Cooling structure for electronic parts

[Detailed Description of the Invention]

[Industrial Application] The present invention relates to the cooling structure of the electronic parts which cool electronic parts with much calorific value in the state where it was made to mount on a substrate. [Description of the Prior Art] The radiator for making electronic parts, such as a semiconductor device with much calorific value, radiate the heat in the air conventionally was attached. Drawing 2 explains this. Drawing 2 is a perspective view showing the cooling structure of the conventional semiconductor device. In the figure, electronic parts, such as a semiconductor device with much 1 to calorific value, and 2 are the radiators for cooling these electronic parts l, this radiator 2 is formed with metal with high thermal conductivity, etc., and in order to take a loud heat sinking plane product, multiple cooling fins 2a are provided in one. 3 is a printed circuit board for carrying electronic parts (not shown) other than the above-mentioned electronic-parts 1, and the above-mentioned electronic parts 1 are connected to this printed circuit board 3 via wiring 4. Since the weight 9 volume becomes large and mounting on printed circuit board 3 becomes difficult, electronic parts l in which radiator 2 was attached as mentioned above are usual, It electrically connected with printed circuit board 3 via wiring 4, and was carried in the main part of electronic equipment (not shown), etc. in the state where it was made independent of printed circuit board 3. [Problem(s) to be Solved by the Invention] However, it says [ carrying electronic parts l in which radiator 2 was attached as mentioned above in the main part of electronic equipment, etc. in printed circuit board 3 at another object ], When removing printed circuit board 3 at the time of maintenance inspection, radiator 2 must also be removed from the main part of electronic equipment, and it must be carefully dealt with so that wiring 4 which connects both moreover may not be cut. For this reason, maintenance inspection work became complicated and there was a problem that working hours borrowed too much in many. The wiring distance between electronic parts 1 and printed circuit board 3 might become long, and the impedance of wiring 4 might interfere with circuit operation in the circuit treating high frequency. [Means for solving problem] It loads with the heating unit of heat vibes into the bag which consists of pliability material, and the cooling structure of the electronic parts concerning the present invention encloses the fluid for Heat transfer in this bag, and contacts this bag to electronic parts. [For Work ] The heat dissipation portion which makes the heat of electronic parts actually radiate heat can be made to estrange from electronic parts, and since it becomes unnecessary to provide the space which carries a radiator etc. in a printed circuit board, electronic parts with much calorific value can be mounted on a printed circuit board. Since the bag is formed of pliability material, it changes according to the surface shape of electronic parts, and can take many contact surface products. [Example] Hereinafter, Drawing 1 explains one example of the present invention in detail. Drawing 1 is a sectional side elevation showing the schematic structure of the cooling structure of the electronic parts concerning the present invention. In Drawing 1, 11 is electronic parts, such as a printed circuit board and a semiconductor device with much 12 to calorific value, and multiple these electronic parts 12 are mounted on the above-mentioned printed circuit board 11. Bag 14 which 13 is the heat vibes for radiating heat outside in the heat of the above-mentioned electronic parts 12, and this heat vibes 13 mentions below to the heating unit side is attached, and fin 15 for heat dissipation is attached to the radiator side. Bag 14 is formed of the material into which the whole has pliability, as for ', the inside is loaded with the heating unit of the above-mentioned heat vibes 13, and fluid 16 for Heat transfer is enclosed. As mentioned above, in order to cool electronic parts 12 with heat vibes 13 with which bag 14 was attached, it is carried out by pushing bag 14 against electronic parts 12 from the upper part. When bag 14 is pushed against electronic parts 12, since bag 14 is formed with pliability, it will change easily according to the surface shape of electronic parts 12, and will be close to the surface of electronic parts 12. Drawing 1 shows the state where it was pushed to printed circuit board 11 so that bag 14 might touch a plurality of electronic parts 12 and each of printed circuit board 11. And the heat emitted from electronic parts 12 is transmitted from this bag 14 to fluid 16 for Heat transfer, and is told to the heating unit of heat vibes 13 by a natural convection within bag 14. With heat vibes 13, since heat is told to a radiator from a heating unit, the heat from the above-mentioned electronic parts 12 will be told to the radiator of heat vibes 13, and will radiate heat outside from fin 15 for heat dissipation. That is, the heat of electronic parts 12 will be told to fin 15 for heat dissipation via fluid 16 for bag 14. Heat transfer, and heat vibes 13. Therefore, if the cooling structure of the electronic parts concerning the present invention is adopted, fin 15 for cooling which makes the heat of electronic parts 12 actually radiate heat in the air can be made to estrange from electronic parts 12. Since it becomes unnecessary to provide the space which carries a radiator etc. in printed circuit board 11, electronic parts with much calorific value can be mounted on printed circuit board 11. in addition -- bag 14 touched a plurality of electronic parts 12 and printed circuit boards 11, respectively, in this example, the example forced on printed circuit board 11 was shown so that these might all be cooled, but the present invention is taken by such limitation -- To be -- there are nothings, and it may install so that only specific parts may be cooled. In order to protect bag 14, a cover (not shown) may be provided in the portion which does not touch electronic parts 12 in bag 14. [Effect of the Invention] Cooling structure of the electronic parts built over the present invention as explained above, Since it loads with the heating unit of heat vibes into the bag which consists of pliability material and is the composition of enclosing the fluid for Heat transfer in this bag, and contacting this bag to electronic parts, The heat dissipation portion which makes the heat of electronic parts actually radiate heat can be made to estrange from electronic parts, and when electronic parts with much calorific value are mounted on a printed circuit board, it becomes unnecessary to provide for a printed circuit board the space which carries a radiator etc. Therefore, since electronic parts with much calorific value as well as other electronic parts can be mounted on a printed circuit board, wiring distance can be shortened, the performance of an electric circuit can be raised, and, moreover, maintenance 9 inspection work can be carried out easily. Since the bag is formed of pliability material and it changes according to the surface shape of electronic parts, it is effective in the ability to cool various-shaped electronic parts not only with the ability of many contact surface products to be taken but with one kind of bag.

[Brief Description of the Drawings]

The sectional side elevation and Drawing 2 showing the schematic structure of the cooling structure of the electronic parts which require Drawing 1 for the present invention are a perspective view showing the cooling structure of the conventional semiconductor device. 12 .... electronic parts, 13 .... heat pipe, 14 .... bag, 15 .... fin for cooling, 16 .... fluid for Heat transfer.