Nova Patents
JPH05190877A

Manufacture of diode element

Abstract

(57) A summary and the purpose It has the asymmetrical structure using an organic semiconductor, and operation should be stabilized, and offer the production method of a highly efficient nature diode element with high electric strength of an opposite direction. Composition Lead phthalocyanine material by setting temperature of the insulating substrate 1 to 100 degreeC, and carrying out vacuum deposition at first, The トリクリ nick type crystal 5 is formed in the lower electrode 2 side, by subsequently to room temperature lowering and carrying out vacuum deposition of the substrate temperature, the monoclinic type crystal 6 is formed in the top electrode 4 side, and the organic semiconductor thin film 3 which takes asymmetrical structure in the thickness direction is formed on the insulating substrate 1.

Term

No projected expiry on record.

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2 claims: 2 independent, 0 dependent

  1. 1
    [Claims] 1. A method for manufacturing a diode element having an organic semiconductor thin film having an asymmetric structure in the thickness direction by vacuum-depositing lead phthalocyanine on an insulating substrate at different substrate temperatures. 【特許請求の範囲】 【請求項1】 絶縁基板上に鉛フタロシアニンを基板温度を変えて真空蒸着することにより、厚さ方向に非対象構造をとる有機半導体薄膜を有するダイオード素子の製造方法。
  2. 2
    A lower electrode is formed on an insulating substrate, and lead phthalocyanine is placed on the insulating substrate including the lower electrode at a constant speed of 0.1 to 20 angstrom / sec in a temperature range of 430 to 440 ° C. The temperature of the insulation substrate was kept at about 100 ° C and vacuum-deposited, then the temperature of the insulating substrate was lowered to room temperature, and lead phthalocyanine was vacuum-deposited in the same manner to form a lead phthalocyanine thin film. An electrode is formed to form a diode element, and the diode element is 10-5A method for manufacturing a diode element, which includes leaving the diode element in a torr vacuum for about 5 hours. 【請求項2】 絶縁基板上に下部電極を形成し、前記下部電極を含む絶縁基板上に鉛フタロシアニンを430~440°Cの温度範囲で0.1~20オングストローム/秒の一定速度、かつ前記絶縁基板の温度を100°C程度に保って真空蒸着し、次いで前記絶縁基板の温度を室温に下げて同様にして鉛フタロシアニンを真空蒸着して鉛フタロシアニン薄膜を形成し、前記鉛フタロシアニン薄膜の上に上部電極を形成してダイオード素子を形成し、前記ダイオード素子を10-5torrの真空中に5時間程度放置することを含むダイオード素子の製造方法。