Information processing system, information processing method, and program

0001The present invention relates to information processing systems, information processing methods and programs.

0002In a semiconductor manufacturing apparatus for manufacturing a semiconductor device, a large amount of apparatus data can be generated in the process of processing for manufacturing the semiconductor device. The device data may include, for example, data relating to an event occurring in the semiconductor manufacturing device or data indicating a measurement result. The device data is recorded in a shared database and can be used for abnormality detection of semiconductor manufacturing equipment, state diagnosis, cause analysis of abnormality, and the like.

0003Since the semiconductor manufacturing apparatus is always required to have a finer pattern, the accuracy can be frequently improved by improving the control software for controlling the semiconductor manufacturing apparatus. Along with this, the unit of the measured value by the measuring unit mounted on the semiconductor manufacturing apparatus and the number of significant digits can be changed. When such a change occurs, when analyzing the device data output from the semiconductor manufacturing device, it takes time and effort to find and correct a large number of changes in the system of units and significant figures.

0004Patent Document 1 discloses that numerical data is managed as a pair with a unit representing the numerical value, and that the unit of numerical data is converted to another unit when a unit conversion instruction is given. .. In Patent Document 2, it is possible to convert the data of the data extraction source so as to meet the specifications of the data of the data extraction destination according to the conversion processing contents registered in the data conversion library and the conversion relationship defined in the item conversion map. It is disclosed.

0005However, Patent Documents 1 and 2 manage the data definition and its version in association with the period in which the device data is recorded according to the data definition, and do not disclose or suggest the use thereof.

<p num="0006"><patcit num="1"><text>Japanese Unexamined Patent Publication No. 7-13819</text></patcit><patcit num="2"><text>Japanese Unexamined Patent Publication No. 2004-110182</text></patcit></p>

<p num="0007"> The present invention provides to a user in an information processing system that uses device data recorded in a database according to a data definition that can be updated at any time, converting the device data extracted from the database into an expression according to a specified data definition. With the goal.</p>

<p num="0008"> One aspect of the present invention relates to an information processing system that utilizes device data recorded in a database according to a data definition that can be updated at any time, and the information processing system uses a data definition version and data definitions in the data definition version. A holding unit that holds a data definition history associated with a specified period, a data definition library in which a data definition version and a data definition in the data definition version are registered in association with each other, and an extraction specified through a user interface. An extraction unit that extracts device data that matches the extraction conditions including the period from the database, and the user interface that converts the representation of the device data extracted by the extraction unit into a representation that follows the data definition specified through the user interface. The device data is data generated by a semiconductor manufacturing device or data processed therein, and the conversion unit is used in the extraction period by referring to the data definition history. By specifying the data definition version of the specified data definition and further referring to the data definition library, the data definition in the specified data definition version is specified as the data definition of the device data extracted by the extraction unit. , Converts the representation of the device data to a representation according to the specified data definition.</p>

<p num="0009"> According to the present invention, in an information processing system that uses device data recorded in a database according to a data definition that can be updated at any time, the device data extracted from the database is converted into an expression according to a specified data definition and provided to the user. can do.</p>

0010<figref num="1">The figure which illustrates the schematic structure of the exposure apparatus as an example of a semiconductor manufacturing apparatus.</figref><figref num="2">The figure which shows the schematic structure of the information processing system of 1st Embodiment of this invention.</figref><figref num="3">The figure which illustrates the apparatus data which can be generated by a data processing part based on a log.</figref><figref num="4">A flowchart illustrating the flow of information processing in the information processing apparatus of the first embodiment or an information processing system including the information processing apparatus.</figref><figref num="5">The figure which illustrates the data definition history.</figref><figref num="6">The figure which illustrates the data definition.</figref><figref num="7">The figure which illustrates the extracted device data.</figref><figref num="8">The figure which illustrates the detected data definition history.</figref><figref num="9">The figure which illustrates the conversion table.</figref><figref num="10">The figure which shows the schematic structure of the information processing system of the 2nd Embodiment of this invention.</figref><figref num="11">The figure which illustrates the correspondence between the version of the control software and the data definition version.</figref><figref num="12">The figure which illustrates the apparatus data before and after conversion in 1st Embodiment.</figref>

0011Hereinafter, preferred embodiments of the present invention will be described with reference to the accompanying drawings.

0012(First Embodiment) The information processing system according to the first embodiment of the present invention will be described with reference to FIG. The information processing system of the first embodiment of the present invention is configured to utilize device data recorded in a database according to a data definition that can be updated at any time. The information processing system includes an information processing apparatus 200, and typically may further include one or more terminals 230. The terminal 230 functions as a user interface. When the information processing device 200 has a user interface function, the terminal 230 is not always necessary. The information processing device 200 may be constructed by one or more computers. A system including an information processing system and a semiconductor manufacturing apparatus can be called a semiconductor manufacturing system.

0013The information processing device 200 or the information processing system is provided with device data from one or more semiconductor manufacturing devices (here, exposure device 100) via a communication interface (not shown) and a communication network (or communication line). .. The device data may be data that can be generated in a semiconductor manufacturing device represented by the exposure device 100 or data that is processed thereof. Examples of the semiconductor manufacturing apparatus include the exposure apparatus 100, which is illustrated in detail below, as well as, for example, a film forming apparatus (for example, a plasma forming apparatus), an etching apparatus, an annealing apparatus, an ion implantation apparatus, a cleaning apparatus, and a coater developer. Coating and developing equipment) and inspection equipment can be mentioned.

0014This will be described with reference to FIG. The exposure apparatus 100 is configured to expose the wafer by projecting a pattern of a reticle (original plate) onto a substrate such as a wafer or a plate by a projection optical system. In the example shown in FIG. 1, the exposure device 100 is configured as a scanning exposure device. It should be understood that the exposure apparatus 100 shown here is merely an example of an exposure apparatus, and further, is merely an example of a semiconductor manufacturing apparatus.

0015In the exposure apparatus 100, the luminous flux output from the light source 1 illuminates the reticle (original plate) 3 held in the reticle stage 6 after the shape and light amount distribution are adjusted by the illumination optical system 2. The pattern of the reticle 3 is projected by the projection optical system 4 onto the wafer (substrate) 5 coated with the photosensitizer (resist) held on the wafer chuck 8 on the wafer stage 7. As a result, the shot region of the wafer 5 is exposed, and a latent image pattern corresponding to the pattern of the reticle 3 is formed (transferred) on the photosensitizer. After the latent image pattern is formed in the entire shot region of the wafer 5, the latent image pattern is developed in the developing process to form the resist pattern.

0016The illumination optical system 2 may be provided with, for example, a plurality of aperture diaphragms having different circular aperture areas for setting the coherence factor σ value. The illumination optical system 2 may further include a ring-shaped diaphragm for ring-shaped illumination, a quadrupole diaphragm, and a mechanism for adjusting the amount of illumination light (for example, a plurality of ND filters and a mechanism for switching between them). The illumination optical system 2 further includes a photodetector for measuring the amount of light, a slit for determining the shape of the luminous flux, a blind mounted at a position conjugate with the reticle 3 to secure an illumination range, and a drive mechanism for driving the blind. Can be provided. The operation of the light source 1 and the illumination optical system 2 is controlled by the instruction of the illumination system control system 21.

0017The projection optical system 4 may be provided with a numerical aperture setting mechanism for setting the numerical aperture and a lens driving mechanism for correcting aberrations. The operation of the projection optical system 4 is controlled by the projection optical system control system 24.

0018The position of the reticle stage 6 is determined by the reticle stage measurement system 10 as the positions of the two orthogonal axial directions (X and Y directions) in the plane orthogonal to the optical axis (Z direction) of the projection optical system 4 and these. The rotation around the axis is measured and controlled by the reticle stage control system 22.

0019Further, a TTR (Through The Reticle) observation optical system 9 may be arranged between the illumination optical system 2 and the reticle stage 6. The TTR observation optical system 9 can simultaneously observe the mark on the reticle 3 or the stage reference mark installed on the reticle stage 6 and the stage reference mark on the wafer stage 7 via the projection optical system 4. Can be configured in. The position of the projection optical system 4 of the reticle stage 6, the reticle 3, and the wafer stage 7 in the optical axis direction (Z direction) by the TTR observation optical system 9, and two orthogonal axial directions (X) in the plane orthogonal to the optical axis. , Y direction) position, and rotation around these axes can be measured.

0020The position of the wafer 5 can be measured by the wafer stage measurement system 12 and the alignment measurement system 30. The wafer stage measurement system 12 includes, for example, the positions of the projection optical system 4 in the optical axis direction (Z direction), the positions in the plane orthogonal to the optical axis in the two orthogonal axial directions (X and Y directions), and these. Measure the rotation around the axis. The alignment measurement system 30 can measure the surface position of the wafer 5 in the optical axis direction (Z direction) of the projection optical system 4. The wafer stage control system 25 controls the position of the wafer stage 7 based on the information provided by the wafer stage measurement system 12 and the alignment measurement system 30.

0021The exposure apparatus 100 and the off-axis observation optical system 11 capable of observing and measuring the surface of the wafer 5 with non-exposure light may be provided. The off-axis observation optical system 11 observes a plurality of marks on the wafer 5 and measures the pattern position and shape on the wafer 5. The off-axis observation optical system 11 also observes the stage reference mark on the wafer stage 7 and measures the position of the stage reference mark.

0022When the wafer 5 is exposed, the reticle 3 held by the reticle stage 6 is driven in the "scanning direction" shown in FIG. In synchronization with this, the wafer 5 held by the wafer stage 7 is also driven in the "scanning direction" shown in FIG. Here, the reticle 3 and the wafer 5 are driven at a speed ratio corresponding to the projection magnification of the projection optical system 4. When the relative positions of the reticle 3 and the wafer 5 are displaced, the deformed pattern is transferred to the shot of the wafer 5. Therefore, the main control system 27 calculates the relative positional deviation between the reticle 3 and the wafer 5, and controls the reticle stage control system 22 and the wafer stage control system 25 so that the relative positional deviation becomes zero.

0023The exposure apparatus 100 may include a reticle library 14, a reticle transfer unit including a reticle robot 13, and a reticle alignment unit 29 that aligns the position of the reticle 3 with a mark on the reticle stage 6. The reticle transfer unit operates according to the instruction from the reticle transfer control system 19. Further, the exposure apparatus 100 may include a wafer transfer unit including a wafer cassette elevator 16 and a wafer loading / unloading robot 15. The wafer transfer unit operates according to an instruction from the wafer transfer control system 26.

0024For example, the chamber environment control unit 31 maintains a constant temperature of the air inside the chamber in which the main body portion of the exposure apparatus 100 is housed, and removes minute foreign substances by a filter. The chamber environment control unit 31 operates according to the instruction from the chamber control system 18.

0025The main control system 27 includes components of the exposure apparatus 100, for example, a chamber control system 18, a reticle transfer control system 19, a wafer transfer control system 26, a reticle stage control system 22, a wafer stage control system 25, and an illumination system control system 21. Controls the projection optical system control system 24 and the like. The main control system 27 can acquire setting parameters or operation instructions that define the exposure operation of the exposure device 100 via the communication interface 17 and control each component of the exposure device 100 based on the setting parameters or operation instructions.

0026The exposure process is executed according to the job parameters that define the operation of the exposure apparatus 100. Job parameters include, for example, process name (job name), lot ID, shot range, shot arrangement, each shot number, exposure amount, exposure scanning speed, exposure scanning direction, calibration items of units constituting the exposure apparatus, wafers, and the like. Includes shot alignment method, etc.

0027The main control system 27 executes the exposure process while controlling each component of the exposure apparatus 100 based on the job parameters for each lot, with one or a plurality of wafers as one lot. First, at the start of the lot processing, the reticle and the wafer used for the exposure processing are supplied into the exposure apparatus 100. When the supply of the reticle and the wafer is completed, the components specified by the job parameters among the components of the exposure apparatus 100 are calibrated and the measurement for the alignment of the reticle and the wafer is performed. The main control system 27 exposes each shot area on the wafer by a step-and-scan method while controlling each component based on the result.

0028At the same time as the exposure process, the main control system 27 generates a log recording the operation of the exposure device 100 during the exposure process. The log is, for example, events such as start / end events of the operation of each component, processing setting values, calibration and alignment measurement results, shot area exposure amount results, scan operation control results, and errors that occur in the exposure device. And the time of their occurrence is also recorded. The main control system 27 executes the process according to the control software that defines the process to be executed, and the contents recorded in the log can also be defined by the control software. The control software is given a version identifier each time it is changed.

0029Hereinafter, when extracting device data from the database 221 whose data definition may differ from time to time because it is updated from time to time, the data definition of the device data is specified based on the extraction period, and the device data extracted from the database 221 is defined as the data definition. The method of conversion according to is described.

0030The information processing device 200 may be configured to process device data provided by the exposure device 100. The information processing device 200 can be configured, for example, by installing a computer program on a general-purpose computer. The information processing device 200 includes a communication interface (not shown), a conversion unit 201, an extraction unit 202, a data definition management unit 203, a storage unit 204, a database 221, and a data processing unit 222 when the computer program is installed. Works as. Alternatively, the information processing device 200 operates as a device that executes a communication step, a conversion step, an extraction step, a data definition management step, a storage step, and the like by installing the computer program.

0031The extraction unit 202 extracts device data corresponding to the extraction conditions required by the terminal 230 from the database 221 and transmits or provides the device data to the terminal 230. Here, the extraction condition includes at least the extraction period, and may also include the device data item name and the like.

0032The conversion unit 201 stores the data definition version in each of the one or a plurality of periods included in the extraction period (the period in which the device data should be extracted) included in the extraction condition requested by the terminal 230 in the data definition history in the storage unit 204. Identify based on 205. Further, the conversion unit 201 specifies the data definition in each of the one or a plurality of periods included in the extraction period included in the extraction condition requested by the terminal 230 with reference to the data definition library 206. Further, the conversion unit 201 converts the device data from the expression according to the data definition when it is recorded in the database 221 into the expression so as to follow the data definition requested by the terminal 230, and transmits or provides the device data to the terminal 230.

0033The data definition management unit 203 generates or updates the data definition history 205 based on the data definition change information 208 obtained from the data processing unit 222, and records it in the holding unit 210 in which the area is defined in the storage unit 204. The data definition history 205 may be generated for each individual exposure device. Here, the generation of the data definition history will be described. In order to generate the data definition history, every time the data definition is changed, the data processing unit 222 sets the defined version number of the changed data definition 223 and the date and time when the use is started as the data definition change information 208, and the data definition management unit. Provided to 203. The data definition management unit 203 generates or updates the data definition history 205 as illustrated in FIG. 5 based on the data definition change information 208, and records it in the storage unit 204. In this embodiment, the storage unit 204 includes a storage unit 210 that holds the data definition history 205, and a data definition library 206 in which the data definition version and the data definition in the data definition version are registered in association with each other. The data definition library 206 can be updated by the data definition management unit 203. For example, the data definition management unit 203 registers a new data definition 223 in the data definition library 206 in association with the data definition version of the new data definition 223 in response to a change in the data definition (input of the data definition 223). Can be done.

0034The data processing unit 222 processes the log generated by the exposure device 100 (main control system 27) and provided to the information processing device 200 according to the data definition 223 to generate device data, and records it in the database 221. Here, the log generated by the exposure device 100 (main control system 27) and provided to the information processing device 200 may be recorded in the database 221 as device data as it is. In this case, the exposure apparatus 100 converts the raw data into a log in a format according to the data definition 223, and the data processing unit 222 can record the log supplied from the information processing apparatus 200 as it is in the database 221. Here, an example will be described in which the data processing unit 222 processes the log generated by the exposure device 100 (main control system 27) and provided to the information processing device 200 according to the data definition 223 to generate device data.

0035The data definition 223 defines, for example, the item name given to each of the data indicating the event and the measured value included in the log generated by the main control system 27, the format to be recorded, and the unit of each. .. The data definition 223 is given a version number each time it is changed. FIG. 3 illustrates device data that can be generated by the data processing unit 222 based on the log. Logs 310A and 310B are examples of logs generated by the main control system 27, and include a processing time 301, an operation record identifier 302, and a recorded content 303. The data definition defines, for example, a data storage array 320 for storing the data of the item corresponding to the operation record identifier 302, a date and time field 321 for storing the processing time 301, and a content field 322 for adding the recorded content 303. ..

0036It is assumed that the log 310A is a log generated by the main control system 27 when the control software executed by the main control system 27 is "Tool Type OO Control Ver.1". The data processing unit 222 records the information 330 in the log 310A as device data 340 in the database 221 according to the data definition in the data definition version "data definition version 1".

0037It is assumed that the time has changed and the control software has been changed to "Tool Type OO Control Ver.2." Log 310B is recorded in database 221 as device data according to the format defined in "Tool Type OO Control Ver.2". The difference between the control software "Tool Type OO Control Ver.1" and the control software "Tool Type OO Control Ver.2" is that the unit of wafer X position and wafer Y position has been changed from um to nm. .. The data definition version is changed to "data definition version 2" to accommodate this difference. The data processing unit 222 records the information 331 constituting the log 310B in the database 221 as the device data 341 according to the data definition version 2.

0038The device data generated by the data processing unit 222 is recorded in the database 221 together with information identifying the exposure device 100, for example, a device recognition ID. Further, in order to generate the data definition history, when the data definition is changed, the data processing unit 222 data the data definition change information 208 that records the definition version number and the date and time when the use is started. Provided to the definition management unit 203. The data definition may be different for each exposure device, and the data definition change information 208 may be provided to the data definition management unit 203 together with the information for identifying the exposure device.

0039The flow of information processing in the information processing apparatus 200 of the first embodiment or the information processing system including the information processing apparatus 200 of the first embodiment will be described with reference to FIG. In step S401, the device recognition ID, the item name of the device data to be extracted, and the period to be extracted are set as the extraction condition 207 for extracting the device data of the target exposure device 100 from the database 221 from the terminal 230. Provided to the information processing apparatus 200. As the item name of the device data to be extracted, for example, an event such as a start / end event or an error event of each processing operation, an operation result, a measurement result, or the like can be specified. For example, the device recognition ID is "Tool" as the exposure device 100 to be extracted. The device that is "A" and the "wafer X position" and "wafer Y position" can be specified as the item names to be extracted. Further, as the period to be extracted, for example, the period from May 1, 2008 to May 10, 2008 can be specified. Further, in step S401, the target data definition (for example, unit, format) is input from the terminal 230. As the target data definition, for example, it may be specified for each item name of the device data to be extracted, or the data definition version may be specified. Here, as an example, it is assumed that a data definition version called "data definition version 1" is specified.

0040In step S402 (extraction step), the extraction unit 202 extracts device data matching the device data item name specified in the period specified in step S401 from the database 221. FIG. 7 illustrates the extracted device data 701.

0041In step S403 (specific step), the conversion unit 201 identifies the data definition version in the specified extraction period with reference to the data definition history 205 related to "device Tool A" recorded in the storage unit 204. FIG. 5 illustrates the data definition history 205. For example, consider the case where a period from May 1, 2008 to May 10, 2008 is specified as the extraction period. In this case, "data definition version 1" is specified as the data definition version for the period from May 1, 2008 to May 4, 2008. In addition, for the period from May 5, 2008 to May 10, 2008, "Data definition version 2" is specified as the data definition version. Figure 8 illustrates the change history of the data-defined version for each period detected when the period from May 1, 2008 to May 10, 2008 is specified as the extraction period. Further, in step S403, the conversion unit 201 specifies the data definition for the device data item name to be extracted in the data definition version for each specified time period with reference to the data definition library 206.

0042Figure 6 illustrates the data definition. Data definitions such as data definitions 223A to C are registered in the data definition library 206. The unit and format of the device data item names "wafer X position" and "wafer Y position" are specified based on the data definition versions "data definition version 1" and "data definition version 2" for each specified time period. In this example, in "Data definition version 1", it is specified that the unit of "wafer X position" and "wafer Y position" is "um" and the format is "value to the first decimal place". To. Further, in "data definition version 2", it is specified that the unit of "wafer X position" and "wafer Y position" is "nm" and the format is "integer".

0043In step S404 (conversion step), the conversion unit 201 converts the representation of the device data extracted by the extraction unit 202 in step S402 into a representation according to the data definition (eg, unit, format) specified in step S401. At this time, if the data definition of the conversion destination (after conversion) is specified by the data definition version, the data definition corresponding to the data definition version is the device data item name to be extracted by referring to the data definition library 206. Is specified for each of. In this example, as described above, "data definition version 1" is specified as the conversion destination, and the unit of "wafer X position" and "wafer Y position" is "um" in the expression of the extracted device data. The format (display format) is converted so that it becomes "the value up to the first decimal place". This conversion can be done with reference to conversion table 209, which describes the conversion rules. The conversion table 209 shows the conversion rule for converting the device data according to the conversion source unit into the device data according to the conversion destination unit, and the device data according to the numerical representation such as the number of effective digits of the conversion source. May include at least one of the conversion rules for converting to. FIG. 9 illustrates a conversion table 209 containing conversion rules for converting device data according to the conversion source unit into device data according to the conversion destination unit. FIG. 12 illustrates device data before and after conversion in the first embodiment. The extracted device data 701 is converted as the conversion result 1201.

0044The conversion unit 201 may add information on the data definition (for example, unit, format) for each time when the device data is recorded to the extraction result 701. In this case, it is not necessary to perform unit or format conversion of the device data. As a result, the extraction result 701 is added with information such as result 1202.

0045(Second Embodiment) Hereinafter, the second embodiment of the present invention will be described, but matters not mentioned here may follow the first embodiment. The information processing system of the second embodiment will be described with reference to FIG. The information processing system of the second embodiment of the present invention includes the device information generator 220 and the information processing device 240, and typically may further include one or more terminals 230. The terminal 230 functions as a user interface. When the information processing device 240 has a user interface function, the terminal 230 is not always necessary. The information processing device 240 may be constructed by one or more computers. A system including an information processing system and a semiconductor manufacturing apparatus can be called a semiconductor manufacturing system. The information processing device 200 or the information processing system is provided with device data from one or more semiconductor manufacturing devices (here, exposure device 100) via a communication interface (not shown) and a communication network (or communication line). ..

0046In the second embodiment, the data definition history 205 is generated or updated by the data definition management unit 203 based on the version change information of the control software of the main control system 27. The device information generator 220 is configured as a device having functions corresponding to the communication interface (not shown), the database 221, and the data processing unit 222 of the information processing device 200 in the information processing system of the first embodiment shown in FIG. .. Then, the device information generation device 220 generates device data from the log transmitted from the exposure device 100 and records it in the database 221. The information processing device 240 corresponds to the communication interface (not shown), the conversion unit 201, the extraction unit 202, the data definition management unit 203, and the storage unit 204 in the information processing device 200 in the information processing system of the first embodiment shown in FIG. It is configured as a device having a function to process information. Then, the information processing device 240 processes the device data recorded in the database 221 of the device information generation device 220.

0047When the version of the control software executed by the main control system 27 is changed, the data definition management unit uses the information for specifying the version and the date and time when the operation is started in that version as the control software version change information 212. Provided to 203. The device information generation device 220 generates device data according to the data definition of the data definition version that matches the new control software version in accordance with the version change of the control software of the main control system 27. The storage unit 204 records a table 213 that describes the correspondence between the control software version and the data definition version. The data definition of the data definition version corresponding to the version of the control software may be provided to the information processing device 240 from the main control system 27 of the exposure device 100, or the input device provided in the information processing device 240 may be provided. It may be provided to the information processing device 240 via.

0048The data definition management unit 203 generates the data definition history 205 based on the table 213. FIG. 11 illustrates the correspondence between the control software version and the data definition version. For example, the control software "Tool Type OO Control Ver.3" shall correspond to the data definition version 3. Consider the case where the control software is changed from "Tool Type OO Control Ver.2" to "Tool Type OO Control Ver.3". In this case, the data definition management unit 203 records the date and time of the change in the data definition history 205 as the start date and time of the data definition version 3. Consider the case where the control software is changed from "Tool Type OO Control Ver.3" to "Tool Type OO Control Ver.4". Since the data definition version 3 corresponds to "Tool Type OO Control Ver.3" and "Tool Type OO Control Ver.4", the data definition version is not changed and is not recorded in the data definition history 205.

0049The method of converting the device data extracted from the database 211 into a representation according to the specified data definition and providing it to the user is the same as the method described with reference to FIG.