Modular mass storage system

Online retailers, Internet service providers, search service providers, financial institutions, universities, and other computer-intensive organizations often operate from large computing facilities. These computing facilities store and house large numbers of servers, networks, and computer equipment for the purpose of processing, storing, and exchanging data as needed to operate an organization. Computer rooms in computing facilities typically have many server racks. Each server rack contains computer equipment associated with many servers as well.

Computer systems contain many components that generate exhaust heat. These components include printed circuit boards, mass storage devices, power supplies, and processors. For example, a computer with multiple processors can generate 250 watts of exhaust heat. One known computer system includes these multiple larger, multi-processor computers, configured as rack-mounted components and located within the rack system. One known rack system includes 40 of these rack-mounting components, which thus generate as much as 10 kilowatts of exhaust heat. In addition, one known data center includes multiple such rack systems.

Some servers include a large number of hard disk drives (eg, 8 or more hard disk drives) to provide suitable data storage. Hard disk drives for servers are usually standard off-the-shelf types. Standard off-the-shelf hard disk drives are often a cost-effective solution to storage needs because they are available at relatively low cost. Nevertheless, in a server design with these standard hard disk drives, the placement of the hard disk drives can leave a significant amount of wasted space in the server chassis. This wasted space can lead to poor computing and storage capacity for the system, especially when multiplied by the large number of servers in the rack.

Hard disk drives contain heat-generating motors and electronic components. Some or all of this heat must be removed in order for the server to run continuously. The heat generated by the hard disk drives in the data room can be significant, especially if all hard disk drives are always fully powered on.

Like other components, hard disk drives can sometimes fail during operation. Such failures will reduce the storage capacity of the system. To restore capacity, you may need to "turn off the server and remove it from the rack so that you can replace or repair a failed hard disk drive.

Some systems, such as archiving, backup, and disaster recovery, may need to store large amounts of data, even though they rarely access specific stored data. Magnetic tape systems are often used to store archived data. However, magnetic tape drives are fragile and susceptible to adverse environmental conditions such as heat and humidity. In addition, some magnetic tape drives have a relatively high failure rate.

<figref num="1">It is a block diagram which shows one Embodiment of the system including the data control module and the data storage device module in the rack of this invention.</figref><figref num="2">It is a figure which shows one Embodiment of the system which includes the data control module and the data storage device module which installed the mass storage device device in the plurality of backplanes of this invention.</figref><figref num="3">It is the schematic which shows the front of the three data storage subsystems in the rack of this invention.</figref><figref num="4">It is a figure which shows one Embodiment of the backplane of the disk drive attached to the pad of the chassis of this invention.</figref><figref num="5">It is a figure which shows one Embodiment through which the air flow from under the backplane of the mass storage device of this invention is passed.</figref><figref num="6">FIG. 5 illustrates an embodiment of a data storage module in which a hard disk drive is mounted on a shelf, including a shelf and cross braces for the hard disk of the present invention.</figref><figref num="7">FIG. 5 illustrates an embodiment of a data storage module in which a hard disk drive has been removed from the shelves, including shelves and cross braces for the hard disk of the present invention.</figref><figref num="8">FIG. 3 is a top perspective view of an embodiment of a hard disk drive assembly including the backplane circuit board of the present invention.</figref><figref num="9">FIG. 3 is a bottom perspective view of an embodiment of a hard disk drive assembly including the backplane circuit board of the present invention.</figref><figref num="10">It is a figure which shows the attachment of the hard disk drive to the data storage module of this invention.</figref><figref num="11">It is a figure which shows one Embodiment of the module which includes the data controller of this invention and the backplane of a plurality of disk drives.</figref><figref num="12">It is a figure which shows one Embodiment which removes heat from a data storage device module in a rack system of this invention.</figref><figref num="13">It is a figure which shows the method of deploying a data storage device including deploying a mass storage device device on two or more backplanes connected to the common chassis of the present invention.</figref>

Although various modifications and alternative forms are possible with the present invention, specific embodiments of the present specification are illustrated in the drawings and described in detail. However, these drawings and detailed description of the invention are not intended to limit the invention to the particular form disclosed, but rather all within the spirit and scope of the invention as defined in the appended claims. Intended to include all improvements, equivalents, and alternatives. The headings used herein are for structural purposes only and are not intended to limit the scope of this specification or claims. The word "may" as used throughout this specification is not mandatory (ie, mandatory), but rather acceptable (ie, possible). Similarly, with respect to the word "include", "include" and "including" mean, but are not limited to.

Discloses various embodiments of computer systems and systems and methods for performing computing operations. In certain embodiments, the system for storing data includes a rack, one or more data storage modules connected to the rack, and one or more data control modules connected to the rack. Data storage modules include a chassis, two or more backplanes connected to the chassis, and one or more mass storage devices (eg, hard disk drives) connected to the backplane. The data control module has access to the mass storage device located in the data storage module.

In one embodiment, the data storage module includes a chassis, two or more backplanes connected to the chassis approximately horizontally, two or more hard disk drives connected to each of the backplanes, and a backplane. Includes one or more vents below. This vent contains an air inlet and an air outlet. This vent allows air to move from the air inlet to the air outlet, removing heat from at least one mass storage device.

In one embodiment, deploying a data storage device involves deploying a mass storage device on two or more backplanes connected to a common chassis. Some mass storage devices turn off or go into a standby state. If you need to access data on one or more mass storage devices, power on or unstandby the mass storage device.

As used herein, an "air handling system" refers to pumping, moving, or removing air from one or more systems or components. Means system.

As used herein, "air moving device" includes devices, elements, systems, or combinations thereof that are capable of moving air. Examples of air transfer devices include fans, blowers, and compressed air systems.

As used herein, "aisle" means a space adjacent to one or more elements, devices, or racks.

As used herein, "backplane" means a plate or board to which electronic components such as mass storage devices, circuit boards, etc. can be mounted. In certain embodiments, the hard disk drive can be inserted approximately perpendicular to the plane of the backplane. In one embodiment, the backplane has one or more power buses capable of powering the components of the backplane, and data is transmitted to and from the components attached to the backplane. Includes one or more data buses that can.

As used herein, "ambient" means, with respect to a system or facility, at least a portion of the surrounding air. For example, for a data center, the ambient air may be air outside the data center, for example, air in or near the intake hood of the data center air treatment system.

As used herein, a "cable" includes a cable, conduit, or line that supports one or more conductors and is flexible, at least in part of its overall length. A cable may include a connection, such as a plug, at one or more of its ends.

As used herein, a "circuit board" is a board or plate containing one or more conductors that carry electricity, data, or signals from a circuit board or components connected to the circuit board. Means. In one embodiment, the circuit board is a board made of epoxy glass with one or more conductive layers. However, the circuit board may be a combination of suitable materials.

As used herein, "chassis" means a structure or element that supports other elements, or one to which other elements can be attached. The chassis may be of any shape or structure, including frames, seats, plates, boxes, channels, or a combination thereof. In certain embodiments, the chassis consists of one or more sheet-like metal parts. A chassis for a computer system may support a circuit board assembly, a power supply unit, a data storage device, a fan, a cable, and other components of the computer system.

As used herein, "computing" includes operations that can be performed by a computer, such as computation, data storage, data retrieval, or communication.

In the present specification, "computer system (" computer " "system") "includes various computer systems or their components. An example of a computer system is a rack mount server. As used herein, the term computer refers to integrated circuits referred to in the prior art as computers, as well as processors, servers, microcontrollers, microcontrollers, programmable logic controllers (PLCs), and application-specific integrated circuits. , And other programmable circuits are broadly meant, and these terms are used interchangeably herein. In various embodiments, memory includes, but is not limited to, a computer-readable medium, such as random access memory (RAM). Alternatively, compact disc-read-only memory (CD-ROM), magneto-optical disc (MOD), and / or digital versatile disc (DVD) may be used. Additional input channels may also include computer peripherals related to the operator's interface, such as a mouse or keyboard. Further, for example, peripheral devices including a scanner and the like may be used. Further, in some embodiments, additional output channels may include a monitor and / or printer for the operator's interface.

As used herein, the term "data center" includes a facility or part of a facility in which computer operations are performed. A data center can contain servers dedicated to a particular function or for multiple functions. Examples of computer operations include information processing, communications, testing, simulation, power distribution and control, and operational management.

As used herein, a "data center module" includes, or houses, one or more computer systems capable of providing computing resources to a data center. Includes modules suitable for and / or physically supporting.

As used herein, "directing" air includes directing or sending air to a place or point in space or the like. In various embodiments, the movement of air to direct the air is induced by creating a high pressure region, a low pressure region, or a combination of the two. For example, by creating a low pressure region at the bottom of the chassis, air can be directed downwards within the chassis. In some embodiments, air is directed using wings, panels, plates, baffles, pipes, or other structural elements.

As used herein, a "member" is a component or two or more components that are physically connected to each other (eg, a member is two or more sheet-like metals connected to each other. Can include parts).

As used herein, "module" means a component or a component that is physically connected to each other. Modules can include functional elements and systems such as computer systems, circuit boards, racks, blowers, ducts, and distribution units, and structural elements such as bases, frames, housings, or containers.

As used herein, "primarily horizontal" means closer to horizontal than vertical. In the context of mounted elements or devices, "approximately horizontal" includes elements or devices whose mounting width is greater than their mounting height.

As used herein, "primarily vertical" means closer to vertical than horizontal. In the context of mounted elements or devices, "approximately vertical" includes elements or devices whose mounting height is greater than their mounting width. In the context of a hard disk drive, "approximately vertical" includes mounting the hard disk drive with a mounting height greater than the mounting width.

As used herein, "rack" means a rack, container, frame, or other element or combination of elements that can accommodate or physically support one or more computer systems.

As used herein, "room" means a room or space in a building. Computer room means a room in a building where a computer system, such as a rack-mounted server, operates.

As used herein, "space" means space, area, or volume.

As used herein, "shelf" means an element or combination of elements on which an object can be placed. For example, shelves can include plates, sheets, trays, discs, blocks, grids, or boxes. The shelves may be rectangular, square, circular or other shape. In some embodiments, the shelves may be one or more rails.

As used herein, "shock absorbing" means that the support element absorbs mechanical energy and / or shocks and / or vibration loads, as used for the support elements of other elements. It means to relax. The cushioning material may have elasticity, viscoelasticity, viscosity, or a combination thereof.

In various embodiments, the data storage system includes one or more data storage modules that are accessed and controlled by a data controller that is external to the data storage module. In the embodiment, the data control module and one or more data storage modules connected to the data control module are housed in the rack. FIG. 1 is a block diagram showing an embodiment including a data control module and a data storage module in a rack. The system 100 includes a rack 102, a data control module 104, and a data storage module 106. The data control module 104 and the data storage module 106 are included in the rack 102.

The mass storage device of the data storage module 106 is connected to the data control module 104. The data control module 104 can access data in any or all of the mass storage devices in the data storage modules 106a, 106b, and 106c.

In various embodiments, the data storage module comprises two or more circuit boards, each circuit board supporting and providing electrical connectivity for multiple mass storage devices. For example, in the embodiment of FIG. 1, the data storage module 106 includes a backplane circuit board 108. The backplane circuit board 108 supports the mass storage device 110. The backplane circuit board 108 provides electrical, data, and signal connectivity to the mass storage device 110. In various embodiments, each of the mass storage devices 110 is a hard disk drive. In one embodiment, each of the mass storage devices 110 is a 500GB hard disk drive with a 3Gbs interface.

In the embodiment of FIG. 1, each backplane circuit board 108 supports 16 mass storage devices 110. The backplane can support any number of high-capacity storage devices. In some embodiments, different backplanes within the data storage module support different numbers of mass storage devices.

System 100 includes buses 112a, 112b, and 112c. The bus 112a connects the data control module 104 to the data storage module 106a. Bus 112b connects the data control module 104 to the data storage module 106b. The bus 112c connects the data control module 104 to the data storage module 106c. The buses 112a, 112b, and 112c may each include one or more cables between the data control module 104 and the data storage modules 106a, 106b, and 106c. Each of the buses 112a, 112b, and 112c may provide a connection for data input and output between the data controller 104 and one of the data storage modules. In some embodiments, each of the buses 112a, 112b, and 112c may provide data input and output on multiple channels (eg, 4 channels). Each of the data storage modules 106a, 106b, and 106c may be assigned a separate identifier.

In various embodiments, the access and transfer of data between the data controller and the data storage module in the system may be performed by the appropriate computer bus. In some embodiments, data access and transfer is carried out by the SAS (Serial Attached SCSI) bus. In some embodiments, data access and transfer is performed by a Serial Advance Technology Attachment (SATA) bus.

Connections within each storage module 106a, 106b, and 106c may include backplane chain connections within the data storage module. For example, as shown in FIG. 1, the leftmost backplane is connected to bus 112a via input 114 on the backplane circuit board 108. The leftmost output 116 is connected over input 114 on the adjacent backplane. Each additional backplane circuit board 108 can be chained to another backplane circuit board in a similar manner, for example as shown in FIG.

In certain embodiments, each of the backplanes 108 includes an expander chip. The expander chip enables communication with various mass storage devices 110. Each of the backplanes 108 has a cascade port that chains the backplanes 108 to each other. In some embodiments, the backplane 108 comprises an electrical circuit that regulates power in the mass storage device 110. In certain embodiments, the backplane 108 may include power for the mass storage device 110 on the backplane.

For clarity, the backplane and mass storage device only illustrates the data storage module 106a. The backplane and mass storage devices of the data storage modules 112b and 112c are similar to those of the data storage modules 112a.

Each backplane may contain an output for each attached mass storage device 110. In one embodiment, the data input / output interface to the backplane has four channels. In one embodiment, each mass storage device 110 has a storage capacity of 500 GB.

Although three modules are shown in FIG. 1, in various embodiments, any number of data storage modules may be connected to the data controller.

FIG. 2 shows an embodiment of a system in which a mass storage device is mounted on multiple backplanes and includes a data control module and a data storage module. The system 120 includes a data storage module 122 and a data control module 124. In one embodiment, the data storage module 122 and the data control module 124 are rack mounted.

The data storage module 122 includes a chassis 126 of the data storage module, a data storage assembly 128, and a power supply unit 130. The data storage assembly 128 includes a backplane circuit board assembly 132 and a hard disk drive 134. The backplane circuit board assembly 132 may be mounted horizontally to the chassis 126 of the data storage module. The hard disk drive 134 is attached to the backplane circuit board assembly 132. The hard disk drive 134 may be mounted vertically. In one embodiment, the hard disk drive 134 is mounted so that the mounting height of the hard disk drive is maximized.

The power supply unit 130 may be connected to the circuit board assembly 132 on the backplane. The power supply unit 130 can power the circuit board assembly 132 on the backplane and the hard disk drive 134.

The data control module 124 includes a chassis 140 of the data control module, a control circuit board assembly 142, and a power supply unit 144. The control circuit board assembly 142 and the power supply unit 144 can be mounted on the chassis 140 of the data control module. The control circuit board assembly 142 has access to the data on the hard disk drive 134.

The power supply unit 144 can be connected to the control circuit board assembly 142. The power supply unit 144 can supply power to the control circuit board assembly 142.

In one embodiment, the data storage module 122 is 4U in height and the data control module 124 is about 1U in height.

In Figure 2, the chassis 126 for the data storage module and the chassis 140 for the data control module are outlined in a simple box for clarity. In various embodiments, the module chassis includes various structural and environmental components to support, mount, and protect the elements of the module, such as enclosures, mounting plates, covers, panels, or mounting rails. , Or may be using them.

In various embodiments, the computing unit includes a power supply that meets industry-recognized standards. In one embodiment, the power supply of the computing unit has a form factor according to industry accepted standards. In certain embodiments, the power supply units 130 and 144 have a standard 1U form factor. Examples of power supplies and other standards for power supply form factors include 2U, 3U, SFX, ATX, NLX, LPX, or WTX.

In the embodiment of FIG. 2, the data storage module 122 and the data control module 124 each include one power supply unit, and the data storage module 122 includes 96 hard disk drives. However, a computer system may include any number of hard disk drives, power supply units, or other components. In some embodiments, the data storage module or data control module may have one or more internal fans to facilitate the flow of air in the computer system. For example, in one embodiment, a series of fans can be mounted along the trailing edge of the data storage module 124. In some embodiments, the computing unit may have no fans and / or disk drives. In certain embodiments, the power supply may be outside the storage or computing module. For example, in one embodiment, the control circuit board assembly 142 of the data control module 124 may receive power from a power source (such as a rack-level power source) that is external to the chassis 140 of the data control module, and the power supply unit 144 may receive power. It may not be.

In one embodiment, the rack comprises two or more data storage subsystems with vertically oriented hard disk drives. FIG. 3 is a schematic representation of the front of the three data storage subsystems in the rack. System 160 includes rack 162 and data storage subsystem 164. The data storage subsystem 164 includes a data control module 166 and three data storage modules 168, respectively. In each data storage subsystem 164, the data control module 166 can control the data storage module 168 and access the data on the data storage module 168.

In one embodiment, the data storage module 166 includes two or more horizontally mounted backplanes, which support a vertically oriented hard disk drive. For example, the data storage module 168 may include six backplanes and a hard disk drive arranged as described above for the data storage module 122, respectively.

In one embodiment, each of the data storage modules 168 is 4U in height and each data control module 166 is 1U in height, with a total height of 13U for each subsystem and for a rack. A total of 39U is used. However, in various embodiments, the data storage module and the data control module may be of any suitable height.

In the embodiment of FIG. 1, the data controller is illustrated in the rack, but the data controller can be anywhere as appropriate.

In certain embodiments, the backplane is mounted to reduce or minimize the impact and / or vibration load between each hard disk drive and the chassis and between the hard disk drives within the module. FIG. 4 represents an embodiment of the backplane of a disk drive mounted on the pad of the chassis. Pad 180 is located on rail 182 at the bottom of chassis 126 of the data storage module. The backplane circuit board assembly 132 is mounted on the pad 180. The pad 180 is made of a shock absorber such as an elastomeric material. Pad 180 can reduce the propagation of shock and / or vibration between the chassis 126 of the data storage module and the hard disk drive 134.

In some embodiments, the backplane elements of the disk drive and the chassis may be combined to form a box for mounting the hard disk drive. For example, chassis bottom panels 184, rails 186, and one or more backplane circuit board assemblies 132 can be combined to form a rectangular box. This box portion can reduce the deformation of the chassis such as the sagging of the bottom panel 184 of the chassis that may occur when the hard disk drive 134 is directly attached to the bottom panel 184 of the chassis 126 of the data control module. In certain embodiments, rails, pads, trays, or similar structural elements may perform multiple functions, such as forming a box structure, electrical circuit space, and space for airflow.

In one embodiment, the system includes an air flow path under the backplane of two or more mass storage devices. FIG. 5 shows a data storage module that includes a riser. The backplane circuit board 132 can be attached to the backplane circuit board 132. The riser 198 may create a space between the backplane circuit board 132 and the chassis floor to form a gap 200. The gap 200 allows an air flow path 202 to be created beneath the circuit board assembly 132 on the backplane. The air flow path 202 may extend continuously from the frontmost backplane circuit board 108 to the rearmost backplane circuit board assembly 132.

As shown in FIG. 2, air may flow through the front vent 204 on the front of the chassis 126 of the data storage module. In the embodiment of FIG. 2, the front vent 204 is located near the bottom of the chassis 204 of the data storage module. However, the front vents can be anywhere on the front of the chassis or enclosure. Air can be moved from the front to the back of the chassis 126 of the data storage module by one or more air transfer devices. The air transfer device may be located outside the chassis 126 of the data storage module, inside the data storage module 126, above, or both. Air may flow through the air flow path 202 below the circuit board assembly 132 on the backplane and out through the chassis 126 of the data storage module.

Further, referring to FIG. 2, the data storage module 122 may include a power inlet plenum 208 and a power outlet plenum 210. Some of the air on the front of the chassis 126 of the data storage module may enter the power inlet plenum 208, through the front inlet 212 of the power supply, and into the housing of the power supply unit 130. Airflow through the power supply housing may exit the housing and pass through the power outlet plenum 210. In some embodiments, air may be guided to the bottom of the chassis (eg, under the backplane circuit board 132).

In some embodiments, the air from the power outlet plenum may mix with the air entering the chassis 126 of the data storage module before passing through the circuit board 132 of the backplane. In one embodiment, the exhaust from the power supply unit 144 is with other air entering the chassis 130 of the data storage module, for example, by a duct that carries the exhaust from the power supply unit to the rear of the chassis 126 of the data storage module. Can be separated.

In one embodiment, the power supply is arranged in the module so that the exhaust from the module is directed under the backplane of the chassis mass storage. For example, the power supply unit 130 of FIG. 2 may be rotated 90 degrees counterclockwise so that the air passing through the power supply unit exits the power supply unit near the bottom of the chassis.

In certain embodiments, air flowing under the backplane of the mass storage device may be exhausted upwards to remove heat from the mass storage device. For example, as shown in Figure 5, the air flow may be ventilated from below the backplane of the mass storage device. Air can flow under the circuit board assembly 132 of the backplane in the air flow path 202 between the backplane and the bottom of the chassis 126 of the data storage module. At each of the backplane circuit board assemblies 132, the air flowing from the front to the back of the chassis is exhausted through an opening 216 in the backplane circuit board assembly 132 between the hard disk drives 134. Air can rise upwards on the surface of the hard disk drive 134 through the opening 216. Some of the air may reach the top of the chassis. Air passing upwards over the hard disk drive 134 can remove heat from the hard disk drive 134. Air across the hard disk drive 134 upwards can move toward the back of the chassis 126 of the data storage module.

In certain embodiments, the size and number of backplane openings can be selected to regulate the flow of air through the various hard disk drives within the chassis. For example, in some embodiments, the backplane vents near the back of the chassis may be larger than the backplane vents near the front of the chassis. This is because there is relatively warm air near the back of the chassis, which may require a larger air flow.

FIG. 6 shows an embodiment of a data storage module that includes a shelf with a hard disk drive mounted on the shelf and cross braces for the hard disk. The data storage module 220 includes chassis assembly 222, power supply unit 224, and hard disk drive 226. Chassis assembly 222 includes base panel 228, front housing 230, shelves 232, cross brace 234, and left panel 236. Chassis assembly 222 may also include a right panel (for convenience of illustration, the right panel is omitted in FIG. 6).

In the embodiment of FIG. 6, the cross brace 234 is between the circuit board assemblies 234 of each backplane. However, in other embodiments, the cross braces may or may not be located in only some columns of the hard disk drive.

In some embodiments, the shelves 232 are mounted on cushioning material. For example, a series of cushioning pads may be deployed between the shelves 232 and the base panel 228.

The cross brace 234 is mounted on the shelf 232. The hard disk drive 226 is mounted on the circuit board assembly 225 on the backplane between the cross braces 234.

In the embodiment of FIG. 6, the power supply unit 224 is mounted so that its overall length is lateral to the front surface of the chassis (eg, from left to right in the length direction). The opening 244 is deployed in front of chassis assembly 222. The opening 244 allows air in front of the data storage module 220 to pass through an air flow path 245 formed between the base panel 228 and the shelf 232. The air flow path 245 may extend from the front to the back of the data storage module 220. The air flow path 245 may supply air to remove heat from the hard disk drive 226.

FIG. 7 shows an embodiment of a data storage module including a shelf and an intersecting brace for a hard disk drive, with the hard disk drive removed for the purposes of illustration. In addition, the back facing members of the cross brace are omitted in the drawing for clarity. In one embodiment, the back facing cross brace member is the same as the front facing cross brace member.

Cross brace 234 includes guide rim 249. The guide rim 249 includes an opening 246. The cross brace 234 can cure the chassis assembly 222 and prevent the chassis elements from sagging under the weight of the hard disk drive 226. The guide rim 249 may serve as a guide for hard disk drive 226. The opening 246 can be the path of air flow from front to back through the cross brace 234 between adjacent hard disk drives 226.

FIG. 8 is a top perspective view of an embodiment of a disk storage assembly including a backplane circuit board. FIG. 9 is a bottom perspective view of an embodiment of a disk storage assembly including a backplane circuit board. The disk storage assembly 250 includes a hard disk drive 226 and a backplane circuit board assembly 225. The hard disk drive 226 may be attached to the backplane circuit board assembly 225 at base 251. The connector 252 may electrically connect the hard disk drive 226 to the backplane circuit board assembly 225.

Each hard disk drive 226 may have a set of opposing rails 254. In certain embodiments, rail 254 may serve as a handle for hard disk drive 226.

The backplane circuit board assembly 225 may include tabs 255 and mounting pads 256. In certain embodiments, the mounting pad 256 is made of cushioning material. In some embodiments, the mounting pad 256 includes screws (eg, for mounting the chassis to the backplane). The tab 260 can be fitted into slot 247 on the cross brace 234.

FIG. 10 shows an embodiment of mounting a hard disk drive on a data storage module. Tab 255 on the backplane circuit board assembly 225 may extend into the corresponding slot at the cross brace 234. Pad 256 may be attached to socket 262 on shelf 232.

Rail 254 of hard disk drive 226 can slide between the ends of adjacent rims 249. The hard disk drive 226 may slide onto and from the top of the chassis. In certain embodiments, the rail 254 is shock-insulated or vibration-proof to the hard disk drive. In certain embodiments, for example, the rail 254 is made of or comprises an elastic material such as rubber. The rails can reduce the load of shock or vibration and / or isolate a particular drive from the vibration of other drives on or outside the backplane.

Referring to FIG. 7, air on the front side of the data storage module 250 may flow through the power opening 240 and the opening 244 during operation. Air passing through the power opening 240 may pass through the enclosure of the power supply unit 224. This air may exit the power enclosure through vent 242. Exhaust from vent 242 of the power supply unit 224 can mix with air entering chassis assembly 224 through opening 244. The mixed air may subsequently pass through the air flow path 245. Some of the air moving from the front to the rear of the air flow path 245 can pass through the shelf vent 238 of the shelf 332 and through the opening 259 of the backplane (shown in FIG. 9). Air exhausted through the shelf vent 238 can flow upwards across the hard disk drive 226 and backwards through the opening 246 of the cross brace 234. This removes heat from hard disk drive 226. Air may flow through the opening 246 in the cross brace 234 until it reaches behind the chassis assembly 222.

In certain embodiments, the data storage module comprises two or more backplanes with a data controller and multiple mass storage devices. The data controller and backplane may be supported by a common chassis. In some embodiments, the module includes a hard disk drive mounted vertically on the backplane. FIG. 11 shows an embodiment of a module that includes a data controller and backplanes for multiple disk drives. The data storage module 280 includes a controller 282, a data storage assembly 284, a power supply unit 286, and a chassis 288. The controller 282, data storage assembly 284, and power supply unit 286 are mounted on chassis 288.

The data storage assembly 284 includes a backplane circuit board assembly 290 and a hard disk drive 292. The backplane circuit board assembly 290 may be mounted horizontally on chassis 288 of the data storage module. The hard disk drive 292 is mounted on the backplane circuit board assembly 290. The hard disk drive 292 may be mounted vertically, as described above with respect to FIG. Each of the backplane circuit board assemblies may support multiple hard disk drives 232 and provide electrical connectivity.

The power supply unit 286 can be connected to the circuit board assembly 290 on the backplane. Power supply unit 286 can power backplane circuit board assembly 290 and hard disk drive 292.

In one embodiment, the air flows from the front to the back of the module so that the air downstream from the controller or motherboard assembly flows under the backplane of two or more mass data storage devices. For example, as shown by the arrows in FIG. 11, air can pass through vent 294 in front of chassis 288 and over controller 282. Air downstream from controller 282 can flow under the backplane circuit board assembly 290. In one embodiment, the air exhausted from the power supply unit 286 mixes with the air downstream from the controller 282 before passing through the backplane circuit board assembly 290.

FIG. 12 shows an embodiment of removing heat from a data storage module in a rack system. Air can flow from the subfloor plenum 354 into the computing room 352 via the vent 380. The rear fan 366 at the fan door 374 can draw air from the front aisle 368 into the rack 364 via the data storage module 360 and the data control module 362. The rear fan 366 can exhaust hot air from the rack. Hot air can pass through the ceiling plenum 356. An air orientation device 389 is deployed at the front or on the rack. The air orientation device 389 can be used to facilitate the air flow of a particular module mounted in the rack. Other arrangements of air transfer devices can be included in various embodiments. The applications described below include other arrangements, systems, devices, and technologies for use in various embodiments for cooling or mounting computing modules, data storage modules, and data control modules. As fully disclosed herein. That is, U.S. Patent Application No. 12 / 646,417 "Air Transfer for Rack Systems" filed December 23, 2009, and U.S. Patent Application No. 12 / 751,212 "Rack with Scoop" filed March 30, 2010. "Mounted Air Directioner", US Patent Application No. 12 / 886,440, filed September 9, 2010, "System with Rack-Mounted AC Fan," is disclosed herein in its entirety.

In one embodiment, the mass storage device is deployed on multiple backplanes in a common chassis. Figure 13 shows how to deploy data storage, including deploying mass storage devices on two or more backplanes that are connected to a common chassis. In the 400, the backplanes of two or more mass storage devices are mounted in a common chassis. This mass storage device may be, for example, a hard disk drive. This backplane may be horizontal on the chassis. The hard disk drive may be vertical. In certain embodiments, the data storage device and control are provided by a data storage device module and a data control module similar to those described above with respect to FIG. In one embodiment, the backplanes are connected to each other, of which at least one backplane is connected to the data controller. The data controller may be outside the chassis in which the backplane is mounted.

At 402, some or all of the mass storage devices on the backplane may be operational. For example, mass storage devices can provide storage capacity for a data center.

With a 404, some or all of the mass storage devices on the backplane may be powered off or put into a standby state. A storage device that is powered off or in a standby state can be considered cold. At the 406, the mass storage device, which was either turned off or was in a standby state, boots. At 408, the data of the started mass storage device is accessed.

If a module fails a hard disk drive, the module can be removed or reclaimed from its rack-mounted location. A failed hard disk drive can be removed and replaced from the top of the module.

Various embodiments can be described for the following clauses. Appendix 1. A system for storing data, With the rack With one or more data storage modules connected to the rack, Each of at least one of the data storage modules With the chassis With two or more backplanes connected to the chassis, Includes one or more mass storage devices connected to at least one of the backplanes. A system for storing data including one or more data control modules connected to a rack and connected to the outside of the chassis of the data storage module, at least one of the data control modules. , At least one of the data storage modules is configured to access one or more of the mass storage devices. Appendix 2. The two or more backplanes of at least one of the data storage modules are approximately horizontal, and at least one of the mass storage devices is approximately perpendicular to the backplane. Section 1 The system described in. Appendix 3. For at least one of the data storage modules, at least the first backplane is connected to the data control module and at least the second backplane is for data communication. The system described in Section 1 chained to the backplane of 1. Appendix 4. The system according to Section 1, wherein the one or more data storage modules include two or more data storage modules connected to a rack. Appendix 5. The two or more storage modules include three storage modules, and at least one of the large-capacity storage devices in at least one of the storage modules has a large-capacity storage with a mounting height. Equipment The system according to section 4 mounted on the backplane so that it has the maximum dimensions of the device. Appendix 6. At least one of the mass storage devices is a hard disk drive, and the data control module puts at least one of the hard disk drives in a standby or off state and the hard disk. The system described in Section 1 that is configured to boot from a standby or off state to access the data stored on the drive. Appendix 7. The multi-channel connection further comprises at least one multi-channel connection between the data control module and at least the one data storage module. The connection of the first channel between the data control module and at least the first hard disk drive on the first backplane, and The system according to section 1, comprising a second channel connection between the data control module and at least a second hard disk drive on the first backplane. Appendix 8. The system according to Section 1, further comprising the data control module and at least one air transfer device configured to move air through the data storage module. Appendix 9. Data storage module With the chassis Two or more backplanes connected approximately horizontally to the chassis, With at least two or more hard disk drives connected to each of the two backplanes, A data storage module that includes one or more cables configured to connect at least two hard disk drives on the backplane to a common data controller. Appendix 10. At least one air flow path is included under the back plane, and at least one of the air flow paths includes one or more air inlets and one or more air outlets. The data storage described in Section 9 configured to allow at least one flow path to move air from at least one air inlet to at least one air outlet and to dissipate heat from at least one said hard disk drive. Equipment module. Appendix 11. The data storage module according to Section 9, wherein at least one of the hard disk drives is mounted on the backplane so that the mounting height is the maximum dimension of the hard disk drive. Appendix 12. The data storage module according to Section 9, further comprising one or more circuit board assemblies connected to the chassis and configured to access the two or more hard disk drives. Appendix 13. The data storage module according to Section 9, further comprising one or more power supply units configured to power at least two hard disk drives on the backplane. Appendix 14. The data storage module according to Section 13, wherein the power supply unit is laterally mounted on the front surface of the chassis. Appendix 15. The two or more backplanes include at least six or more backplanes connected to the chassis, each of which supports two or more hard disk drives. The data storage module according to section 9, which is configured to connect to a data control module outside the data storage module. Appendix 16. The data storage module according to Section 9, further comprising one or more intersecting members between at least two of the backplanes. Appendix 17. The data storage module of section 16, wherein at least one of the cross members comprises at least one guide for at least one of the hard disk drives. Appendix 18. At least one of the intersecting members comprises one or more openings that are at least partially present between two adjacent hard disk drives on the backplane. The data storage module according to Section 16, wherein the above opening is configured to allow air to move from the front to the back of the cross member. Appendix 19. Further includes one or more guide rails connected to at least one of the hard disk drives, such that the guide rails are connected to at least one guide on the at least one cross member. The data storage module according to section 9, wherein the at least one guide rail is configured to at least partially isolate the hard disk drive from an external vibration load. Appendix 20. Data storage module With the chassis With one or more backplanes connected approximately horizontally to the chassis, With two or more mass storage devices connected to each of at least one of the backplanes, Containing at least one air flow path under the backplane, and at least one said air flow path includes one or more air inlets and one or more air outlets, said at least one. A data storage module configured such that an air flow path allows air to move from said at least one air inlet to at least one said air outlet and removes heat from at least one said mass storage device. Appendix 21. The one or more backplanes include two or more backplanes connected to the chassis, and at least one row of mass storage devices is in each of the two or more backplanes. The data storage module described in Section 20 to be connected. Appendix 22. At least one of the mass storage devices is a hard disk drive, and at least one of the hard disk drives is placed on the backplane so that the mounting height is the highest dimension of the hard disk drive. The data storage module described in Section 20 to be installed. Appendix 23. Data storage device according to section 20, further comprising one or more air transfer devices configured to move air to at least one of the one or more air flow paths under the backplane. module. Appendix 24. The data storage module according to section 23, wherein at least one of the air transfer devices is external to the data storage module. Appendix 25. The data storage module according to section 20, wherein the one or more air channels under the backplane are at least partially downstream from one or more power supply units on the chassis. Appendix 26. At least a portion of the air exiting the power supply unit further comprises one or more power supply units configured to power at least two hard disk drives on the backplane. The data storage module according to section 20, which is exhausted from one of the backplanes. Appendix 27. A method of providing a data storage device, Steps to provide two or more mass storage devices on two or more backplanes connected to a common chassis, A step of turning off or putting on at least one of the mass storage devices and activating at least one of the mass storage devices turned off or put into a stand-by state. A method of providing a data storage device comprising accessing data in at least one of the booted mass storage devices. Appendix 28. The method further comprises the step of electrically connecting at least two of the backplanes connected to the chassis to each other, the method of electrically connecting at least one of the backplanes to an external data controller. The method described in Section 27, which further comprises the steps to be performed. Appendix 29. The method of Section 27, further comprising moving air under the at least one backplane and removing heat from at least one of the mass storage devices on the at least one backplane.

In one embodiment, the computing module comprises a mass storage device mounted in two or more different directions. In some embodiments, the computing unit includes one or more horizontally mounted hard disk drives and one or more vertically mounted hard disk drives.

In certain embodiments, the hard disk drive of the data storage module is a standard commercial hard disk drive. Suitable hard disk drive form factors include 3.5 inches, 5.25 inches, and 2.5 inches. In one embodiment, a standard 3.5 inch hard disk drive is mounted for maximum mounting height.

In one embodiment, rack-mounted computing modules are commonly cooled by an air cooling system that pumps air into the rack. To remove heat from the rack-mounted computing modules, an air treatment system may be run to allow air to flow into the computer room and rack system. When air reaches the front of each computing module, it can pass through the chassis of the computing module. After passing through the chassis, hot air can exit the rear of the rack system and out of the computer room. In some embodiments, the computing module may have an onboard fan in addition to or in place of the central cooling system. In some embodiments, the rack may have fans that supply cooling air to all computing modules in the rack.

In the embodiments described above, the hard disk drive is mounted on the pads and rails, but in various embodiments, the hard disk drive or other data storage device may be mounted on the chassis with other mounting elements. Good. For example, a hard disk drive and / or a backplane for the hard disk drive may be attached to a square tube that supports the hard disk drive and lifts the hard disk drive above the bottom of the chassis.

In one embodiment, the rack system includes a rack-mounted fan that is outside the rack's computer system. Rack-mounted fans can supply airflow through the computer system.

For clarity, the modules in many of the figures herein are outlined with a simple box around the functional components. In various embodiments, the module or chassis of modules may include enclosures, trays, mounting plates, combinations thereof, and various structural elements.

In the embodiments described above, it is mentioned that some data storage modules have a height of 4U, but in various embodiments, the modules are 3U, 4U, 6U, or other heights and dimensions. May be good.

Although described in considerable detail in the above embodiments, a full understanding of the above disclosure will reveal various modifications and improvements to those skilled in the art. The following claims are intended to be construed to include these modifications and improvements.