Light emitting device package and light unit
12 claims: 3 independent, 9 dependent
- 1第1貫通ホール及び第2貫通ホールを有し、かつ複数の層を含むパッケージ本体と、 前記第1貫通ホール内に配置される放熱部と、 前記第2貫通ホール内に配置される導電性物質と、 前記複数の層のうちの隣接する一対の層の間に配置される電極パターンと、 前記放熱部の上に配置される発光素子と、 前記パッケージ本体の上に配置される第1電極パッドと、 前記パッケージ本体及び前記放熱部の下に配置される第1突出防止層と、 前記第1突出防止層の下に配置される第2電極パッドと、を含み、 前記パッケージ本体は、外側面、内側面、及び底面を有するキャビティを含み、 前記キャビティの内側面は、段差を含む階段形状を含み、 前記第1電極パッドは、前記底面に位置し、前記発光素子とワイヤによって電気的に連結され、 前記パッケージ本体は、Al 2 O 3 、Si x O y 、Si x N y 、またはAINを含み、 前記第1突出防止層は、前記パッケージ本体の前記複数の層のうちの最下層と同一の材質からなり、 前記第1突出防止層の上面は、前記放熱部の底面と接し、 前記第1突出防止層の底面は、前記第2電極パッドの上面と接し、 前記第1電極パッドと前記第2電極パッドは、前記導電性物質及び前記電極パターンを介して電気的に連結され、 前記放熱部は、銅(Cu)が含まれた銅合金層を含み、 前記銅合金層は、Cu-W合金層を含み、 前記放熱部は、前記発光素子と垂直に重なり、 前記発光素子は、260~405nmの波長帯域の光を発光 し、 前記放熱部の底面と直交する方向において、前記第2電極パッドは、前記放熱部と重ならない ことを特徴とする紫外線発光素子パッケージ。
- 2前記放熱部は、 前記発光素子に隣接して配置される第1領域と、 前記第1領域より前記発光素子から離隔するように、前記第1領域の下に延長されて配置される第2領域と、を含み、 前記放熱部の第1領域の幅と前記放熱部の第2領域の幅は互いに異なる、請求項1に記載の紫外線発光素子パッケージ。
- 3前記放熱部の第1領域の幅は、前記放熱部の第2領域の幅より狭い、請求項2に記載の紫外線発光素子パッケージ。
- 4前記発光素子と前記放熱部との間に配置される接着層をさらに含む、請求項1ないし3のいずれかに記載の紫外線発光素子パッケージ。
- 5前記発光素子と前記放熱部との間に配置される第2突出防止層をさらに含む、請求項1ないし4のいずれかに記載の紫外線発光素子パッケージ。
- 6前記放熱部は、複数の層を含む、請求項1ないし5のいずれかに記載の紫外線発光素子パッケージ。
- 7前記第1電極パッドは、前記第2突出防止層の上に配置される、請求項5に記載の紫外線発光素子パッケージ。
- 8シリコーンレジンを含み、前記発光素子を包囲するように前記キャビティ内に配置されるモールディング部をさらに含む、請求項1ないし7のいずれかに記載の紫外線発光素子パッケージ。
- 9前記パッケージ本体の上にガラスをさらに含む、請求項1ないし8のいずれかに記載の紫外線発光素子パッケージ。
- 10前記発光素子と前記放熱部との間に配置される第2突出防止層をさらに含み、 前記放熱部は、前記発光素子に隣接して配置される上端領域と、前記上端領域より前記発光素子から離隔するように、前記上端領域から延長されて配置される下端領域とを含み、 前記放熱部の上端領域の幅と前記放熱部の下端領域の幅は相互異なる、請求項1に記載の紫外線発光素子パッケージ。
- 11前記放熱部の上端領域の幅は、前記放熱部の下端領域の幅より広い、請求項 10 に記載の紫外線発光素子パッケージ。
- 12請求項1ないし 11 のいずれかに記載の紫外線発光素子パッケージを含む、発光ユニット。
Independent claims12
322 paragraphs, as filed
The present invention relates to a light emitting device package and a light unit including the same.
Light emitting devices such as light emitting diodes (Light Emitting Diodes) and laser diodes that use semiconductor group 3-5 or group 2-6 compound semiconductor materials are red, green, blue, ultraviolet rays, etc. due to the development of thin film growth technology and device materials. It is possible to realize various colors of, and it is also possible to realize efficient white light by using fluorescent substances or combining colors, and it consumes less power than existing light sources such as fluorescent lamps and incandescent lamps. It has advantages such as semi-permanent life, fast response speed, safety, and environmental friendliness.
Therefore, it replaces the cold cathode Fluorescence Lamp (CCFL) that constitutes the transmission module of the optical communication means and the backlight of the LCD (Liquid Crystal Display) display device, and replaces the light emitting diode backlight, fluorescent lamp, and incandescent lamp. Applications are expanding to replace white light emitting diode lighting devices, automobile headlights, and signal lights.
In the light emitting element package, the first electrode and the second electrode are arranged on the package body, the light emitting element is arranged on the bottom surface of the package body, and the light emitting element is electrically connected to the first electrode and the second electrode.
In the case of a light emitting element package equipped with a light emitting diode that emits ultraviolet rays (UV), when the reflected ultraviolet light comes into contact with the package body, the organic material contained in the body is discolored or deteriorated, and the reliability of the package is lowered. Exists. Therefore, it is necessary to improve the reliability of the light emitting element package while maintaining excellent heat dissipation characteristics.
FIG. 1 is a diagram showing a conventional light emitting device package.
A cavity structure is formed in the package body 110, and a light emitting element 130 is arranged on the bottom surface of the cavity. Although the heat radiating portion 180 can be arranged under the package body 110, the heat radiating portion 180 and the light emitting element 130 can be fixed by the conductive adhesive layer 120.
However, the conventional light emitting device package has the following problems.
In FIG. 1, the heat radiating unit 180 may be made of a material having excellent thermal conductivity, but heat can be discharged from the light emitting element 130 in the light emitting element package 100, and a material is formed between the package body 110 and the heat radiating unit 180. The flatness of the heat radiating portion may decrease due to the difference in the coefficient of thermal expansion caused by the difference between the two.
That is, in FIG. 1, since the volume of the heat radiating unit 180 expands, the surface of the heat radiating unit 180 becomes uneven rather than flat, and the light emitting element 130 is arranged in an inclined manner, so that the light emitting angle of the light emitting element package 100 is increased. Can be tilted. Further, if the heat radiating portion 180 becomes uneven in the downward direction of the light emitting element package 100, the light emitting element package may be tilted when mounted on a circuit board or the like.
<p> An object of the present invention is to improve the reliability of a light emitting device package.</p>
<p> The light emitting device package of the present invention includes a package body having a through hole and a heat radiating portion that is arranged in the through hole and includes an alloy layer containing copper (Cu), and contains copper in the heat radiating portion. The alloy layer comprises at least one in W or Mo, the package body comprises a cavity having a side wall and a bottom surface, and the bottom surface is formed with the through hole.</p>
<p> According to one aspect of the present invention, the volume expansion of the heat dissipation part of the light emitting element package due to heat is reduced, the deformation due to heat is minimized in the manufacturing process, the light emission angle is balanced, and the reliability of the light emitting element package is improved. Can be made to.</p><p> Further, according to one aspect of the present invention, since the light emitting element and the heat radiating portion are directly energized, the manufacturing process of the light emitting element package can be simplified.</p><p> Further, according to one aspect of the present invention, the electrodes of the light emitting element package are made of gold, which has strong oxidation resistance and durability, reduces the possibility of short-circuiting between the electrodes, and emits light in a short wavelength band such as UV. The area of the gold-plated electrode, which has a relatively low total reflectance, is reduced, and the exposed area of the ceramic layer, which has a relatively high total reflectance of UV light, is increased, so that the light extraction efficiency is improved and the light is exposed. Since the bonding force between the ceramic substrate and the silicone resin in the molding portion is larger, the stability of the structure can be improved.</p><p> Further, according to one aspect of the present invention, since the light source module and the external power supply are mechanically connected without soldering work, there is no concern about environmental pollution, the environment is friendly, the occurrence of wire connection failure is minimized, and the light source is used. The reliability of the module can be improved.</p><p> Further, according to one aspect of the present invention, it is not necessary to provide a separate support portion of the diffusion member, and the structure of the light source module is simplified by fastening the diffusion member to the holder, and the occurrence of poor adhesion of the diffusion member is minimized. be able to.</p>
<figref num="1">It is a figure which showed the conventional light emitting element package.</figref><figref num="2">It is a figure which showed the light emitting element package which concerns on 1st Example.</figref><figref num="3">It is the figure which showed separately only the heat radiating part included in the light emitting element package of FIG.</figref><figref num="4">It is the figure which showed separately only the heat radiating part included in the light emitting element package of FIG.</figref><figref num="5">It is a figure which showed the light emitting element applicable to the light emitting element package which concerns on 1st Example.</figref><figref num="6">It is a figure which showed the light emitting element package which concerns on 2nd Example.</figref><figref num="7">It is a figure which showed the light emitting element package which concerns on 3rd Example.</figref><figref num="8">It is a figure which showed the light emitting element package which concerns on 4th Example.</figref><figref num="9A">It is a figure which showed the light emitting element package which concerns on 5th Example.</figref><figref num="9B">It is a figure which showed an Example of the method of forming a circuit pattern in a main body.</figref><figref num="10">It is a figure which showed the light emitting element package which concerns on 6th Example.</figref><figref num="11">It is a figure which showed the light emitting element package which concerns on 7th Example.</figref><figref num="12">It is a figure which showed the light emitting element package which concerns on 8th Example.</figref><figref num="13A">It is a figure which showed the arrangement of the electrode pattern of the light emitting element package of FIG.</figref><figref num="13B">It is a figure which showed the arrangement of the electrode pattern of the light emitting element package of FIG.</figref><figref num="13C">It is a figure which showed the arrangement of the electrode pattern of the light emitting element package of FIG.</figref><figref num="14A">It is the figure which showed the part of FIG. 13A in detail.</figref><figref num="14B">It is a side sectional view showing the light emitting element package of FIG. 13 cut diagonally.</figref><figref num="15">It is a figure which showed the light emitting element package which concerns on 9th Example.</figref><figref num="16">It is a figure which showed the light emitting element package which concerns on 9th Example.</figref><figref num="17A">It is a figure which showed the light emitting element package which concerns on 9th Example.</figref><figref num="17B">It is a figure which showed the light emitting element package which concerns on 9th Example.</figref><figref num="18">It is a figure which showed in detail the heat radiating part included in the light emitting element package which concerns on 9th Example.</figref><figref num="19">It is a figure which showed the light source module which concerns on 10th Example.</figref><figref num="20">It is a figure which showed the light source module which concerns on 10th Example.</figref><figref num="21">It is a figure which showed the light source module which concerns on eleventh embodiment.</figref><figref num="22">It is a figure which showed the light source module which concerns on the twelfth embodiment.</figref><figref num="23">It is a figure which showed the light source module which concerns on 13th Example.</figref><figref num="24">It is a figure which showed the light source module which concerns on 14th Example.</figref><figref num="25">It is a figure which showed the fastening part structure of a holder.</figref><figref num="26A">It is sectional drawing which showed an Example of the contact structure of the wire arranged in a holder, and the electrode pad on a substrate.</figref><figref num="26B">It is sectional drawing which showed an Example of the contact structure of the wire arranged in a holder, and the electrode pad on a substrate.</figref><figref num="27">It is a figure which showed the light source module which concerns on the 15th Example.</figref><figref num="28">It is a figure which showed the light source module which concerns on the 16th Example.</figref><figref num="29A">It is a perspective view which saw a part of the support plate from the top.</figref><figref num="29B">It is a perspective view which saw a part of the support plate from the bottom.</figref><figref num="30">It is a figure which showed the light source module which concerns on the 17th Example.</figref><figref num="31">It is a figure which showed the light source module which concerns on 18th Example.</figref><figref num="32">It is a figure which showed the light source module which concerns on 19th Example.</figref><figref num="33">It is a figure which showed the light source module which concerns on 20th Example.</figref><figref num="34">It is a figure which showed the light source module which concerns on 21st Example.</figref><figref num="35">It is a figure which showed one Example of the headlamp which arranged the light source module which concerns on each said Example.</figref>
Hereinafter, each embodiment will be described with reference to the attached drawings.
In the description of the examples according to the present invention, when it is described that each element is formed "above or below", "above" or "below" means that the two elements are in direct contact with each other or one. It includes all that one or more other elements are arranged and formed between the two elements. Further, when the expression "upper or lower" is used, not only the upper direction but also the lower direction can be included with respect to one element.
The thickness and size of each layer in the drawings have been exaggerated, omitted, or outlined for convenience and clarity of description. Moreover, the size of each component does not completely reflect the actual size.
FIG. 2 is a diagram showing a light emitting element package according to the first embodiment, and FIGS. 3 and 4 are views showing only the heat radiating portion included in the light emitting element package of FIG. 2 separately.
As shown in FIG. 2, the light emitting element package 200 according to the first embodiment can include a main body 210, a heat radiating unit 220, and a light emitting element 230.
The main body 210 can be embodied in a plurality of layers. FIG. 2 shows a case where the main body 210 includes a first layer 211, a second layer 212, a third layer 213, and a fourth layer 214, but the main body 210 has more layers or It can also be embodied in fewer layers. Further, the main body 210 can be embodied in a single layer.
The main body 210 may include a plurality of insulating layers. The main body 210 can be embodied with an insulating substance of nitride or oxide. Further, the main body 210 can include a plurality of ceramic layers. For example, the main body 210 can be embodied by a low temperature co-fired ceramic (LTCC) method. Further, the main body 210 can be embodied by a high temperature co-fired ceramic (HTCC) method. The material of the main body 210 is SiO<sub>2</sub>, Si<sub>x</sub>O<sub>y</sub>, Si<sub>3</sub>N<sub>4</sub>, Si<sub>x</sub>N<sub>y</sub>, SiO<sub>x</sub>N<sub>y</sub>, Al<sub>2</sub>O<sub>3</sub>, Or can be AlN. For example, the main body 210 can be formed of AlN or can be embodied of a metal nitride having a thermal conductivity of 140 W / mK or more.
The thickness of each layer 211, 212, 213, 214 of the main body 210 may be the same, or at least one of them may be different in thickness. Each layer 211, 212, 213, 214 of the main body 210 may be an individual layer distinguished in the manufacturing process, or may be integrally formed after the completion of firing.
An electrode pattern can be formed between the layers forming the main body 210, and a power source can be provided to the light emitting element 230 via the electrode pattern. Further, the power source applied to the light emitting element 230 can also be provided via a via hole structure that can be formed in the main body 210.
The inside of the upper part of the main body 210 can be embodied by an inclined surface. A reflective substance can be provided inside the main body 210. The main body 210 can reflect the light emitted from the light emitting element 230 and extract it to the outside.
According to this embodiment, the main body 210 has a cavity, and the light emitting element 230 can be located in the cavity. The side wall of the cavity may consist of an inclined surface.
The molding unit 240 can be provided on the light emitting element 230. The molding unit 240 can protect the light emitting element 230 by blocking foreign matter and moisture flowing in from the outside. Further, the molding unit 240 can include a fluorescent substance, and can receive the light emitted from the light emitting element 230 and provide the wavelength-converted light.
A through hole can be provided in the lower part of the main body 210. The heat radiating portion 220 can be arranged in the through hole of the main body 210. When a cavity is formed in the main body 210 according to this embodiment, a through hole can be provided on the bottom surface of the cavity. The light emitting element 230 can be arranged on the heat radiating unit 220, and the light emitting element 230 can come into contact with the heat radiating unit 220. The heat radiating unit 220 can efficiently transfer the heat generated from the light emitting element 230 to the outside. The heat radiating portion 220 can be exposed to the outside. The heat radiating portion 220 can include an alloy layer 221 containing copper (Cu) and a copper (Cu) layer 222 arranged below the alloy layer 221. The horizontal cross-sectional area of the alloy layer 221 containing copper can be realized to be smaller than the horizontal cross-sectional area of the copper layer 222.
According to one embodiment, the heat radiating portion 220 can have an alloy layer 221 containing CuW and a copper layer 222 arranged below the alloy layer 221 as shown in FIG. Further, according to one embodiment, as shown in FIG. 4, the heat radiating portion 220 can have an alloy layer 221 containing CuMo and a copper layer 222 arranged below the alloy layer 221. .. The alloy layer 221 can contain at least one element of W and Mo.
In this embodiment, the heat radiating portion 220 is realized by using the alloy layer 221 including the copper layer and the copper layer 222. In the case of a copper layer, it is inferior in workability, but exhibits very good properties for heat transfer. However, the coefficient of thermal expansion of the copper layer is large, and the difference is large as compared with the coefficient of thermal expansion of the light emitting element 230. As a result, stress due to thermal expansion and contraction is transmitted to the light emitting element 230 due to the rise and fall of the temperature, and damage to the light emitting element 230 may occur. In order to solve such a problem, in the embodiment, in embodying the heat radiating portion 220, a copper layer 222 is arranged at the lower part, and an alloy layer 221 containing copper is arranged on the copper layer 222. As a result, the light emitting element 230 comes into contact with the alloy layer 221 instead of directly contacting the copper layer 222. In the embodiment, a CuW alloy layer and a CuMo alloy layer are presented as an example of the alloy layer 221. Since the CuW alloy layer and the CuMo alloy layer have a coefficient of thermal expansion similar to that of the light emitting element 230, the light emitting element 230 It becomes possible to prevent damage due to temperature rise and fall. The alloy layer 221 can contain at least one substance of W and Mo. The alloy layer 221 can include CuW, CuMo, CuWMo layer and the like.
Further, according to the present embodiment, by forming the heat radiating portion 220 with a plurality of layers, it is possible to prevent the upper surface of the heat radiating portion 220 from protruding upward. As a result, the light emitting element 230 arranged on the heat radiating unit 220 can be stably positioned.
FIG. 5 is a diagram showing a light emitting element applicable to the light emitting element package according to the first embodiment.
As shown in FIG. 5, the light emitting element according to the present embodiment can include a light emitting structure 10, an electrode 20, and a reflecting electrode 50.
The light emitting structure 10 can include a first conductive semiconductor layer 11, an active layer 12, and a second conductive semiconductor layer 13. Concavities and convexities 17 can be provided on the upper surface of the first conductive semiconductor layer 11.
For example, the first conductive semiconductor layer 11 is formed in an n-type semiconductor layer to which an n-type dopant is added as a first conductive type dopant, and the second conductive semiconductor layer 13 is a second conductive type. It can be formed on a p-type semiconductor layer to which a p-type dopant is added as a type dopant. Further, the first conductive semiconductor layer 11 can be formed on the p-type semiconductor layer, and the second conductive semiconductor layer 13 can be formed on the n-type semiconductor layer.
The first conductive semiconductor layer 11 can include, for example, an n-type semiconductor layer. The first conductive semiconductor layer 11 is In<sub>x</sub>Al<sub>y</sub>Ga<sub>1-xy</sub>It can be realized by a semiconductor material having a composition formula of N (0 x 1, 0 y 1, 0 x + y 1). The first conductive semiconductor layer 11 can be selected from, for example, GaN, AlN, AlGaN, InGaN, InN, InAlGaN, AlInN, AlGaAs, GaP, GaAs, GaAsP, AlGaInP, and the like, and Si, Ge. , Sn, Se, Te and other n-type dopants can be doped.
The active layer 12 includes electrons (or holes) injected through the first conductive semiconductor layer 11 and holes (or holes) injected through the second conductive semiconductor layer 13. Are layers that meet each other and emit light due to the difference in the band gap of the energy band due to the forming substance of the active layer 12. The active layer 12 can be formed by any one of a single quantum well structure, a multi-quantum well structure (MQW: Multi Quantum Well), a quantum point structure, and a quantum wire structure, but the active layer 12 is not limited thereto. ..
The active layer 12 is, for example, In<sub>x</sub>Al<sub>y</sub>Ga<sub>1-xy</sub>It can be realized by a semiconductor material having a composition formula of N (0 x 1, 0 y 1, 0 x + y 1). When the active layer 12 is embodied in the multiple quantum well structure, the active layer 12 can be embodied by laminating a plurality of well layers and a plurality of barrier layers, for example, an InGaN well layer / GaN barrier layer. It can be realized by the cycle of.
The second conductive semiconductor layer 13 can be embodied in, for example, a p-type semiconductor layer. The second conductive semiconductor layer 13 is In<sub>x</sub>Al<sub>y</sub>Ga<sub>1-xy</sub>It can be realized by a semiconductor material having a composition formula of N (0 x 1, 0 y 1, 0 x + y 1). The second conductive semiconductor layer 13 can be selected from, for example, GaN, AlN, AlGaN, InGaN, InN, InAlGaN, AlInN, AlGaAs, GaP, GaAs, GaAsP, AlGaInP, and the like, and can be selected from Mg, Zn, and the like. , Ca, Sr, Ba and other p-type dopants can be doped.
On the other hand, the first conductive semiconductor layer 11 may include a p-type semiconductor layer, and the second conductive semiconductor layer 13 may include an n-type semiconductor layer. Further, a semiconductor layer including an n-type or p-type semiconductor layer can be further formed under the second conductive semiconductor layer 13. Thereby, the light emitting structure 10 can have at least one of np, pn, npn, and pnp junction structures. Further, the doping concentration of impurities in the first conductive semiconductor layer 11 and the second conductive semiconductor layer 13 may be uniform or non-uniform. That is, the structure of the light emitting structure 10 can be formed in various ways, and is not limited thereto.
Further, a first conductive InGaN / GaN super lattice structure or an InGaN / InGaN super lattice structure can be formed between the first conductive semiconductor layer 11 and the active layer 12. Further, a second conductive AlGaN layer can be formed between the second conductive semiconductor layer 13 and the active layer 12.
The unevenness 17 can be provided on the upper surface of the first conductive semiconductor layer 11. When the first conductive semiconductor layer 11 is a GaN layer, the surface on which the unevenness 17 is formed may be an N surface in consideration of the growth direction and the etching direction.
The ohmic contact layer 40 and the reflective electrode 50 can be arranged under the light emitting structure 10. The electrode 20 can be arranged on the light emitting structure 10. The electrode 20 and the reflective electrode 50 can provide a power source to the light emitting structure 10. The ohmic contact layer 40 can be formed so as to make ohmic contact with the light emitting structure 10. Further, the reflective electrode 50 can function to reflect the light incident from the light emitting structure 10 and increase the amount of light extracted to the outside.
The ohmic contact layer 40 can be formed of, for example, a transparent conductive oxide film layer. The ohmic contact layer 40 includes, for example, ITO (Indium Tin Oxide), IZO (Indium Zinc Oxide), AZO (Aluminum Zinc Oxide), AGZO (Aluminum Gallium Zinc Oxide), IZTO (Indium Zinc Tin Oxide), and IAZO (Indium Aluminum). Selected from Zinc Oxide), IGZO (Indium Gallium Zinc Oxide), IGTO (Indium Gallium Tin Oxide), ATO (Antimony Tin Oxide), GZO (Gallium Zinc Oxide), IZON (IZO Nitride), ZnO, IrOx, RuOx, NiO It can be formed of at least one substance.
The reflective electrode 50 can be formed of a metal material having a high reflectance. For example, the reflective electrode 50 can be formed of a metal or alloy containing at least one of Ag, Ni, Al, Rh, Pd, Ir, Ru, Mg, Zn, Pt, Cu, Au, and Hf. Further, the reflective electrode 50 is the same as the metal or alloy, ITO (Indium-Tin-Oxide), IZO (Indium-Zinc-Oxide), IZTO (Indium-Zinc-Tin-Oxide), IAZO (Indium-Aluminum-Zinc). -Oxide), IGZO (Indium-Gallium-Zinc-Oxide), IGTO (Indium-Gallium-Tin-Oxide), AZO (Aluminum-Zinc-Oxide), ATO (Antimony-Tin-Oxide), etc. It can be formed in multiple layers using a substance. For example, in the embodiment, the reflective electrode 50 may include at least one of Ag, Al, AgPdCu alloy, and AgCu alloy.
A current blocking layer (CBL) 30 can be arranged between the light emitting structure 10 and the ohmic contact layer 40. The current cutoff layer 30 can be formed in a region where at least a part of the current cutoff layer is vertically overlapped with the electrode 20, whereby the current is concentrated at the shortest distance between the electrode 20 and the reflective electrode 50. The phenomenon can be alleviated and the luminous efficiency of the light emitting element according to the embodiment can be improved.
The current cutoff layer 30 can be formed by using a material having electrical insulation or forming Schottky contact with the light emitting structure 10. The current blocking layer 30 can be formed of an oxide, a nitride or a metal. The current cutoff layer 30 is, for example, SiO.<sub>2</sub>, SiO<sub>x</sub>, SiO<sub>x</sub>N<sub>y</sub>, Si<sub>3</sub>N<sub>4</sub>, Al<sub>2</sub>O<sub>3</sub>, TiO<sub>x</sub>, Ti, Al, Cr can be included.
The current cutoff layer 30 can be arranged in a first region below the light emitting structure 10, and the ohmic contact layer 40 is a second region below the light emitting structure 10 and the current. It can be placed below the barrier layer 30. The ohmic contact layer 40 can be arranged between the light emitting structure 10 and the reflecting electrode 50. Further, the ohmic contact layer 40 can be arranged between the current blocking layer 30 and the reflecting electrode 50.
An isolation layer 80 can be further arranged between the light emitting structure 10 and the ohmic contact layer 40. The isolation layer 80 can be arranged around the lower part of the light emitting structure 10 and on the ohmic contact layer 40. The isolation layer 80 can be formed of, for example, a material having electrical insulation or a material having lower electrical conductivity than the light emitting structure 10. The isolation layer 80 can be embodied with, for example, an oxide or a nitride. For example, the isolation layer 80 is SiO<sub>2</sub>, Si<sub>x</sub>O<sub>y</sub>, Si<sub>3</sub>N<sub>4</sub>, Si<sub>x</sub>N<sub>y</sub>, SiO<sub>x</sub>N<sub>y</sub>, Al<sub>2</sub>O<sub>3</sub>, TiO<sub>2</sub>, ITO, AZO, ZnO, etc. can be selected and formed from at least one group. The isolation layer 80 can be formed of the same substance as the current blocking layer 30, or can be formed of different substances from each other. The isolation layer 80 can also be referred to as a channel layer.
A diffusion barrier layer 55, a bonding layer 60, and a support member 70 can be arranged below the reflective electrode 50.
The diffusion barrier layer 55 can function to prevent the substance contained in the bonding layer 60 from being diffused in the direction of the reflective electrode 50 in the step in which the bonding layer 60 is provided. The diffusion barrier layer 55 can prevent a substance such as tin (Sn) contained in the bonding layer 60 from affecting the reflective electrode 50 and the like. The diffusion barrier layer 55 can contain at least one of Cu, Ni, TiW, W, and Pt substances.
The bonding layer 60 includes a barrier metal, a bonding metal, and the like, and can contain, for example, at least one of Ti, Au, Sn, Ni, Cr, Ga, In, Bi, Cu, Ag, and Ta. The support member 70 supports the light emitting element according to the embodiment and is electrically connected to the external electrode to provide a power source to the light emitting structure 10. The support member 70 is, for example, a semiconductor substrate in which Ti, Cr, Ni, Al, Pt, Au, W, Cu, Mo, CuW or impurities are injected (eg, Si, Ge, GaN, GaAs, ZnO, etc.). It can be formed by at least one of SiC, SiGe, etc.). Further, the support member 70 can also be formed of an insulating material.
A protective layer 90 can be further arranged on the light emitting structure 10. The protective layer 90 can be embodied with an oxide or a nitride. The protective layer 90 is, for example, SiO.<sub>2</sub>, SiO<sub>x</sub>, SiO<sub>x</sub>N<sub>y</sub>, Si<sub>3</sub>N<sub>4</sub>, Al<sub>2</sub>O<sub>3</sub>It can be formed of a material having translucency and insulation such as. The protective layer 90 can be provided on the side surface of the light emitting structure 10. Further, the protective layer 90 can be provided not only on the side surface of the light emitting structure 10 but also on the upper surface.
In the above description, the light emitting element having a vertical structure in which the electrode 20 is arranged above the light emitting structure 10 and the reflecting electrode 50 is arranged below the light emitting structure 10 has been described as a reference. However, the light emitting element according to the present embodiment has a first electrode electrically connected to the first conductive semiconductor layer 11 forming the light emitting structure 10 and a second conductive body forming the light emitting structure 10. The position and shape of the second electrode electrically connected to the type semiconductor layer 13 can be variously deformed. Further, the light emitting element according to the present embodiment can also be applied to a light emitting element having a horizontal structure in which the first electrode and the second electrode are exposed in the same direction.
FIG. 6 is a diagram showing a light emitting device package according to the second embodiment. The content that overlaps with the above-described embodiment will not be described again.
As shown in FIG. 6, the light emitting element package according to the second embodiment can include a main body 210, a heat radiating unit 220, and a light emitting element 230.
The main body 210 can be embodied in a plurality of layers. FIG. 6 shows a case where the main body 210 includes a first layer 211, a second layer 212, a third layer 213, and a fourth layer 214, but the main body 210 has more layers. Alternatively, it can be embodied in fewer layers. Further, the main body 210 can be embodied in a single layer.
The main body 210 may include a plurality of insulating layers. The main body 210 can be embodied in a nitride or oxide insulating material. Further, the main body 210 can include a plurality of ceramic layers. For example, the main body 210 can be embodied by a low temperature co-fired ceramic (LTCC) method. Further, the main body 210 can be embodied by a high temperature co-fired ceramic (HTCC) method. The material of the main body 210 is SiO<sub>2</sub>, Si<sub>x</sub>O<sub>y</sub>, Si<sub>3</sub>N<sub>4</sub>, Si<sub>x</sub>N<sub>y</sub>, SiO<sub>x</sub>N<sub>y</sub>, Al<sub>2</sub>O<sub>3</sub>, Or can be AlN. For example, the main body 210 can be formed of AlN or can be embodied of a metal nitride having a thermal conductivity of 140 W / mK or more.
The thickness of each layer 211, 212, 213, 214 of the main body 210 may be the same, or at least one of them may be different in thickness. Each layer 211, 212, 213, 214 of the main body 210 may be an individual layer distinguished in the manufacturing process, or may be integrally formed after the completion of firing.
An electrode pattern can be formed between the layers forming the main body 210, and a power source can be provided to the light emitting element 230 via the electrode pattern. Further, the power source applied to the light emitting element 230 can also be provided via a via hole structure that can be formed in the main body 210.
The inside of the upper part of the main body 210 can be embodied in a stepped shape. A reflective substance can be provided inside the main body 210. The main body 210 can reflect the light emitted from the light emitting element 230 and extract it to the outside.
A through hole can be provided in the lower part of the main body 210. The heat radiating portion 220 can be arranged in the through hole of the main body 210. The light emitting element 230 can be arranged on the heat radiating unit 220. The light emitting element 230 can come into contact with the heat radiating unit 220. The heat radiating unit 220 makes it possible to efficiently transfer the heat generated by the light emitting element 230 to the outside. The heat radiating portion 220 can be exposed to the outside.
The heat radiating portion 220 can have an alloy layer 221 containing copper (Cu) and a copper (Cu) layer 222 arranged below the alloy layer 221. The horizontal cross-sectional area of the alloy layer 221 containing copper can be realized to be smaller than the horizontal cross-sectional area of the copper layer 222.
In this embodiment, the heat radiating portion 220 is realized by using the alloy layer 221 including the copper layer and the copper layer 222. In the case of the copper layer, the processability is inferior, but the heat transfer is very good. However, since the copper layer has a large coefficient of thermal expansion, the difference is large as compared with the coefficient of thermal expansion of the light emitting element 230. As a result, stress due to thermal expansion and contraction is transmitted to the light emitting element 230 due to the rise and fall of the temperature, and damage to the light emitting element 230 may occur. In order to solve such a problem, in the embodiment, in embodying the heat radiating portion 220, a copper layer 222 is arranged at the lower part, and an alloy layer 221 containing copper is arranged on the copper layer 222. As a result, the light emitting element 230 comes into contact with the alloy layer 221 instead of directly contacting the copper layer 222. In the embodiment, a CuW alloy layer and a CuMo alloy layer are presented as an example of the alloy layer 221. Since the CuW alloy layer and the CuMo alloy layer have a coefficient of thermal expansion similar to that of the light emitting element 230, the light emitting element 230 It becomes possible to prevent damage due to temperature rise and fall. The alloy layer 221 can contain at least one substance of W and Mo. The alloy layer 221 can include CuW, CuMo, CuWMo layer and the like.
Further, according to the present embodiment, by forming the heat radiating portion 220 in a plurality of layers, it is possible to prevent the upper surface of the heat radiating portion 220 from protruding upward. As a result, the light emitting element 230 arranged on the heat radiating unit 220 can be stably positioned.
FIG. 7 is a diagram showing a light emitting device package according to the third embodiment. The contents overlapping with each of the above-described embodiments will not be described again.
As shown in FIG. 7, the light emitting element package 200 according to the third embodiment can include a main body 210, a heat radiating unit 220, and a light emitting element 230.
The main body 210 can be embodied in a plurality of layers. FIG. 7 shows a case where the main body 210 includes a first layer 211, a second layer 212, a third layer 213, a fourth layer 214, and a fifth layer 215. Can also be embodied in more or fewer layers. Further, the main body 210 can be embodied in a single layer.
The main body 210 may include a plurality of insulating layers. The main body 210 can be embodied in a nitride or oxide insulating material. Further, the main body 210 can include a plurality of ceramic layers. The body 210 may include a green sheet. For example, the main body 210 can be embodied by a low temperature co-fired ceramic (LTCC) method. Further, the main body 210 can be embodied by a high temperature co-fired ceramic (HTCC) method. The material of the main body 210 is SiO<sub>2</sub>, Si<sub>x</sub>O<sub>y</sub>, Si<sub>3</sub>N<sub>4</sub>, Si<sub>x</sub>N<sub>y</sub>, SiO<sub>x</sub>N<sub>y</sub>, Al<sub>2</sub>O<sub>3</sub>, Or can be AlN. For example, the main body 210 can be formed of AlN or can be embodied of a metal nitride having a thermal conductivity of 140 W / mK or more.
The inside of the upper part of the main body 210 can be embodied on an inclined surface. A reflective substance can be provided inside the main body 210. The main body 210 can reflect the light emitted from the light emitting element 230 and extract it to the outside. The first layer 211 and the second layer 212 forming the main body 210 can also be referred to as expansion layers. The expansion layer can be laminated and positioned around the heat radiating portion 230. The body 210 may include a cavity formed by the expansion layer and having a bottom and an inner surface. The inner surface of the cavity can have an inclined surface. The third layer 213 can also be referred to as a support layer. The third layer 213 supports the light emitting element 230 and can also play a supporting role in the process of forming the heat radiating portion 220. That is, the third layer 213 can serve as a protrusion prevention layer that prevents the heat radiating portion 220 from expanding due to heat and protruding in the light emitting element 230 direction.
A recess can be provided in the lower part of the main body 210. The recess can be provided upward from a support portion that supports the main body 210. For example, the support may be the fifth layer 215 in contact with the heat dissipation 220. The heat radiating unit 220 can be arranged in the recess of the main body 210. The light emitting element 230 can be arranged on the heat radiating unit 220. The third layer 213 can be arranged between the light emitting element 230 and the heat radiating portion 220. The third layer 213 can be formed to have a thin thickness so that the heat generated by the light emitting element 230 can be well transferred to the heat radiating unit 220. For example, the third layer 213 can be formed with a thickness of 40 μm to 60 μm.
The heat radiating unit 220 makes it possible to efficiently transfer the heat generated by the light emitting element 230 to the outside. The heat radiating portion 220 can be exposed to the outside. The heat radiating portion 220 can include an alloy layer 221 containing copper (Cu) and a copper (Cu) layer 222 arranged below the alloy layer 221. The horizontal cross-sectional area of the alloy layer 221 containing copper can be realized to be smaller than the horizontal cross-sectional area of the copper layer 222.
According to this embodiment, by arranging the third layer 213 on the heat radiating unit 220, it is possible to prevent the upper surface of the heat radiating unit 220 from protruding upward. The third layer 213 can be formed of, for example, a green sheet, and the upper surface can be formed flat. Thereby, the light emitting device 230 can be arranged on the third layer 213 through eutectic bonding or the like.
For example, the heat radiating portion 220 may be formed through a firing step after filling the recess of the main body 210 in the form of a sintered body, pellets, rods, fine powder, paste, or the like. As a result, the light emitting element 230 arranged on the heat radiating unit 220 can be stably positioned. Further, a separate thin film, for example, a green sheet having a thickness of 40 μm to 60 μm can be arranged under the heat radiating portion 220.
FIG. 8 is a diagram showing a light emitting device package according to the fourth embodiment. The contents overlapping with each of the above-described embodiments will not be described again.
As shown in FIG. 8, the light emitting element package according to the fourth embodiment can include a main body 210, a heat radiating unit 220, and a light emitting element 230.
The inside of the upper part of the main body 210 can be embodied in a stepped shape. A reflective substance can be provided inside the main body 210. The main body 210 can reflect the light emitted from the light emitting element 230 and extract it to the outside. The first layer 211 and the second layer 212 forming the main body 210 can also be referred to as expansion layers. The expansion layer can be laminated and positioned around the heat radiating portion 230. The body 210 may include a cavity formed by the expansion layer and having a bottom and an inner surface. The inner surface of the cavity can have a stepped shape. The third layer 213 can also be referred to as a support layer. The third layer 213 supports the light emitting element 230 and can also play a supporting role in the step of forming the heat radiating portion 220.
FIG. 9A is a diagram showing a light emitting element package according to a fifth embodiment, and FIG. 9B is a diagram showing an embodiment of a method of forming a circuit pattern in a main body. The contents overlapping with each of the above-described embodiments will not be described again.
As shown in FIG. 9A, the light emitting element package according to the fifth embodiment can include a main body 210, a heat radiating unit 220, and a light emitting element 230.
A through hole is formed in the main body 210, and the heat radiating portion 220 is inserted into the through hole. The heat dissipation effect can be increased by forming a pattern on the inner surface of the through hole and the outer surface of the heat radiating portion 220 in contact with the inner side surface to widen the contact area.
FIG. 9A shows, as an example, that the pattern has a stepped shape, but there is no limitation on the pattern shape.
A circuit pattern is formed inside the main body 210 by using an electrode pattern and a through electrode.
Referring to FIG. 9B, first, a plurality of green sheets 280 are prepared by mixing the ceramic and the binder. A via hole 290 is formed at an accurate position on each of the plurality of green sheets produced in this manner 281 to 284 in consideration of the entire main body 210, and an electrode pattern 294 connected to the via hole 290 is formed. At this time, after forming the electrode pattern 294, the via hole 290 can also be formed. Then, the through electrode 292 is formed by filling the inside of the via hole 290 with the electrode material. The electrode material can be filled only in the inner wall of the via hole 290, or can be filled in the entire via hole 290.
The electrode pattern (not shown) located at the bottom of the main body 210 acts as an electrode pad and is connected to the electrodes of the substrate to supply a current to the light emitting element 230.
The light emitting element 230 can be electrically connected to the heat radiating portion 220 via the conductive adhesive layer 250. That is, the heat radiating unit 220 is made of a material having both thermal conductivity and electrical conductivity, is electrically connected to the electrode pattern of the main body 210, and the light emitting element 230 is bonded to the heat radiating unit 220 via the conductive adhesive layer 250. Therefore, the light emitting element 230 and the heat radiating unit 220 can be directly energized without separate wire bonding. The conductive adhesive layer 250 can be, for example, Ag paste or AuSn metal.
FIG. 10 is a diagram showing a light emitting device package according to a sixth embodiment. The contents overlapping with each of the above-described embodiments will not be described again.
As shown in FIG. 10, the light emitting element package according to the sixth embodiment can include a main body 210, a heat radiating unit 220, and a light emitting element 230.
The main body 210 has a protrusion prevention layer 260 located between the light emitting element 230 and the heat radiating unit 220.
Since the main body 210 and the heat radiating unit 220 have different coefficients of thermal expansion due to different substances, the heat radiating unit 220 in the form of a heat radiating block is inserted into the main body 210 and then undergoes simultaneous-fire processing or emits light. While the heat radiating unit 220 expands due to the heat generated by the light emitting element 230 during the use of the element package, the upper surface of the heat radiating unit 220 on which the light emitting element 230 is mounted may protrude in a convex shape.
If the upper surface of the heat radiating portion 220 protrudes in a convex shape, poor contact with the light emitting element 230 may occur, which may cause a problem in reliability. Therefore, the protrusion prevention layer 260 can be positioned between the light emitting element 230 and the heat radiating unit 220 to prevent the upper surface of the heat radiating unit 220 from protruding in the light emitting element 230 direction.
The protrusion prevention layer 260 may be formed separately and arranged on the main body 210, or may be integrally formed with the main body 210 to form a part of the main body 210.
An electrode pattern (not shown) is formed on the protrusion prevention layer 260, and the light emitting element 230 and the protrusion prevention layer 260 can be electrically connected to each other.
The protrusion prevention layer 260 can be formed not between the light emitting element 230 and the heat radiating unit 220 but also under the heat radiating unit 220.
FIG. 11 is a diagram showing a light emitting device package according to the seventh embodiment. The contents overlapping with each of the above-described embodiments will not be described again.
As shown in FIG. 11, the light emitting element package according to the seventh embodiment can include a main body 210, a heat radiating unit 220, and a light emitting element 230.
The main body 210 has a protrusion prevention layer 260 located between the light emitting element 230 and the heat dissipation unit 220, and a protrusion prevention layer 270 located below the heat dissipation unit 220.
Since the heat radiating portion 220 can project convexly not only on the upper surface but also on the lower surface, a protrusion prevention layer can be formed on all the upper and lower surfaces of the heat radiating portion 220.
The protrusion prevention layers 260 and 270 may be formed separately and arranged on the main body 210, or may be integrally formed with the main body 210 to form a part of the main body 210.
FIG. 12 is a diagram showing a light emitting device package according to the eighth embodiment. The contents overlapping with each of the above-described embodiments will not be described again.
In the light emitting element package 300 according to the eighth embodiment, the package body 310 includes a plurality of ceramic layers 310a, 310b, 310c, and 310d. The package body 310 can be embodied using high temperature cofired ceramics (HTCC) or low temperature cofired ceramics (LTCC) technology.
When the package body 310 is a multilayer ceramic substrate, the thickness of each layer may be the same or different. The package body 310 is made of an insulating material of nitride or oxide, for example, SiO<sub>2</sub>, Si<sub>x</sub>O<sub>y</sub>, Si<sub>3</sub>N<sub>y</sub>, SiO<sub>x</sub>N<sub>y</sub>, Al<sub>2</sub>O<sub>3</sub>Alternatively, it can contain AlN.
The widths of the plurality of ceramic layers 310a, 310b, 310c, 310d are different from each other, and some ceramic layers 310a, 310b can form the bottom surface of the light emitting device package 300 or the cavity, and some other ceramic layers 310c, 310d. Can form the side wall of the cavity.
The light emitting element 230 is arranged on the bottom surface of the cavity composed of the plurality of ceramic layers 310a, 310b, 310c, and 310d described above. Although four light emitting elements 230 are arranged in this embodiment, at least one can be arranged.
The light emitting device 230 includes an LED (Light Emitting Diode) using a plurality of compound semiconductor layers, for example, semiconductor layers of Group 3-5 elements, and the light emitting device emits light such as blue, green, or red. It can be a colored light emitting element or a UV light emitting element that emits UV light.
Since the package body 310 is made of a ceramic substrate such as LTCC or HTCC, which is an inorganic material, a deep UV LED with a wavelength of about 280 nm or a near UV LED with a wavelength of about 365 to 405 nm can be used. Even if the light emitting element 230 including the light emitting element 230 is used, there is no possibility that the main body 310 is discolored or deteriorated by the ultraviolet light emitted from the light emitting element 230, and the reliability of the light emitting module can be maintained.
13A to 13C are views showing the arrangement of the electrode patterns of the light emitting device package of FIG. 12, FIG. 14A is a view showing a part of FIG. 13A in detail, and FIG. 14B is a view of the light emitting device package of FIG. It is a side sectional view shown by cutting in the diagonal direction.
Since the four light emitting elements 230 are arranged in the light emitting element package 300 of FIG. 12, the four first electrode patterns 331, 332, 333, 334 and the second electrode patterns 341, 342, 343 in FIG. 13A are arranged. , 344 can be placed respectively. Since the four first electrode patterns 331, 332, 333, 334 described above can have the same polarity as each other, they can be connected to one lead frame, and the four electrode patterns 331, 332 of other polarities can be connected. , 333, 334 can also have the same polarity with each other, so that they can be connected to one other lead frame.
In the top view of FIG. 13A, the ceramic layers 310c and 310d forming the side walls of the cavity are shown on the outer shell, and the ceramic layers 310b forming the bottom surface of the cavity are exposed in the center. In the top view of FIG. 13A, the width c of the ceramic layer 310d placed on the uppermost side in FIG. 12 appears to be the widest, the width b of the ceramic layer 310c placed on the second upper side looks narrower, and the bottom surface of the cavity. The ceramic layer 310b forms the narrowest width a.
The arrangement of the first electrode patterns 331, 332, 333, 334 and the second electrode patterns 341, 342, 343, 344 described above can be symmetrical with respect to the center of the ceramic layer 310b forming the bottom surface of the cavity. .. In the following, a part of the electrode pattern structure will be described in detail with reference to FIG.
The first electrode patterns 331, 332, 333, 334 are located in the central region of the bottom surface of the cavity, and the second electrode patterns 341, 342, 343, 344 are located in the edge region of the bottom surface of the cavity. The arrangements of the first electrode patterns 331, 332, 333, 334 and the second electrode patterns 341, 342, 343, 344 described above can be interchanged with each other.
In the second electrode pattern 341, the width f of the side is arranged to be narrower than the width e of the edge portion. The ceramic layer 310b is exposed in the region d where the width of the side of the second electrode pattern 341 is narrowly arranged. That is, the width of the maximum pattern and the width of the minimum pattern of the second electrode pattern 341 can be different from each other, but such an arrangement increases the area where the light emitted from the light emitting element is reflected by the ceramic layer 310b. , The light efficiency of the light emitting element package can be improved.
To explain again, the second electrode pattern 341 includes a first region 341-1 and a second region 341-2 connected to the first region 341-1, and the first region 341 The width of -1 is different from the width of the second region 341-2, and the width e of the first region 341-1 is wider. By forming the width of the second region 341-2 to be narrower than the width of the first region 341-1, the ceramic layer 310b can be exposed and the light reflection efficiency can be improved. The first region 341-1 is a region to which the wire 360 is bonded at the time of wire bonding of the light emitting element 230. The same applies to the second electrode patterns 342, 343, and 344.
Then, the area where the exposed ceramic layer 310b comes into contact with the translucent layer also increases, but the bonding force between the second electrode pattern 341 made of metal and the translucent layer is compared with that of the ceramic layer 310b and the translucent layer. Since the bonding force with the silicone resin or the like is larger, the stability in the structure of the light emitting element package can be increased.
Then, a protrusion p can be formed at the edge of the second electrode pattern 341. The via hole type connecting electrode described above is arranged on the ceramic layer 310b forming the package body corresponding to the protrusion p, and the second electrode pattern 341 can be connected to the lead frame. possible. The above-mentioned protrusion p and the expansion pattern are electrically connected to the through hole formed in the package body, and can be electrically connected to the lead frame or the like at the lower part of the package body. Referring to FIG. 14B, the protrusion p, which is an expansion pattern of the second electrode pattern 341, is formed by being expanded toward the wall portion of the cavity, and at least a part thereof may be located below the wall portion of the cavity. Further, the through hole electrically connected to the protruding portion p can also be arranged so as to be vertically overlapped with the wall portion of the cavity. When the electrode pattern is formed on the package body in which the through hole is formed, the electrode pattern portion becomes concave in the downward direction due to the through hole, which may affect the reliability. By forming it on the lower side of the wall portion of the cavity, it is possible to prevent a decrease in reliability.
In FIG. 13B, the first electrode patterns 331 to 334 are patterned to form a region d in which the electrode patterns are narrowly arranged, and the widths of the sides of the first electrode patterns 331 to 334 described above are narrowly arranged. The ceramic layer 310b is exposed in the region d. That is, the area where the first electrode patterns 331 to 334 are narrowly arranged increases the area reflected from the ceramic layer 310b, and the luminous efficiency of the luminous element package can be improved.
To explain again, the first electrode pattern 331 has a chip mounting region 331-1 and a plurality of edge regions 331-2 arranged around the chip mounting region 331-1, and each adjacent edge. The ceramic layer 310b is exposed between the partial regions 331-2, and the light reflection efficiency can be improved. The same applies to the first electrode patterns 332, 333, and 334. As an example, FIG. 13B shows that each edge region 331-2 is located at a corner of the chip mounting region 331-1.
In FIG. 13C, the first electrode patterns 331 to 334 are patterned to form a region d in which the electrode pattern is narrowly arranged in the edge region, and the effect is as described in FIG. 13B.
To explain again, the first electrode pattern 331 has a chip mounting region 331-1 and a plurality of edge regions 331-2 arranged around the chip mounting region 331-1, and each adjacent edge. The ceramic layer 310b is exposed between the partial regions 331-2, and the light reflection efficiency can be improved. The same applies to the first electrode patterns 332, 333, and 334. As an example, FIG. 13B shows that each edge region 331-2 is located along the side of the chip mounting region 331-1.
In FIGS. 13A to 13C described above, the electrode pattern is narrowly formed and the ceramic layer is exposed. One or more of the four first electrode patterns 331 to 334 and the second electrode patterns 341 to 344, respectively. Can be embodied in.
In FIG. 14, the second electrode pattern 341 may have an edge width e of 0.45 mm when the side width f is 0.35 mm. Then, the width between the second electrode pattern 341 and the first electrode pattern 331 is 0.1 mm, and the width g of the wider region at the edge of the second electrode pattern 341 can be 0.45 mm. ..
15 to 17 are views showing each light emitting element package according to the ninth embodiment. The contents overlapping with each of the above-described embodiments will not be described again.
In the light emitting element package 400 according to the ninth embodiment, the package body is composed of a plurality of ceramic layers 410a, 410b, 410c, 410d, 410e. The package body can be embodied using High Temperature Cofired Ceramics (HTCC) or Low Temperature Cofired Ceramics (LTCC) technology.
When the package body is a multilayer ceramic substrate, the thickness of each layer may be the same or different. The package body is made of an insulating material of nitride or oxide, for example SiO<sub>2</sub>, Si<sub>x</sub>O<sub>y</sub>, Si<sub>3</sub>N<sub>y</sub>, SiO<sub>x</sub>N<sub>y</sub>, Al<sub>2</sub>O<sub>3</sub>Alternatively, it can contain AlN.
The widths of the plurality of ceramic layers 410a, 410b, 410c, 410d, 410e may be different from each other, and some ceramic layers 410a, 410b, 410c can form the bottom surface of the light emitting device package 400 or the cavity, and the other one. The ceramic layers 410d and 410e of the part can form the side wall of the cavity.
The light emitting element 230 is arranged on the bottom surface of the cavity composed of the plurality of ceramic layers 410a, 410b, 410c, 410d, and 410e described above. At least one light emitting element 230 can be arranged. A molding portion 450 is arranged inside the cavity while surrounding the light emitting element 230 and the wire 440, but the molding portion 450 can contain a silicone resin or a phosphor 460, and the phosphor 460 emits from the light emitting element 230. The light in the first wavelength region obtained can be converted into the light in the second wavelength region having a longer wavelength. For example, if the first wavelength region is the ultraviolet region, the second wavelength region can be the visible light region.
Since the package body is made of an inorganic ceramic substrate, a light emitting element 230 containing a Deep UV LED with a wavelength of about 280 nm or a Near UV LED with a wavelength of about 365 to 395 nm is used. Even so, the reliability of the light emitting module can be maintained without the possibility that the package body is discolored or deteriorated by the ultraviolet light emitted from the light emitting element 230.
Referring to FIG. 15, the light emitting element 230 is arranged on the surface of the package body, but when the plurality of ceramic layers 410a, 410b, 410c, 410d, 410e forming the package body form a cavity, they are arranged on the bottom surface of the cavity. The light emitting element 230 can be arranged on the surface of the ceramic layer 410c.
The light emitting element 230 is in contact with the heat radiating portions 480a and 480b via the conductive adhesive layer 445. The heat radiating portions 480a and 480b are made of a substance having excellent thermal conductivity and electrical conductivity, and may be made of, for example, copper (Cu) or an alloy containing copper (Cu). The alloy containing copper (Cu) can be composed of at least one substance of W or Mo, and can include, for example, CuW, CuNo, CuWMo and the like. Since the heat radiating parts 480a and 480b are made of a substance having electrical conductivity and the light emitting element 230 is attached to the heat radiating parts 480a and 480b via the conductive adhesive layer 445, the light emitting element 230 and the heat radiating parts 480a and 480b are separately separated. It can be directly energized without wire bonding.
Width W of heat dissipation parts 480a and 480b adjacent to the light emitting element 230<sub>b b</sub>Is the width W of the light emitting element 230<sub>a</sub>It may be the same as the width W of the layer arranged on the bottom surface of the package body.<sub>c</sub>Is the width W of the light emitting element 230<sub>a</sub>Can be wider. That is, the widths of the heat radiating portions 480a and 480b are wider in the direction opposite to the light emitting element than in the direction of contact with the light emitting element 230.
In such a configuration, it is sufficient if the widths of the heat radiating portions 480a and 480b are the same as the width of the light emitting element 230 on the surface in contact with the light emitting element 230, and the width of the heat radiating portions 480a and 480b increases as the distance from the light emitting element 230 increases. It becomes wider and the heat release efficiency can be increased. Since the area of the heat radiating parts 480a and 480b to which heat is transferred in the lower direction is relatively large, the expansion of the heat radiating parts 480a and 480b due to thermal expansion is reduced as compared with the case where heat is released in a narrow area. be able to. Further, the upper cross-sectional area of the heat radiating portion can be configured to be wider than the lower cross-sectional area as the distance from the light emitting element increases.
According to this embodiment, the heat radiating portions 480a and 480b are located adjacent to the light emitting element 230 and are located in a relatively narrow width first portion and in the direction opposite to the light emitting element 230, from the first portion. The wide second part may consist of different substances from each other. That is, the first portion may be composed of an alloy layer containing copper (Cu), and the second portion may be composed of a copper layer. The copper-containing alloy layer can be composed of at least one substance of W or Mo, and can contain, for example, CuW, CuNo, CuWMo, and the like.
In the case of the copper layer, the processability is inferior, but the heat transfer is very good. However, since the copper layer has a large coefficient of thermal expansion, the difference is large as compared with the coefficient of thermal expansion of the light emitting element 230. As a result, stress due to thermal expansion and contraction is transmitted to the light emitting element 230 due to the rise and fall of the temperature, and damage to the light emitting element 230 may occur. In order to solve such a problem, as an example, in embodying the heat radiating portions 480a and 480b, the lower second portion is formed in a copper layer, and the upper first portion is formed with an alloy layer containing copper. did. As a result, the light emitting element 230 comes into contact with the alloy layer instead of directly contacting the copper layer. Since the CuW alloy layer and the CuMo alloy layer have a coefficient of thermal expansion similar to that of the light emitting element 230, it is possible to prevent the light emitting element 230 from being damaged by the rise and fall of the temperature.
The two heat radiating portions 480a and 480b can be electrically connected to each other via the electrode pattern 475c formed on the ceramic layer 410c. Then, the heat radiating portion 480b is electrically connected to the electrode layer 475b formed on the ceramic layer 410b, and the electrode layer 475b is formed with an electrode pattern below the ceramic layer 410a via a through hole 477a filled with a conductive substance. Can be connected to 475a.
The other electrodes of the light emitting element 230 are bonded to the electrode pattern 471d on the surface of the ceramic layer 410c by the wire 440. The electrode pattern 471d is formed by passing through holes 473a, 473c, 473d and electrode patterns 471b, 471c filled with conductive substances formed in the ceramic layers 410a, 410b, and 410c, respectively, to form an electrode below the ceramic layer 410a. It can be linked to pattern 471a. The pair of electrode patterns 471a and 475a described above act as electrode pads and can be in direct electrical contact with the circuit board.
Two or four light emitting elements 230 can be arranged on the ceramic layer 410c described above as shown, but the electrode patterns 471d and 475d electrically connected to the respective light emitting elements 230 have the same polarity. Because there is, it can be electrically connected.
A protrusion prevention layer 490 can be arranged below the heat radiating portions 480a and 480b. The green sheet supports the ceramic layer 410a and the heat radiating portions 480a and 480b on the lowermost side of the package body, and the protrusion prevention layer 490 can prevent the thermal expansion of the heat radiating portions 480a and 480b by sealing.
In the embodiment shown in FIG. 16, the protrusion prevention layer 490 is arranged below the ceramic layer 410a forming the package body. Then, the electrode pattern 471a is electrically connected to the electrode pad 492a at the lower part of the green sheet 490 via the through hole 491a filled with the conductive material formed in the ceramic layer 410a, and the other electrode patterns 475a are It can be electrically connected to another electrode pad 492b under the green sheet 490 via a through hole 491b filled with a conductive material formed in the ceramic layer 410b.
In each of the above-described embodiments, the protrusion prevention layer 490 is a support plate that supports the shapes of the heat radiating portions 480a and 480b, and may be a film having a low translucency or made of the same material as the ceramic layer 410a.
In the embodiment shown in FIG. 17A, the protrusion prevention layer 495 is arranged above the ceramic layer 410c forming the bottom surface of the cavity. Then, the light emitting element 230 is bonded to the electrode patterns 471d and 475d arranged on the surface of the protrusion prevention layer 495 by the wire 440, and the electrode pattern 471d is filled with the conductive substance formed in the protrusion prevention layer 495. It is electrically connected to the electrode pattern 497a via the through hole 496a, and the plurality of electrode patterns 471d and 475d can be electrically connected to each other.
The two light emitting elements 230 are electrically connected to the electrode pattern 498 on the ceramic layer 410c via the conductive adhesive layer 445, the electrode pattern 498 is in electrical contact with the heat radiating portion 480b, and the heat radiating portion 480b is formed. It is electrically connected to the electrode pattern 475a below the ceramic layer 410a via the electrode patterns 475b and 475c and the through holes 477a and 477b filled with the conductive material. The two heat dissipation layers 480a and 480b can also be electrically connected to each other.
In this embodiment, the protrusion prevention layer 495 is arranged in the region corresponding to the heat radiating portions 480a and 480b, and it is possible to prevent the surfaces of the heat radiating portions 480a and 480b from being uneven when the heat radiating portions 480a and 480b are expanded by heat. it can. The height balance of the package body can be adjusted together with the portion of the protrusion prevention layer 495 that does not correspond to the light emitting element 230.
On the other hand, referring to FIG. 17B, another ceramic layer 410f may be located below the ceramic layer 410d, and electrode patterns 471d and 475d may be located on the ceramic layer 410f. The ceramic layers 410f to 410e and the bottom surface of the cavity have a stepped shape. The molding portion does not have to be formed.
FIG. 18 is a diagram showing in detail the heat radiating portion included in the light emitting element package according to the ninth embodiment.
(A) and (b) of FIG. 18 show two heat radiating parts 480a and 480b, and (c) and (d) show four heat radiating parts 480a to 480d. With such a configuration of a plurality of heat radiating portions, deformation of the heat radiating portion due to heat can be minimized in the manufacturing process of the light emitting element package, and as a result, the light emitting element and the light emitting element package are prevented from tilting, and the light emission angle is prevented. Can be balanced.
In FIGS. 18 (a) and 18 (b), the width W of the lower part of the heat radiating portions 480a and 480b.<sub>c</sub>Is the width W of the upper part of the heat dissipation parts 480a and 480b.<sub>b b</sub>, W<sub>b b</sub>Can be larger. And each heat dissipation part 480a, 480b is the distance W<sub>d</sub>Only separated. Distance W mentioned above<sub>d</sub>Can be the width of the ceramic layer arranged between the heat radiating portions 480a and 480b.
In (c) and (d) of FIG. 18, four heat radiating parts 480a, 480b, 480c, and 480d are arranged, but they can be arranged corresponding to four light emitting elements, and each heat radiating part can be arranged. Distance W between 480a, 480b, 480c, 480d<sub>d</sub>Are the same, and the ceramic layer that forms the main body of the package is arranged. The four heat radiating parts 480a, 480b, 480c, and 480d are arranged symmetrically with each other.
Since the contents of the electrode pattern according to the eighth embodiment described above can be applied to the light source module according to the ninth embodiment and the contents are duplicated, the description thereof will be omitted.
19 and 20 are views showing the light source module according to the tenth embodiment. The contents overlapping with each of the above-described embodiments will not be described again.
Referring to FIG. 19, the light source module according to the tenth embodiment is arranged on the main body 510 in which the through hole 510a is formed, the heat radiating portion 520 arranged in the through hole 510a, and the heat radiating portion 520. The submount 530 and at least one light emitting element 230 arranged on the submount 530 are provided.
The main body 510 may be a single-layer ceramic substrate or a multi-layer ceramic substrate. When the main body 510 is a multilayer ceramic substrate, it can be realized by using, for example, high temperature cofired ceramics (HTCC) or low temperature cofired ceramics (LTCC) technology.
When the main body 510 is a multilayer ceramic substrate, the thickness of each layer may be the same or different, and is not limited thereto.
A large number of electrode patterns are included in the main body 510, and by electrically connecting these electrode patterns to the light emitting element 230, the current required for driving the light emitting element 230 can be supplied.
Body 510, cavitation has sidewalls 512a and bottom surface 512b can include I 512. As shown in FIG. 19, the side wall 512a of the main body 510 can be configured to include an inclined surface. The inclined surface reflects the light generated by the light emitting element 230 and advances to the upper surface of the cavity 512 which is an open region, so that the light extraction efficiency of the light source module can be improved.
A reflective layer can be coated, plated or vapor-deposited on at least part of the side wall 512a and the bottom surface 512b of the cavity 512.
In the case of a metal substrate, there is a disadvantage that it is difficult to form a cavity in the process, but a ceramic substrate has an advantage that it is easy to form a cavity and is resistant to heat. However, since the ceramic substrate is inferior in thermal conductivity to the metal substrate, the heat radiating portion 520 made of metal slug is co-fired or AgCu is used to compensate for the heat radiating characteristics. After bonding and heat treatment, it can be bonded or inserted for use.
When the through hole 510a is formed in the main body 510 and the cavity 512 is formed in the main body 510, the through hole 510a can be formed in the bottom surface 512b of the cavity 512. A heat radiating portion 520 is inserted and arranged in the through hole 510a.
The heat dissipation effect can be increased by forming a pattern on the inner surface of the through hole 510a and the outer surface 522 of the heat radiating portion 520 in contact with the inner side surface to widen the contact area.
Although FIG. 19 shows that the pattern has a stepped shape as an example, there is no limitation on the pattern shape.
The heat radiating unit 520 can contain a metal having excellent thermal conductivity, and includes, for example, at least one of a Cu-containing alloy such as CuW and CuMo, a Cu single metal, Mo, W or Ag. Can be done.
Considering the coefficient of thermal expansion of the main body 510 and the heat radiating part 520, for example, when the main body 510 is realized by using HTCC technology, it is heat-stable to insert and use the heat radiating part 520 containing CuW. When the main body 510 is embodied using LTCC technology, it may be heat stable to use by coupling or inserting a heat radiating unit 520 containing Ag.
A sub mount 530 is arranged on the heat radiating unit 520. The submount 530 is a conductive substrate or an insulating substrate, and can contain a substance such as Si, SiC, or AlN in consideration of thermal conductivity and coefficient of thermal expansion.
A conductive adhesive layer 540 is located on the submount 530, and the light emitting element 230 can be attached via the conductive adhesive layer 540.
Since the heat generated by the light emitting element 230 is released to the outside via the submount 530 and the heat radiating unit 520, the submount 530 can be made of a material having excellent thermal conductivity.
Since the sub-mount 530 is arranged on the heat radiating unit 520, the heat generated by the light emitting element 230 is externally via the heat radiating unit 520 having excellent thermal conductivity instead of the main body 510 which is relatively inferior in thermal conductivity. It is emitted and can improve the reliability of the light source module.
Further, when the light emitting element 230 is directly mounted on the heat radiating unit 520, if the upper surface of the heat radiating unit 520 on which the light emitting element 230 is mounted is not flat, the light emitting element 230 floats or is bonded unstable, and the heat radiating property and reliability are obtained. However, such a problem can be minimized by arranging the light emitting element 230 on the submount 530.
Since the heat radiating unit 520 releases the heat generated by the light emitting element 230 to the outside and maintains the reliability of the light source module, the heat radiating unit 520 and the light emitting element 230 should be arranged so as to be vertically superimposed on each other. Can be done.
Although FIG. 19 shows three light emitting elements 230 as an example, more or less light emitting elements may be included depending on the embodiment.
Since the main body 510 is made of an inorganic material, even if a light emitting element 230 including a deep ultraviolet (Deep UV) LED or a near ultraviolet (Near UV) LED having a wavelength of about 260 to 405 nm is used, the light emitting element 230 The main body 510 is not likely to be discolored or deteriorated by the emitted ultraviolet light, and the reliability of the light emitting module can be maintained.
The glass portion 550 can be positioned so as to cover the upper surface of the cavity 512 of the main body 510, which is an open region.
The glass portion 550 is made of a transparent material and a non-reflective coating film so as to allow light generated by the light emitting element 230 to pass to the outside without being absorbed. For example, SiO<sub>2</sub>(Quartz, UV Fused Silica), Al<sub>2</sub>O<sub>3</sub>(Sapphire) or LiF, MgF<sub>2</sub>, CaF<sub>2</sub>, Low Iron Transparent Glass, B<sub>2</sub>O<sub>3</sub>And so on.
When the light emitting element 230 is a UV LED, the glass portion 550 can play a role of preventing the ultraviolet light emitted from the light emitting element 230 from destroying or altering the organic matter outside the light source module.
The space 560 between the glass portion 150 and the cavity 512 may be in a vacuum state and is nitrogen (N).<sub>2</sub>It can also be filled with gas or forming gas.
A support portion 514 capable of supporting the edge portion of the glass portion 550 can be formed at the upper end of the side wall 512a of the cavity 512 of the main body 510 formed of the ceramic substrate.
Alternatively, as shown in FIG. 20, instead of the glass portion 550, the molding portion 565 may be formed in the cavity 512 of the main body 510 so as to surround the light emitting element 230.
The molding portion 565 can include Si-Resin having a high refractive index or a low refractive index mixed with a phosphor, Si-Resin that is resistant to ultraviolet rays, a hybrid resin, and the like, and is not limited thereto. ..
A heat dissipation pad 570 can be arranged below the main body 510 and the heat dissipation unit 520.
Since the heat generated by the light emitting element 230 is released to the outside via the heat radiating pad 570 via the submount 530 and the heat radiating unit 520, the heat radiating pad 570 is a substance having excellent thermal conductivity, for example, Ag, Au. Alternatively, it may be a metal containing any one of Cu.
The heat conductive sheet 575 may be located between the heat radiating pad 570 and the main body 510, and between the heat radiating pad 570 and the heat radiating portion 520. The heat conductive sheet 575 has excellent heat conductivity, electrical insulation, and flame retardancy, and the heat transfer effect can be maximized by bringing the heat generating portion and the heat radiating pad into close contact with each other.
FIG. 21 is a diagram showing a light source module according to the eleventh embodiment. The contents overlapping with each of the above-described embodiments will not be described again.
The light source module according to the eleventh embodiment includes a main body 510 in which a through hole 510a is formed, a heat radiating portion 520 arranged in the through hole 510a, and at least one light emitting element arranged on the heat radiating portion 520. Equipped with 230.
It differs from the tenth embodiment described above in that the light source module does not include a separate submount 530 and the light emitting element 230 is arranged directly on the heat radiating unit 520.
Since the heat radiating unit 520 can have conductivity and the light emitting element 230 is bonded on the conductive adhesive layer 540, the light emitting element 230 and the heat radiating unit 520 can be directly connected to each other without a separate wire bonding step. It can be energized.
FIG. 22 is a diagram showing a light source module according to a twelfth embodiment. The contents overlapping with each of the above-described embodiments will not be described again.
In the light source module according to the twelfth embodiment, the Zener diode bonding portion 580 is formed in the main body 510, and the Zener diode 585 is arranged in the Zener diode bonding portion 580.
The Zener diode bonding portion 580 can be formed separately from the space in which the light emitting element 230 is located. When the light emitting element 230 emits light, the light is diffusely reflected or absorbed by the Zener diode 585, and the luminous efficiency of the light emitting element 230 may decrease. Therefore, the Zener diode 585 is separated or isolated from the space where the light emitting element 230 is located.
As an example, when the cavity 512 is formed in the main body 510, the Zener diode bonding portion 580 may be located in a region where the cavity 512 is not formed.
The Zener diode bonding portion 580 can be formed with a molding portion 590 filled with a silicone resin or the like to protect the Jenner diode and the Au-wire.
FIG. 23 is a diagram showing a light source module according to the thirteenth embodiment. The contents overlapping with each of the above-described embodiments will not be described again.
In the light source module according to the thirteenth embodiment, the light source 600 is arranged on one surface, the substrate 620 having the electrode pad 610 electrically connected to the light source 600, and the electrode pad 610 located on the substrate 620. A holder 630 in which the cavity 632 is located is provided in a region corresponding to the above, and the electrode pad 610 is arranged in the cavity 632 and is in contact with a protruding electrode portion 631 to which wires 634 and 635 are electrically connected.
The light source 600 may be a COB (Chip On Board) type that includes a light emitting element and mounts the light emitting element on a substrate in a chip shape.
The substrate 620 may be a metal substrate or a ceramic substrate on which a circuit pattern is formed.
The ceramic substrate is composed of a single layer or multiple layers, and when the substrate 620 is a multi-layered ceramic substrate, for example, high temperature cofired ceramics (HTCC) or low temperature cofired ceramics (HTCC) or low temperature cofired ceramics (HTCC) or low temperature cofired ceramics (HTCC). It can be realized using Ceramics, LTCC) technology.
When the light emitting element is a UV LED including a deep UV LED having a wavelength of about 260 to 395 nm or a near ultraviolet (Near UV) LED, the substrate 620 is discolored or deteriorated by the ultraviolet light emitted from the light emitting element. The substrate 620 can consist of a ceramic substrate so as not to.
An electrode pad 610 electrically connected to the light source 600 is located on the upper surface of the substrate 620.
When a plurality of electrode pads 610 are provided, the electrode pads 610 can be used in a concept including a plurality of electrode pads.
Although the electrode pad 610 can be arranged adjacent to the edge region of the substrate 620, the arrangement of the electrode pad 610 can be changed according to an embodiment and is not limited thereto.
The electrode pad 610 can be arranged as it is on the upper surface of the substrate 620, or a recess 614 can be formed on the substrate 620 and arranged in the recess 614.
That is, the thickness of the substrate 620 corresponding to the electrode pad 610 and the thickness of the substrate 620 not corresponding to the electrode pad 610 are different from each other, and as an example, the thickness of the substrate 620 corresponding to the electrode pad 610 is higher. Can be thin.
The electrode pad 610 is located at a distance from the anode electrode pad 611 electrically connected to the first electrode (not shown) of the light source 600 and the anode electrode pad 611, and is the second electrode of the light source 600. (Not shown) and an electrically connected cathode electrode pad 612.
The anode electrode pad 611 and the cathode electrode pad 612 can be arranged side by side in the same direction, but the present invention is not limited to this.
FIG. 23 shows, as an example, a light emitting module provided with two electrode pads 610, such as the first electrode pad 610a and the second electrode pad 610b. It is possible to have only one light emitting module or three or more light emitting modules.
When two or more of the electrode pads 610 are provided, there is an advantage that the electrode pads 610 at a convenient position can be selected and used without changing the position or direction of the light emitting module depending on the position of the external power supply.
The holder 630 is located above the substrate 620 and includes a cavity 632 with an open area corresponding to the electrode pad 610, with wires 634, 635 disposed within the cavity 632 contacting the electrode pad 610. Will be done.
That is, the wires 634 and 635 connected to the external power source are arranged in the cavity 632 of the holder 630, and the protruding electrode portion 631 electrically connected to the wires 634 and 635 is the anode electrode pad 611 and the anode electrode pad 611. Each contact with the cathode electrode pad 612 can supply a current to the light source module.
The internal structure of the holder 630 and the contact structure with the electrode pad 610 will be described later with reference to FIGS. 25 and 26.
When the light emitting element includes a UV LED, the holder 630 may be made of an inorganic material so as not to be discolored or deteriorated by the ultraviolet light emitted from the light emitting element.
FIG. 23 shows that the holder 630 is provided only on the upper portion of the first electrode pad 610a in order to facilitate the description of the form of the electrode pad 610, but the holder 630 is also provided on the upper portion of the second electrode pad 610b. It is provided.
FIG. 24 is a diagram showing a light source module according to the 14th embodiment. The contents overlapping with each of the above-described embodiments will not be described again.
In the light source module according to the fourteenth embodiment, the light source 600 is arranged on one surface, the substrate 620 having the electrode pad 610 electrically connected to the light source 600, and the electrode pad 610 located on the substrate 620. A holder 630 in which the cavity 632 is located is provided in a region corresponding to the above, and the electrode pad 610 is arranged in the cavity 632 and is in contact with a protruding electrode portion 631 electrically connected to a wire.
The light source 600 may be a COB (Chip On Board) type that includes a light emitting element and mounts the light emitting element on a substrate in a chip shape.
The electrode pad 610 is located at a distance from the anode electrode pad 611 electrically connected to the first electrode (not shown) of the light source 600 and the anode electrode pad 611, and is the second electrode of the light source 600. (Not shown) and an electrically connected cathode electrode pad 612.
At this time, unlike the thirteenth embodiment, the anode electrode pad 611 and the cathode electrode pad 612 are not arranged side by side in the same direction, but can be arranged in the divided regions on the substrate 620. ..
In FIG. 24, as an example, it is shown that the anode electrode pad 611 is located in a part of the edge region of the substrate 620, and the cathode electrode pad 612 is located in the diagonal direction far away from the anode electrode pad 611. ..
Further, unlike the thirteenth embodiment, since the anode electrode pad 611 and the cathode electrode pad 612 are located far apart from each other, the holder 630 also covers the anode electrode pad 611 and the cathode electrode pad 612, respectively. One wire connected to the external power supply is also arranged in the cavity 632 formed in the holder 630 separately.
That is, the difference between the holder 630 in the thirteenth embodiment and the holder 630 in the fourteenth embodiment is that in the holder 630 of the thirteenth embodiment, one holder has an anode electrode pad 611 and a cathode electrode pad 612. Since two wires 634 and 635 of different polarities are arranged in the cavity 632 because they cover all at once, the holder 630 of the 14th embodiment has one holder covering the anode electrode pad 611 and a cathode. Since there is another holder covering the electrode pad 612, wires 634 or 635 of different polarities are arranged in the cavities 632 of each holder.
FIG. 24 shows that the holder 630 is provided only on the upper part of the anode electrode pad 611 in order to facilitate the description of the form of the electrode pad 610, but the holder 630 is also provided on the upper part of the cathode electrode pad 612.
FIG. 25 is a diagram showing the structure of the fastening portion of the holder. Hereinafter, the fastening structure of the holder 630 arranged in the light emitting module according to the embodiment will be described with reference to FIG. 25.
In FIG. 25, the upper surface of the holder 630 is omitted and only the lower surface is shown. The holder 630 has at least one first fastening portion 637, and can be fixed to the substrate 620 arranged on the lower surface of the holder 630 by the fastening means 638.
Although not shown, the substrate 620 can also be formed with a fastening portion at a position corresponding to the first fastening portion 637.
In FIG. 25, as an example, two through holes as fastening portions 637 are formed on the lower surface of the holder 630, and screws as fastening means 638 are used to fasten the fastening portion 637 of the holder 630 and the fastening portion of the substrate 620. The holder 630 is fixed to the substrate 620 by combining with (not shown).
The form and number of the first fastening portions 637, the types of fastening means 638, and the like can be variously modified depending on the embodiment, and are not limited thereto.
26A and 26B are cross-sectional views showing an embodiment of a contact structure between a wire arranged in a holder and an electrode pad on a substrate.
Referring to FIG. 26A, the holder 630 has a protruding electrode portion 631 in which the cavity 632 is located corresponding to the electrode pad 610 on the substrate 620, is arranged in the cavity 632, and is electrically connected to the wire 634. Is in contact with the electrode pad 610.
A recess 614 is formed on the substrate 620, and the electrode pad 610 can be arranged in the recess 614.
The electrode pad 610 is connected to a circuit pattern 617 formed on the substrate 620.
In the past, the wire 634 connected to the external power supply and the electrode pad 610 on the board 620 were electrically connected by soldering work, but since the soldering work uses heavy metals such as lead, it is fatal to environmental pollution. Therefore, there is a problem that wire connection failure occurs due to cold soldering or the like.
In this embodiment, the wires 634 arranged in the holder 630 are mechanically contacted with the electrode pads 610 via the protruding electrode portion 631, so that there is no concern about environmental pollution and wire connection failure is caused. By minimizing it, the reliability of the light emitting module can be improved.
A spring portion 639 that supports the protruding electrode portion 631 may be provided in the cavity 632 of the holder 630.
When the wire 634 is in contact with the electrode pad 610 via the protruding electrode portion 631, the spring portion 639 makes the protruding electrode portion 631 more firmly in contact with the electrode pad 610 due to the restoring force of the spring portion 639. It can be so.
The outer surface of the spring portion 639 is coated with an insulating material to prevent an electrical short circuit between the wire 634 and the electrode pad 610.
Alternatively, as shown in FIG. 26B, the wire 634 and the electrode pad 610 are electrically connected via a second electrode portion 633 formed by integrally forming the protruding electrode portion 631 and the spring portion 639 of FIG. 26A. You can also do it.
At this time, a separate support portion 615 is located on one surface of the cavity 632, and one side of the second electrode portion 633 can penetrate and support the support portion 615.
Further, since the holder 630 is provided with at least one protruding portion 636 on the lower surface facing the substrate 620, and the substrate 620 is provided with at least one accommodating groove 618 at a position corresponding to the protruding portion 636, the holder. The 630 and the substrate 620 can be fitted together.
The protrusion 636 and the accommodating groove 618 can more firmly bond the holder 630 and the substrate 620 together with the fastening means 638, as described in connection with FIG. 25.
Although FIGS. 26A and 26B show the wire 634 electrically connected to the anode electrode pad 611 as an example, the same applies to the wire 635 electrically connected to the cathode electrode pad 612. Can be done.
Further, although not shown, as shown in FIG. 23, when one holder 630 is arranged so as to cover all the anode electrode pad 611 and the cathode electrode pad 612, the cavities 632 of the holder 630 are arranged so as to cover each other. Two wires 634 and 635 having different polarities are arranged, and the wires 634 and 635 can be electrically connected to the anode electrode pad 611 and the cathode electrode pad 612 arranged on the substrate 620, respectively.
FIG. 27 is a diagram showing a light source module according to a fifteenth embodiment. The contents overlapping with each of the above-described embodiments will not be described again.
In the light source module according to the fifteenth embodiment, the light source 600 is arranged on one surface, the substrate 620 having the electrode pad 610 electrically connected to the light source 600, and the electrode pad 610 located on the substrate 620. A holder 630 in which the cavity 632 is located is provided in a region corresponding to the above, and the electrode pad 610 is arranged in the cavity 632 and is in contact with a protruding electrode portion 631 electrically connected to a wire.
The light source 600 includes a light emitting element package, and the light emitting element package may be a POB (Package On Board) type mounted on a substrate.
An electrode pad 610 is located on the upper surface of the substrate 620, and the electrode pad 610 includes an anode electrode pad 611 electrically connected to a first electrode (not shown) of the light source 600 and the light source 600. It includes a second electrode (not shown) and an electrically connected cathode electrode pad 612.
As described above, there may be many forms in the number and position of the electrode pads 610 and the number and arrangement of the anode electrode pads 611 and the cathode electrode pads 612 included in the electrode pads 610, but FIG. 27 shows an example. As shown, one anode electrode pad 611 is located in a part of the edge region of the substrate 620 and is arranged far apart from the anode electrode pad 611.
Further, a holder 630 that covers the anode electrode pad 611 and the cathode electrode pad 612 is arranged corresponding to the positions of the anode electrode pad 611 and the cathode electrode pad 612.
Since the holder 630 has been described in relation to the thirteenth and fourteenth embodiments, detailed description thereof will be omitted.
In FIG. 27, it is shown that the holder 630 is arranged only on the upper part of the anode electrode pad 611 so that the form of the electrode pad 610 can be easily seen, but the holder 630 is also arranged on the upper part of the cathode electrode pad 612. ..
The substrate 620 may be a metal substrate or a ceramic substrate on which a circuit pattern is formed.
The ceramic substrate may consist of a single layer or multiple layers. When the substrate 620 is a multilayer ceramic substrate, it can be realized by using, for example, high temperature cofired ceramics (HTCC) or low temperature cofired ceramics (LTCC) technology.
FIG. 28 is a diagram showing a light source module according to the 16th embodiment. The contents overlapping with each of the above-described embodiments will not be described again.
The light source module according to the sixteenth embodiment corresponds to a substrate 620 having a light source 600 arranged on one surface and having an electrode pad 610 electrically connected to the light source, and a substrate 620 located on the substrate 620 and corresponding to the light source 600. It includes a holder 700 having an open portion 710 whose region is open, and a diffusion member 720 fixed in the open portion 710 and arranged on the light source 600.
The light source 600 may be a COB (Chip On Board) type that includes a light emitting element and mounts the light emitting element in a chip shape on a substrate 620.
The substrate 620 may be a metal substrate or a ceramic substrate on which a circuit pattern is formed.
The ceramic substrate may consist of a single layer or multiple layers. When the substrate 620 is a multilayer ceramic substrate, it can be realized by using, for example, high temperature cofired ceramics (HTCC) or low temperature cofired ceramics (LTCC) technology.
The holder 700 is at least one cover unit provided with a support plate 730 arranged to correspond to at least a part of the edge region of the substrate 620 and a cavity having an open region corresponding to the electrode pad 610. Can include 800 and.
Referring to FIG. 28, the support plate 730 has a first support plate 731 arranged corresponding to one edge region of the four edge regions of the substrate 620 and the first support plate 731. A second support plate 732.
At this time, the inner side surfaces of the first support plate 731 and the second support plate 732 form the opening portion 710.
An insertion groove 736 is formed on the inner surface of the opening portion 710, that is, the inner surface of the first support plate 731 and the second support plate 732, and the diffusion member 720 is inserted into the insertion groove 736. Can be concluded.
As described above, the support plate 730 can be arranged corresponding to at least a part of the edge region of the substrate 620, but the inner surface of the support plate 730 forms the open portion 710 and the open portion 710. Since the diffusion member 720 must be fastened to the insertion groove 736 formed on the inner surface of the support plate 730, the support plate 730 can be provided so as to be symmetrical with each other.
The support plate 730 can be arranged in contact with the upper surface of the substrate 620 at the edge region of the substrate 620.
The cover unit 800 is arranged on the upper part of the substrate 620 so as to cover the electrode pads 610 arranged on the substrate 620.
In FIG. 28, two first cover units 800a and two second cover units 800b are shown as an example, but less or more cover units may be provided depending on the number or arrangement position of the electrode pads 610. it can.
The cover unit 800 can be used in a concept including a plurality of cover units 800a and 800b.
Although not shown, for example, when the anode electrode pad 611 and the cathode electrode pad 612 are arranged side by side next to each other, one cover unit 800 that covers all of the anode electrode pad 611 and the cathode electrode pad 612 is 800. Can only be equipped.
Alternatively, for example, when there are two or more anode electrode pads 611 and cathode electrode pads 612 arranged side by side next to each other, the cover unit 800 can be provided with two or more.
In FIG. 28, the anode electrode pad 611 is arranged in a part of the edge region of the substrate 620, and the cathode electrode pad 612 is arranged far away from the anode electrode pad 611, so that the anode electrode pad 611 is arranged. A first cover unit 800a for covering and a second cover unit 800b for covering the cathode electrode pad 612 are provided, respectively.
The cover unit 800 and the support plate 730 can be separately formed and then bonded to each other, but can also be integrally formed as shown in FIG. 28.
FIG. 29A is a perspective view of a part of the support plate viewed from above, and FIG. 29B is a perspective view of a part of the support plate viewed from below.
With reference to FIG. 29A, the support plate 730 is formed with at least one first fastening portion 742, and can be provided with fastening means 744 to be fastened to the first fastening portion 742.
In FIG. 29A, as an example, a through hole is formed as the first fastening portion 742, and a screw is shown as the fastening means 744, but the present invention is not limited to this.
Although not shown, a fastening portion is also formed in a region on the substrate 620 corresponding to the first fastening portion 742, and the holder 700 can be fixed to the substrate 620 by the fastening means 744.
The form and number of the first fastening portion 742, the type of the fastening means 744, and the like can be variously modified depending on the embodiment, and the present invention is not limited thereto.
Referring to FIG. 29B, the support plate 730 may include at least one protrusion 746 on a surface facing the substrate 620.
Although not shown, the holder 700 can be fixed to the substrate 620 by forming accommodating portions in a region on the substrate 620 corresponding to the protrusion 746 and fitting them together.
The form and number of the projecting portion 746 and the accommodating portion, the forming position, and the like can be variously deformed depending on the embodiment, and the present invention is not limited thereto.
Referring to FIG. 28 again, an insertion groove 736 is formed on the inner surface of the opening portion 710, that is, the inner surface of the first support plate 731 and the second support plate 732, and diffuses into the insertion groove 736. The member 720 can be inserted and fastened.
The diffusing member 720 maximizes the light projection angle through refraction and scattering of light incident from the light source 600 so that the light can be diffused uniformly.
The diffusion member 720 may be made of a transparent material so as to transmit the light emitted from the light source 600 without absorbing it and improve the light extraction efficiency of the light emitting module.
When the light source 600 includes a UV LED, the diffuser 720 is made of an inorganic material so that the diffuser 720 is not discolored or altered by the light emitted from the light source 600, for example, a glass material or a translucent resin. It can be configured to include things.
Further, a light extraction pattern or a selected wavelength light blocking pattern may be located on the surface of the diffusion member 720.
The light extraction pattern can diffusely reflect the light generated by the light source 600, improve the light extraction efficiency of the light source module, and can be formed periodically or aperiodically. For example, a microlens array (MLA) is arranged. It is also possible to form a pattern.
The selective wavelength light blocking pattern can act like a kind of color filter, and selectively transmits only the light in the selective wavelength region among the light in the many wavelength regions generated by the light source 100. Can be done.
Although not shown, a first prism sheet, a second prism sheet, and a protective sheet can be arranged on the diffusion member 720 in the insertion groove 736, and the arrangement order of these sheets can be changed. is there.
The first prism sheet is formed of a polymer material having elasticity while being translucent on one surface of a support film, and the polymer has a prism layer in which a plurality of three-dimensional structures are repeatedly formed. Can be done. The first prism sheet is provided with a striped type in which peaks and valleys are repeatedly provided to form a pattern.
The direction of the peaks and valleys in the second prism sheet can be perpendicular to the direction of the peaks and valleys on one side of the support film in the first prism sheet.
FIG. 30 is a diagram showing a light source module according to the 17th embodiment. The contents overlapping with each of the above-described embodiments will not be described again.
The light source module according to the seventeenth embodiment corresponds to a substrate 620 having a light source 600 arranged on one surface and having an electrode pad 610 electrically connected to the light source, and a substrate 620 located on the substrate 620 and corresponding to the light source 600. It includes a holder 700 having an open portion 710 whose region is open, and a diffusion member 720 fixed in the open portion 710 and arranged on the light source 600.
The light source 600 may be a COB (Chip On Board) type that includes a light emitting element and mounts the light emitting element on a substrate in a chip shape.
The holder 700 is at least one cover unit provided with a support plate 730 arranged to correspond to at least a part of the edge region of the substrate 620 and a cavity having an open region corresponding to the electrode pad 610. Can have 800 and.
Referring to FIG. 30, the support plate 730 has a first support plate 731 arranged corresponding to one edge region of the four edge regions of the substrate 620 and the first support plate 731. A second support plate 732 located facing the above, a third support plate 733 connecting one side of the first support plate 731 and one side of the second support plate 732, and the third support plate 733. Can have a fourth support plate 734 that is located facing the support plate 733 and connects the other side of the first support plate 731 to the other side of the second support plate 732.
At this time, the inner surfaces of the first, second, third, and fourth support plates 731 to 734 form the opening portion 710.
Since the configurations of the third support plate 733 and the fourth support plate 734 are the same as those of the first support plate 731 and the second support plate 732 described above, detailed description thereof will be omitted. ..
An insertion groove 736 is formed on the inner surface of the opening portion 710, that is, the inner surface of the first, second, third, and fourth support plates 731 to 734, and the diffusion member 720 is provided in the insertion groove 736. Can be inserted and fastened.
The diffusing member 720 maximizes the light projection angle through refraction and scattering of light incident from the light source 600 so that the light can be diffused uniformly.
The diffusion member 720 may be made of a transparent material so as to transmit the light emitted from the light source 600 without absorbing it and improve the light extraction efficiency of the light emitting module.
When the light source 600 includes a UV LED, the diffuser 720 is made of an inorganic material, for example, a glass material, so that the diffuser 720 is not discolored or altered by the light emitted from the light source 600.
The cover unit 800 and the first to fourth support plates 731 to 734 can be integrally formed.
FIG. 31 is a diagram showing a light source module according to the eighteenth embodiment. The contents overlapping with each of the above-described embodiments will not be described again.
The light source module according to the eighteenth embodiment is a holder 700 having a substrate 620 in which the light source 600 is arranged on the upper surface and an open portion 710 located above the substrate 620 and having an open area corresponding to the light source 600. And a diffusion member 720 which is fastened to the opening portion 710 and is arranged above the light source 600. Then, the heat radiating member 1000 is arranged below the substrate 620.
The light source 600 may be a COB (Chip On Board) type that includes a light emitting element and mounts the light emitting element on a substrate in a chip shape.
The holder 700 is at least one cover unit provided with a support plate 730 arranged to correspond to at least a part of the edge region of the substrate 620 and a cavity having an open region corresponding to the electrode pad 610. Can be equipped with 800.
FIG. 31 shows, as an example, a first support plate 731 in which the support plate 730 is arranged corresponding to one edge region of the four edge regions of the substrate 620, and the first support. A second support plate 732 located facing the plate 731, a third support plate 733 connecting one side of the first support plate 731 and one side of the second support plate 732, and the above. It is shown to have a fourth support plate 734 that is located facing the third support plate 733 and connects the other side of the first support plate 731 to the other side of the second support plate 732. However, it is also possible to have only two support plates 731 and 732, or 733 and 734, which are symmetrical to each other.
An insertion groove 736 is formed on the inner surface of the opening portion 710, that is, on the inner surface of the first, second, third, and fourth support plates 731 to 734, and the diffusion member 720 is provided in the insertion groove 736. Can be inserted and fastened.
The diffusing member 720 maximizes the light projection angle through refraction and scattering of light incident from the light source 600 so that the light can be diffused uniformly.
Since the heat radiating member 1000 serves to release the heat generated by the light source 600 to the outside, it can be made of a material having excellent thermal conductivity.
The heat radiating member 1000 can have a plurality of heat radiating fins 1010 formed in the direction of the lower surface of the heat radiating member 1000. The heat radiating fin 1010 improves the heat release effect by increasing the area in which the heat radiating member 1000 comes into contact with the external air.
A heat conductive member 1020 may be located between the heat radiating member 1000 and the substrate 620. The heat conductive member 1020 has excellent heat conductivity, electrical insulation, and flame retardancy, and the heat transfer effect can be maximized by bringing the heat generating portion and the heat radiating member into close contact with each other.
The support plate 730 can have at least one second fastening portion 750 formed so as to project from the support plate 730.
The second fastening portion 750 can be extended on the same surface as the support plate 730 and can project beyond the width of the substrate 620 located below the holder 700.
A fastening portion 1015 is also formed in a region on the heat radiating member 1000 corresponding to the second fastening portion 750 formed on the support plate 730, and the holder 700 is fixed to the heat radiating member 1000 by the fastening means 755. Can be done.
FIG. 31 shows, as an example, that the second fastening portion 750 is provided on the first support plate 731 and the second support plate 732, but is not limited thereto.
The second fastening portion 750 can be formed symmetrically with two opposing support plates 731 and 732, or 733 and 734, so that the holder 700 can be firmly fixed by the heat radiating member 1000.
The holder 700 can be connected to and fixed to the substrate 620 as in each of the above-described embodiments, but the substrate 620 includes a circuit pattern and the like, and there are restrictions on forming the fastening portion. Since there is a risk, a separate second fastening portion 750 can be formed on the holder 700 and fixed to the heat radiating member 1000 by the fastening means 755.
Alternatively, according to an embodiment, the holder 700 can be coupled and fixed to all of the substrate 620 and the heat radiating member 1000.
As described above, the heat conductive member 1020 can be positioned between the substrate 620 and the heat radiating member 1000, and the substrate 620 can be fixed to the heat radiating member 1000. However, since the cost of the heat conductive member 1020 is high, by fixing the holder 700 and the heat radiating member 1000 through the second fastening means 755, the substrate 620 can be attached without the heat conductive member 1020. It can be fixed to the heat radiating member 1000 to reduce the manufacturing unit price of the light emitting module.
32 is a diagram showing the light source module according to the 19th embodiment, FIG. 33 is a diagram showing the light source module according to the 20th embodiment, and FIG. 34 is a diagram showing the light source module according to the 21st embodiment. It is a figure which showed the module. The contents overlapping with each of the above-described embodiments will not be described again.
In the light source module according to each embodiment, a light source 600 is arranged on one surface, a substrate 620 having an electrode pad 610 electrically connected to the light source, and a region located on the substrate 620 and corresponding to the light source 600. It includes a holder 700 having an open portion 710 with an open portion 710, and a diffusion member 720 fixed in the open portion 710 and arranged on the light source 600.
The light source 600 includes a light emitting element package, and may be a POB (Package On Board) type in which the light emitting element package is mounted on a substrate.
The holder 700 is at least one cover unit provided with a support plate 730 arranged to correspond to at least a part of the edge region of the substrate 620 and a cavity having an open region corresponding to the electrode pad 610. Can have 800 and.
The 19th, 20th, and 21st embodiments are similar to the 16th, 17th, and 18th embodiments, respectively, except that the light source 600 includes a light emitting device package. The explanation will be omitted.
FIG. 35 is a diagram showing an embodiment of a headlamp in which the light source module according to each of the above-described embodiments is arranged.
Referring to FIG. 35, the light generated by the light source module 1101 can be reflected by the reflector 1102 and the shade 1103 and then passed through the lens 1104 and directed toward the front of the vehicle body.
The light source module 1101 is a light source module according to each of the above-described embodiments, and is a COB (Chip On Board) type in which a light emitting element is mounted on a substrate, or a POB (in which a light emitting element package is mounted on a substrate). Package On Board) type.
Although the present invention has been described above with reference to specific examples and drawings, the present invention is not limited to the above-mentioned examples, and any person who has ordinary knowledge in the field to which the present invention belongs is such. Various modifications and modifications are possible from the description.
Therefore, the technical scope of the present invention should not be defined only in the above-described examples, but should be defined by the scope of claims described later and the scope of the claims.
200 Light emitting element package 210 Package body 220 Heat dissipation part 230 Light emitting element 240 Molding part
42 sheets
Sheet 1 Sheet 2 Sheet 3 Sheet 4 Sheet 5 Sheet 6 Sheet 7 Sheet 8 Sheet 9 Sheet 10 Sheet 11 Sheet 12 Sheet 13 Sheet 14 Sheet 15 Sheet 16 Sheet 17 Sheet 18 Sheet 19 Sheet 20 Sheet 21 Sheet 22 Sheet 23 Sheet 24 Sheet 25 Sheet 26 Sheet 27 Sheet 28 Sheet 29 Sheet 30 Sheet 31 Sheet 32 Sheet 33 Sheet 34 Sheet 35 Sheet 36 Sheet 37 Sheet 38 Sheet 39 Sheet 40 Sheet 41 Sheet 42
Every citation, both ways
| Document | Relation | Office |
|---|---|---|
| JP2006093565A | Cites | Japan |
| JP2006216764A | Cites | Japan |
| JP2010195655A | Cites | Japan |
| WO2008038574A1 | Cites | World Intellectual Property Organization (WIPO) |
| JP2010186814A | Cites | Japan |
| JP2005310935A | Cites | Japan |
| JP2008192949A | Cites | Japan |
| JP2007242856A | Cites | Japan |
| JP2006303351A | Cites | Japan |
| JP09153679A | Cites | Japan |
| JP2009071013A | Cites | Japan |
| JP2009535806A | Cites | Japan |
| JP2006303366A | Cites | Japan |
| JP2009111180A | Cites | Japan |
| JP2010274256A | Cites | Japan |
| JP2009502024A | Cites | Japan |
| JP2009033088A | Cites | Japan |
| JP2007214162A | Cites | Japan |
| US20080179618A1 | Cites | United States of America |
| US20110175136A1 | Cites | United States of America |
| JP2003124410A | Cites | Japan |
| JP2002289763A | Cites | Japan |
| JP2011044608A | Cites | Japan |
| JP2011129916A | Cites | Japan |
| JP2006005290A | Cites | Japan |
| JP2011159813A | Cites | Japan |
| JP2011014890A | Cites | Japan |
| JP2010283253A | Cites | Japan |
| JP2010087181A | Cites | Japan |
50 members in 5 offices
Priority claims16
| Document | Office | Kind | Date |
|---|---|---|---|
| 1020110083721 | Republic of Korea | – | |
| 20110083721 | Republic of Korea | A | |
| 1020110084718 | Republic of Korea | – | |
| 20110084718 | Republic of Korea | A | |
| 1020110131466 | Republic of Korea | – | |
| 20110131466 | Republic of Korea | A | |
| 1020110139806 | Republic of Korea | – | |
| 1020110140236 | Republic of Korea | – | |
| 20110139806 | Republic of Korea | A | |
| 20110140236 | Republic of Korea | A | |
| 1020110143151 | Republic of Korea | – | |
| 1020110143152 | Republic of Korea | – | |
| 20110143151 | Republic of Korea | A | |
| 20110143152 | Republic of Korea | A | |
| 1020110147361 | Republic of Korea | – | |
| 20110147361 | Republic of Korea | A |
Members50
| Document | Office | Kind | |
|---|---|---|---|
| EP2562832A2 | European Patent Office (EPO) | A2 | |
| EP2562834A2 | European Patent Office (EPO) | A2 | |
| US2013049563A1 | United States of America | A1 | |
| US2013049564A1 | United States of America | A1 | |
| JP2013046071A | Japan | A | |
| JP2013046072A | Japan | A | |
| KR20130021298A | Republic of Korea | A | |
| KR20130022053A | Republic of Korea | A | |
| CN103078033A | China | A | |
| CN103078040A | China | A | |
| KR20130064873A | Republic of Korea | A | |
| KR20130072412A | Republic of Korea | A | |
| KR20130072698A | Republic of Korea | A | |
| KR20130074990A | Republic of Korea | A | |
| KR20130074991A | Republic of Korea | A | |
| KR20130078421A | Republic of Korea | A | |
| US8704433B2 | United States of America | B2 | |
| US8773006B2 | United States of America | B2 | |
| US2014225151A1 | United States of America | A1 | |
| US9196814B2 | United States of America | B2 | |
| US2016043296A1 | United States of America | A1 | |
| EP2562832A3 | European Patent Office (EPO) | A3 | |
| EP2562834A3 | European Patent Office (EPO) | A3 | |
| JP6005440B2 | Japan | B2 | |
| JP2016213509A | Japan | A | |
| CN103078040B | China | B | |
| US9634215B2 | United States of America | B2 | |
| JP2017126803A | Japan | A | |
| CN107425103A | China | A | |
| CN103078033B | China | B | |
| JP6312899B2 | Japan | B2 | |
| KR101891717B1 | Republic of Korea | B1 | |
| KR101894353B1 | Republic of Korea | B1 | |
| KR101902393B1 | Republic of Korea | B1 | |
| JP2018186284A | Japan | A | |
| JP2018190990A | Japan | A | |
| JP6437154B2 | Japan | B2 | |
| JP2019036753A | Japan | A | |
| JP6567482B2This record | Japan | B2 | |
| KR101976531B1 | Republic of Korea | B1 | |
| EP2562832B1 | European Patent Office (EPO) | B1 | |
| EP2562834B1 | European Patent Office (EPO) | B1 | |
| JP6626161B2 | Japan | B2 | |
| CN107425103B | China | B | |
| JP2020017733A | Japan | A | |
| JP6691952B2 | Japan | B2 | |
| JP6969806B2 | Japan | B2 | |
| USRE48858E | United States of America | E | |
| JP2022023154A | Japan | A | |
| JP7266316B2 | Japan | B2 |
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Numbers
- Publication
- 6567482
- Application
- 175999
Titles2
- Japanese
- 紫外線発光素子パッケージ及びこれを含む発光ユニット
- English
- Ultraviolet light emitting element package and light emitting unit including it
Classification
- CPC, 12
- H10H20/85
- H10H20/8581
- H10H20/8582
- H10H20/857
- C09K11/67
- H01S5/02469
- H10H20/858
- H10W72/07352
- H10W72/321
- H10W90/00
- H10W72/884
- H10W72/5522
- IPC, 3
- H01L33 64
- H10W70 60
- H10W70 68
