Electronic apparatus
Abstract
This record has no abstract on file.
Term
3.5 yearsleft in the term
Expires 9 April 2030.
- Priority and filed
- Granted
- Today
- Expires
14 claims: 11 independent, 3 dependent
- 1筐体と、 前記筐体に収容され、切欠き部が設けられた回路基板と、 前記回路基板に取り付けられた第1バックプレートと、 前記回路基板に取り付けられ、前記第1バックプレートから前記切欠き部の少なくとも一部よりも遠くに位置された第2バックプレートと、 前記第1バックプレートと前記第2バックプレートとを繋ぐとともに、少なくとも一部が前記切欠き部の縁部の少なくとも一部に沿って延びた連結部と、 を具備したことを特徴とする電子機器。
- 2請求項1 記載の電子機器 において、 前記連結部は、前記回路基板の面に沿って延びたことを特徴とする電子機器。
- 3請求項1 記載 または請求項2 記載の電子機器 において、 前記連結部は、前記回路基板に固定された固定部を有したことを特徴とする電子機器。
- 4請求項3 記載の電子機器 において、 前記固定部は、更に前記筐体に固定されたことを特徴とする電子機器。
- 5請求項4 記載の電子機器 において、 前記固定部は、前記切欠き部の角からずれた位置に設けられたことを特徴とする電子機器。
- 6請求項5 記載の電子機器 において、 前記回路基板に実装された発熱体を更に備え、この発熱体は、前記連結部に沿って位置されたことを特徴とする電子機器。
- 7請求項6 記載の電子機器 において、 前記第2バックプレートは、前記回路基板に固定された4つの固定部を有し、 前記発熱体の少なくとも一部は、前記第2バックプレートの4つの固定部のうちの2つの固定部と、前記連結部の固定部とに囲まれた領域に位置されたことを特徴とする電子機器。
- 8請求項7 記載の電子機器 において、 前記第2バックプレートは、前記4つの固定部をフレーム状に繋ぐ4つの梁部を有し、この4つの梁部は、前記回路基板の面に沿った2つの第1梁部と、前記回路基板から浮かされた2つの第2梁部とを含むことを特徴とする電子機器。
- 9請求項8 記載の電子機器 において、 前記第1梁部は、前記回路基板の長手方向に延び、前記第2梁部は、前記回路基板の短手方向に延びたことを特徴とする電子機器。
- 10請求項9 記載の電子機器 において、 前記連結部は、前記第1梁部の略延長線上に延びたことを特徴とする電子機器。
- 11請求項8 記載 または請求項10 記載の電子機器 において、 前記2つの第1梁部は、前記回路基板の両端部に分かれ、それぞれその端部に沿ったことを特徴とする電子機器。
- 12請求項1 記載 または請求項11 記載の電子機器 において、 前記回路基板に対向したヒートパイプと、 前記第1バックプレートに固定され、前記ヒートパイプを押圧した第1押圧部材と、 前記第2バックプレートに固定され、前記ヒートパイプを押圧した第2押圧部材と、 を更に備えたことを特徴とする電子機器。
- 13筐体と、 前記筐体に収容された回路基板と、 前記回路基板に取り付けられた第1バックプレートと、 前記回路基板に取り付けられた第2バックプレートと、 前記第1バックプレートと前記第2バックプレートとを繋ぎ、一部が前記回路基板の縁部の少なくとも一部に沿って延びた連結部と、 を具備したことを特徴とする電子機器。
- 14筐体と、 前記筐体に収容され、第1発熱体及び第2発熱体が実装された回路基板と、 前記第1発熱体に対応して前記回路基板に取り付けられた第1補強部と、 前記第2発熱体に対応して前記回路基板に取り付けられた第2補強部と、 前記第1補強部と前記第2補強部とを繋ぎ、一部が前記回路基板の縁部の少なくとも一部に沿って延びた連結部と、 を具備したことを特徴とする電子機器。
Independent claims14
67 paragraphs, as filed
An embodiment of the present invention relates to an electronic device provided with a circuit board.
Circuit boards mounted on electronic devices may include a back plate.
<p><patcit num="1"><text>Japanese Unexamined Patent Publication No. 2006-216944</text></patcit></p>
<p> In recent years, there has been a demand for reduction of stress applied to a circuit board.</p>
<p> The electronic device according to one embodiment of the present invention includes a housing, a circuit board housed in the housing, a first back plate attached to the circuit board, and a second back plate attached to the circuit board. The back plate, the first back plate, and the back plate are connected to each other.<u style="single">A part of it extends along at least a part of the edge of the circuit board.</u>It was provided with a connecting portion.</p>
<figref num="1">The perspective view of the electronic device which concerns on 1st Embodiment of this invention.</figref><figref num="2">The perspective view which shows the 1st surface of the circuit board which concerns on 1st Embodiment of this invention.</figref><figref num="3">The plan view which shows the 1st surface of the circuit board shown in FIG.</figref><figref num="4">The perspective view which shows the 1st surface of the circuit board shown in FIG.</figref><figref num="5">The perspective view which shows the 2nd surface of the circuit board shown in FIG.</figref><figref num="6">The plan view which shows the 2nd surface of the circuit board shown in FIG.</figref><figref num="7">Sectional drawing along line F7-F7 of the circuit board shown in FIG.</figref><figref num="8">Sectional drawing along line F8-F8 of the circuit board shown in FIG.</figref><figref num="9">Sectional drawing along line F9-F9 of the circuit board shown in FIG.</figref><figref num="10">The perspective view which shows the circuit board which concerns on 1st Embodiment of this invention.</figref><figref num="11">The plan view which shows the circuit board which concerns on 1st Embodiment of this invention.</figref><figref num="12">The plan view which shows the circuit board which concerns on 1st Embodiment of this invention.</figref>
Hereinafter, one embodiment of the present invention will be described based on a drawing applied to a notebook type personal computer (hereinafter, notebook PC).
1 to 9 disclose the electronic device 1 according to the first embodiment of the present invention. The electronic device 1 is, for example, a notebook PC. The electronic device to which the present invention is applicable is not limited to the above. The present invention is widely applicable to various electronic devices including display devices such as televisions, recording / playback devices, PDAs (Personal digital assistants), game machines, and the like.
As shown in FIG. 1, the electronic device 1 includes a main body unit 2, a display unit 3, and hinges 4a and 4b. The main body unit 2 is an electronic device main body on which a main board is mounted. The main body unit 2 includes a housing 5. The housing 5 has an upper wall 6, a lower wall 7, and a peripheral wall 8 and is formed in a flat box shape.
The lower wall 7 faces the upper surface of the desk when the electronic device 1 is placed on the desk. The lower wall 7 is substantially parallel to the desk surface. The upper wall 6 extends substantially parallel (that is, substantially horizontal) to the lower wall 7 with a space between the upper wall 6 and the lower wall 7. A keyboard 9 is attached to the upper wall 6. The keyboard 9 shows only some keys. The peripheral wall 8 stands up against the lower wall 7 and connects the peripheral edge of the lower wall 7 and the peripheral edge of the upper wall 6.
The housing 5 has a base 11 and a cover 12. Base 11 includes a lower wall 7 and a portion of a peripheral wall 8. The cover 12 includes an upper wall 6 and a part of the peripheral wall 8. The housing 5 is formed by combining the cover 12 with the base 11.
The display unit 3 is rotatably (openable and closable) connected to the rear end of the main body unit 2 by hinges 4a and 4b. The display unit 3 is rotatable between a closed position that is tilted so as to cover the main body unit 2 from above and an open position that is raised with respect to the main body unit 2.
As shown in FIG. 1, the display unit 3 includes a display housing 14 and a display device 15 housed in the display housing 14. The display screen 15a of the display device 15 can be exposed to the outside through an opening 14a provided in the front wall of the display housing 5.
As shown in FIG. 2, the circuit board 21 and the heat dissipation module 22 are housed in the housing 5 of the main unit 2. The heat dissipation module 22 is an RHE type including a cooling fan 23, a heat sink 24, and a heat pipe 25.
The circuit board 21 is, for example, a main board. The circuit board 21 has a first surface 21a and a second surface 21b located on the opposite side of the first surface 21a. In the present embodiment, the first surface 21a is the lower surface and the second surface 21b is the upper surface. Instead of this, the first surface 21a may be the upper surface and the second surface 21b may be the lower surface.
As shown in FIG. 3, the circuit board 21 has a first notch 27 and a second notch 28. The first notch portion 27 is notched along the outer shape of the storage device 29 and has a rectangular shape. An example of the storage device 29 is an HDD (Hard disk drive). The second notch 28 is notched along the outer shape of the cooling fan 23 and the heat sink 24.
The first notch portion 27 has a first straight line portion 27a and a second straight line portion 27b extending in a direction intersecting the first straight line portion 27a (for example, a direction substantially orthogonal to the first straight line portion 27a). At the intersection of the first straight line portion 27a and the second straight line portion 27b, a substantially right-angled angle 27c is provided.
The circuit board 21 has a first end portion 31 and a second end portion 32 located on the opposite side of the first end portion 31. The first notch 27 is formed in the first end 31. The second notch 28 is formed in the second end 32. As a result, the circuit board 21 is located between the first portion 33, which is separated from the first notch portion 27 and the second notch portion 28, and the first notch portion 27 and the second notch portion 28. It has two parts 34 and. The second portion 34 is a so-called narrow portion, which is narrower in width and weaker in strength than the first portion 33.
As shown in FIG. 3, the first portion 33 includes a first region 33a, a second region 33b, and a third region 33c. Here, the direction from the first portion 33 to the second portion 34 is defined as the first direction D1, and the direction substantially orthogonal to the first direction D1 is defined as the second direction D2. The first region 33a is a region adjacent to the first notch 27 in the first direction D1. The second region 33b is a region adjacent to the second portion 34 in the first direction D1. The third region 33c is a region adjacent to the second notch 28 in the first direction D1.
The first direction D1 is, for example, the longitudinal direction of the circuit board 21. The second direction D2 is, for example, the lateral direction of the circuit board 21. The second portion 34 of the circuit board 21 extends in the first direction D1. The first notch 27 and the second notch 28 are aligned in the second direction D2.
As shown in FIG. 4, a first heating element 36, a second heating element 37, and a third heating element 38 are mounted on the first surface 21a. The first heating element 36 is, for example, a CPU (Central Processing Unit). The second heating element 37 is, for example, VGA (Video Graphics Array). The third heating element 38 is, for example, a PCH (Platform Controller Hub). The heating element to which the present invention can be applied is not limited to the above example, and various parts for which heat dissipation is desired are appropriately applicable.
The first heating element 36 is arranged in the first portion 33 and extends from the first region 33a to the second region 33b. That is, at least a part of the first heating element 36 is located in the first region 33a. The second heating element 37 is located in the second portion 34. The third heating element 38 straddles the first portion 33 to the second portion 34. That is, at least a part of the third heating element 38 is arranged in the second part 34.
As shown in FIG. 4, around the first heating element 36, four first studs 41 surrounding the first heating element 36 are attached to the circuit board 21. The four first studs 41 are arranged corresponding to the four corners of the substantially rectangular first heating element 36. On the other hand, around the second heating element 37, four second studs 42 surrounding the second heating element 37 are attached to the circuit board 21. The four second studs 42 are arranged corresponding to the four corners of the substantially rectangular second heating element 37.
As shown in FIGS. 2 and 3, a first heat receiving member 43 faces the first heating element 36 and is thermally connected to the first heating element 36. A second heat receiving member 44 faces the second heating element 37 and is thermally connected to the second heating element 37. The first heat receiving member 43 and the second heat receiving member 44 are, for example, metal heat receiving plates, respectively.
The heat pipe 25 is an example of a heat conductive member, and faces the first surface 21a of the circuit board 21. The heat pipe 25 has a first heat receiving portion 25a connected to the first heat receiving member 43, a second heat receiving portion 25b connected to the second heat receiving member 44, and a heat radiating portion 25c connected to the heat sink 24. The heat pipe 25 is thermally connected to the first heating element 36, the second heating element 37, and the heat sink 24, respectively, and transfers the heat of the first heating element 36 and the second heating element 37 to the heat sink 24. The third heating element 38 is, for example, naturally dissipating heat, but may be thermally connected to the heat pipe 25 instead.
As shown in FIGS. 2 and 3, a first pressing member 45 is attached to the first stud 41. The first pressing member 45 has a pressing portion 45a facing the heat pipe 25 and, for example, four fixing portions 45b extending from the pressing portion 45a and fixed to the first stud 41. The pressing portion 45a and the fixing portion 45b cooperate with each other to function as a leaf spring. When the fixing portion 45b is fixed to the first stud 41, the pressing portion 45a presses the heat pipe 25 and the first heat receiving member 43 toward the first heating element 36. As a result, the heat pipe 25 is firmly and thermally connected to the first heating element 36.
A second pressing member 46 is attached to the second stud 42. The second pressing member 46 has a pressing portion 46a facing the heat pipe 25 and, for example, four fixing portions 46b extending from the pressing portion 46a and fixed to the second stud 42. The pressing portion 46a and the fixing portion 46b cooperate with each other to function as a leaf spring. When the fixing portion 46b is fixed to the second stud 42, the pressing portion 46a presses the heat pipe 25 and the second heat receiving member 44 toward the second heating element 37. As a result, the heat pipe 25 is more firmly and thermally connected to the second heating element 37.
As shown in FIGS. 5 and 6, the first back plate 51, the second back plate 52, and the connecting portion 53 are attached to the second surface 21b of the circuit board 21. The first back plate 51, the second back plate 52, and the connecting portion 53 are integrally formed of, for example, a metal material, and have higher rigidity than the circuit board 21.
The first back plate 51 is an example of the first reinforcing portion, and corresponds to the first heating element 36. The first back plate 51 is provided on the first portion 33 of the circuit board 21. The first back plate 51 has four fixing portions 55 and four beam portions 56 connecting the four fixing portions 55 in a frame shape. The term "connecting in a frame shape" as used in the present invention is not limited to the one formed in the shape of a window frame as in the second back plate 52 in FIG. 5, but is irregular as in the first back plate 51. Including those formed in a frame shape. In other words, "connecting in a frame" means that there are two beams extending substantially parallel to each other and two beams spanned between the two beams.
The four beam portions 56 of the first back plate 51 according to the present embodiment include two first beam portions 56a extending in the first direction D1 and two second beam portions 56b extending in the second direction D2. Have. The two first beam portions 56a extend substantially parallel to each other. The two second beam portions 56b are laid between the first beam portions 56a.
All four beam portions 56 of the first back plate 51 are along the second surface 21b of the circuit board 21 and are substantially in close contact with the second surface 21b of the circuit board 21. The term "substantially close contact" includes not only the case of direct contact but also the case of being overlapped on the surface of the circuit board with an insulator film or the like sandwiched between them. That is, "substantially close contact" means that there is no substantial gap between the back plate or the connecting portion described later and the circuit board to promote the bending of the circuit board.
The fixing portion 55 is arranged at a position corresponding to the first stud 41. FIG. 8 shows an example of the second back plate 52. Similarly, the fixing portion 55 of the first back plate 51 is fixed to the circuit board 21 by the first stud 41. More specifically, the fixing portion 55 has a screw hole 59. The screw hole 59 is an example of an engaging portion. The circuit board 21 has an insertion hole 21c facing the screw hole 59. The first stud 41 has a threaded portion 60. The first stud 41 is an example of a fixing member.
The first back plate 51 is fixed to the circuit board 21 by passing the screw portion 60 of the first stud 41 through the insertion hole 21c of the circuit board 21 and engaging with the screw hole 59 of the fixing portion 55. Furthermore, the first pressing member 45 is fixed to the first back plate 51 via the first stud 41. The first back plate 51 may be fixed by a fixing member other than the stud.
The second back plate 52 is an example of the second reinforcing portion, and corresponds to the second heating element 37. The second back plate 52 is provided on the second portion 34 of the circuit board 21. The second back plate 52 is arranged at a portion straddling the first notch 27 with respect to the first back plate 51. That is, the second back plate 52 is arranged farther from the first back plate 51 than at least a part of the first notch 27.
The second back plate 52 has four fixing portions 57 and four beam portions 58 connecting the four fixing portions 57 in a frame shape. The four beam portions 58 have two first beam portions 58a extending in the first direction D1 and two second beam portions 58b extending in the second direction D2. The two first beam portions 58a extend substantially parallel to each other. The two second beam portions 58b are laid between the first beam portions 58a.
As shown in FIGS. 5 and 7, the two first beam portions 58a of the second back plate 52 are along the second surface 21b of the circuit board 21 and are substantially in close contact with the second surface 21b of the circuit board 21. ing. As shown in FIG. 6, the circuit board 21 has a first end portion 61 facing the first notch portion 27 and a second end portion 62 facing the second notch portion 28. The two first beam portions 58a are arranged separately from each other at the first end portion 61 and the second end portion 62, and extend along the first end portion 61 or the second end portion 62, respectively.
On the other hand, as shown in FIGS. 5 and 8, the two second beam portions 58b of the second back plate 52 are floated with respect to the circuit board 21, and a gap is provided between the second beam portion 58b and the circuit board 21. S is formed. Then, for example, a plurality of electronic components 64 are arranged in a region overlapping the second beam portion 58b.
The fixing portion 57 is arranged at a position corresponding to the second stud 42. As shown in FIG. 8, the fixing portion 57 is fixed to the circuit board 21 by the second stud 42. More specifically, the fixing portion 57 has a screw hole 59. The screw hole 59 is an example of an engaging portion. The circuit board 21 has an insertion hole 21c facing the screw hole 59. The second stud 42 has a threaded portion 60. The second stud 42 is an example of a fixing member.
The second back plate 52 is fixed to the circuit board 21 by passing the screw portion 60 of the second stud 42 through the insertion hole 21c of the circuit board 21 and engaging with the screw hole 59 of the fixing portion 57. Furthermore, the second pressing member 46 is fixed to the second back plate 52 via the second stud 42. The second back plate 52 may be fixed by a fixing member other than the stud.
As shown in FIGS. 5 and 6, the connecting portion 53 is provided between the first back plate 51 and the second back plate 52, and connects the two. The connecting portion 53 extends between the corner portion of the first back plate 51 (that is, the fixed portion 55) and the corner portion of the second back plate 52 (that is, the fixed portion 57). The connecting portion 53 extends from the first portion 33 to the second portion 34 of the circuit board 21.
As shown in FIG. 7, the connecting portion 53 extends along the second surface 21b of the circuit board 21 and is substantially in close contact with the second surface 21b. In the present embodiment, the connecting portion 53 is substantially in close contact with the second surface 21b of the circuit board 21 over its entire length.
As shown in FIGS. 5 and 6, at least a part of the connecting portion 53 extends linearly along the first notch portion 27. Furthermore, at least a part of the connecting portion 53 extends along the outer shape of the first cutout portion 27 (the edge portion of the first cutout portion 27, that is, the first straight line portion 27a). As shown in FIGS. 5 and 6, the connecting portion 53 extends on an extension line of the first beam portion 58a of the second back plate 52. That is, the connecting portion 53 is linearly connected to the first beam portion 58a.
As shown in FIG. 6, the circuit board 21 has a fragile portion 66 which is the most vulnerable to bending in the circuit board 21 in the vicinity of the corner 27c of the first notch portion 27. The fragile portion 66 is a portion where, for example, stress is concentrated when the circuit board 21 is bent, and disconnection of the wiring pattern or solder cracks are likely to occur. The connecting portion 53 is arranged so as to pass through the fragile portion 66.
As shown in FIG. 5, a fixing portion 71 is provided in the middle (intermediate portion) of the connecting portion 53. The fixed portion 71 is formed in a substantially semicircular shape, for example, and is wider than the other portions of the connecting portion 53. The fixing portion 71 is provided at a position deviated from the corner 27c of the first notch portion 27. That is, the fixed portion 71 does not face the corner 27c of the first notch portion 27. The fixing portion 71 has a first insertion hole 71a. As shown in FIG. 7, the circuit board 21 has a second insertion hole 21e facing the first insertion hole 71a.
As shown in FIG. 9, the connecting portion 53 and the circuit board 21 are sandwiched between the base 11 and the cover 12 forming the housing 5. The base 11 has a first support portion 73 that faces the connecting portion 53 and the circuit board 21 and supports, for example, the circuit board 21 from below. The cover 12 has a second support portion 74 that faces the connecting portion 53 and the circuit board 21 and supports, for example, the connecting portion 53 from above.
The first support portion 73 has, for example, a screw hole 73a. The screw hole 73a is an example of an engaging portion. The second support portion 74 has, for example, a third insertion hole 74a. Then, by engaging the screw 75 with the screw hole 73a through the third insertion hole 74a, the first insertion hole 71a, and the second insertion hole 21e, the base 11, the cover 12, the connecting portion 53, and the circuit board 21 are tightened together. It is fixed. As a result, the fixing portion 71 of the connecting portion 53 is fixed to the circuit board 21 and also to the housing 5. The screw 75 is an example of a fixing member.
As shown in FIG. 6, the first heating element 36 is arranged in an area surrounded by four fixing portions 55 of the first back plate 51 and is reinforced by the first back plate 51. The second heating element 37 is located in an area surrounded by four fixing portions 57 of the second back plate 52 and is reinforced by the second back plate 52.
A part of the third heating element 38 is arranged in a right triangle-shaped region surrounded by two fixing portions 57 of the four fixing portions 57 of the second back plate 52 and the fixing portion 71 of the connecting portion 53. Has been done. The third heating element 38 is arranged along the second beam portion 58b of the second back plate 52 and the connecting portion 53. As a result, the third heating element 38 is reinforced by the second back plate 52 and the connecting portion 53. The entire third heating element 38 may be arranged in an area surrounded by the two fixing portions 57 of the second back plate 52 and the fixing portion 71 of the connecting portion 53.
According to the electronic device 1 having such a configuration, it is possible to reduce the stress applied to the circuit board 21. Due to the thinning and miniaturization of the electronic device 1, the circuit board 21 may have a complicated shape (for example, a notched shape). The circuit board 21 having such a complicated shape is easily bent and easily receives a large amount of stress. Further, when the heat dissipation module is mounted on the circuit board, the load increases, and when the circuit board is held by hand, for example, the load is applied and the circuit board bends, which puts stress on the circuit board.
FIG. 10 shows a circuit board 21 in which the first back plate 81 and the second back plate 82 are mounted independently of each other. In this circuit board 21, the portion 84 in the vicinity of the corner 27c of the first notch 27 is twisted in the t1 and t2 directions centered on this portion 84, and twisted in the t3 and t4 directions centered on this portion 84. It is the part where the most bending stress is applied to the twist. This stress causes disconnection through stress on the wiring pattern of the substrate. Further, this stress may cause solder cracks through stress on the solder portion of the mounted component centering on the portion 84. These trace stresses can compromise the long-term reliability of the product.
On the other hand, the circuit board 21 according to the present embodiment is provided with a connecting portion 53 that connects the first back plate 51 and the second back plate 52. As a result, the strength of the first back plate 51 itself and the strength of the second back plate 52 itself are increased, and the circuit board 21 is reinforced by the connecting portion 53 between the first back plate 51 and the second back plate 52 to form a circuit. The substrate 21 is less likely to bend.
Therefore, even when a force for bending the circuit board 21 is applied, the circuit board 21 is less likely to be twisted (difficult to bend), and the stress acting on the circuit board 21 is reduced. As a result, disconnection of the wiring pattern of the circuit board 21 and solder cracks are suppressed. As a result, the reliability of the product can be improved.
If the connecting portion 53 extends along the notch 27, the fragile portion 66 generated around the notch 27 is directly (or in the immediate vicinity) reinforced, so that the circuit board 21 is less likely to bend. Become. Further, when the connecting portion 53 extends along the notch portion 27, it is easy to secure a mounting area in the central region of the circuit board 21, and high-density mounting of components can be achieved. When the connecting portion 53 is along the surface of the circuit board 21, there is no gap between the connecting portion 53 and the circuit board 21 that promotes the bending of the circuit board 21, so that the circuit board 21 is less likely to bend.
When the connecting portion 53 has the fixing portion 71 fixed to the circuit board 21, the connecting portion 53 and the circuit board 21 are more integrated. Therefore, the circuit board 21 is less likely to shift with respect to the connecting portion 53, and the circuit board 21 is less likely to bend. When the fixing portion 71 is further fixed to the housing 5, the circuit board 21 is further supported by the housing 5, so that the circuit board 21 is less likely to bend.
As described above, stress concentration is likely to occur at the corner 27c of the notch 27, and the vicinity thereof is likely to be fragile. If, for example, the insertion hole 71a of the fixing portion 71 is provided in the immediate vicinity of the corner 27c of the notch portion 27, the peripheral portion of the corner 27c may become more fragile. On the other hand, the fixing portion 71 according to the present embodiment is provided at a position deviated from the corner 27c of the notch portion 27. Therefore, the fixing portion 71 can fix the connecting portion 53 to the circuit board 21 while maintaining the strength of the circuit board 21.
When the third heating element 38 is arranged along the connecting portion 53, the periphery of the third heating element 38 is reinforced by the connecting portion 53. That is, the deflection of the circuit board 21 is reduced around the third heating element 38, and the stress acting on the third heating element 38 is reduced.
In the present embodiment, a part of the third heating element 38 is arranged in an area surrounded by two fixing portions 57 of the second back plate 52 and a fixing portion 71 of the connecting portion 53. Therefore, the deflection of the circuit board 21 around the third heating element 38 is further reduced, and the stress acting on the third heating element 38 is further reduced.
The second back plate 52 includes two first beam portions 58a along the surface of the circuit board 21 and two second beam portions 58b floating from the circuit board 21. In such a second back plate 52, the strength of the back plate itself in the bending direction is higher than that of the back plate in which all four beams are in close contact with the circuit board. Further, by lifting a part of the second back plate 52 (second beam portion 58b), parts can be mounted even at a portion overlapping the second back plate 52. As a result, high-density mounting of components can be further achieved.
However, if all the beams of the back plate have a gap between the back plate and the circuit board 21, the circuit board 21 may be bent by this gap. Therefore, in the second back plate 52 according to the present embodiment, the two first beam portions 58a in the direction in which the circuit board 21 is relatively likely to bend (longitudinal direction) are substantially brought into close contact with the circuit board 21, and the circuit board 21 Two second beam portions 58b in a direction in which bending is relatively unlikely to occur (short direction) are floated from the circuit board 21. As a result, it is possible to secure the mounting area and reinforce the circuit board 21 at the same time in a well-balanced manner.
When the connecting portion 53 extends on a substantially extension line of the first beam portion 58a of the second back plate 52, a continuous beam portion is formed from the second back plate 52 to the connecting portion 53. Therefore, the circuit board 21 is less likely to bend.
When the first pressing member 45 fixed to the first back plate 51 and pressing the heat pipe 25 and the second pressing member 46 fixed to the second back plate 52 and pressing the heat pipe 25 are provided, the first pressing member is provided. The member 45 and the second pressing member 46 apply a bending force to the circuit board 21 via the heat pipe 25. In the circuit board 21 having such a configuration, when the first back plate 51 and the second back plate 52 are connected by the connecting portion 53, the beam portion that opposes the bending force from the first heating element 36 to the second heating element 37. Is formed, so that the deflection of the circuit board 21 becomes smaller.
Next, with reference to FIGS. 11 and 12, two modifications of the electronic device 1 are shown. The configurations having the same or similar functions as the configurations of the above embodiments are designated by the same reference numerals and the description thereof will be omitted. Further, the configuration other than that described below is the same as that of the above embodiment.
FIG. 11 shows the circuit board 21 of the electronic device 1 according to the first modification. As shown in FIG. 11, the first back plate 51 has, for example, an extension portion 91 extending from the fixing portion 55 to the side opposite to the first beam portion 56. A fixing portion 71 is provided at the tip of the extension portion 91. At least a portion of the third heating element 38 is located in an area surrounded by two fixing portions 57 of the second back plate 52 and a fixing portion 71 of the extension 91. As a result, the third heating element 38 is reinforced as in the above embodiment.
FIG. 12 shows the circuit board 21 of the electronic device 1 according to the second modification. As shown in FIG. 12, the second back plate 52 has, for example, an extension 91 extending from the fixing portion 57 to the opposite side of the first beam portion 58. The extension 91 extends along the third heating element 38. A fixing portion 71 is provided at the tip of the extension portion 91. At least a portion of the third heating element 38 is located in an area surrounded by two second fixing portions 57 of the second back plate 52 and a fixing portion 71 of the extension 91. As a result, the third heating element 38 is reinforced as in the above embodiment.
Although the electronic device 1 according to one embodiment of the present invention has been described above, the present invention is not limited thereto. The present invention is not limited to the above-described embodiment as it is, and at the implementation stage, the components can be modified and embodied within a range that does not deviate from the gist thereof.
The connecting portion 53 does not necessarily have to be along the notch portion of the circuit board 21. The fixing portion 71 of the connecting portion 53 may be fixed only to the housing 5, or may be fixed only to the circuit board 21. Further, the fixing portion 71 of the connecting portion 53 may be omitted as appropriate. The heat dissipation module 22 is not an essential component and can be omitted as appropriate. The second beam portion 58b of the second back plate 52 may be substantially in close contact with the circuit board 21.
1 ... Electronic equipment, 5 ... Housing, 21 ... Circuit board, 25 ... Heat pipe, 27 ... 1st notch, 27c ... Square, 28 ... 2nd Notch, 36,37,38 ... heating element, 45 ... 1st pressing member, 46 ... 2nd pressing member, 51 ... back plate, 52 ... back plate, 53 .. .Connecting part, 57 ... Fixed part, 58 ... Beam part, 58a ... 1st beam part, 58b ... 2nd beam part, 71 ... Fixed part.
Every citation, both ways
| Document | Relation | Office |
|---|---|---|
| JP2008251687A | Cites | Japan |
| JP2007299920A | Cites | Japan |
| JP2008294348A | Cites | Japan |
6 members in 2 offices
Priority claims2
| Document | Office | Kind | Date |
|---|---|---|---|
| 2010090889 | Japan | A | |
| JP20100090889 | – | – | – |
Members6
| Document | Office | Kind | |
|---|---|---|---|
| US2011249403A1 | United States of America | A1 | |
| JP2011222776A | Japan | A | |
| JP4875181B2This record | Japan | B2 | |
| US8243450B2 | United States of America | B2 | |
| US2012250257A1 | United States of America | A1 | |
| US8767390B2 | United States of America | B2 |
12 legal events, as the office reported them to INPADOC
Over the term
Point at a mark for the eventEvents
| Event | Code | |
|---|---|---|
| Written notification of registration of transferJAPANESE INTERMEDIATE CODE: R350R350 | R350 | |
| Request for change of ownership or part of ownershipJAPANESE INTERMEDIATE CODE: R313117S111 | S111 | |
| Request for change of ownership or part of ownershipJAPANESE INTERMEDIATE CODE: R313121S111 | S111 | |
| Renewal fee payment (event date is renewal date of database)FPAY | FPAY | |
| Renewal fee payment (event date is renewal date of database)FPAY | FPAY | |
| Written notification of patent or utility model registrationJAPANESE INTERMEDIATE CODE: R151R151 | R151 | |
| First payment of annual fees (during grant procedure)JAPANESE INTERMEDIATE CODE: A61A61 | A61 | |
| Written decision to grant a patent or to grant a registration (utility model)JAPANESE INTERMEDIATE CODE: A01A01 | A01 | |
| Written decision to grant a patent or to grant a registration (utility model)JAPANESE INTERMEDIATE CODE: A01A01 | A01 | |
| Decision of grant or rejection writtenTRDD | TRDD | |
| Written amendmentJAPANESE INTERMEDIATE CODE: A523A521 | A521 | |
| Notification of reasons for refusalJAPANESE INTERMEDIATE CODE: A131A131 | A131 |
Numbers
- Publication
- 4875181
- Publication, DOCDB
- 4875181
- Publication, EPODOC
- JP4875181B
- Application
- 90889
- Application, DOCDB
- 2010090889
- Application, EPODOC
- JP20100090889
Titles2
- Japanese
- 電子機器
- English
- Electronics
Classification
- CPC, 1
- G06F1/1616
- IPC, 1
- H05K1 02