Solid state image sensor

[Detailed Description of the Invention]

[Industrial Application] The present invention relates to the solid imaging device which equipped the package with the solid-state image sensing device chip.

[Description of the Prior Art] In recent years, by inserting the insert portion of thin length into the abdominal cavity, an abdominal cavity internal-organs machine etc. are observed, or the endoscope to which various curative treatment is made using the treatment implement inserted in in the treatment implement channel if needed is used widely. The electronic endoscope which formed the solid imaging device in the tip part of the insert portion is also used. As for the solid imaging device which narrow-ization of the insert portion is desired from the reasons of a patient's pain reduction etc., therefore is formed in the insert portion tip part of the above-mentioned electronic endoscope, a miniaturization is desired in an endoscope. Here, this solid imaging device that shows an example of the conventional solid imaging device in Drawing 8 has CCD chip 101 as an image sensor, and this CCD chip 101 comprises semiconductors, such as silicon, and is mounted in package 102 made from ceramics. The above-mentioned chip 101 is being fixed by carrying out die bonding by silver wax 10.4 grade on covar board electrode 10B on package 102, in order to give a reference potential to this chip 101. The above-mentioned covar temporary type fi103 is connected to a part of The leadframe 105 in package 102, and a reference potential is given via this leadframe 105. On CCD chip 101, Ponding pad 106 for outputting and inputting a drive signal required for CCD chip 101 and the output signal from CCD chip 101 with the exterior is provided. The electrical connection of this Ponding pad 106 is carried out to Ponding pad 108 on package 102 via bonding wire 107. The electrical connection of the bonding band 108 on package 102 was carried out to leadframe 105 within package 102, and this leadframe 105 has projected it outside as a signal terminal. Further, in order to protect from humidity, garbage, etc., the airtight ceiling of above-mentioned CCD Chimbu 101 is mainly done by glass Faith Bree 1-109. The color filter of the cases, such as color chip CCD, is carried out to Taking 1 elephant surface-A of CCD chip 101, and they stick A 110. When pixel density forms this color filter array 110 colored filter 3 on glass and it sticks soon with the adhesives for optics on CCD chip 101, It may fix to package 102 like face shield 109 of illustration using the level difference of package 102.

[Problem(s) to be Solved by the Invention] Here, a size required for the bonding between CCD chip 101 and package 102 is explained using Drawing 9. For example, the size of Ponding pad 106 by the side of CCD chip 101 is 100micromX100micrometer, and a pitch is 150~200 micrometers. It is 0.7~1.0 mm, when carrying out bonding of the distance 1 between t It was and Ponding pad 106.108 in which an electrical connection is carried out by bonding wire 107 using an automatic bonding machine, it is required 1.0 mm, and 0.7 mm is a case where it is based on manual operation. Bending height h of bonding wire 107 is 0.4~0.6 mm. When it is going to reduce package 102 to a limit in the size of a Be shy solid imaging device here, As long as the required size of the above-mentioned Ri serves as a key factor in above 1 and the height direction in the plane direction of CCD chip 101 and it depends for an electrical link on bonding wire 107, a reduction marginal size will be governed by the required size of the above-mentioned p and h. Although the art which attained the miniaturization of package shape by things smoothly to mold resin is indicated by JP,62-67863,A in the material of the package, as for the required size by wire bonding, Re does not have Dirty in it as mentioned above. In light of the above-mentioned circumstances, an object of the present invention is to provide the solid imaging device which enabled the miniaturization in the state where the package was equipped with the solid-state image sensing device chip.

[Means for solving problem] As shown in the key map of Drawing 1, solid imaging device 90 of the present invention is, Solid-state image sensing device chip 91 and package 92 equipped with the above-mentioned solid-state image sensing device chip 91, Tip side putt electrode pole 93 established in the acceptance surface side of the above-mentioned solid-state image sensing device chip 91, Package side putt electrode 94 provided in the acceptance surface side of the above-mentioned package 92, Flow to the above-mentioned package side putt electrode 94, and it is provided in the above-mentioned package 92 for an electrical link with the exterior, or is with 95 in part, For example, it is provided on transparent member 98 which closes the acceptance surface side of the above-mentioned solid-state image sensing device chip 91, and has pattern lead 97 which flows through the above-mentioned tip side putt electrode 93 and the above-mentioned package side putt electrode 94 via vamp material 96 and 96.

[Function] In the present invention, the electrical connection of tip side putt electrode 93 and the package side putt electrode 94 which flows to lead 95 provided in package 92 for the electrical link with the exterior is carried out by pattern lead 97 via vamp material 96.96.

[example Co hereinafter -- referring to drawings -- a detailed description of the invention -- Topple. Drawings 2 thru/or 5 are applied to the 1st example of the present invention, and Drawing 2 is an explanatory view in which the sectional view of a solid imaging device and Drawing 3 show the perspective view of a color filter array, Drawing 4 shows the sectional view by the side of the tip of an endoscope inserting part, and Drawing 5 shows the whole endoscope system. Endoscope 1 is provided with insert portion 2 which has flexibility by thin length, and final controlling element 3 of the diameter of a large formed successively by the back end of this insert portion 2 as shown in Drawing 5. From the above-mentioned Cropping part 3, universal code 4 of visibility is installed in the side, and connector 5 is provided in the end of this universal code 4. This connector 5 is connected to light equipment 21. From the above-mentioned connector 5, signal code 22 extends and connector 23 is provided in the end of this signal code 22. This connector 23 is connected to video processor 24. the above-mentioned video processor 24 -- a monitor -- 25.VTR De V 26. video printer 27. video A 228 grade is connected. The above-mentioned insert portion 2 consists of flexible tube 9 which has the bent side 8. visibility in which a hard tip part 7. curve is possible sequentially from the tip side. As shown in Drawing 4, the above-mentioned tip part 7 has tip members forming 10, and tip cover 41 is attached to this tip members forming 10. This tip members forming 10 and tip cover 41 are provided with a lighting window, R Prospectus window, the air-supply/water-supply mouth, and the forceps channel mouth. It is equipped with the Light distribution lens which is not illustrated inside the above-mentioned lighting window, and the light guides which consist of fiber bundles and which are not illustrated are formed successively by the back end of this Light distribution lens. This light guide is inserted in in the inside of insert portion 2 * final controlling element 3 and universal code 4, and is connected to connector 5. And the illumination light emitted to the incidence end of this light guide from the light source lamp in the above-mentioned light equipment 21 enters. Inside the above-mentioned observation door, image pick-up part 30 which has object optical system 43 and solid imaging device 60 is provided. Signal wire 32 connected to the above-mentioned solid imaging device 60 via substrate 49 is inserted in in the inside of insert portion 2. final controlling element 3. universal code 4. connector 5 and signal code 22, and is connected to connector 23. And the above-mentioned solid imaging device 60 is driven by video processor 24 connected via the above-mentioned connector 23, and picture signal processing of the output signal of this solid imaging device 60 is carried out by the above-mentioned video processor 24. The picture signal from this video processor 24 is inputted into the above-mentioned monitor 25.VTR Dekki 26. video printer 27. video disk 28 grade. The air-supply/water-supply tube which is not illustrated is connected to the above-mentioned air-supply/water-supply mouth. This air-supply/water-supply tube is inserted in in the inside of insert portion 2. Cropping part 3 and universal code 4, and is connected to connector 5. Forceps channel tube 35 is connected to the above-mentioned forceps channel mouth via channel connection Bahia 59. This forceps channel tube 35 is inserted in in the inside of insert portion 2, and is connected to the forceps loading slot which was established in final controlling element 3 and which is not illustrated. The above-mentioned bent side 8 has many approximately cylindrical joint pieces 11*12 and the curve pipe constituted by connecting .. with joint axis 13, enabling free rotation, and the peripheral part of this curve pipe is covered with curve rubber 14. Flexible tube 9 is connected to the rear end part of the joint piece of the last end. In the above-mentioned insert portion 2, four angle wires 17 for curve operation are inserted in, and the tip part of this angle wire 17 is being fixed to the latest joint piece 11 by wire guide 15. From the tip side, wire receptacle 18 is provided in the inner periphery of the joint piece after 2nd joint piece 12 at the predetermined intervals, and the above-mentioned angle wire 17 is inserted in in this wire receptacle 18. Aggressiveness influence of the above-mentioned angle wire 17 is carried out by the angle operation knob provided in final controlling element 3, and bent side 8 curves to the upper and lower sides/horizontal direction by this. Next, the above-mentioned image pick-up part 30 is explained in detail. 1st lens frame 42 is being fixed to the bore for observation formed in the above-mentioned tip members forming 10 and tip cover 41 on image pick-up part fixed screw 33. 1st above-mentioned lens frame 42 is equipped with ball 44 before an object which constitutes object optical system 43. 2nd lens frame 45 is fixed inside 1st above-mentioned lens frame 42, and this 2nd lens frame 45 is equipped with other lens systems of object optical system 43. Element frame 47 is connected to the rear end part of 2nd above-mentioned lens frame 45, and solid imaging device 60 is being fixed to this element frame 47. Substrate 49 in which electronic parts 50 were mounted is connected to external lead 60a of this solid imaging device 60. Signal wire 32 is connected to the four above-mentioned substrates via cable fixed member 51. This signal wire 32 is a coaxial cable. Cable core line 52 is connected to the above-mentioned substrate 49, and shielded wire 54 is electrically connected to shielding member 56 which covers the above-mentioned solid imaging device 60 and substrate 49 by electrically conductive adhesive. The above-mentioned cable core line 52. shielded wire 54 is covered with insulation tube 53. covering tube 55, respectively. The perimeter of the above-mentioned shielding member 56 and the terminal area of cable 32 are covered with insulating heat shrinkable tube 57. Next, the composition of the above-mentioned solid imaging device 60 is explained using Drawing 2. Solid imaging device 60 has the above-mentioned CCD chip 61, and this CCD chip 61 is mounted, for example in package 62 made from ceramics. The ashes acceptance surface side of the above-mentioned CCD chip 61 is being fixed by carrying out die bonding by silver wax 64 grade on covar board electrode 63 on package 62, in order to give a reference potential to this CCD chip 61. The above-mentioned covar board electrode 63 is connected to a part of leadframe 65 within package 62, and a reference potential is given via this leadframe 65. Image area (photoelectric conversion side) is established in the central part, and tip side putt electrode 66 for outputting and inputting a drive signal required for CCD chip 61 and the output signal from CCD chip 61 with the exterior around this image area is provided in the acceptance surface side of the above-mentioned CCD chip 61. On this tip side putt electrode 66, vamp material 67 which consists of gold or a solder ball is provided. Package side putt electrode 68 is provided in the position corresponding to the above-mentioned tip side putt electrode 66 at the acceptance surface side of package 62. On this Backage side putt electrode 68, vamp material 69 which consists of gold or a solder ball is provided. The acceptance surface side of the above-mentioned CCD chip 61 is mainly closed with glass face shields 70, in order to protect from humidity, garbage, etc. Electrode pattern 71 is formed in the position corresponding to the above-mentioned putt electrode 66*68 by printing or vapor deposition at the ashes acceptance surface, i.e., COD chip 61, side of this face play 1-70. And electrical connection connection of the putt electrode 66.68 is made via vamp material 67.69 with the above-mentioned electrode pattern 71 by sticking the above-mentioned face shield 70 on CCD chip 61. The electrical connection of vamp material 676 One and electrode pattern 71 has a method according to simple pressurization, and the method of making it heat and alloy, pressurizing. The electrical connection of the above-mentioned package side putt electrode 68 is carried out to leadframe 65 within package 62, and this leadframe 65 is projected outside as a signal terminal, and forms external lead 60a. Since the above-mentioned face shield 70 can be approached and stuck on the image area of CCD chip 61, it can be transposed to a color filter array. An example of the color filter array in this case is shown in Drawing 3. Color filter array 72 has glass plate 73, A pot-like color filter 73 is formed in the position corresponding to the image area of CCD chip 61 at this glass plate 73, and electrode pattern 71 is formed in the circumference of this color filter 73. Thus, in this example, electrical connection connection of putt electrode 66 of CCD chip 61 and the putt electrode 88 of package 62 is made by hump material 67.69 and electrode Batang 71 instead of the bonding wire. Thereby, the constraints on the size by wire bonding are lost, In 0.6 mm and the height direction (direction perpendicular to the acceptance surface of CCD chip 61), reduction of about 0.6 mm or more is attained at every 0.3 mm of one side, i.e., both sides, at the horizontal direction containing putt electrode 66.68 connected mutually substantial, for example. It is the former as shown in Drawing 8 about the above-mentioned height direction, Since bonding wire 107 might be disconnected by contact with face shield 109 as a gap of bonding wire 107 and face shield 109 when it did not leave a margin of 0.5 more mm or more from a wire upper end part, the useless space size was needed. On the other hand, according to this example, since there is no destabilizing element called disconnection by the above contact, solid imaging device 60 in a package state can be reduction-ized to a limit. Drawings 6 and 7 are applied to the 2nd example of the present invention, Drawing 6 is a sectional view of a solid imaging device, and Drawing 7 is a top view of a TAB film substrate. In solid imaging device 60 of this example, independent Formed of the electrode pattern 71 which connects conductively tip side Pack I and electrode 66, and package side putt electrode 68 is carried out. In this case, as shown in Drawing 6, transparent resin 80 for optics may be filled up with and closed to the acceptance surface side of CCD chip 61, without providing face shield 70 in the 1st example, and face shield 70 may be stuck like the 1st example. Electrode pattern 71 is tape automated bonding (below Tape Aut0!11atedBOndinQ :), for example, as shown in Drawing 7. It is described as TAB. It forms on film substrate 81, and after making electrical connection connection of the putt electrode 66.68 via vamp material 67.69 with this electrode pattern 71, only TAB film substrate 81 is removed. Or as shown in Drawing 7, opening 82 corresponding to the image area of CCD chip 61 may be provided in the central part of TAB film substrate 81, this opening 82 may be made consistent with the image area of CCD chip 61, and it may leave the whole film substrate 81 on CCD chip 61. Composition 2 other operations and effects are the same as the 1st example. The present invention is not limited to each above-mentioned example, for example, electrode pattern 71 may be provided in the surfaces, such as an optical low pass filter provided on CCD chip 61. When changing into the state where the acceptance surface side of a solid-state image sensing device chip is not closed, as a solid imaging device, for example, equipping an electronic endoscope with this solid imaging device, it may be made to close with the last lens of an object lens system of this electronic endoscope. The present invention is applicable not only to an electronic endoscope but various imaging devices.

[Effect of the Invention] As explained above, in the present invention, it flowed through a tip side putt electrode and the package side putt electrode which flows to a lead provided in a package for an electrical link with the exterior by pattern lead via vamp material. Therefore, since it becomes reducible [ a size of a plane direction of a solid-state image sensing device in the state where a package was equipped with a solid-state image sensing device chip, and the height direction ], it is effective in a miniaturization of a solid imaging device being attained.

[Brief Description of the Drawings]

Drawing 1 requires the key map and Drawings 2 or 5 of the present invention for the 1st example of the present invention, Drawing 2 is a sectional view of a solid imaging device, and Drawing 3 is a perspective view of a color filter array, It is an explanatory view in which Drawing 4 shows the sectional view by the side of the tip of an endoscope inserting part, and Drawing 5 shows the whole endoscope system, Drawings 6 and 7 are applied to the 2nd example of the present invention, and Drawing 6 is a sectional view of a solid imaging device, The sectional view of the solid imaging device of the former [ Drawing / 7 / Drawing / the top view of a TAB film substrate and / 8 ] and Drawing 9 are explanatory views for explaining a size required for the bonding between the CCD chip and package in the solid imaging device of Drawing 8. 1 ... Endoscope 90 [ .. Package ] ... Solid imaging device 91 ... Solid-state image sensing device chip 2 3 ... Tip side Pack A electrode The package side Pack A electrode 95 .. Lead 96 .. Vamp material Pattern lead Drawing 6 Drawing 3 Drawing 7 90 Solid salary, 1eii Drawing 2 ! 7A1A/ Drawing 8 Drawing 9