Electronic book
10 claims: 10 independent, 0 dependent
- 1第1の板及び第2の板と、 前記第1の板及び前記第2の板の上方の第1の可撓性基板と、 前記第1の可撓性基板の上方の表示部と、 前記第1の可撓性基板の上方の駆動回路と、 前記表示部の上方の第2の可撓性基板と、 前記第2の可撓性基板の上方の第3の板及び第4の板と、 バッテリーと、 を有し、 前記表示部は、トランジスタを有し、 前記第1の板は、前記駆動回路と重なる領域を有し、 前記第1の板と、前記第2の板とは離間して設けられ、 前記第3の板と、前記第4の板とは離間して設けられ、 前記第1の板と前記第2の板との間は、前記第3の板と前記第4の板との間と重なる領域を有し、 前記表示部は、前記第1の板と前記第2の板との間で折り曲がる機能を有することを特徴とする表示装置。
- 2第1の板及び第2の板と、 前記第1の板及び前記第2の板の上方の第1の可撓性基板と、 前記第1の可撓性基板の上方の表示部と、 前記第1の可撓性基板の上方の駆動回路と、 前記表示部の上方の第2の可撓性基板と、 前記第2の可撓性基板の上方の第3の板及び第4の板と、 バッテリーと、 を有し、 前記表示部は、複数の画素を有し、 前記複数の画素のいずれか一は、トランジスタを有し、 前記第1の板は、前記駆動回路と重なる領域を有し、 前記第1の板と、前記第2の板とは離間して設けられ、 前記第3の板と、前記第4の板とは離間して設けられ、 前記第1の板と前記第2の板との間は、前記第3の板と前記第4の板との間と重なる領域を有し、 前記表示部は、前記第1の板と前記第2の板との間で折り曲がる機能を有し、 前記複数の画素のいずれか一は、前記表示部の前記折り曲がる機能を有する領域に配置されていることを特徴とする表示装置。
- 3第1の板及び第2の板と、 前記第1の板及び前記第2の板の上方の第1の可撓性基板と、 前記第1の可撓性基板の上方の表示部と、 前記第1の可撓性基板の上方の駆動回路と、 前記表示部の上方の第2の可撓性基板と、 前記第2の可撓性基板の上方の第3の板及び第4の板と、 バッテリーと、 を有し、 前記表示部は、トランジスタを有し、 前記第1の板は、前記駆動回路と重なる領域を有し、 前記第1の板と、前記第2の板とは離間して設けられ、 前記第3の板と、前記第4の板とは離間して設けられ、 前記第1の板と前記第2の板との間は、前記第3の板と前記第4の板との間と重なる領域を有し、 前記表示部は、前記第1の板と前記第2の板との間で折り曲がる機能を有し、 前記第1の板及び前記第2の板は、前記第1の可撓性基板に貼り付けられていることを特徴とする表示装置。
- 4請求項1乃至 3 のいずれか一項において、 前記トランジスタは、酸化物半導体を有することを特徴とする表示装置。
- 5請求項1乃至 4 のいずれか一項において、 前記バッテリーは、シート状の形状を有することを特徴とする表示装置。
- 6第1の板及び第2の板と、 前記第1の板及び前記第2の板の上方の第1の可撓性基板と、 前記第1の可撓性基板の上方の表示部と、 前記第1の可撓性基板の上方の駆動回路と、 前記表示部の上方の第2の可撓性基板と、 前記第2の可撓性基板の上方の第3の板及び第4の板と、 バッテリーと、 を有し、 前記表示部は、トランジスタを有し、 前記第1の板は、前記駆動回路と重なる領域を有し、 前記第1の板と、前記第2の板とは離間して設けられ、 前記第3の板と、前記第4の板とは離間して設けられ、 前記第1の板と前記第2の板との間は、前記第3の板と前記第4の板との間と重なる領域を有し、 前記表示部は、前記第1の板と前記第2の板との間で折り曲がる機能を有することを特徴とする電子機器。
- 7第1の板及び第2の板と、 前記第1の板及び前記第2の板の上方の第1の可撓性基板と、 前記第1の可撓性基板の上方の表示部と、 前記第1の可撓性基板の上方の駆動回路と、 前記表示部の上方の第2の可撓性基板と、 前記第2の可撓性基板の上方の第3の板及び第4の板と、 バッテリーと、 を有し、 前記表示部は、複数の画素を有し、 前記複数の画素のいずれか一は、トランジスタを有し、 前記第1の板は、前記駆動回路と重なる領域を有し、 前記第1の板と、前記第2の板とは離間して設けられ、 前記第3の板と、前記第4の板とは離間して設けられ、 前記第1の板と前記第2の板との間は、前記第3の板と前記第4の板との間と重なる領域を有し、 前記表示部は、前記第1の板と前記第2の板との間で折り曲がる機能を有し、 前記複数の画素のいずれか一は、前記表示部の前記折り曲がる機能を有する領域に配置されていることを特徴とする電子機器。
- 8第1の板及び第2の板と、 前記第1の板及び前記第2の板の上方の第1の可撓性基板と、 前記第1の可撓性基板の上方の表示部と、 前記第1の可撓性基板の上方の駆動回路と、 前記表示部の上方の第2の可撓性基板と、 前記第2の可撓性基板の上方の第3の板及び第4の板と、 バッテリーと、 を有し、 前記表示部は、トランジスタを有し、 前記第1の板は、前記駆動回路と重なる領域を有し、 前記第1の板と、前記第2の板とは離間して設けられ、 前記第3の板と、前記第4の板とは離間して設けられ、 前記第1の板と前記第2の板との間は、前記第3の板と前記第4の板との間と重なる領域を有し、 前記表示部は、前記第1の板と前記第2の板との間で折り曲がる機能を有し、 前記第1の板及び前記第2の板は、前記第1の可撓性基板に貼り付けられていることを特徴とする電子機器。
- 9請求項 6乃至8 のいずれか一項において、 前記トランジスタは、酸化物半導体を有することを特徴とする電子機器。
- 10請求項 6乃至9 のいずれか一項において、 前記バッテリーは、シート状の形状を有することを特徴とする電子機器。
Independent claims10
238 paragraphs, as filed
0001The technical field is related to electronic books.
0002In recent years, with the progress of digitization technology, text information and image information of newspapers, magazines, etc. have been converted into electronic data. The provision mode of providing as is adopted. This kind of electronic data is In general, the feature is that the contents can be viewed by being displayed on a display device provided in a PC or the like. have.
0003As the display device for displaying the above-mentioned electronic data, a portable device is used in addition to the stationary display device. Exists. An electronic book is a typical portable display device. Ebooks are usually the main body A display unit is provided on the front, and the next page can be operated by operating the page switching key provided on the outer circumference of the main unit. A configuration is adopted in which the data on the previous page and the data on the previous page are displayed on the display unit.
0004However, e-books that adopt such a structure are not considered to be paper media such as newspapers and magazines. The handling is very different. In particular, the act of switching pages by key operation is a paper medium. It is far from the habit of handling books in the body. Therefore, how to handle it like this Due to the difference, the efficiency of reading characters, the efficiency of understanding sentences, the efficiency of image recognition, etc. are reduced. There is a problem.
0005In order to eliminate the difference from the above-mentioned paper medium, an electronic book using a double-sided display device has been proposed. (See, for example, Patent Document 1 and Patent Document 2).
<p num="0006"><patcit num="1"><text>Japanese Unexamined Patent Publication No. 2005-38608</text></patcit><patcit num="2"><text>Japanese Unexamined Patent Publication No. 2003-58081</text></patcit></p>
<p num="0007">In one aspect of the disclosed invention, the drive circuit is broken when handling a flexible panel. One of the purposes is to provide an electronic book that reduces the number of people. Alternatively, one aspect of the disclosed invention Then, one of the purposes is to provide an electronic book having a simplified structure.</p>
<p num="0008">In one aspect of the disclosed invention, display control is performed by a scanning line drive circuit and a signal line drive circuit. It has a plurality of flexible display panels having a display unit and a binding unit for fixing the plurality of display panels. However, a signal line drive circuit is provided in the binding part, and the display panel has an end portion in the direction perpendicular to the binding part. This is an electronic book provided with a scanning line drive circuit.</p><p num="0009">In one aspect of the disclosed invention, the scanning line drive circuit and the signal line drive circuit include transistors. Then, the transistors that make up the scanning line drive circuit and the transistors that make up the signal line drive circuit An electronic book having a different structure may be used.</p><p num="0010">In one aspect of the disclosed invention, the channel layer of the transistor constituting the scanning line drive circuit is , It is a non-single crystal semiconductor, and the channel layer of the transistor that constitutes the signal line drive circuit is single-connected. It may be an electronic book which is a crystal semiconductor.</p><p num="0011">In one aspect of the disclosed invention, the non-single crystal semiconductor is amorphous silicon, microcrystalline silicon. It may be an electronic book which is a semiconductor, polysilicon, or an oxide semiconductor.</p><p num="0012">In one aspect of the disclosed invention, the display unit has a transistor and constitutes the display unit. The channel layer of the transistor that constitutes the ranger and the scanning line drive circuit is provided with the same material. It may be an e-book.</p><p num="0013">In one aspect of the disclosed invention, the binding section, in addition to the signal line drive circuit, is a battery, ann. It may be an electronic book having any one of tena, CPU, and memory.</p><p num="0014">In one aspect of the disclosed invention, the scanning line drive circuit has a plurality of circuit units and a plurality of circuit units. May be electronic books provided apart from each other.</p><p num="0015">In one aspect of the disclosed invention, even an electronic book having a stress concentration region between a plurality of circuit units. Good.</p><p num="0016">In one aspect of the disclosed invention, the plurality of display panels has a first display having a first display unit. A panel, a second display panel having a second display unit, a first display panel and a second display panel Provided between flannel, has a third display on the first surface and on the second surface opposite the first surface It has a third display panel having a fourth display unit, and the third display panel is a first display panel. It may be an electronic book that is easier to bend than the book and the second display panel.</p><p num="0017">In one aspect of the disclosed invention, the first display panel is a third display unit and a third display unit. It has a first optical sensor that controls the presence or absence of a display, and the second display panel has a second display unit and a second display unit. It has a second optical sensor that controls the presence or absence of display on the display unit of 4, and the third display panel is the first. An electronic book having a light-shielding portion in an area overlapping the optical sensor and the second optical sensor may be used.</p><p num="0018">Further, in the present specification and the like, a semiconductor device is a device that can function by utilizing semiconductor characteristics. In general, electro-optic devices, semiconductor circuits and electronic devices are all included in semiconductor devices.</p><p num="0019">Further, in the present specification and the like, the display device includes a light emitting device and a liquid crystal display device. Light emitting device emits The liquid crystal display device includes a liquid crystal element. The light emitting element shines by current or voltage. Elements whose degree is controlled are included in the category, specifically, inorganic EL (Electro L). There are uminescence) elements, organic EL elements, etc.</p>
<p num="0020">According to one aspect of the disclosed invention, it is possible to reduce breakage of the drive circuit and provide a durable electronic book. Can be</p><p num="0021">According to one aspect of the disclosed invention, the structure can be simplified and the cost of the electronic book can be reduced. ..</p>
0022<figref num="1">It is a figure explaining one form of an electronic book.</figref><figref num="2">It is a figure explaining one form of an electronic book.</figref><figref num="3">It is a figure explaining one form of an electronic book.</figref><figref num="4">It is a figure explaining one form of an electronic book.</figref><figref num="5">It is a figure explaining one form of the circuit configured in the binding part of an electronic book.</figref><figref num="6">It is a figure explaining one form of an electronic book.</figref><figref num="7">It is a figure explaining one form of an electronic book.</figref><figref num="8">It is a figure explaining one form of an electronic book.</figref><figref num="9">It is a figure explaining one form of an electronic book.</figref><figref num="10">It is a figure explaining one form of an electronic book.</figref><figref num="11">It is a figure explaining one form of an electronic book.</figref><figref num="12">It is a figure explaining one form of an electronic book.</figref><figref num="13">It is a figure explaining one form of an electronic book.</figref><figref num="14">It is a figure explaining one form of an electronic book.</figref><figref num="15">It is a figure explaining one form of an electronic book.</figref><figref num="16">It is a figure explaining the block diagram of one form of an electronic book.</figref><figref num="17">It is a figure explaining one form of a display panel.</figref><figref num="18">It is a figure explaining one form of a display panel.</figref><figref num="19">It is a figure explaining one form of a display panel.</figref><figref num="20">It is a figure explaining one form of a display panel.</figref><figref num="21">It is a figure explaining one form of a transistor applicable to an electronic book.</figref><figref num="22">It is a figure explaining one form of a display panel.</figref>
0023Hereinafter, embodiments will be described in detail with reference to the drawings. However, the invention is carried out as shown below. It is not limited to the description contents in the form of, and deviates from the purpose of the invention disclosed in the present specification and the like. It is self-evident to those skilled in the art that the form and details can be changed in various ways. Also different The configurations according to the embodiments can be combined as appropriate. In addition, below In the configuration of the invention described, the same reference numerals are given to the same parts or parts having similar functions. It will be used, and the description of the repetition will be omitted.
0024The size, layer thickness, or region of each configuration shown in the drawings and the like of each embodiment is clear. It may be exaggerated for the sake of clarity. Therefore, it is not necessarily limited to that scale Not done.
0025In addition, terms such as "first", "second", "third" and the like used in this specification are a mixture of components. It should be added that it is attached to avoid the same and is not limited in number.
0026(Embodiment 1) In the present embodiment, an example of an electronic book will be described with reference to the drawings.
0027The electronic book shown in this embodiment is displayed and controlled by a scanning line drive circuit and a signal line drive circuit. A plurality of display panels having a display unit and a binding unit for fixing the plurality of display panels. It has a signal line drive circuit inside the binding part, and each of the multiple display panels has a scanning line drive. A dynamic circuit is provided.
0028FIG. 1 shows two display panels (Table 1) as an example of an electronic book having a plurality of display panels. A binding part 4308 is provided at the end of the display panel 4311 and the second display panel 4312) to form a book. It shows the case to do. See Figure 1 below for the first and second display panels? The electronic book composed of these will be explained concretely. In addition, Fig. 1 (A) opens the e-book. Fig. 1 (B) shows the state in which the e-book is closed, and Fig. 1 (C) shows the state in which the e-book is halved. Indicates the open state.
0029The electronic book shown in FIG. 1 has a first display panel 4311 having a first display unit 4301 and a first display panel 4311. A second display panel 4312 having two display units 4307 and a first display panel 4311 The binding part 4308 provided at one end of the second display panel 4312 and the first display part 430. Scanning line drive circuits 4321a and 4321b that control the display of 1 and the second display unit 4307 Scanning line drive circuits 4322a and 4322b that perform display control, and the first display unit 4301 and the first It has a signal line drive circuit 4323 that controls the display of the display unit 4307 of 2.
0030The scanning line drive circuits 4321a and 4321b are provided on the first display panel 4311, and the scanning line is provided. The drive circuits 4322a and 4322b are provided on the second display panel 4312 to drive the signal lines. Road 4323 is provided inside the binding portion 4308.
0031The first display panel 4311 can be configured to have flexibility. In this case, plastic A pixel circuit constituting the first display unit 4301 on a flexible substrate such as a stick, and scanning. The line drive circuits 4321a and 4321b may be provided.
0032The second display panel 4312 also has a flexible configuration similar to the first display panel 4311. can do. In this case as well, the second display unit is placed on a flexible substrate such as plastic. The pixel circuit constituting the 4307 and the scanning line drive circuits 4322a and 4322b may be provided. ..
0033The binding portion 4308 is at least the first display panel 4311 and the second display panel 4312. It is preferable to have a configuration that is more difficult to bend (high rigidity). As an example, binding part 430 The housing that constitutes 8 is thicker than the first display panel 4311 and the second display panel 4312. It can be made of plastic, metal, or the like. In this case, the e-book is bound from 4308 onwards. It can be configured to bend (curve) at the outer part.
0034The place where the binding portion 4308 is provided is not particularly limited, but as an example, the first display panel 43 A binding portion 4308 can be provided along one end of the 11th and 2nd display panels 4312. To. For example, as shown in FIG. 1, the first display panel 4311 and the second display panel 431. When 2 is rectangular, the binding part 430 is along a predetermined side (so that one side is fixed). 8 can be provided. The rectangular shape referred to here includes the case where the corners are rounded. Shall be.
0035The signal line drive circuit 4323 is provided inside the binding portion 4308. For example, binding part 430 8 is provided in a columnar or columnar housing having a hollow, and a signal line drive circuit 432 is provided in the hollow portion. 3 can be provided. Provide the signal line drive circuit 4323 inside the binding part 4308. Therefore, it is possible to prevent the signal line drive circuit 4323 from being damaged due to bending of the display panel.
0036Further, as shown in FIG. 1, the scanning line drive circuits 4321a and 4321b are mounted on the first display panel. In 4311, it is preferable to provide the binding portion 4308 at the end portion substantially perpendicular to the binding portion 4308. Similarly The scanning line drive circuits 4322a and 4322b are bound on the second display panel 4312. It is preferable to provide it at the end portion in the substantially vertical direction with the same portion 4308. As a result, the scanning line drive times Compared to the case where the road and signal line drive circuits are provided in one place (for example, inside the binding part 4308). Therefore, the wiring can be reduced and the structure can be simplified.
0037Further, the number of pixels constituting the scanning line drive circuits 4321a and 4321b and the first display unit 4301 Scan line drive circuit 432 by forming the path on a flexible substrate in the same process It is possible to bend 1a and 4321b and reduce the cost. Similarly The scanning line drive circuits 4322a and 4322b and the pixel circuits that make up the second display unit 4307 are the same. By forming on a flexible substrate in the same process, the scan line drive circuit 4322a, It is possible to bend the 4322b and reduce the cost.
0038The pixel circuit that constitutes the first display unit 4301, the pixel circuit that constitutes the second display unit 4307, and so on. And scanning line drive circuits 4321a, 4321b, 4322a, 4322b It can be formed by a thin film transistor or the like. On the other hand, signal line drive circuit 4323 etc. Circuits that operate at high speed are formed using semiconductor substrates such as silicon and SOI substrates. Formed using an IC (Integrated Circuit), and bind the IC to the binding part 4 It can be installed inside the 308.
0039In this way, an IC in which a circuit for high-speed operation such as a signal line drive circuit is formed is placed inside the binding portion. A thin film transformer is provided on a flexible substrate with a scanning line drive circuit and a pixel circuit constituting a display unit. A signal line drive circuit and a scanning line drive circuit are provided by an IC by forming them with elements such as a gista. It is easier to bend the display panel compared to the case where it is caused by the bending of the display panel. It is possible to suppress the destruction of ICs and further reduce costs. In addition, the scanning line drive circuit , By providing it at the end of the display panel in the direction perpendicular to the binding part, wiring can be suppressed. The stop structure can be simplified.
0040In addition, in FIG. 1, the case where the scanning line drive circuit is formed at both ends of the first display panel 4311 is taken. As shown, only at one end (scan line drive circuit 4321a and scan line drive circuit 4321b) (Only one of them) may be provided. Similarly, the scan line drive circuit is displayed on the second display panel. Although the case where it is formed at both ends of the 4312 is shown, it may be provided only at one end. I.
0041This embodiment can be implemented in combination with the configurations described in other embodiments as appropriate. Is.
0042(Embodiment 2) In the present embodiment, the specific configuration of the electronic book shown in FIG. 1 above is described with reference to the drawings. explain. The configuration shown in the present embodiment is common to the first embodiment in many parts. To. Therefore, in the following, the explanation of the overlapping part is omitted, and the details of the differences are explained. Explain to.
0043First, an example of a specific configuration of an electronic book will be described with reference to FIG. In addition, Fig. 2 ( A) shows a plan view with the electronic book closed, and Fig. 2 (B) shows the disconnection between AB in Fig. 2 (A). The plane is shown, and FIG. 2 (C) shows a detailed schematic view of the cross section.
0044In the electronic book shown in FIG. 2, the binding portion 4308 is formed of a hollow housing, and the inside of the housing is formed. The signal line drive circuit 4323 is provided in. Here, the signal line drive circuit 4323 is the IC. The IC is provided inside the binding portion 4308. IC is silicon, etc. It can be formed using a semiconductor substrate, an SOI substrate, or the like. Of course, after the signal line drive circuit External circuits (eg, CPU, memory, etc.) can be provided in the IC.
0045Further, in FIG. 2, the IC provided inside the binding portion 4308 is TAB (Tape Aut). FPC (Flexible Printe) using omated Bonding) method It shows the case of mounting on d Circuit).
0046More specifically, the signal line drive circuit 4323a that controls the first display unit 4301 is FPC4. The signal line drive circuit 4323b provided on the 324a and controlling the second display 4307 is F. The signal line drive circuit 4323a and the signal line drive circuit 4323b are installed on the PC4324b. It is electrically connected via the printed circuit board 4325. FPC4324a is the first display Electrically connected to panel 4311 and printed circuit board 4325, FPC4324b is second It is electrically connected to the display panel 4312 and the printed circuit board 4325.
0047Further, in FIG. 2, the printed circuit board 4325 is installed in contact with the housing constituting the binding portion 4308. Can be kicked. In this case, the first display panel 4311 and the second display panel 4312 It is fixed by the binding part 4308.
0048As shown in Fig. 2, when the signal line drive circuit is provided on the FPC, the first display panel 4311 It is preferable to provide a stress concentration region 4326 on one or both of the and second display panels 4312. Castanopsis. When opening an e-book by providing a stress concentration region 4326 on the display panel (No. FP to 1 display panel 4311 and / or 2nd display panel 4312) It is possible to reduce the stress applied to C and suppress the destruction of the signal line drive circuit provided on the FPC. it can.
0049The stress concentration region is defined as deformation of the member due to cutting, bending, and extension due to sticking of the member. It refers to the area where stress is concentrated, which is formed by changing the strength against the force. In particular , Cut into the part of the first display panel 4311 or the second display panel 4312 that you want to fold The stress concentration region 4326 can be formed by providing the recesses (recesses, grooves).
0050For example, the first display panel 4311 uses the element substrate 4331a and the sealing substrate 4332a. A notch is provided in one or both of the element substrate 4331a and the sealing substrate 4332a. Can be configured as In FIG. 2, a notch is provided in the sealing substrate 4332a. The case where the stress concentration region 4326 is formed is shown. Also, in the structure shown here , The element substrate 4331a has a pixel circuit and a scanning line drive circuit 4 for driving the first display unit 4301. Forming 321a, 4321b and electrically connecting these circuits to FPC4324a Can be done.
0051Similarly, the second display panel 4312 uses the element substrate 4331b and the sealing substrate 4332b. To provide a recessed portion in one or both of the element substrate 4331b and the sealing substrate 4332b. Can be configured as A second display unit 4307 is driven on the element substrate 4331b. Pixel circuits and scanning line drive circuits 4322a and 4322b are formed, and these circuits and FPC The 4324b can be electrically connected.
0052In addition, the stress concentration region 4326 is the first display panel 4311 and the second display panel 4312. Should be provided along the direction in which it is desired to be bent. For example, in FIG. 2 (A), the binding portion 430 First display panel 4311 and / or second display panel 43 along a direction approximately parallel to 8. By providing a notch from the upper end to the lower end of 12, the direction in which the display panel is bent can be changed. Controllable (display panel can be selectively folded in the direction perpendicular to the binding part 4308 It is possible to suppress the destruction of the signal line drive circuit provided on the FPC.
0053The stress concentration region 4326 can be provided inside or outside the binding portion 4308. For example , With the first display panel 4311 and the second display panel 4312 closed, the binding section 4308 is provided so as to be in contact with the first display panel 4311 or the second display panel 4312. If so, stress is collected on the outside of the binding part 4308 (for example, between the binding part 4308 and the display part). It is preferable to provide the middle region 4326.
0054In FIG. 2, the signal line drive circuit 4323a that controls the first display unit 4301 and the second display unit 4 The signal line drive circuit 4323b that controls the 307 is formed using separate ICs, and the printed circuit board is used. Electrically connect signal line drive circuit 4323a and signal line drive circuit 4323b via 4325 The case is shown, but the case is not limited to this. Signal line drive circuit 4323a and signal line drive circuit The 4323b may be built into one IC.
0055Next, the structure of the electronic book different from that of FIG. 2 will be described with reference to FIG. Figure 3 (A) shows electricity A plan view with the child book closed is shown, and FIG. 3 (B) shows a cross section between AB in FIG. 3 (A). , FIG. 3 (C) shows a detailed schematic view of the cross section.
0056Figure 3 shows the COG (Chip On Glass) method for the IC provided in the binding section 4308. The case of mounting on the first display panel 4311 and the second display panel 4312 is shown by using an equation. doing.
0057More specifically, the signal line drive circuit 4323a that controls the first display unit 4301 The second display unit 4 is provided on the element substrate 4331a constituting the first display panel 4311. The element that the signal line drive circuit 4323b that controls 307 constitutes the second display panel 4312 The signal line drive circuit 4323a and the signal line drive circuit 4323b are provided on the board 4331b. Electrically connected via FPC4324a, 4324b and printed circuit board 4325 To.
0058As shown in FIG. 3, when the signal line drive circuit is provided on the display panel, the first is the same as in FIG. Stress concentration region 43 in one or both of 1 display panel 4311 and 2nd display panel 4312 It is preferable to provide 26. In this case, a signal line drive circuit is installed in the stress concentration region 4326. It is provided in a region different from the marked region (a region avoiding the region where the signal line drive circuit is provided). For example, when opening an electronic book by providing it on the sealing substrate side (first display panel 431). Low stress applied to signal line drive circuit (when bending 1 or 2nd display panel 4312) It can be reduced and the destruction of the signal line drive circuit can be suppressed.
0059Next, the configuration of the electronic book different from those in FIGS. 2 and 3 will be described with reference to FIG. Figure 4 (A ) Shows a plan view with the electronic book closed, and FIG. 4 (B) shows a cross section between AB in FIG. 4 (A). 4 (C) shows a detailed schematic view of the cross section.
0060In the electronic book shown in FIG. 4, an IC in which a circuit such as a signal line drive circuit is formed is provided on a printed circuit board. , The case where the printed circuit board and the display panel are connected by using FPC is shown.
0061More specifically, the signal line drive circuit 4323a that controls the first display unit 4301 A signal line drive circuit provided on the printed circuit board 4327a and controlling the second display unit 4307. 4323b is provided on the printed circuit board 4327b, and the signal line drive circuit 4323a and the signal line Drive circuit 4323b is electrically connected via FPC4329. FPC4329 Is electrically connected to printed circuit board 4327a and printed circuit board 4327b, FPC432 4a is electrically connected to the first display panel 4311 and the printed circuit board 4327a, and is FP. C4324b is electrically connected to the second display panel 4312 and printed circuit board 4327b It has been.
0062In Fig. 4, the display panel can be bent with FPC4324a and FPC4324b. Therefore, stress concentration regions are provided in the first display panel 4311 and the second display panel 4312. It can be configured without.
0063Next, an example of the configuration of the binding portion 4308 and the circuit that can be provided in the binding portion 4308. This will be explained with reference to FIG.
0064In FIG. 5, the case where the display control unit 200 including the signal line drive circuit is built in the binding unit 4308 is shown. I will explain. As described above, these circuits use semiconductor substrates such as silicon and SOI substrates. It can be formed using the IC formed in use.
0065The display control unit 200 includes a CPU 201, a storage unit 203, a power supply unit 205, and a power supply circuit 207. , Video signal generation circuit 215, signal line drive circuit 4323a, 4323b, operation unit 219, etc. It can be configured to have. In addition, each configuration can be connected via an interface or the like. Can be done. In addition, the display control unit 200 includes a first display panel 4311 and a second display panel. It is electrically connected to the 4312. Here, the operation unit 219 is provided in the binding unit 4308. Although the case is shown, the operation unit 219 is displayed on the first display panel 4311 and / or the second display panel. It can also be installed on the flannel 4312.
0066The CPU 201 controls the operation of the entire electronic book.
0067The data input unit 211 is a first display unit 4301 and / or a second display unit 43 from an external device. The information to be displayed in 07 is entered. In addition, the data input unit 211 is for data with an external device. An antenna 216 may be provided for transmission and reception. In this case, the data input unit 211 , Data received by antenna 216 and data stored in recording medium (external memory 213) Has a function of transferring to the internal memory 209.
0068The storage unit 203 has an internal memory 209, a data input unit 211, and an external memory 213. It can be configured. Internal memory 209, data input section 211 and external memory 213 Operates information and e-books to be displayed on the first display unit 4301 and the second display unit 4307. It is possible to record the program to be made.
0069The internal memory 209 generates a video signal based on signals from the power feeding unit 205, the operation unit 219, and the like. The signal output to circuit 215 and / or power supply circuit 207 is processed by CPU 201. It has a storage unit that stores programs for this purpose and data transferred from the data input unit 211. To. As an example of internal memory 209, DRAM (Dynamic Random Acc) ess Memory), SRAM (Static Random Access Me) mory), mask ROM (Read Only Memory), PROM (Prog) It is composed of rammable Read Only Memory) and so on.
0070The external memory 213 includes a storage medium such as an IC card and a memory card.
0071The power feeding unit 205 is composed of a secondary battery, a capacitor, and the like. As a secondary battery, for example, Richi Lithium battery, preferably a lithium polymer battery using a gel electrolyte, a lithium ion battery It is possible to reduce the size by using the above. Of course, any rechargeable battery will do, Nickel-metal hydride battery, Ni-Cd battery, organic radical battery, lead-acid battery, air secondary battery, nickel A battery that can be charged and discharged, such as a zinc battery or a silver zinc battery, may be used. As a capacitor Using electric double layer capacitors, lithium ion capacitors and other large capacity capacitors Can be Capacitors do not deteriorate much even if the number of times of charging and discharging increases, and they have quick charging characteristics. Is also suitable because it is excellent. The shape of the power feeding unit 205 is sheet-like, columnar, or prismatic. , Plate-shaped, coin-shaped, etc. may be appropriately selected.
0072Further, the power feeding unit 205 can be configured to be wirelessly supplied with electric power. in this case , An antenna may be provided on the feeding unit 205.
0073The power supply circuit 207 has the first display panel 4311 and the first display panel 4311 according to the control of the CPU 201. 2 Controls the power supply to the display element to display or hide the display panel 4312. It is a circuit for.
0074The operation unit 219 can be provided by a keyboard, operation buttons, or the like. In addition, the operation unit 219 Is provided on the first display panel 4311 and / or the second display panel 4312. 1 display unit 4301 and / or 2nd display unit 4307 as a touch display, the table The display unit can also function as an operation unit.
0075Figure 5 shows a configuration in which the display control unit 200 is built into the binding unit 4308, but it is even more switchable. So-called power devices such as a ching power supply and a DC-DC converter may be provided.
0076Further, in the electronic book shown in FIG. 5, the power input and display can be performed by operating the operation unit 219. You can switch. In addition, the first display unit 4301 and / or the second display unit 43 Using 07 as a touch display, use your finger on the first display 4301 and the second display 4307. It may be operated by touching it with an input pen or the like.
0077In this way, by incorporating the display control unit 200 in the binding unit 4308, the display control unit 200 can be combined. It can be protected by a housing. Moreover, the electronic book can be made thin.
0078In the first and second embodiments, the scanning line drive circuit 43 is displayed on the first display panel 4311. 21a, 4321b in the vertical direction of the binding part 4308 and along the first display part 4301 The scanning line drive circuits 4322a and 4322b are provided on the second display panel 4312. , The case where it is provided along the second display unit 4307 in the vertical direction of the binding unit 4308 is shown. However, it is not limited to this.
0079For example, as shown in FIG. 6 (A), in the first display panel 4311, the scanning line drive circuit Separate 4321a and 4321b from the binding part 4308 compared to the first display part 4301. Can be provided as follows. Generally, it constitutes scanning line drive circuits 4321a and 4321b. Since the elements are integrated from the elements constituting the pixel circuit, the first display panel 43 By not providing scanning line drive circuits 4321a and 4321b in the part where 11 is bent Therefore, damage to the scanning line drive circuits 4321a and 4321b can be suppressed.
0080Further, as shown in FIGS. 6 (B) and 6 (C), the scanning line drive circuits 4321a and 4321b are used. Each can be divided into a plurality of circuit units, and the plurality of circuit units can be provided separately from each other. As a result, even when the first display panel 4311 is curved, the scanning line drive circuit 4 Reduces the stress applied to 321a and 4321b, and reduces the stress applied to the scanning line drive circuits 4321a and 4321b. Damage can be suppressed. Figure 6 (B) shows the scanning line drive circuits 4321a and 4321b. Each is divided into two circuit sections, and Fig. 6 (C) shows the scanning line drive circuits 4321a and 43. The case where 21b is divided into four circuit parts is shown, but the scanning line drive circuit is installed. The number of divisions is not limited to this.
0081Also, as shown in FIG. 6 (D), in the first display panel 4311, only at one end. (Only one of the scanning line drive circuit 4321a and the scanning line drive circuit 4321b) It may be successful. This makes it possible to narrow the frame of the electronic book.
0082The structure shown in FIG. 6 can also be applied to the second display panel 4312.
0083This embodiment can be implemented in combination with the configurations described in other embodiments as appropriate. Is.
0084(Embodiment 3) In this embodiment, an electronic book having a plurality of flexible display panels is spread and curved. 7 to 10 show an example of the action and effect of the above-described embodiment. It will be explained with reference to it.
0085First, in Fig. 7 (A), the front plane when the user uses the e-book with the spread spread. In the figure, FIG. 7 (B), the top plan view when the user uses the electronic book in a spread. Will be shown and explained.
0086The electronic books shown in FIG. 7 (A) are shown in the first display panel 4311 and the second display panel 4312. It has a binding part 4308. The first display panel 4311 has a first display unit 4301. The first display unit 4301 is a scanning line drive circuit 4 that supplies a scanning signal to the first display unit 4301. 321, by the signal line drive circuit 4323a that supplies the image signal to the first display unit 4301 The display will be controlled. The second display panel 4312 is the second display unit 43. 07, the second display unit 4307 is a scan that supplies a scan signal to the second display unit 4307. Line drive circuit 4322, signal line drive circuit 432 that supplies image signals to the second display unit 4307 The display will be controlled by 3b. In Fig. 7 (A), the user's hand 435 Edges of first display panel 4311 and second display panel 4312 by 0a, 4350b The state of holding the club is also shown in the figure. Further, in the front plan view shown in FIG. 7 (A), The line of sight when looking at the top plan shown in Fig. 7 (B) is also added.
0087The top plan shown in FIG. 7B shows the first display panel 4311 and the second display panel 4312. , The binding part 4308 is shown. As shown in Figure 7 (B), the user has hands 4350a, 43. When using an e-book with a spread at 50b, the flexible display panel is shown in C in the figure. The range of the arrow shown is the bent part (hereinafter referred to as the bent part C), and the range of the arrow shown in the figure is the non-bent part. It will be formed (hereinafter referred to as non-bent part D).
0088In FIG. 7B, as an example, the first display panel 4311 and the second display panel 431 For the bent part C and the non-folded part D of 2, the side close to the binding part 4308 is the bent part C, and the binding part is bound. The side away from part 4308 is described as non-bent part D. Positions of bent part C and non-folded part D Depending on the configuration of the binding part 4308 and the material of the substrate that constitutes the display panel, The way of bending is different. Therefore, the first display panel 4311 and the second display panel Regarding the bent part C and the non-folded part D of Le 4312, the side away from the binding part 4308 is the bent part C. Therefore, the side close to the binding portion 4308 may be the non-bent portion D.
0089Since the e-book has a configuration in which the display panel is fixed by the binding unit 4308, the binding unit The first display panel that is perpendicular to the extending direction of 4308 (Fig. 7 (B) middle arrow 7002) A bent portion C and a non-folded portion D are formed on the 4311 and the second display panel 4312. To. Therefore, the signal line drive circuit 4323a and the signal line drive circuit 4323b have the binding portion 430. 8 can prevent damage caused by bending of the display panel. Scanning line drive circuit 432 1. By providing the scanning line drive circuit 4322 at the vertical end of the display panel, the display unit and Since it is possible to manufacture by the same process, it is possible to reduce the cost and the binding part 43. Compared with the case of providing in 08, it is possible to reduce the wiring routing to the display unit. Bent part C, non A plurality of bent portions D may be formed, or may be formed alternately. Also on the display panel A stress concentration region may be provided to artificially form a bent portion C and a non-bent portion D.
0090Next, in FIGS. 8 (A) to 8 (C), the electronic book is used in a spread as in FIG. 7 (A). The front plan view is shown, and the scanning line drive circuit 4321 for the bent portion C and the non-bent portion D is shown. , The arrangement of the scanning line drive circuit 4322 will be described.
0091In FIG. 8 (A), the side close to the binding portion 4308 is the bent portion C, and the side away from the binding portion 4308 is set. The side is described as the non-bent part D. Therefore, scanning line drive circuit 4321, scanning line drive Circuit 4322 shall be provided in the non-bent portion D on the side away from the binding portion 4308, respectively. .. The scanning signal is supplied to the pixel TFT 4352 in the display unit by the scanning line drive circuit 43. 21. By routing the wiring extending from the scanning line drive circuit 4322 to each scanning line of the display unit. You can do it. For driving the scanning line drive circuit 4321 and the scanning line drive circuit 4322. The supply of control signals such as clock signals extends from the video signal generation circuit in the binding section 4308. It is done through the line. Wiring for electrical connection between circuits is for microfabrication of metal films, etc. The semiconductor film of the transistor, which is formed of a silicon film and constitutes a scanning line drive circuit, is a silicon film or the like. It is made of a semiconductor material. Metal films have better ductility than semiconductor materials and are damaged by bending Is small. Therefore, the wiring connected to the scanning line drive circuit is arranged at the bent portion C. By arranging the transistors that make up the scanning line drive circuit at the location corresponding to the non-bent portion D, Therefore, damage to the semiconductor film of the transistor due to bending can be reduced. The conclusion As a result, the scanning line drive circuit 4321 and the scanning line drive circuit 4322 are arranged as shown in FIG. 8 (A). So, when the user uses the e-book with a spread of hands 4350a, 4350b, the circuit Damage can be suppressed.
0092In FIG. 8 (B), the bent portion C and the non-folded portion are directed from the side closer to the binding portion 4308 to the side away from the binding portion 4308. The configuration in which D and D are provided alternately is shown. Therefore, scanning line drive circuit 4321, scanning In the arrangement of the line drive circuit 4322, each drive circuit is divided into a plurality of parts in the non-bent portion D. , Should be provided apart from each other. Scanning to pixel TFT4352 in the display unit The signal supply extends from the first scan line drive circuit 4321 and the second scan line drive circuit 4322. This can be done by routing the wiring. Scan line drive circuit 4321, scan line drive times The supply of control signals such as clock signals for driving the road 4322 is projected in the binding section 4308. This is done through wiring extending from the image signal generation circuit. In addition, the pretense that constitutes the scanning line drive circuit The supply of the signal propagating between the pulse signal generation circuits such as the desktop is performed through the wiring. .. Wiring for making electrical connections between circuits is formed by microfabrication of metal films and the like. , The semiconductor film of the transistor that constitutes the scanning line drive circuit is formed of a semiconductor material such as a silicon film. Is done. Compared to semiconductor materials, metal films have excellent ductility and less damage due to bending. so that , Arrange the wiring connected to the scanning line drive circuit at the part corresponding to the bent part C, and hit the non-bent part D. By arranging the transistors that make up the scanning line drive circuit at the locations where the scanning line is driven, the transistors are curved. Damage to the semiconductor film of the engineer can be reduced. Also, in Fig. 8 (B), the drive The circuit is divided into a plurality of parts and provided apart from each other, and when curved, the circuit is hung on the scanning line drive circuit. Stress can be dispersed. As a result, the scanning line drive circuit 432 is shown in FIG. 8 (B). 1. By arranging the scanning line drive circuit 4322, the user can use the hands 4350a and 4350b to operate. When the child book is used with the spread spread, it is possible to suppress the breakage of the circuit more effectively.
0093In FIG. 8B, the scanning line drive circuit 4321 and the scanning line drive circuit 4322 are displayed on the display unit. Above and below the scan line drive circuit 4321a, scan line drive circuit 4321b, scan line drive circuit 43 22a, arranged as a scanning line drive circuit 4322b to make it redundant, or output a scanning signal It may be configured to disperse the functions to be powerful. In FIG. 8 (C), the configuration described in FIG. 8 (B) Is arranged above and below the display panel. The scanning signal supplied to the pixel TFT4352 is run. Check line drive circuit 4321a and scan line drive circuit 4321b up and down, and scan line drive circuit 43 By arranging 22a and the scanning line drive circuit 4322b vertically and supplying them, the scanning line drive circuit can be supplied. Since it is possible to reduce the number of pulse signal generation circuits such as flip-flops that are configured, the user Suppresses circuit damage when using e-books spread out with hands 4350a and 4350b Can be
0094In FIGS. 8 (B) and 8 (C) above, by showing a concrete example, the vehicle runs in the region that becomes the bent portion C. Regarding the advantage of arranging the scanning line drive circuit in the area that becomes the non-bent part D without arranging the inspection line drive circuit Is explained. With this configuration, the stress applied to the scanning line drive circuit when curved is dispersed. Can be used by the user with a hand 4350a, 4350b to spread the e-book At that time, damage to the circuit can be suppressed.
0095Next, as described in FIGS. 8 (B) and 8 (C), the drive circuit is divided into a plurality of parts and installed separately from each other. Stress concentration for artificially forming the bent portion C and the non-bent portion D in the display panel at the time of digiting. An example of providing an area will be described with reference to FIGS. 9 and 10.
0096In FIG. 9 (A), the first display panel 4311, the binding part 4308, the first display part 4301, and the running The inspection line drive circuit 4321 and the signal line drive circuit 4323a are shown. Scan line drive circuit The 4321 is shown in two parts, separated from each other via the wiring 920. To. The stress concentration region 921 is preferably formed so as to overlap with the wiring 920. Figure 9 (B) shows an example of a cross-sectional view in the direction perpendicular to the binding portion 4308, and wiring 920. In the stress concentration region 921 that overlaps with, a notch 922a is provided in the sealing substrate 923 to provide an element. The cutout portion 922b may be provided on the substrate 924. As shown in FIG. 9 (C), the element Attach the reinforcing plate 925 on the scanning line drive circuit 4321 of 923 to the substrate 924 and the sealing substrate. As a result, the notch portion 922a and the notch portion 922b may be formed. Na The cut portion 922a and the cut portion 922b are provided parallel to the major axis direction of the binding portion 4308. It may be set up only in a part.
0097The stress concentration region is the deformation of the member due to cutting, bending, and extension due to the attachment of the member. It refers to the area where stress is concentrated, which is formed by changing the strength with respect to.
0098Note that the division of the scanning line drive circuit is a repeated ray in which circuit elements such as TFT and wiring are mixed. A state in which the out area is divided by the area allocated for wiring. U.
0099Further, in FIG. 10 (A), as in FIG. 9 (A), the first display panel 4311 and the binding portion 430 8, 1st display 4301, scanning line drive circuit 4321, signal line drive circuit 4323a Is shown. The scan line drive circuit 4321 is divided into four and separated from each other via the wiring 920. It is provided in between. The stress concentration region 921 is formed so as to overlap with a plurality of wirings 920. It is preferable to do so. FIG. 10B shows an example of a cross-sectional view in the direction perpendicular to the binding portion. In the stress concentration region 921 that overlaps with the wiring 920, multiple cuts are made in the sealing substrate 923. Only the groove portion 922a may be provided, and a plurality of notch portions 922b may be provided on the element substrate 924. It should be noted that , As shown in FIG. 10 (C), the scanning line drive circuit 4 of 923 on the element substrate 924 and the sealing substrate 4 By pasting the reinforcing plate 925 on the 321, multiple cuts 922a and multiple cuts It may be configured to form the recessed portion 922b. In addition, a plurality of notches 922a and a plurality of notches The cut portion 922b may be provided parallel to the major axis direction of the binding portion 4308, or may be provided only in a part thereof. It may be provided.
0100The number of divisions of the scanning line drive circuit shown in FIGS. 9 and 10 is an example for explanation, and is appropriate. It may be divided into arbitrary numbers.
0101As described above, according to the configuration of the present embodiment, the user can use the electronic book as a spread. When doing so, damage to the scanning line drive circuit can be suppressed more effectively. Further, according to the configuration of the present embodiment. Then, by providing a stress concentration area with a notch or the like in advance on the display panel, it is more effective. Therefore, damage to the scanning line drive circuit can be suppressed.
0102This embodiment can be implemented in combination with the configurations described in other embodiments as appropriate. Is.
0103(Embodiment 4) In this embodiment, the structure of an electronic book having a plurality of display panels described in the first embodiment is described. In addition to the result, double-sided display type between the first display panel 4311 and the second display panel 4312 An example in which the third panel of the above is installed will be described. Figure 11 (A) shows the e-book spread. Figure 11 (B) shows the state in which the electronic book is closed. Figure 12 shows the e-book It is sectional drawing in the horizontal direction.
0104The electronic books shown in FIGS. 11A and 11B have a first display panel having a first display unit 4301. 431 and a second display panel 43 having an operation unit 4304 and a second display unit 4307. 12, and a third display panel 43 having a third display 4302 and a fourth display 4310 13, the first display panel 4311, the second display panel 4312, and the third display panel It has a binding portion 4308 provided at one end of the 4313. Third display panel 4 313 is inserted between the first display panel 4311 and the second display panel 4312. .. The electronic books shown in FIGS. 11A and 11B are the first display unit 4301, the second display unit 4307, and the second display unit. It has four display screens, a display unit 4302 of 3 and a display unit 4310 of 4th.
0105First display panel 4311, second display panel 4312, and third display panel 4313 Is flexible and easy to bend. In addition, the first display panel 4311 and the second display panel Use a plastic substrate for the flannel 4312 and a thin film for the third display panel 4313 If so, it can be made into a thin electronic book. That is, as an example in Fig. 12, the electronic book Showing a cross-sectional view in the horizontal direction, the third display panel 4313 is the first display panel 4311 and It can be an electronic book that is easier to bend than the second display panel 4312. Therefore, the first By making the display panel outside the display panel 4313 of 3 stiff, it feels like a book. It can be handled with, and damage to the third display panel 4313 can be suppressed.
0106The third display panel 4313 has both a third display unit 4302 and a fourth display unit 4310. It is a surface display type panel. The third display panel 4313 uses a double-sided injection type display panel. Alternatively, a single-sided injection type display panel may be attached and used. Also, back lie in between Two liquid crystal display panels may be used sandwiching the (preferably a thin EL light emitting panel).
0107Further, the electronic books shown in FIGS. 11 (A) and 11 (B) are used to control the display of the first display unit 4301. Inspection line drive circuit (not shown) and scanning line drive circuit 4 that controls the display of the second display unit 4307. Tables of 322a, 4322b and third display 4302 and / or fourth display 4310 A scanning line drive circuit (not shown) that performs display control, a first display unit 4301, and a second display unit 43. 07, a signal that controls the display of the third display unit 4302, and / or the fourth display unit 4310. It has a line drive circuit 4323. The scanning line drive circuits 4321a and 4321b are the first. The scanning line drive circuits 4322a and 4322b are provided on the display panel 4311 of the second display. It is provided on the panel 4312, and the signal line drive circuit 4323 is provided inside the binding portion 4308. ing.
0108Further, in the electronic books shown in FIGS. 11A and 11B, the second display panel 4312 is operated. It has a part 4304 and associates each function such as a power input switch and a display changeover switch. Can be
0109In addition, the input operation of the electronic book shown in FIGS. 11 (A) and 11 (B) is performed by the first display unit 4301 and the second display unit 4301. It is performed by touching the display unit 4307 with a finger or an input pen, or by operating the operation unit 4304. Is done. In addition, in FIG. 11A, the display button 4309 displayed on the second display unit 4307 Is illustrated, and input can be performed by touching with a finger or the like.
0110How to use an e-book with the third display panel 4313 shown in FIGS. 11 (A) and 11 (B) inserted. As an example of, read the text on the first display unit 4301 and the fourth display unit 4310, and read the second table. It is convenient to refer to the figures on the display 4307 and the third display 4302. At this time, the third Display panel 4313 simultaneously displays the third display unit 4302 and the fourth display unit 4310. Since it is not possible to do so, when you start turning the page, from the display of the third display unit 4302 It shall be switched to the display of the fourth display unit 4310.
0111Also, read the first display unit 4301 to the third display unit 4302, and read the next page, the third table. When the display panel 4313 is started to be turned over, the fourth display unit 4310 and the second display are displayed at an angle. Section 4307 displays the next page, and the fourth display section 4310 and the second display section 4 After using the 307 and starting to turn the third display panel 4313, at an angle the third table The display 4302 and the first display 4301 display the next page. This will turn off the screen It is possible to make the replacement invisible and suppress visual discomfort.
0112Then the first display panel 4311, the second display panel 4312, and the third display panel 4 An example of a specific configuration of an electronic book having 313 is shown in the same manner as in FIGS. 2 (A) and 2 (B). This will be described with reference to FIGS. 13 (A) and 13 (B). In addition, Fig. 13 (A) shows the state where the electronic book is closed. 13 (B) shows a cross section between AB in FIG. 13 (A).
0113The electronic book shown in FIG. 13 is formed of a housing in which the binding portion 4308 has a hollow shape, and the inside of the housing. A signal line drive circuit 4323 is provided in the section. Here, the signal line drive circuit 4323 is I It is formed of C, and the IC is provided inside the binding portion 4308. IC is silicon, etc. It can be formed by using a semiconductor substrate, an SOI substrate, or the like. Of course, the signal line drive circuit Circuits other than (for example, CPU, memory, etc.) can be provided in the IC.
0114Further, in FIG. 13, the IC provided inside the binding portion 4308 is TAB (Tape Au). FPC (Flexible Print) using the tomated Bonding method It shows the case of mounting on ed Circuit).
0115More specifically, a signal line drive circuit 4323 for controlling the first display unit 4301 was formed. An IC is provided on the FPC4324, and a signal line drive that also controls the second display unit 4307. An IC on which circuit 4323 is formed is provided on FPC4324, and a third display unit 4302 and The IC on which the signal line drive circuit 4323 that controls the fourth display unit 4310 is formed is FPC4. Provided on the 324, the signal line drive circuit 4323 is electrically connected via the printed circuit board 4325. It is connected. FPC4324 has a first display panel 4311 and a second display panel 431. 2 and is electrically connected to the printed circuit board 4325.
0116Further, in FIG. 13, the printed circuit board 4325 is adhered to the housing constituting the binding portion 4308. It can be provided as such.
0117As shown in FIG. 13, when the signal line drive circuit is provided on the FPC, it will be described in FIG. 2 (C) above. Thus, stress on one or both of the first display panel 4311 and the second display panel 4312 It is preferable to provide a concentrated area 4326. A stress concentration region 4326 is provided on the display panel. By doing so, when opening an e-book (first display panel 4311 and / or second display panel Reduces the stress applied to FPC4324 (when bending Le 4312), FPC4324 It is possible to suppress the destruction of the signal line drive circuit 4323 provided above. The third display Formed in a thin film on panel 4313, when using an ebook with a spread It has sufficient flexibility and can be handled like a book.
0118Next, the configuration of the electronic book different from that of FIG. 13 will be described with reference to FIG. Figure 14 (A ) Shows the plan view of the electronic book in the closed state, and FIG. 14 (B) shows the space between AB in FIG. 14 (A). The cross section is shown.
0119In the electronic book shown in FIG. 14, the IC provided in the binding portion 4308 is COG (Chip On). Using the Glass) method, the first display panel 4311 and the second display panel 4312 It shows the case of implementation.
0120More specifically, a signal line drive circuit 4323 for controlling the first display unit 4301 was formed. The IC is provided on the element substrate constituting the first display panel 4311, and similarly, the second display unit is provided. The IC on which the signal line drive circuit 4323 that controls 4307 is formed is the second display panel 431. The third display unit 4302 and the fourth display unit 4310 are provided on the element substrate constituting 2. The IC on which the control signal line drive circuit 4323 is formed constitutes the third display panel 4313. The signal line drive circuit 4323 is provided on the element board and the FPC4324 and the printed circuit board 4. It is electrically connected via 325.
0121Next, the configuration of the electronic book different from those in FIGS. 13 and 14 will be described with reference to FIG. Figure 15 (A) shows a plan view with the electronic book closed, and FIG. 15 (B) is A in FIG. 15 (A). -B section is shown.
0122In the electronic book shown in FIG. 15, an IC in which a circuit such as a signal line drive circuit is formed is installed on a printed circuit board. The case where the printed circuit board and the display panel are connected by using an FPC is shown.
0123More specifically, a signal line drive circuit 4323 for controlling the first display unit 4301 was formed. A signal in which an IC is provided on the printed circuit board 4325 and similarly controls the second display 4307. An IC on which the line drive circuit 4323 is formed is provided on the printed circuit board, and a third display unit 430 is provided. The IC on which the signal line drive circuit 4323 that controls the 2nd and 4th display units 4310 is formed is the 3rd The signal line drive circuit 4323 is provided on the element board that constitutes the display panel 4313 of the FP. It is electrically connected via C4324. FPC4324 is a printed circuit board 4 respectively Electrically connected to 325.
0124In Figure 15, the display panel can be bent with the FPC4324, so it is bent. It is possible to have a configuration in which no part is provided.
0125Then, between the first display panel 4311 and the second display panel 4312, a double-sided display type first Explain the configuration and functions of an e-book equipped with 3 panels using block diagrams, etc. To do. The electronic book in the present embodiment is spontaneous as a display element used for the display panel. Especially suitable for optical light emitting elements or liquid crystal elements that control the transmission of light such as backlights. Suitable. It should be noted that the display element of the electronic book may be another display element such as an electrophoresis element. Note that it is applicable.
0126FIG. 16 shows a block diagram of an electronic book described in this embodiment. The ebook shown in Figure 16 , 1st display panel 701, 2nd display panel 702, 3rd display panel 703, It has a fourth display panel 704 and a display control unit 705. The first display panel 701 is a run It has an inspection line drive circuit 706A and a first display unit 707A. The second display panel 702 is running It has an inspection line drive circuit 706B and a second display unit 707B. The third display panel 703 is running It has an inspection line drive circuit 706C and a third display unit 707C. The fourth display panel 704 is a run It has an inspection line drive circuit 706D and a fourth display unit 707D.
0127As described in the above embodiment, the first display panel 701 to the fourth display panel Each of the 704s has flexibility, and display control including the signal line drive circuit described in the above embodiment. The part 705 is fixed by the binding part that is installed internally.
0128The third display panel 703 and the fourth display panel 704 are double-sided injection type display panels. The third display unit 707C and the fourth display unit 707D are combined with each other. The display panel 703 of 3 can be used, and it is possible to reduce the thickness and cost of e-books. come.
0129The first display unit 707A to the fourth display unit 707D each have a plurality of pixels 708. Each of the plurality of pixels 708 has a pixel circuit 710 for controlling a display element. The pixel circuit 710 includes thin film transistors, etc., and if they are formed together, the cost is low. You can strike. Further, the first display unit 707A has an optical sensor 709A, and the second display unit 707A has a second display unit. The 707B has an optical sensor 709B, and the third display unit 707C has an optical sensor 709C. The fourth display unit 707D has an optical sensor 709D.
0130The scanning line drive circuit 706A to the scanning line drive circuit 706D have a pixel count of pixels 708. It supplies a scanning signal to the road 710.
0131The optical sensors 709A to 709D are the first display panels as described in the above embodiment. While viewing the 701 and the third display panel 703, or the second display panel 702 It also has a function of detecting the state of visually recognizing the fourth display panel 704. Therefore, the table The machine described in this embodiment by means of an inclination detection unit or another open / close detection means on a display panel or the like. It is also possible to realize Noh.
0132The optical sensor 709C and / or the optical sensor 709D is the optical sensor 709A and / or. Alternatively, it can be omitted by increasing the accuracy of the illuminance of the optical sensor 709B. Na Place a light-shielding part instead of the optical sensor 709C and / or the optical sensor 709D. By improving the illuminance accuracy of the optical sensor 709A and / or the optical sensor 709B. It is also preferable because it can be detected by an optical sensor even when a translucent substrate is used. To.
0133The optical sensors 709A to 709D are formed by the thin film transistor of the pixel circuit 710. As a photosensor with a photodiode or phototransistor on the substrate May be formed. Forming optical sensors 709A to 709D together with thin film transistors It is possible to reduce the cost of electronic books.
0134The display control unit 705 located in the binding unit 4308 has a light intensity comparison circuit 711 and a CPU 712. , Internal memory 713, video signal generation circuit 714, power supply circuit 715, signal transmitter / receiver 71 6, power supply unit 717, operation unit 718, signal line drive circuit 714A to signal line drive circuit 714D Each configuration is connected via an interface or the like. Signal transmitter / receiver 716 Is configured to include an antenna unit 719 for transmitting and receiving data to and from an external device. May be good.
0135The light intensity comparison circuit 711 detects signals from the light sensors 709A to 709D and detects the signals. It is a circuit that compares the signal intensities according to the illuminance. The light intensity comparison circuit 711 provides each light. Encode the signal according to the strength of the sensor. And the first display panel 701 and / or the first The optical sensor 709A and / or the optical sensor 709C of the display panel 703 of 3 and the second Optical sensor 709B and / or the fourth display panel 704 of the display panel 702 and / or the fourth display panel 704 / Or compare the signal according to the illuminance with the optical sensor 709D. The result of the comparison is C It is sent to PU712, and CPU712 will perform processing according to the signal. In addition, C The PU 712 also performs processing according to the operation of the operation unit 718.
0136The signal transmission / reception unit 716 is stored in the data received by the antenna unit 719 or a recording medium. It has a function to transfer the data to the internal memory 713. Internal memory 713 has an inter Data is stored via a face or the like. Internal memory 713 from signal transmitter / receiver 716 The data to be transferred to is the video signal to be displayed on the display panel, as well as the user ID, etc. It may be something that stores information.
0137The internal memory 713 is a signal from the light intensity comparison circuit 711, the power feeding unit 717, the operation unit 718, etc. The signal to be output to the video signal generation circuit 714 and / or the power supply circuit 715 based on Programs to be processed by CPU712 and data transferred from signal transmitter / receiver 716 It has a storage unit for storing. As an example, the internal memory 713 is ROM (Read). Only Memory) or RAM (Random Access Memory) is fine It is made.
0138The power supply unit 717 supplies electric power wirelessly or by wire, or stores batteries, capacitors, etc. It has a function of supplying electric power by means. In addition, the operation unit 718 has a touch panel and is movable. Encode the user's operation based on the operation buttons that can operate the part and transfer it to the CPU 712 Have the means to do.
0139The video signal generation circuit 714 is the first display panel 701 to the control of the CPU 712. To drive the scan line drive circuit to show or hide the fourth display panel 704 Clock signal, start pulse, etc. are transmitted from each scanning line drive circuit 706A to scanning line drive circuit 706. A clock signal for driving the signal line drive circuit supplied to D and provided in the binding section. Tart pulse, video signal, etc. are provided to each signal line drive circuit 714A to signal line drive circuit 714D. It is a circuit for supplying and supplying.
0140The signal line drive circuit 714A to the signal line drive circuit 714D has a pixel count in pixel 708. An image signal is supplied to the road 710 via a signal line.
0141The power supply circuit 715 is the first display panel 701 to the fourth according to the control of the CPU 712. To control the power supply to the display element to display or hide the display panel 704 of It is a circuit of. In FIG. 16, for the sake of explanation, the first display unit 707A is provided in the power supply circuit 715. Power supply circuit 715A that supplies power to the power supply circuit 715A and power supply that supplies power to the second display unit 707B Power supply circuit 715B, power supply circuit 715C that supplies power to the third display unit 707C, fourth The power supply circuit 715D, which supplies power to the display unit 707D, is shown.
0142The operation of the electronic book shown in FIG. 16 will be described with an example. First, the optical sensor 709A ~ The illuminance of the display surface of each display panel obtained by the 709D is compared by the light intensity comparison circuit 711. To do. CPU712 is the result of comparison with the light intensity comparison circuit 711, or from the operation unit 718. The signal of is used to determine which display panel the user is viewing. For example, an optical sensor Illuminance of 709A and / or optical sensor 709C and optical sensor 709B and / or optical sensor Compare the illuminance of the sensor 709D with the illuminance of the optical sensor 709A and / or the optical sensor 709C. If is greater than the illuminance of the light sensor 709B and / or the light sensor 709D, the user is the first It is determined that the display unit 707A and / or the third display unit 707C of the above is visually recognized. CPU The video signal generation circuit 7 is determined by determining which display panel the user is viewing on the 712. Video signals and controls that 14 supplies to the first display panel 701 to the fourth display panel 704 The signal and / or power supply circuit 715 is the first display panel 701 to the fourth display panel. Controls the power supply to the 704. Specifically, a second display that is not visible to the user Second display panel 702 and fourth display including section 707B and fourth display section 707D By stopping the power supply to the panel 704, the power consumption is reduced and the life of the display panel is extended. Can be planned.
0143In the electronic book shown in FIG. 16, the page viewed by the user is used as an optical sensor and a light intensity comparison circuit. By making a judgment, the image signal supply to the display panel, power supply, etc. can be selectively switched. I can. Therefore, we propose e-books that realize low power consumption and long life of display panels. Can be provided.
0144This embodiment can be implemented in combination with the configurations described in other embodiments as appropriate. Is.
0145(Embodiment 5) In this embodiment, an example of a display panel provided on an electronic book is shown. The display panel has various display elements A display panel with children can be applied, and even a passive matrix type can be used as an active mat. It may be a lix type.
0146Display panels include electronic paper and light-emitting display panels (EL (electroluminescence). ) Panel), liquid crystal display panel, etc. can be used. The display element is sealed on the display panel. It is a panel in a state where it is in a state, and a connector, for example, FPC (Flexible pri). nted circuit) or TAB (Tape Automated Bond) ing) Tape or TCP (Tape Carrier Package) is attached It is electrically connected to an external circuit including a signal line drive circuit. The IC that is the signal line drive circuit , COG (Chip On Glass) method may be mounted directly on the display panel. ..
0147The display panel is a single-sided display panel that displays on only one side even if it is a double-sided display type that displays on both sides. You may use it.
0148In the fourth embodiment, the third display panel 4313 has a third display unit 4302 and a fourth table. It is a double-sided display type panel having a display 4310. The third display panel 4313 is double-sided injection A type display panel may be used, or a single-sided injection type display panel may be attached and used. .. In addition, two liquid crystal display panels with a backlight (preferably a thin EL panel) sandwiched between them. May be used.
0149An example of a double-sided display panel is shown in FIGS. 17 (A) to 17 (C) using the third display panel 4313. .. In FIGS. 17A to 17C, the arrows indicate the light emission directions.
0150FIG. 17A shows a third display panel in which the display element 102 is sandwiched between the substrate 100 and the substrate 101. 4313, the third display unit 4302 on the board 100 side, and the fourth display unit 4 on the board 101 side. 310 is provided. Depending on the display element 102, the third display unit 4302 and the fourth table Since the display 4310 is displayed, the substrate 100 and the substrate 101 are translucent. Display element For 102, it is preferable to use an EL element which is a self-luminous light emitting element. The third display panel When using the light incident on the flannel 4313, the liquid crystal display element or electric swimming can be used as the display element 102. A dynamic display element can also be used.
0151FIG. 17B shows a single-sided display including the display element 114 sandwiched between the substrate 110 and the substrate 112. A single-sided display panel including a panel and a display element 115 sandwiched between the board 111 and the board 113. It is the third display panel 4313 in which all the panels are laminated, and the third display unit 4302 on the board 110 side. A fourth display unit 4310 is provided on the board 111 side. Third by display element 114 The display unit 4302 is displayed, and the display element 115 displays the fourth display unit 4310. Therefore, the substrate 110 and the substrate 111 are translucent. On the other hand, the substrate 112 and the substrate 113 are transparent. It does not have to be light, and may be reflective. In addition, the single-sided display panels are based on each other. The plate 112 and the substrate 113 may be adhered and bonded by an adhesive layer. Also, the board 11 Only one of 2 and the substrate 113 may be used.
0152As the display element 114 and the display element 115, it is preferable to use an EL element. In addition, the third display When using the light incident on the panel 4313 Liquid as the display element 114 and the display element 115 A crystal display element or an electrophoresis display element can also be used. Improves light extraction efficiency Therefore, it is preferable to use a reflective display panel as the single-sided display panel.
0153A backlight may be provided between the translucent liquid crystal display panels to serve as the third display panel 4313. I. FIG. 17C shows translucency including the display element 124 sandwiched between the substrate 120 and the substrate 122. Transparent including a type liquid crystal display panel and a display element 125 sandwiched between a substrate 121 and a substrate 123. A third display panel in which an optical liquid crystal display panel is laminated via a backlight 126 as a light source. 4313, the third display unit 4302 on the board 120 side, and the fourth display unit on the board 121 side. 4310 is provided. A third by the light of the backlight 126 and the display element 124 The display 4302 is displayed, and the light of the backlight 126 and the display element 125 display the fourth. Since the display unit 4310 is displayed, the board 120, the board 121, the board 122, and the board 123 It is translucent.
0154The single-sided display panel and the backlight may be adhered by an adhesive layer. I. Further, only one of the substrate 122 and the substrate 123 may be used. Backlight As for 126, if a thin EL panel is used, the third display panel 4313 can be made thinner. Therefore, it is preferable.
0155In the case of a single-sided display type panel, a non-transmissive or reflective housing is placed on the surface where the display unit is not provided. If it is provided, the strength of the display panel can be improved, which is preferable.
0156A form of the display panel will be described with reference to FIGS. 18 to 20. 18 to 20 , Corresponds to the cross-sectional view of MN in FIG. 4 (A). 18 to 20 and 22 are images. A first display having a primary circuit 4301 and a first display having a scanning line drive circuit 4322a This is an example in which FPC4324 is attached to panel 4311 and is installed on the element board 4331a. The first display unit 4301 and the scanning line drive circuit 4322a are separated by the sealing material 4005. It is sealed with the sealing substrate 4332a.
0157As shown in FIGS. 18 to 20 and 22, the first display panel 4311 is a connection terminal electrode. It has 4015 and terminal electrode 4016, and has connection terminal electrode 4015 and terminal electrode 401. 6 is electrically connected to the terminal of FPC4324 via the anisotropic conductive film 4019. There is.
0158The connection terminal electrode 4015 is formed of the same conductive film as the first electrode layer 4030, and the terminal electrode 4 016 is the same as the source electrode layer and drain electrode layer of the thin film transistors 4010 and 4011. It is made of the same conductive film.
0159Further, as shown in FIG. 4, a single crystal semiconductor film or a polycrystalline semiconductor is placed on a separately prepared substrate. The signal line drive circuit 4323a formed of a film is mounted by an FPC and is inside the binding part 4308. It is provided in. Signal line drive circuit 4323a, scan line drive circuit 4322a and table 1 Various signals and potentials given to the indicator 4301 are supplied from the FPC 4324.
0160The connection method of the signal line drive circuit 4323a is not particularly limited, and the COG method is used. A method, a wire bonding method, a TAB method, or the like can be used.
0161In addition, the first display unit 4301 provided on the element substrate 4331a and the scanning line drive circuit 432 1a has a plurality of thin film transistors, and in FIGS. 18 to 20, the first display unit 430 Thin film transistor 4010 included in 1 and thin film transistor included in scanning line drive circuit 4321a The Langista 4011 is illustrated. Insulation on thin film transistors 4010, 4011 Layers 4020 and 4021 are provided. The insulating film 4023 functions as a base film. It is an insulating film.
0162The thin film transistors 4010 and 4011 are not particularly limited, and various thin film transistors are applied. can do. In FIGS. 18 to 20, the thin film transistors 4010 and 4011 are designated as thin film transistors 4010 and 4011. An example of using an inverted staggered thin film transistor having a bottom gate structure is shown. Thin film transistor 40 10 and 4011 show a channel-etched type, but a cha with a channel protection film on the semiconductor layer. A flannel-protected inverted staggered thin film transistor may be used.
0163The thin film transistor 4010 provided in the first display unit 4301 is electrically connected to the display element. And configure the display panel. The display element is not particularly limited as long as it can display, and there are various display elements. A display element can be used.
0164Electronic paper can be used as the display panel. Image writing on electronic paper As a means of using electric field, magnetic field, light, or heat, shape and position changes regarding changes in the display medium There are many methods in various combinations such as the use of and the use of physical changes. For example, twist Ball method, electrophoresis method, powder method (also called toner display), liquid crystal method And so on.
016518 and 22 show the active matrix type electronic page as the first display panel 4311. An example using par is shown. Electronic paper has the same readability as paper and is lower than other display panels. It has the advantages of power consumption and the ability to have a thin and light shape.
016618 (A) (B) and 22 show active matrix type electrons as an example of a display panel. Show paper.
0167The electronic paper shown in FIG. 18A is an example of a display device using the twist ball display method. The twist ball display method is an electrode that uses spherical particles painted in black and white as a display element. By arranging between the layers and controlling the orientation of the spherical particles by causing a potential difference between the electrode layers, This is a method of displaying.
0168Installed on the first electrode layer 4030 to be connected to the thin film transistor 4010 and the sealing substrate 4332a. A black region 4615a and a white region 4615b are formed between the separated second electrode layer 4031 and the black region 4615a. Spherical particles 4613 containing a cavity 4612 that has and is filled with liquid are provided. The circumference of the spherical particles 4613 is filled with a filler 4614 such as resin. Second The electrode layer 4031 corresponds to a common electrode (counter electrode). The second electrode layer 4031 has a common potential. It is electrically connected to the wire.
0169It is also possible to use an electrophoretic element instead of the twist ball. With display element An example of using the electrophoresis element is shown in FIG. 18 (B). Clear liquid 4712 and the first particle Negatively charged black particles 4715a and positively charged white particles as the second particle For microcapsules 4713 with a diameter of about 10 μm to 200 μm enclosed with 4715b There is.
0170Microcapsules 47 provided between the first electrode layer 4030 and the second electrode layer 4031 13 is given an electric field by the first electrode layer 4030 and the second electrode layer 4031, White fine particles 4715b and black fine particles 4715a move in opposite directions, displaying white or black. can do. A display element to which this principle is applied is an electrophoresis display element. Electrophoresis table Since the indicator element has high reflectance, no auxiliary light is required, and the power consumption is low and it is dim. It is possible to recognize the display unit even in a place. Also, when power is not supplied to the display unit Even if there is, it is possible to retain the image once displayed, so the display panel from the radio wave source It is possible to save the displayed image even when the is moved away.
0171The first particle and the second particle contain a dye and do not move in the absence of an electric field. It is. Further, the colors of the first particle and the second particle are different (including colorless).
0172The microcapsules dispersed in a solvent are called electronic inks. Electronic ink can be printed on the surface of glass, plastic, cloth, paper, etc. Also Color display is also possible by using a color filter or particles having a dye.
0173The first particles and the second particles in the microcapsules are conductor material, insulator material, and so on. Semiconductor materials, magnetic materials, liquid crystal materials, ferroelectric materials, electroluminescent materials, electroluminescence Trochromic materials, a type of material selected from magnetic electrophoretic materials, or composite materials of these You can use it.
0174It is also possible to use an electronic powder fluid (registered trademark) as the powder system method. With display element An example of using an electron powder fluid is shown in FIG. First electrode layer 4030, second electrode layer 403 In the space 4812 separated by 1 and the rib 4814, a positively charged black powder or granular material 4815a And the negatively charged white powder granules 4815b are filled. Space 4812 is air.
0175When an electric field is applied by the first electrode layer 4030 and the second electrode layer 4031, black powder particles Body 4815a and white powder 4815b move in opposite directions, displaying white or black Can be done. Color powders such as red, yellow, and blue may be used as the powder or granular material.
0176In addition, as a display element, a light emitting element (EL element) that utilizes electroluminescence is used. You may use it. In light emitting devices that utilize electroluminescence, the light emitting material is an organic compound. It is distinguished by whether it is an inorganic compound or an organic compound. Generally, the former is an organic EL device and the latter. Is called an inorganic EL element.
0177An organic EL element is an electron and a hole from a pair of electrodes by applying a voltage to the light emitting element. Is injected into each layer containing a luminescent organic compound, and an electric current flows. And those monsters The recombination of the rear (electrons and holes) causes the luminescent organic compound to form an excited state. Then, it emits light when its excited state returns to the ground state. From such a mechanism, like this A light emitting element is called a current excitation type light emitting element.
0178The inorganic EL element is divided into a dispersed inorganic EL element and a thin film type inorganic EL element depending on the element configuration. It is similar. The dispersed inorganic EL element has a light emitting layer in which particles of a light emitting material are dispersed in a binder. The luminescence mechanism utilizes donor and acceptor levels. Ccepter recombination type luminescence. In the thin film type inorganic EL element, the light emitting layer is sandwiched between the dielectric layers, and the light emitting layer is sandwiched between the dielectric layers. Furthermore, it has a structure in which it is sandwiched between electrodes, and the light emission mechanism utilizes the inner-shell electron transition of metal ions. Localized light emission to be used. Here, an organic EL element will be used as the light emitting element. To.
0179The light emitting element may have at least one of a pair of electrodes transparent in order to extract light. Soshi A thin film transistor and a light emitting element are formed on the substrate, and light is emitted from the surface opposite to the substrate. Top surface injection to emit, bottom surface injection to extract light emission from the surface on the substrate side, substrate side and the side opposite to the substrate There is a light emitting element with a double-sided injection structure that extracts light from the surface of the surface, and any light emitting element with an injection structure can be applied. can do.
0180FIG. 19 shows an example in which a light emitting display panel (EL panel) is used as the first display panel 4311. I will. The light emitting element 4513, which is a display element, is a thin film transistor provided on the display unit 4301. It is electrically connected to the 4010. The configuration of the light emitting element 4513 is the first electrode layer 403. 0, electroluminescent layer 4511, second electrode layer 4031 laminated structure, but limited to the configuration shown Not done. According to the direction of the light extracted from the light emitting element 4513, etc., the light emitting element 4513 The configuration can be changed as appropriate.
0181The partition wall 4510 is formed by using an organic resin film, an inorganic insulating film, or an organic polysiloxane. In particular, using a photosensitive material, an opening is formed on the first electrode layer 4030, and the side wall of the opening is formed. Is preferably formed so as to be an inclined surface formed with a continuous curvature.
0182The electroluminescent layer 4511 is configured such that a plurality of layers are laminated even if the electroluminescent layer 4511 is composed of a single layer. It doesn't matter whether it is done or not.
0183A second electrode layer to prevent oxygen, hydrogen, moisture, carbon dioxide, etc. from entering the light emitting element 4513. A protective film may be formed on the 4031 and the partition wall 4510. As a protective film, a silicon nitride film, A silicon nitride film, a DLC film, or the like can be formed. In addition, the element substrate 4331a is sealed. Filler 4514 is installed in the space sealed by the substrate 4332a and the sealing material 4005. It is squeezed and sealed. Highly airtight and less degassed so that it is not exposed to the outside air. Packing with protective film (bonded film, UV curable resin film, etc.) or cover material It is preferable to perform aging (encapsulation).
0184The filler 4514 includes not only inert gases such as nitrogen and argon, but also UV curable resin. Can use thermosetting resin, PVC (polyvinyl chloride), acrylic, poly Mid, epoxy resin, silicone resin, PVB (polyvinyl butyral) or EVA (d) (Tylene vinyl acetate) can be used. For example, use nitrogen as a filler. I.
0185If necessary, a polarizing plate or a circular polarizing plate (including an elliptical polarizing plate) is provided on the ejection surface of the light emitting element. Optical films such as retardation plates (λ / 4 plates, λ / 2 plates) and color filters may be provided as appropriate. I. Further, an antireflection film may be provided on the polarizing plate or the circular polarizing plate. For example, due to surface irregularities Anti-glare treatment that can diffuse the reflected light and reduce reflection can be applied.
0186FIG. 20 shows an example in which a liquid crystal display panel is used as the first display panel 4311. In Figure 20 The liquid crystal element 4013, which is a display element, has a first electrode layer 4030 and a second electrode layer 403. 1 and the liquid crystal layer 4008 are included. It should be noted that the machine is used as an alignment film so as to sandwich the liquid crystal layer 4008. Effective insulating films 4032 and 4033 are provided. The second electrode layer 4031 is a sealing substrate 4 The first electrode layer 4030 and the second electrode layer 4031 are provided on the 332a side, and the liquid crystal layer 400 is provided. It is configured to be stacked via 8.
0187The 4035 is a columnar spacer obtained by selectively etching the insulating film. It is provided to control the film thickness (cell gap) of the liquid crystal layer 4008. It should be noted that the spherical shape You may use a pacer.
0188Further, although not shown in the liquid crystal display device of FIG. 20, a color filter (colored layer) and a black layer are used. Optical members (optical substrates) such as trix (light-shielding layer), polarizing member, retardation member, antireflection member, etc. Etc. will be provided as appropriate. For example, circularly polarized light using a polarizing substrate and a retardation substrate may be used. Also , A backlight, a side light, or the like may be used as the light source. E as a backlight It is preferable to use an L panel because it can be made thinner.
0189Further, a liquid crystal showing a blue phase without using an alignment film may be used. The blue phase is one of the liquid crystal phases Yes, when the temperature of the cholesteric liquid crystal is raised, the direct transition from the cholesteric phase to the isotropic phase It is a previously expressed phase. The blue phase is expressed only in a narrow temperature range, which improves the temperature range. To the liquid crystal layer 4008, a liquid crystal composition mixed with 5% by weight or more of a chiral agent was used. Use. A liquid crystal composition containing a liquid crystal exhibiting a blue phase and a chiral agent has a response speed of 10 μs ~. It is as short as 100 μs and is optically isotropic, so no orientation treatment is required and the viewing angle dependence is small. I.
0190Although FIG. 20 shows an example of a transmissive liquid crystal display panel, a semitransparent liquid is also used in a reflective liquid crystal display panel. It can also be applied to the crystal display panel.
0191In FIGS. 18 to 20 and 22, the element substrate 4331a and the sealing substrate 4332 are shown. As a, a translucent plastic or the like can be used. As plastic FRP (Fiberglass-Reinforced Plastics) board, PVF (polyvinyl fluoride) film, polyester film, polyester film Lum or acrylic resin film can be used. Also, P the aluminum foil A sheet having a structure sandwiched between VF films and polyester films can also be used.
0192The insulating layer 4020 functions as a protective film for the thin film transistor.
0193The protective film prevents the invasion of pollutant impurities such as organic substances, metal substances, and water vapor floating in the atmosphere. It is intended for use, and a dense film is preferable. The protective film is a silicon oxide film using a sputtering method. , Silicon nitride film, silicon oxide film, silicon oxide film, aluminum oxide film, aluminum nitride It is formed by a single layer or a laminate of a film, an aluminum nitride film, or an aluminum nitride film. Just do it.
0194The insulating layer 4021 that functions as a flattening insulating film is made of polyimide, acrylic, or benzosi. Heat resistant organic materials such as clobutene, polyamide and epoxy can be used. .. In addition to the above organic materials, low dielectric constant materials (low-k materials), siloxane-based resins, and PS G (phosphorus glass), BPSG (phosphorus glass) and the like can be used. In addition, this An insulating layer may be formed by laminating a plurality of insulating films formed of these materials.
0195The method of forming the insulating layer 4020 and the insulating layer 4021 is not particularly limited, and depending on the material, the spa Tatter method, SOG method, spin coating, dip, spray coating, droplet ejection method (ink jet method) Method, screen printing, offset printing, etc.), doctor knife, roll coater, carte An coater, a knife coater, or the like can be used. Forming an insulating layer using a material liquid In this case, even if the semiconductor layer is annealed (200 ° C to 400 ° C) at the same time in the baking process. Good. Efficiently manufacture display panels by combining the firing process of the insulating layer and the annealing of the semiconductor layer It becomes possible to do.
0196The display panel transmits light from a light source or a display element to perform display. Therefore, a table through which light is transmitted The substrate, other insulating film, conductive film, and other thin films provided on the display are all compatible with light in the visible wavelength range. To make it translucent.
0197First electrode layer 4030 and second electrode layer 4031 (pixel electrode layer) that apply voltage to the display element , Common electrode layer, counter electrode layer, etc.), the direction of the light to be taken out and the electrode layer are provided. Translucency and reflectivity may be selected depending on the location and the pattern structure of the electrode layer.
0198The first electrode layer 4030 and the second electrode layer 4031 are indium acids containing tungsten oxide. Indium zinc oxide containing compound, tungsten oxide, indium oxidation containing titanium oxide Indium tin oxide containing titanium oxide, indium tin oxide (hereinafter referred to as ITO). ), Indium zinc oxide, indium tin oxide with silicon oxide added, etc. A conductive material can be used.
0199The first electrode layer 4030 and the second electrode layer 4031 are tungsten (W) and molybdenum. (Mo), Zirconium (Zr), Hafnium (Hf), Vanadium (V), Niobium (N) b), tantalum (Ta), chromium (Cr), cobalt (Co), nickel (Ni), chita Metals such as titanium (Ti), platinum (Pt), aluminum (Al), copper (Cu), silver (Ag), Or it can be formed from one or more of its alloys or its metal nitrides. Wear.
0200Further, as the first electrode layer 4030 and the second electrode layer 4031, a conductive polymer (conductive poly) is used. It can be formed by using a conductive composition containing (also referred to as mer). As a conductive polymer Can be used as a so-called π-electron conjugated conductive polymer. For example, polyaniline Or its derivatives, polypyrrole or its derivatives, polythiophene or its derivatives, young Examples thereof include copolymers of two or more of these.
0201In addition, since thin film transistors are easily destroyed by static electricity, etc., protection for driving circuit protection is provided. It is preferable to provide a circuit. The protection circuit is preferably configured using a non-linear element. ..
0202This embodiment can be implemented in combination with the configurations described in other embodiments as appropriate. Is.
0203(Embodiment 6) In the present embodiment, examples of materials and element structures constituting the electronic book will be described in detail.
0204Since the signal line drive circuit is provided at the binding portion, it does not need to be particularly flexible. Therefore, A semiconductor using a semiconductor substrate (semiconductor wafer) capable of high-speed operation as a signal line drive circuit It is preferable to use an integrated circuit chip (IC). Single crystal semiconductor substrate and semiconductor substrate Polycrystalline semiconductor substrates can be used, such as silicon wafers and germanium wafers. Semiconductor wafers, compound semiconductor wafers such as gallium arsenide and indium phosphide To.
0205Further, a substrate having an SOI structure in which a single crystal semiconductor layer is provided on an insulating surface in a signal line drive circuit ( SOI substrate) may be used. The SOI board is SIMOX (Separation by IMplanted Oxygen) method or Smart-Cut method Can be done. The SIMOX method injects oxygen ions into a single crystal silicon substrate to a predetermined depth. After forming the oxygen-containing layer, heat treatment is performed to form an embedded insulating layer at a certain depth from the surface, and then embedded. This is a method of forming a single crystal silicon layer on a built-in insulating layer. Also, the Smart-Cut method , Hydrogen ion implantation is performed on the oxidized single crystal silicon substrate, and water is placed at a place corresponding to the desired depth. A single unit that forms an element-containing layer and has a silicon oxide film for bonding on the surface of another semiconductor substrate. Single crystal in hydrogen-containing layer by bonding with (crystal silicon substrate, etc.) and heat treatment The silicon substrate is divided to form a laminate of a silicon oxide film and a single crystal silicon layer on the semiconductor substrate. It is a way to do it.
0206As a semiconductor element provided in the circuit part of an electronic book, not only a field effect transistor but also a half Memory elements that use a conductor layer can also be applied, and are required for many purposes. A semiconductor integrated circuit that satisfies the above functions can be provided.
0207The method is particularly limited if the scanning line drive circuit and the display unit are provided on the flexible substrate of the display panel. Not determined. The scan line drive circuit and display may be formed directly on the flexible substrate, or other fabrications. It is made on a substrate, and then only the element layer is transferred from the made substrate to a flexible substrate by a peeling method. It may be provided. For example, the scanning line drive circuit and the display unit are formed on the manufacturing substrate in the same process and scanned. The line drive circuit and the display unit can be provided by transposing it to the flexible substrate of the display panel. This place In this case, the scanning line drive circuit and the display unit are formed in the same process, so that the transition of the same structure and material is used. It is preferable to use a star because the cost can be reduced. Therefore, it constitutes a scanning line drive circuit and a display unit. The channel layer of the transistor is provided with the same material.
0208In addition, the substrate of the display panel is transferred together with the flexible support substrate by transposing from the fabrication substrate to the flexible support substrate. It may be provided by adhering to. For example, a plurality of scanning line drive circuits are formed on a manufacturing substrate to make them flexible. After transposing to the support board of, the flexible support board is divided into individual scan line drive circuits, and one The scanning line drive circuit provided on the flexible support substrate is bonded and installed as much as necessary for the display panel of. You may kick it. In this case, since the scanning line drive circuit and the display unit are manufactured in separate processes, each of them is manufactured. Transistors of various configurations and materials can be selected.
0209Further, the above-mentioned transfer method and the direct formation method may be combined. For example, using a printing method, etc. The flexible group of the display panel is the wiring that electrically connects the display unit, scanning line drive circuit unit, FPC, etc. It may be formed directly on the plate.
0210As the manufacturing substrate, the manufacturing substrate may be appropriately selected according to the manufacturing process of the element layer. For example, making As the substrate, a glass substrate, a quartz substrate, a sapphire substrate, a ceramic substrate, and an insulating layer on the surface. A metal substrate or the like on which is formed can be used. In addition, it has heat resistance that can withstand the processing temperature. A plastic substrate may be used.
0211As a flexible substrate, aramid resin, polyethylene naphthalate (PEN) resin, polye Tersalphon (PES) resin, polyphenylene sulfide (PPS) resin, polyimi Do (PI) resin or the like can be used. Also, with a structure in which the fibers are impregnated with organic resin. Certain prepregs may be used.
0212The method of transposing the element layer from the manufactured substrate to another substrate is not particularly limited, and various methods can be used. Can be done. For example, a release layer may be formed between the fabrication substrate and the element layer.
0213In this specification, the element layer is opposed to the semiconductor element layer provided on the element substrate side as well as the element layer. It also includes a counter electrode layer provided on the substrate side. Therefore, the peeling process is performed on either the element base side or the sealing substrate side. Can also be used for In addition, considering the simplicity of the process, the production substrate is changed to a flexible substrate. After placing, the flexible substrate is temporarily adhered to a glass substrate or the like in the manufacturing process to proceed with the manufacturing process. You can also do it.
0214The peeling layer is tongue steep by a sputtering method, a plasma CVD method, a coating method, a printing method, etc. (W), molybdenum (Mo), titanium (Ti), tantalum (Ta), niobium (Nb), Nickel (Ni), Cobalt (Co), Zirconium (Zr), Zinc (Zn), Ruteniu Mu (Ru), Rhodium (Rh), Palladium (Pd), Osmium (Os), Iridium An element selected from (Ir) and silicon (Si), or an alloy material containing an element as a main component, or a predecessor A layer made of a compound material containing a description element as a main component is formed as a single layer or laminated. Contains silicon The crystal structure of the layer may be amorphous, microcrystal, or polycrystalline. In addition, here, paint The cloth method includes a spin coating method, a droplet ejection method, and a dispensing method.
0215When the release layer has a single layer structure, preferably a tungsten layer, a molybdenum layer, or a tongue steer. A layer containing a mixture of molybdenum and molybdenum is formed. Or the oxide or oxidation of tungsten With a layer containing a nitride, a layer containing a molybdenum oxide or an oxide nitride, or tungsten A layer containing an oxide or an oxide nitride of a mixture of molybdenum is formed. In addition, tongue ste The mixture of molybdenum and tungsten corresponds to, for example, an alloy of tungsten and molybdenum.
0216When the release layer has a laminated structure, a tungsten layer, a molybdenum layer, or a molybdenum layer is preferably used as the first layer. Formed a layer containing a mixture of tungsten and molybdenum, and as a second layer, tungsten, Molybdenum or a mixture of tungsten and molybdenum oxides, nitrides, nitride nitrides or nitrogen Form oxides.
0217As a release layer, a laminated structure of a layer containing tungsten and a layer containing an oxide of tungsten is formed. In this case, a layer containing tungsten is formed, and an insulating layer formed of an oxide is formed on the upper layer. By doing so, a layer containing an oxide of tungsten is formed at the interface between the tungsten layer and the insulating layer. You may take advantage of what is done. Furthermore, the surface of the layer containing tungsten is thermally oxidized. Tungsten acid is treated by oxygen plasma treatment, treatment with a solution with strong oxidizing power such as ozone water, etc. A layer containing the compound may be formed. In addition, plasma treatment and heat treatment include oxygen, nitrogen, and dioxide dioxide. It may be carried out in the atmosphere of a single nitrogen or a mixed gas of the gas and another gas. this The same applies when forming a layer containing a tungsten nitride, an oxide nitride and a nitride oxide. After forming a layer containing tungsten, a silicon nitride layer, a silicon oxide layer, and an acid nitride are placed on top of the layer. It is preferable to form a siliconized silicon layer.
0218In the transfer step to another substrate, a release layer is formed between the substrate and the element layer, and the release layer and the element layer are formed. A metal oxide film is provided between the two, and the metal oxide film is fragile by crystallization, and the element layer is peeled off. Amorphous silicon film containing hydrogen is provided between the highly heat-resistant substrate and the element layer, and the laser beam is emitted. The element layer is peeled off by removing the amorphous silicon film by irradiation or etching. Method, a release layer is formed between the substrate and the element layer, and a metal oxide film is provided between the release layer and the element layer. The metal oxide film is fragile by crystallization, and a part of the release layer is made into a solution or NF.<sub>3</sub>, BrF<sub>3</sub>, Cl F<sub>3</sub>After removing by etching with a fluorinated halogen gas such as, to a fragile metal oxide film Method of peeling off, mechanically remove the substrate on which the element layer is formed, or use a solution or NF<sub>3</sub>, BrF<sub>3</sub>, ClF<sub>3</sub>A method of removing by etching with a halogenous fluorine gas such as, etc. should be used as appropriate. Can be done. Further, as a peeling layer, a film containing nitrogen, oxygen, hydrogen, etc. (for example, an amorphous substance containing hydrogen) Using a quality silicon film, hydrogen-containing alloy film, oxygen-containing alloy film, etc.), irradiate the release layer with laser light. Nitrogen, oxygen and hydrogen contained in the release layer are released as gas to promote the separation between the element layer and the substrate. You may use the method of
0219By combining the above peeling methods, the transposition step can be performed more easily. In other words, Leh Irradiation with the light, etching to the peeling layer with gas or solution, with a sharp knife or scalpel, etc. After mechanically removing the peeling layer and the element layer so that they can be easily peeled off, a physical force (machine) It can also be peeled off by a machine or the like).
0220Further, the element layer may be separated from the substrate by infiltrating the liquid into the interface between the release layer and the element layer. liquid Water or the like can be used as the body.
0221The transistor included in the electronic book disclosed in the present specification is not particularly limited. Therefore, transition Various star structures and semiconductor materials can be used.
0222An example of the structure of the thin film transistor will be described with reference to FIG. FIG. 21 shows the fifth embodiment. This is an example of a thin film transistor that can be used for the thin film transistor 4010.
0223In FIGS. 21 (A) to 21 (D), the insulating film 4023 is formed on the element substrate 4331a. Thin film transistor 4010a, 4010b, 4010c, 4010d on the insulating film 4023 Is provided. Thin film transistor 4010a, 4010b, 4010c, 4010d An insulating layer 4020 and an insulating layer 4021 are formed on the thin film transistors 4010a and 401. A first electrode layer 4030 is provided that electrically connects to 0b, 4010c, and 4010d. To.
0224The thin film transistor 4010a is attached to the thin film transistor 4010 in FIGS. 18 to 20. The wiring layers 405a and 405b, which function as the source electrode layer and the drain electrode layer, are half and half. Conductor layer 403 and n<sup>+</sup>It is a structure that touches without interposing layers.
0225The thin film transistor 4010a is an inverted staggered thin film transistor and has an insulating surface. On the element substrate 4331a and the insulating film 4023, which are the substrates, the gate electrode layer 401 and the gate insulation A wiring layer 40 that functions as a layer 402, a semiconductor layer 403, a source electrode layer or a drain electrode layer. Includes 5a and 405b. n<sup>+</sup>Layers 404a and 404b are semiconducting with lower resistance than semiconductor layer 403. It is a body layer.
0226The thin film transistor 4010b is a bottom gate type thin film transistor with an insulating surface. The gate electrode layer 401 and the gate are placed on the element substrate 4331a and the insulating film 4023, which are the substrates to be used. Wiring layers 405a, 405 that function as the insulating layer 402, the source electrode layer or the drain electrode layer. b, functioning as a source area or drain area n<sup>+</sup>Layers 404a, 404b, and semiconductors Includes layer 403. In addition, it covers the thin film transistor 4010b and is in contact with the semiconductor layer 403. A margin layer 4020 is provided.
0227In addition, n<sup>+</sup>Layers 404a, 404b can be with the gate insulating layer 402 and the wiring layers 405a and 405b. It may be a structure provided between them. Also n<sup>+</sup>Gate insulating layer and wiring for layers 404a and 404b The structure may be provided both between the layers and between the wiring layer and the semiconductor layer.
0228The thin film transistor 4010b is used in the entire region including the thin film transistor 4010b. A device substrate in which the insulating layer 402 is present and has a gate insulating layer 402 and an insulating surface. A gate electrode layer 401 is provided between 4331a. Wiring on the gate insulating layer 402 Layers 405a, 405b, and n<sup>+</sup>Layers 404a and 404b are provided. And game Insulation layer 402, wiring layers 405a, 405b, and n<sup>+</sup>Semiconductors on layers 404a, 404b Layer 403 is provided. Although not shown, the wiring layer 40 is placed on the gate insulating layer 402. It has a wiring layer in addition to 5a and 405b, and the wiring layer extends outward from the outer peripheral portion of the semiconductor layer 403. Exists.
0229The thin film transistor 4010c extends to the source electrode layer in the thin film transistor 4010b. And the drain electrode layer and the semiconductor layer are n<sup>+</sup>It is a structure that touches without interposing layers.
0230The thin film transistor 4010c is used in the entire region including the thin film transistor 4010c. A device substrate in which the insulating layer 402 is present and has a gate insulating layer 402 and an insulating surface. A gate electrode layer 401 is provided between 4331a. Wiring on the gate insulating layer 402 Layers 405a and 405b are provided. Then, the gate insulating layer 402 and the wiring layer 405a , 405b is provided with a semiconductor layer 403. Although not shown, the gate insulating layer 4 02 has a wiring layer in addition to the wiring layers 405a and 405b, and the wiring layer is a semiconductor layer 403. It extends to the outside of the outer circumference of the.
0231The thin film transistor 4010d is a top gate type thin film transistor. Thin film tran Gista 4010d is an example of a planar type thin film transistor. On a substrate with an insulating surface Functions as a source region or drain region on a certain element substrate 4331a and insulating film 4023 To do n<sup>+</sup>A gate insulating layer on the semiconductor layer 403 and the semiconductor layer 403 including the layers 404a and 404b. 402 is formed, and the gate electrode layer 401 is formed on the gate insulating layer 402. Also n<sup>+</sup>Wiring that is in contact with layers 404a and 404b and functions as a source electrode layer or drain electrode layer Layers 405a and 405b are formed. n<sup>+</sup>Layers 404a and 404b are semiconductor layers 403. It is a semiconductor region with lower resistance.
0232As the thin film transistor, a top gate type forward staggered thin film transistor may be used.
0233In the present embodiment, the single gate structure has been described, but a multi-gate structure such as a double gate structure has been described. It may have a structure. In this case, even in a structure in which the gate electrode layer is provided above and below the semiconductor layer. A structure in which a plurality of gate electrode layers are provided only on one side (upper or lower) of the semiconductor layer may be preferable.
0234The semiconductor material used for the semiconductor layer is not particularly limited. For semiconductor layers of thin film transistors Examples of materials that can be used will be described.
0235The material that forms the semiconductor layer of a semiconductor element is a semiconductor material typified by silane or German. Amorphous (amorphous, hereinafter referred to as "amorphous") produced by vapor deposition method or sputtering method using chemical gas Also called "AS". ) Semiconductors, the amorphous semiconductors using light energy and thermal energy Crystallized polycrystalline semiconductor or microcrystal (semi-amorphous or microcrysta) Also called Le. Hereinafter, it is also referred to as "SAS". ) Semiconductors and the like can be used. semiconductor The layer can be formed by a sputtering method, an LPCVD method, a plasma CVD method, or the like. ..
0236The microcrystalline semiconductor film is semi-cheap, which is intermediate between amorphous and single crystal, considering the free energy of Gibbs. It belongs to a fixed state. That is, a half having a third state that is stable in free energy. It is a conductor, has short-range order, and has lattice distortion. Columnar or acicular crystals are paired with the substrate surface And it is growing in the normal direction. Microcrystalline silicon, which is a typical example of microcrystalline semiconductor, is a llama. 520 cm whose spectrum shows single crystal silicon<sup>-1</sup>Shifting to the lower wavenumber side .. That is, 520 cm showing single crystal silicon<sup>-1</sup>And 480 cm showing amorphous silicon<sup>-1</sup>There is a peak in the Raman spectrum of microcrystalline silicon between. Also, unbonded hands (dung) At least 1 atomic% or more of hydrogen or halogen to terminate the ring bond) It is included. In addition, it contains noble gas elements such as helium, argon, krypton, and neon. By further promoting lattice strain, stability is increased and a good polycrystalline semiconductor film can be obtained. To.
0237This microcrystalline semiconductor film uses a high-frequency plasma CVD method with a frequency of several tens of MHz to several hundreds of MHz. Or it can be formed by a microwave plasma CVD device with a frequency of 1 GHz or higher. .. Typically, SiH<sub>4</sub>, Si<sub>2</sub>H<sub>6</sub>, SiH<sub>2</sub>Cl<sub>2</sub>, SiHCl<sub>3</sub>, SiCl<sub>4</sub>, S iF<sub>4</sub>It can be formed by diluting silicon hydride such as hydrogen with hydrogen. Also, silicon hydride and In addition to hydrogen, one or more selected from helium, argon, krypton, neon A microcrystalline semiconductor film can be formed by diluting with a rare gas element. Silica hydride at these times The flow rate ratio of hydrogen to element is 5 times or more and 200 times or less, preferably 50 times or more and 150 times or less. More preferably, it is 100 times.
0238Typical examples of amorphous semiconductors include hydride amorphous silicon and crystalline semiconductors. A typical example is polysilicon. For polysilicon (polycrystalline silicon) So-called polysilicon, which is formed through a process temperature of 800 ° C or higher, is used as the main material. Main materials are high-temperature polysilicon and polysilicon formed at a process temperature of 600 ° C or less. Amorphous silicon is used in the so-called low-temperature polysilicon, and elements that promote crystallization are used. It contains polysilicon, which is a crystallized con. Of course, as mentioned above, microcrystals A semiconductor or a semiconductor having a crystal phase as a part of the semiconductor layer can also be used.
0239In addition to simple substances such as silicon (Si) and germanium (Ge) as semiconductor materials. Also for compound semiconductors such as GaAs, InP, SiC, ZnSe, GaN, SiGe, etc. Can be
0240When a crystalline semiconductor film is used for the semiconductor layer, there are various methods for producing the crystalline semiconductor film. Method (laser crystallization method, thermal crystallization method, or using elements that promote crystallization such as nickel Thermal crystallization method, etc.) may be used. In addition, the crystallite crystal semiconductor, which is SAS, is irradiated with a laser to crystallize it. It can also be crystallized to increase crystallinity. Amorphous if no elements that promote crystallization are introduced By heating the silicon film at 500 ° C for 1 hour in a nitrogen atmosphere before irradiating it with laser light. The hydrogen concentration of the amorphous silicon film is 1 x 10<sup>20</sup>atoms / cm<sup>3</sup>Release to the following. This is because when a laser beam is applied to an amorphous silicon film containing a large amount of hydrogen, the amorphous silicon film is destroyed. Because it will end up.
0241As a method of introducing a metal element into an amorphous semiconductor film, the metal element is introduced into the table of the amorphous semiconductor film. There is no particular limitation as long as it is a method that can exist on the surface or inside the surface, for example, a sputtering method or CVD. Method, plasma treatment method (including plasma CVD method), adsorption method, method of applying metal salt solution Can be used. Of these, the method using a solution is simple and adjusts the concentration of metal elements. Is useful in that it is easy to do. At this time, the wettability of the surface of the amorphous semiconductor film is improved. Good, UV light in an oxygen atmosphere to spread the aqueous solution over the entire surface of the amorphous semiconductor film Irradiation, thermal oxidation method, treatment with ozone water containing hydroxyl radicals or hydrogen peroxide, etc. Therefore, it is desirable to form an oxide film.
0242In addition, in the crystallization step of crystallizing an amorphous semiconductor film to form a crystalline semiconductor film, an amorphous semiconducting material is formed. Heat treatment (550) by adding elements that promote crystallization (also referred to as catalyst elements and metal elements) to the body membrane. Crystallization may be carried out at ° C to 750 ° C for 3 minutes to 24 hours). Promotes (promotes) crystallization Elements include iron (Fe), nickel (Ni), cobalt (Co), and ruthenium (Ru). ), Rhodium (Rh), Palladium (Pd), Osmium (Os), Iridium (Ir) , Platinum (Pt), copper (Cu) and gold (Au). Can be done.
0243In order to remove or reduce elements that promote crystallization from the crystalline semiconductor film, the crystalline semiconductor film is used. In contact with each other, a semiconductor film containing an impurity element is formed to function as a gettering sink. Not Pure elements include impurity elements that impart n-type, impurity elements that impart p-type, and rare gas elements. Etc. can be used, for example, phosphorus (P), nitrogen (N), arsenic (As), antimony ( Sb), Bismuth (Bi), Boron (B), Helium (He), Neon (Ne), Argo (Ar), Kr (Krypton), Xe (Xenon) for one or more selected species Can be A semi-crystalline semiconductor film containing an element that promotes crystallization and a semi-containing noble gas element A conductor film is formed and heat treatment (3 minutes to 24 hours at 550 ° C to 750 ° C) is performed. Crystalline semiconductor The element that promotes crystallization contained in the film moves into the semiconductor film containing the noble gas element and is crystalline. Elements that promote crystallization in the semiconductor film are removed or reduced. Then gettering thin Remove the semiconductor film containing the noble gas element that has become a problem.
0244Crystallization of the amorphous semiconductor film may be a combination of heat treatment and crystallization by laser irradiation. Heat treatment or laser light irradiation may be performed independently or multiple times.
0245Further, the crystalline semiconductor film may be formed directly on the substrate by the plasma method. Also, plasma The crystalline semiconductor film may be selectively formed on the substrate by using the method.
0246Further, an oxide semiconductor may be used for the semiconductor layer. For example, zinc oxide (ZnO), tin oxide (SnO<sub>2</sub>) Etc. can also be used. When ZnO is used as a semiconductor layer, the gate insulating layer Y<sub>2</sub>O<sub>3</sub>, Al<sub>2</sub>O<sub>3</sub>, TiO<sub>2</sub>, Gate electrode layer, source power using their stacking, etc. ITO, Au, Ti and the like can be used as the polar layer and the drain electrode layer. Also, In and Ga can also be added to ZnO.
0247InMO as an oxide semiconductor<sub>3</sub>(ZnO)<sub>m</sub>It is possible to use a thin film represented by (m> 0). it can. M is gallium (Ga), iron (Fe), nickel (Ni), manganese (M). It shows one metal element or a plurality of metal elements selected from n) and cobalt (Co). For example In addition to the case of Ga as M, the above other than Ga such as Ga and Ni or Ga and Fe May contain metallic elements. In addition, gold contained as M in the above oxide semiconductor In addition to genus elements, Fe, Ni and other transition metal elements as impurity elements, or acids of the transition metals Some contain ghosts. For example, an In-Ga-Zn-O system as an oxide semiconductor layer A non-single crystal film can be used.
0248Oxide semiconductor layer (InMO<sub>3</sub>(ZnO)<sub>m</sub>In-Ga-Zn-O system as (m> 0) membrane) InMO with M as another metallic element instead of non-single crystal film<sub>3</sub>(ZnO)<sub>m</sub>(m> 0) Membrane You may use it. In addition to the above, In addition to the above, In -Sn-Zn-O series, In-Al-Zn-O series, Sn-Ga-Zn-O series, Al-Ga- Zn-O system, Sn-Al-Zn-O system, In-Zn-O system, Sn-Zn-O system, Al-Z nO-based, In-O-based, Sn-O-based, and Zn-O-based oxide semiconductors can be applied. ..
0249This embodiment can be implemented in combination with the configurations described in other embodiments as appropriate. Is.
0250100 boards 101 board 102 Display element 110 board 111 board 112 board 113 board 114 Display element 115 Display element 120 board 121 board 122 board 123 board 124 Display element 125 Display element 126 backlight 200 Display control unit 201 CPU 203 Memory 205 Power supply 207 Power supply circuit 209 internal memory 211 Data entry 213 External memory 215 Video signal generation circuit 216 antenna 219 Operation unit 401 Gate electrode layer 402 Gate insulating layer 403 semiconductor layer 404a n<sup>+</sup>layer 405a Wiring layer 407 Insulating film 421 thin film transistor 701 First display panel 702 Second display panel 703 Third display panel 704 Fourth display panel 705 Display control unit 706A Scanning line drive circuit 706B Scanning line drive circuit 706C Scanning line drive circuit 706D Scan line drive circuit 707A 1st display 707B 2nd display 707C 3rd display 707D 4th display 708 pixels 709A optical sensor 709B optical sensor 709C optical sensor 709D optical sensor 710 pixel circuit 711 Light intensity comparison circuit 712 CPU 713 internal memory 714 Video signal generation circuit 714A signal line drive circuit 714B signal line drive circuit 714C signal line drive circuit 714D signal line drive circuit 715 Power supply circuit 715A power supply circuit 715B power supply circuit 715C power supply circuit 715D Power supply circuit 716 Signal transmitter / receiver 717 power supply 718 Operation unit 719 Antenna part 920 wiring 921 Stress concentration area 922a Notch 922b Notch 923 Encapsulation board 924 Element substrate 925 Reinforcing board 4005 Sealing material 4008 liquid crystal layer 4010 thin film transistor 4011 thin film transistor 4013 Liquid crystal element 4015 Connection terminal electrode 4016 terminal electrode 4019 Anisotropic conductive film 4020 Insulation layer 4021 Insulation layer 4023 Insulation film 4030 Electrode layer 4031 Electrode layer 4032 Insulation film 4301 1st display 4302 Third display 4304 Operation unit 4307 Second display 4308 Binding part 4309 Display button 4310 4th display 4311 First display panel 4312 Second display panel 4313 Third display panel 4321 Scanning line drive circuit 4322 Scan line drive circuit 4323 Signal line drive circuit 4324 FPC 4325 printed circuit board 4326 Stress concentration area 4329 FPC 4352 pixel TFT 4507 Display 4510 bulkhead 4511 Electroluminescent layer 4513 Light emitting element 4514 Filler 4612 Cavity 4613 Spherical particles 4614 Filler 4712 Liquid 4713 microcapsules 4812 space 4814 ribs 7002 arrow 4010a thin film transistor 4010b thin film transistor 4010c thin film transistor 4010d thin film transistor 4321a Scan line drive circuit 4321b Scan line drive circuit 4322a Scan line drive circuit 4322b Scan line drive circuit 4323a Signal line drive circuit 4323b signal line drive circuit 4324a FPC 4324b FPC 4327a printed circuit board 4327b printed circuit board 4331a Element substrate 4331b Element substrate 4332a Encapsulation board 4332b Encapsulation board 4350a hand 4350b hand 4615a black area 4615b White area 4715a Fine particles 4715b Fine particles 4815a Granular material 4815b Granular material
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Numbers
- Publication
- 5963899
- Application
- 28346
Titles2
- Japanese
- 表示装置及び電子機器
- English
- Display devices and electronic devices
Classification
- CPC, 36
- G06F1/1652
- H10K59/131
- G06F1/1616
- G06F1/1647
- G06F3/1423
- G06F3/147
- G09G3/20
- G09G3/344
- G09G2300/08
- G09G2310/0218
- G09G2310/0267
- G09G2310/0275
- G09G2310/0281
- G09G2330/021
- G09G2360/144
- G09G2380/14
- G09G3/035
- G09F9/40
- G09G2380/02
- H10K77/111
- G09F9/301
- H10K59/1213
- H10K59/87
- G09G3/3266
- G09G3/3275
- H10K2102/311
- G06F1/1635
- G02F1/1368
- G02F1/133305
- G02F1/13452
- G09G5/003
- G06F1/1643
- G09G3/2096
- G09G3/3225
- G09G3/3648
- G09G2330/02
- IPC, 5
- G09F9 00
- G09F9 30
- H01L29 786
- H01L21 336
- G09F9 40
