Liquid crystal display device

Description: TECHNICAL FIELD [Detailed description of the invention]

【0001】

[Industrial application field]

The present invention relates to a liquid crystal display device having a light guide plate arranged under the liquid crystal display panel and a fluorescent tube arranged near the side surface of the light guide plate, and more particularly to a holding structure of the light guide plate and the liquid crystal display panel.

【0002】

[Conventional technology]

The active matrix type liquid crystal display device is provided with a non-linear element (switching element) corresponding to each of a plurality of pixel electrodes arranged in a matrix. The liquid crystal in each pixel is theoretically constantly driven (duty ratio 1.0), so the active method has better contrast than the so-called simple matrix method, which employs a time division drive method, and is particularly a color liquid crystal display device. It is becoming an indispensable technology. A typical switching element is a thin film transistor (TFT).

【0003】

In the liquid crystal display device, for example, two transparent glass substrates are superposed with a predetermined gap so that the surfaces on which the display pixel electrode made of a transparent conductive film and the alignment film are laminated face each other, and the two substrates are separated from each other. Both substrates are bonded together by a frame-shaped sealing material at the edge of the seal material, and the liquid crystal is sealed and sealed inside the sealing material between the two substrates from the liquid crystal sealing port provided in a part of the sealing material. A liquid crystal display panel (liquid crystal display element) in which a polarizing plate is installed or attached to the outside of both substrates, a circuit board arranged outside the outer periphery of the liquid crystal display panel and forming a liquid crystal driving circuit, and these. An intermediate frame, which is a molded product that holds each member, a metal shield case that houses each of these members and has a liquid crystal display window, and is placed under the liquid crystal display panel to emit light to the liquid crystal display panel. It is configured to include a backlight to be supplied.

【0004】

Examples of the active matrix type liquid crystal display device using a thin film transistor include Japanese Patent Application Laid-Open No. 63-309921, "12.5 type active matrix type color liquid crystal display adopting a redundant configuration", Nikkei Electronics, pp. 193 ~. It is known for 210, published by Nikkei McGraw-Hill on December 15, 1986.

【0005】

[Problems to be Solved by the Invention]

In the prior art, there is a problem that the external dimensions of the device become large in order to firmly press the light guide plate and the liquid crystal display panel of the backlight in the device.

【0006】

Further, when pulling out two lamp cables in which one ends of the fluorescent tubes constituting the backlight are connected in one direction, there is no space for the lamp cables to pass through in the prior art, and the lamp cables protrude from the liquid crystal display device. , A large space was required to store the lamp cable, and it was difficult to reduce the size and weight of the device. Further, the conventional rubber bush that holds the fluorescent tube holds only the fluorescent tube.

【0007】

Further, the light guide plate of the conventional backlight has a large amount of wasted area for holding in order to hold the light guide plate in the device, and is formed to be significantly larger than the size of the effective light emitting portion, so that the device is large. Therefore, there was a problem that the weight of the device was heavy.

【0008】

Further, conventionally, after assembling the liquid crystal display device, the weight of the liquid crystal display panel, the light guide plate, etc. is applied to the bottom surface of the mold case (frame-shaped body) formed by integral molding in the vertical direction from the upper surface to the lower surface. , There was a problem that the bottom of the mold case swelled. In order to suppress this swelling, the thickness of the mold case had to be increased, and the liquid crystal display device could not be made thinner or lighter.

【0009】

Further, in the conventional liquid crystal display device, the cable of the fluorescent tube of the backlight passes through the outer side surface of the device, and the cable and the inverter connected to the tip thereof protrude to the outside of the device, and the external dimensions are substantially increased. There was a problem.

【0010】

A first object of the present invention is to provide a liquid crystal display device capable of firmly pressing a light guide plate and a liquid crystal display panel in the device and reducing the size and weight.

【0011】

A second object of the present invention is to provide a liquid crystal display device capable of realizing miniaturization and weight reduction by preventing the cable of the fluorescent tube from protruding from the liquid crystal display device.

【0012】

A third object of the present invention is to provide a compact and lightweight liquid crystal display device by efficiently holding a light guide plate in the device and reducing the size of the light guide plate as much as possible.

【0013】

A fourth object of the present invention is to suppress swelling of the bottom surface of the mold case due to the weight of the liquid crystal display panel, the light guide plate, etc., and to reduce the thickness of the mold case, resulting in thinning and weight reduction. The purpose is to provide a liquid crystal display device that can be used.

【0014】

A fifth object of the present invention is to provide a compact and lightweight liquid crystal display device in which cables and inverters do not protrude to the outside of the device.

【0015】

[Means for solving problems]

In order to solve the first problem, the present invention comprises a liquid crystal display panel, a light guide plate arranged under the liquid crystal display panel, a fluorescent tube arranged near the side surface of the light guide plate, and the light guide plate. In a liquid crystal display device having at least one optical sheet arranged on the upper surface and a case for storing the light guide plate and the fluorescent tube, the edge of the side of at least one optical sheet is guided by the guide. It is characterized in that it is placed on the side wall of the case so as to protrude from the end of the side of the light plate, and an elastic body such as a rubber cushion is provided between the optical sheet on the side wall and the liquid crystal display panel. And.

【0016】

Further, the elastic body is provided between the optical sheet on the side wall and the lower surface of the upper transparent glass substrate of the liquid crystal display panel.

【0017】

Further, a liquid crystal display panel, a circuit board arranged on the outer peripheral portion of the liquid crystal display panel, a light guide plate arranged under the liquid crystal display panel, and a fluorescent tube arranged in the vicinity of at least one side surface of the light guide plate. An integral molding including at least one optical sheet arranged on the upper surface of the light guide plate, a metal shield case including the liquid crystal display panel and the circuit board, and the light guide plate and the fluorescent tube. In a liquid crystal display device having a mold case formed by the above, at least one end of at least one of the four sides of the optical sheet is projected from the end of the side of the light guide plate to project the mold case. An elastic body is interposed between the optical sheet on the side wall and the lower surface of the upper transparent glass substrate of the liquid crystal display panel, and the shield case and the mold case are provided respectively. It is characterized in that the fitting portion is fitted and integrated.

【0018】

Further, the optical sheet is characterized by being a diffusion sheet provided on the upper surface of the light guide plate and a prism sheet provided on the upper surface of the diffusion sheet.

【0019】

In order to solve the second problem, the present invention comprises an elastic body that holds both the fluorescent tube and the cable in a liquid crystal display device having a backlight including the fluorescent tube and the cable of the fluorescent tube. It is characterized by having a holder made of.

【0020】

Further, a liquid crystal display device having a backlight including a fluorescent tube and two cables having one end connected to both ends of the fluorescent tube, and the other ends of the two cables being pulled out in the same direction. The present invention is characterized in that it has a holder provided with at least one of one or a plurality of holes and grooves for holding both the fluorescent tube and one or two of the cables.

【0021】

In order to solve the third problem, the present invention presents a liquid crystal display in which a light guide plate of a backlight arranged under the liquid crystal display panel and a fluorescent tube arranged near the side surface of the light guide plate are housed in a case. The apparatus is characterized in that the movement of the light guide plate to the fluorescent tube side is prevented by a minute protrusion provided on the inner surface of the case between the light guide plate and the fluorescent tube.

【0022】

Further, the case is characterized in that it is a molded case formed by integral molding.

【0023】

Further, the light guide plate is characterized in that it has a substantially quadrangular shape.

【0024】

Further, the size of the light guide plate is as close as possible to the size of the effective light emitting portion.

【0025】

Further, the protrusion is provided integrally with the case.

【0026】

Further, it is characterized in that two protrusions are provided in the vicinity of both ends of the fluorescent tube.

【0027】

Further, three sides other than one side of the light guide plate on the fluorescent tube side are held by an inner wall of a light guide plate storage portion formed in the case along a substantially quadrangular shape of the light guide plate. ..

【0028】

In order to solve the fourth problem, the liquid crystal display device of the present invention is characterized in that an opening is provided in a central portion excluding a frame-shaped portion of a case for holding a light guide plate.

【0029】

Further, in a liquid crystal display device in which a liquid crystal display panel and a light guide plate arranged under the liquid crystal display panel are housed by a mold case formed by integral molding and a metal shield case, an opening is provided in the central portion excluding the frame-shaped portion of the mold frame. It is characterized by being provided.

【0030】

Further, it has a metal shield case including a liquid crystal display panel and a molded case formed by integrally molding including a light guide plate arranged under the liquid crystal display panel, and the liquid crystal display panel. A liquid crystal formed by interposing an elastic body between the light guide plate and pushing the shield case toward the inside of the device to fit and integrate fitting portions provided with the shield case and the mold case. The display device is characterized in that an opening is provided in a central portion excluding the frame-shaped portion of the mold case.

【0031】

In order to solve the fifth problem, the liquid crystal display device of the present invention is characterized in that the cable of the backlight is housed in a groove provided in the case.

【0032】

Further, in a liquid crystal display device having a fluorescent tube and a mold case formed by integral molding for accommodating the fluorescent tube, two cables connected to both ends of the fluorescent tube are integrally provided in the mold case. It is characterized by being stored in a groove.

【0033】

Further, a liquid crystal display panel, a circuit board arranged on the outer peripheral portion of the liquid crystal display panel, a light guide plate arranged under the liquid crystal display panel, a fluorescent tube arranged on at least one side surface of the light guide plate, and the liquid crystal. It has a metal shield case that includes the display panel and the circuit board, and a mold case that is integrally molded to include the light guide plate and the fluorescent tube, and includes the shield case and the mold. A liquid crystal display device integrated with a case is characterized in that two cables having one ends connected to both ends of the fluorescent tube are housed in a groove integrally provided on a side wall of the mold case.

【0034】

Further, the first cable connected to the first end of the fluorescent tube is housed in a groove provided on the side wall of the mold case along the fluorescent tube.

【0035】

Further, the first cable connected to the first end of the fluorescent tube is housed in the groove provided on the side wall of the mold case along the fluorescent tube, and the second cable of the fluorescent tube is provided. The first cable after the end and the second cable connected to the second end are pulled out in a direction substantially perpendicular to the direction before the second end of the first cable. It is characterized by being.

【0036】

Further, the first cable after the second end of the fluorescent tube and the second cable connected to the second end are short of the mounting hole of the mold case and the liquid crystal display panel. It is characterized in that it is pulled out from the circuit board arranged on the outer peripheral portion of the side.

【0037】

Further, the inverter connected to each other end of the cable is housed in the outer storage portion of the light guide plate provided in the mold case without protruding from the mold case.

【0038】

[Action]

In the liquid crystal display device of the present invention, the end of the side of at least one optical sheet such as a diffusion sheet or a prism sheet arranged on the light guide plate is projected from the end of the side of the light guide plate to store the light guide plate. The light guide plate and the liquid crystal display panel are placed on the side wall of the case, an elastic body such as a rubber cushion is interposed between the optical sheet on the side wall and the liquid crystal display panel, and the light guide plate and the liquid crystal display panel are pressed firmly by the case. It can be firmly pressed and fixed in the device . Further, the holding structure can reduce the size and weight of the device without increasing the external dimensions of the device. If an elastic body such as a rubber cushion is placed between the optical sheet on the side wall of the case and the lower surface of the upper transparent glass substrate of the two transparent glass substrates constituting the liquid crystal display panel, one of the substrates Since only the pressure is applied, it is effective in preventing display unevenness due to a change in the gap between the two substrates.

【0039】

Further, in the liquid crystal display device of the present invention, both the fluorescent tube and the cable of the fluorescent tube are held by a holder such as a rubber bush made of an elastic body, so that the cable is stored without protruding from the liquid crystal display device. Therefore, the liquid crystal display device can be made smaller and lighter, and the manufacturing cost can be reduced.

【0040】

Further, in the liquid crystal display device of the present invention, the electronic components are mounted in the space occupied by the conventional light guide plate by making the size of the light guide plate of the backlight as close as possible to the size of the effective light emitting portion and making it as small as possible. The light guide plate can be held in a small space by holding the light guide plate by a minute protrusion provided on the inner surface of the storage case of the light guide plate, so that the device can be made smaller and lighter. And the manufacturing cost can be reduced.

【0041】

Further, in the liquid crystal display device of the present invention, a large opening is provided in the central portion of the bottom surface of the mold case excluding the surrounding frame-shaped portion, so that the weight of the liquid crystal display panel or the like is increased after the liquid crystal display device is assembled. And the internal pressure can prevent the bottom surface of the mold case from swelling due to the force applied to the bottom surface of the mold case in the vertical direction from the upper surface to the lower surface, and the maximum thickness can be suppressed. Therefore, the thickness of the mold case can be reduced, and the liquid crystal display device can be made thinner and lighter.

【0042】

Further, in the liquid crystal display device of the present invention, two cables connected to both ends of the fluorescent tube of the backlight are housed in a groove provided in the case, and an inverter is provided on the outside of the light guide plate provided in the mold case. By storing the cable or the inverter in the storage unit, the cable or the inverter can be stored without protruding to the outside of the device. Therefore, the liquid crystal display device can be made smaller and lighter, and the manufacturing cost can be reduced.

【0043】

[Example]

The present invention, yet another object of the present invention and yet other features of the present invention will become apparent from the following description with reference to the drawings.

【0044】

<< Active Matrix Liquid Crystal Display >> Hereinafter, an example in which the present invention is applied to an active matrix type color liquid crystal display will be described. In the drawings described below, those having the same function are designated by the same reference numerals, and the repeated description thereof will be omitted.

【0045】

<< Outline of Matrix Unit >> FIG. 2 is a plan view showing one pixel of an active matrix type color liquid crystal display device to which the present invention is applied and its surroundings, and FIG. 3 is a view showing a cross section at a 3-3 cutting line in FIG. , FIG. 4 is a cross-sectional view taken along the 4-4 cutting line of FIG. Further, FIG. 5 shows a plan view when a plurality of pixels shown in FIG. 2 are arranged.

【0046】

As shown in FIG. 2, each pixel has two adjacent scanning signal lines (gate signal line or horizontal signal line) GL and two adjacent video signal lines (drain signal line or vertical signal line) DL. It is located in the intersection area (in the area surrounded by four signal lines). Each pixel contains a thin film transistor TFT, a transparent pixel electrode ITO1 and a holding capacitance element Cadd. The scanning signal lines GL extend in the column direction, and a plurality of scanning signal lines GL are arranged in the row direction. The video signal lines DL extend in the row direction, and a plurality of video signal lines DL are arranged in the column direction.

【0047】

As shown in FIG. 3, the thin film transistor TFT and the transparent pixel electrode ITO1 are formed on the lower transparent glass substrate SUB1 side based on the liquid crystal LC, and the color filter FIL and the black matrix pattern BM for shading are formed on the upper transparent glass substrate SUB2 side. It is formed. The lower transparent glass substrate SUB1 has a thickness of, for example, about 1.1 mm. Further, silicon oxide film SIO formed by dipping or the like is provided on both sides of the transparent glass substrates SUB1 and SUB2. Therefore, even if there are sharp scratches on the surfaces of the transparent glass substrates SUB1 and SUB2, the sharp scratches can be covered with the silicon oxide film SIO, so that the scanning signal line GL, the light-shielding film BM, etc. deposited on the sharp scratches can be covered. The film quality can be kept homogeneous.

【0048】

A light-shielding film BM, a color filter FIL, a protective film PSV2, a common transparent pixel electrode ITO2 (COM), and an upper alignment film ORI2 are sequentially laminated on the inner surface (liquid crystal LC side) of the upper transparent glass substrate SUB2. There is.

【0049】

<< Overview around the matrix >> Fig. 17 shows the main plane around the matrix (AR) of the display panel PNL including the upper and lower glass substrates SUB1 and SUB2, Fig. 18 shows the plane that further exaggerates the peripheral part, and Fig. 19 shows the plane. It is a figure which shows the enlarged plane near the seal part SL corresponding to the panel upper left corner part of 17 and FIG. In addition, FIG. 20 is a diagram showing a cross section at the 19a-19a cutting line of FIG. 19 on the left side and a cross section near the external connection terminal DTM to which the video signal drive circuit should be connected on the right side, with the cross section of FIG. 3 in the center. is there. Similarly, FIG. 21 is a diagram showing a cross section near the external connection terminal GTM to which the scanning circuit should be connected on the left side and a cross section near the seal portion on the right side where there is no external connection terminal.

【0050】

In the manufacture of this panel, if small size divided from simultaneously processing a plurality fraction of the device in one glass substrate for improving throughput, standardized any breed for shared manufacturing facilities if large size After processing the glass substrate of the specified size, it is reduced to a size suitable for each variety, and in each case, the glass is cut after passing through a series of steps. 17 to 19 show an example of the latter, both of FIGS. 17 and 18 show the upper and lower boards SUB1 and SUB2 after cutting, FIG. 19 shows before cutting, and LN shows before cutting both boards. CT1 and CT2 indicate the positions to be cut on the substrates SUB1 and SUB2, respectively. In either case, the size of the upper board SUB2 is the size of the lower board SUB1 so that the parts (upper and lower sides and left side in the figure) where the external connection terminal groups Tg and Td (subscripts are omitted) are exposed in the completed state. Is restricted to the inside. The terminal groups Tg and Td are of the tape carrier package TCP (Figs. 22 and 23) on which the scanning circuit connection terminal GTM and the video signal circuit connection terminal DTM, which will be described later, and their lead-out wiring parts are integrated with the integrated circuit chip CHI, respectively. Multiple units are named together. The lead-out wiring from the matrix portion of each group to the external connection terminal portion is inclined as it approaches both ends. This is to match the terminal DTM and GTM of the display panel PNL with the array pitch of the package TCP and the connection terminal pitch of each package TCP.

【0051】

A seal pattern SL is formed between the transparent glass substrates SUB1 and SUB2 along the edge thereof so as to seal the liquid crystal LC except for the liquid crystal sealing port INJ. The sealing material is made of, for example, an epoxy resin. At least one common transparent pixel electrode ITO2 on the upper transparent glass substrate SUB2 side is connected to the lead wiring INT formed on the lower transparent glass substrate SUB1 side by the silver paste material AGP at the four corners of the panel in this embodiment. ing. This lead-out wiring INT is formed in the same manufacturing process as the gate terminal GTM and drain terminal DTM described later.

【0052】

Alignment films ORI1, ORI2, transparent pixel electrode ITO1, common transparent pixel electrode ITO2, and each layer are formed inside the seal pattern SL. The polarizing plates POL1 and POL2 are formed on the outer surfaces of the lower transparent glass substrate SUB1 and the upper transparent glass substrate SUB2, respectively. The liquid crystal LC is enclosed in a region partitioned by a seal pattern SL between the lower alignment film ORI1 and the upper alignment film ORI2 that set the orientation of the liquid crystal molecules. The lower alignment film ORI1 is formed on the upper part of the protective film PSV1 on the lower transparent glass substrate SUB1 side.

【0053】

In this liquid crystal display device, various layers are separately stacked on the lower transparent glass substrate SUB1 side and the upper transparent glass substrate SUB2 side to form a seal pattern SL on the substrate SUB2 side, and the lower transparent glass substrate SUB1 and the upper transparent glass substrate SUB2 are formed. Is assembled by superimposing and injecting liquid crystal LC from the opening INJ of the sealing material SL, sealing the injection port INJ with epoxy resin or the like, and cutting the upper and lower substrates.

【0054】

<< Thin film transistor TFT >> The thin film transistor TFT operates so that when a positive bias is applied to the gate electrode GT, the channel resistance between the source and the drain decreases, and when the bias is set to zero, the channel resistance increases.

【0055】

The thin film transistor TFT of each pixel is divided into two (plurality) in the pixel, and is composed of thin film transistor (divided thin film transistor) TFT1 and TFT2. The thin film transistors TFT1 and TFT2 are configured to have substantially the same size (channel length and channel width are the same). Each of the divided thin film transistors TFT1 and TFT2 is an i-type semiconductor composed of a gate electrode GT, a gate insulating film GI, and an i-type (intrinsic, intrinsic, conductive type-determining impurity-free) amorphous silicon (Si). It has a layer AS, a pair of source electrodes SD1 and a drain electrode SD2. It should be noted that the source and drain are originally determined by the bias polarity between them, and the polarity is reversed during operation in the circuit of this liquid crystal display device, so it should be understood that the source and drain are switched during operation. However, in the following description, for convenience, one is fixed as a source and the other is fixed as a drain.

【0056】

<< Gate electrode GT >> As shown in FIG. 6 (plan view showing only the second conductive film g2 and the i-type semiconductor layer AS in FIG. 2), the gate electrode GT is perpendicular to the scanning signal line GL (FIGS. 2 and FIG. It is composed of a shape that protrudes upward (upward at 6) (branched into a T shape). The gate electrode GT protrudes beyond the active regions of the thin film transistors TFT1 and TFT2. The gate electrodes GT of the thin film transistors TFT1 and TFT2 are integrally configured (as a common gate electrode) and are continuously formed on the scanning signal line GL. In this example, the gate electrode GT is formed of a single-layer second conductive film g2. The second conductive film g2 is formed with a film thickness of about 1000 to 5500 Å by using, for example, an aluminum (Al) film formed by sputtering. Further, an anodic oxide film AOF of Al is provided on the gate electrode GT.

【0057】

As shown in FIGS. 2, 3 and 6, the gate electrode GT is formed to be larger than that so as to completely cover the i-type semiconductor layer AS (when viewed from below). Therefore, when a backlight BL such as a fluorescent tube is attached below the lower transparent glass substrate SUB1, the gate electrode GT composed of this opaque Al becomes a shadow, and the i-type semiconductor layer AS is exposed to the backlight light. However, the conductive phenomenon due to light irradiation, that is, the deterioration of the off-characteristics of the thin film transistor is less likely to occur. The original size of the gate electrode GT is the minimum required to straddle between the source electrode SD1 and the drain electrode SD2 (including the alignment margin between the gate electrode GT, the source electrode SD1 and the drain electrode SD2). ) The depth length that has the width and determines the channel width W is the ratio of the distance (channel length) L between the source electrode SD1 and the drain electrode SD2, that is, the factor W / L that determines the mutual conductance gm. It depends on what you do. The size of the gate electrode GT in this liquid crystal display device is, of course, larger than the original size described above.

【0058】

<< Scanning signal line GL >> The scanning signal line GL is composed of the second conductive film g2. The second conductive film g2 of the scanning signal line GL is formed in the same manufacturing process as the second conductive film g2 of the gate electrode GT, and is integrally formed. Further, an anodic oxide film AOF of Al is also provided on the scanning signal line GL.

【0059】

<< Insulating film GI >> The insulating film GI is used as the gate insulating film of each of the thin film transistors TFT1 and TFT2. The insulating film GI is formed on the upper layer of the gate electrode GT and the scanning signal line GL. For the insulating film GI, for example, a silicon nitride film formed by plasma CVD is used, and the insulating film GI is formed with a film thickness of 1200 to 2700 Å (in this liquid crystal display device, a film thickness of about 2000 Å). As shown in FIG. 19, the gate insulating film GI is formed so as to surround the entire matrix portion AR, and the peripheral portion is removed so as to expose the external connection terminals DTM and GTM.

【0060】

<< i-type semiconductor layer AS >> As shown in FIG. 6, the i-type semiconductor layer AS is used as each channel forming region of the thin film transistors TFT1 and TFT2 divided into a plurality of parts. The i-type semiconductor layer AS is formed of an amorphous silicon film or a polycrystalline silicon film, and is formed with a film thickness of 200 to 2200 Å (in this liquid crystal display device, a film thickness of about 2000 Å).

【0061】

This i-type semiconductor layer AS changes the composition of the supply gas and Si₃N₄Following the formation of the insulating film GI used as the gate insulating film composed of the same plasma CVD apparatus, the insulating film GI is formed without being exposed to the outside from the plasma CVD apparatus. In addition, the N (+) type semiconductor layer d0 (Fig. 3) doped with 2.5% phosphorus (P) for ohmic contact also has a continuous film thickness of 200 to 500 Å (in this liquid crystal display device, a film of about 300 Å). (Thickness) is formed. After that, the lower transparent glass substrate SUB1 was taken out from the CVD apparatus, and the N (+) type semiconductor layer d0 and the i-type semiconductor layer AS became independent as shown in FIGS. 2, 3 and 6 by photoprocessing technology. It is patterned in an island shape.

【0062】

As shown in FIGS. 2 and 6, the i-type semiconductor layer AS is also provided between both the intersection (crossover portion) of the scanning signal line GL and the video signal line DL. The i-type semiconductor layer AS at the intersection reduces the short circuit between the scanning signal line GL and the video signal line DL at the intersection.

【0063】

<< Transparent Pixel Electrode ITO1 >> The transparent pixel electrode ITO1 constitutes one of the pixel electrodes of the liquid crystal display unit.

【0064】

The transparent pixel electrode ITO1 is connected to both the source electrode SD1 of the thin film transistor TFT1 and the source electrode SD1 of the thin film transistor TFT2. Therefore, even if a defect occurs in one of the thin film transistors TFT1 and TFT2, if the defect causes side effects, the appropriate part is cut by laser light or the like, otherwise the other thin film transistor operates normally. You can leave it as it is. It is rare that defects occur in two thin film transistors TFT1 and TFT2 at the same time, and the probability of point defects and line defects can be extremely reduced by such a redundant method. The transparent pixel electrode ITO1 is composed of a first conductive film d1, and this first conductive film d1 is composed of a transparent conductive film (Indium-Tin-Oxide ITO: Nesa film) formed by sputtering, and is a film of 1000 to 2000 Å. It is formed with a thickness (a film thickness of about 1400 Å in this liquid crystal display device).

【0065】

<< Source electrode SD1, Drain electrode SD2 >> The source electrode SD1 and drain electrode SD2 of the thin film transistor TFT1 and TFT2 divided into a plurality of parts are shown in FIGS. 2, 3 and 7 (the first to third conductive films in FIG. 2). As shown in the plan view showing only d1 to d3), they are provided separately on the i-type semiconductor layer AS.

【0066】

Each of the source electrode SD1 and the drain electrode SD2 is configured by sequentially superimposing the second conductive film d2 and the third conductive film d3 from the lower layer side in contact with the N (+) type semiconductor layer d0. The second conductive film d2 and the third conductive film d3 of the source electrode SD1 are formed in the same manufacturing process as the second conductive film d2 and the third conductive film d3 of the drain electrode SD2.

【0067】

The second conductive film d2 uses a chromium (Cr) film formed by sputtering, and is formed with a film thickness of 500 to 1000 Å (in this liquid crystal display device, a film thickness of about 600 Å). Since stress increases when the Cr film is formed thicker, it should be formed within a range not exceeding a film thickness of about 2000 Å. The Cr film has good contact with the N (+) type semiconductor layer d0. The Cr film constitutes a so-called barrier layer that prevents Al of the third conductive film d3, which will be described later, from diffusing into the N (+) type semiconductor layer d0. As the second conductive film d2, in addition to the Cr film, a refractory metal (Mo, Ti, Ta, W) film and a refractory metal silicide (MoSi)₂, TiSi₂, TaSi₂, WSi₂) A membrane may be used.

【0068】

The third conductive film d3 is formed to have a film thickness of 3000 to 5000 Å (in this liquid crystal display device, a film thickness of about 4000 Å) by sputtering Al. The Al film has less stress than the Cr film, can be formed to a thicker film thickness, and is configured to reduce the resistance values of the source electrode SD1, the drain electrode SD2, and the video signal line DL. As the third conductive film d3, an Al film containing silicon or copper (Cu) as an additive may be used in addition to the pure Al film.

【0069】

After patterning the second conductive film d2 and the third conductive film d3 with the same mask pattern, the N (+) type semiconductor layer d0 is used with the same mask or with the second conductive film d2 and the third conductive film d3 as masks. Is removed. That is, the portion of the N (+) type semiconductor layer d0 remaining on the i-type semiconductor layer AS other than the second conductive film d2 and the third conductive film d3 is self-aligned. At this time, since the N (+) type semiconductor layer d0 is etched so that the entire thickness thereof is removed, the surface portion of the i-type semiconductor layer AS is also slightly etched, but the degree is controlled by the etching time. do it.

【0070】

The source electrode SD1 is connected to the transparent pixel electrode ITO1. The source electrode SD1 has the i-type semiconductor layer AS step (the film thickness of the second conductive film g2, the film thickness of the anodic oxide film AOF, the film thickness of the i-type semiconductor layer AS, and the film thickness of the N (+) type semiconductor layer d0. It is configured along a step corresponding to the added film thickness). Specifically, the source electrode SD1 is composed of a second conductive film d2 formed along the step of the i-type semiconductor layer AS and a third conductive film d3 formed on the upper portion of the second conductive film d2. ing. Since the Cr film of the second conductive film d2 cannot be formed thickly due to the increase in stress and cannot overcome the stepped shape of the i-type semiconductor layer AS, the third conductive film d3 of the source electrode SD1 overcomes this i-type semiconductor layer AS. Is configured for. That is, the step coverage is improved by forming the third conductive film d3 thickly. Since the third conductive film d3 can be formed thick, it greatly contributes to the reduction of the resistance value of the source electrode SD1 (the same applies to the drain electrode SD2 and the video signal line DL).

【0071】

<< Protective film PSV1 >> A protective film PSV1 is provided on the thin film transistor TFT and the transparent pixel electrode ITO1. The protective film PSV1 is mainly formed to protect the thin film transistor TFT from moisture and the like, and a film having high transparency and good moisture resistance is used. The protective film PSV1 is formed of, for example, a silicon oxide film or a silicon nitride film formed by a plasma CVD apparatus, and is formed with a film thickness of about 1 μm.

【0072】

As shown in FIG. 19, the protective film PSV1 is formed so as to surround the entire matrix portion AR, the peripheral portion is removed so as to expose the external connection terminals DTM and GTM, and the common electrode COM of the upper substrate side SUB2 is lowered. The part connected to the external connection terminal connection lead wiring INT of the side board SUB1 with silver paste AGP has also been removed. Regarding the thickness relationship between the protective film PSV1 and the gate insulating film GI, the former is thickened in consideration of the protective effect, and the latter is thinned in the transconductance gm of the transistor. Therefore, as shown in FIG. 19, the protective film PSV1 having a high protective effect is formed larger than the gate insulating film GI so as to protect the peripheral portion over as wide a range as possible.

【0073】

<< Light-shielding film BM >> A light-shielding film BM is provided on the upper transparent glass substrate SUB2 side so that external light (light from above in FIG. 3) is not incident on the i-type semiconductor layer AS used as a channel forming region. The light-shielding film BM has a pattern as shown in the hatching in FIG. Note that FIG. 8 is a plan view showing only the first conductive film d1 composed of the ITO film, the color filter FIL, and the light-shielding film BM in FIG. The light-shielding film BM is formed of, for example, an aluminum film or a chromium film having a high light-shielding property, and in this liquid crystal display device, the chromium film is formed to a film thickness of about 1300 Å by sputtering.

【0074】

Therefore, the i-type semiconductor layer AS of the thin film transistors TFT1 and TFT2 is sandwiched by the light-shielding film BM and the large gate electrode GT on the upper and lower sides, and the portion is not exposed to external natural light or backlight light. As shown by the hatched portion in FIG. 8, the light-shielding film BM is formed around the pixels, that is, the light-shielding film BM is formed in a grid pattern (black matrix), and the effective display area of one pixel is partitioned by this grid. .. Therefore, the contour of each pixel is made clear by the light-shielding film BM, and the contrast is improved. That is, the light-shielding film BM has two functions of light-shielding the i-type semiconductor layer AS and a black matrix.

【0075】

Further, since the portion of the transparent pixel electrode ITO1 facing the edge portion on the root side in the rubbing direction (lower right portion in FIG. 2) is shielded by the light-shielding film BM, the domain can be seen even if a domain is generated in the above portion. Since there is no such thing, the display characteristics do not deteriorate.

【0076】

The backlight can be attached to the upper transparent glass substrate SUB2 side, and the lower transparent glass substrate SUB1 can be the observation side (external exposure side).

【0077】

The light-shielding film BM is also formed in a frame-like pattern on the peripheral portion as shown in FIG. 18, and the pattern is continuously formed with the pattern of the matrix portion shown in FIG. 8 in which a plurality of dots are provided. .. As shown in FIGS. 18 to 21, the light-shielding film BM in the peripheral portion is extended to the outside of the seal portion SL to prevent leaked light such as reflected light caused by a mounting machine such as a personal computer from entering the matrix portion. .. On the other hand, this light-shielding film BM is fastened to the inside by about 0.3 to 1.0 mm from the edge of the substrate SUB2, and is formed so as to avoid the cut region of the substrate SUB2.

【0078】

<< Color Filter FIL >> The color filter FIL is formed by coloring a dyeing base material formed of a resin material such as acrylic resin with a dye. The color filter FIL is formed in stripes at positions facing the pixels (Fig. 9) and dyed separately (Fig. 9 shows only the first conductive film d1 in Fig. 5, the light-shielding film BM, and the color filter FIL. The B, R, and G color filters FIL are 45 °, 135 °, and cross hatched, respectively). As shown in FIGS. It is formed inside the peripheral edge.

【0079】

The color filter FIL can be formed as follows. First, a dyeing base material is formed on the surface of the upper transparent glass substrate SUB2, and the dyeing base material other than the red filter forming region is removed by photolithography technology. After that, the dyeing base material is dyed with a red dye and fixed, to form a red filter R. Next, the green filter G and the blue filter B are sequentially formed by performing the same steps.

【0080】

<< Protective film PSV2 >> The protective film PSV2 is provided to prevent the dyes obtained by dyeing the color filter FIL in different colors from leaking to the liquid crystal LC. The protective film PSV2 is formed of a transparent resin material such as an acrylic resin or an epoxy resin.

【0081】

<< Common transparent pixel electrode ITO2 >> The common transparent pixel electrode ITO2 faces the transparent pixel electrode ITO1 provided for each pixel on the lower transparent glass substrate SUB1 side, and the optical state of the liquid crystal LC is the same as each pixel electrode ITO1. It changes in response to the potential difference (electric field) with the pixel electrode ITO2. A common voltage Vcom is applied to this common transparent pixel electrode ITO2. In this embodiment, the common voltage Vcom is set to the intermediate potential between the low-level drive voltage Vdmin applied to the video signal line DL and the high-level drive voltage Vdmax, but the integrated circuit used in the video signal drive circuit If you want to reduce the power supply voltage by about half, you can apply an AC voltage. For the planar shape of the common transparent pixel electrode ITO2, refer to FIGS. 18 and 19.

【0082】

<< Gate terminal section >> Fig. 10 is a diagram showing the connection structure from the scanning signal line GL of the display matrix to its external connection terminal GTM, where (A) is a flat surface and (B) is the BB cutting line of (A). The cross section is shown. The figure corresponds to the lower part of Fig. 19, and the diagonal wiring part is shown as a straight line for convenience.

【0083】

AO is a mask pattern for photographic processing, in other words a photoresist pattern for selective anodization. Therefore, this phosphate is removed after anodizing, and the pattern AO shown in the figure does not remain as a finished product, but the oxide film AOF is selectively formed on the gate wiring GL as shown in the cross-sectional view, so that the locus is traced. Remain. In the plan view, the left side is a region covered with a resist and not anodized, and the right side is a region exposed from the resist and anodized with reference to the boundary line AO of the resist. The anodized AL layer g2 has its oxide Al on its surface.₂O₃The film AOF is formed and the volume of the lower conductive part decreases. Of course, anodization is performed by setting an appropriate time, voltage, etc. so that the conductive portion remains. The mask pattern AO does not intersect the scanning line GL with a single straight line, but bends and intersects in a crank shape.

【0084】

In the figure, the AL layer g2 is hatched for easy understanding, but the non-anodated region is patterned in a comb shape. This is because if the width of the Al layer is wide, whiskers are generated on the surface, so the width of each one is narrowed, and by bundling them in parallel, the whiskers are prevented from occurring and the wire breaks. The aim is to minimize the sacrifice of probability and conductivity. Therefore, in this example, the part corresponding to the root of the comb is also shifted along the mask AO.

【0085】

The gate terminal GTM has a Cr layer g1 that has good adhesion to the silicon oxide SIO layer and has higher electrical contact resistance than Al, etc., and a transparent conductive layer that protects the surface and has the same level (same layer, simultaneous formation) as the pixel electrode ITO1. It is composed of d1. In addition, the conductive layers d2 and d3 formed on the gate insulating film GI and its side surface have regions so that the conductive layers g2 and g1 are not etched together due to pinholes during etching of the conductive layers d3 and d2. It remains as a result of covering with a photoresist. In addition, the ITO layer d1 extending to the right beyond the gate insulating film GI is a complete measure of the same measures.

【0086】

In the plan view, the gate insulating film GI is formed on the right side of the boundary line, and the protective film PSV1 is also formed on the right side of the boundary line. You can make contact with each other. In the figure, only one pair of the gate wire GL and the gate terminal is shown, but in reality, a plurality of such pairs are arranged one above the other as shown in FIG. The left end of the gate terminal is configured and extended beyond the substrate cutting region CT1 and shorted by the wiring SHg during the manufacturing process. Such a short-circuit wire SHg in the manufacturing process is useful for supplying power during anodization and preventing electrostatic breakdown during rubbing of the alignment film ORI1.

【0087】

<< Drain terminal DTM >> Fig. 11 is a diagram showing the connection from the video signal line DL to its external connection terminal DTM, (A) shows the plane, and (B) shows the cross section of the BB cutting line of (A). Shown. The figure corresponds to the vicinity of the upper right of FIG. 19, and the orientation of the drawing is changed for convenience, but the right end direction corresponds to the upper end portion (or lower end portion) of the substrate SUB1.

【0088】

The TSTd is an inspection terminal, and no external circuit is connected to it, but the width is wider than the wiring part so that the probe needle and the like can be contacted. Similarly, the drain terminal DTM is wider than the wiring portion so that it can be connected to an external circuit. The inspection terminal TSTd and the externally connected drain terminal DTM are arranged alternately in a staggered manner in the vertical direction, and the inspection terminal TSTd is terminated without reaching the end of the board SUB1 as shown in the figure, but the drain terminal DTM is , As shown in Fig. 19, the terminal group Td (subscript omitted) is configured and further extended beyond the cutting line CT1 of the substrate SUB1, and all of them are short-circuited to each other by the wiring SHd to prevent electrostatic breakdown during the manufacturing process. .. A drain connection terminal is connected to the opposite side of the video signal line DL matrix where the inspection terminal TSTd exists, and conversely, an inspection terminal is connected to the opposite side of the video signal line DL matrix where the drain connection terminal DTM exists. Is connected.

【0089】

The drain connection terminal DTM is formed of two layers, a Cr layer g1 and an ITO layer d1, for the same reason as the gate terminal GTM described above, and is connected to the video signal line DL at the portion where the gate insulating film GI is removed. The semiconductor layer AS formed on the end of the gate insulating film GI is for etching the edge of the gate insulating film GI in a tapered shape. On the terminal DTM, the protective film PSV1 is of course removed in order to connect to an external circuit. AO is the above-mentioned anodizing mask, and its boundary line is formed so as to largely surround the entire matrix. In the figure, the left side from the boundary line is covered with the mask, but the part not covered by this figure has layer g2. This pattern is not directly related as it does not exist.

【0090】

As shown in (C) of Fig. 20, the lead wiring from the matrix part to the drain terminal part DTM is on the same level as the video signal line DL just above the layers d1 and g1 at the same level as the drain terminal part DTM. The structure is such that layers d2 and d3 are laminated halfway through the seal pattern SL, which minimizes the probability of disconnection and protects the easily exposed Al layer d3 with the protective film PSV1 or seal pattern SL as much as possible. The aim is to do it.

【0091】

<< Structure of Retention Capacity Element Cadd >> The transparent pixel electrode ITO1 is formed so as to overlap the adjacent scanning signal line GL at the end opposite to the end connected to the thin film transistor TFT. As is clear from FIGS. 2 and 4, this superposition is a holding capacitance element (capacitance element) in which the transparent pixel electrode ITO1 is used as one electrode PL2 and the adjacent scanning signal line GL is used as the other electrode PL1. Configure Cadd. The dielectric film of the holding capacitance element Cadd is composed of an insulating film GI and an anodic oxide film AOF used as a gate insulating film of the thin film transistor TFT.

【0092】

As is clear from FIG. 6, the holding capacitance element Cadd is formed in a portion where the width of the second conductive film g2 of the scanning signal line GL is widened. The second conductive film g2 at the portion intersecting the video signal line DL is thinned in order to reduce the probability of a short circuit with the video signal line DL.

【0093】

Even if the transparent pixel electrode ITO1 is broken at the stepped portion of the electrode PL1 of the holding capacitance element Cadd, the defect is caused by the island region composed of the second conductive film d2 and the third conductive film d3 formed so as to straddle the stepped portion. Will be compensated.

【0094】

<< Equivalent circuit of the entire display device >> Fig. 12 shows a connection diagram of the equivalent circuit of the display matrix section and its peripheral circuits. Although the figure is a circuit diagram, it is drawn corresponding to the actual geometric arrangement. AR is a matrix array in which a plurality of pixels are arranged two-dimensionally.

【0095】

In the figure, X means the video signal line DL, and the subscripts G, B, and R are added corresponding to the green, blue, and red pixels, respectively. Y means the scanning signal line GL, and the subscripts 1, 2, 3, ..., End are added according to the order of scanning timing.

【0096】

The video signal line X (subscript omitted) is connected to the upper video signal drive circuit He. That is, the video signal line X has a terminal drawn out only on one side of the liquid crystal display panel PNL, similarly to the scanning signal line Y.

【0097】

The scanning signal line Y (subscript omitted) is connected to the vertical scanning circuit V.

【0098】

SUP provides information for CRT (Cathode Ray Tube) from the power supply circuit and host (upper arithmetic processing device) to obtain multiple divided and stabilized voltage sources from one voltage source, and information for TFT liquid crystal display device. It is a circuit including a circuit to be replaced with.

【0099】

<< Equivalent circuit of holding capacitance element Cadd and its operation >> Fig. 13 shows the equivalent circuit of the pixels shown in Fig. 2. In FIG. 13, Cgs is a parasitic capacitance formed between the gate electrode GT of the thin film transistor TFT and the source electrode SD1. The dielectric film of parasitic capacitance Cgs is the insulating film GI and the anodized film AOF. Cpix is a liquid crystal capacitance formed between the transparent pixel electrode ITO1 (PIX) and the common transparent pixel electrode ITO2 (COM). The dielectric films of the liquid crystal capacity Cpix are the liquid crystal LC, the protective film PSV1, and the alignment films ORI1 and ORI2. Vlc is the midpoint potential.

【0100】

The holding capacitance element Cadd works to reduce the influence of the gate potential change ΔVg on the midpoint potential (pixel electrode potential) Vlc when the thin film transistor TFT is switched. This situation can be expressed by an equation as follows.

【0101】

ΔVlc = {Cgs / (Cgs + Cadd + Cpix)} × ΔVg Here, ΔVlc represents the change in the midpoint potential due to ΔVg. This change ΔVlc causes a DC component applied to the liquid crystal LC, but the larger the holding capacity Cadd, the smaller the value can be. In addition, the holding capacitance element Cadd also has the effect of prolonging the discharge time, and accumulates video information for a long time after the thin film transistor TFT is turned off. Reducing the DC component applied to the liquid crystal LC can improve the life of the liquid crystal LC and reduce the so-called burn-in in which the previous image remains when the liquid crystal display screen is switched.

【0102】

As described above, the gate electrode GT is enlarged so as to completely cover the i-type semiconductor layer AS, so that the overlap area with the source electrode SD1 and the drain electrode SD2 increases, and therefore the parasitic capacitance Cgs increases, and the midpoint The potential Vlc has the opposite effect of being more susceptible to the gate (scanning) signal Vg. However, this demerit can be eliminated by providing the holding capacitance element Cadd.

【0103】

Retention capacitance The retention capacitance of the element Cadd is 4 to 8 times (4, Cpix <Cadd <8, Cpix) with respect to the liquid crystal capacitance Cpix, and 8 to 32 times (8) with respect to the parasitic capacitance Cgs, due to the writing characteristics of the pixels. Set the value to about Cgs <Cadd <32 Cgs).

【0104】

<< Connection method of holding capacitance element CAD electrode wire >> First-stage scanning signal line GL (Y) used only as holding capacitance electrode wire₀) Is set to the same potential as the common transparent pixel electrode ITO2 (Vcom) as shown in FIG. In the example of FIG. 19, the scanning signal line of the first stage is short-circuited to the common electrode COM through the terminal GT0, the leader line INT, the terminal DT0, and the external wiring. Alternatively, the holding capacity electrode wire Y of the first stage₀Is connected to the scanning signal line Yend of the final stage, connected to a DC potential point (AC grounding point) other than Vcom, or one extra scanning pulse Y from the vertical scanning circuit V.₀You may connect to receive.

【0105】

<< Connection structure with external circuit >> Fig. 22 shows a tape carrier in which the integrated circuit chip CHI, which constitutes the scanning signal drive circuit V and the video signal drive circuits He and Ho, is mounted on a flexible wiring board (commonly known as TAB, Tape Automated Bonding). It is a figure which shows the cross-sectional structure of a package TCP, and FIG. 23 is a cross-sectional view of a main part which shows the state which it connected to the terminal DTM for a video signal circuit in this example of a liquid crystal display panel.

【0106】

In the figure, TB is the input terminal / wiring part of the integrated circuit CHI, and TM is the output terminal / wiring part of the integrated circuit CHI. The bonding pad PAD of the integrated circuit CHI is connected by the so-called face-down bonding method. The outer tips (commonly known as outer leads) of the terminals TB and TM correspond to the inputs and outputs of the semiconductor integrated circuit chip CHI, respectively, and can be attached to the CRT / TFT conversion circuit / power supply circuit SUP by soldering, etc., and the anisotropic conductive film ACF. Connected to the LCD display panel PNL. The package TCP is connected to the panel so that its tip covers the protective film PSV1 that exposes the connection terminal DTM on the panel PNL side. Therefore, the external connection terminal DTM (GTM) is at least the protective film PSV1 or the package TCP. On the other hand, because it is covered, it becomes strong against electric contact.

【0107】

BF1 is a base film made of polyimide or the like, and SRS is a solder resist film for masking so that solder does not adhere to unnecessary parts during soldering. The gaps between the upper and lower glass substrates on the outer side of the seal pattern SL are protected by epoxy resin EPX or the like after cleaning, and silicone resin SIL is further filled between the package TCP and the upper substrate SUB2 to multiplex the protection.

【0108】

<< Manufacturing Method >> Next, the manufacturing method on the substrate SUB1 side of the liquid crystal display device described above will be described with reference to FIGS. 14 to 16. In the figure, the characters in the center are abbreviations for the process names, the left side shows the pixel portion shown in FIG. 3, and the right side shows the processing flow in terms of the cross-sectional shape near the gate terminal shown in FIG. Except for step D, steps A to I are divided according to each photographic process, and each cross-sectional view of each step shows the stage where the processing after the photographic process is completed and the photoresist is removed. It should be noted that the photographic processing refers to a series of operations from the application of the photoresist to the selective exposure using a mask and the development thereof, and the repeated explanation is avoided. The following description will be given according to the divided steps.

【0109】

Process A, Figure 14 Silicon oxide film SIO is provided on both sides of the lower transparent glass substrate SUB1 made of 7059 glass (trade name) by dip processing, and then baked at 500 ° C for 60 minutes. A first conductive film g1 made of chromium having a film thickness of 1100 Å is provided on the lower transparent glass substrate SUB1 by sputtering, and after photoprocessing, the first conductive film g1 is selectively etched with a second cerium ammonium nitrate solution as an etching solution. .. As a result, the anodized bus line SHg that connects the gate terminal GTM, drain terminal DTM, and gate terminal GTM, the bus line SHd that short-circuits the drain terminal DTM, and the anodized pad connected to the anodized bus line SHg (not shown). To form.

【0110】

Process B, Figure 14 A second conductive film g2 composed of Al-Pd, Al-Si, Al-Si-Ti, Al-Si-Cu, etc. having a film thickness of 2800 Å is provided by sputtering. After the photographic treatment, the second conductive film g2 is selectively etched with a mixed acid solution of phosphoric acid, nitric acid and glacial acetic acid.

【0111】

Process C, Figure 14 After phototreatment (after the above-mentioned anodizing mask AO formation), a solution prepared by adjusting 3% tartrate with ammonia to PH 6.25 ± 0.05 was diluted 1: 9 with ethylene glycol solution, and the substrate SUB1 was placed in an anodized solution. Immerse and chemical current density is 0.5mA / cm²Adjust so that (constant current conversion). Next, the predetermined Al₂O₃Anodize until the chemical conversion voltage 125V required to obtain the film thickness is reached. After that, it is desirable to hold it in this state for several tens of minutes (constant voltage chemical conversion). This is a uniform Al₂O₃It is important to obtain a film. As a result, the conductive film g2 is anodized, and an anodized film AOF having a film thickness of 1800 Å is formed on the scanning signal line GL, the gate electrode GT and the electrode PL1. Process D, Figure 15 Ammonia gas, silane gas, and nitrogen gas are introduced into the plasma CVD device to provide a Si nitride film with a thickness of 2000 Å, and silane gas and hydrogen gas are introduced into the plasma CVD device to provide an i-type amorphous film with a thickness of 2000 Å. After the Si film is provided, hydrogen gas and phosphine gas are introduced into the plasma CVD apparatus to provide an N (+) type amorphous Si film having a film thickness of 300 Å.

【0112】

Process E, Figure 15 After photo processing, SF as dry etching gas₆, CCl₄The islands of the i-type semiconductor layer AS are formed by selectively etching the N (+) type amorphous Si film and the i-type amorphous Si film using.

【0113】

Process F, Figure 15 After photo processing, SF as dry etching gas₆The Si nitride film is selectively etched using.

【0114】

Process G, Figure 16 A first conductive film d1 made of an ITO film having a film thickness of 1400 Å is provided by sputtering. After the photographic treatment, the first conductive film d1 is selectively etched with a mixed acid solution of hydrochloric acid and nitric acid as an etching solution to form the uppermost layer of the gate terminal GTM, the drain terminal DTM, and the transparent pixel electrode ITO1.

【0115】

Process H, Fig. 16 A second conductive film d2 made of Cr having a film thickness of 600 Å is provided by sputtering, and a third conductive film made of Al-Pd, Al-Si, Al-Si-Ti, Al-Si-Cu, etc. having a film thickness of 4000 Å is further provided. d3 is provided by sputtering. After the photo processing, the third conductive film d3 is etched with the same liquid as in step B, and the second conductive film d2 is etched with the same liquid as in step A to form the video signal line DL, the source electrode SD1 and the drain electrode SD2. To do. Next, CCl in the dry etching equipment₄,SCIENCE FICTION₆Is introduced and the N (+) type amorphous Si film is etched to selectively remove the N (+) type semiconductor layer d0 between the source and the drain.

【0116】

Process I, Figure 16 Ammonia gas, silane gas, and nitrogen gas are introduced into the plasma CVD apparatus to provide a Si nitride film having a film thickness of 1 μm. After photo processing, SF as dry etching gas₆The protective film PSV1 is formed by selectively etching the Si nitride film by the photo-etching technique using.

【0117】

<< Overall Configuration of Liquid Crystal Display Module >> FIG. 1 is an exploded perspective view of the liquid crystal display module MDL, and the specific configurations of each component are shown in FIGS. 24 to 45.

【0118】

SHD is a shield case made of a metal plate (also called a metal frame), WD is a display window, INS1 to 3 are insulating sheets, PCB1 to 3 are circuit boards (PCB1 is a drain side circuit board, PCB2 is a gate side circuit board, and PCB3 is. Interface circuit board), JN is a joiner that electrically connects circuit boards PCB1 to 3, TCP1 and TCP2 are tape carrier packages, PNL is a liquid crystal display panel, GC is a rubber cushion, ILS is a light-shielding spacer, PRS is a prism sheet, SPS is a diffusion sheet, GLB is a light guide plate, RFS is a reflective sheet, MCA is a lower case (mold case) formed by integral molding, LP is a fluorescent tube, LPC is a lamp cable, GB is a rubber that supports fluorescent tube LP It is a bush, and each member is stacked in a vertical arrangement as shown in the figure to assemble the liquid crystal display module MDL.

【0119】

The module MDL has two types of storage / holding members, a lower case MCA and a shield case SHD. Insulation sheet INS1 ~ 3, circuit board PCB1 ~ 3, liquid crystal display panel PNL is stored and fixed metal shield case SHD, and the lower side that houses the backlight BL consisting of fluorescent tube LP, light guide plate GLB, prism sheet PRS, etc. The module MDL is assembled by combining with the case MCA.

【0120】

Hereinafter, each member will be described in detail.

【0121】

<< Metallic Shield Case SHD >> Fig. 25 shows the top surface, front side surface, rear side surface, right side surface, and left side surface of the shield case SHD, and Fig. 1 shows a perspective view of the shield case SHD when viewed from diagonally above. Shown.

【0122】

The shield case (metal frame) SHD is manufactured by punching and bending a single metal plate using press working technology. WD indicates an opening that exposes the display panel PNL in the field of view, and is hereinafter referred to as a display window.

【0123】

NL is a fixing claw (12 in total) between the shield case SHD and the lower case MCA, and HK is also a fixing hook (4 in total), which is integrally provided in the shield case SHD. The fixing claws NL shown in FIGS. 1 and 25 are fixed in a square shape provided on the lower case MCA by being bent inward after storing the circuit boards PCB1 to 3 in the shield case SHD in the state before bending. It is inserted into the recess NR (see each side view in FIG. 37). The fixing hooks HK are fitted to the fixing protrusions HP (see the side view of FIG. 37) provided on the lower case MCA, respectively. As a result, the shield case SHD that holds and stores the liquid crystal display panel PNL, the circuit boards PCB1 to 3, etc., and the lower case MCA that holds and stores the light guide plate GLB, the fluorescent tube LP, etc. are firmly fixed. In addition, a thin and elongated rectangular rubber cushion GC (also referred to as a rubber spacer, see FIGS. 1 and 43) is provided around the four edges that do not affect the display on the lower surface of the display panel PNL. The rubber cushion GC is interposed between the display panel PNL and the light guide plate GLB. By pushing the shield case SHD toward the inside of the device using the elasticity of the rubber cushion GC, the fixing hook HK is caught by the fixing protrusion HP, and the fixing claw NL is bent and inserted into the fixing recess NR. Each fixing member functions as a stopper, the shield case SHD and the lower case MCA are fixed, and the entire module is firmly held as one, and no other fixing member is required. Therefore, it is easy to assemble and the manufacturing cost can be reduced. In addition, the mechanical strength is high, the vibration and shock resistance is high, and the reliability of the device can be improved. In addition, since the fixing claw NL and the fixing hook HK are easy to remove (just extend the bending of the fixing claw NL and remove the fixing hook HK), it is easy to disassemble and assemble the two members, so repair is easy. , It is easy to replace the fluorescent tube LP of the backlight BL. Further, in this embodiment, as shown in FIG. 25, one side is mainly fixed by the fixing hook HK, and the other side facing each other is fixed by the fixing claw NL. Since it is fixed, it can be disassembled by simply removing some of the fixing claws NL without removing all the fixing claws NL. Therefore, it is easy to repair or replace the backlight.

【0124】

CH is a common through hole provided in the same plane position as circuit boards PCB1 to 3, and the shield case SHD and circuit board PCB1 to 3 are placed in order on the pins that are fixed and erected at the time of manufacture. By inserting and mounting the CH, the relative positions of the two can be set accurately. Further, when the module MDL is mounted on an applied product such as a personal computer, the common through hole CH can be used as a positioning reference.

【0125】

FGN is a total of 12 frame ground claws formed integrally with the metal shield case SHD, which extends into a "U" -shaped opening on the side of the shield case SHD, in other words, a square opening. It is composed of elongated protrusions. This elongated protrusion, that is, the claw FGN, is bent at the root in the direction toward the inside of the device, and is connected to the ground wiring (not shown) of the circuit boards PCB1 to 3 frame ground pad FGP (see FIGS. 24 and 27). ) Is connected by soldering. Since the claw FGN is provided on the side of the shield case SHD, the work of bending the claw FGN inside the device and soldering it to the frame ground pad FGP is a circuit board PCB1 to 3 integrated with the liquid crystal display panel PNL. Can be performed with the inner surface (lower surface) of the shield case SHD facing up after the shield case SHD is stored and fixed, and the workability is good. Further, when the claw FGN is bent, the claw FGN does not hit the circuit boards PCBs 1 to 3, so that the bending workability is good. Further, in the soldering work, the soldering iron can be applied from the inner surface side of the opened shield case SHD, so that the soldering workability is good. Therefore, the connection reliability between the claw FGN and the frame ground pad FGP can be improved.

【0126】

SH1 to SH4 are four mounting holes provided in the shield case SHD in order to mount the module MDL as a display unit on an information processing device such as a personal computer or a word processor. The lower case MCA also has mounting holes MH1 to MH1 to 4 that match the mounting holes SH1 to 4 of the shield case SHD (see Fig. 37 and Fig. 38). Fixed and mounted. By the way, when the mounting holes are provided at the corners of the metal shield case SHD, a parallel surface that is integrated with the metal plate constituting the metal shield case SHD and has a height different from that of the metal plate is formed. The part made by drawing) can be made into a 1/4 circular shape. However, due to the arrangement of the mounting components of the circuit board PCB3 and the electrical connection between the circuit boards PCB1 and PCB2, we do not want to provide the mounting hole SH in the corner, but want to provide it in the middle part at a predetermined distance from the corner. In this case, the shape of the drawing part DR of the mounting hole SHD cannot be 1/4 circular shape due to drawing processing, but it becomes 1/2 circular shape, and the area required for the mounting hole becomes large. .. Therefore, as shown in FIG. 25, by providing a notch L in a 1/4 circular radius portion between the drawing portion DR and the metal plate adjacent thereto, drawing processing becomes easy and the mounting hole is formed. The drawn portion DR of SH1 can be made into a 1/4 circular shape, and the area required for the mounting hole can be reduced. Therefore, the module MDL can be made smaller and lighter, and the manufacturing cost can be reduced. In other words, the mounting hole SH can be provided in the intermediate portion at a predetermined distance from the corner of the module MDL while realizing the miniaturization of the module MDL.

【0127】

<< Circuit boards PCB1 to 3 >> Fig. 26 shows a bottom view and cross-sectional views showing a state in which circuit boards PCB1 to 3 are mounted on the outer periphery of the display panel PNL, and FIG. 24 shows the display panel PNL and circuit boards PCB1 to 3. Is a bottom view and each cross-sectional view showing the state of being housed and mounted in the shield case SHD, and FIG. 27 is a bottom view of the circuit boards PCB1 to 3 (PCB1 and 2 show the state where TCP is not mounted, and PCB3 is 24 and 26 are shown in more detail), FIG. 29 (A) is a bottom view of the circuit board PCB3 without electronic components mounted, (B) is a bottom view with electronic components mounted, and FIG. 31 is a bottom view. A bottom view of the circuit board PCB1 (showing a state in which TCP is not mounted) and FIG. 32 are a bottom view of the circuit board PCB2 (showing a state in which TCP is not mounted).

【0128】

CHI1 and CHI2 are drive IC (integrated circuit) chips that drive the display panel PNL (5 on the lower side of Fig. 26 are drive IC chips on the vertical scanning circuit side, and 10 on the left side are drive IC chips on the video signal drive circuit side. ). As explained in Fig. 22 and Fig. 23, TCP1 and TCP2 are equipped with a tape carrier package in which the drive IC chip CHI is mounted by the tape automated bonding method (TAB), and PCB1 and PCB2 are mounted with TCP and capacitor CDS, respectively. It is a circuit board consisting of PCB (Printed Circuit Board). FGP is the frame ground pad, JN3 is the joiner that electrically connects the drain side circuit board PCB1 and the gate side circuit board PCB2, and JN1 and JN2 are the joiners that electrically connect the drain side circuit board PCB1 and the interface circuit board PCB3. Is. Joiners JN1 to 3 shown in FIG. 35 are configured by sandwiching and supporting a plurality of lead wires (phosphor bronze material with Sn plating) between a striped polyethylene layer and a polyvinyl alcohol layer. JN1 to JN1 to 3 can also be configured using an FPC (Flexible Printed Circuit).

【0129】

That is, the circuit boards PCBs 1 to 3 of the display panel PNL are arranged in a "U" shape on the three outer peripheral portions of the display panel PNL. A plurality of drive IC chips (drivers) CHI1 that give drive signals to the video signal lines (drain signal lines) of the display panel PNL are mounted on the outer periphery of one long side (left side in FIG. 24) of the display panel PNL. The drain side circuit board PCB1 on which the tape carrier package TCP1 is mounted is arranged. In addition, a plurality of tape carriers each equipped with a drive IC chip CHI2 that gives a drive signal to the scanning signal line (gate signal line) of the display panel PNL on the outer periphery of the short side (lower side of FIG. 24) of the display panel PNL. The gate side circuit board PCB2 on which the package TCP2 is mounted is placed. Further, an interface circuit board (also referred to as a control circuit board or a converter circuit board) PCB3 is arranged on the outer periphery of the other short side (upper side of FIG. 24) of the display panel PNL.

【0130】

Since the circuit boards PCB1 to 3 are divided into three substantially rectangular shapes, the stress generated in the long axis direction of the circuit boards PCB1 to 3 due to the difference in the coefficient of thermal expansion between the display panel PNL and the circuit boards PCB1 to 3 ( Stress) is absorbed at Joiner JN1 ~ 3, and the connection strength is weak. The output lead of the tape carrier package TCP (TTM in Fig. 22 and Fig. 23) and the external connection terminal of the liquid crystal display panel PNL (DTM in Fig. 22 and Fig. 23). (GTM)) can be prevented from peeling off, and it also contributes to stress relaxation of the input lead of the tape carrier package TCP, and the reliability of the module against heat can be improved. In such a substrate division method, since each has a simple quadrangular shape as compared with one "U" -shaped substrate, a large number of substrates PCBs 1 to 3 can be used from one substrate material. It can be obtained, the utilization rate of the printed circuit board material is increased, and the cost of parts and materials can be reduced (in the case of this embodiment, it was reduced to about 50%). If flexible FPCs (Flexible Printed Circuits) are used instead of PCBs (Printed Circuit Boards) made of glass epoxy resin, etc. for circuit boards PCB1 to 3, the FPCs will bend, further preventing lead peeling. Can be enhanced. It is also possible to use an integrated "U" -shaped PCB that is not divided, in which case it is possible to reduce man-hours, simplify manufacturing process management by reducing the number of parts, and improve reliability by eliminating the joiner between circuit boards. effective.

【0131】

As shown in FIG. 27, the frame ground pads FGP connected to the ground wirings of the three circuit boards PCBs 1 to 3 are provided with 5, 4, and 3, respectively, for a total of 12 pieces. When the circuit board is divided into multiple parts, if at least one of the drive circuit boards is connected to the frame ground in terms of direct current, no electrical problem will occur, but if there are few such parts in the high frequency region, EMI (Electromagnetic) due to reflection of electric signals, potential fluctuation of ground wiring, etc. due to differences in characteristic impedance of each drive circuit board, etc. The potential for generating unnecessary radiated radio waves that cause interference) increases. In particular, the active matrix module MDL using a thin film transistor uses a high-speed clock, so it is difficult to take EMI countermeasures. In order to prevent this, the ground wiring (AC ground potential) is connected to a common frame (that is, shield case SHD) having a sufficiently low impedance at at least one place for each of the plurality of divided circuit boards. As a result, the ground wiring in the high frequency region is strengthened, so compared to the case where only one location is connected to the shield case SHD in total, in the case of 12 locations in this example, the electric field strength of radiation is improved by 5 dB or more. Was done.

【0132】

As mentioned above, the frame ground claw FGN of the shield case SHD is composed of elongated metal protrusions, and can be easily connected to the frame ground pads FGP of circuit boards PCB1 to 3 by bending, and a special wire for connection ( No lead wire) is required. Further, since the shield case SHD and the circuit boards PCB1 to 3 can be mechanically connected via the claw FGN, the mechanical strength of the circuit boards PCB1 to 3 can be improved.

【0133】

Conventionally, in order to suppress the generation of unnecessary radiated radio waves that cause EMI, a plurality of resistors / capacitors for smoothing the signal waveform are dispersed near the signal source integrated circuit or in the middle of the signal transmission path. Was placed. Therefore, since many spaces are required for providing the resistors / capacitors in the vicinity of the signal source integrated circuit or between the tape carrier packages, the dead space becomes large and electronic components can be mounted at high density. There wasn't. In this embodiment, as shown in FIG. 24, a plurality of capacitors / resistors CR for EMI countermeasures are far from the signal source integrated circuit TCON (described in detail later) provided on the interface circuit board PCB3, and also. At the end of the drain side circuit board PCB1 on the downstream side in the signal flow direction of multiple drive IC chips CHI1, which is farther than the drive IC chip CHI1 of the drain side circuit board PCB1 that receives the signal from the signal source integrated circuit TCON. They are arranged in a concentrated manner. Therefore, the dead space can be reduced and the electronic components can be mounted at a high density as compared with the distributed arrangement. Therefore, the module MD can be made smaller and lighter, and the manufacturing cost can be reduced.

【0134】

<< Drain-side circuit board PCB1 >> As shown in FIG. 24, only one drain-side circuit board PCB1 is arranged on only one side (left side in FIG. 24) of the long side of the display panel PNL. That is, like the scanning signal line GL, the video signal line DL has a terminal drawn out only on one side of the liquid crystal display panel PNL. Therefore, compared to the configuration in which the video signal lines are alternately drawn out on the two opposite long sides of the display panel PNL and the drain side circuit boards are arranged outside each long side, the so-called frame portion around the display unit Since the area can be reduced, the external dimensions of the liquid crystal display module MDL and the information processing device (see FIG. 47) such as a personal computer and a word processor incorporating the liquid crystal display module MDL can be reduced in size and therefore reduced in weight. be able to. As a result, the material can be reduced, so that the manufacturing cost can be reduced. As shown in FIG. 47, the side on which the drain side circuit board PCB1 is arranged is a position where the module MDL is arranged on the upper side of the screen when it is mounted on a personal computer, a word processor, or the like. For this reason, notebook-type personal computers and word processors usually require a space at the bottom of the screen to provide a hinge for attaching the display to the keyboard, so the drain-side circuit board is placed at the top of the screen. By doing so, the vertical position of the screen becomes appropriate. In FIG. 31, JP11 is a pad to which the joiner JN1 is connected, JP12 is a pad to which the joiner JN2 is connected, and JP13 is a pad to which the joiner JN3 is connected.

【0135】

In the conventional module in which the video signal lines are alternately drawn out above and below the liquid crystal display panel and the two drain side circuit boards are arranged on both the upper and lower sides of the outer peripheral portion of the liquid crystal display panel, they come in from an external personal computer or the like. Since the electronic components are arranged along the flow of the signal flowing in the module, a connector for connecting to a personal computer or the like and a signal source integrated circuit TCON are arranged in the center of the interface circuit board. When the drain side circuit board PCB1 is arranged on one side of the liquid crystal display panel PNL as in this embodiment, if the electronic components are arranged along the signal flow as in the conventional method, the drain side circuit of the interface circuit board PCB3 is arranged. The connector CT is arranged at the end far from the substrate PCB1, that is, the end closest to the corner of the shield case SHD (see FIG. 24. In this embodiment, it is not arranged at the corner of the shield case SHD. ), Then, the layout is such that the signal source integrated circuit TCON is placed next to the direction away from the corner. Here, if the connector CT is to be placed at the end of the circuit board PCB3, that is, at the corner of the shield case SHD, the upper part of the connector CT is connected to a personal computer or the like and cannot be covered with the lower case MCA ( The corners of the shielded case SHD with the mounting hole SH4 (the notch MLC of the lower case MCA shown in Figure 37 is located above the connector CT) can be covered with the lower case MCA with the matching mounting hole MH4. It disappears and the mechanical strength decreases. Therefore, in this embodiment, as shown in FIG. 24, the low-height signal source integrated circuit TCON is arranged on the end of the circuit board PCB3, that is, on the circuit board PCB3 near the corner of the shield case SHD, and the corner is formed. The vicinity is covered with the lower case MCA, and the connector CT is placed next to the direction away from the corner. That is, since the vicinity of the corner of the shield case SHD provided with the mounting hole SH4 is covered by the lower case MCA provided with the matching mounting hole MH4, the module MDL can be used as information on a personal computer or the like. When mounted on a processing device, the corners of the shield case SHD and lower case MCA of the module MDL are firmly pressed and fixed by screws etc. via the mounting holes SH4 and mounting holes MH4 of both, improving mechanical strength. However, the reliability of the product is improved. As shown in FIG. 47, the signal coming from the personal computer or the like first goes from the connector CT to the signal source integrated circuit TCON, and then flows to the drive IC chip CHI1 of the drain side circuit board PCB1. Therefore, since the signal flow is in order, it is possible to eliminate the useless signal flow, so that the useless wiring can be reduced and the area of the circuit board can be reduced.

【0136】

Further, in the embodiment shown in FIG. 24, the signal source integrated circuit TCON and the connector CT are provided on the interface circuit board PCB3 on the side opposite to the connection side (the side with the joiners JN1 and JN2) with the drain side circuit board PCB1. ing. Therefore, as shown in FIG. 47, the connection cable with the host is shortened by mounting the liquid crystal display module MDL on a personal computer, a word processor, etc. with the side without the drain side circuit board PCB1 facing the hinge. be able to. As a result, it is possible to reduce the noise invading from the connection cable between the host and the liquid crystal display module MDL. Further, since the connection between the host and the signal source integrated circuit TCON can be minimized, it can be further strengthened against noise intrusion. Furthermore, it is also resistant to waveform blunting delay.

【0137】

<< Gate-side circuit board PCB2 >> FIG. 32 is a plan (bottom surface) view of the circuit board PCB2. JP23 is a pad to which Joiner JN3 is connected.

【0138】

<< Tape Carrier Package TCP >> FIG. 33 is a plan (bottom) view of the tape carrier package TCP on which the integrated circuit chip CHI is mounted.

【0139】

The structure of the tape carrier package TCP and the connection structure with the liquid crystal display panel PNL have already been described with reference to FIGS. 22 and 23, which are cross-sectional views, in << Connection structure with an external circuit >>.

【0140】

The planar shape of the package TCP is shown in FIG. The small outer width of the terminal TM and TB corresponds to the narrow terminal pitch. That is, the dimensions of the output terminal TM connected to the display panel PNL are matched to the pitch of the input terminals of the panel PNL, and the input terminal TB connected to the input terminal TB connected to the circuit board PCB1 or PCB2. The dimensions of are matched to the pitch of the output terminals of the circuit board PCB1 or PCB2.

【0141】

The width of either the output terminal portion TM or the input terminal portion TB may be smaller than the outermost outer width.

【0142】

FIG. 34 is a plan (bottom) view and a side view showing a state in which a plurality of tape carrier package TCPs are mounted on the circuit boards PCB1 and PCB2.

【0143】

<< Interface circuit board PCB3 >> Fig. 29 (A) is a top view of interface circuit board PCB3 (connector CT, hybrid integrated circuit HI mounted), and (B) is signal source integrated circuit TCON, IC, capacitor, resistor, etc. It is a top view (connector CT and hybrid integrated circuit HI are mounted on the dotted line) with the components mounted. The interface circuit board PCB3 includes electronic components such as ICs, capacitors, and resistors, as well as a power supply circuit for obtaining multiple divided and stabilized voltage sources from one voltage source, and a host (upper arithmetic processing device). It is equipped with a circuit that converts the information for the CRT (cathode ray tube) from the above into the information for the TFT liquid crystal display device (see Fig. 12). CT is a connector connected to an information processing device such as a personal computer on which the module MD is mounted, and TCON is a signal source integrated circuit that processes image information sent from the host and converts it into a liquid crystal drive signal. , Generates a timing pulse, drives and controls the gate side circuit board PCB2 and the drain side circuit board PCB1, and displays the data on the liquid crystal display device. JP31 is the connection part to which the joiner JN1 is connected, and JP32 is the connection part to which the joiner JN2 is connected.

【0144】

<< Electrical connection between circuit boards PCB1 to 3 >> Fig. 36 is a plan view showing a state in which joiners JN1 and JN2, which electrically connect the drain side circuit board PCB1 and the interface circuit board PCB3, are mounted in two layers. It is a side view.

【0145】

In recent years, with the progress of multicoloring of color liquid crystal display devices, the number of video signal lines that specify the gradation of red, green, and blue has increased, and the number of gradation voltages has increased. The part having the function of the interface between the set side of the personal computer or the like in which the module is incorporated and the module is complicated, and it is becoming difficult to electrically connect the drain side circuit board and the interface circuit board in particular. In addition to the increase in the number of video signal lines due to the rapid increase in the number of colors in the liquid crystal display device, the number of connected lines is extremely large because the gradation voltage, clock, and power supply voltage that increase in proportion to the number of colors are also connected. There are many.

【0146】

As shown in FIG. 24, at the corner of the shield case SHD in which the two drain-side circuit board PCB1 and the interface circuit board PCB3 are adjacent to each other, each connection line is drawn out to each adjacent end of the circuit board PCB1 and the circuit board PCB3. In addition, a large number of terminals arranged in 4 rows of 2 rows each are electrically connected using two joiners JN1 and JN2 arranged in two stages in the thickness direction of the circuit board. There is. By effectively utilizing the space in the thickness direction of the module MDL and using the joiners provided in multiple stages to connect the circuit boards in this way, it is possible to connect in a small space even if the number of connection line terminals is large. , The module MDL can be made smaller and lighter, and the manufacturing cost can be reduced. In FIG. 36, JT1 is a terminal of the joiner JN1, JT2 is a terminal of the joiner JN2, PT1 is a connection terminal of the circuit board PCB1, and PT3 is a connection terminal of the circuit board PCB3.

【0147】

It should be noted that the number of joiners can be arranged not only in two stages but also in three or more stages. In addition, the electrical connection between the drain side circuit board PCB1 and the gate side circuit board PCB2 uses one joiner JN3 (see Fig. 1), but this is also connected by multiple joiners provided in multiple stages. You may.

【0148】

The mounting holes for the module MDL are usually located at the corners of the module MDL. However, when trying to make an electrical connection between the circuit boards PCB1 and PCB3 using Joiner JN, as shown in Fig. 46, the shape of one of the circuit boards PCB3 is not a square shape, but a special shape with a protruding part. Become. With such a shape, the board removal efficiency of the circuit board is poor, and the material cost of the circuit board is increased. Therefore, in this embodiment, as shown in FIG. 24, the mounting holes SH1 and SH2 of the shield case SHD (and the mounting holes MH1 and MH2 of the corresponding lower case MCA) are displaced from the corners of the module MDL, that is, the shield case SHD. As a result, the space for connecting the joiner JN can be secured while the circuit boards PCB1, PCB2, and PCB3 remain substantially square (the circuit board PCB3 has a notch for the mounting hole SH1). ), The board removal efficiency of the circuit board is good, and the material cost of the circuit board can be reduced.

【0149】

<< Hybrid integrated circuit HI and electronic components EP mounted on the interface circuit board PCB3 in a two-story building >> FIG. 30 is a side view and a front side view of the hybrid integrated circuit HI mounted on the interface circuit board PCB3.

【0150】

The hybrid integrated circuit HI shown in FIG. 24 is configured by hybrid-integrating a part of the circuit and mounting a plurality of integrated circuits and electronic components on the upper and lower surfaces of a small circuit board, and one on the interface circuit board PCB3. It is implemented. As shown in FIG. 30, the lead HL of the hybrid integrated circuit HI is formed long, and a plurality of electronic component EPs are also mounted on the circuit board PCB3 between the circuit board PCB3 and the hybrid integrated circuit HI. In the past, when the number of parts was large, the circuit boards on which the parts were mounted were stacked in multiple stages and the circuit boards were connected to each other using a joiner. By using this system, the number of electronic components can be reduced, and since a separate circuit board and joiner are not required (the lead HL of the hybrid integrated circuit HI corresponds to the joiner), the material cost can be reduced. Moreover, the number of work steps can be reduced. Therefore, the manufacturing cost can be reduced and the reliability of the product can be improved.

【0151】

<< Insulation sheet INS >> Insulation sheets INS1 to 3 shown in FIG. 28 are arranged between the metal shield case SHD and the circuit boards PCB1 to 3 to insulate them. LT is a double-sided adhesive tape that adheres the insulating sheets INS1 to 3 and the liquid crystal display panel PNL, and ST is a double-sided adhesive tape that adheres the insulating sheets INS1 to 3 and the shield case SHD.

【0152】

<< Lower Case MCA >> FIG. 37 is a top view, an upper side view, a rear side view, a right side view, and a left side view of the lower case MCA, and FIG. 38 is a bottom view of the lower case MCA.

【0153】

The lower case MCA formed by molding is a holding member for fluorescent tube LP, lamp cable LPC, light guide plate GLB, etc., that is, a backlight storage case, and is made by integrally molding with a single mold with synthetic resin. Be done. As described in detail in << Shield Case SHD >>, the lower case MCA is firmly united with the metal shield case SHD by the action of each fixing member and elastic body, so the vibration and impact resistance of the module MDL, Thermal impact resistance can be improved and reliability can be improved.

【0154】

On the bottom surface of the lower case MCA, a large opening MO occupying an area of more than half of the surface is formed in the central portion excluding the surrounding frame-shaped portion. As a result, after assembling the module MDL, the repulsive force of the rubber cushion GC (see Fig. 42) between the liquid crystal display panel PNL and the light guide plate GLB applies vertically to the bottom surface of the lower case MCA from the top surface to the bottom surface. The force can prevent the bottom surface of the lower case MCA from bulging, and the maximum thickness can be suppressed. Therefore, in order to suppress the swelling, it is not necessary to increase the thickness of the lower case, and the thickness of the lower case can be reduced, so that the module MDL can be made thinner and lighter.

【0155】

The MLC is a notch provided in the lower case MCA of the part corresponding to the mounting part of the interface circuit board PCB3, and in this embodiment, the power supply circuit (DC-DC converter) converted into a hybrid IC (Fig. 27). (Including notch for connector CT connection shown). In this way, by providing a notch without covering the heat generating portion on the circuit board PCB3 with the lower case MCA, the heat dissipation of the heat generating portion of the interface circuit board PCB3 can be improved. That is, at present, in order to improve the performance and ease of use of a liquid crystal display device using a thin film transistor TFT, it is required to have multiple gradations and a single power supply. The circuit for realizing this consumes a large amount of power, and when the circuit means is compactly mounted, it becomes a high-density mounting, and heat generation becomes a problem. Therefore, by providing the lower case MCA with a notched MLC corresponding to the heat generating portion, it is possible to improve the high-density mountability and compactness of the circuit. In addition to this, the signal source integrated circuit TCON is considered to be a heat generating component, and the lower case MCA above this may be cut out.

【0156】

MH1 to MH1 to 4 are four mounting holes for mounting the module MD to an application device such as a personal computer. The metal shield case SHD also has mounting holes SH1 to SH4 that match the mounting holes MH1 to 4 of the lower case MCA, and is fixed and mounted on the applied product using screws or the like.

【0157】

<< Backlight BL >> Fig. 40 (A) is a top view of the main parts of the fluorescent tube LP, lamp cable LPC1, LPC2, rubber bush GB1 and GB2 of the backlight BL, and (B) is a cross-sectional view of the BB cutting line of (A). Is.

【0158】

The backlight BL that supplies light to the display panel PNL is a single cold cathode fluorescent tube LP, fluorescent tube LP lamp cables LPC1, LPC2, fluorescent tube LP and rubber bushes GB1 and GB2 that hold the lamp cable LPC, and a light guide plate. It is composed of GLB, a diffusion sheet SPS arranged in contact with the entire upper surface of the light guide plate GLB, a reflection sheet RFS arranged on the entire lower surface of the light guide plate GLB, and a prism sheet PRS arranged in contact with the entire upper surface of the light guide plate SPS. Fluorescent lamp.

【0159】

In the module MDL, the elongated fluorescent tube LP is arranged in the space under the drain side circuit board PCB1 and the tape carrier package TCP1 mounted on one of the long sides of the liquid crystal display panel PNL. As a result, the external dimensions of the module MDL can be reduced, so that the module MDL can be made smaller and lighter, and the manufacturing cost can be reduced.

【0160】

The rubber bushes GB1 and GB2 hold both one cold cathode fluorescent tube LP and the lamp cables LPC1 and LPC2. That is, the fluorescent tube LP is a hole H having a larger inner diameter of the rubber bushes GB1 and GB2 (a substantially keyhole shape as shown in FIG. 40 (B) connecting a hole having a larger inner diameter and a hole having a smaller inner diameter)._LThe lamp cable LPC1 inserted into and held at one end of the fluorescent tube LP is inserted and held in the groove GBD provided in the rubber bush GB2, and further, the lamp is pulled out in the same direction as the lamp cable LPC1. Cable LPC2 is the hole H of the rubber bush GB2 on the cable outlet side, which has the smaller inner diameter of GBH._SIt is inserted and held in. The main part of the hole GBH does not penetrate the rubber bushes GB1 and GB2, but at least the rubber bush GB2 on the cable outlet side has a small hole H in the hole GBH in order to pull out the lamp cable LPC2 from the rubber bush GB2._SA through hole with a small inner diameter is formed in communication with the above. With such a configuration, when pulling out two lamp cables in one direction, the lamp cable protrudes from the module because there is no space for the lamp cable to pass through and the lamp cable is not passed through the rubber bush in the prior art. In this embodiment, since the lamp cable LPC1 does not protrude from the lower case MCA, the space of the module MDL can be saved, the module MDL can be made smaller and lighter, and the manufacturing cost can be reduced. Can be done. Also, since the rubber bushes GB1 and GB2 hold both the fluorescent tube LP and the lamp cable LPC, the holding power of the lamp cable LPC holds the rubber bushes GB1 and GB2 that hold the fluorescent tube LP, so that the fluorescence is fluorescent. The retention of tube LP can be improved. The rubber bush GB1 holds the fluorescent tube LP and one lamp cable LPC1, and the rubber bush GB2 holds the fluorescent tube LP and two lamp cables LPC1 and LPC2. The bush GB1 shares the same shape as the rubber bush GB2.

【0161】

The shapes of the holes or grooves provided in the rubber bushes GB1 and GB2 for holding the fluorescent tube LP and the lamp cable LPC are not limited to those shown in the figure. For example, the holes or grooves for holding the fluorescent tube LP and the two lamp cable LPCs may be provided independently, or the holes or grooves for the fluorescent tube LP and the one or two lamp cable LPCs may be shared as appropriate. May be good. Further, the rubber bush GB1 has a hole or groove for holding the fluorescent tube LP and one lamp cable LPC1, and the rubber bush GB2 has a hole or groove for holding the fluorescent tube LP and the two lamp cables LPC1 and LPC2. As such, the rubber bush GB1 and the rubber bush GB2 may have different shapes.

【0162】

<< Storage of fluorescent tube LP, lamp cable LPC, rubber bush GB in the lower case MCA >> Fig. 39 (A) shows the backlight BL (fluorescent tube LP, lamp cable LPC, rubber bush GB, inside the lower case MCA. The top view showing the state in which the light guide plate GLB) is housed and mounted, (B) is a cross-sectional view of the BB cutting line of (A), and (C) is a cross-sectional view of the CC cutting line of (A).

【0163】

In FIG. 37 showing the inner surface (upper surface) of the lower case MCA, MB is the holding part of the light guide plate GLB, ML is the storage part of the fluorescent tube LP, MG is the storage part of the rubber bush GB, and MC1 is the storage part of the lamp cable LPC1. , MC2 is the storage part of the lamp cable LPC2.

【0164】

As shown in FIGS. 39 (A) to 39 (C), the backlight BL is housed in the lower case MCA, which is the backlight storage case. That is, the rubber bushes GB1 and GB2 holding the fluorescent tube LP and the lamp cable LPC are fitted into the storage portion MG shown in FIG. 37 formed so that the rubber bushes GB1 and GB2 fit snugly, and the fluorescent tube LP is on the lower side. It is stored in the storage unit ML without contact with the case MCA. The lamp cables LPC1 and LC2 are housed in the storage portions MC1 and MC2 formed by grooves formed in the lower case MCA so as to substantially follow the shape of the lamp cables LPC1 and 2. The lamp cable LPC1 and the lamp cable LPC2, which are close to the tip connected to the inverter IV, that is, after the rubber bush GB2, change their directions from the long axis direction of the circuit board PCB2 to almost perpendicular to the long axis direction of the circuit board PCB2. (See Fig. 1 and Fig. 39), It is housed in the space between the mounting hole MH3 (see Fig. 37) and the circuit board PCB2. Inverter IV is connected to the tip of the lamp cables LPC1 and LP2, and the inverter IV is housed in the inverter storage MI provided next to the circuit board PCB2 as shown in FIG. 39 (A). In this way, when the module MD is incorporated into an application product such as a personal computer, the lamp cable LPC does not pass through the outer side surface of the module, and the inverter IV does not protrude outside the module MD. The lamp cable LPC, rubber bush GB, and inverter IV can be stored and mounted compactly, the module MDL can be made smaller and lighter, and the manufacturing cost can be reduced.

【0165】

Although one fluorescent tube LP is arranged in this embodiment, two or more fluorescent tube LPs may be arranged, and the installation location may be the short side of the light guide plate GLB.

【0166】

<< Storage of the light guide plate GLB in the lower case MCA >> FIG. 41 is a cross-sectional view of a main part of the lower case MCA, the light guide plate GLB, the fluorescent tube LP, the lamp cable LPC, and the like.

【0167】

The conventional light guide plate has a large amount of wasted area for holding in the module and is significantly larger than the size of the effective light emitting portion. However, the light guide plate GLB of this embodiment has a square shape as shown in FIG. 39 (A). It has a rectangular shape, and the overall dimensions of the light guide plate GLB are as close as possible to the dimensions of the light emitting part. The three sides of the light guide plate GLB are held by the inner wall of the light guide plate storage part of the lower case MCA formed so as to fit almost exactly, and the remaining one side of the light guide plate GLB on the fluorescent tube LP side is the light guide plate GLB. It is held near the rubber bush GB on the inner surface (upper surface) of the lower case MCA between the fluorescent tube LP and the fluorescent tube LP by two minute protrusions (claw) PJs formed integrally with the lower case MCA. The protrusion PJ prevents the light guide plate GLB from moving to the fluorescent tube LP side, and prevents the light guide plate GLB from hitting the fluorescent tube LP and damaging the fluorescent tube LP. The lamp reflective sheet LS has a rectangular shape before installation, and after installation, the end of the long side of the lamp reflective sheet LS is adhered to the lower end of the reflective sheet RFS, and the fluorescent tube LP extends over the entire length. The other long side end is placed and held on the upper end of the prism sheet PRS. The lamp reflection sheet LS has a U-shaped cross section and is formed to have a length such that it is arranged inside the protrusion PJ. The protrusion PJ is formed as small as possible so as not to reduce the light utilization efficiency as much as possible.

【0168】

By making the size of the light guide plate GLB as close as possible to the size of the effective light emitting part and making it as small as possible in this way, electronic components can be mounted in the space occupied by the conventional light guide plate, and the lower case. By holding the light guide plate GLB by the protrusion PJ provided integrally with the MCA, the light guide plate GLB can be held in a small space, so that the module MDL can be made smaller and lighter, and the manufacturing cost can be reduced. be able to. In other words, it is possible to improve the luminous efficiency of the light guide plate GLB while realizing the miniaturization of the module MDL.

【0169】

The protrusion PJ does not necessarily have to be provided integrally with the lower case MCA, and a protrusion formed of another member such as metal may be attached to the lower case MCA.

【0170】

<< Diffusion Sheet SPS >> The diffusion sheet SPS is placed on the light guide plate BLB, diffuses the light emitted from the upper surface of the light guide plate GLB, and uniformly irradiates the liquid crystal display panel PNL with the light.

【0171】

<< Prism sheet PRS >> The prism sheet PRS is placed on the diffusion sheet SPS, and the lower surface is a smooth surface and the upper surface is a prism surface. The prism surface is composed of, for example, a plurality of grooves having a V-shaped cross section arranged in a straight line parallel to each other. The prism sheet PRS can improve the brightness of the backlight BL by collecting the light diffused from the diffusion sheet SPS over a wide angle range in the normal direction of the prism sheet PRS. Therefore, the power consumption of the backlight BL can be reduced, and as a result, the module MDL can be made smaller and lighter, and the manufacturing cost can be reduced.

【0172】

<< Reflective sheet RFS >> The reflective sheet RFS is arranged under the light guide plate GLB and reflects the light emitted from the lower surface of the light guide plate GLB toward the liquid crystal display panel PNL.

【0173】

<< Holding Structure of Light Guide Plate GLB and Liquid Crystal Display Panel PNL >> FIG. 42 is a cross-sectional view of a main part of a module MDL showing a holding structure of the light guide plate GLB and the liquid crystal display panel PNL.

【0174】

As shown in FIG. 42, the dimensions of the prism sheet PRS and the diffusion sheet SPS are larger than the dimensions of the light guide plate GLB, and the ends of the prism sheet PRS and the diffusion sheet SPS protrude from the end of the light guide plate GLB (overhang). ), Hanging on the side wall of the lower case MCA. A light-shielding spacer ILS made of rubber cushion GC and rubber is placed on the overhang of the prism sheet PRS and diffusion sheet SPS and on the side wall of the lower case MCA to pressurize the upper transparent glass substrate SUB2 of the liquid crystal display panel PNL. It is designed to be held (see << Liquid crystal display panel PNL holding structure >> and Fig. 44 below). As a result, both the prism sheet PRS and the diffusion sheet SPS or the diffusion sheet SPS enter the gap between the light guide plate GLB and the lower case MCA to prevent the light guide plate GLB from clinging, and the light guide plate GLB becomes a module MDL. It is held firmly inside. With the structure shown in FIG. 42, the pressure of the rubber cushion GC and the light-shielding spacer ILS is applied to the lower case MCA via the prism sheet PRS and the diffusion sheet SPS, and the liquid crystal display panel PNL is securely held in the module MDL, and the light guide plate. The holding power of GLB, liquid crystal display panel PNL, etc. is improved, and the reliability of the product can be improved.

【0175】

Here, both the prism sheet PRS and the diffusion sheet SPS are overhanged from the light guide plate GLB, but one of them may be overhanged. Further, here, the light guide plate GLB is overhanged on all four sides, but it is not always necessary to overhang on all four sides, and only one to three sides are effective.

【0176】

<< Holding Structure of Liquid Crystal Display Panel PNL >> FIG. 45 is a cross-sectional view of a main part showing a holding structure of a liquid crystal display panel PNL in a conventional liquid crystal display module MDL. FIG. 44 is a cross-sectional view of a main part showing a holding structure of a liquid crystal display panel PNL in the liquid crystal display module MDL according to an embodiment of the present invention.

【0177】

In the conventional liquid crystal display module MDL, as shown in FIG. 45, in order to fix the liquid crystal display panel PNL in the module MDL, rubber cushion GC is applied to both of the two transparent glass substrates constituting the liquid crystal display panel PNL. I was holding it down through. That is, as described in detail in << Shield Case SHD >>, by using the elasticity of the rubber cushion GC to push the shield case SHD toward the inside of the device, the shield case SHD and the lower case MCA are fixed by each fixing member. It is fixed (that is, the fixing hook HK is caught on the fixing protrusion HP, and the fixing claw NL is bent inward and inserted into the fixing recess NR). Therefore, conventionally, since the two transparent glass substrates are strongly pressed via the rubber cushion GC, the liquid crystal gap between the two transparent glass substrates of the liquid crystal display panel PNL is partially changed, causing display unevenness. .. Therefore, the liquid crystal display panel PNL could not be pressed very strongly, and sufficient mechanical strength could not be secured. On the other hand, in the present invention, as shown in FIG. 44, the dimensions of the two transparent glass substrates constituting the liquid crystal display panel PNL are changed, that is, the side where the terminals are not arranged (on the side of the interface circuit substrate PCB3). As for the side), the transparent glass substrate is projected from the other transparent glass substrate, one glass plate portion is provided over the three sides of the liquid crystal display panel PNL, and only one transparent glass substrate is placed on the one glass plate portion. Since it is pressed through the placed rubber cushion GC, the gap between the two transparent glass substrates does not change even if it is pressed strongly, and display unevenness does not occur. Therefore, the pressing force of the liquid crystal display panel PNL can be increased, and therefore the mechanical strength can be improved and the reliability can be improved. Further, a double-sided adhesive tape BAT is interposed between the upper surface of the single glass plate portion of the liquid crystal display panel PNL and the lower surface (inner surface) of the metal shield case SHD, and both are fixed. Note that FIG. 44 is a diagram showing an outline of the holding structure of the liquid crystal display panel PNL, and is actually guided between the rubber cushion GC and the lower case MCA.

【0178】

In the embodiment shown in FIG. 44, the prism sheet PRS is not overhanged on the light guide plate GLB because it is not limited to overhanging the prism sheet PRS described above.

【0179】

Although the present invention has been specifically described above based on the examples, the present invention is not limited to the above examples, and it goes without saying that various modifications can be made without departing from the gist thereof.

【0180】

[Effect of the invention]

As described above, according to the present invention, since the light guide plate and the liquid crystal display panel can be firmly pressed in the device without increasing the external dimensions, the mechanical strength can be improved and the device can be downsized. , The weight can be reduced, and the manufacturing cost can be reduced. Further, since the cable of the fluorescent tube of the backlight can be stored without protruding from the device, the device can be made smaller and lighter, and the manufacturing cost can be reduced. In addition, the retention of the fluorescent tube can be improved. Further, since the light guide plate of the backlight can be held in a small space, the device can be made smaller and lighter, and the manufacturing cost can be reduced. Further, since the large opening is provided in the central portion of the bottom surface of the mold case, it is possible to prevent the bottom surface of the mold case from bulging, and the liquid crystal display device can be made thinner and lighter. Further, since the backlight cable and the inverter can be stored without protruding to the outside of the device, the liquid crystal display device can be made smaller and lighter, and the manufacturing cost can be reduced.

[Simple explanation of drawings]

[Figure 1]

It is an exploded perspective view of the liquid crystal display module of the active matrix type color liquid crystal display device to which this invention is applied.

[Figure 2]

It is a main part plan view which shows one pixel of a liquid crystal display part and its periphery.

[Fig. 3]

It is sectional drawing which shows 1 pixel in 3-3 cutting line of FIG. 2 and the periphery thereof.

[Fig. 4]

It is sectional drawing of the additional capacity CAD in 4-4 cutting line of FIG.

[Fig. 5]

FIG. 5 is a plan view of a main part of a liquid crystal display unit in which a plurality of pixels shown in FIG. 2 are arranged.

[Fig. 6]

It is a top view which drew only the layer g2 and AS of the pixel shown in FIG.

[Fig. 7]

It is a top view which drew only the layer d1, d2, d3 of the pixel shown in FIG.

[Fig. 8]

It is a top view which showed only the pixel electrode layer ITO1, the light-shielding film BM, and the color filter layer FIL of the pixel shown in FIG.

[Fig. 9]

FIG. 5 is a plan view of a main part in which only the pixel electrode layer, the light-shielding film, and the color filter layer of the pixel arrangement shown in FIG. 5 are drawn.

[Fig. 10]

It is the figure of the plane and the cross section which shows the vicinity of the connection part of the gate terminal GTM and the gate wiring GL.

[Fig. 11]

It is the figure of the plane and the cross section which shows the vicinity of the connection part of a drain terminal DTM and a video signal line DL.

[Fig. 12]

It is an equivalent circuit diagram which shows the liquid crystal display part of the active matrix type color liquid crystal display device.

[Fig. 13]

It is the equivalent circuit diagram of the pixel shown in FIG.

[Fig. 14]

It is a flowchart of the cross-sectional view of the pixel part and the gate terminal part which shows the manufacturing process of the process A to C on the substrate SUB1 side.

[Fig. 15]

It is a flowchart of the cross-sectional view of the pixel part and the gate terminal part which shows the manufacturing process of the process D to F on the substrate SUB1 side.

[Fig. 16]

It is a flowchart of the cross-sectional view of the pixel part and the gate terminal part which shows the manufacturing process of the process G ~ I on the substrate SUB1 side.

[Fig. 17]

It is a top view for demonstrating the structure of the matrix peripheral part of the display panel.

[Fig. 18]

It is a panel plan view for exaggerating the peripheral part of FIG. 17 slightly and explaining more concretely.

[Fig. 19]

It is an enlarged plan view of the corner part of the display panel including the electrical connection part of the upper and lower boards.

[Fig. 20]

It is sectional drawing which shows the vicinity of a panel angle and the vicinity of a video signal terminal portion on both sides with the pixel portion of the matrix in the center.

[Fig. 21]

It is sectional drawing which shows the scanning signal terminal on the left side, and the panel edge part which does not have an external connection terminal on the right side.

[Fig. 22]

It is a figure which shows the cross-sectional structure of the tape carrier package TCP in which the integrated circuit chip CHI which constitutes a drive circuit is mounted on a flexible wiring board.

[Fig. 23]

It is sectional drawing of the main part which shows the state which the tape carrier package TCP is connected to the video signal circuit terminal DTM of a display panel PNL.

[Fig. 24]

Bottom view in which the liquid crystal display panel PNL and circuit boards PCB1 to PCB3 are incorporated in the shield case SHD, sectional view in AA cutting line, sectional view in AA cutting line, sectional view in BB cutting line, sectional view in CC cutting line, It is sectional drawing in the DD cutting line.

[Fig. 25]

It is a top view, a front side view, a rear side view, a right side view, and a left side view of a shield case SHD.

[Fig. 26]

In the bottom view of the circuit boards PCB1 to 3 on which the liquid crystal display panel PNL and the tape carrier package TCP are mounted, the cross-sectional view of the AA cutting line, the cross-sectional view of the BB cutting line, the cross-sectional view of the CC cutting line, and the cross-sectional view of the DD cutting line. is there.

[Fig. 27]

It is a detailed bottom view of the circuit boards PCB1 to 3 without mounting the tape carrier package TCP.

[Fig. 28]

It is a top view of the insulating sheets INS1 to 3, a cross-sectional view of the AA cutting line, a cross-sectional view of the BB cutting line, and a cross-sectional view of the CC cutting line.

[Fig. 29]

(A) is a top view of the interface circuit board PCB3, and (B) is a bottom view.

[Fig. 30]

It is a side view and the front side view of the hybrid integrated circuit HI mounted on the interface circuit board PCB3.

[Fig. 31]

It is a bottom view of the gate side circuit board PCB1.

[Fig. 32]

It is a bottom view of the gate side circuit board PCB2.

[Fig. 33]

It is a plane (bottom) view of the tape carrier package TCP.

[Fig. 34]

It is a plane (bottom) view and a side view of TCP in which a plurality of sheets are mounted.

[Fig. 35]

(A), (B), and (C) are plan views of Joiners JN1 to 3, respectively.

[Fig. 36]

It is a plan view and a side view of the mounted joiners JN1 and JN2.

[Fig. 37]

It is a top view, a front side view, a rear side view, a right side view, and a left side view of the lower case MCA.

[Fig. 38]

It is a bottom view of the lower case MCA.

[Fig. 39]

(A) is a top view of the light guide plate GLB, fluorescent tube LP, rubber bush GB, etc. housed in the lower case MCA, (B) is a cross-sectional view of the BB cutting line, and (C) is a cross-sectional view of the CC cutting line. is there.

[Fig. 40]

(A) is a top view of the main part of the backlight BL (fluorescent tube LP, lamp cable LPC, rubber bush GB), and (B) is a cross-sectional view of the AA cutting line.

[Fig. 41]

It is sectional drawing of the main part of the backlight BL (light guide plate GLB, fluorescent tube LP, etc.) housed in the lower case MCA.

[Fig. 42]

It is sectional drawing of the main part of the liquid crystal display module MD which shows the holding structure of a light guide plate GLB and a liquid crystal display panel PNL.

[Fig. 43]

It is a bottom view of the liquid crystal display panel PNL, the circuit boards PCB1 to 3 on which the tape carrier package TCP is mounted, and the rubber cushion GC.

[Fig. 44]

It is sectional drawing of the main part which shows the mounting state of the shield case SHD, the liquid crystal display panel PNL, the rubber cushion GC, and the lower case MCA.

[Fig. 45]

It is sectional drawing of the main part which shows the conventional mounting state of a shield case SHD, a liquid crystal display panel PNL, a rubber cushion GC, and a lower case MCA.

[Fig. 46]

It is a figure which shows the mounting hole SH of the conventional liquid crystal display module MDL.

[Fig. 47]

It is a perspective view of a notebook type personal computer or a word processor equipped with a liquid crystal display module MDL.

[Explanation of symbols]

GLB ... light guide plate, PNL ... liquid crystal display panel, SUB2 ... upper transparent glass substrate, SPS ... diffusion sheet, PRS ... prism sheet, SHD ... metal shield case, MCA .. Lower case, GC ... rubber cushion, LP ... fluorescent tube, LPC1, LPC2 ... lamp cable, GB1, GB2 ... rubber bush, GBH ... hole, GBD ... groove, BL ... backlight, GLB ... light guide plate, PJ ... protrusion, MCA ... lower case, GC ... rubber cushion, MO ... opening, IV ... inverter, MI ... Inverter compartment.