Wiring structure and joint box including the same

The present invention relates to a wiring structure and a joint box including the wiring structure.

In recent years, a plurality of electrical components have been used for electric appliances and automobiles (vehicles), and since a large number of wirings are connected to those electrical components, the connection relationship and power supply of those wirings are unified. A joint box has been proposed.

For example, in Patent Document 1, a plurality of wiring boards provided with metal foil wiring are laminated on a resin plate made of a three-dimensionally molded synthetic resin material, and pin terminal insertion holes are inserted in these laminated wiring boards. A metal receiving terminal is attached to the through hole constituting the pin terminal insertion hole of the wiring board of a specific layer, and the tab attached to the receiving terminal is connected to the metal foil wiring of the wiring board. , The pin terminal is inserted into the pin terminal insertion hole, electrically conducted with the metal foil wiring of the wiring board via the receiving terminal, and connected to the internal or adjacent electronic circuit unit by the protruding pin terminal. Further, a joint box using a wiring board is disclosed.

<p><patcit num="1"><text>Japanese Unexamined Patent Publication No. 2009-164632</text></patcit></p>

<p num="0005"> By the way, in the configuration in which the pin terminal is inserted into the pin terminal insertion hole of the substrate laminate as described in Patent Document 1, the metal foil wiring is performed on a wiring board other than the wiring board in which the pin terminal is conductive to the metal foil wiring. When a through hole is included in the portion provided with, it is necessary to prevent the metal foil wiring from coming into contact with the pin terminal. Therefore, for example, the hole of the metal foil wiring is formed larger than the through hole, and the metal foil wiring is formed. Measures are taken to separate the edge of the wire from the edge of the through hole. However, if the hole of the metal foil wiring is made larger than the through hole, the area of the metal foil wiring becomes smaller, so that the conductor resistance thereof increases and the heat dissipation property decreases.</p><p num="0006"> An object of the present invention is to prevent the metal foil wiring from coming into contact with the pin terminals in a wiring board other than the wiring board in which the pin terminals are conductive to the metal foil wiring.</p>

<p num="0007"> The wiring structure of the present invention Each is configured by stacking a plurality of wiring boards provided with metal foil wiring on an insulating substrate, and through holes formed in each of the plurality of wiring boards are connected in the substrate thickness direction. A board laminate with pin terminal insertion holes and The pin terminals inserted into the pin terminal insertion holes of the substrate laminate, With In the pin terminal insertion hole, the through hole constituting the pin terminal insertion hole of any of the plurality of wiring boards was electrically connected to the metal foil wiring of the wiring board and was inserted into the pin terminal insertion hole. While a terminal connection portion for externally holding the pin terminal is provided, the other of the pin terminal inserted into the pin terminal insertion hole in the through hole constituting the pin terminal insertion hole of the other wiring board. An insulating sleeve for restricting contact with the wiring board is internally fitted, and an upper and lower protective members provided so as to project the pin terminal and sandwich the substrate laminate are further provided, and the insulating sleeve is provided. Is integrally provided on the upper and / or lower protective members.</p><p num="0008"> The joint box of the present invention The wiring structure of the present invention is housed in a housing so that the pin terminals project, and a connector mounting portion including the pin terminals protruding from the housing is provided on the outside of the housing.</p>

<p num="0009"> According to the present invention, in the pin terminal insertion hole, the through hole forming the pin terminal insertion hole of any one of the plurality of wiring boards is electrically connected to the metal foil wiring of the wiring board and is inserted into the pin terminal insertion hole. While a terminal connection part for externally holding the pin terminal is provided, the through hole constituting the pin terminal insertion hole of the other wiring board is connected to the other wiring board of the pin terminal inserted through the pin terminal insertion hole. Since the insulating sleeve that regulates the contact of the pin terminal is internally fitted, it is sure to prevent the metal foil wiring from contacting the pin terminal on other wiring boards other than the wiring board in which the pin terminal conducts to the metal foil wiring. Can be done.</p>

<figref num="1">It is a schematic cross-sectional view of the joint box which concerns on embodiment.</figref><figref num="2">(A) and (b) are schematic plan views of an example of a wiring board and another example of a wiring board.</figref><figref num="3">(A) and (b) are partial cross-sectional views including the terminal insertion through hole of the insulating substrate.</figref><figref num="4">It is a partial cross-sectional view which shows the mounting structure of the metal foil wiring to the insulating substrate in the wiring board.</figref><figref num="5">It is a partial cross-sectional view which shows the attachment structure of the receiving terminal to the metal foil wiring in the wiring board.</figref><figref num="6">(A) and (b) are partial cross-sectional views of a wiring structure.</figref><figref num="7">It is a perspective view of a pin terminal.</figref><figref num="8">(A) to (e) are cross-sectional views of the pin portion of the pin terminal.</figref><figref num="9">(A) and (b) are explanatory views which show the insertion state of a pin terminal into a terminal holding through hole.</figref><figref num="10">(A) and (b) are partial cross-sectional views of a modified example of a wiring structure.</figref><figref num="11">It is explanatory drawing which shows the mounting structure of the substrate laminated body to the upper side | lower side protection member.</figref><figref num="12">It is explanatory drawing which shows the attachment structure of the wiring structure to the upper housing member.</figref><figref num="13">It is a front view of the substrate locking projection.</figref><figref num="14">It is explanatory drawing which shows the mounting structure of the circuit board to the board cover member.</figref>

Hereinafter, embodiments will be described in detail.

FIG. 1 shows a joint box A according to the present embodiment.

The joint box A according to the present embodiment is mounted on an electric product or an automobile (vehicle), and connectors provided on each of a large number of wires extending from electrical components, a power source, etc. are connected, and the connection relationship between the wires is connected. And the power supply is unified.

The joint box A according to the present embodiment has a configuration in which a thick plate-shaped wiring structure 10 is housed in a housing 20.

The wiring structure 10 has a configuration in which a plurality of pin terminals 12 are provided on the substrate laminate 11. Further, the substrate laminated body 11 has a configuration in which a plurality of wiring boards 13 are laminated.

2A and 2B show an example of the wiring board 13 and another example of the wiring board 13.

Each of the plurality of wiring boards 13 is provided with metal leaf wiring 16 on the insulating substrate 14 to which receiving terminals 15 are attached to both ends. The wiring board 13 may be provided with the metal foil wiring 16 on only one surface of the insulating substrate 14, or may be provided with the metal foil wiring 16 on both sides of the insulating substrate 14. The receiving terminal 15 is not particularly limited to both ends as shown in FIG. 2 as long as it is connected to the metal leaf wiring. Also, the number of receiving terminals 15 to be connected is not specified.

The insulating substrate 14 is made of, for example, a resin material. The resin material forming the insulating substrate 14 may be a thermoplastic resin or a thermosetting resin, but in the case of a thermosetting resin such as an epoxy resin, irregularities are formed on the substrate. In some cases, cutting is required, which causes complexity in the substrate manufacturing process and waste of materials. Therefore, if the mold is devised, unevenness on the substrate can be easily formed by injection molding, and the material can be formed. A thermoplastic resin that does not cause waste is preferable. As the thermoplastic resin, a polypropylene resin is preferable from the viewpoint of heat resistance, and a polypropylene resin containing 20% by mass of talc is more preferable from the viewpoint of shape retention. The thickness of the insulating substrate 14 is, for example, 1 to 5 mm. Terminal insertion through holes 17a and 17b for pin terminal insertion are formed at the same positions on the insulating substrate 14 of any of the wiring boards 13. The terminal insertion through holes 17a and 17b include a terminal insertion through hole 17a connected by a metal leaf wiring 16 via a receiving terminal 15 and other terminal insertion through holes 17b. The hole diameters of the terminal insertion through holes 17a and 17b are, for example, 1 to 10 mm. Examples of the shapes of the terminal insertion through holes 17a and 17b include a circular shape, a rectangular shape, a slit shape, and the like, corresponding to the shape of the pin terminal 12. A plurality of alignment protrusions 14a for wiring alignment are provided on the insulating substrate 14 so as to correspond to the terminal insertion through holes 17a connected by the metal leaf wiring 16 via the receiving terminal 15. Therefore, a terminal welding hole 14b is formed in the vicinity thereof. As a spacer for ensuring insulation between the insulating substrate 14 and the metal foil wiring 16 of the adjacent wiring board 13, for example, as shown in FIGS. 3A and 3B, the insulating substrate 14 is connected by the metal foil wiring 16. A substrate spacing convex portion 14c may be provided on the outer periphery of the terminal insertion through hole 17b or the like.

The metal foil wiring 16 is made of, for example, a punched copper foil or the like. The thickness of the metal leaf wiring 16 is, for example, 0.01 to 2.0 mm. Alignment holes 16a are formed in the metal foil wiring 16 by a drill or punch so as to correspond to the alignment protrusions 14a of the insulating substrate 14. The metal foil wiring 16 has holes having substantially the same shape corresponding to the terminal insertion through holes 17b that are not connected by the metal foil wiring 16, such as the portion of the terminal insertion through holes 17b on the lower side of the substrate shown in FIG. 2 (a). It is formed.

In the wiring board 13, the alignment projection 14a is inserted into the alignment hole 16a, and as shown in FIG. 4, the head of the alignment projection 14a is crushed and pulled out, so that the metal is formed on the insulating substrate 14. The foil wiring 16 is integrally provided. In addition, the metal leaf wiring 16 may be adhered to the insulating substrate 14 with an adhesive. As shown in FIG. 5, receiving terminals 15 are welded to each of both ends of the metal foil wiring 16 at the welded portion C at the position of the terminal welding hole 14b.

The receiving terminal 15 is made of, for example, a punched and pressed copper plate or the like. The thickness of the receiving terminal 15 is, for example, 0.1 to 3.0 mm. The receiving terminal 15 is formed with a terminal holding through hole 15a corresponding to the terminal insertion through hole 17a of the insulating substrate 14. The receiving terminal 15 has a substrate surface side portion 15b provided on the substrate surface, is continuous with the substrate surface side portion 15b, and is internally fitted into the terminal insertion through hole 17a to form a terminal holding through hole 15a. It has an annular terminal holding portion 15c.

The substrate laminate 11 has a configuration in which a plurality of wiring boards 13 are laminated. The substrate laminate 11 has, for example, 2 to 10 wiring boards 13, preferably 3 to 7, and a thickness of 2 to 50 mm, preferably 5 to 20 mm. In the substrate laminate 11, the plurality of wiring boards 13 are provided on the side where the metal foil wiring 16 is provided and the side where the metal foil wiring 16 is not provided in order to prevent short circuits between the metal foil wirings 16 of the wiring boards 13 adjacent to each other. It is preferable that the metal foil wirings 16 are laminated so as to face each other, but if the metal foil wirings 16 of the wiring boards 13 adjacent to each other are made conductive or if an insulating material can be provided to ensure the insulating property, the metal The sides on which the foil wiring 16 is provided may be laminated so as to face each other.

The substrate laminate 11 is provided with a plurality of pin terminal insertion holes 18 formed by connecting terminal insertion through holes 17b or terminal holding through holes 15a formed in each of the plurality of wiring boards 13 in the substrate thickness direction. There is. Each of the plurality of pin terminal insertion holes 18 is provided with a terminal holding portion 15c of the receiving terminal 15 in the terminal holding through hole 15a constituting any of the pin terminal insertion holes 18 of the plurality of wiring boards 13. In addition, the insulating sleeve 19 is internally fitted in the terminal insertion through hole 17b constituting the pin terminal insertion hole 18 of the wiring board 13. For example, as shown in FIG. 6A, in any of the pin terminal insertion holes 18 in the substrate laminate 11 in which the first to sixth wiring boards 13 are laminated in order from the upper layer, the third wiring board 13 is formed. In the embodiment in which the terminal holding through hole 15a provided with the receiving terminal 15 is configured and the terminal insertion through hole 17b is formed in the first, second, and fourth to sixth wiring boards 13, the first and second through holes 17b are formed. The upper insulating sleeve 19 is commonly fitted in the terminal insertion through hole 17b of the wiring board 13 of the above, and the lower insulating sleeve 19 is commonly fitted in the terminal insertion through hole 17b of the fourth to sixth wiring boards 13. And it is fitted inside. As shown in FIG. 6B, a terminal holding through hole 15a in which the receiving terminal 15 is provided is formed in the sixth wiring board 13, and a terminal insertion through hole 17b is formed in the second to sixth wiring boards 13. In this configuration, the insulating sleeve 19 is commonly fitted in the terminal insertion through holes 17b of the second to sixth wiring boards 13.

The plurality of pin terminals 12 include those having various shapes depending on the intended use, and all of the pin terminals 12 are disclosed in Patent Document 1 and Japanese Patent No. 3974924, and as shown in FIG. It has a pin portion 12a inserted into the pin terminal insertion hole 18 of the substrate laminate 11 and a terminal portion 12b protruding to the outside of the substrate laminate 11. The plurality of pin terminals 12 may include those in which the pin portion 12a is configured to penetrate the substrate laminate 11 and project to the outside. Further, the plurality of pin terminals 12 include those (for example, earth bus terminals) which are uniformly formed in the length direction and whose both ends are formed in terminal portions 12b protruding on both sides of the substrate laminate 11. You may.

Each of the plurality of pin terminals 12 is inserted into the pin terminal insertion holes 18 in the substrate laminate 11. The plurality of pin terminals 12 include a pin terminal 12 in which the terminal portion 12b protrudes from one side of the substrate laminate 11 and a pin terminal 12 in which the terminal portion 12b protrudes from the other side. It should be noted that any terminal portion 12b of the plurality of pin terminals 12 may be provided so as to project from only one side of the substrate laminate 11. Further, the pin terminal 12 is not inserted through all the pin terminal insertion holes 18, and there is also a pin terminal insertion hole 18 in which the pin terminal 12 is not inserted.

Here, as described above, in the pin terminal insertion hole 18 into which the pin terminal 12 is inserted, a wiring board is formed in the terminal holding through hole 15a forming the pin terminal insertion hole 18 of the plurality of wiring boards 13. A terminal connection portion that conducts with the metal foil wiring 16 of 13 and holds the pin terminal 12 inserted through the pin terminal insertion hole 18 by fitting is provided, while the pin terminal insertion hole 18 of the other wiring board 13 is configured. Since the insulating sleeve 19 for restricting the contact of the pin terminal 12 inserted through the pin terminal insertion hole 18 with the other wiring board 13 is internally fitted in the terminal insertion through hole 17b, the pin terminal 12 is wired with a metal foil. In other wiring boards 13 other than the wiring board 13 conducting on the 16th, it is possible to surely prevent the metal foil wiring 16 from coming into contact with the pin terminals 12. As a result, in the other wiring board 13, the metal leaf wiring 16 can be provided up to the terminal insertion through hole 17b as in the terminal insertion through hole 17b on the lower side of the substrate shown in FIG. 2A. The conductor resistance of the metal foil wiring 16 can be lowered and the heat dissipation can be improved.

The pin terminal 12 is made of, for example, a processed metal plate product. As the pin terminal 12, for example, as shown in FIG. 8A, the pin portion 12a has a configuration in which both side portions of the strip-shaped metal plate are folded inward twice to form a rectangular cross section. As shown in 8 (b), each of both side portions of the strip-shaped metal plate is folded inward and abutted against each other. As shown in FIG. 8 (c), the strip-shaped metal plate has a step in the thickness direction. As shown in FIG. 8 (d), the structure of the strip-shaped metal plate as it is, and as shown in FIG. 8 (e), each of both side portions of the strip-shaped metal plate. However, there is a configuration in which the metal is folded inward so as to have a space between them. Here, as the material of the metal plate, for example, copper, a copper alloy, a metal material coated with copper, or the like is applied. Further, if necessary, a Sn (tin) plated surface is applied. The thickness and width of the strip-shaped metal plate are appropriately set according to the current capacity flowing through the terminal to be manufactured.

It is preferable that the pin terminal 12 is electrically connected only to the metal foil wiring 16 of the plurality of wiring boards 13. It is structurally possible for the pin terminal 12 inserted through the pin terminal insertion hole 18 to conduct with the metal foil wiring 16 of the plurality of wiring boards 13, but in that case, the pin terminal inserted through the pin terminal insertion hole 18 is possible. The 12 is fitted and held in the terminal holding portions 15c of the plurality of receiving terminals 15, and the pin terminal 12 may be plastically deformed by the portion through which the terminal holding portion 15c of the first receiving terminal 15 is inserted. Therefore, there is a possibility that the reliability of the electrical contact with the terminal holding portion 15c of the receiving terminal 15 to be inserted thereafter becomes low. For example, when the pin terminal 12 is inserted into the circular pin terminal insertion hole 18, as shown in FIG. 9A, the pin terminal 12 has four corners pinned in the terminal holding portion 15c of the first receiving terminal 15. It is held in contact with the inside of the terminal insertion hole 18, but in the terminal holding portion 15c of the receiving terminal 15 to be inserted after that, when the corner portion is plastically deformed by the first receiving terminal 15, it is shown in FIG. 9 (b). As described above, there is a possibility that the four corners do not come into contact with the inside of the pin terminal insertion hole 18. However, if each pin terminal 12 is electrically connected only to the metal leaf wiring 16 of the plurality of wiring boards 13, high reliability of electrical contact of the pin terminal 12 to the metal foil wiring 16 can be obtained. it can.

As shown in FIGS. 10A and 10B, the wiring structure 10 includes plate-shaped upper and lower protective members 31 and 32 provided so as to sandwich the substrate laminate 11. preferable. Each of the upper and lower protective members 31 and 32 has a terminal insertion portion formed corresponding to the pin terminal insertion hole 18, and in the portion where the pin terminal 12 is inserted into the pin terminal insertion hole 18, a pin is formed through the terminal insertion portion. The terminal 12 is projected.

Each of the upper and lower protective members 31 and 32 is made of, for example, a resin material. This resin material may be a thermoplastic resin such as a polypropylene resin or an ABS resin, or may be a thermocurable resin such as an epoxy resin, but in the case of a thermocurable resin, when forming irregularities. Since cutting work is required, which causes complexity in the substrate manufacturing process and waste of material, it can be easily formed on the substrate by injection molding if the mold is devised, and waste of material is also generated. A thermoplastic resin that does not generate is preferable. The thickness of each of the upper and lower protective members 31 and 32 is, for example, 1 to 5 mm.

As shown in FIG. 11, the upper and lower protective members 31 and 32 are formed with positioning protrusions 31a in the former and positioning holes 32a corresponding to the latter in the latter, and the substrate laminate 11 is provided so as to correspond to the positioning protrusions 31a. Protrusion insertion holes 11a are also formed in each of the plurality of constituent wiring boards 13, and the positioning protrusions 31a penetrate the protrusion insertion holes 11a and the positioning holes 32a of the plurality of wiring boards 13 of the substrate laminate 11 to crush the head. The substrate laminate 11 may be packed by the upper and lower protective members 31 and 32 and integrated with the upper and lower protective members 31 and 32. According to such a configuration, the metal leaf wiring 16 and the receiving terminal 15 of each wiring board 13 can be protected without being exposed. The lower protective member 32 may have a positioning protrusion and the upper protective member 31 may have a corresponding positioning hole.

It is preferable that each of the upper and lower protective members 31 and 32 is provided with ribs on the outer surface, for example, in a grid pattern. According to such a configuration, the bending of the substrate laminate 11 can be regulated by the reinforcing effect of the ribs. If the substrate laminate 11 is bent, the workability of alignment when it is housed in the housing 20 may be hindered.

It is preferable that the upper and / or lower protective members 31 and 32 are integrally provided with the insulating sleeve 19. For example, as shown in FIG. 10A, in any of the pin terminal insertion holes 18 in the substrate laminate 11 in which the first to sixth wiring boards 13 are laminated in order from the upper layer, the third wiring board 13 is formed. In the embodiment in which the terminal holding through hole 15a provided with the receiving terminal 15 is configured and the terminal insertion through hole 17b is formed in the first, second, and fourth to sixth wiring boards 13, the first and second through holes 17b are formed. Insulation sleeve 19 integrally provided with the upper protective member 31 is commonly fitted in the terminal insertion through hole 17b of the wiring board 13 of the above, and also in the terminal insertion through hole 17b of the fourth to sixth wiring boards 13. An insulating sleeve 19 integrally provided with the lower protective member 32 is commonly fitted inside. As shown in FIG. 10B, a terminal holding through hole 15a in which the receiving terminal 15 is provided is formed in the sixth wiring board 13, and a terminal insertion through hole 17b is formed in the second to sixth wiring boards 13. In this configuration, the insulating sleeve 19 integrally provided with the upper protective member 31 is commonly fitted in the terminal insertion through hole 17b of the second to sixth wiring boards 13.

The housing 20 is composed of an upper housing member 21 provided on the upper side of the wiring structure 10 and a lower housing member 22 provided on the lower side. Each of the upper and lower housing members 21 and 22 is made of, for example, a resin material. This resin material may be a thermoplastic resin such as a polypropylene resin or an ABS resin, or may be a thermocurable resin such as an epoxy resin, but in the case of a thermocurable resin, when forming irregularities. Since cutting work is required, which causes complexity in the substrate manufacturing process and waste of material, it can be easily formed on the substrate by injection molding if the mold is devised, and waste of material is also generated. A thermoplastic resin that does not generate is preferable. The thickness of each of the upper and lower housing members 21 and 22 is, for example, 1 to 5 mm.

As shown in FIG. 12, a mounting protrusion 21a is formed on the upper housing member 21, and a mounting hole 10a is also formed on the wiring structure 10 so as to correspond to the mounting protrusion 21a. The head is crushed or welded through the mounting hole 10a of the above, and the wiring structure 10 is integrally attached. The wiring structure 10 may be integrally attached to the lower housing member 22.

Terminal insertion portions are formed in the upper and lower housing members 21 and 22 corresponding to the pin terminal insertion holes 18 of the wiring structure 10, and the pin terminals 12 are inserted into the pin terminal insertion holes 18. Then, the terminal portion 12b of the pin terminal 12 of the wiring structure 10 projects through it. Then, on each of the upper and lower housing members 21 and 22, a single or a plurality of pin terminals 12 and / or a single or a plurality of pin terminals 12 projecting from the terminal insertion portions do not project to the outside thereof, respectively. A plurality of connector mounting portions 23 are provided so as to be surrounded by a wall including a plurality of terminal insertion portions. A connector provided for each of a large number of wirings extending from electrical components and the like is connected to each connector mounting portion 23.

The upper housing member 21 is surrounded by a wall including a single or a plurality of pin terminals 12 protruding from the terminal insertion portion and / or a single or a plurality of terminal insertion portions in which the pin terminals 12 do not protrude from the outside thereof. The board mounting portion 24 configured as described above is provided, and the board mounting portion 24 is provided with the circuit board 25 on which the electronic component 25a is mounted. The circuit board 25 is provided with a terminal receiving portion corresponding to the pin terminal 12 of the board mounting portion 24, and is provided with the pin terminal 12 corresponding to the terminal insertion portion where the pin terminal 12 does not protrude. There is. The circuit board 25 holds the pin terminal 12 whose terminal receiving portion protrudes from the terminal insertion portion, and the pin terminal 12 is inserted and held in the pin terminal insertion hole 18 via the terminal insertion portion to be directly electrically operated. Is attached to the wiring structure 10 via the upper housing member 21. The pin terminal 12 and the terminal receiving portion may be fixed by a solder connection. Examples of the circuit board 25 include a voltage control circuit board, an earth leakage detection circuit board, and the like. Further, the circuit board 25 may be provided on the lower housing member 22.

The upper housing member 21 is provided with a board cover member 26 so as to cover the board mounting portion 24. The substrate cover member 26 is preferably made of, for example, the same resin material as the upper housing member 21. The board cover member 26 is provided with a plurality of board locking projections 27 on the upper housing member 21 side. As shown in FIG. 13, the substrate locking protrusion 27 is integrally provided with a truncated cone-shaped head 27b at the tip of the protrusion main body 27a, and a vertically split notch is formed on the top surface side of the head 27b. As a result, the outer diameter of the head 27b can be elastically reduced. As shown in FIG. 14, the circuit board 25 is formed with a protrusion insertion hole 25b corresponding to the board locking protrusion 27, and the substrate locking protrusion 27 is outside the head 27b in the protrusion insertion hole 25b. The head 27b is locked and fixed to the substrate cover member 26 by a snap fit that is inserted in a reduced diameter state and then elastically returns to the head 27b. Therefore, the circuit board 25 is attached to the board mounting portion 24 of the upper housing member 21 in a unit state in which the circuit board 25 is locked and fixed to the board cover member 26. According to this configuration, since the circuit board 25 is locked and fixed to the board cover member 26, the circuit board 25 can be easily attached to the board cover member 26, and even when the circuit board 25 is replaced. The substrate cover member 26 can be reused.

The board cover member 26 is provided with a guide ridge 28, and the upper housing member 21 is provided with a guide groove (not shown) that meshes with the guide ridge 28. According to such a configuration, problems such as the substrate cover member 26 being obliquely attached to the upper housing member 21 are eliminated, the attachment work is facilitated, and the shape-maintaining effect of the substrate cover member 26 is achieved by the guide ridge 28. Can be obtained. Further, the substrate cover member 26 has a vent for improving heat dissipation, a reinforcing rib (not shown) for maintaining the shape on the inner side surface, and a locking fixing portion (not shown) for the upper housing member 21. ) Are provided, respectively.

The upper housing member 21 is provided with a switch mounting portion 29 so as to include a single or a plurality of pin terminals 12 and / or a single or a plurality of terminal insertion portions in which the pin terminals 12 do not protrude from the terminal insertion portions. Has been done. A switch component for voltage switching is attached to the switch mounting portion 29 directly or via a relay connector, and is configured to be electrically connected to the circuit board 25.

The present invention is useful for wiring structures and joint boxes including them.

A joint box 10 Wiring structure 11 Substrate laminate 12-pin terminal 13 Wiring board 14 Insulated substrate 15c terminal holding part 16 Metal leaf wiring 17a, 17b terminal insertion through hole 18-pin terminal insertion hole 19 Insulation sleeve 20 housing 23 Connector mounting part