Motor drive device and method for manufacturing same

The present invention relates to a motor drive device used for driving a motor and a method of manufacturing the same.

A motor drive device that drives a motor generally has a circuit board on which electronic components are mounted. At this time, different circuits (circuit components) may be used depending on the type of motor (for example, for output) (see, for example, JP-A-2018-136144). Here, for example, by arranging either the large-current component or the small-current component on a common substrate, the large-current circuit and the small-current circuit can be appropriately manufactured. By doing so, it is possible to appropriately select components and mount them on a common substrate to fabricate different circuits on a common production line.

However, when different parts are selected and mounted on a common board, there is a possibility that the part to be selected or the part to be mounted may be erroneously selected (erroneous mounting). In particular, in the case of mass production, the line speed is fast and the possibility of mounting errors increases. This erroneous mounting results in a loss of production, which is undesirable.

SUMMARY OF THE INVENTION An object of the present invention is to provide a motor drive device and a method of manufacturing the same in which erroneous mounting during manufacturing is reduced.

A motor drive device according to an aspect of the present invention comprises a substrate, a first mounting area on the substrate for mounting a first circuit component, and a first mounting area on the substrate for mounting a second circuit component. The second mounting area and at least a portion of the first connection wiring member constituting the first path for supplying current to the first circuit component overlap the second mounting area. and at least part of a second connection wiring member forming a second path for supplying current to the second circuit component. and a second pair of connection points for connecting the second connection wiring member on the substrate so as to overlap with the first mounting area.

A method for manufacturing a motor drive device according to an aspect of the present invention provides a first mounting region for mounting a first circuit component, a second mounting region for mounting a second circuit component, and a By connecting the first pair of connection points on the substrate, which constitute a part of the first path for supplying current to the first circuit component, to each other, the second a second pair of connection points on the substrate forming part of a second path for supplying current to circuit components; When mounting the first circuit component or mounting the second circuit component in the second mounting region, and mounting the first circuit component in the mounting step, at least part of the When the first pair of connection points are connected by a first connection wiring member that overlaps with the second mounting region, and the second circuit component is mounted in the mounting step, at least a portion of the first connection wiring member overlaps the first mounting region. connecting the second pair of connection points with a second connection wiring member that overlaps the mounting area.

According to the present invention, it is possible to provide a motor drive device and a method of manufacturing the same that are intended to reduce erroneous mounting during manufacturing.

<figref num="1">It is a figure showing the printed circuit board for motor drive devices which concern on embodiment.</figref><figref num="2">It is a figure showing the motor drive circuit for large currents.</figref><figref num="3">FIG. 3 is a diagram showing a motor drive circuit for small current;</figref><figref num="4">It is a perspective view of a connection wiring member.</figref>

A motor drive device and a method of manufacturing the same according to embodiments will be described in detail below with reference to the drawings.

A motor driving device is a device that outputs a current for driving a motor, and has various circuits for driving and controlling the motor. The motor drive device can include, for example, one of the following motor drive circuits 20a and 20b depending on whether the motor to be driven has a large output or a small output.

FIG. 1 shows a printed circuit board 10 for a motor drive device according to an embodiment. 2 and 3 show a high-output motor drive circuit 20a and a low-output motor drive circuit 20b, respectively, which are fabricated using the printed circuit board 10. FIG.

The printed board 10 is a common board that can be used for manufacturing both the motor drive circuits 20a and 20b. As will be described later, depending on whether to manufacture a large current or a small current, a large current component (here, current sensor 31) or a small current component (here, shunt resistance element 32 ), one of the motor drive circuits 20a and 20b can be selected and manufactured.

As shown in FIG. 1, the printed board 10 is a board having mounting areas A (A1, A2), B, C (C1-C4) and connection points 11-18, 21, 22. As shown in FIG.

In addition to these mounting areas A, B, C and connection points 11 to 18, 21, 22, the printed circuit board 10 has electrical components, wiring, etc., but the description is omitted for the sake of clarity. . The printed circuit board 10 has, for example, wiring and electrical components connected to the connection points 11-18, 21, and 22. As shown in FIG.

The mounting areas A (A1, A2), B, and C (C1 to C4) are visually identified on the printed circuit board . In other words, the mounting areas A1, A2, B, C1 to C4 may be distinguished from their surroundings, for example, their boundaries or the areas themselves may be colored differently from their surroundings.

As shown in FIGS. 2 and 3, mounting areas A1 and A2 are areas for mounting components for large current (here, current sensor 31), and mounting area B is for mounting components for small current (current sensor 31). Here, it is a region for mounting a shunt resistance element 32). One or the other of the mounting areas A1 and B corresponds to the first mounting area and the second mounting area.

That is, either the current sensor 31 or the shunt resistance element 32 is selected and mounted on the printed circuit board 10 depending on whether the motor drive circuit 20 is for large current or for small current. Here, two current sensors 31 are mounted in mounting areas A1 and A2 for large current, and one shunt resistance element 32 is mounted in mounting area B for small current.

The mounting areas C1 to C4 are areas for mounting the electrolytic capacitors 33 thereon. Here, different numbers of electrolytic capacitors 33 are mounted for large current and for small current. Four electrolytic capacitors 33 are mounted in all of the mounting areas C1 to C4 for large current, and one electrolytic capacitor 33 is mounted only in mounting area C1 for small current.

Here, the shape and size of the mounting areas A, B, and C correspond to the shape of the current sensor 31, the shunt resistance element 32, and the electrolytic capacitor 33 to be mounted when viewed from above the printed circuit board 10. ing. By doing so, it becomes easier to accurately mount these electrical components. It should be noted that the mounting areas A, B, and C may have different shades or colors so that they can be distinguished from each other. Accurate mounting of these electrical components becomes easier.

The connection points 11 to 18, 21, 22 are made of conductors to which the ends of the connection wiring members 41, 42 are connected. By appropriately selecting two connection points 11 to 18, 21, and 22 and connecting one end and the other end of connection wiring members 41 and 42, a current path connecting the two connection points can be formed. The connection points 11 to 18, 21, 22 have connection holes (not shown) into which connection portions 45 of connection wiring members 41 or 42, which will be described later, are inserted.

As shown in FIG. 2, in the large-current circuit, a connection wiring member 41 (one or the other of the first connection wiring member and the second connection wiring member) is provided between the connection points 11 and 12 and the connection points 13 and 14. Three connection wiring members 42 are arranged between 15 and 16 and between 17 and 18 . As shown in FIG. 3, in the circuit for small current, one connection wiring member 41 is arranged between the connection points 21 and 14, and two connection wiring members 42 are arranged between the connection points 22 and 16 and between the connection points 17 and 18. .

The pair of connection points 11, 12 and the pair of connection points 21, 14 correspond to one or the other of the first pair of connection points and the second pair of connection points, and one of them is selected to form the connection wiring. Member 41 is connected. A current is supplied to the current sensor 31 in the mounting area A1 or the shunt resistance element 32 in the mounting area B by connecting the connection wiring member 41 to the pair of connection points 11 and 12 or the pair of connection points 21 and 14. Can form paths.

The pair of connection points 11 and 12 and the pair of connection points 21 and 14 have substantially the same interval (distance) so that the connection wiring member 41, which is the same member, can be connected.

A pair of connection points 11 and 12 straddle the mounting area B. FIG. Therefore, when the pair of connection points 11 and 12 are connected by the connection wiring member 41, the connection wiring member 41 is arranged so that at least a part thereof overlaps the mounting region B, and the shunt resistance element 32 is mounted in the mounting region B. will not be possible. As a result, the mounting of the shunt resistance element 32 in the mounting area B (mounting of the component for small current) and the connection of the pair of connection points 11 and 12 with the connection wiring member 41 (connection for large current) are simultaneously performed. erroneous mounting is prevented.

A pair of connection points 21 and 14 straddle the mounting area A1. Therefore, when the pair of connection points 21 and 14 are connected by the connection wiring member 41, the connection wiring member 41 is arranged so that at least a portion of the connection wiring member 41 overlaps the mounting area A1, and the current sensor 31 cannot be mounted in the mounting area A1. become unable. As a result, the mounting of the current sensor 31 in the mounting area A1 (mounting of the component for large current) and the connection of the pair of connection points 21 and 14 with the connection wiring member 41 (connection for small current) are performed simultaneously. Incorrect mounting is prevented.

Here, the connection points 13 and 14, 15 and 16, 17 and 18, and 22 and 16 have substantially the same interval (distance) so that the connection wiring member 42, which is the same member, can be connected.

In FIG. 3, two connection wiring members 42 are used to connect the connection points 22 and 18 via the connection points 16 and 17, but one connection wiring member 42 is used to connect the mounting area A2. It is also possible to directly connect the connection point 22 and the connection point 18 across the . In this case, the distance between the connection points 22 and 16 need not be substantially the same as that between the connection points 15 and 16 and so on.

The connection points 14 and 16 are commonly used when mounting both large-current and small-current components. As a result, the number of connection points is reduced, which facilitates the reduction of erroneous mounting and the reduction of the mounting area.

4 is a perspective view of connection wiring members 41 and 42. FIG. As shown in FIG. 4, each of the connection wiring members 41 and 42 has a shape obtained by bending an elongated flat plate, and has a connecting portion 45, a connecting portion 46, and a horizontal conductor portion 47. As shown in FIG. The connection wiring members 41 and 42 are not limited to flat plates, and may be made by bending electric wires or round bars.

The connection portions 45 are arranged at both ends of the connection wiring members 41 and 42 and connected to any one of the connection points 11-18, 21 and 22. As shown in FIG. The connection portions 45 can be inserted into the connection holes of the connection points 11 to 18, 21, and 22 and connected using solder or the like.

The horizontal conductor portion 47 is connected to the connecting portion 45 via the connecting portion 46, and is arranged substantially parallel to the main surface of the printed circuit board 10 during mounting. The length L of the horizontal conductor portion 47 differs depending on which of the connection wiring members 41 and 42 it is. The length L of the horizontal conductor portion 47 of the connection wiring member 41 is longer than the length L of the horizontal conductor portion 47 of the connection wiring member 42 . The connection wiring member 41 has a length corresponding to the connection points 11 and 12 and the connection points 21 and 14, and the connection wiring member 42 has a length corresponding to the connection points 13 and 14, 15 and 16, and 17 and 18. , 22 and 16.

The current sensor 31 can be configured using a substantially cylindrical core (magnetic core) and a Hall IC arranged in a gap formed in this core. That is, the current sensor 31 has a substantially cylindrical shape with an axis substantially parallel to the main surface of the printed circuit board 10, and the horizontal conductor portion 47 of the connection wiring member 42 passes through the inside of this cylinder. That is, when the current sensor 31 and the connection wiring member 42 are mounted, when viewed from the direction perpendicular to the main surface of the printed circuit board 10, the current sensor 31 and the connection wiring member 42 appear to overlap in a plane, but they do not overlap in three dimensions. That is, after mounting the current sensor 31, the connection wiring member 42 can be mounted without interfering with it.

The current sensor 31 detects current flowing through the horizontal conductor portion 47 of the connection wiring member 42 passing through the core. The magnetic field generated by the current flowing through the horizontal conductor portion 47 is received by the core, and the Hall IC converts it into a voltage, so that the current flowing through the horizontal conductor portion 47 can be detected.

The shunt resistance element 32 has a substantially rectangular parallelepiped shape, has a shunt resistance (low resistance) for current detection, and detects the current using the voltage drop across it.

Here, one shunt resistance element 32 is used to detect two-phase currents. Therefore, the shunt resistance element 32 has two detection elements corresponding to each phase. However, it is also possible to use a shunt resistor with one sensing element, in which case two shunt resistors are implemented.

In this way, the reason why the current detection element is replaced depending on whether the current is large or small is that the advantages and disadvantages of the current sensor 31 and the shunt resistance element 32 are taken into consideration. The shunt resistance element 32 has better detection accuracy and responsiveness than the current sensor 31, but generates a large amount of heat. Therefore, different parts are selected according to the output current, such as the shunt resistance element 32 for small currents and the current sensor 31 for large currents.

Here, as shown in FIG. 2, when the connection wiring member 41 is connected between the connection points 11 and 12 for large current, the horizontal conductor portion 47 of the connection wiring member 41 at least partially overlaps the mounting region B. , the shunt resistance element 32 for small current cannot be mounted in this mounting region B. That is, the connection of the connection wiring member 41 for large current is not compatible with the mounting of the shunt resistance element 32 for small current. As a result, erroneous mounting of connecting the connection wiring member 41 for large current and mounting the shunt resistance element 32 for small current at the same time is prevented.

Further, as shown in FIG. 3, when the connection wiring member 41 is connected between the connection points 21 and 14 for a small current, the horizontal conductor portion 47 of the connection wiring member 41 at least partially overlaps the mounting area A1, The current sensor 31 for large current cannot be mounted in this mounting area A1. That is, the connection of the connection wiring member 41 for small current is not compatible with the mounting of the current sensor 31 for large current on the mounting area A1. As a result, erroneous mounting of connecting the connection wiring member 41 for small current and mounting the shunt resistance element 32 for small current at the same time is prevented.

(Manufacturing method of motor driving device) The motor driving device can be manufactured by the following procedure.

First, the printed circuit board 10 shown in FIG. 1 is prepared (preparation step). Then, it is selected whether to manufacture the motor drive circuit 20 for large current or for small current from the printed circuit board 10, and depending on this selection, the mounting (mounting process) of electrical components, the connection between connection points ( connection step) is performed.

(1) When a large current is selected, the members are arranged as follows.

Current sensor 31: Mounting area A1, A2 Electrolytic capacitor 33: Mounting area C1-C4 Connection wiring member 41: Between connection points 11 and 12 Connection wiring member 42: Between connection points 13 and 14, 15 and 16, 17 and 18

Note that members (shunt resistance element 32, connection wiring members 41 and 42) are not mounted on mounting area B and connection points 21 and 22. FIG.

(2) When a small current is selected, the members are arranged as follows.

Shunt resistance element 32: Mounting area B electrolytic capacitor 33: Mounting area C1 Connection wiring member 41: Between connection points 21 and 14 Connection wiring member 42: Between connection points 22 and 16, 17 and 18

In addition, members (current sensor 31, electrolytic capacitor 33, connection wiring members 41 and 42) are not mounted on mounting areas A1, A2, C2 to C4 and connection points 11, 12, 13 and 15. FIG.

A motor drive device can be manufactured by incorporating the motor drive circuit 20 manufactured as described above.

As described above, in the present embodiment, by selecting and arranging components for large current and small current on the printed circuit board 10, the motor drive circuit 20 for large current and small current can be manufactured. The printed circuit board 10 can be shared, and the manufacturing cost can be reduced. Also, by sharing the connection wiring members 41 and 42, the manufacturing cost can be reduced.

By overlapping the arrangement location of the electric component (current sensor 31) for large current and the arrangement location of the connection wiring member 41 for small current, it is intended to prevent the expansion of the substrate area and the erroneous mounting. In addition, by overlapping the arrangement location of the electric component for small current (shunt resistance element 32) and the arrangement location of connection wiring member 41 for large current, it is intended to prevent expansion of the board area and erroneous mounting.

[Technical Ideas Obtained from the Embodiments] Technical ideas that can be grasped from the above embodiments will be described below.

[1] The motor drive device according to the embodiment includes a board (printed board 10) and a first mounting on the board for mounting a first circuit component (one of the current sensor 31 and the shunt resistance element 32). An area (one of the mounting areas A1 and B) and a second mounting area (one of the mounting areas A1 and B) on the substrate for mounting the second circuit component (the other of the current sensor 31 and the shunt resistance element 32). The other) and at least a part of the first connection wiring member 41 constituting the first path for supplying current to the first circuit component overlap the second mounting area. A first pair of connection points (one of connection points 11, 12 and connection points 21, 14) for connecting the connection wiring member to the substrate, and a second connection point for supplying current to the second circuit component. A second pair of connections for connecting the second connection wiring member 41 to the substrate such that at least a portion of the second connection wiring member 41 forming a path overlaps the first mounting area. a point (the other of connection points 11, 12 and connection points 21, 14).

As a result, erroneous mounting of the first circuit component and connection by the second connection wiring member and erroneous mounting of the second circuit component and connection by the first connection wiring member is prevented.

[2] Each of the first mounting area and the second mounting area is visibly identified on the substrate. This improves the eligibility for mounting the first circuit component or the second circuit component.

[3] The interval between the first pair of connection points and the interval between the second pair of connection points are substantially the same. As a result, the members having the same shape can be connected, and the manufacturing efficiency is improved. That is, the first connection wiring member and the second connection wiring member can be the same member.

[4] One of the first circuit component and the second circuit component is a component for large current, and the other of the first circuit component and the second circuit component is a component for small current. . As a result, circuits for large current and small current can be produced using the same substrate.

[5] The first circuit component and the second circuit component are current detection components. This allows the same substrate to be used for different current ranges.

[6] A method for manufacturing a motor drive device includes a preparation step, a mounting step, and a connection step.

In the preparation step, a printed circuit board is prepared. The printed circuit board has a first mounting area for mounting the first circuit component and a second mounting area for mounting the second circuit component, which are connected to each other, thereby A first pair of connection points on the substrate, which form part of a first path for supplying current to the circuit component, are connected to each other to supply current to the second circuit component. a second pair of connection points on the substrate forming part of two paths.

In the mounting step, the first circuit component is mounted on the first mounting area, or the second circuit component is mounted on the second mounting area.

In the connection step, when the first circuit component is mounted in the mounting step, the first pair of connection points are connected by a first connection wiring member that at least partially overlaps the second mounting region, and the mounting is performed. When the second circuit component is mounted in the process, the second pair of connection points are connected by a second connection wiring member that at least partially overlaps the first mounting area.

As a result, it is possible to reduce erroneous mounting when selecting and mounting the first circuit component or the second circuit component using a common printed circuit board.