Abrasive bodies

[Detailed Description of the Invention]

The background of an invention The present invention relates to a polish main part. It buries for [ which is marketed now ] drill crown (drilcrown), and is one sort of a golden (insert) element or a cutting element, The diamond fabrication object (compact) joined to the metallic bond (sintering) carbide (cementedcarbide) base material is comprised, and the base material is joined to the one by one more big metallic bond carbide board with wax here. The wax has the melting point more than 700 degreeC, and under the severe condition which exists generally [ while using the drill crown ], the good junction between the substrate and base material is attained certainly, and it maintains it. While burying and soldering the base material to a substrate during golden manufacture, it must warn to secure that powdering of a diamond fabrication object layer does not arise. this -- under the soldering -- a diamond fabrication object -- heat -- it can attain being useless (heat sink) and by making it contact. The abstract of an invention Present invention: a polish material fabrication object; The sintering carbide (hard metal) base material joined to b this polish material fabrication object; it reaches. The polish main part which comprises the metal content board joined to the base material through the joining layer which comprises the alloy containing more than one sort or it of c nickel, copper, cobalt, iron, or these metal is provided. The layer of the alloy which contains more than one sort or it of nickel, copper, cobalt, iron, or these metal if it carries out from another viewpoint of the present invention, The manufacturing method of the above-mentioned polish main part which includes the process inserted between the sintering carbide support surfaces which the forming object has joined to the substrate face, and the process of carrying out diffused junction of the base material to the substrate at the temperature below the melting point of the insertion layer via the insertion layer is provided. The detailed statement of an invention A polish material fabrication object comprises the multi-crystal collection lump of the nature polish material particles of superhard which are common knowledge and were combined with this industry in the shape of a hard aggregate. Such a forming object generally has the second phase that always contains the catalyst [ especially as opposed to the nature polish material particles of superhard ] of the forming object, or a solvent, or a junction phase. It is publicly known now and the nature polish material of superhard currently used for the forming object is a diamond and Legal crystal (cubic) boron nitride. these arbitrary industries [ like sintering titanium carbide, sintering tantalum carbide, sintering tungsten carbide, or those mixtures ] in which the sintering carbide base material is -- it may be publicly known. The metal phase to such sintering carbide is generally Nitsugawa, cobalt, or iron which exists in the quantity from 3 % of the weight to 35 % of the weight. It can join to the carbide base material directly, or can join the polish material fabrication object to the carbide base material through a joining layer. The polish material fabrication object joined to the sintering carbide base material is known also as "a compound polish material fabrication object (composite abrasive compact)." The example of a polish material fabrication object or a compound polish material fabrication object can be found out on British patent No. 1489130, U.S. Pat. No. 3745623, and 3743489 each specifications. These indications are included in this specification as reference. The substrate is generally larger than the sum total mass and sum total capacity of the polish material fabrication object and the carbide base material in mass and capacity. Although the substrate is generally sintering carbide (hard metal), it can also be steel like hardened steel. The joining layer between the base material and substrate generally has the thickness up to 220 microns. It is high, namely, the Takeshi strength which junction between the base material and substrate does not carry out is 140Ns/mm.²Or it is I and It was that it can be more than it. The polish main part of the present invention has a use as a component to a polishing tool. the especially polish main part receives A bit or crown of a drill -- it buries and has a use as gold, i.e., a cutting element. The example of such a cutting element is shown in Drawing 1 of a drawing. The cutting element which comprises disc-like polish material fabrication object 10 joined to sintering carbide base material 12 in this figure is shown. The carbide base material 12 is arranged in hollow 14 in substrate 16 prolonged for a long time. Junction to substrate 16 of the carbide base material 12 is performed through joint layer 18 of the form mentioned above. The polish main part of the present invention is the British patent No. 1489130 first, Although it writes in U.S. Pat. No. 3745623 and 3743489 each specification, generally by manufacturing the compound polish material fabrication object which comprises the polish material fabrication object joined to the sintering carbide base material by the method publicly known in this industry [ like ], it is obtained. Subsequently, diffused junction art is applied and the compound polish material fabrication object is joined to a substrate through the above defined joining layer. Although diffused junction is publicly known in this industry and it is a method which junction of metal versus metal is made to produce, in this case, a metal atom carries out horizontal OFF intermediary movement of the bonded surface, and forms continuation crystalline particles. This method is solid phase synthesis and metal has not reached that melting point. As for diffused junction, it is I and It was to produce the junction which has the outstanding intensity between the base material and substrate, when it is under the condition that the damage over the polish material particles of a polish material fabrication object is avoided on substance. If it puts in another way, in the case of a diamond fabrication object, the forming object does not contain black lead on substance, and, in the case of a cubic boron nitride fabrication object, does not contain hexagonal boron nitride on substance. desirable -- this method -- the following process, i.e., : (a) Process of providing the compound polish material fabrication object which comprises the polish material fabrication object joined to the sintering carbide (hard metal) base material; (b) The layer of the alloy containing more than one sort or it of nickel, copper, cobalt, iron, or such metal, Process of carrying out cotton intermediary maintenance at time sufficient although a metal content substrate face is deposited, horizontal force power is applied to the metal layer, the temperature of the metal layer is raised to the temperature below the melting point and the metal layer can make it enabling it to join the pressure and temperature to the substrate; (c) Process of grinding the exposure surface of the metal layer; (d) Process at which the both base materials and substrates are made to change into the state where the metal layer contacts the support surface; (e) Process of pressing the both base materials and substrates by applying horizontal force power to the base material and substrate; (f) process; of raising the temperature of the metal layer to the temperature of the range of 650 *~750-degreeC below the melting point -- and (g) Include process; of performing the above-mentioned process (f) and (g) under an inactive atmosphere, maintaining the cotton intermediary above-mentioned pressure and temperature at sufficient time for diffused junction to arise between the base material and substrate. The pressure applied while carrying out diffused junction of the base material to a substrate is generally 40~300Ns/mm.²It comes out, and it is and temperature is a grade of 650~750 degreeC typically. Diffused junction is 10.^-4The damage which arises to the polish material particles of a line intermediary and the polish material fabrication object under Thor, a still better vacuum, or other inactive atmosphere like inactive gas is minimized. the pressure and temperature -- 5~ -- cotton intermediary maintenance can be carried out typically in 5~35 minutes, and good junction can be ensured for 300 minutes. In the present invention method, the horizontal force power can be applied to this industry that uses an oil pressure cylinder press, for example by a publicly known method. In one special method of applying desired horizontal force power to the base material and substrate, the difference of the thermal expansion coefficient between an external envelopment object and an internal expansion object is used. The base material and substrate after changing the both methods into the state of the above-mentioned process (c), It is arranged in the envelopment object which has the cave formed in the inside, and the cave, and puts in in the cave of the assembling parts which comprise the expansion object which has a bigger thermal expansion coefficient than the envelopment object, Subsequently, it includes raising the temperature of the assembling parts to the request temperature of the above-mentioned process (e), expanding the expansion object by that cause, and applying the horizontal force power of a request of the above-mentioned process (d) to the base material and substrate. Typically, the temperature of the assembling parts is To raise the temperature by putting the assembling parts in a furnace. The envelopment object can be a product made from ceramics based on the product made from sintering carbide, silicon nitride, or zirconia. The expansion object is the metal or the product made from an alloy which has a typically high thermal expansion coefficient. the alloy of the example of a suitable alloy based on nickel is nimonic (Nimonic) -- it is . The cavernous side in contact with the expansion object can be made to be able to incline, and can be adjusted in the slope of the expansion object. Or instead, the expansion object has two contact portions, and the contact surface may incline and consistent. When the expansion object reacts to the element joined under application temperature conditions in harmful, an inactive filling thing suitable between the expansion object and the element joined can be supplied. This pressurizing method is applied [ as opposed to / especially / joining a compound polish material fabrication object to a tool pedicel (that is, a tool pedicel is a substrate) ]. Drawings 2 and 3 of a drawing illustrate the embodiment in the above-mentioned viewpoint of the present invention. In these drawings, assembling parts 20 which comprise envelopment object 22 which has A groove or cave 24 formed into it by the product made from sintering carbide are shown. Envelopment object 22 is attached to hollow 26 in steel supporting boards 28. He would like to be opposed to cave 24, rust 30 and 32 is arranged, and these have a Along contact slope in straight line 34. These wedges are the products made from alloy nimonic. In the cave, packing element 36 in contact with surface 38 of wedge 32 is also arranged. Tool pedicel 42 is arranged between packing element 36 and surface 40 of the envelopment object, and the tool pedicel has compound polish material fabrication object 44 and the junction relations which comprise polish material fabrication object 46 joined to sintering carbide base material 48. Between tool pedicel 42 and base material 48, suitable thin metal layer 50 to produce diffused junction between the tool pedicel and base material is arranged. In order to make the effective diffused junction between a tool pedicel and a base material attain, the whole assembling parts are put in the furnace at a suitable temperature. The temperature must be the temperature which produces diffused junction. At this temperature, wedges 30 and 32 made from nimonic expand at a speed quicker than envelopment object 22. It has the effect that this makes junction pressure power act on tool pedicel 42 and base material 48. It is it is important and desirable to grind the exposure surface of a metal layer, in order to secure making the surface as flat as possible. Polish can be performed by using a diamond polishing tool. The surface of the base material to which a substrate is joined should also be made as flat as again possible. Especially the metal layer joined to a substrate face is distorted during polish, and has a twisted tendency. In order to minimize this tendency, a metal layer is deposited to a substrate face and horizontal force power is applied to the metal layer, It is I and It was that it is preferred to raise the temperature of the metal layer to the temperature below the melting point, and to, carry out cotton intermediary maintenance of the pressure and temperature subsequently to the substrate at time sufficient although the metal layer can join. Typically, the pressure applied to the metal layer is 1~200Ns/mm.²It is Range and the temperature from which the metal layer is raised is 700degreeC~1100degreeC. the conditions of such temperature and pressure -- 5~ -- cotton intermediary maintenance can be carried out typically in 5~30 minutes for 300 minutes. The metal can be deposited to a substrate face by a method publicly known in this industry like making the surface which contacted electroplating, unelectrolyzed plating, vapor deposition, sputtering, or metallic foil to the substrate, and has arranged it or on which the substrate carried out metallic coating of the metallic foil contact, and arranging. The horizontal force power can be applied to a metal layer by a method publicly known in this industry. the thin metallic coating of the metal used for coating point Stand up to contact the carbide base material and metallic coating surface of a substrate, and coating with the substrate face the support surface which should be joined, and an identical or similar metal -- Apply -- things are made. Such a metal layer can deposit electroplating, unelectrolyzed plating, vacuum deposition, and this industry like sputtering by a publicly known method on the surface of the base material. The following example further explains the present invention. Example 1 The disk of annealing nickel was deposited on the surface of stub (stub) made from tungsten carbide which carried out cobalt combination. It is 100Ns/mm to this nickel covering surface.²Pressure was applied and temperature was raised to 830 degreeC. It was which maintains these conditions for 20 minutes. Subsequently, the exposure surface of the nickel layer was ground with the diamond polishing tool. The thickness of nickel covering is 120 microns and is Oh. The compound polish material fabrication object of the disk shape which comprises the diamond fabrication object joined to the base material of the tungsten carbide which carried out cobalt combination was manufactured by the method of the statement on the British patent No. 1489130 specifications. Subsequently, the compound polish material fabrication object was joined to the stub by contacting the back of the base material to the nickel layer on the stub first. 290Ns/mm horizontal force power²In addition to the With compound polish material fabrication object and the stub, both these both were pressed and the temperature of the border plane, i.e., a nickel layer, was raised to 725 degreeC. This processing is 10.^-4In Thor's vacuum, it is I got it. It was which maintains these conditions for 30 minutes. The junction outstanding between the carbide base material and carbide stub with this diffused junction art was attained. The Takeshi strength which the junction does not carry out is measured, and it is 390Ns/mm.²It is I and It was that it is a of grade. The thickness of the joining layer between the base material and stub is a 120-micron grade, and is Oh. Example 2 Conditions of this intermediary following [ join / to a compound polish material fabrication object / the stub which carried out nickel covering ]: Applied pressure 270Ns/mm²Heating temperature 730degreeC Maintenance conditions 300-minute nickel covering 200 microns It is Ivy although the procedure given in the above-mentioned Example 1 was used except for the adopted point. The Takeshi strength which junction between a carbide base material and a stub does not carry out is 400Ns/mm.²It is I and It was that it is above.

[Brief Description of the Drawings]

Drawing 1 is a side view of the embodiment of the polish main part of the present invention. Drawing 2 is a side sectional view of the assembling parts for using it for the present invention method. Drawing 3 is a partial section perspective diagram of the assembling parts of above-mentioned Drawing 2.