Radio-frequency identifying device, manufacture thereof and detecting system using device thereof

Description: TECHNICAL FIELD [Detailed description of the invention]

【0001】

[Industrial application field]

The present invention relates to radio frequency (RF) discriminators and detection systems for tracking data about humans or articles and articles in transit or storage. In particular, the present invention relates to a method for manufacturing an RF identification device having a size equal to or smaller than that of a postage stamp. The present invention also relates to a novel data processing method between the device and the operator at remote locations.

【0002】

[Conventional technology]

Traditionally, in the field of radio frequency identification (RFID), transmission systems have used relatively large devices, such as cigarette package dimensions. The device was generally made using hybrid circuit manufacturing techniques. This relatively large electronic device was attached to a railroad vehicle and used the reflection of RF signals to monitor the position and movement of the vehicle.

【0003】

Also, smaller passive RF discriminators have been used in the fields of vehicle tracking and vehicle transportation. This device utilizes reflection and was developed by Amtech Inc. (Dallas, Texas). However, this reflective RF identification device does not operate unless the impedance of the antenna is adjusted, requires a large driving force for operation, and can control only limited data.

【0004】

Therefore, for relatively small items in the field of postal services, which locate and track mail because the device is relatively large and expensive, or in fields such as handling and transporting baggage on airplanes. Not suitable for storage or transportation.

【0005】

For this reason, barcodes and OCR technologies are often used in the fields of conventional transportation tracking and inventory management. However, the use of these barcodes and OCR devices is labor intensive and requires many workers to operate the goods, and / or before the goods being transported arrive at their final destination. A barcode reader was required to read those barcodes. This bar code reader and OCR device are expensive, and the number of devices is inevitably limited, so that the work is time-consuming. In addition, barcode readers and OCR devices lacked reading reliability.

【0006】

A passive RF discriminator has also been developed by Hughes / IDI / Destron (Irbin, CA) in the areas of animal tracking and plant monitoring. The device is composed of a ferrite core wound with a coil. The device could only be used within a very limited range of 9 inches, could handle very limited data, and could not be rewritten by the user. In addition, the ability was limited and the operating speed was slow.

【0007】

[Problems to be Solved by the Invention]

An object of the present invention is to provide a novel RF, identification device, a manufacturing method thereof, and a detection system that eliminates the drawbacks of conventional RFID, OCR, and bar code tracking of articles and data processing systems. Although the present invention has described examples in the fields of baggage transportation of airplanes, postal services, and inventory control, it is applicable not only in this field but also in various fields.

【0008】

To achieve the above objectives, the inventors have developed a novel radio frequency (RF) identification device and a data processing system for transmitting data between RFID devices and operators separated from each other. This new device has a square shape with a side of about 1 inch, which is slightly larger than the size of the stamp, and is about 0.03 inch thick. The device comprises an integrated circuit (IC) chip, which is surrounded by a hard or flexible thin film sheet material. The IC chip is mounted in a package of approximately 1 square inch. The sheet material has an adhesive on its back surface, which is used to attach the device to the outer surface of the article or to a printed label. The IC chip decodes the receiving circuit for operating the logic circuit and the input data such as the identification number, the owner name, the starting point, the weight, the size, the route, and the destination, and stores the data. It is equipped with a memory circuit. The memory circuit includes, but is not limited to, PROMs, EPROMs, EEPROMs, SRAMs, DRAMs and ferroelectric memory. In addition, the IC chip includes a transmission circuit for transmitting the necessary data to a person who wants to retrieve the data in the memory. The RF antenna is made in a thin film sheet member or on the thin film sheet member in a predetermined shape and is arranged close to the IC chip. The thickness of this antenna is about 30 mils. The IC chip is connected to a battery, which operates the chip. The chip is equipped with a circuit that creates a non-start mode so that it is not driven during transportation or storage to reduce power consumption.

【0009】

Thus, data can be concord into the IC chip at the starting point, destination, or in transit by a single operator, and signals can be sent to the chip from a remote location to evoke the chip. In this way, the chip can be operated without the need for a number of people. In a preferred embodiment of the invention, the receive and transmit integrated circuits operate in spectral diffusion mode and at 200 MHz to 10 GHz, preferably 800 MHz to 8 GHz. This is to avoid malfunction or improper operation due to noise signal sources, multipath, or radiation reflected from the surroundings.

【0010】

Therefore, an object of the present invention is to provide a novel RFID device and a method for manufacturing the same. Another object of the present invention is to provide a novel RFID device having RF transmission and reception circuits in one chip and a detection system using the device for tracking a person or an article in storage or transportation. is there. Another object of the present invention is to provide a hybrid circuit, RFID tagging, bar code, bar code reader, OCR, and a novel electronic device that does not depend on a clean operating environment such as noise. Another object of the present invention is to provide novel electronic devices made using integrated circuits and mounting techniques. Another object of the present invention is to provide a novel electronic device having high yield, high price / high performance, high reliability, and economically excellent. Another object of the present invention is to provide a novel FRID device that is data writable and has a transmission distance of 5 feet or more. Another object of the present invention is to provide a novel manufacturing method for manufacturing a FRID apparatus. Another object of the present invention is to provide a novel method for manufacturing a FRID device that enables high-speed automation. Another object of the present invention is to provide a rapid handling method of a novel product such that the FRID apparatus can be supplied to a customer in a tape shape, a reel shape, a fan-shaped folded shape, or a sheet shape. Another object of the present invention is to provide a novel RFID device that is driven by an RF coil and a capacitor without using a battery. Such devices are described herein as "passive" devices. The word "passive" only refers to not using a battery. The electronic circuit of the IC chip is driven by a combination of an RF coil and a capacitor. Another object of the present invention is to provide a novel method for detecting the existence of articles, animals, humans and their exact positions. Another object of the present invention is to detect the presence and position of an article, a human being, a conventional small card, a magnetic card, The purpose is to provide a non-contact detection method that replaces barcodes and other contact-type electronic devices. This new detection method saves time, such as eliminating the need to remove the card from your pocket and swiping the card through a card reader before entering the security area of the building. Another object of the present invention is to provide a novel electronic device and transmission system that can solve problems in various fields such as the postal field of parcels and mail, the airplane field, inventory management, security, waste, and personnel management. To do.

【0011】

[Means for solving problems]

The RF identification device of the present invention has a rigid or flexible thin film support member, an IC chip provided on the support member, and is incorporated in the chip or is close to the chip at a predetermined position of the support member. The IC chip is provided with a circuit for receiving and encoding data about an article to be stored or transported, and reading the stored or transported data, and reading this data to a remote location. It is equipped with a circuit for transmitting to the operator of.

【0012】

In the device, the IC chip and the thin film battery are arranged on the support member, and these parts are sealed by the cover member. In this sealed state, the IC chip is connected in series with two batteries. The support member and the cover member include a conductive pattern layer for electrically connecting the battery and the IC chip. The IC chip and the antenna are connected by a conductive member. The IC chip includes a circuit that switches to a non-activation mode during transportation or storage of the article. In addition, the receiving and transmitting circuits in the IC chip are operated in the spread spectrum mode in order to prevent the IC chip from malfunctioning or improperly operating due to a noise signal source or an obstacle source such as radiation reflected from the surroundings. .. In addition, the back surface of the device is provided with an adhesive member for attaching the device to an article to be transported or stored. Further, the antenna, the battery, the capacitor and the inductor can be manufactured in a monolithic structure in one chip. Further, the antenna is electrically connected to the IC chip, and the IC chip is electrically connected to the contact point of the support member by flip-chip voiding.

【0013】

[Action]

Since an RFID device is made by storing an IC chip having transmission / reception and memory functions, a drive source of the chip, and an antenna in a package, various data related to articles and the like can be transmitted to the IC chip via the antenna. It can be sent to the receiving means, the output is stored in the memory, and the data in the memory can be called up as needed and supplied to the operator who needs the data at a remote location via the transmitting means and the antenna. .. As a result, a small RFID device can be made, and the existence and position of an article or the like can be traced quickly, easily, and accurately.

【0014】

[Example]

FIG. 1 shows a manufacturing process diagram of the RF identification device according to the present invention, and the manufacturing process consists of nine steps. These steps are described in detail in FIGS. 2, 3 and 4A-4D below. First, in the first step 10, a circuit pattern is formed on the substrate. The substrate is preferably made by laminating a barrier material such as polyethylene and / or polyvinylidene chloride (PVDC) and a film of polymer such as polyester. In the second step 12, the circuit pattern is cured. A conductive epoxy member is applied to the substrate. In the third step 14, the IC chip is arranged on the substrate. In the fourth step 16, two batteries are arranged on the substrate. These batteries may be stacked vertically to form an electrical series or parallel connection. In step 5, the epoxy member is cured. In the sixth step 20, the curing material is added to the cover member. In step 7, the rear battery epoxy member is applied to the cover member. The substrate is then folded in half to form the top cover. In the eighth step 24, the epoxy member is cured. In step 9, step 26, the package is sealed.

【0015】

FIG. 2 is a perspective view showing a tag of an RFID device according to an embodiment of the present invention. In this figure, the RFID tag has a support substrate 30, and an integrated circuit (IC) chip 32 is the substrate 30. It is arranged near the upper end. The IC chip 32 is connected to a dipole antenna. This antenna consists of a pair of conductive pieces 34,36 extending laterally from the IC chip 32. These conductive pieces 34 and 36 are formed by screen printing on the upper surface of the support substrate 30. The pair of rectangular batteries 38, 40 are arranged on the support substrate 30 and in close proximity to the IC chip 32. The two batteries 38 and 40 are electrically connected in series by the method described below to drive the IC chip 32. Next, in the device shown in FIG. 2, the package is made by bending the outer or upper cover member 42 and fixing the member to the exposed edge surface of the support substrate 30 to seal the package. The connection portion 50 is configured by providing a conductive epoxy member on a part inside the cover member 42, and when the cover member 42 is bent so as to cover the support substrate 30, the connection portion 50 and the battery 38 It is electrically connected in series with 40. The IC chip 32 has a transmission circuit, a memory circuit, a control circuit, a logic circuit and a reception circuit in it, and the batteries 38 and 40 transmit data to the operator and receive data from the operator. During that time, power is supplied. In this way, the RFID device provides the operator with various above-mentioned data and identification parameters regarding the attached article, animal, or person.

【0016】

FIG. 3 is a plan view of the support substrate 30 and the cover member 42. The support substrate 30 and the cover member 42 are joined at an intersection line 44 in the first step of manufacturing the RFID device. The dipole antenna pieces 34 and 36 are provided so as to extend from each side surface of the IC chip 32. The conductive pieces 46 and 48 connect the IC chip 32 and the batteries 38 and 40. The conductive piece 50 is provided on the inner surface of the upper cover 42. As a result, when the cover 42 is bent 180 degrees at the intersection line 44, the outer edge portion 52 of the upper cover 42 and the outer edge portion 54 of the support substrate 30 are fixed to each other. On the other hand, the conductive piece 50 is coupled to the batteries 38,40 by a conductive epoxy material, and the batteries 38,40 are electrically connected in series. Furthermore, IC chip 32 by the conductive strips 50 and the conductor pieces 46 and 48, back Terry 38, 40 are electrically connected in series.

【0017】

4A to 4D are cross-sectional views taken along the line 4A to 4D of FIG. 3, and FIG. 4A shows a cross-sectional view in which the IC chip 32 is coupled to the support substrate 30 by the conductive epoxy member 56. The conductive piece 48 is formed on the upper surface of the support substrate 30. This figure corresponds to steps 10, 12 and 14 in the manufacturing process diagram of FIG. FIG. 4B shows a cross-sectional view in which the battery 40 arranged at the position shown in FIG. 2 is coupled to the conductive piece 48 by a conductive epoxy member provided on the upper surface of the conductive piece 48. FIG. 4B corresponds to steps 16 and 18 in the manufacturing process diagram of FIG. FIG. 4C shows a cross-sectional view in which the curing material 58 is provided on the upper surface and the side surface of the IC chip 32. The hardened material 58 is preferably made of an insulating material such as a "glob-top" epoxy material to give the finished package the desired hardness. FIG. 4C corresponds to step 20 in the manufacturing process diagram of FIG. Conductive epoxy members are provided at each corner of the conductive piece 50. The cover member 42 provided with the conductive epoxy member is bent so as to cover the batteries 38, 40 and the support substrate 30. After this, the cover member is heated and cured. In this way, a sealed package of the shape shown in FIG. 4D is formed. This figure corresponds to steps 22, 24, 26 of the manufacturing process of FIG.

【0018】

5A and 5B are perspective views showing an RFID device according to another embodiment of the present invention, in which the RFID device is a combination of a battery 60 and a capacitor 62 disposed under an IC chip 64. Consists of. The battery 60 is provided on the upper surface 66 of the support substrate 68. The plate-shaped capacitors 62 parallel to each other are arranged between the upper surface of the battery 60 and the lower surface of the IC chip 64. To facilitate the electrical connection between the capacitor 62 and the battery 60, the capacitor 62 has an exposed surface on the left side and the battery 60 has an exposed surface 67. In FIGS. 5A and 5B, the exposed surface 65 of the capacitor 62 is provided on the left side, and the exposed surface 67 of the battery 60 is provided on the right side. Reference numerals 70, 72, 74 and 76 are antenna wires, which constitute two dipole antennas. Antenna wires 70,72,74,76 are connected to the IC chip at the opposite corners of the IC chip 64. The antenna wires 70, 72, 74, 76 are provided so as to extend in the X-shape from the corner of the IC chip 64. The upper polymer cover member 77 covers and seals all components disposed on 66 on the support substrate.

【0019】

6A-6E are cross-sectional views of line 6A-6E of FIG. 5A, in FIG. 6A, the substrate 78 is made of a relatively impermeable material such as PVDC and the first, i.e. polyester or polyethylene. It is made by laminating various polymer members. The substrate 78 has a suitable adhesive film 80 on its bottom surface. This adhesive film is used to attach the device when using it. The connection and attachment of the battery to the upper surface of the substrate 78 is performed by using the conductive epoxy member 94 (FIG. 6B) provided between the battery 60 and the capacitor 62 and between the capacitor 62 and the IC chip 64.

【0020】

In FIG. 6B, the thin film battery consists of plates 84 and 86 parallel to each other, the battery being provided on substrate 78. Further, the capacitor is composed of two plates 90 and 92 parallel to each other, and the capacitor is pressed and mounted on the battery 84 using a conductive epoxy film. The lower plate 92 of the capacitor 62 is made slightly larger in the lateral direction than the upper plate 90 to facilitate the electrical connection between the IC chip 96 and the battery 60 and the capacitor 62. Here, the IC chip 96 corresponds to the IC chip 64 of FIGS. 5A and 5B. The IC chip 96 is pressed and attached to the upper plate 90 using the conductive epoxy member 98 to form an electrical connection between the conductive film 98 and the IC chip 96. The bottom surface of the RFIC chip 96 is provided with a metal member to facilitate subsequent connections. In this manufacturing process, the epoxy member is heated, cured, or metal annealed in order to improve the sealing of the laminated substrate.

【0021】

In FIG. 6C, reference numeral 100 is a second insulating layer, and the insulating layer 100 is provided so as to cover a laminate composed of a battery / capacitor / IC chip. The insulating layer 100 includes openings 102,104,110,112, and the openings are for providing a conductive polymer member. The openings 102, 104, 110 and 112 formed in advance in the polymer layer 100 are aligned with the connection holes provided on the upper part of the battery, the capacitor and the RFID chip 96, respectively. The second polymer layer 100 is attached to the substrate 78 using ordinary heating or adhesive means to form a seal.

【0022】

In FIG. 6D, the conductive polymer member 108 is provided in the openings 102 and 104 formed on the lower side of the second polymer layer 100, and extends into the openings 110 and 112 formed on the upper side thereof. It is present and makes an electrical connection with the top surface of the RFID chip 96. The conductive epoxy member 108 is formed using a stamping machine or milk screen technology and is provided on the upper surface of the second polymer layer 100. The conductive epoxy member 108 forms the deepest part of the antenna shown in FIGS. 5A and 5B extending from the IC chip 96 in a dual dipole shape. The antenna shown in FIG. 5A is not shown in the broken sectional views of FIGS. 6A to 6E. It is optional here to heat the epoxy material to cure it.

【0023】

In FIG. 6E, the insulating layer 114 of the third polymer extends over the upper surface of the insulating layer 100 of the second polymer and the exposed upper surface of the RF antenna 108 of the conductive epoxy polymer. The third polymer insulating layer 114 is secured onto the second insulating layer 100 using heat or an adhesive seal. The polymer insulating layer 114 on top of this forms the final seal of the device.

【0024】

After the device shown in FIG. 6E is completed, the device is provided on a hoisting reel (not shown). The hoisting reel comprises three long polymer films 78,100,114, the films accommodating a large amount of the device. The new feature is that RFID devices can be easily supplied to customers in the form of ordinary tapes and reels, and the manufacturing process can be automated at high speed as well as quickly used. Since many of these devices are continuously provided on the tape, the customer cuts and uses each device when attaching it to an article. The device may also be manufactured into large sheets, which may be shipped together with the large sheets for later cutting by the customer.

【0025】

FIG. 7 is a cross-sectional view showing a device according to still another embodiment of the present invention, in which the electrical connection of the battery 118 and the capacitor 120 to the IC chip 96 is flush with the surface of the substrate 78. This is done by disposing 118 and a capacitor 120. The lower plate of the battery 118 is connected to the upper side of the IC chip 96 via the conductive epoxy layer 128, while the lower plate of the capacitor 120 is connected to the upper side of the IC chip 96 via the conductive epoxy layer 128. Will be done. A small space 126 is provided to electrically separate the battery 118 and the capacitor 120. Further, the conductive epoxy layer 128 is provided so as to extend between the left side opening 130 and the lower side opening 132 of the intermediate polymer layer 100. In FIGS. 6A-6E, the third outer polymer layer 114 extends over the upper side surface of the intermediate polymer layer 100. Also, the conductive polymer layer 128 is connected to the intersecting antennas of FIG. The antenna of FIG. 7 is sealed by polymer layers 78, 100 and 114. The battery and the capacitor are arranged side by side on the support board.

【0026】

FIG. 8 is a perspective view showing an apparatus according to still another embodiment of the present invention, in which the IC chip 138 is centrally located on the top surface of the support substrate 140 and has two triangular batteries. Electrically connected to 142 and 144. The batteries 142 and 144 are connected in series with the IC chip 138. The protective cover member 146 is provided so as to cover the upper surfaces of the batteries 142 and 144 and the IC chip 138 by using the manufacturing process described above, and seals these parts. The entire surface of the batteries 142 and 144 is used as a bow tie-shaped antenna structure. Further, the batteries 142 and 144 are connected in series with the IC chip 138 to drive the IC chip 138. That is, the batteries 142 and 144 provide a power supply and antenna structure, thus minimizing the number of contacts with the IC chip.

【0027】

FIG. 9 is a perspective view showing a passive, i.e., batteryless device according to yet another embodiment of the present invention, in which the device does not have a battery and instead has an IC chip. A capacitor 148 is arranged below the 150. The capacitor 148 drives the IC chip 150 after recharging the capacitor 148 for a predetermined period of time by a normal RF charging circuit (not shown) on the IC chip. The energy of the capacitor is supplied from a remote source. The device of FIG. 9 is a conductive piece 154 for transmitting data to and receiving data from the first loop antenna 122 for receiving the RF charge signal of the capacitor 148 and the IC chip 150. It is equipped with a dipole antenna consisting of 156 and 156. The capacitor 148 and the IC chip 150 are provided so as to be hermetically sealed between the support substrate 157 and the upper cover member 158 as in the above-described embodiment.

【0028】

In FIG. 10, 160 represents the active region of IC chips 138,150, and this novel integrated circuit transceiver is formed using planar process technology for MOS devices. Since the process technology has been well known in the past, it will not be described in detail here. The IC chip 160 includes an RF receiving circuit 162 and an RF transmitting circuit 164, and these circuits 162 and 164 are connected to an antenna 168 provided separately from the chip via a common line 166. This antenna is composed of any one of the above-mentioned antennas. The non-start / start circuit 170 is connected to the antenna 168 via wire 171 and operates in response to a signal received from the antenna 168 to require the other circuits described below within the IC chip 160. It works accordingly. The receiving circuit 162 is connected to the control logic circuit 174 via the line 172, and the output of the control logic circuit 174 is supplied to the memory circuit 178 via the first output line 176, and the output of the memory circuit 178 is also supplied. Is supplied to the control logic circuit 174 via the feedback output line 180. Further, the output of the control logic circuit 174 is supplied to the transmission circuit 164 via the second output line 182, and the memory data is supplied to the transmission circuit 164 via the control logic circuit 174. In the operation of encoding data, the received data regarding the ID number, name, route, destination, size, weight, etc. is encoded via the receiving circuit 162 and the control logic circuit 174 and stored in the memory circuit 178. To.

【0029】

Next, the operation of calling data will be described. When the RFID device described above is attached to the outer surface of an airplane baggage or a ship's postal bag, the airplane baggage clerk or postal worker sends the owner's ID number, starting point, weight, size, route, to the receiving circuit 162. Data related to information such as destinations is sent via an RF transmission link. These data are received by the receiving circuit 162 and then transmitted to the control logic circuit 174 through the line 172. The control logic circuit 174 divides this data by a known method, and stores the data at the address of the memory circuit 178 via the line 176. This data is stored in memory 178 until called at some point of transport.

【0030】

For example, when a vessel arrives at its destination, the worker calls this data to ensure that the cargo or baggage is delivered to a given recipient as soon as possible, reliably and effectively. Manipulate. The operator sends an operation signal to the RFID chip 160 at the destination. Here, the signal is received by the antenna 168 and first input to the non-start / start circuit 170. The circuit 170 evokes the circuit of FIG. 10 from the non-launch mode. Then, the receiving circuit 162 processes this received data and sends it to the control logic circuit 174 via the line 172. At the same time, the operator operates an operating electronic device having the same circuit configuration except that the circuit configuration shown in FIG. 10 does not include the non-start / start circuit 170.

【0031】

Now, with all of the circuits in FIG. 10 operating, the above-mentioned six types of data of the shipped article are called from the memory circuit, and this called data is output to line 180 for control logic. It is input to the transmission circuit 164 via the circuit 174. Therefore, the transmission circuit 164 transmits this data to the operator. The receiving circuit 162 and the transmitting circuit 164 of FIG. 10 perform (1) direct sequence, (2) frequency hopping, (3) pulse FM or chirp modulation, (4) pulse amplitude modulation, simple amplitude modulation or two-phase phase modulation. It is preferred to operate in one of the spread spectrum (SS) modes using one of the useful spread spectrum (SS) type modulations such as time hopping utilized or time-frequency hopping. The operation of spread spectrum mode itself is known and must meet the frequency band separation requirements of Part 15 of the FCC Regulations. The circuit configuration of the operating device (not shown) is basically the same as that of FIG. 10, and the details thereof will be omitted.

【0032】

Various modifications are possible within the gist and scope of the present invention. For example, various modifications and modifications can be made in the antenna shape, battery arrangement (such as battery stacking), device material, device manufacturing process, and system block diagram of FIG. Further, although the antenna, the battery, the capacitor and the inductor are provided separately from the device, they can be integrally formed with the device. Therefore, these or other structural modifications are possible within the scope of the present invention. Furthermore, as mentioned above, the use of RFID devices is not limited to airplane baggage (baggage, cargo and mail): postal parcels (FedEx and parcel services) US mail: manufacturing: in-stock items: personal information, etc. Will be done. Further, the dependent terms of the present invention are not only the novel RFID device and its manufacturing method, but also the operation for tracking the position of the transported article or the stored article as well as the novel RFID transmission system and human beings and animals. It should be recognized that it is also directed to the method.

【0033】

[Effect of the invention]

Since the RFID device is configured by housing the IC chip having transmission / reception and memory functions, the drive source of the chip, and the antenna in a package, the RFID device becomes compact, and is quick, easy, and accurate. It is possible to track the existence and position of articles and the like.

[Simple explanation of drawings]

[Figure 1]

It is a diagram which shows the manufacturing process of the RFID apparatus by one Example of this invention.

[Figure 2]

It is an enlarged perspective view which shows the RFID apparatus by one Example of this invention.

[Fig. 3]

It is a top view which shows the conductive pattern on the support substrate and the cover member of FIG. 2, and the position of an IC chip and a battery is shown by a dotted line in this figure.

[Fig. 4]

It is a sectional view taken along line 4-4 of FIG. 3, and shows the four main manufacturing processes of the RFID device.

[Fig. 5]

(A) is an enlarged perspective view showing an RFID device according to another embodiment of the present invention in which an IC chip is installed on a parallel plate-shaped capacitor provided on a battery. (B) is a broken enlarged perspective view showing the battery / capacitor / IC chip structure of (A).

[Fig. 6]

It is a sectional view taken along line 6-6 of FIG. 5, and shows the five main manufacturing processes of the RFID device of FIG.

[Fig. 7]

FIG. 5 is a cross-sectional view showing an RFID device according to another embodiment of the present invention, in which a battery and a capacitor are arranged side by side on a support substrate.

[Fig. 8]

FIG. 6 is a partially cutaway perspective view showing an RFID device according to another embodiment of the present invention, in which the battery has a bowknot shape, and the entire surface thereof functions as an antenna.

[Fig. 9]

It is a partially broken perspective view showing a passive RFID device according to another embodiment of the present invention, in which the battery is removed and the capacitor is periodically externally driven to drive the IC chip. It will be charged.

[Fig. 10]

It is a block diagram which shows the signal processing circuit of the RFID device with built-in IC chip and the operation device for operating the chip.

[Explanation of symbols]

30,78,140,157 Support board 32,64,138,150 IC chip 38,40,60 battery 42,77,146,158 Cover member 34,36,70,72,74,76,142,144,168,156 Antenna 162 Receiving circuit (means) 164 Transmission circuit (means) 170 Start / non-start circuit 174 Control logic circuit 178 Memory circuit (means)