Wiring and sealing scheme for an active matrix display device

The present invention relates to a display device having a sealing structure. In particular, semiconductor devices (using semiconductor thin films) The present invention relates to an active matrix type display device using an element). Also, Active Matrix The present invention relates to an electronic device in which a type display device is used as a display unit.

In recent years, as a flat type display, an electro-optical device such as an EL display device having an EL element has been used. The place is attracting attention.

The EL element has a structure in which an EL layer is sandwiched between a pair of electrodes (anode and cathode), but EL The layers usually have a laminated structure. Typically, the Kodak Eastman Company A laminated structure called "hole transport layer / light emitting layer / electron transport layer" proposed by Tang et al. Can be mentioned. This The structure of is very high luminous efficiency, and most of the EL display devices currently under research and development are The structure of is adopted.

In addition, a hole injection layer / hole transport layer / light emitting layer / electron transport layer or hole injection on the anode The structure may be such that the layer / hole transport layer / light emitting layer / electron transport layer / electron injection layer are laminated in this order. Light emitting layer May be doped with a fluorescent dye or the like.

In the present specification, all the layers provided between the cathode and the anode are collectively referred to as an EL layer. Yo The hole injection layer, hole transport layer, light emitting layer, electron transport layer, electron injection layer, etc. described above are all EL layers. include.

Then, a predetermined voltage is applied to the EL layer having the above structure from the pair of electrodes, thereby causing the light emitting layer. Carrier recombination occurs in and emits light. In this specification, the EL element emits light. This is called driving the EL element. Further, in the present specification, the anode, the EL layer and the cathode are used. The formed light emitting element is called an EL element.

In the present specification, the EL element refers to light emission (fluorescence) from a singlet exciton. And those that utilize the emission (phosphorescence) from triplet excitons. To do.

An active matrix type can be mentioned as a configuration of the EL display device.

FIG. 9 shows an example of the configuration of the pixel portion of the active matrix type EL display device. Activema In the trix type EL display device, each pixel is a thin film transistor (hereinafter referred to as TFT). Have. Gate signal line Gate signal line (G1 ~ Gy) that inputs the selection signal from the drive circuit Is connected to the gate electrode of the switching TFT901 of each pixel. Also, One of the source area and drain area of the switching TFT901 of each pixel is a saw. The source signal line (S1 to Sx) that inputs signals from the signal line drive circuit, and the other is for EL drive. Connected to the gate electrode of the TFT 902 and one electrode of the capacitor 903 of each pixel ing. The other electrode of capacitor 903 is connected to the power supply line (V1 to Vx). There is. One of the source area and drain area of the EL drive TFT902 of each pixel is electric. The source supply line (V1 to Vx) is connected to the other, and the other is connected to the EL element 904 of each pixel.

When the gate signal line G1 is selected by the gate signal line drive circuit and a signal is input, the gate The switching TFT901 connected to the signal line G1 is turned on. Here, the source signal line When a signal is input from the drive circuit to the source signal lines S1 to Sx, the pixel to which the signal is input Then, the EL drive TFT902 is turned on, and the EL element 9 is connected from the power supply line (V1 to Vx). A current flows through 04, and the EL element 904 emits light. This operation is performed on all gate signal lines G1 ~ Gy is repeated to display the image.

The EL element 904 has an anode, a cathode, and an EL layer provided between the anode and the cathode. The anode of the EL element 904 is connected to the source area or drain area of the EL drive TFT 902. In this case, the anode of the EL element 904 is the pixel electrode and the cathode is the counter electrode. On the contrary, EL element The cathode of the child 904 is connected to the source area or drain area of the EL drive TFT 902. In this case, the cathode of the EL element 904 is the pixel electrode and the anode is the counter electrode.

In this specification, the potential of the counter electrode is referred to as the counter potential. In addition, the counter electrode is connected to the counter electrode. The power supply that gives the rank is called the opposite power supply. EL drive is the potential difference between the potential of the pixel electrode and the potential of the counter electrode. It is a voltage, and this EL drive voltage is applied to the EL layer.

Here, there is a problem that the organic EL layer is deteriorated by moisture and oxygen. Therefore, EL After forming the layer, it is sealed with UV curable resin in a nitrogen atmosphere without exposing it to the atmosphere. It is common. Figure 4 shows an example of sealing the EL display device.

FIG. 4 (A) shows a top view of the EL display device. Pixel unit 402 with EL element, gate signal Pixel unit on the insulating substrate 41 having the line drive circuit 403 and the source signal line drive circuit 404. Sea so as to surround 402, gate signal line drive circuit 403 and source signal line drive circuit 404. Form the lumber 401. At this time, an opening (as an injection port for later injecting the filler 43) (Not shown) is provided. After that, a spacer (not shown) is sprinkled and the cover material 42 is attached. match. After curing the sealing material 401 by ultraviolet irradiation, the cover material 42 and the sealing material 4 Filler 43 is injected into the area surrounded by 01, and filler 43 is injected with a sealing material (not shown). Seal the mouth.

FIG. 4 (B) shows a cross-sectional view of A to A'of FIG. 4 (A).

For the sake of simplicity, the TFTs that make up the gate signal line drive circuit 403 are used here. Only the EL drive TFT 414 and the EL element 417 that make up 413 and the pixel unit 402 are shown. .. The insulating substrate 41 will be referred to as a pixel substrate. The EL element 417 is a pixel electrode 407 and an EL. It is composed of a layer 416 and a counter electrode 408. The cover material 42 is separated by the sealing material 401. It is attached, and the filler 43 is sealed between the pixel substrate 41 and the cover material 42. filling A hygroscopic substance (not shown) is added to the material 43. In this way, EL due to moisture It prevents the deterioration of the element 417.

Here, 406 is the gate insulating film of TFT413 and TFT414 for EL drive, and 415 is the gate insulating film. It is an interlayer insulating film.

The pixel section 402, the gate signal line drive circuit 403, and the source signal line drive circuit 404 The input signal is wired from the FPC (Flexible Printed Circuit) board 410. It is input through 2 (412a ~ 412c) (see Fig. 4 (A)). Where wiring 412 Connects the FPC board 410 and each drive circuit through between the pixel board 41 and the sealing material 401. It continues. The FPC substrate 410 has an anisotropic conductive film at the external input terminal 409. It is connected to the wiring 412 by (not shown).

<p>In the EL display device, in order to prevent deterioration of the EL element, a sealing material is used to cover the pixel substrate and cover. -It is necessary to bond the materials and seal the EL element.</p><p> Here, unlike the pixel part, the sealing material part and each drive circuit part do not display an image. This is the part. In the conventional display device, the part of the display screen that does not display this image is occupied. The ratio of the display device is large, which has been a problem in reducing the size of the display device.</p><p> Therefore, it is an object of the present invention to reduce the area of the portion other than the pixel portion in the display device.</p>

<p> Wiring is formed on the portion of the pixel substrate covered with the sealing material. In addition, through this wiring When the material is irradiated with ultraviolet rays, the sealing material on the upper part of the wiring is sufficiently exposed to ultraviolet rays. , Set the line width of this wiring.</p><p> As a result, the surface occupied by the wiring and the sealing material around the pixel portion and the drive circuit portion in the display device. The product can be reduced and the display device can be miniaturized.</p><p> The configuration of the present invention is shown below.</p><p> According to the present invention, a substrate, a cover material, and a sealing material are provided, and a plurality of substrates are provided on the substrate. It has a pixel and a drive circuit for inputting a signal to the plurality of pixels, and the plurality of pixels Each has an EL element, the cover material has a light-shielding property, and the sealing material is ultraviolet. It has a material that is cured by a wire, surrounds the plurality of pixels and the drive circuit, and surrounds the substrate. The sealing material is placed on the top, and the cover material and the substrate are brought into close contact with each other with the sealing material sandwiched between them. In a display device in which the EL element is sealed, between the sealing material and the substrate. A first wire is formed, the first wire having a plurality of second wires connected in parallel. A display device characterized by the above is provided.</p><p> The portion of the substrate in contact with the sealing material is characterized by being formed of an inorganic substance. It may be a display device.</p><p> According to the present invention, the first substrate, the second substrate, and the sealing material are provided, and the first group is provided. It has a plurality of pixels and a drive circuit for inputting signals to the plurality of pixels on the board, and has a front. The second substrate has a light-shielding property, and the sealing material has a material that is cured by ultraviolet rays. A sealing material is arranged on the first substrate so as to surround the plurality of pixels and the drive circuit. The second substrate and the first substrate are brought into close contact with each other with the sealing material sandwiched between them, and the first base is formed. A display in which a liquid crystal is enclosed in a region surrounded by a plate, the second substrate, and the sealing material. In the apparatus, the first wiring is formed between the sealing material and the first substrate, and the first wiring is formed. The first wiring is a display device characterized by having a plurality of second wirings connected in parallel. Provided.</p><p> The portion of the first substrate in contact with the sealing material shall be formed of an inorganic substance. It may be a display device characterized by.</p><p> The width L of the plurality of second wires connected in parallel and the plurality of second wires connected in parallel. It is a display device characterized in that the ratio L / S of the wiring interval S takes a value of 0.7 to 1.5. You may.</p><p> The width L of the plurality of second wires connected in parallel takes a value of 100 μm to 200 μm. , The interval S of the plurality of second wires connected in parallel has a value of 50 μm to 150 μm. It may be a display device characterized by the above.</p><p> The wiring is the source wiring and the drainage of the TFT of the plurality of pixels and the drive circuit. A display device characterized in that it is made of the same substance as the substance that constitutes the in-wiring. May be good.</p><p> According to the present invention, a plurality of pixels and a plurality of external input terminals are provided on the substrate, and the plurality of pixels is provided. The number of pixels is an anode that supplies a current to the EL element in a display device having the EL element. A display device is provided in which the wire is connected to the plurality of external input terminals. ..</p><p> According to the present invention, a plurality of pixels and a plurality of external input terminals are provided on the substrate, and the plurality of pixels is provided. The number of pixels is a shadow that draws a current from the EL element in a display device having an EL element. A display device is provided in which the pole wire is connected to the plurality of external input terminals. To.</p><p> Of the plurality of external input terminals, at least one external input terminal is located at one end of the board. The other external input terminals in the vicinity are near one end of the board, which is different from one end of the board. It may be a display device characterized by being nearby.</p><p> At least one of the plurality of external input terminals is connected to the first FPC board, and the device is connected to the first FPC board. Other than the above, it may be a display device characterized by being connected to a second FPC board.</p><p> The distance between the plurality of external input terminals is 1/2 or more of the length of the long side of the board. The display device may be characterized in that.</p><p> According to the present invention, the substrate, the first wiring formed on the substrate, the plurality of pixels, and the shield are shielded. A display device having a cover material having light property and a sealing material, which is formed on the substrate. The plurality of pixels are sealed by the sealing material and the covering material, and the first The wiring is covered with the sealing material, and the sealing material has a material that is cured by ultraviolet rays. The first wiring is characterized by having a plurality of second wirings connected in parallel. A display device is provided.</p><p> According to the present invention, the substrate, the first wiring formed on the substrate, the plurality of pixels, and the shield are shielded. A display device having a cover material having light property and a sealing material, which is formed on the substrate. The plurality of pixels are sealed by the sealing material and the covering material, and the plurality of pixels are sealed. Each pixel has an EL element, and the first wiring is covered with the sealing material. Therefore, the sealing material has a material that is cured by ultraviolet rays, and the first wiring is ordinary. A display device is provided characterized by having a plurality of second wires connected in a row.</p><p> According to the present invention, the substrate, the first wiring formed on the substrate, the plurality of pixels, and the shield are shielded. A display device having a cover material having light property, a sealing material, and a liquid crystal, which is on the substrate. The plurality of pixels formed in the above and the liquid crystal are sealed by the sealing material and the covering material. The first wiring is covered with the sealing material, and the sealing material is ultraviolet rays. The first wire has a plurality of second wires connected in parallel. A display device characterized by having wiring is provided.</p><p> A video camera, an image reproduction device, and a head mount characterized by using the display device. It may be a display, a mobile phone, or a personal digital assistant.</p>

<p> In display devices such as EL display devices and liquid crystal display devices, the part occupied by the wiring around the drive circuit The area occupied by the part that does not display the image, such as the part where the sealing material is formed, is large and is displayed. There was a problem in miniaturization of the device.</p><p> However, in the present invention, the wiring around the drive circuit is also formed in the sealing material portion by the above configuration. can do. Thereby, a small display device can be provided.</p>

<figref num="1">Top view and sectional view of the EL display device of the present invention.</figref><figref num="2">Top view and sectional view of the EL display device of the present invention.</figref><figref num="3">The figure which shows the shape of the wiring of the display device of this invention.</figref><figref num="4">Top view and sectional view of a conventional EL display device.</figref><figref num="5">The figure which shows the wiring of the power line of the display device of this invention.</figref><figref num="6">Top view and sectional view of the liquid crystal display device of the present invention.</figref><figref num="7">Top view and sectional view of the liquid crystal display device of the present invention.</figref><figref num="8">The figure of the electronic device using the display device of this invention.</figref><figref num="9">The figure which shows the structure of the pixel part of an EL display device.</figref><figref num="10">The figure which shows the structure of the pixel part of a liquid crystal display device.</figref>

An embodiment of the present invention will be described with reference to FIG.

An EL display device in which wiring is formed on a portion of a pixel substrate covered with a sealing material will be described. To. In this specification, the portion of the pixel substrate covered with the sealing material is referred to as a sealing region. To.

FIG. 1A shows a top view of the EL display device of the present invention. Pixel section 71 on the pixel board 701 1 and the gate signal line drive circuit 702 and the source signal line drive circuit 703 are formed. This A sealing material 704 is formed around the surface, and a cover material 705 is attached. FP The C board 706 is connected to the pixel board 701 by an external input terminal 707. wiring The 708 receives a signal from the FPC board 706 at the external input terminal 707 and receives a game. A plurality of wirings such as a signal line and a power line to be transmitted to the signal line drive circuit 702 are shown. Wiring 709 Receives the signal from the FPC board 706 at the external input terminal 707 and receives the source signal. A plurality of wirings such as signal lines and power lines transmitted to the line drive circuit 703 are shown. Wiring 710 (wiring 710a and wiring 710b) are from the FPC board 706 at the external input terminal 707. A plurality of wirings such as a power line that receive a signal and transmit the signal to the pixel unit 711 are shown. Here, wiring 708 to 710 are formed in the sealing region.

FIG. 1 (B) is a cross-sectional view showing a portion of A to A'in FIG. 1 (A).

Here, for the sake of simplicity, the elements constituting the gate signal line drive circuit 702 are used. Only the EL drive TFT713 is shown as an element that constitutes the TFT712 and the pixel unit 711. .. Either the source area or the drain area of the EL drive TFT713 is an EL element. It is connected to the pixel electrode 714 of the child 721 and controls the current input to the EL element 721. This Here, 716 is an interlayer insulating film, 715 is an EL layer, 717 is an insulating film, 718 is a counter electrode, 71. 9 is the filler and 720 is the gate insulating film. Here, the interlayer insulating film 716 is an inorganic substance. It shall be formed by quality.

What constitutes the source wiring and drain wiring of TFT712 and TFT713 for EL drive Wiring 708, Wiring 710a and Wiring 710b are formed using the same material as the quality.

Of the wiring 708 to 710, wiring 709 includes wiring 708, wiring 710a, and so on. Since it is formed in the same manner as the wiring 710b, the description thereof will be omitted.

Here, a material that is cured by ultraviolet rays is often used as the sealing material 704. Also, In many cases, a material having a light-shielding property is used as the cover material 705. Therefore, the cover material 70 Even if ultraviolet rays are irradiated from the 5 side, the sealing material 704 cannot be exposed, and the sealing material 704 is hardened. It cannot be transformed. Therefore, from the pixel board 701 side, wiring 708, wiring 710a and so on. It is necessary to irradiate the sealing material 704 with ultraviolet rays through the wiring 710b.

Here, of the wiring 708, wiring 710a, and wiring 710b, the video signal line and the pulse line For example, use relatively narrow wiring. On the other hand, a power supply that supplies current to the power supply line of the pixel section. The voltage input to the line, the power line of the source signal line drive circuit, the gate signal line drive circuit, etc. It is larger than the voltage input to the deo signal line or pulse line. Therefore, these power lines are It is necessary to use wiring that is wider than the video signal line or pulse line.

However, if wide wiring is used, it will be behind the wiring when ultraviolet rays are irradiated through the wiring. The part of the sealing material is not sufficiently irradiated with ultraviolet rays. Then, the sealing material does not cure sufficiently. There is a possibility.

Therefore, in the present invention, the following wiring shapes are considered. The schematic diagram is shown in Fig. 3 (A). .. Note that FIG. 3A corresponds to an enlarged view of a part 666 of the sealing region of FIG.

In Fig. 3 (A), pay attention to one power line 777 out of the wiring (first wiring) 710b. doing. The power line 777 is formed by connecting the wiring (second wiring) A1 to A6 in parallel. It is formed. Here, ultraviolet rays are applied to the sealing material 704 via the wiring 777 having such a shape. The case of irradiation will be described.

Here, one power line 777 is connected to six wires A1 to A6 in parallel. Therefore, the present invention is not limited to this configuration. Generally, one wire is n ( n is a natural number of 2 or more) By connecting two wires (second wire) A1 to An in parallel. May be configured.

FIG. 3 (B) is a cross-sectional view taken along the line A to A'of FIG. 3 (A). In FIG. 3 (B), FIG. 3 (A) ) And the same sign indicate the same part.

In Fig. 3 (B), when ultraviolet rays are applied from the pixel substrate side, the seals on the wirings A1 to A6 are sealed. The material part 660 is shaded, but the width L of the wiring is sufficiently small and the interval S of the wiring is sufficiently large. When it is heard, the irradiated ultraviolet rays also wrap around the shaded area 660. The 600 part just above the wiring is not exposed to ultraviolet rays, but the wiring width is large. Compared to the case, this 600 part is small enough to expose the sealing material sufficiently as a whole. Can be done.

Specifically, the width L of the wirings A1 to A6 takes a value of 100 μm to 200 μm, and the wirings A1 to A1 to The interval S between each wiring of A6 takes a value of 50 μm to 150 μm, and L / S is 0.7 to 0.7. In the case of wiring with a shape of 1.5, the ultraviolet rays emitted through the wiring will be applied to the upper part of the wiring. The sealing material can be sufficiently exposed and the sealing material can be sufficiently cured.

More preferably, the width L of the wirings A1 to A6 takes a value of 150 μm or less, and the wirings A1 to A6 The distance S between each wiring is 100 μm or more, and the L / S is 1.5 or less. In the case of wiring with such a shape, the sealing material on the upper part of the wiring can be sufficiently cured. ..

In Fig. 3, we focused on one power line 777 out of the wiring 710b, but it was sealed. The same shape can be used for other wiring formed in the area where the wiring width is a problem. it can.

In this way, wiring can be formed in the sealing region. As a result, in the area other than the pixel part The area can be reduced and the display device can be miniaturized.

Hereinafter, examples of the present invention will be described.

<p> In this embodiment, an active matrix type EL display having a configuration different from that of the embodiment of the invention. The device will be described with reference to FIG. The same parts as those in FIG. 1 are represented by using the same reference numerals.</p><p> FIG. 2A shows a top view of the EL display device of the present invention. Pixel section 71 on the pixel board 701 1 and the gate signal line drive circuit 702 and the source signal line drive circuit 703 are formed. This A sealing material 704 is formed around the surface, and a cover material 705 is attached. FP The C board 706 is connected to the pixel board 701 by an external input terminal 707. wiring The 708 receives a signal from the FPC board 706 at the external input terminal 707 and receives a game. A plurality of wirings such as a signal line and a power line to be transmitted to the signal line drive circuit 702 are shown. Wiring 709 Receives the signal from the FPC board 706 at the external input terminal 707 and receives the source signal. A plurality of wirings such as signal lines and power lines transmitted to the line drive circuit 703 are shown. Wiring 710a and Wiring 710b receives the signal from the FPC board 706 at the external input terminal 707. , A plurality of wirings such as a power line transmitted to the pixel unit 711 are shown. Here, wiring 708 ~ 710 Is formed in the sealing region.</p><p>FIG. 2B is a cross-sectional view showing a portion of A to A'in FIG. 2A.</p><p> Here, for the sake of simplicity, the elements constituting the gate signal line drive circuit 702 are used. Then, only the EL drive TFT713 is shown as an element that constitutes the TFT712 and the pixel unit 711. Su. Either the source area or the drain area of the EL drive TFT713 is EL. It is connected to the pixel electrode 714 of the element 721 and controls the current input to the EL element 721. Here, the interlayer insulating film 716, the EL layer 715, the insulating film 717, the counter electrode 718, and the filler 71. 9. Gate insulating film 720. Here, the interlayer insulating film 716 is made of an organic substance. It shall be formed.</p><p> What constitutes the source wiring and drain wiring of TFT712 and TFT713 for EL drive Wiring 708, Wiring 710a and Wiring 710b are formed using the same material as the quality.</p><p> Of the wiring 708 to 710, wiring 709 includes wiring 708, wiring 710a, and so on. Since it is formed in the same manner as the wiring 710b, the description thereof will be omitted.</p><p> Since an organic substance is used as the interlayer insulating film 716, it is placed directly on this organic substance. Adhesion is poor when wire 708, wiring 710a and wiring 710b are formed. In addition, impurities are added to the materials that make up wiring 708, wiring 710a, and wiring 710b from organic substances. Is introduced, and there are problems such as deterioration of wiring 708, wiring 710a, and wiring 710b. Therefore, except for the interlayer insulating film 716 formed of an organic substance, wiring 708, wiring 710a and Wiring 710b needs to be formed.</p><p> The interlayer insulating film 716 of the portion forming the wiring 708, wiring 710a and wiring 710b. The process of removing the shape of the source wiring and drain wiring of TFT712 and pixel TFT713 At the same time as forming contact holes that reach the source area of those TFTs It can be carried out.</p><p> Further, as the sealing material 704, a material that is cured by ultraviolet rays is often used. Also, In many cases, a material having a light-shielding property is used as the cover material 705. Therefore, is it on the cover material side? The sealing material cannot be cured even if it is irradiated with ultraviolet rays. So, is it the pixel board 701 side? Irradiate ultraviolet rays through wiring 708, wiring 710a and wiring 710b, and seal material 704. Need to be cured. However, as wiring 708, wiring 710a and wiring 710b, the width When the wide wiring is used, the part of the sealing material 704 behind the wiring is sufficiently exposed to ultraviolet rays. There is a possibility that the sealing material 704 will not be sufficiently cured.</p><p> Therefore, one wide wiring is used as wiring 708, wiring 710a and wiring 710b. Instead, as shown in Fig. 3, use the one in which multiple wires are connected in parallel.</p><p> Specifically, the width L of the plurality of wires takes a value of 100 μm to 200 μm, and is between the plurality of wires. The distance S takes a value of 50 μm to 150 μm, and the ratio of the width L of the plurality of wires to the distance S of the plurality of wires. Use wiring with a shape such that the L / S is 0.7 to 1.5. In the case of wiring of such a shape, the ultraviolet rays emitted through the wiring are sealed at the top of the wiring. The material can be sufficiently exposed and the sealing material can be sufficiently cured.</p><p> More preferably, the width L of the plurality of wires takes a value of 150 μm or less, and the interval S of the plurality of wires is S. However, a wiring field with a shape that takes a value of 100 μm or more and has an L / S value of 1.5 or less. In that case, the sealing material on the upper part of the wiring can be sufficiently cured.</p><p> In this way, wiring can be formed in the sealing region. As a result, in the area other than the pixel part The area can be reduced and the display device can be miniaturized. </p>

<p> In this embodiment, a current is applied to the power supply line of the pixel portion of the active matrix type EL display device. An example of wiring the power supply line to be supplied will be described.</p><p>Now, refer to FIG. 1 (A) again. The current that drives the EL element 721 reaches the wiring 710a. It is input to the power supply line of the pixel unit 711 through the power line of the wiring 710b. Pixel part 71 The power supply line of 1 is supplied with current from two places by the power lines of 710a and 710b. There is.</p><p>On the other hand, in the conventional EL display device shown in FIG. 4, the power supply line of the pixel unit 402 is 412a. Current is supplied from one place from the power line. Active matrix type EL table of the present invention In the display device, the reason why the current is supplied to the pixel portion from two places of the pixel portion will be described.</p><p> There is one external input terminal to which one FPC board is connected, and the current from one of the pixel parts Is supplied, and the external input terminal is divided into two parts, each of which is an FPC board (No. 1). 1 FPC board and 2nd FPC board) are connected, and power is supplied to the power supply line from two directions of the pixel part. Fig. 5 schematically shows an example of wiring the power line when a flow is supplied. EL element as a power line The anode wire connected to the anode and the cathode ray connected to the cathode are shown. Figure 5 (A) shows the external input terminal. There is a 707 in one place. On the other hand, in Fig. 5 (B), there are two external input terminals 707 (one end of the board). And near one end of the substrate that is different from one end of the substrate), and from each, the anode wire and the positive The pole wire is wired to the pixel part.</p><p> In Fig. 5 (A), the length of R1 is the length of the power supply line on the side away from the input ports of the anode and cathode rays. The wiring resistance increases by that amount, and the potential drops due to this, so the EL element is marked from the power supply line. The applied voltage drops, causing a drop in image quality.</p><p> On the other hand, in FIG. 5 (B), one anode line and one cathode ray are on the side away from the input port 1 and the other. Input port 2 is provided, and current is supplied to the power supply line from both the input port 1 and the input port 2. this Therefore, it is possible to reduce the deterioration of the image quality due to the voltage drop due to the wiring resistance.</p><p> When providing external input terminals at two locations as shown in Fig. 5 (B), between these two external input terminals By separating the distance of more than 1/2 of the length of the long side of the substrate on which the pixel portion is formed, it depends on the wiring resistance. The effect of reducing the deterioration of image quality due to the decrease in voltage is enhanced.</p><p> If wiring resistance does not matter so much, you may form an external input terminal in one place. I.</p><p> It should be noted that this embodiment can be executed in combination with the embodiment of the invention and the first embodiment. is there. </p>

<p> In this embodiment, a liquid crystal display device using a method of forming wiring in a sealed region portion will be described. To do.</p><p> An active matrix type can be mentioned as a driving method of the liquid crystal display device.</p><p> First, FIG. 10 shows the configuration of the pixel portion of the active matrix type liquid crystal display device. In the active matrix type liquid crystal display device, each pixel has a TFT. Game Each pixel of the gate signal line (G1 to Gy) to which the selection signal from the signal line drive circuit is input It is connected to the gate electrode of the pixel TFT1002. In addition, the pixel T of each pixel One of the source area and drain area of the FT1002 receives a signal from the source signal line drive circuit. Powered source signal line (S1 ~ Sx), the other is one electrode with holding capacity 1001 and liquid It is connected to one of the two electrodes that sandwich the crystal 1003.</p><p> When a signal is input to the gate signal line G1, all pixels T connected to the gate signal line G1 A signal is input to the gate electrode of the FT1002, and the pixel TFT1002 is turned on. Pixel A signal is input from the source signal line (S1 to Sx) to the pixel with TFT1002 turned on. Then, an electric charge is held in the holding capacity 1001, and the liquid crystal 1003 is sandwiched by this held charge. A voltage is applied between the electrodes. This applied voltage controls the orientation of the liquid crystal molecules and transmits the transmitted light. Control the amount. Repeat this operation for all gate signal lines (G1 ~ Gy) and image Is displayed.</p><p> Next, the liquid crystal sealing of the active matrix type liquid crystal display device will be described.</p><p> In a liquid crystal display device, a voltage is applied between two electrodes sandwiching a liquid crystal to display the liquid crystal. Control the orientation and display. Here, in order to maintain the state where the liquid crystal is sandwiched between the electrodes, each Two insulating substrates on which electrodes are formed are contacted with a sealing material in the direction in which the electrodes face each other. It is necessary to wear it and enclose the liquid crystal in the meantime.</p><p> Figure 6 shows a case where two substrates of a liquid crystal display device are bonded together and a liquid crystal is sealed between them. A schematic diagram is shown.</p><p> FIG. 6A is a top view of the liquid crystal display device. Epoxy-based wood is used as the sealing material 301. Fat and the like are used. On the substrate 31 on which an alignment film (not shown) is formed and subjected to rubbing treatment. It surrounds the pixel unit 302, the gate signal line drive circuit 303, and the source signal line drive circuit 304. The sealing material 301 is formed so as to be used. At this time, an opening is used as an injection port for later injecting liquid crystal. A portion (not shown) is formed as a part of the sealing material 301. Next, the spacer (not shown) Spray and attach to the other substrate 32.</p><p> If the distance between the substrate 31 and the substrate 32 is determined by the diameter of the spacer, the substrate 31 may be used. Irradiates the sealing material 301 part with ultraviolet rays or heats it through the substrate 32. The sealing material 301 is cured to bring the substrate 31 and the substrate 32 into close contact with each other.</p><p> By applying heat, the sealing material 301 is cured, and the substrate 31 and the substrate 32 are separated. In the bonding method, it is necessary to heat-treat while pressurizing, and the substrate 31 and the substrate 32 are thermally expanded. There is a serious problem that the position of the bonding is shifted due to the tension. Also, it takes time to heat cure. There is also the problem. Therefore, the sealing material is cured by ultraviolet irradiation instead of thermosetting. Many processes are used.</p><p> After that, the liquid crystal 33 is injected from the liquid crystal injection port, and the liquid crystal injection port is closed with a sealing material (not shown). For the time being, prevent the liquid crystal 33 from flowing out. The encapsulant is thermosetting. Use a material that is cured by ultraviolet rays, not the material used in. This is after injecting the liquid crystal 33 This is to prevent the liquid crystal 33 from deteriorating when heat is applied.</p><p> Substances that contaminate the liquid crystal, such as moisture containing ions, pass through the sealing material 301 and the sealing material. It also works to prevent it from happening.</p><p> Next, the signals input to each of the source signal line drive circuit and the gate signal line drive circuit are input. The wiring to be transmitted will be described.</p><p> Video signals from the outside are sent to the gate signal line drive circuit 303 and the source signal line drive circuit. A signal input to 304 and input to pixel unit 302 is configured. Here, game from the outside The signals input to the signal line drive circuit 303 and the source signal line drive circuit 304 are pixel substrates. It is input from the FPC board 310 attached to the external input terminal 309 on 31. FP The C substrate 310 is imaged by an anisotropic conductive film (not shown) at the external input terminal 309. It is connected to the wiring 312 formed on the base board. This wiring 312 (312a, 312b) Passes between the sealant 301 and passes through the gate signal line drive circuit 303 and the source signal line drive circuit. It is connected to 304.</p><p> Wiring 312a receives the signal from the FPC board 310 at the external input terminal 309. This is the wiring that is transmitted to the gate signal line drive circuit 303. Wiring 312b is an external input terminal In 309, the signal from the FPC board 310 is received, and the source signal line drive circuit 304 It is a wiring to be transmitted to. Here, the wiring 312a and the wiring 312b are on the pixel board 31. It is formed in a portion (sealing region) covered with the material 301.</p><p> FIG. 6 (B) shows a cross-sectional view of B to B'of FIG. 6 (A). The same part as in Fig. 6 (A) is It is represented by the same code.</p><p> Here, for the sake of simplicity, the TFT 11 constituting the gate signal line drive circuit 303 Only the pixel TFT 314 constituting 4 and the pixel portion 302 is shown. Consists of pixel section and drive circuit The substrate 31 on which the TFT is formed is referred to as a pixel substrate. Also, take it on the pixel board The attached electrode 307 is called a pixel electrode. The other board 32 is called the opposite board. To do. Further, the electrode 308 attached to the opposite substrate side is called a counter electrode. This pixel electrode 3 The image is displayed by controlling the voltage applied to 07 and the counter electrode 308.</p><p> Here, 306 is the gate insulating film of the TFT 114 and the TFT pixel 314. Further, 315 is an interlayer insulating film and 112 is a light-shielding layer. The alignment film is shown here. Absent.</p><p> Either the source region or the drain region of the pixel TFT 314 is the pixel electrode 30. It is connected to 7 to control the voltage applied to the pixel electrode 307. In addition, here, the interlayer is interrupted. It is assumed that the rim membrane 315 is formed of an inorganic substance.</p><p> Here, the thing that constitutes the source wiring and drain wiring of TFT114 and pixel TFT314 Wiring 312 is formed using the same material as the quality.</p><p> Further, it is assumed that a material that is cured by ultraviolet rays is used as the sealing material 301. Opposed board 32 Even if ultraviolet rays are irradiated from the side, the sealing material 301 can be cured because there is a light-shielding layer 112. I can't. Therefore, ultraviolet rays are irradiated from the pixel substrate 31 side through the wiring 312a, and the sealing material 3 is used. 01 needs to be cured. However, if a wide wire is used as the wire 312a, the wiring will be arranged. The part of the sealing material 704 behind the line is not sufficiently irradiated with ultraviolet rays, and the sealing material 704 is ten. May not cure in minutes.</p><p> Therefore, instead of using one wide wiring as the wiring 312a, as shown in Fig. 3. The one in which a plurality of wires are connected in parallel is used.</p><p> Specifically, the width L of the plurality of wires takes a value of 100 μm to 200 μm, and is between the plurality of wires. The distance S takes a value of 50 μm to 150 μm, and the ratio of the width L of the plurality of wires to the distance S of the plurality of wires. Use wiring with a shape such that the L / S is 0.7 to 1.5. In the case of wiring of such a shape, the ultraviolet rays emitted through the wiring are sealed at the top of the wiring. The material can be sufficiently exposed and the sealing material can be sufficiently cured.</p><p> More preferably, the width L of the plurality of wires takes a value of 150 μm or less, and the interval S of the plurality of wires is S. However, a wiring field with a shape that takes a value of 100 μm or more and has an L / S value of 1.5 or less. In that case, the sealing material on the upper part of the wiring can be sufficiently cured.</p><p> When the light-shielding layer 112 is attached to the pixel substrate 31 side, the sealing material 301 It is necessary to irradiate ultraviolet rays from the opposite substrate 32 side in order to cure. At this time, the wiring 312a does not block the irradiated ultraviolet rays, so it has a wide shape. There is no problem even if you use.</p><p> In this way, wiring can be formed in the sealing region. As a result, in the area other than the pixel part The area can be reduced and the display device can be miniaturized. </p>

<p> In this embodiment, FIG. 7 is used for a display device having a structure different from that described in the third embodiment. I will explain. In FIG. 7, the same parts as those in FIG. 6 are represented by using the same reference numerals.</p><p> FIG. 7A is a top view of the liquid crystal display device of the present invention. Pixel section 302 on the pixel board 31 The gate signal line drive circuit 303 and the source signal line drive circuit 304 are formed. this A sealing material 301 is formed around the periphery, the opposing substrate 32 is attached, and the liquid crystal 33 is placed between them. It is enclosed. The FPC board 310 is in contact with the pixel board 31 by the external input terminal 309. It is being continued. Wiring 312a is from the FPC board 310 at the external input terminal 309. This is a wiring that receives a signal and transmits it to the gate signal line drive circuit 303. Wiring 312b The external input terminal 309 receives the signal from the FPC board 310 and drives the source signal line. This is the wiring that is transmitted to the dynamic circuit 304. Here, the wiring 312a and the wiring 312b are sealed areas. It is formed in the area.</p><p> FIG. 7 (B) is a cross-sectional view showing a portion B to B'of FIG. 7 (A). Here, Figure 7 (A ) And the same sign represent the same part.</p><p> Here, for the sake of simplicity, T is used as an element constituting the gate signal line drive circuit 303. Only FT114 is shown. Moreover, only the pixel TFT314 is used as an element constituting the pixel portion 302. Is shown. Either the source area or the drain area of the pixel TFT314 has a pixel power. It is connected to the pole 307 and controls the voltage applied to the pixel electrode 307.</p><p> Similar to the substances that make up the source wiring and drain wiring of TFT114 and pixel TFT314 Wiring 312 is formed using the material of. Here, the interlayer insulating film 315 is organic. It shall be formed by a substance.</p><p> Since an organic substance is used as the interlayer insulating film 315, it is placed directly on this organic substance. Adhesion is poor when wire 312 is formed. In addition, it is not suitable for materials that make up wiring 312 from organic substances. There are problems such as the introduction of pure products and the deterioration of wiring 312. So it is made of organic matter It is necessary to form the wiring 312 except for the interlayer insulating film 315.</p><p> The step of removing the interlayer insulating film 315 of the portion forming the wiring 312a is TFT11. When forming the source wiring and drain wiring of 4 or pixel TFT314, their source area And can be done at the same time as forming a contact hole that reaches the drain region.</p><p> Further, it is assumed that a material that is cured by ultraviolet rays is used as the sealing material 301. Opposed board 32 Even if ultraviolet rays are irradiated from the side, the sealing material 301 can be cured because there is a light-shielding layer 112. I can't. Therefore, ultraviolet rays are irradiated from the pixel substrate 31 side through the wiring 312a, and the sealing material 3 is used. 01 needs to be cured. However, if a wide wire is used as the wire 312a, the wiring will be arranged. The part of the sealing material 704 behind the line is not sufficiently irradiated with ultraviolet rays, and the sealing material 704 is ten. May not cure in minutes.</p><p> Therefore, instead of using one wide wiring as the wiring 312a, as shown in Fig. 3. , Use the one in which multiple wires are connected in parallel.</p><p> Specifically, the width L of the plurality of wires takes a value of 100 μm to 200 μm, and is between the plurality of wires. The distance S takes a value of 50 μm to 150 μm, and the ratio of the width L of the plurality of wires to the distance S of the plurality of wires. Use wiring with a shape such that the L / S is 0.7 to 1.5. In the case of wiring of such a shape, the ultraviolet rays emitted through the wiring are sealed at the top of the wiring. The material can be sufficiently exposed and the sealing material can be sufficiently cured.</p><p> More preferably, the width L of the plurality of wires takes a value of 150 μm or less, and the interval S of the plurality of wires is S. However, a wiring field with a shape that takes a value of 100 μm or more and has an L / S value of 1.5 or less. In that case, the sealing material on the upper part of the wiring can be sufficiently cured.</p><p> When the light-shielding layer 112 is attached to the pixel substrate 31 side, the sealing material 301 Ultraviolet rays will be irradiated from the opposite substrate 32 side in order to cure. At this time, wiring 31 2a does not block the irradiated ultraviolet rays, so there is no problem even if you use a wide shape. I.</p><p> In this way, wiring can be formed in the sealing region. As a result, in the area other than the pixel part The area can be reduced and the display device can be miniaturized. </p>

<p> In this embodiment, an electronic device incorporating a display device formed by using the present invention as a display medium. The vessel will be described.</p><p> Such electronic devices include video cameras, digital cameras, and head-mounted displays. Ray (goggles type display), game console, car navigation, personal computer Data, mobile information terminals (mobile computers, mobile phones, e-books, etc.), etc. Is done. An example of them is shown in FIG.</p><p> Figure 8 (A) shows a personal computer, which is the main body 2001, the housing 2002, and the display unit 2. 003, keyboard 2004, etc. are included. The display device of the present invention is a table of a personal computer. It can be used for the indicator 2003.</p><p> Figure 8 (B) shows a video camera, which is the main unit 2101, display unit 2102, and audio input unit 210. 3. Includes operation switch 2104, battery 2105, image receiving unit 2106, etc. Table of the present invention The indicator can be used on the display unit 2102 of a video camera.</p><p> Figure 8 (C) shows a part of the head-mounted display device (on the right side), which is the main body 2301 and the signal. Cable 2302, head fixing band 2303, display monitor 2304, optical system 2305, table Includes display 2306 and the like. The display device of the present invention is a display unit 2306 of a head-mounted display device. Can be used for.</p><p> Figure 8 (D) shows an image playback device (specifically, a DVD playback device) equipped with a recording medium. Body 2401, Recording medium (CD, LD or DVD, etc.) 2402, Operation switch 2403, Includes display unit (a) 2404, display unit (b) 2405, and the like. The display unit (a) is mainly for image information. Information is displayed, and the display unit (b) mainly displays character information, but the display device of the present invention is a recording medium. It can be used for the display unit (a) 2404 and the display unit (b) 2405 of an image reproduction device equipped with a body. it can. As an image playback device equipped with a recording medium, a CD playback device, a game device, etc. The present invention can be used for.</p><p> Figure 8 (E) shows a portable computer with a main unit 2501 and a camera unit 250. 2. Includes image receiving unit 2503, operation switch 2504, display unit 2505, etc. Display device of the present invention The device 2505 can be used for the display unit 2505 of a portable (mobile) computer.</p><p> As described above, the scope of application of the present invention is extremely wide, and it can be applied to electronic devices in all fields. Is possible. Further, the electronic device of this embodiment is made of any combination of Examples 1 to 4. It can also be realized by using the above configuration.</p>