Liquid crystal display

The present invention relates to a liquid crystal display including a color filter layer and a backlight module. In particular, the backlight module includes an ultraviolet unit, and the color filter layer can absorb ultraviolet rays from the ultraviolet unit and emit a green light beam. It relates to a liquid crystal display including a possible wavelength conversion material.

A liquid crystal display (LCD) is not a self-luminous display. That is, the LCD needs to use a self-luminous device as a light source. This light source is called a backlight module. There are generally two types of backlight modules: direct-type backlights and edge-type backlights. Conventional backlight modules use a lamp tube, for example, a Cold Cathode Florescent Lamp (CCFL) as a light source. However, CCFLs have a low Color Rendering Index (CRI) and cannot reproduce the actual color of an object.

Light Emitting Diodes (LEDs) have a high CRI and are attracting attention as a light source for backlight modules. LEDs have the advantages of low volume, low power consumption, fast reaction time, long operating time, good durability and so on. Color filters are commonly used in LCDs to separate the three primary colors, namely red, blue and green, from white light. By mixing the three primary colors in different proportions, various desired colors can be produced.

The method of generating white light by the LED is as follows. (1), yellow phosphorescent body, generally YAG (Yttrium Aluminum) Garnet: YAG) Uses a phosphorescent body and a blue LED. This method is the most common method. However, since the white light thus generated is produced by mixing blue light and yellow light, the spectrum mainly contains two wavelength components of 460 nm and 550 nm, that is, this kind of light. White light lacks the components of red and green light. Therefore, an LED using this kind of white light cannot display the true color of an object. (2) The blue LED excites red and green phosphorescent bodies to generate red and green light, and mixes red light, green light and blue light to produce white. However, there is severe crosstalk between the red, blue and green produced by this method, i.e., the red, blue and green color bands overlap. (3) This is a method of exciting three or more phosphorescent bodies with an ultraviolet LED to generate three colors of red, blue and green. However, this method also causes serious crosstalk. (4), white light is generated by three separate red, blue and green LEDs. White light by this method can obtain more than 105% NTSC, which is 1.5 times higher than the conventional CCFL. However, due to the different lighting efficiencies of LEDs of different colors, the number of red, blue and green LEDs required in practice will differ. In general, green LEDs are the least efficient, so more green LEDs need to be used to balance the amount of light produced by LEDs of other colors. However, the larger the number of LEDs, the higher the cost and the larger the space for storing the LEDs.

<p><patcit num="1"><text>US2005 / 0001537A1</text></patcit><patcit num="2"><text>US2004 / 0061810A1</text></patcit><patcit num="3"><text>US6686691</text></patcit><patcit num="4"><text>US6791636</text></patcit><patcit num="5"><text>US6844903</text></patcit><patcit num="6"><text>US6809781</text></patcit><patcit num="7"><text>US6252254</text></patcit><patcit num="8"><text>US6255670</text></patcit><patcit num="9"><text>US6278135</text></patcit><patcit num="10"><text>US6294800</text></patcit><patcit num="11"><text>EP1138747</text></patcit><patcit num="12"><text>WO0189000</text></patcit><patcit num="13"><text>WO0189001</text></patcit></p>

<p> An object of the present invention is to provide a liquid crystal display including a color filter layer and a backlight module.</p>

<p> The LCD of the present invention includes a backlight module including an ultraviolet unit, a liquid crystal layer that controls light from the backlight module, a plurality of pixels, and a wavelength conversion material formed on at least one of the plurality of pixels. It has a color filter layer. The wavelength conversion material emits green light when irradiated by the ultraviolet unit.</p><p> The backlight module further includes a red light unit and a blue light unit. Preferably, at least one of the ultraviolet unit, the red light unit and the blue light unit is an LED.</p><p> The color filter layer preferably includes a reflective layer that reflects a predetermined light flux from the backlight module. More preferably, the color filter layer comprises a Distributed Bragg Reflector (DBR) that reflects the luminous flux from the backlight module.</p>

<p> According to an embodiment of the present invention, it is possible to provide a liquid crystal display including a color filter layer and a backlight module.</p>

<figref num="1">It is a figure which concerns on the Example of this invention.</figref><figref num="2a">It is a figure which shows the light diffusing apparatus and the optical adjustment surface in an Example of this invention.</figref><figref num="2b">It is a figure which shows the light diffusing apparatus and the optical adjustment surface in an Example of this invention.</figref><figref num="2c">It is a figure which shows the light diffusing apparatus and the optical adjustment surface in an Example of this invention.</figref><figref num="2d">It is a figure which shows the light diffusing apparatus and the optical adjustment surface in an Example of this invention.</figref><figref num="2e">It is a figure which shows the light diffusing apparatus and the optical adjustment surface in an Example of this invention.</figref><figref num="3a">It is a figure which shows the structure of the semiconductor light emitting device unit in the Example of this invention.</figref><figref num="3b">It is a figure which shows the structure of the semiconductor light emitting device unit in the Example of this invention.</figref>

Next, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings.

<p> FIG. 1 is a diagram showing the structure of the LCD 10 of the present invention.</p><p> The LCD 10 includes a backlight module 11 as a light source. Since the LCD 10 displays an image in the visible light wave range, the backlight module 11 must have a light source in the visible light wave range. In general, the backlight module 11 emits white light, and preferably the white light is produced by the light of the three primary colors from the red, blue and green LEDs.</p><p> In order to improve the illumination efficiency of green light, the backlight module 11 of the present invention includes an ultraviolet light emitter, for example, an ultraviolet unit 1101, preferably an ultraviolet LED, and a wavelength conversion capable of absorbing ultraviolet rays and producing green. Use material 1402 (P in Figure 1). Here, the wavelength of ultraviolet rays is 10 nm to 420 nm, preferably 200 nm to 420 nm. White light is generated by mixing red light from the red light unit, blue light from the blue light unit, and green light from the wavelength conversion material 1402 irradiated by the ultraviolet unit 1101. The red light unit 1102 and the blue light unit 1103 include LEDs, fluorescent lamps, incandescent lamps and halogen lamps. However, it is not limited to these.</p><p> The wavelength conversion material 1402 is, for example, a phosphorescent body that can be excited by ultraviolet rays from the ultraviolet unit 1101 to generate green light. When the wavelength of ultraviolet rays from the ultraviolet unit 1101 is 200 to 420 nm, preferably 360 to 420 nm, an alkaline earth silicate is used as the wavelength conversion material 1402, preferably a europium-activated alkaline earth silicate. To use. The composition of europium-activated alkaline earth silicate is (SrBaMg)₂SiO₄: Eu. The FWHM (Full Width Half Maximum) of the luminous flux produced by these phosphors is smaller than the FWHM of green light emitted by 35 nm and InGaN LEDs. As a europium-activated alkaline earth silicate, a product of Intematrix Corporation (CA, USA), eg G400^TM/ G380^TM/ G360^TMWas used.</p><p> Other phosphors that are excited by UV light and capable of emitting green light are, for example, (Ba._1-xyzCa_xSr_yEU_z)₂(Mg_1-wZn_w) Si₂O₇(Here, x + y + z = 1, 0.05&gt; z&gt; 0 and w &lt;0.05), Ca₈Mg (SiO)₄)₄Cl₂: Eu, Mn, Ba₂SiO₄: Eu, Ba₂MgSi₂O₇: Eu, BaAl₂O₄: Eu, SrAl₂O₄: Eu or BaMg₂Al₁₆O₂₇: Eu etc., and these excited wavelengths are 330 nm to 420 nm.</p><p> The number of ultraviolet unit 1101, red light unit 1102 and blue light unit is determined by the size of LCD10, the brightness required for LCD10, the respective light densities of units 1101, 1102 and 1103, and the optical design inside the backlight module 11. .. However, it is not limited to these. Red, blue and green LEDs are red-blue-green (purple), red-green (purple) -blue, blue-green (purple) -red, blue-red-green (purple), green (purple) -red. It can be arranged in the order of-blue, green (purple) -blue-red, red-blue-green (purple) -red, or red-green (purple) -blue-red.</p><p> In this embodiment, since the ultraviolet light is invisible light, the mixed light 12 from the backlight module 11 simply displays a mixture of red light and blue light, that is, purple-red light.</p><p> The liquid crystal layer 13 includes a liquid crystal material and a thin film transistor (TFT) layer. When a bias voltage is applied to the TFT layer, the liquid crystal molecules are tilted or rotated, and the amount of mixed light passing through the liquid crystal layer 13 changes accordingly.</p><p> The mixed light 12 passes through the liquid crystal layer 13 and is incident on the color filter layer 14. The color filter layer 14 is usually formed on a glass substrate and contains a plurality of pixels (R, P, B in FIG. 1). A pixel set is usually formed by at least three monochromatic pixels that separate red, blue and green light from the mixed light 12.</p><p> In this embodiment, the wavelength conversion material 1402 is provided within one pixel in the pixel set (referred to as green pixel P). The wavelength conversion material 1402 is excited by ultraviolet rays from the ultraviolet unit 1101 and emits green light (G). The other two pixels in each pixel set are the red pixel (R) and the blue pixel (B). The red and blue pixels consist of, for example, organic materials. The red pixel (R) allows only the mixed light red light to pass through, and the blue pixel (B) allows only the mixed light blue light to pass through. As a result, the red pixel (R) displays the red light, and the blue pixel (B) displays the blue light.</p><p> The red pixels (R) and blue pixels (B) may consist of phosphorescent bodies that are excited by ultraviolet light and capable of emitting red and blue light, instead of organic materials. Examples of phosphorescent bodies that are excited by ultraviolet rays and capable of emitting red light include Y.₂O₂S: Eu, Bi, Y₂O₃S: Eu, Bi or 3.5MgO.0.5MgF₂.GeO₂: Mn⁺⁴These excitation wavelengths are 330 nm to 420 mm. Examples of phosphorescent bodies that are excited by ultraviolet rays and capable of emitting blue light include BaMg.₂Al₁₆O₂₇: Eu, (SaBaCa)₅(PO₄)₃Cl: Eu or Sr₄Al₁₄O₂₅There are: Eu, and these excitation wavelengths are 220 nm to 330 mm.</p><p> Each pixel passes only part of the white light, in other words, the amount of light emitted through the pixel is less than the amount of incident light because some of the light incident on the pixel is absorbed by the pixel. Correspondingly, the light emission efficiency is lowered. To improve the light emission efficiency, the fractionated blur reflector (DBR) 1404 is formed in front of the filter layer 1401 to reflect light of the selected wavelength. As an example, a DBR layer capable of reflecting blue light or ultraviolet light is formed in front of the red pixel (R) so as to prevent the blue light or ultraviolet light from being absorbed by the red pixel (R), and reflects blue light or ultraviolet light. Then, it is incident on a blue pixel (B) or a green pixel (G). Use the corresponding DBR for the other pixels. Further, since the ultraviolet rays are reflected by the DBR1404, it is possible to prevent the ultraviolet rays from entering the LCD 10.</p><p> Further, the LCD 10 may include other optical films such as a prism sheet, diffusing means and polarizing means. In this case, the prism sheet and the diffusing means are generally provided in the backlight module 11 to homogenize the light from the light emitting units 1101 to 1103 and generate the desired mixed light 12. Since the polarizing means is generally used together with the liquid crystal layer 13, the mixed light 12 is polarized before it enters the liquid crystal layer 13.</p><p> Although the method of exciting a wavelength conversion material with ultraviolet rays to generate green light can improve the emission efficiency of green light, the components in LCD10 are particularly plastic elements such as prism sheets, diffusion means and polarizing means. It is easily damaged by irradiation with ultraviolet rays. Therefore, those optical films or plastic elements are preferably made of UV resistant material.</p>

<p> As shown in FIG. 2a, the backlight module of this embodiment includes a light diffusing device 15 and / or a light flux adjusting surface 16 having a wavy array that directs light, and light from each of the light emitting units 1101 to 1103. Is mixed / diffused into the liquid crystal layer 13.</p><p> Further, as shown in FIG. 2b, the light diffusing device 15 includes a pterygoid protrusion 1501, a recess 1502, and a light incident surface 1503. The light diffusing device 15 is formed in the vertical direction 1504. The recess 1502 is installed away from the light incident surface 1503, preferably on the opposite side of the light incident surface 1503. The first wavy array 1601 is formed on the optical control surface 16 and diffuses and / or mixes the light fluxes from the ultraviolet unit 1101, the red light unit 1102 and / or the blue light unit 1103. Therefore, it is avoided to generate a light spot in the backlight module or to display light of an unmixed color. A part of the light incident on the light incident surface 1503 of the light diffusing device 15 is totally reflected to both sides, that is, the wing-shaped protrusion 1501 in the recess 1502, and the other part passes through the recess 1502 and is a light diffusing device. It is refracted according to Snell's law due to the difference in refractive index between 15 and the surrounding optical medium. A part of the luminous flux is totally reflected in the recess 1502 and directed to the pterygoid protrusion 1501, so that the amount of light emitted from the recess 1502 is reduced. Preferably, the recess 1502 has a V-shaped or U-shaped shape. The light flux incident on the pterygoid process 1501 can be refracted or reflected, or emitted directly from the light diffusing device 15. For example, the light flux incident on the light diffusing device 15 at a predetermined angle is gradually mixed with light of uniform color by a plurality of total reflections on the pterygoid process 1501. The light incident surface 1503 may be not only a flat surface but also a concave surface or another shape capable of receiving light.</p><p> The first wavy array 1601 may be formed on the optical control surface 16. The optical adjustment surface 16 and the first wavy array 1601 may be formed on the light incident surface 1503 of the light diffusing device 15. The first wavy array 1601 is a wavy surface. The wavy surface has a wave propagation direction, that is, an arrangement direction or a wavy surface direction of the first wavy arrangement. The wave structure formed in the first wavy array 1601 may be a plurality of microlenses. The luminous flux that has passed through the microlens is diffused. The diameter of each microlens is 50-60 μm. When the first wavy array 1601 is arranged continuously, the distance between two consecutive wave peaks or valleys is substantially 100 to 200 μm.</p><p> The optical adjusting surface 16 may be formed in the light diffusing device 15 by combining two light flux transmitting materials having different refractive indexes, depending on the situation. The wavy array is then formed at the interface between the two luminous flux transmitting materials, as shown in FIG. 2c. The shaded area contains a material that is different from the material of the other parts. As shown in FIG. 2e, the first wavy array 1601 may be formed not only on the light incident surface 1503 but also on the pterygoid projection 1501 and / and the recess 1502.</p><p> The material of the light diffuser 15 is not limited to acrylic resin, COC, PMMA, PC, PC / PMMA, polyetherimide, fluororesin, silicon, or a combination thereof. Alternatively, the material of the light diffusing device 12 may be any other transparent material.</p><p> As shown in FIG. 2d, the optical adjustment surface 16 may be formed on an optical film 17 having an opposite first surface 1701 and a second surface 1702. The optical adjustment surface 16 is formed on one of the first surface 1701 and the second surface 1702. When the optical control surface 16 is formed on the first surface 1701, the first wavy array 1601 is formed on the first surface. The optical film 17 is provided on the light diffusing device 15 or in the region between the light diffusing device 15 and the light emitting units 1101 to 1103. Further, the second optical adjustment surface 18 may be formed on the second surface 1702, in which case the second wavy array 1801 is formed on the second optical adjustment surface 18. The arrangement direction of the second wavy arrangement 1801 is different from the arrangement direction of the first wavy arrangement 1601. In this case, the interference pattern is generated by stacking the first wavy array 1601 and the second wavy array 1801 in different arrangement directions. By appropriately adjusting the first wavy array 1601 and the second wavy array 1801, the luminous flux passing through the interference pattern can be redistributed. Optical film 17 is S-Light Opt Electronics Inc., Produced by Taiwan.</p><p> The optical adjustment surfaces 16 and 18 are not only provided on one of the light diffusing device 15 and the optical film 17, but may be provided on both the light diffusing device 15 and the optical film 17. The first wavy array 1601 and the second wavy array 1801 may have the same or different wave sizes, wave shapes and wave periods.</p><p> The arrangement direction of the light emitting units 1101 to 1103 is the arrangement direction of the first wavy array 1601, that is, when parallel to the wave plane direction, the light passes through the first wavy array 1601 and then the first wavy array 1601. A light pattern that is substantially parallel to the wave plane direction is formed. When the arrangement direction of the light sources 1101 to 1103 and the wave surface direction of the first wavy array 1601 are formed in a straight line, the light is distributed in a straight line. When the arrangement direction of the light sources 1101 to 1103 and the wave surface direction of the first wavy array 1601 are formed in a curved or radial pattern, the light is distributed in the curved or radial pattern. Theoretically, when the arrangement direction of the light sources 1101 to 1103 is substantially parallel to the wave plane direction of the first wavy arrangement 1601, the light from the light sources 1101 to 1103 has a light pattern along the direction extending in the wave plane direction. It is distributed.</p>

<p> In this embodiment, the light emitting unit is a semiconductor light emitting device, for example, an LED, preferably an LED die. As the power increases, so does the heat generated by the LEDs. In order to provide the heat dissipation function of the LED, the present invention provides the ultraviolet unit 1101, the red light unit 1102 and / or the blue light unit 1103 on the composite substrate 1901 as shown in FIG. 3a.</p><p> The wiring layout carrier 1903 is coupled to the composite substrate 1901 by a coupling structure 1902. The ultraviolet unit 1101, the red light unit 1102 and / or the blue light unit 1103 are fixed to the recess 1906. The conductive wire 1905 or other electrical coupling means couples the ultraviolet unit 1101, the red light unit 1102 and / or the blue unit 1103 to the electrical contacts 1904 formed on the wiring layout carrier 1903. The difference in the coefficient of thermal expansion between the light emitting units 1101 to 1103 and the composite substrate 1901 is substantially 10 × 10.^-6Since it is / ° C or less, the thermal stress between the light emitting units 1101 to 1103 and the composite substrate 1901 can be suppressed.</p><p> The coefficient of thermal expansion of LED dies is generally 1x10.^-6/ ° C ~ 10 × 10^-6/ ° C. For example, the coefficient of thermal expansion of GaN is about 5.4 × 10.^-6At / ° C, the coefficient of thermal expansion of InP is about 4.6 × 10.^-6At / ° C, the coefficient of thermal expansion of GaP is about 5.3 × 10.^-6/ ° C. In order to suppress the extra thermal stress between the light emitting units 1101 to 1103 and the contact material thereof, the composite substrate 1901 is used as a support base for the semiconductor light emitting device unit 19. The composite substrate 1901 is also used as a heat radiating medium. The coefficient of thermal expansion of the composite substrate 1901 is 10 × 10.^-6It is preferably less than / ° C.</p><p> The above composites generally consist of two or more materials, which do not form other molecular or atomic structures. Generally speaking, this composite material can combine the advantages of each material to obtain better physical performance than the original material. This composite material generally has advantages such as light weight, high strength, and excellent thermal properties. This composite material is selected from a metal-based composite (MMC), a polymer Matrix Composite (PMC), and a ceramic-based composite (CMC). These composites are produced by mixing carbon or ceramic fibers with metals, polymers and ceramics, respectively. In order to transfer the heat generated by the semiconductor light emitting device 14, the thermal conductivity coefficient is 150 W / mK or more, and the coefficient of thermal expansion is 10 × 10.^-6Metal-based composites below / ° C, for example aluminum-based composites (thermal conductivity of about 100-640 W / mK, thermal expansion coefficient of 5-10 × 10)^-6It is desirable to use (/ ° C) to form the composite substrate 1901. Of course, the polymer-based composite and the ceramic-based composite may be used according to actual requirements.</p><p> The wiring layout carrier 1903 is, for example, a printed wiring board, a flexible printed circuit, and a semiconductor substrate, for example, a silicon substrate or a ceramic substrate. The semiconductor substrate used as the wiring layout carrier 1903 uses various semiconductor processing processes such as etching and sputtering to form a desired circuit on the semiconductor substrate. These processes may also be integrated with the process of forming semiconductor light emitting diodes. Semiconductor substrates, such as silicon substrates, have the desired thermal conductivity (their thermal conductivity and coefficient of thermal expansion are 150 W / mK and 4 × 10, respectively.^-6/ ° C). Since the thermal conductivity coefficient and the coefficient of thermal expansion of the substrate of the metal-based composite material are close to the thermal conductivity coefficient and the coefficient of thermal expansion of the silicon substrate, the thermal stress between two different materials is effectively suppressed and the thermal conductivity efficiency is improved. Will be done. Of course, the printed wiring board and the flexible printed circuit may be used according to the actual requirements.</p><p> The wiring layout carrier 1903 is coupled to the composite substrate 1901 by a coupling structure 1902. The bonded structure 1902 is formed from an adhesive material, preferably a flexible adhesive layer, and more preferably a flexible adhesive layer capable of maintaining an adhesive state at room temperature or medium / low temperature. The material of the flexible adhesive layer is resin (Benzocyclobutene: BCB), epoxy, polyimide, SOG (Spin On Glass) material, silicon, solder, or a combination thereof. However, it is not limited to these. These flexible adhesive materials can be cured at relatively low temperatures (generally below 300 ° C), which allows between the composite substrate 1901 and the light emitting units 1101-1103 and / or composite. The thermal stress generated between the substrate 1901 and the wiring layout carrier 1903 due to high temperature can be suppressed, and damage to the light emitting units 1101 to 1103 due to high temperature can also be suppressed.</p><p> As shown in FIG. 3b, the bonding structure 1902 includes a flexible adhesive layer 2001, a reaction layer 2002, and / or a reaction layer 2003. The flexible adhesive layer 2001 can be formed from the materials described above. Reaction layers 2002 and 2003 are formed between the flexible bond 12001 and the wiring layout carrier 1903 and / or between the flexible bond 12001 and the composite substrate 1901 and between the flexible bond layer 2001 and the wiring layout carrier 1903. And / or enhance the adhesion between the flexible adhesive layer 2001 and the composite substrate 1901. The material of the reaction layer 2002 or 2003 is, for example, silicon nitride (SiN)._x), Epoxy, titanium (Si), chromium (Cr), or a combination thereof. However, it is not limited to these materials. The reaction layers 2002 and / or 2003 can be previously formed on the wiring layout carrier 1903 and / or composite substrate 1901 by physical vapor deposition (PVD) or chemical vapor deposition (CVD). The flexible adhesive layer 2001 is then formed on one side of the wiring layout carrier 1903 and / or composite substrate 1901. The wiring layout carrier 1903 is then subjected to appropriate pressure and / or temperature, eg 328-658 g / cm.²And 150-600 ° C, preferably 505 g / cm²And 200 to 300 ° C are bonded to the composite substrate 10.</p><p> Also, if the surface of the composite substrate 1901 is rough, the flattening layer 21 will smooth the rough surface of the composite substrate 1901 and on the surface of the composite substrate 1901 to enhance the adhesion between the bonding structure 1902 and the composite substrate 1901. It is formed. The material of the flattening layer 21 is, for example, nickel (Ni) or another material that can adhere to the bonding structure 1902.</p><p> In this embodiment, the wavelength conversion material 1402 covers the upper part of the light emitting units 1101 to 1103. In addition, a light transmitting member, such as a lens, is provided to limit and protect the wavelength conversion material 1402.</p><p> The wavelength conversion material 1402 may be mixed with a light transmitting material or another adhesive material to be formed in the light emitting units 1101 to 1103. Further, it is preferable that the wavelength conversion material 1402 is not mixed with the light transmitting member or other adhesive material, and covers the region on the light emitting units 1101 to 1103 in the form of a deposit.</p><p> The reflective layer 22 may be formed in the recesses 1906 to reflect and direct the luminous flux from the light emitting units 1101 to 1103. The material of the reflective layer 22 is made of a light reflecting material such as gold, silver, aluminum, tin and the like. The reflective layer 22 is formed on a part or all of the inner surface of the recess 1906 by various film deposition methods. Further, when the reflective layer 22 is a conductor, the reflective layer 22 is formed in the region where the light emitting units 1101 to 1103 cover the composite substrate 1901 in order to maintain the insulation between the light emitting units 1101 to 1103 and the reflective layer 22. It is preferable not to be done. Further, in order to further increase the reflection efficiency by the reflective layer 22, the concave portion 1906 is preferably formed in a tapered shape. That is, the inner wall of the recess 1906 is an inclined surface that forms a funnel-shaped space.</p><p> Although preferred embodiments of the present invention have been described above, the present invention is not limited to this embodiment, and any modification to the present invention belongs to the scope of the present invention unless the gist of the present invention is deviated.</p>

10 LCD 11 Backlight module 12 Mixed light 13 Liquid crystal layer 14 color filter layer 1101 UV unit 1102 red light unit 1103 blue light unit 1401 pixels 1402 Wavelength conversion material 1403 green light 15 Light diffuser 16 Optical adjustment surface 1501 Wing-shaped protrusion 1502 recess 1503 Light incident surface 1504 vertical 1601 First wavy array 17 Optical film 1701 First surface 1702 Second surface 18 Optical adjustment surface 1801 Second wavy array 19 Semiconductor light emitting device unit 1901 Composite substrate 1902 Bond structure 1903 Wiring layout carrier 1904 Electrical contacts 1905 Conductive wire 1906 Recess 21 Flattening layer 22 Reaction layer 2001 Flexible adhesive layer 2002, 2003 Reaction layer