in FIG. 1).

【0019】

As shown in the enlarged view of FIG. 3, in the body 34 of the drive unit 20 to which the other end of the connecting plate portion 21 is connected, the drive unit 20 is on the opposite side of the connecting plate portion 21 with the rotation axis of the inner peripheral blade 2. A feed shaft motor 35 that feeds and moves in an orthogonal (horizontal) direction is attached. The output side of the feed shaft motor 35 is connected to, for example, a ball screw (not shown), and the rotational force of the feed shaft motor 35 is applied by a coupling structure such as fitting with a ball (steel ball) fixed to the column 17. It can be converted into a linear motion in the feed direction. Therefore, the feed shaft motor 35 reciprocates the remaining cutting means 18 in the direction orthogonal to the rotation axis of the inner peripheral blade. Instead of this mechanism, a pinion may be attached to the feed shaft motor 35 and meshed with the rack on the column 17 to perform the same drive.

【0020】

Further, the body 34 of the drive unit 20 is slidably sandwiched on its upper and lower surfaces by two pairs of guide plates 37 located in the vertical direction, and its feed reciprocating motion is guided. The movable plate 38 to which the guide plate 37 is fixed is formed with a dovetail groove 38a on the side surface opposite to the drive unit 20. On the other hand, a fixing plate 39 having a dovetail portion 39a fitted in the dovetail groove 38a is fixed to the side surface of the column 17 facing the dovetail groove 38a. Then, a space 40 having a slight width is formed between the dovetail portion 39a and the dovetail groove 38a in a state where the dovetail portion 39a and the dovetail groove 38a are fitted, and a rust-shaped spacer 41 capable of advancing and retreating is inserted into this space 40 to form a fixing plate 39. And the movable plate 38 is firmly fixed. Further, a support plate 43 extending to the upper surface region of the movable plate 38 is fixed to the upper portion of the fixing plate 39. A screw hole 38b is formed in the movable plate 38 coaxially with the hole formed on the movable plate 38 of the support plate 43 (see FIG. 4), and the male screw 44a of the adjusting screw 44 passes through the hole of the movable plate 38. It is screwed into the screw hole 38b.

【0021】

Therefore, if the dovetail groove 38a of the movable plate 38 is movable with respect to the dovetail portion 39a of the fixed plate 39, the movable plate 38 can be moved up and down with respect to the fixed plate 39 by rotating the adjusting screw 44. It can be moved, and the remaining cutting means 18 can be moved up and down via the guide plate 37. As a result, when the outer diameter of the ingot 13 is different, the height position of the remaining portion 14a of the carbon bed 14 at the time of cutting is different, and the height of the remaining portion cutting means 18 can be adjusted accordingly (FIG. FIG. 4). Next, on one side surface of the movable plate 38, a lever 46 that can reciprocate by a predetermined angle range is provided in a screwed state, and the lever 46 reciprocates from one rotating end to the other rotating end. By being made to move, the tip moves back and forth within the movable plate 38 by a predetermined distance (see FIG. 4). Therefore, by interlocking the tip of the lever 46 with the spacer 41 via an interlocking member (not shown), the spacer 41 can be moved back and forth in the gap between the dovetail portion 39a and the dovetail groove 38a to tighten or loosen both. It is possible to switch between the fixed state of the movable plate 38 with respect to the fixed plate 39 and the height adjustable state.

【0022】

Further, in the body 34 of the drive unit 20, a bracket 48 is fixed between the feed shaft motor 35 and the guide plate 37, and the drive unit 20 (remaining cutting means) is attached to the nut portion 49 provided on the bracket 48. The first stopper 45 having a screw portion for setting one limit of the feed range of 18) is screwed and is fixed so as to project in the movable plate 38 direction, and the head 45a of the first stopper 45 The feed range can be increased or decreased by moving the first stopper 45 forward and backward by operation. Further, in the vicinity of the connecting portion of the connecting plate 21 with the driving portion 20, the second stopper 50 is fixed along the direction of the body 34 so as to face the first stopper 45 with the movable plate 38 interposed therebetween. When the first and second stoppers 45 and 50 abut on the movable plate 38, respectively, the feed range of the remaining cutting means 18 is set.

【0023】

Next, the unloader unit 52 will be described with reference to FIGS. 5 to 7. In the unloader portion 52, the suction means 54 is fixedly held at the tip of the support mechanism 53, as in the above-described prior art. The support mechanism 53 is attached to the support arm 55, an air cylinder 56 for transporting the wafer 15 supported by the support arm 55 and sucked by the suction means 54 to the next process, and the tip of the support arm 55. It has a receiving portion 57 that receives the suction means 54, and a knuckle joint portion 58 that connects the receiving portion 57 and the air cylinder 56a. In this embodiment, the unloader portion 52 does not move up and down following the workpiece p during cutting, and therefore, as in the prior art, a sliding slide member that movably supports the suction means 54 in the up and down direction. Etc. are not provided. Further, in the suction means 54, the suction plate 60 has, for example, a substantially square plate shape, and for example, a disk-shaped suction pad 61 is attached to each of the four corners of the tip surface facing the inner peripheral blade 2. A suction port 61a is formed in the center of each suction pad 61, and is connected to an air suction machine (not shown) via a joint 62 connected from the suction port 61a to the back surface side of the suction plate 60. There is.

【0024】

Further, the back surface side of the suction plate 60 is connected to the ball shaft 64 via a bellows-shaped connecting portion 63. The ball portion 64a of the ball shaft 64 is fitted into a spherical spherical recess 57a formed in the receiving portion 57 of the support mechanism 53 so as to be spherically movable to form a ball joint portion. Moreover, the receiving portion 57 is provided with a fixing screw 65 for fixing the outer surface and the ball portion 64a (see FIG. 6). Then, by tightening the fixing screw 65 until the ball portion 64a is pressed against the receiving portion 57, the ball shaft 64, that is, the suction plate 60 can be fixed at an arbitrary three-dimensional angle. The three-dimensional angle adjustment of the plate 60 becomes possible.

【0025】

In the case of this embodiment, as can be understood from FIG. 7, an unloader portion 52 such as a suction plate 60 is provided at a position shifted toward the inner peripheral blade 2a on the upper side with respect to the rotation axis of the inner peripheral blade 2. There is. Cutting of the workpiece p is also started with the position facing the work piece p as the initial position. Further, FIG. 8 shows a block diagram of a main part of the drive system of the wafer recovery device according to the present embodiment, and the movement of the workpiece drive unit 16a for moving the gripping means 16 is controlled by the control means 67. To.

【0026】

The wafer recovery device of the slicing machine according to this embodiment has the above-described configuration, and next, a wafer recovery method will be described. As the work piece p, for example, a case where a silicon single crystal ingot is cut to manufacture a semiconductor wafer will be described. Assuming that the outer diameter of the columnar ingot 13 is 5 inches or 6 inches, and one of them is selected, the height of the remaining cutting means 18 is adjusted in advance accordingly. For that purpose, first, the lever 46 is rotated to remove and loosen the spacer 41 fitted in the narrow space between the dovetail portion 39a and the dovetail groove portion 38a. Next, by rotating the adjusting screw 44 by a predetermined amount, the movable plate 38 is moved up and down by a predetermined distance with respect to the fixed plate 39 connected to the column 17. For example, in FIG. 4, if the ingot 13 has a relatively large diameter (6 inches), it is located at a predetermined position in the direction away from the unloader portion 52 as shown by the solid line, and if it has a relatively small diameter (5 inches). , (As shown by the alternate long and short dash line), move the remaining cutting means 18 to a predetermined position in the direction approaching the unloader portion 52.

【0027】

In this way, the remaining cutting means 18 is moved up and down according to the diameter of the selected ingot 13, and the height adjustment thereof is completed. Then, by returning the lever 46 to the original angular position, the dovetail portion 39a of the fixing plate 39 and the dovetail groove portion 38a of the movable plate 38 are firmly fixed by the spacer 41 at that position.

【0028】

Next, the workpiece p to which the carbon bed 14 is fixed to the lower end surface of the ingot 13 in the longitudinal direction is gripped at a predetermined height position by the gripping means 16 and moved to the initial position (direction A). Next, the suction means 54 is moved to press the suction pad 61 against the end face of the workpiece. In this state, the fixing screw 65 of the ball joint portion is loosened, and the suction means 54 including the ball shaft 64 and the suction plate 60 is three-dimensionally rotated at an arbitrary angle with respect to the spherical recess 57a of the receiving portion 57 to suck. When all the suction pads 61 of the plate 60 are in a suction state in contact with the end surface of the ingot 13, the fixing screw 65 is tightened at that angle to fix the ball shaft 64 to the receiving portion 57. Here, the height of the unloader portion 52 is not changed regardless of the replacement with the ingot 13 having a different outer diameter, and in any case, the dimension between the suction pads 61 so that the vicinity of the center portion of the wafer 15 can be sucked is large. It is set. Further, the gripping height of the workpiece p by the gripping means 16 is such that the cutting start point (that is, the upper end portion) of the workpiece p is at the same height position regardless of the diameter of the ingot 13.

【0029】

After the above adjustment is completed, the workpiece p is cut. The workpiece p gripped by the gripping means 16 is sent a predetermined distance in the direction of the rotation axis of the inner peripheral blade 2, and when it reaches a predetermined position (initial position) in the cutting region surface of the inner peripheral blade 2, this time. It is sent in the radial direction of the inner peripheral blade 2 orthogonal to the direction of the rotation axis. At this time, the unloader portion 52 maintains the stopped state at the initial position shown in FIG. 7 without following the radial movement of the workpiece p. Then, the ingot 13 of the workpiece p is gradually cut by the inner peripheral blade 2 rotated by a drive motor (not shown). When the workpiece p moves to the cutting blade 2a side to a predetermined position where about 90% of the workpiece is cut out by the inner peripheral blade 2, the movement for cutting the workpiece p by the gripping means 16 ends. .. In this state, as shown in FIG. 9, the workpiece p is in a state in which the ingot 13 is completely cut as the wafer 15 and a part of the carbon bed 14 is left uncut as the remaining portion 14a. The thickness of the remaining portion 14a is determined by the radial movement distance of the workpiece p set for cutting the workpiece p by the control means 67, and is set to the order of, for example, about 20 to 30 μm.

【0030】

Next, the workpiece p is returned to the initial position by the gripping means 16 and becomes a stationary state. Here, the control means 67 moves the unloader unit 52 in the rotation axis direction by the unloader unit drive unit 52a, and each suction pad 61 of the suction plate 60 is pressed against one surface of the wafer 15 to ensure certainty. The wafer 15 is adsorbed on the wafer 15. Then, after a lapse of a predetermined time, the remaining cutting means 18 is activated. That is, as shown in FIG. 1, the remaining portion cutting means 18 at the initial position is located at a position where the grindstone 22 of the cutting portion 19 is retracted in the direction of the rotation axis, and is located at one end of the horizontal feed range. There is. Then, by driving the slide cylinder 31, the cylinder cylinder 32a is extended from the cylinder body 32 in a direction parallel to the rotation axis by a predetermined distance, so that the cutting portion 19 is moved and the grindstone 22 is moved to the remaining cutting position. Be retained.

【0031】

Next, the feed shaft motor 35 and the grindstone shaft motor 23 are driven. By driving the feed shaft motor 35, the drive unit 20 including the feed shaft motor 35 and the body 34 is guided by two pairs of upper and lower guide plates 37 and fed in the feed direction (in the direction of arrow C in FIG. 1), and the rest. Cutting means 18 is sent. Further, by driving the grindstone shaft motor 23, the grindstone 22 is rotated at high speed via the tube 26 and the grindstone shaft 27. Therefore, the remaining portion 14a of the carbon bed 14 of the workpiece p is cut by the grindstone 22 by the horizontal feed movement of the remaining portion cutting means 18. At this time, since the wafer 15 has already been adsorbed by the unloader unit 52, no adsorption error or the like occurs, and the wafer 15 in the adsorbed state is surely recovered after cutting the remaining portion 14a.

【0032】

In this way, the recovery process by cutting and adsorbing one wafer 15 from the work piece p is completed. After that, the gripping means 16 moves the workpiece p again in the A direction and the B direction, repeats the same process, and sequentially cuts and recovers the wafer 15.

【0033】

As described above, according to the present embodiment, the suction means 54 is not made to follow the movement of the workpiece p for cutting the wafer to suck the wafer 15, but the stationary wafer 15 is sucked by the suction means 54. Since the suction is performed, the suction work can be performed more easily and reliably. Further, in the case of this embodiment, the remaining portion 14a of the workpiece p cut by the inner peripheral blade 2 is a portion of the carbon bed 14, and the ingot 13 is completely cut, so that the product accuracy of the wafer is not adversely affected. .. Moreover, the angle of each suction pad 61 of the suction means 54 can be adjusted three-dimensionally in advance by spherical motion, and the adjustment work is performed on the end face of the workpiece p. It is more accurate than the adjusted method, and the suction of the suction pad 61 to the wafer 15 at the time of recovery is more reliable. Further, when adjusting the angle of the suction plate 60, it is not necessary to measure the gap with the inner peripheral blade 2 with a feeler gauge or the like as in the conventional method, and it is not necessary to visually recognize the suction plate 60. Parallelism can be obtained by pressing the pad 61, and the adjustment can be easily and accurately adjusted three-dimensionally by the ball joint portion. In this way, the wafer can be recovered more reliably, and the recovery efficiency can be increased to almost 100%.

【0034】

The above-described embodiment relates to a method of cutting out the wafer 15 by moving the workpiece p in the radial direction of the inner peripheral blade 2 with respect to the non-moving inner peripheral blade 2 held by the column 17. However, instead of this, the present invention may be adopted as a method of holding the workpiece p in a stationary state without moving it and moving the inner peripheral blade 2 in the radial direction thereof to cut out the wafer 15. In this case, the inner peripheral blade 2 finishes the cutting work and returns to the initial position in a state where a part of the carbon bed 14 is left uncut as the remaining portion 14a when the workpiece p is cut. After that, the wafer 15 is sucked by the suction means 54, and the balance 14a is cut by the balance cutting means 18. In this modification, the inner peripheral blade 2 is driven and controlled by the control means 67 by the inner peripheral blade driving unit 2b shown in FIG.

【0035】

Next, FIG. 10 shows a second embodiment of the present invention, and the residual cutting means 18 is not used in this embodiment. In the second embodiment, the radial movement distance of the inner peripheral blade 2 by the gripping means 16 for holding the workpiece p is the same as that of the above-mentioned prior art, but the drive system block diagram shown in FIG. 8 shows. The control means 67 allows the workpiece drive unit 16a to move and control the movement in two stages. That is, in FIG. 10, assuming that the state indicated by the alternate long and short dash line at the predetermined position for wafer cutting in the rotation axis direction of the inner peripheral blade 2 as the initial position, the gripping means 16 is used in the first stage. The workpiece p is moved in the radial direction (B direction) of the inner peripheral blade 2a to cut out the wafer 15 and is moved to a position where a part of the carbon bed 14 is cut leaving the remaining portion 14a, and is stationary. It becomes a state. Then, in the second stage, the workpiece p is further moved in the same direction from the end position of the first stage in the same direction, and the remaining portion 14a of the carbon bed 14 is completely cut off.

【0036】

Further, the suction pad 61 of the suction means 54 is held at a position facing the end surface of the workpiece p at the end position of the first stage, and is held on the end surface of the wafer 15 of the workpiece p at which the first stage is completed. The suction pad 61 will be sucked. From this state, the unloader unit 52 is controlled to move the second stage integrally with the workpiece p. Therefore, the suction means 54 follows the workpiece p in a state of being attracted to the wafer 15 only by the stroke of the second stage of the workpiece p. Therefore, the unloader portion of the unloader portion 52 shown in FIG. As the drive unit 52a, a sliding slide member, a pneumatic cylinder, or the like described in the prior art may be provided.

【0037】

Next, the wafer recovery method of the second embodiment will be described. The workpiece p gripped by the gripping means 16 is fed in the A direction to the initial position indicated by the alternate long and short dash line in FIG. Then, it is sent in the radial direction (direction B in FIG. 10), the ingot 13 portion is gradually cut by the inner peripheral blade 2a of the inner peripheral blade 2, the wafer 15 is completely cut, and then one of the carbon beds 14 is cut. The part is cut to stop the movement of the workpiece p. As a result, the cutting work of the first stage is completed, and the rest of the carbon bed 14 is left uncut. In this state, the suction plate 60 of the suction means 54 is at a position facing the cut out wafer 15, and the suction pad 61 is surely sucked to the wafer 15 by the forward movement of the unloader portion 52. Next, the workpiece p is further sent in the radial direction (B direction in FIG. 10) from the first stage, the remaining portion 14a of the carbon bed 14 is cut off by the rotating inner peripheral blade 2, and the wafer 15 contains the ingot 13. It is completely separated from the workpiece p. As a result, the cutting work of the second stage is completed, the workpiece p is returned to the initial position, and the wafer 15 is carried to the next process by the unloader unit 52.

【0038】

According to this embodiment, since there is no residual cutting means 18, the configuration of the wafer collecting device is further simplified, and the operation control of the gripping means 16 of the workpiece p is also simplified. The suction means 54 follows the workpiece p in the second stage, but since it is after suction, it does not affect the recovery rate. In the first step, the workpiece p may be moved to cut the wafer leaving the remaining portion 14a, and in the second step, the inner peripheral blade 2 may be moved in the radial direction to cut the remaining portion 14a. .. As a result, the unloader portion 52 is not made to follow in the radial direction.

【0039】

FIG. 11 shows a modified example of the second embodiment, in which the workpiece p is cut by moving the inner peripheral blade 2 in the radial direction without moving the workpiece p. In this example, as shown in FIG. 11, the initial position is the position before the start of cutting indicated by the alternate long and short dash line with respect to the workpiece p located on the surface of the inner peripheral blade 2. Then, the state shown by the solid line in which the inner peripheral blade 2 moves in the radial direction and cuts the workpiece p leaving the remaining portion 14a is the operation of the first stage. After that, the suction pad 61 of the suction means 54 is sucked on the surface of the cut wafer 15 in the stationary state of the inner peripheral blade 2. From this state, as a second step, the inner peripheral blade 2 is moved in the radial direction and the remaining portion 14a is cut off. The inner peripheral blade 2 is driven and controlled by the control means 67 by the inner peripheral blade driving unit 2b shown in FIG. In the case of this embodiment, only the inner peripheral blade 2 moves during the first and second stages of cutting, and the workpiece p and the suction means 54 do not move. Therefore, the configuration of the wafer recovery device and the cutting of the wafer 15 are performed. And the recovery work is further simplified and the operation control is also easier.

【0040】

[Effect of the invention]

As described above, the wafer recovery device of the slicing machine according to the present invention includes a driving means for finishing cutting of the wafer by leaving a part of the work piece as an uncut state when cutting the work piece. It is provided with a suction means for sucking and gripping the wafer in a state where the remaining portion is left, and a remaining portion cutting means having a cutting edge for cutting the remaining portion. Further, in the wafer recovery method of the slicing machine according to the present invention, the work piece is moved relative to the inner peripheral blade to cut the work piece, and a part of the work piece is left as an uncut state. The cutting of the work piece is temporarily finished, and the end face of the stationary wafer with the remaining part is sucked and gripped by operating the suction means, and then the remaining part is cut to separate the wafer from the work piece. It is the one that was made. Therefore, it is not necessary to make the suction means follow the movement for cutting the workpiece to suck the wafer, and the stationary wafer can be reliably sucked by the suction means, so that the suction work can be performed more easily and surely. This has the important practical advantage that the wafer can be recovered more reliably and the recovery efficiency is very high. Moreover, the operation control of the suction means becomes easy. Further, since the remaining portion of the work piece is formed on the carbon bed, the ingot is completely cut even if the remaining portion is left uncut when cutting with the inner peripheral blade, which adversely affects the product accuracy of the wafer. Absent. Further, the relative movement of the workpiece with respect to the inner peripheral blade is stopped with the remaining portion left uncut, the wafer is attracted by the suction means, and then the workpiece moves relative to the inner peripheral blade in the same direction again. Since the rest is cut by this, the operation control for cutting is further simplified, the work becomes easier and the cost is reduced.

【0041】

Further, the wafer recovery device of the slicing machine according to the present invention is the first step of temporarily ending the cutting of the wafer by leaving a part of the workpiece as an uncut state when cutting the workpiece by the inner peripheral blade. The above-mentioned effect is obtained because the driving means for performing the cutting of the wafer and the second-stage cutting for cutting the remaining portion and the suction means for sucking and gripping the stationary wafer in which the remaining portion is left are provided. In addition, the configuration and control of the wafer recovery device is relatively simple and the recovery cost is lower. Further, in the wafer recovery device of the slicing machine according to the present invention, the suction means has a suction pad that sucks the surface of the wafer, and the suction plate that supports the suction pad is connected to a ball portion that can move spherically. A fixing member for fixing the ball portion to the receiving portion that supports the spherical movement is provided, and the suction plate can be adjusted and fixed at an arbitrary three-dimensional angle, so that each suction means can be sucked. The angle of the pad can be adjusted three-dimensionally in advance by spherical motion, and the adjustment work is performed on the end face of the work piece. The suction operation of the suction pad on the wafer at that time becomes more reliable, the wafer can be recovered more reliably, and the recovery efficiency becomes very high. Furthermore, when adjusting the angle of the suction plate, it is not necessary to measure the gap with the inner peripheral blade with a feeler gauge or the like as in the conventional method, and the suction pad is pressed so as to be sucked on the end face of the workpiece. There is also an advantage that the adjustment can be easily and accurately three-dimensionally performed by the ball joint portion.

[Simple explanation of drawings]

[Figure 1]

It is a top view of the residual cutting means of the wafer recovery apparatus according to 1st Embodiment of this invention.

[Figure 2]

It is an enlarged view of the slide cylinder, the flange and the connecting plate part of FIG.

[Fig. 3]

It is an enlarged view of the drive part of the rest cutting means of FIG.

[Fig. 4]

It is the figure which looked at the rest cutting means of FIG. 1 from the direction I.

[Fig. 5]

It is a side view of the main part which shows the unloader part of the wafer recovery apparatus by partially breaking the suction means and the ball joint part.

[Fig. 6]

FIG. 5 is a plan view of a main part of the suction means of FIG. 5 as viewed from below.

[Fig. 7]

It is a figure which shows the positional relationship between the inner peripheral blade and the suction plate.

[Fig. 8]

It is a block diagram of a main part of a drive system.

[Fig. 9]

It is sectional drawing which shows the state of cutting the workpiece in the state which left the remaining part.

[Fig. 10]

It is a figure which shows the 2nd Embodiment of this invention, and shows the positional relationship between the workpiece, the inner peripheral blade, and the suction means.

[Fig. 11]

It is the same figure as FIG. 10 which shows the modification of the 2nd Example of this invention.

[Fig. 12]

It is a block diagram of the main part of the conventional wafer recovery apparatus.

[Fig. 13]

It is a front view of the suction pad of FIG.

[Explanation of symbols]

2 ... Inner peripheral blade, p ... Work piece, 13 ... Ingot, 14 ... Carbon bed, 14a ... Remaining, 16 ... Gripping means, 16a ... Work piece drive Part, 17 ... Column, 18 ... Remaining cutting means, 52 ... Unloader part, 54 ... Suction means, 57 ... Receiving part, 60 ... Suction plate, 61 ... Suction Pad, 64 ... ball shaft, 64a ... receiver.