Method for efficiently producing removable peripheral cards

The present invention relates to integrated circuit products, and more specifically to removable peripheral cards that include one or more integrated circuits.

As memory integrated circuit (IC) packages continue to trend toward smaller memory densities, advances in the way ICs are packaged are required. Recent advances include stacking multiple integrated circuit dies in a single IC package. Such internal package stacking involves stacking smaller dies onto larger dies. Each of the dies is wire bonded to the substrate. This type of stacking comprises, for example, a die having the same function (eg, two flash memory dies) or a die having different functions (eg, one flash memory die and one SRAM die). Further methods of laminating two or three dies have been made for laminated chip scale packages (laminated CSPs) and laminated thin small outline packages (TSOPs).

Memory cards are commonly used to store digital data used in a variety of products (eg, electronic products). These memory cards are required to store increasingly large amounts of data. Memory cards typically provide non-volatile data storage, and such memory cards are very popular and useful because they retain their data even after it is powered down. An example of a memory card is a flash card that stores data using flash-type or EEPROM-type memory cells. Flash cards have a relatively small form factor for cameras, computers (handhelds, notebooks, and desktop computers), set-top boxes, handhelds or other small audio players / recorders (eg MP3 devices), and medical monitors. It has been used to store digital data for such products. The leading supplier of flashcards is SanDisk Corporation in Sunnyvale, California.

Unfortunately, the manufacture of high density memory cards with a relatively small form factor is complex. One complex factor is that the final form factor of the memory card is irregular, i.e. not rectangular. Irregular form factors can serve a variety of purposes, such as restricting connections to connectors or ports in a particular direction, providing positional reference or locking positions, and so on. However, the assembly parts of integrated circuits must traditionally have a regular shape, that is, a rectangular shape, and be protected from the user. Thus, in the prior art, memory cards have an irregular form factor formed by a lid, frame or outer package surrounding a regularly shaped integrated circuit assembly. Lids, frames or outer packages are often made of plastic. Another problem with irregular form factors is that the assembly of lids, frames or outer packages around integrated circuit assemblies is not a semiconductor manufacturing process, so it must be done on a separate manufacturing line, perhaps in a different manufacturing facility. It must not be.

<p> Therefore, there is a need to improve the approach for manufacturing memory cards with a small form factor.</p>

<p> In a broad sense, the present invention relates to an improved technique for manufacturing integrated circuit products. This improved technology enables the production of smaller and cheaper integrated circuit products. In one aspect of the invention, an integrated circuit product manufactures a batch at a time, and the process of unifying the batch into individual integrated circuit products is a sewing or cutting operation that makes the batch non-linear (eg, non-rectangular or curved). Is used, and the resulting individualized integrated circuit package no longer needs to be perfectly rectangular. Another aspect of the invention is that the integrated circuit product can be manufactured in a semiconductor assembly process, which makes it optional to provide an external package or container.</p><p> Integrated circuit products relate to removable peripheral cards or other removable media formed using semiconductor assembly technology. One type of removable peripheral card is called a memory card. Memory cards are typically small integrated circuit products that provide data storage. These memory cards are inserted or accepted into ports or connectors on electronic devices such as computers, cameras, mobile phones and personal digital assistants.</p><p> The present invention can be implemented in a variety of ways such as systems, devices, devices or methods. Some embodiments of the present invention will be described below. As a method of forming a plurality of integrated circuit products at the same time, one embodiment of the present invention prepares a multi-instance readframe or a multi-instance substrate having a plurality of instances (meaning an instance, a chip, a die, or an integrated circuit product). A step of attaching one or more dies to each instance on at least one side surface of the multi-instance lead frame or multi-instance substrate, and a step of attaching each of the one or more dies to the lead frame or substrate. A step of electrically connecting to each of the instances, and then a step of collectively sealing the plurality of instances on at least one side surface of the multi-instance lead frame or the multi-instance substrate with a molding material, and the plurality of said. It is a method including at least a step of forming an integrated circuit product by using a step of forming a unit at least in a non-linear manner in at least one region of each instance.</p><p> According to one embodiment, integrated circuit products manufactured in batches include a step of preparing a multi-instance lead frame or multi-instance substrate having multiple instances and one or more dies of said multi-instance lead frame or multi. A step of attaching to each instance on at least one side surface of the instance board, a step of electrically connecting each of the one or more dies to the respective instance of the lead frame or the board, and then the multi. A single unit using a step of collectively sealing the plurality of instances on at least one side surface of an instance lead frame or a multi-instance substrate with a molding material and a step of molding each of the plurality of instances into at least a non-linear shape. One of the plurality of instances produced by the operation is the integrated circuit product.</p><p> As a method of forming a plurality of memory cards at the same time, each said memory card includes at least one memory die and a controller die, and one embodiment of the present invention includes a step of preparing a multi-instance read frame having a plurality of instances. , The step of attaching the multi-instance lead frame on a removable tape, the step of placing the die attach material on each part of the instance of the multi-instance lead frame, and the memory die of the instance. A step of attaching to each of the instances via the die attach material, a step of fixing the controller die to each of the instances, and each of the memory die and the controller die of the multi-instance lead frame. Electrical to each instance At least a step of connecting to the instance, a step of encapsulating the instances together with a molding material, and then a step of unifying each of the instances by using at least a step of forming them in a non-linear manner. Including.</p><p> As a method of forming a plurality of memory cards at the same time, each said memory card includes at least one memory die and a controller die, and one embodiment of the present invention is a step of preparing a multi-instance printed circuit board having a plurality of instances. A step of attaching the memory die to each of the instances, a step of fixing the controller die to each of the instances, and electricity of each of the memory die and the controller die to each instance of the multi-instance printed circuit board. It includes at least a step of connecting the instances, a step of collectively sealing the instances with a molding material, and a step of subsequently unifying each of the instances by using at least a step of forming into a non-rectangular shape.</p><p> Other aspects and advantages of the invention will be apparent by the following detailed description, along with the accompanying drawings exemplifying the principles of the invention.</p>

The present invention will be readily understood by the following detailed description in conjunction with the accompanying drawings. Here, similar reference numbers represent similar components. The present invention relates to an improved technique for manufacturing integrated circuit products. The improved technology enables the production of smaller and cheaper integrated circuit products. In one aspect of the invention, one batch of integrated circuit products is manufactured at a time, and the process of singing this batch into individual integrated circuit products is non-linear (eg, non-rectangular or curved). The individualized integrated circuit package obtained by using a forming or cutting operation no longer needs to be a perfect rectangle. Another aspect of the invention is that the integrated circuit product can be manufactured in a semiconductor assembly process, which optionally provides an external package or container.

These integrated circuit products can be formed using semiconductor assembly technology. Integrated circuit products also have a small form factor. The small form factor is on the order of chip scale packaging. Further, this form factor can be formed in a semiconductor manufacturing process similar to that of a semiconductor assembly in semiconductor manufacturing.

The integrated circuit product is a removable peripheral card. Detachable peripheral cards are useful for many purposes and perform a variety of functions. One type of removable peripheral card is called a memory card. Memory cards are typically small integrated circuit products that provide data storage. These memory cards are plugged into or accepted by ports or connectors on electronic devices such as computers, cameras, mobile phones and personal digital assistants. The memory card is a non-volatile memory card. A memory card comprises a plurality of integrated circuit chips stacked on one or both sides of a substrate or lead frame.

Examples of embodiments of the present invention will be described below with reference to FIGS. 1A-5B. However, those skilled in the art will readily appreciate that the detailed description of these figures in the present application is for illustration purposes only and that the present invention extends beyond these limited embodiments.

FIG. 1A is a plan view of the manufactured semiconductor product. The substrate of the manufactured semiconductor product is a multi-instance substrate 100. The multi-instance board 100 is a plurality of instances (inst) of the integrated circuit product. Each of the ances) 104 has a molding material 102 that seals the given circuit (ie, the semiconductor die). Instances 104 of integrated circuit products are labeled 104-1,104-2,104-3,104-4, ..., 104-n. Each of the instances 104 represents an integrated circuit product. In other words, the manufactured semiconductor products have an array of integrated circuit products. Therefore, when the multi-instance substrate 100 is processed and the instance 104 is formed on the multi-instance substrate 100, the integrated circuit product is manufactured by the batch method.

FIG. 1B is a cross-sectional view of the manufactured semiconductor product when viewed along the reference lines A-A'shown in FIG. 1A. In FIG. 1B, instances 104-1, 104-2 and 104-3 each include a first semiconductor die 106-1, 106-2, 106-3, respectively. The integrated circuit die 106 is mounted on the multi-instance substrate 100. In one embodiment, the multi-instance board 100 corresponds to a printed circuit board (PCB) or printed circuit board (PCB). Further, each of the instances 104-1, 104-2, 104-3 includes a second semiconductor die 108-1, 108-2, 108-3, respectively. As shown in FIG. 1B, the second semiconductor die 108 is laminated on the first semiconductor die 106. Each of the first semiconductor dies 106 can be mounted directly on the instance 104 of the multi-instance substrate 100, or can be adhered to the instance 104 of the multi-instance substrate 100 via die attach or adhesive material. The second semiconductor die 108 can be mounted (that is, laminated) directly on the first semiconductor die 106, or can be bonded to the first semiconductor die 106 via a die attach or an adhesive material, respectively. Further, in one embodiment, the semiconductor dies 106, 108 are electrically connected to the instance 104 of the multi-instance substrate 100 by wire bonding 110, respectively. For example, the semiconductor dies 106-1,108-1 are electrically connected to the instance 104-1 of the multi-instance substrate 100 by wire bonding 110-1.

Therefore, by applying the multi-instance substrate 100 during manufacturing and forming a plurality of instances of the integrated circuit product, the integrated circuit product is produced in a batch method, that is, in parallel production. However, when the mold material 102 is placed on the various instances 104 to seal the instances, the mold material 102 forms an integral structure that covers all the instances 104 relative to the multi-instance substrate 100. The various instances 104 of the integrated circuit product must then be individualized or united from the integral structure. Therefore, the manufactured semiconductor product is sewn or cut into a plurality of instances. According to one aspect of the invention, integrated circuit products are not perfectly rectangular in shape, so that the semiconductor products manufactured can be integrated into individual instances, eg, non-rectangular or non-linear, such as curved. Sewing is carried out in the shape of a rectangle. Such sewing is performed efficiently with a very fine sewing operation, a very thin saw width, and a high degree of precision and hardness.

2A and 2B show typical shapes of integrated circuit products manufactured by the present invention. In FIG. 2A, the integrated circuit product 200 is illustrated with a portion of the external shape having a curved region 202. Thus, when multiple instances are united from a semiconductor product manufactured with multiple instance boards and an integral molding material, the sewing operation is manufactured to be able to produce the integrated circuit product 200. It is necessary to be able to sew semiconductor products efficiently. In this embodiment, the sewing operation utilizes a combination of linear and non-linear cutting. Straight-line cutting (rectangular cutting) is easily achieved, but non-linear cutting for curved area 202 (curved cutting) involves elaborate sewing operations, as detailed below. I need.

FIG. 2B is a top view of the integrated circuit product 220 having the curved region 222. The integrated circuit product 220 is generally similar to the integrated circuit product 200 shown in FIG. 2A. But integrated circuits The curved region 222 of the product 220 has two small curved portions separated by a slope portion, while in FIG. 2A the curved region 202 has two rounded regions without a slope portion (eg,). S-shaped curve). Curved region 202 is classified as a non-rectangular region even when the two small curved portions shown in FIG. 2B form an acute angle created by intersecting straight cuts.

FIG. 2C is a top view of the integrated circuit product 250 according to another embodiment of the present invention. The integrated circuit product 250 includes a curve region 252 similar to the curve region 222 of the integrated circuit product 220 shown in FIG. 2B. In addition, the integrated circuit product 250 has a notch 254. The notch 254 is a relatively small portion obtained by the sewing operation. The notch 254 acts as a reference point or catch (eg, latch catch) area for the integrated circuit product 250 and is used when the integrated circuit product 250 is inserted into a connector or receptacle for receiving it. The small size of the notch 254 requires precise saw-in operation to obtain such a small shape.

Therefore, this sewing operation is capable of producing integrated circuit products having curved portions or small shapes in its outer body or form factor. The resulting integrated circuit product is generally non-rectangular because at least one part is curved, polyhedral, or other non-rectangular. The operations for manufacturing such integrated circuit products are described in detail below.

FIG. 3 is a flow chart of a batch type integrated circuit product process 300 according to an embodiment of the present invention. The batch integrated circuit product process 300 operates to manufacture a plurality of integrated circuit products. For example, the integrated circuit products manufactured are the integrated circuit products shown in FIGS. 2A, 2B, and 2C.

The batch integrated circuit product process 300 first prepares a multi-instance lead frame or multi-instance board (302). The lead frame or board acts to support the devices or components of an integrated circuit product for each of multiple instances that can be formed simultaneously on the lead frame or board. In the case of a lead frame, the lead frame is typically a conductive metal such as copper. In the case of a board, the board is often a printed circuit board (PCB). For example, in the case of a board, the multi-instance board is the multi-instance board 100 shown in FIG. 1A.

Then, if desired, one or more passive components are attached to each instance of the multi-instance readframe or multi-instance board (304). Here, if the integrated circuit product to be manufactured contains one or more passive components, such passive components are attached to each instance (304). Examples of passive components are capacitors and resistors. In addition, one or more dies (integrated circuit dies) or integrated circuit chips are attached to each instance of a multi-instance readframe or multi-instance board (306). For each instance, one or more dies are attached within the lead frame or area on the board that corresponds to that instance. One or more dies may be attached directly to the lead frame or substrate, or attached to the lead frame or substrate by a die attach material or other inclusions. Further, in one embodiment, if multiple dies for an instance are attached within the area of the lead frame or substrate corresponding to that instance, the die is one die overlaid with the other. It is attached in a normal state where it is laminated so as to be. The die laminated on the lower die can be attached directly to the lower die or attached to the lower die by a die attach material or other inclusions.

After one or more dies are attached to each instance (306), each of the one or more dies in each instance is electrically connected to the lead frame or the corresponding part of the board (308). .. In one embodiment, these electrical connections are provided between the wire bonding pads of the die, the leads or terminals, and the lead frame or substrate. By wire bonding, each electrical connection is a small, thin wire that extends from the die to the lead frame or substrate and is secured by solder.

The multi-instance is then integrally sealed with molding material (310). The mold material is formed as an integrated encapsulation that surrounds each of the lead frame or an instance of the substrate. The resulting seal is also referred to as a molded panel. Molding materials are applied in a variety of ways, including Tollens famolding techniques or flood molding techniques.

In addition, markings are added to the molding material if desired (312). For example, the marking includes a logo or other information printed on the surface of the molding material for each of the instances. The markings indicate, for example, the manufacturer, trademark, and / or device type.

Finally, each instance is then united using the process of forming at least a non-rectangular shape (314). Here, the unification 314 may include a step of forming into a rectangle, but the forming process of each instance includes a step of forming into a non-rectangular shape for at least each part of the instance (non-rectangular shaping). use. This elaborate molding process is accomplished using a sewing device. This sewing device has a small cutting width and can form a small portion.

Examples of sewing devices include, for example, water jet cutting, laser cutting, water guided laser cutting, dry media cutting, and diamond cutting. Water jet cutting is a preferred cutting device given its small cutting width (eg 50 microns), its ability to form small shapes, and its high cutting speed. Water is also used with laser cutting to complement or concentrate its effect. Following the unification 314, the batch type integrated circuit product process 300 is completed and completed.

Although not shown in FIG. 3, the batch integrated circuit product process 300 can further include other operations as desired in one embodiment. For example, after sealing 310, but before unification 314, (i) test integrated circuit products in an array configuration, and / or (ii) test pins and / or conductive leads or traces. Additional operations can be performed to protect and / or coat for wear resistance. Typically, test pins are formed in each instance of the lead frame or substrate, if possible. In one embodiment, after the test pins have been used to test each of the integrated circuit products, the test pins can be coated or coated with a protective film or layer (eg, thereby electrically forming the test pins). To insulate). In addition, following Solitary 314, each instance is further shaped to remove or smooth sharp edges. In addition, a polymer coating can be applied to each of the instances as a protective surface. In addition, for each instance, a lidding operation that adds an external package or lid (a pair of lids) around the integrated circuit product may be further used. Such a package or lid can provide an outer cover for an integrated circuit product and establish the features of that external product. For example, when the resulting integrated circuit product is smaller than the desired form factor of the product, the integrated circuit product can be fitted to the desired form factor by surrounding the integrated circuit product with an external package or lid.

An integrated circuit product is a removable peripheral card or other removable medium formed using semiconductor assembly technology. A type of removable peripheral card is called a memory card. Memory cards are usually small integrated circuit products that store data. These memory cards are inserted into or accepted into the ports or connectors of electronic devices such as computers, cameras, mobile phones and personal digital assistants. Although other integrated circuit products are formed by such a process in FIGS. 4, 5A and 5B, they will be examined below with reference to the memory card.

FIG. 4 is a flow chart of a batch type memory card process 400 according to an embodiment of the present invention. In the batch type memory card process 400, a plurality of memory cards are formed in one batch at a time by using an integrated circuit assembly process. The batch memory card process 400 first obtains a multi-instance printed circuit board (PCB) (402). A multi-instance PCB is a laminated structure that includes conductive traces that are used to electrically connect various devices or components attached to the PCB. Memory dies are mounted on the PCB in each instance. The controller die is then mounted on the memory die for each instance. At this point, for each instance, there is a die stack with a lower die that is a memory die and an upper die that is a controller die. The memory die and controller die are then wire bonded to the PCB in each instance (408). Wire bonding serves to electrically connect the memory die and controller die to the PCB.

The mold material is then applied to the PCB and the parts formed on the PCB. Here, the molding material serves to protect those parts and their electrical connections to the PCB and to provide an external body for the memory card. A method in which each instance of a multi-instance PCB is at least non-linear after the molding material has been fixed or cured. It is unitized using shaping) (412). That is, in each single unit 412 of the memory card, each of the four sides is sewn, and at that time, at least one side includes a curved portion that needs to be formed in a non-linear shape in order to sew the side. As a result, individual instances of memory cards manufactured in the same batch have at least a portion of a housing or external structure that has a non-linear shape. In other words, the external structure or housing of the memory card is not just a rectangle, but includes at least one area that has a non-linear (ie, non-rectangular) shape. For example, in FIG. 2A, the integrated circuit product 200 includes a curved region 202 that corresponds to a non-linear (or non-rectangular) region. Advantageously, the stand-alone 412 can be carried out in the same manufacturing department, as well as other operations of the batch memory card process 400. Further, by forming / cutting in a non-linear manner, it is possible to form the memory card into the final shape by such a simple substance 412. Therefore, the outer shape of the memory card, which is not just a rectangle but has at least one curved area, is thus determined by sewing / cutting of the standalone 412. Following the stand-alone 412, the batch memory card process 400 is completed and completed.

Therefore, no additional external package or body (eg a plastic lid) is needed, and thus no additional steps are required to form such a package or body and thus insert its instance into such a package or body. Not needed. Moreover, the process of manufacturing a memory card is more efficient and cheaper. No external package or body is required, but the instance may be provided with an external package or body if desired. Such a package or body may provide an outer cover for the integrated circuit product, thereby establishing an external product feature of the integrated circuit. For example, if the resulting memory card is less than the desired form factor for that memory card, the memory can be stored by enclosing the memory card in an external package or lid. The card can be matched to the desired form factor.

5A and 5B are flow charts of a batch-type memory card process 500 according to another embodiment of the present invention. The batch type memory card process 500 is a process related to an integrated circuit product manufactured in a lead frame, specifically, a memory card manufacturing process.

The batch memory card processing 500 first obtains a multi-instance readframe (502). The multi-instance lead frame is a conductive metal such as copper. The lead frame is configured to include an array of individual instances in which integrated circuit products are held together by a batch process. A removable polymer tape is mounted on one side of the multi-instance lead frame to provide an interim substrate and to protect and support one surface of the multi-instance lead frame (504). The die attach material is then placed in the area of each instance of the multi-instance readframe (506). The die attach material is typically a non-conductive adhesive.

The memory die is then mounted on the die attach material in the area of each instance of the multi-instance readframe (508). The controller die is mounted on the memory die of each instance (510). Here, in each instance, the controller die is stacked on the memory die. Although not required, the die attach material is placed between the controller die and the memory die to hold the controller die in place and to electrically insulate the controller die from the memory die. Further, although controller dies are described as being stacked on the memory dies of each instance, it will be appreciated that controller dies can be placed on each instance along the memory dies to provide a non-stacked configuration. .. However, the advantage of the stacking method is that the overall form factor of the memory card can be made smaller.

The memory die and controller die are then wire bonded to each instance of the multi-instance readframe (512). Here, the pads or leads of the memory die and controller die are electrically connected to each instance of the multi-instance lead frame by using the wires arranged by the wire bonding process. Mold material is then applied to the multi-instance lead frame and the components above it (514). The molding material protects the electrical connections to the part (eg die) and the multi-instance readframe, while providing an external body for the memory card. The application of mold material (514) can be carried out in a variety of ways. One is called transfer molding and the other is called flood molding.

The polymer tape is then removed from one side of the multi-instance lead frame (516). The sides of the multi-instance reed frame, which was protected by polymer tape, can then be plated (518) with exposed reeds with a conductive material such as gold. In addition, additional etching steps may apply a small amount of etching to the lead frame to smooth the corners or edges of the lead frame. Such slight etching is called one-half etching.

Finally, each instance of the multi-instance readframe is isolated to form a separate memory card (520). The shape of the memory card is formed by the single instance 520. After the instance is unitized (520), the batch memory card process 500 for the manufactured batch of memory cards is completed and terminated.

In one embodiment, the simple substance 520 uses a step of forming into a non-linear shape. That is, in each memory card stand-alone 520, each of the four sides is sewn, whereby at least one side has a curved portion that requires a non-linear shaping step to sew that side. .. As a result, individual instances of memory cards manufactured in one batch have at least a portion of the housing or external structure that has a non-linear shape. In other words, in this embodiment, the external structure or housing of the memory card includes at least one region having a non-linear (or non-rectangular) shape rather than just a rectangle. For example, in FIG. 2A, the integrated circuit product 200 includes a curved region 202 corresponding to a non-linear (or non-rectangular) region. Advantageously, the stand-alone 520 can be performed in the same manufacturing process as the other batch memory card process 500. Further, since it can be formed / cut in a non-linear shape, the memory card can be formed into a final shape by such a single unit 520. Therefore, in this embodiment, the external shape of the memory card, which is not just a rectangle (ie, contains at least one curved area), can be determined by the sewing / cutting step of the stand-alone 520. Following the stand-alone 520, the batch memory card process 500 is completed and completed.

Similar to the embodiment shown in FIG. 4, no additional external package or body (eg plastic lid) is required. Thus no additional steps are needed to form such a package or body and thus insert its instance into such a package or body. As a result, the process for manufacturing memory cards is more efficient and cheaper. It is not necessary to use an external package or external body, but as mentioned above, an instance can optionally be used by an external package or external body to establish an external product feature. For example, if the resulting integrated circuit product is smaller than the desired form factor, external product features are set, including setting the desired form factor by enclosing the integrated circuit product in an external package or lid. Therefore, the integrated circuit product can be adapted to the desired form factor.

The integrated circuit product according to the present invention can be used in a memory system. The present invention is further an electronic system including a memory system as described above. Memory systems are typically used to store digital data used in various electronic products. Often the memory system is removable from the electronic system, so the stored digital data is portable. These memory systems are referred to as memory cards. The memory system according to the invention has a relatively small form factor, including cameras, handheld or notebook computers, network cards, network equipment, set-top boxes, handhelds or other small audio players / recorders (eg MP3 equipment), and Used to store digital data for electronic products such as medical monitors. Examples of memory cards include PC cards (formerly PCMCIA devices), flash cards, flash disks, multimedia cards, and ATA cards. As an example, a memory card can use a flash type or EEPROM type memory cell to store data. More generally, memory systems are not only memory cards, but also memory sticks or other semiconductor memory products.

The advantages of the present invention are innumerable. The various embodiments or examples have the following advantages: One advantage of the present invention is that integrated circuit products such as memory cards can be made smaller. For example, a memory card can be as small as a chip scale package. Another advantage of the present invention is that the assembly of integrated circuit products can be fully implemented using a semiconductor assembly manufacturing line. Yet another advantage of the present invention is that the molding material and substrate or lead frame used in the process of forming integrated circuit products serve as outer or outer surfaces. By elaborate molding of the outer surface or outer surface , The integrated circuit product can be formed to have curved regions and / or small features. Small features serve for functional or decorative purposes. Yet another advantage of the present invention is that integrated circuit products can be manufactured quickly and inexpensively. Another advantage of the present invention is the form factor of integrated circuit products (eg removable peripheral cards). factor) can be set to the extent of semiconductor assembly. Yet another advantage of the present invention is that the surrounding plastic shell, body, or frame is optional, which can reduce unused manufacturing time and cost, as well as external product features of the product used (eg, form factor). ) Can be set flexibly.

Many features and advantages of the present invention are apparent from this description, and thus the appended claims are intended to cover all such features and advantages of the present invention. Moreover, it is not desired for those skilled in the art to limit the invention to the configurations and operations illustrated and described, as many modifications and modifications can easily occur. Therefore, all suitable modifications and equivalents are considered to be within the scope of the present invention.

<figref num="1A">Top view of the manufactured semiconductor product.</figref><figref num="1B">Sectional view of the manufactured semiconductor product along reference lines A-A'shown in FIG. 1A.</figref><figref num="2A">The schematic which shows the typical shape of the integrated circuit product manufactured by this invention.</figref><figref num="2B">The schematic which shows the typical shape of the integrated circuit product manufactured by this invention.</figref><figref num="2C">Top view of an integrated circuit product according to another embodiment of the present invention.</figref><figref num="3">FIG. 6 is a flow chart of a batch type integrated circuit product process according to an embodiment of the present invention.</figref><figref num="4">FIG. 6 is a flow chart of a batch type memory card process according to an embodiment of the present invention.</figref><figref num="5A">FIG. 6 is a flow chart of a batch type memory card process according to another embodiment of the present invention.</figref><figref num="5B">FIG. 6 is a flow chart of a batch type memory card process according to another embodiment of the present invention.</figref>