Cooling apparatus

[Detailed Description of the Invention]

A, Field of the Invention The present invention relates to the cooling device which prevents the heat destruction by temporary overheating of semiconductor device 1 circuit element or an electric circuit. The outline of B1 invention If a semiconductor device etc. become abnormal temperature, the husks in the pipe in 1. microcapsule, a cylinder, a pressure tank, or a heat pipe, etc. will be torn, or a fusion cork melts, or the cooling device of the present invention is opened in a safety valve, and an inner fluid blows off and evaporates it, The radiating fin in which the semiconductor device etc. are attached by Endotherm by the latent heat at the time of evaporation. A Heat transfer board, a pressure tank, the Endotherm part of To 1-Dope, etc. are cooled, and heat destruction of a semiconductor device etc. is prevented. Art of C1 former Semiconductor devices for electric energy conversion, such as the former, a power transistor, and a thyristor, Since the radiator which has the radiating fin made in A.I. Artificial Intelligence with high thermal conductivity, etc. in order to prevent overheating is attached or heat dissipation takes time very low as for the heat transfer efficiency from a fin to air, - the time ---like -- heat -- a fin -- since it must store in an inside, volume is earned by thickening thickness of a fin and a certain amount of calorific capacity is given. B1 Object of the Invention By the way, also when overheating to high temperature temporarily by a short circuit etc., it is necessary to take into consideration the thickness of the fin of the above-mentioned radiator, and it is necessary to design it to a lack enough. Since the portion of the radiating fin which is thinner and small became large unusually in a usual state properly speaking, since it is superfluously thick, the board object also became large, and the thickness of this fin had become the hindrance of the small weight saving. the present invention is It was made by Eri Mi at such a problem that a radiator has conventionally, and there is a place made into the object in providing the cooling device which can cope with overheating lightweight [ small ] and temporary. The means for solving E1 subject To achieve the above objects, a cooling device of the present invention, The paint which cooling fluid is included by the surface of a radiating fin in which a semiconductor device etc. are attached, and contains a To be broken microcapsule by expansion of cooling fluid etc. at the time of abnormal temperature is applied to punctate so that a microcapsule colony may be formed. It may constitute from a small liquefaction gas cylinder stopped by the Heat transfer board in which the semiconductor device etc. which were provided with the radiating fin via many short pillars for the same object are attached, and the fusion cork fused with the abnormal temperature provided so that an oral region might contact the above-mentioned heat exchanger plate in the central part of the above-mentioned radiating fin. Or the safety valve which water and a porous metal piece are stored in an inside, and operates with abnormal temperature can also consist of radiating fins which had and adhered to the field of another side of the pressure tank with which a semiconductor device etc. are attached in a field and the above-mentioned pressure tank. Or the outside pipe which has the partition which the semiconductor device etc. were attached in the end and the hole put on to the other end side in the central part, and has a heat pipe function in which Wick was given to the inside between the above-mentioned end and a partition, and the other end side was provided with the radiating fin, The super-thin pipe in which one end was supported with the fusion cork fused with abnormal temperature to the inside of one end of the above-mentioned outside pipe, and the other end adhered to the central part of the above-mentioned partition, It may constitute from a refrigerant fluid into which it was put between a partition and the back end of the above-mentioned outside pipe between the Was established piston and the compression spring, and the partition and piston in the above-mentioned super-thin pipe and the above-mentioned outside pipe, and a safety valve for extracting the pressure inside unusual of the outside pipe provided in the above-mentioned outside pipe. F0 operation About a claim (1), heat, such as a semiconductor device, usually radiates heat from a portion without the micro colony of a radiating fin at the time. If a semiconductor device etc. carry out abnormal overheating, the husks of Maher j' Black capsule which the cooling fluid in a microcapsule expanded and was softened with heat will be torn, it will jump out, the surrounding heat will be taken and evaporated, a radiating fin will be cooled rapidly, and a semiconductor device etc. will be protected from heat destruction. About a claim (2), heat, such as a semiconductor device, usually radiates heat with a radiating fin through a heat exchanger plate and a short pillar at the time. If a semiconductor device etc. carry out abnormal overheating, the fusion cork which is in contact with the heat exchanger plate melts, and it will evaporate in the liquefied gas in a cylinder, and will blow off, and will diffuse outside. In order [ this ] to grind and to take heat from a heat exchanger plate and a short board quickly, semiconductor devices are protected from heat destruction. About a claim (3), heat, such as a semiconductor device, usually radiates heat with a radiating fin via a tank at the time. If a semiconductor device etc. carry out abnormal overheating, it boils in the water in a tank, internal pressure will go abruptly up, a safety valve will open, vapor will be emitted, internal pressure will be dropped, and water temperature will be reduced. For this reason, heat destruction of a semiconductor device etc. is prevented. About a claim (4), at the time, heat, such as a semiconductor device, is transmitted to a radiating fin with the outside pipe which has Wick in the inner side which functions as a heat pipe, and usually radiates heat from a fin. If a semiconductor device etc. carry out unusual heating, the refrigerant fluid by which Melting was pressurized with the compression spring via the piston will blow off from a super-thin pipe, a fusion cork will hit and evaporate to the high temperature side by the side of Endotherm, and it will cool the Endotherm side quickly. For this reason, heat destruction of a semiconductor device etc. is prevented. If the pressure inside an outside pipe increases by evaporation of a fluid, it will operate in a safety valve and internal pressure will be kept safe. G, an example The example of the present invention is described with reference to drawings. Example 1 In Drawing 1, A is a semiconductor device and 10 is a cooling device. The comparatively thin radiating fin in which 11 was attached in the semiconductor device, and 12 are the microcapsule colonies which applied the paint of cooling fluid intension on the surface of fin 11 to punctate. As shown in Drawing 2, this microcapsule colony 12 distributes and applies microcapsule 13 which included large cooling fluid 14 of specific heat, such as water and ammonia, to the paint which made adhesives, such as epoxy, matrix 15, as shown in Drawing 3. There are inorganic systems, such as glass, silica, milt, alumina 2, and Jillunia, and organic systems, such as carbon, phenol, a vinylidene chloride, and acrylics nitril, in the quality of the material of microcapsule 13, and a particle size uses an about 5~30-micrometer thing. Epoxy strong against heat in comparison is suitable for matrix 15. At the time of usual, generation of heat of semiconductor device A radiates heat through radiating fin 11, as shown in Drawing 4 (a). For this reason, microcapsule colony 12 takes that small size to this extent that does not usually become the hindrance of heat dissipation at the time, and the interval of a spot becomes large like the 1st illustration. When a short circuit accident etc. occur and semiconductor device A carries out abnormal overheating, be shown in 1. figure 4 (b), In order for the cooling fluid in microcapsule 13 to expand immediately, to tear the husks of microcapsule 13 softened with heat, to jump out and to take and evaporate the surrounding heat, it is cooled rapidly and radiating fin 11 is protected from semiconductor device A being destroyed with heat. The temperature setting value at the time of forced cooling can be decided by adjusting suitably the heat intensity of microcapsule 13, and the coefficient of thermal expansion of cooling fluid. Example 2 In Drawing 5, A is a semiconductor device and 20 is a cooling device. AA' in which the semiconductor device in which 21 has heat dissipation Off and t A 24 attached to this semiconductor device is attached, The heat exchanger plate which consists of Cu(s) etc., the short pillar to which 22 connects heat exchanger plate 21 and a radiating fin, and 25 are the small liquefaction gas cylinders of liquefied gas 27 entering of N2.Co2.A etc. which were provided in the radiating fin. As shown in liquefaction gas cylinder 25 and Drawing 8, the mouth is closed by fusion cork 26 consisting of solder and thermoplastics, and male screw 29 of an oral region screws in female screw 28 (Drawing 7) formed in the central part of heat dissipation Off and t A 23, and it is provided so that fusion cork 26 may contact heat exchanger plate 21. Generation of heat of semiconductor device A radiates heat through radiating fin 23 at the time of usual. At the temperature at this time, without melting, fusion cork 25 of the gas cylinder is prepared so that it may melt at the temperature in front of destruction of a semiconductor device. If it becomes temperature just before a short circuit accident occurs, semiconductor device A carries out unusual heating and a semiconductor device is destroyed, fusion cork 26 will melt, and the Flow-ized gas by which it was compressed in small liquefaction gas cylinder 25 at the next moment evaporates, and it blows off, between short pillars 23 is passed through, and it diffuses outside. At this time, since gas takes heat from heat exchanger plate 22 and short pillar 23 quickly, it can prevent heat destruction according semiconductor device A to temporary unusual heating. The fragment into which fusion cork 26 melted is Fly away(ed) by the pressure at this time. Since a surface oar becomes large so that it is thinly large, since a Active style is made to a gas stream and it heat-exchanges efficiently to it, short pillar 22 is effective. As for small liquefaction gas cylinder 25, after an operation will change into the first state again, if it removes and exchanges at a cartridge ceremony. Example 3 In Drawing 9, A is a semiconductor device and 30 is a cooling device. 3I is a pressure tank which consists of Fl with the sufficient thermal conductivity by which the semiconductor device was attached in one side and radiating fin 32 was provided in other one side, C, A.I. Artificial Intelligence, etc. Pressure tank 31 is provided with safety valve 33 and water pouring cork 34. It has steamy omission hole 37 which extracts the steam which comes out when pressure regulation spring 36 and ball value 35 which force on an oral region ball value 35 which consists the oral region of tank 32 of Block silicone rubber etc., and this ball value open safety valve 33, as shown in Drawing 10, and is A.I. Artificial Intelligence in the inside of tank 31, Good porous metal piece 38 of thermal conductivity of C1 grade is inserted, and water 39 is filled in the meantime. Usually, generation of heat of semiconductor device A at the time radiates heat from radiating fin 32 through cylinder 31. However, since it enters in large water 39 of specific heat, or tank 31, it may be smaller than the usual fin. Being once stored in the calorific capacity of water, the heat emitted from semiconductor device A is gradually radiated by the open air through radiating fin 32, and goes. for this reason, the grade which the internal pressure of tank 31 comprises -- although it becomes large, as safety valve 33 does not open, in the internal pressure in this time, it is Seti. If a short circuit accident etc. occur and semiconductor device A carries out unusual heating, it is water in tank 31, Boil-evaporation (latent heat of evaporation) Boiling point fall-evaporation (water temperature fall)-evaporation of the decreased pressure-water in the pressure increase (boiling point elevation of water)-safe valve-opening Kazumi steamy discharge 1 tank in a heat-absorptive-tank (absorption of heat) -> the pressure increase in a tank -> absorption-discharge of heat is performed by one or less safe valve-opening-vapor emission repetition. A semiconductor device can be protected from heat destruction by this cycle. If water decreases in number, it may pour out of pouring mouth 34, and may do. Example 4 In Drawing 11, A is a semiconductor device and 40 is a cooling device. The outside pipe in which 41 becomes the front end from C, SUS, A.I. Artificial Intelligence, etc. in which semiconductor device A was attached, The radiating fin which 42 provided near the back end of pipe 41, the gilt bronze which 43 provided inside pipe 41, The end of Wick who consists of porous metal, a fluting, etc., and 44 is solder to the Endotherm side, The super-thin pipe which adhered to partition 46 which has the hole from which it supported [ tacking ] to fusion corks 45, such as thermoplastic Apatite, and the other end was constituted by pipe 41 and one, The piston at which 47 was provided in the backside of partition 46, the compression spring in which 48 energizes piston 47 to the front, Water into which 49 was put in partition 46, piston 46, and super-thin pipe 44 The refrigerant fluid of C2H50H and N H3 grade, the air hole which 50 established in the back end of pipe 41, and 51 are the safety valves provided in pipe 41. It goes into the portion containing Wick 43 of pipe 41 for a while in the above-mentioned refrigerant fluid and the refrigerant fluid of the same kind, and pipe 41 functions as a heat pipe by this refrigerant fluid and Wick 43. A deer is carried out, and at the time of usual, generation of heat of semiconductor device A is Heat transfer(ed) in the operation of a heat pipe, and radiates heat from radiating fin 42. However, fusion cork 45 is this thing of composition that does not usually melt at the Endotherm side temperature at the time. If a short circuit accident etc. occur and semiconductor device A carries out unusual heating, fusion cork 45 will melt, refrigerant fluid 49 which required pressure with compression spring 48 will blow off through super-thin pipe 44, and it will hit the high temperature side by the side of Endotherm, and will cool quickly the high temperature side by the side of Endotherm by the chilling effect of a refrigerant fluid, and evaporation. Safety valve 51 operates and pipe 41 internal pressure which went up by evaporation of the refrigerant fluid is extracted. The effect of H1 invention It is constituted by the present invention as above-mentioned. Therefore, an effect indicated below is produced. ■ In the cooling device of a claim (1), since the temperature of a radiating fin falls rapidly in order to radiate the heat at the time of overheating of a semiconductor device etc. by evaporation of the cooling fluid in a microcapsule, heat destruction of a semiconductor device can be prevented. Since it becomes unnecessary to store - heat in the inside of a radiating fin temporarily and calorific capacity of a fin can be made smaller than the conventional thing, the volume of the whole heat sink becomes small and a small weight saving is made. ■ In the cooling device of a claim (2), since it cools rapidly by heat absorption in case a liquefied gas evaporates the heat at the time of overheating of a semiconductor device etc., heat destruction of a semiconductor device can be prevented. Since it is not necessary to store heat in the inside of a radiating fin temporarily and calorific capacity of a radiating fin can be made smaller than the conventional thing, the volume of the whole heat sink becomes small and is made in a small weight saving. ■ Since a small liquefaction gas cylinder can be exchanged as a cart rich type, it is easy to maintain again. ■ since water with large calorific capacity is contained in the inside of a tank in the cooling device of a claim (3), the radiating fin of volume much smaller than the conventional heat dissipation Off 1' A may be sufficient -- a radiating fin -- small size -- a weight saving can be carried out. ■ Since porous metal with high thermal conductivity is inserted in the inside of a tank, the heat stored in water can be promptly told to a radiating fin again. ■ Since water temperature falls due to decreased pressure at the same time a pressure valve works and it misses vapor, when the water inside a tank boils at overheating of a semiconductor device etc. further, heat destruction of a semiconductor device can be prevented. ■ In the cooling device of a claim (4), since the heat at the time of overheating of a semiconductor device etc. is quickly cooled by pouring of a refrigerant fluid, the chilling effect at the time of overheating is larger than the thing using the conventional heat pipe.

[Brief Description of the Drawings]

1st [ The ] figure~figure 4 is related with Example 1 of the present invention, and, in Drawing 1, the sectional view of a microcapsule and Drawing 3 of the perspective view of a cooling device and Drawing 2 are [ the front elements on larger scale of a microcapsule colony, and Drawing 4 (a) and (b) ] usually explanatory views of a number heat state at the time of heat dissipation and overheating. 5th [ The ] figure~figure 8 is related with Example 2, and, in the sectional side elevation of a cooling device, and Drawing 6, a radiating fin front view and Drawing 8 of a 5th [ The ] figure V-V sectional view and Drawing 7 are [ Drawing 5 ] cylinder side views. Drawings 9 and 10 are related with Example 3, Drawing 9 is a perspective view of a cooling device, and Drawing 10 is the sectional side elevation. Drawing 11 is a sectional side elevation of the radiator about Example 4. A -.. A semiconductor device, 10 and 20, 30.40-i Rejection device, 11, 23, 32.42 ... Radiating fin 12 ... Maher 1' Croc cell colony, 13 ... microcapsule, 14 ... cooling fluid and 15...7 trick, 21 ... heat exchanger plate, 22 .. short pillar, 25 ... liquefaction gas cylinder, 26.45 ... fusion frame, 27 ... liquefied gas, 28 .. female screw, 29 ... male screw, 31 ... pressure tank, 33.51 ... safety valve, 35 ... pole valve, 36 ... pressure regulation spring, 37 ... steam vent, 38 ... porous metal, 39 ... water, 41 ... outside pipe, 43 ... Wick, 44 ... super-thin Ha and 1' A, and 46 [ ... A refrigerant fluid 5o / ... Air hole ] ... It divides and is 47... A piston, 48 ... A compression spring, 49 Drawing 1 (Oversized-) 1 A ---- 1 published by Dry throat 10 ---- 1 Purification 11 ---- Ichinoseki Pefu, aluminum A It is 1 One lot sword Off in 12----1, and is Le Colony 23. --- Release *A Asso 29 -- 11 constant 11----1 Eagle door Muff and 1 A 12 ----- a Off aluminum Ri DD One -- Le] Ronnie 13 ---- first division Microphone[l -- a turnip -- A ring 14 ---- Yi Bing 15 -- 1 Tat one piece and, Nox (a) Mr. A 1 is also Kes 6N. Drawing 3 Drawing 4 (b) L Fringe 6 Natural