Defect inspection device and defect inspection method

The present invention relates to a defect inspection apparatus and a defect inspection method for inspecting defects in semiconductors, liquid crystal display elements, and the like.

In the semiconductor manufacturing process, the presence of foreign matter or pattern defects on the semiconductor substrate (wafer) causes defects such as wiring insulation defects and short circuits. If fine foreign matter is present as the semiconductor element becomes finer, the finer foreign matter may cause insulation failure of the capacitor and destruction of the gate oxide film and the like.

These foreign substances are generated in various states such as those generated from the moving parts of the semiconductor transfer device, those generated from the human body, those generated by reaction in the processing device by the process gas, and those in which chemicals and materials are mixed. It is mixed.

Similarly, in the manufacturing process of the liquid crystal display element, if foreign matter adheres to the pattern or some defect occurs, the liquid crystal display element cannot be used as the display element. The situation is the same in the manufacturing process of the printed circuit board, and the adhesion of foreign matter causes a short circuit of the pattern and a defective connection.

Conventionally, as one of the techniques for detecting fine foreign matters and defects on a semiconductor substrate at high speed and with high sensitivity, as described in Patent Document 1, a laser is irradiated on the semiconductor substrate to cause foreign matter on the semiconductor substrate. By detecting the scattered light from the foreign matter generated when the foreign matter is attached and comparing it with the inspection result of the semiconductor substrate of the same type that was inspected immediately before, false information due to the pattern is eliminated, and the foreign matter and highly reliable foreign matter and high reliability are eliminated. Defect inspection equipment is disclosed.

Further, Patent Document 2 describes a method for preventing the 0th-order diffracted light from the pattern from being incident on the entrance pupil of the detection lens by a laser irradiation means capable of inspecting foreign matter and defects with high sensitivity and high reliability. There is.

That is, in Patent Document 2, it is possible to avoid the incident of the 0th-order diffracted light by setting the relationship between the elevation angle of the illumination light, the azimuth angle, and the numerical aperture of the detection lens to satisfy a certain condition. Have been described.

Further, in Patent Document 2, in order to generate a slit-shaped beam spot that is narrowed down in the Y direction of the XY plane and collimated in the X direction by the illumination that is inclined and incident on the substrate to be inspected, it is a cone. An illumination lens having a curved surface is used. The illumination lens having this conic section has a cross section of a plane convex lens whose focal length changes linearly along the longitudinal direction.

<p num="0009"><patcit num="1"><text>Japanese Unexamined Patent Publication No. 62-89336</text></patcit><patcit num="2"><text>Japanese Patent No. 3566589</text></patcit></p>

<p num="0010"> In the defect inspection device described above, if the illumination elevation angle is variable and various objects are irradiated with illumination light, the types of defects that can be detected can be expanded.</p><p num="0011"> However, in the prior art, when the illumination elevation angle is changed as in the technique described in Patent Document 2, the setting adjustment for preventing the 0th-order diffracted light from being incident is complicated, and therefore the adjustment mechanism is also complicated. ..</p><p num="0012"> Further, as described in Patent Document 2, a cylindrical lens having a conic curved surface is used as an illumination lens for generating a collimated slit-shaped beam spot, but this cylindrical lens is difficult to process and is difficult to process. The production yield was poor, the lens was expensive, and the cost of the defect inspection device was increased.</p><p num="0013"> An object of the present invention is to realize a defect inspection apparatus and a defect inspection method capable of easily adjusting the substrate to be inspected according to a change in the illumination elevation angle, while being inexpensive.</p>

<p num="0014"> In order to achieve the above object, the present invention is configured as follows.</p><p num="0015"> The defect inspection apparatus of the present invention has a beam shaping unit having a laser light source, a parallel plane substrate that transmits a laser from the laser light source, and a cylindrical lens that shapes a laser that has transmitted through the parallel plane substrate, and a beam that has passed through a beam shaping unit. Is reflected and irradiated onto the object to be inspected as a linear beam spot, and the beam spot shaping part having a beam alignment part capable of changing the elevation angle of the reflected beam with respect to the object to be inspected and the object to be inspected It includes a detection optical system that detects the reflected scattered light and a control system that detects defects in the object to be inspected based on the scattered light detected by the detection optical system.</p><p num="0016"> Further, in the defect inspection method of the present invention, a laser from a laser light source is transmitted through a parallel plane substrate and then transmitted through a cylindrical lens that shapes the laser to form a linear beam, and the linear beam is reflected. Then, the object to be inspected is irradiated as a linear beam spot, the scattered light reflected from the object to be inspected is detected, and the defect of the object to be inspected is detected based on the detected scattered light.</p>

<p num="0017"> According to the present invention, it is possible to realize a defect inspection apparatus and a defect inspection method capable of easily adjusting the substrate to be inspected according to a change in the illumination elevation angle, while being inexpensive.</p>

<figref num="1">It is an overall schematic block diagram of the defect inspection apparatus to which this invention is applied.</figref><figref num="2">It is a schematic block diagram of the beam spot shaping part of the defect inspection apparatus in Example 1 of this invention.</figref><figref num="3">It is a side view of the beam shaping part of the defect inspection apparatus in Example 1 of this invention.</figref><figref num="4">It is sectional drawing along the AA line of the beam shaping part shown in FIG.</figref><figref num="5">It is a schematic plan view of the beam shaping part of the defect inspection apparatus in Example 1 of this invention.</figref><figref num="6">It is a side view of the beam alignment part of the defect inspection apparatus in Example 1 of this invention.</figref><figref num="7">It is a schematic plan view of the beam alignment part of the defect inspection apparatus in Example 1 of this invention.</figref><figref num="8">It is a flowchart of switching operation of the illumination elevation angle in Example 1 of this invention.</figref>

Hereinafter, embodiments of the present invention will be described with reference to the accompanying drawings. In the following figures, the same functional parts are designated by the same reference numerals.

<p num="0020"> The apparatus configuration of the inspection apparatus according to the first embodiment of the present invention will be described with reference to FIGS. 1 to 8. The examples shown below are examples in which the present invention is applied to a defect inspection apparatus for semiconductor wafers. However, the present invention can be applied not only to a defect inspection device for semiconductor wafers but also to a defect inspection device such as a liquid crystal display element and an inspection method.</p><p num="0021"> In FIG. 1, the defect inspection apparatus includes a stage portion 300 on which the substrate 1 to be inspected is mounted. The stage unit 300 scans the beam spot 3, which is a slit-shaped illumination region irradiated on the substrate 1 to be inspected in a slit shape, the detection region 4 of the image sensor, and the inspection region in the substrate 1 to be inspected in the XY directions, and is an optical system. It includes an X stage 301 and a Y stage 302 that can move relative to each other, a Z stage 303 that can focus on the surface of the substrate 1 to be inspected, a theta (θ) stage 304, and a stage controller 305.</p><p num="0022"> The defect inspection device also includes an illumination optical system 100 having a laser light source 105, a beam expander, an optical filter group and a mirror, an optical branching element (or mirror) switchable with a glass plate, and a beam spot shaping unit 500. ..</p><p num="0023"> The details of the beam spot shaping unit 500 will be described later.</p><p num="0024"> Further, the defect inspection apparatus includes a detection optical system 200 and a branch detection optical system 210 for simultaneous inspection of two sensors, and the detection optical system 200 includes a detection lens 201, a spatial filter 202, and an imaging lens 203. It also has a zoom lens group 204, a one-dimensional image sensor 205, an upper observation system 206 capable of observing the detection area of the image sensor 205, and a polarization beam splitter 209.</p><p num="0025"> Further, the defect inspection device includes a control system 400, which has a control CPU unit 401, a signal processing unit 402, a display unit 403, and an input unit 404. The signal processing unit 402 sets the A / D conversion unit, the data memory that can be delayed, the difference processing circuit that takes the difference between the signals between the chips, the memory that temporarily stores the difference signal between the chips, and the pattern threshold value. It has a threshold value calculation processing unit to be set and a comparison circuit. The control CPU unit 401 recognizes and stores the beam position, and corrects and controls the beam position. Further, the control CPU unit 401 controls the drive of the motor and the like, the coordinates, and the sensor. The control CPU unit 401 also includes a storage unit that stores control data.</p><p num="0026"> Further, the defect inspection device includes an output unit that stores the defect detection result of foreign matter and the like and outputs the defect detection result.</p><p num="0027"> As the laser light source of the illumination optical system 100, it is preferable to use a high-power YAG laser third harmonic generator (THG) with a wavelength of 355 nm, but the wavelength does not necessarily have to be 355 nm. That is, the laser light source may be another light source such as an Ar laser, a nitrogen laser, a He-Cd laser, or an excimer laser.</p><p num="0028"> The one-dimensional image sensor 205 may be a CCD or TDI (Time Delay Integration) sensor. In the case of CCD, since the pixel size is about 10 μm, it can be considered as linear detection, and there is no decrease in sensitivity due to capturing an image that is out of focus in the scanning direction.</p><p num="0029"> On the other hand, since TDI integrates images for a certain number of pixels in the scanning direction, it is desirable to reduce the amount of images that are out of focus by reducing the illumination width or tilting the TDI sensor.</p><p num="0030"> The XYZ coordinate system is shown in the lower left of the stage unit 300 in FIG. The XY axis is taken on the plane of the stage portion 300, and the Z axis is taken vertically upward. The optical axis of the detection optical system 200 is arranged along the Z axis.</p><p num="0031"> Next, the detailed configuration and operation of the beam spot shaping unit 500 will be described in detail with reference to FIGS. 2 to 8.</p><p num="0032"> FIG. 2 is a schematic configuration diagram of the beam spot shaping unit 500.</p><p num="0033"> In FIG. 2, the beam spot shaping unit 500 includes a beam shaping unit 501 and a beam aligning unit 502.</p><p num="0034"> FIG. 3 is a side view of the beam shaping section 501, FIG. 4 is a cross-sectional view of the beam shaping section 501 shown in FIG. 3 along the AA line, and FIG. 5 is a plan view of the beam shaping section 501. Further, FIG. 6 is a side view of the beam alignment unit 502, and FIG. 7 is a plan view of the beam alignment unit 502. FIG. 8 is a flowchart of the illumination elevation angle switching operation of the beam spot shaping unit 500.</p><p num="0035"> In FIG. 2, the light 101 from the light source 105 is reflected by the mirror 504 and incident on the parallel plane substrate 511 (for example, plain glass). Then, the light 101 that has passed (transmitted) through the parallel plane substrate 511 is focused by the cylindrical lens 512, shaped into a linear beam, reflected by the mirror 600, and irradiated to the substrate 1 to be inspected.</p><p num="0036"> In FIGS. 3, 4, and 5, the parallel plane substrate 511 and the cylindrical lens 512 are incorporated in the lens holder 510. Here, the lens holder 510 supports the parallel plane substrate 511 and the cylindrical lens 512 from both side surfaces so as not to block the light 101. Further, at least the portion of the lens holder 510 through which the light 101 passes is exposed.</p><p num="0037"> The parallel plane substrate 511 and the cylindrical lens 512 are arranged in a V shape with the same inclination angle θ with respect to the horizontal plane 530 between them. That is, the parallel plane substrate 511 is inclined with respect to the plane 530 perpendicular to the optical axis 102 of the laser from the laser light source 105 by the same angle as the azimuth angle of the linear beam irradiated to the object 1 to be inspected. The cylindrical lens 512 is arranged at a position symmetrical to the parallel plane substrate 511 with a plane perpendicular to the optical axis 102 of the laser in between. Further, the thickness of the parallel plane substrate 511 and the thickness of the cylindrical lens 512 are almost the same.</p><p num="0038"> By arranging the parallel plane substrate 511, the optical axis 104 of the light 101 translated by the parallel plane substrate 511 is translated by the cylindrical lens 512, and the incident optical axis 102 and the emitted optical axis 103 are aligned coaxially. Can be done.</p><p num="0039"> By arranging the parallel plane substrate 511 in front of the cylindrical lens 512, it is possible to prevent the optical axis from shifting at the focal position of the light 101 due to the rotation of the cylindrical lens 512, and the optical axes of the light 101 are aligned at the same focal position. The light 101 can be rotated while keeping it.</p><p num="0040"> Further, the lens holder 510 is connected to the rotation mechanism 525 as shown in FIG. The rotation mechanism 525 will be described in detail.</p><p num="0041"> The rotation mechanism 525 includes a pulley 514 connected to the lens holder 510, a bearing bearing 513 of the lens holder 510, a drive side pulley 515, a timing belt 516 connecting the pulley 514 and the drive side pulley 515, and a drive side pulley 515. A motor 517 connected to the lens and a support 518 are provided.</p><p num="0042"> The support base 518 of the rotation mechanism 525 has an opening for mounting the lens holder 510, and the light 101 passes through the parallel flat substrate 511 and the cylindrical lens 512 of the lens lens holder 510 mounted on the opening. By rotating the lens holder 510, the light 101 can be rotated around the incident optical axis 102 of the light 101.</p><p num="0043"> By providing the rotation mechanism 525 in this way, the light 101 can be rotated while the focal position of the light 101 is maintained at the same position. Further, the lens holder 510 and the rotation mechanism 525 are connected to the vertical movement mechanism 526 in order to adjust the focal position of the cylindrical lens 512. That is, the parallel plane substrate 511 and the cylindrical lens 512 are moved along the optical axis 102 direction of the laser from the laser light source 105 by the vertical movement mechanism 526. The lens holder 510 and the moving mechanism 526 may be connected to the rotating mechanism 525.</p><p num="0044"> Next, the moving mechanism 526 will be described in detail.</p><p num="0045"> The moving mechanism 526 includes a connecting portion 527 (for example, a ball screw nut) that connects the rotating mechanism 525 and the ball screw 520, a ball screw fixing part 521, a motor 523, and a coupling 522 that connects the ball screw 520 and the motor 523. , A guide 524 that guides the cylindrical lens 512 in the focusing direction is provided.</p><p num="0046"> By moving the lens holder 510 and the rotation mechanism 525 along the guide 524 of the movement mechanism 526, the focal position of the cylindrical lens 512 can be adjusted.</p><p num="0047"> Further, the rotation position of the light 101 at the same focal position of the cylindrical lens 512 and the focal position of the cylindrical lens 512 can be adjusted independently of each other.</p><p num="0048"> Next, the mirror 600 will be described with reference to FIG.</p><p num="0049"> The mirror 600 is arranged so as to be inclined with respect to a plane parallel to the substrate 1 to be inspected. Further, the end surface 601 of the mirror 600 on the side of the substrate 1 to be inspected is inclined with respect to the flat surface portion of the mirror 600, and is parallel to or nearly parallel to the plane parallel to the substrate 1 to be inspected. That is, with the mirror 600 tilted with respect to the substrate 1 to be inspected, the end surface 601 of the mirror 600 on the substrate 1 side to be inspected is formed so as to be substantially parallel to the substrate 1 to be inspected.</p><p num="0050"> Due to the shape of the mirror 600, the mirror 600 can be brought close to the substrate 1 to be inspected in an inclined state, and low elevation angle illumination can be formed.</p><p num="0051"> Further, the mirror 600 is inclined and arranged at the tip of the linear moving mechanism 610 via the mirror holder 602 that supports the mirror 600. Here, the vicinity of the end face 601 is supported by the rotation shaft 603, and the mirror 600 is rotatably arranged via the mirror holder 602. As a result, when the linear movement mechanism 610 moves, the mirror 600 is configured to rotate about the rotation shaft 603.</p><p num="0052"> Next, the linear movement mechanism 610 will be described.</p><p num="0053"> The linear movement mechanism 610 has a connecting portion 612 that connects the bearing 611 and the ball screw 614, a ball screw fixing part 615, a coupling 616 that connects the ball screw 614 and the motor 617, and the bearing 611 in the directions of arrows 640 and 650. It is equipped with a guide 613 that guides you to.</p><p num="0054"> Here, a bearing 611 is rotatably arranged between the linear movement mechanism 610 and the mirror 600. By arranging the bearing 611, the mirror holder 602 is pressed and the mirror 600 is rotated while the bearing 611 rotates with the movement of the linear movement mechanism 610. As a result, friction due to the rotational operation of the mirror 600 can be reduced, and dust generation can be suppressed.</p><p num="0055"> Further, a part of the mirror holder 602 described above, specifically, a part in contact with the bearing 611 is hardened. The hardened part has a higher hardness than the other parts. In this way, dust generation can be suppressed by increasing the hardness.</p><p num="0056"> Further, it is desirable that the hardness of the hardened portion of the mirror holder 602 and the hardness of the bearing 611 are about the same as each other because dust generation can be prevented most.</p><p num="0057"> In this way, by rotating the mirror 600 by the linear movement mechanism 610, the illumination light can be adjusted to an arbitrary elevation angle.</p><p num="0058"> Further, the linear movement mechanism 610 and the mirror 600 are connected to the linear movement mechanism 620.</p><p num="0059"> Next, the linear movement mechanism 620 will be described.</p><p num="0060"> The linear movement mechanism 620 includes a connecting portion 621 that connects the linear movement mechanism 610 and the ball screw 623, a ball screw fixing part 624, a coupling 625 that connects the ball screw 623 and the motor 626, and an arrow 640 for the linear movement mechanism 610. It is equipped with a guide 622 that guides in the direction of the arrow 650.</p><p num="0061"> By moving the linear movement mechanism 610 and the mirror 600 together by the linear movement mechanism 620, it is possible to adjust the change in the irradiation position of the illumination light 101 due to the change in the elevation angle of the illumination light 101.</p><p num="0062"> For example, when the mirror 600 is rotated in the direction in which the elevation angle θ1 of the illumination light 101 with respect to the substrate 1 to be inspected increases, the linear movement mechanism 610 moves in the direction of the arrow 640.</p><p num="0063"> Next, the relationship between the linear illumination formed on the substrate 1 to be inspected by the cylindrical lens 512 and the azimuth angle will be described.</p><p num="0064"> FIG. 7 is a plan view of the beam alignment portion 502 shown in FIG. 6, and is a plan view of the substrate 1 to be inspected when viewed from above.</p><p num="0065"> First, the azimuth means the illumination direction of the stage unit 300 with respect to the X-axis direction (scanning direction) (angle α1 in FIG. 7).</p><p num="0066"> In one embodiment of the present invention, linear illumination is emitted from a certain azimuth angle α1 (for example, 45 °) in order to prevent the 0th-order diffracted light from the substrate 1 to be inspected from being detected by the detector of the optical detection system 200. ..</p><p num="0067"> Here, in the defect inspection apparatus according to the embodiment of the present invention, the detectors are arranged parallel to the Y axis shown in FIG. 7. If the linear illumination light (linear beam) is not parallel to the Y-axis, the detector cannot receive all the scattered light from the linear illumination light, resulting in an uninspectable area. Therefore, the linear illumination also needs to be parallel to the Y-axis.</p><p num="0068"> However, when the linear illumination has an azimuth angle α1 and the cylindrical lens 512 is parallel to the substrate 1 to be inspected, in one embodiment of the present invention, the variable elevation angle is obtained. When the optical path is bent, the focal plane of linear illumination is tilted with respect to the Y-axis.</p><p num="0069"> Therefore, in one embodiment of the present invention, the cylindrical lens 512 is tilted with respect to a plane parallel to the wafer which is the substrate 1 to be inspected. More specifically, it is tilted by the same angle as the azimuth angle α1. That is, α1 = θ. Here, θ is the angle shown in FIG.</p><p num="0070"> Further, in order to prevent the optical axis deviation between the incident optical axis 102 and the emitted optical axis 103, the parallel plane substrate 511 is tilted by the same angle θ in the direction opposite to the direction in which the cylindrical lens 512 is tilted. That is, the state shown in FIG. 4 is assumed.</p><p num="0071"> Here, it is desirable that the parallel plane substrate 511 has the same material and thickness as the cylindrical lens 512. If the material and the thickness are the same, the refractive index of the parallel plane substrate 511 and the refractive index of the cylindrical lens 512 are the same in a simple configuration, so that the optical characteristics of the light 101 are not changed. This is because the incident optical axis 102 and the outgoing optical axis 103 can be the same.</p><p num="0072"> The parallel plane substrate 511 may be different in material and thickness from the cylindrical lens 512. For example, when the refractive index of the parallel plane substrate 511 is higher than the refractive index of the cylindrical lens 512, the tilt angle of the parallel plane substrate 511 may be smaller than the tilt angle of the cylindrical lens 512.</p><p num="0073"> When the thickness of the parallel plane substrate 511 is thicker than the thickness of the cylindrical lens 512, the inclination angle of the parallel plane substrate 511 may be smaller than the inclination angle of the cylindrical lens 512.</p><p num="0074"> Next, a method of changing the elevation angle while maintaining the azimuth angle α1 will be described with reference to the flowchart of FIG. Specifically, a method of increasing the elevation angle while maintaining the azimuth angle α1 will be described. Here, the elevation angle means the incident angle of linear illumination in the direction perpendicular to the surface of the substrate 1 to be inspected (angle θ1 in FIG. 6). First, in STEP 1 of FIG. 8, the linear movement mechanism 610 is moved in a direction closer to the substrate 1 to be inspected (direction of arrow 640), and the mirror 600 is rotated. As a result, the tilt angle of the mirror 600 is increased, and the elevation angle of the linear illumination is also increased. Here, when the elevation angle is increased, the irradiation position of the linear illumination changes in the horizontal direction of one surface of the substrate to be inspected, and the focal plane also changes in the vertical direction of one surface of the substrate to be inspected. Further, the linear illumination rotates on one surface of the substrate to be inspected.</p><p num="0075"> Therefore, in STEP2, in order to adjust the change in the horizontal direction, that is, to irradiate the linear illumination at the same horizontal position as before changing the elevation angle, the linear movement mechanism 620 is moved and the mirror 600 is moved in the horizontal direction. .. More specifically, the linear movement mechanism 620 is moved in a direction approaching the substrate 1 to be inspected, and the mirror 600 is moved in a direction approaching the substrate 1 to be inspected. As a result, the linear illumination is irradiated at the same horizontal position as before the elevation angle is changed.</p><p num="0076"> When the illumination elevation angle θ1 is changed while the linear illumination is kept parallel to the Y axis, the light 101 rotates on the reflecting surface of the mirror 600. Therefore, it is necessary to match the rotation angle of the light 101 with the rotation angle of the cylindrical lens 512.</p><p num="0077"> The following relational expression (1) holds for the illumination elevation angle θ1 and the inclination θ2 of the light 101 on the mirror 600 surface.</p><p num="0078"> θ2 = arctan (sin θ1) (1) Next, in STEP3, in order to adjust the vertical change of the focal plane of the irradiation light 101, that is, to align the focal plane with the one surface of the substrate to be inspected, the moving mechanism 526 is moved upward (relative to the substrate 1 to be inspected). Move away). This makes it possible to align the focal plane with one surface of the substrate to be inspected.</p><p num="0079"> Further, in STEP4, in order to adjust the rotation of the linear illumination, the rotation mechanism 525 is rotated in response to the change in the elevation angle. This makes it possible to adjust the rotation of the linear illumination.</p><p num="0080"> In the storage unit of the control CPU unit 401 of the defect inspection device, the rotation angle of the mirror 600 (movement position of the linear movement mechanism 610) and the mirror 600 when a plurality of illumination elevation angles are set for a certain azimuth angle. The horizontal movement position (movement position of the linear movement mechanism 620), the vertical position of the cylindrical lens 512 (the vertical position of the movement mechanism 526), and the rotation position of the cylindrical lens 512 (the rotation position of the rotation mechanism 525) are stored.</p><p num="0081"> Then, if an arbitrary illumination elevation angle is specified and input from the input unit 404, the control CPU unit 401 reads out the rotation angle of the mirror 600 corresponding to the input illumination elevation angle from the storage unit, and based on the read data. , Controls the linear movement mechanism 610, etc.</p><p num="0082"> As described above, according to one embodiment of the present invention, the cylindrical lens 512 is tilted by the same angle as the azimuth angle to make the linear illumination parallel to the Y axis, and the cylindrical lens 512 and the horizontal plane are aligned with each other. A parallel plane substrate 511 is placed at a position symmetrical in between, and incident light is incident on the cylindrical lens 512 via the parallel plane substrate 511 so that the incident light axis and the exit axis are on the same axis. doing.</p><p num="0083"> Therefore, although it is an inexpensive configuration, the linear illumination light can be shaped parallel to the Y-axis regardless of the fluctuation of the azimuth angle, and the optical axis shift at the focal position due to the rotation of the cylindrical lens 512 can be prevented. Can be prevented.</p><p num="0084"> Further, since the parallel plane substrate 511 and the cylindrical lens 512 can be moved in the vertical direction and can be moved in the rotational direction and the horizontal direction, the linear illumination irradiated on the substrate to be inspected. The position adjustment, focus adjustment, and rotation adjustment of the linear illumination light can be easily performed according to the change in the elevation angle of the light.</p>

1 ... substrate to be inspected (wafer), 3 ... beam spot (illumination area), 4 ... image sensor detection area, 100 ... illumination optical system, 101 ... incident light, 102 ... Incident light axis, 103 Exit light axis, 105 Light source, 200 Detection optical system, 201 Detection lens (objective lens), 202 Spatial filter, 203 Connection Image lens, 204: Zoom lens group, 205: Image sensor, 206: Observation optical system, 209: Polarized beam splitter, 210: Branch detection optical system, 300: Stage section, 301 Y stage, 302 X stage, 303 Z stage, 304 θ stage, 305 Stage controller, 400 Control system, 401 Control CPU part, 402 Signal processing unit, 403 Display unit, 404 Input unit, 500 Beam spot shaping unit, 501 Beam shaping unit, 502 Beam alignment unit, 510 Lens holder, 511 Parallel flat substrate, 512 Cylindrical lens, 525 Rotation mechanism, 526 Vertical movement mechanism, 600 Mirror, 602 Mirror holder, 610 , 620 Linear movement mechanism