Coat/develop module with shared dispense

Background of the invention

[0001] The present invention generally relates to the field of semiconductor processing equipment. In particular, the present invention relates to a method and an apparatus for distributing a fluid onto a semiconductor substrate. As a mere example, the methods and equipment were applied to two processing chambers in a coating / developing module sharing a central fluid distribution bank. However, it goes without saying that the present invention has many wide applicability.

[0002] Part of the process of forming an electronic device is typically performed within a multichamber processing system (eg, cluster tool) capable of continuously processing substrates (eg, semiconductor wafers) in a controlled processing environment. .. Typical cluster tools used to deposit (ie, coat) and develop photoresist materials and commonly known as track lithography tools include mainframes, which are pod / cassette-mounted devices and mainframes. It houses a plurality of board transfer robots that transfer boards to and from a plurality of processing chambers connected to a frame. Cluster tools are often used to allow the board to be processed in a repeatable manner within a controlled processing environment. The controlled processing environment has many advantages, including minimizing contamination of the substrate surface during transfer and completion of various substrate processing steps. Therefore, processing in a controlled environment reduces the number of defects formed and increases the yield of the device.

[0003] The two types of processing chambers commonly included within track lithography tools are substrate coating modules and substrate developing modules, which are sometimes collectively referred to as coating / developing modules. Generally, in coating modules, a spin coating process is used to form a photoresist layer or other coating layer on the top surface of the substrate. One method is to mount the substrate on a spin chuck that rotates up to thousands of revolutions per minute (RPM). A few millimeters of liquid (eg, photoresist) is applied to the central region of the substrate, and the rotational action of the spin chuck distributes the liquid over the surface of the substrate. In subsequent steps, the coating is processed to form features on the substrate, as is well known to those skilled in the art. In the developing module, a developer is applied to the surface of the substrate after exposure to the photoresist. The coat / develop module has a number of similarities and, with other factors, differences, including different nozzle structures corresponding to the various viscosities of the distribution fluid.

[0004] In some already known coating / developing modules, a single spin ball is attached to the system to dispense a photoresist or other coating liquid. For some photoresist coating applications, it is desirable to supply many different coating agents, including different thicknesses and materials. In particular, the shift to production on 300 mm substrates has increased the number of different coating liquids. Therefore, in some coat / develop modules, especially photoresist coat modules, the distribution system may include a number of different distribution nozzles that distribute different photoresists. Also included may be many other dispensing nozzles that supply photoresist with solutions and solvents of varying concentrations.

[0005] In some coating / developing modules, the distribution nozzle is manufactured with an exact tolerance according to the tolerance associated with the particular semiconductor process. As a result of the number and quality of distribution nozzles in some of these modules, the cost of the distribution system can be significantly higher than the cost of spin balls.

[0006] Generally, in coating / developing applications, the substrate is rotated to obtain a predetermined rotation speed to distribute the coating fluid, and then the substrate is continuously rotated for a predetermined period of time after the distribution step is completed. .. As mentioned above, the rotation of the substrate is utilized to disperse the coating fluid over the surface of the substrate. In these processes, the distribution system is inactive while substrate rotation distributes the resist. Therefore, in some distribution systems, the most expensive system component, the component contained within the distribution device, is idle for a significant portion of the processing time.

[0007] Other already known court modules use multiple spin balls. One example of a coating device in which two spin chucks are arranged in one casing is described in US Pat. No. 5,250,114. Wafers are loaded and unloaded with respect to the spin chuck by a single robot located outside the casing. One resist nozzle for distributing the resist liquid is attached to a nozzle arm attached to an endless belt surrounding the two rollers. The endless belt is driven by a motor. By using a motor and an endless belt, the nozzle arm can handle both spin chucks.

[0008] The system presented in US Pat. No. 5,205,114 has several problems. First, the system has only one resist nozzle that distributes one resist. Therefore, the system does not supply a large number of different coatings, including coatings made of different materials. Second, the only separator provided between the spin chuck and the other items contained within the casing is the cup that surrounds each spin chuck. The cup is raised to a predetermined position during coating. This cup structure may provide some containment for liquid particles scattered from the wafer surface, but this structure does not control the atmosphere in the vicinity of the wafer. As a result, the suspended particles and solvent mist move freely from one spin chuck to the other spin chuck, or from the waiting trench where one nozzle waits to one of the wafers.

[0009] Therefore, there is a technical need for an improved coating / developing module and an improved method of operating the coating / developing module.

Outline of the invention

[0010] According to the present invention, there is provided a technique related to the field of semiconductor processing equipment. In particular, the present invention includes methods and devices for distributing fluid onto a semiconductor substrate. As a mere example, the methods and equipment were applied to two processing chambers in a coating / developing module sharing a central fluid distribution bank. However, it goes without saying that the present invention has many wide applicability.

[0011] In a particular embodiment of the present invention, there is provided an apparatus that distributes a fluid during a semiconductor substrate processing operation. The device includes a central fluid distribution bank with multiple distribution nozzles coupled to multiple fluid sources and a first processing chamber located on the first side of the central fluid distribution bank. The device also translates between a second processing chamber located on the second side of the central fluid distribution bank and between the central fluid distribution bank and the first processing chamber and the second processing chamber. It includes a distribution arm and a solvent pre-wet nozzle provided on the distribution arm to distribute the solvent to the semiconductor substrate before the fluid is distributed.<u style="single">The plurality of distribution nozzles is a two-dimensional pattern including a first row of distribution nozzles housed in a first nozzle holder assembly and a second row of distribution nozzles housed in a second nozzle holder assembly. The first nozzle holder assembly and the second nozzle holder assembly are aligned substantially parallel to the line connecting the center of the first processing chamber and the center of the second processing chamber.</u>

[0015] According to the present invention, which is superior to the prior art, many advantages are achieved. For example, according to the present technology, some common components can be shared, thereby reducing system cost, complexity, and footprint. Moreover, the embodiment of the present invention enhances the reliability of the system while reducing the number of overlapping systems provided for each processing chamber. These and other advantages are described in more detail throughout this specification, especially below.

[0016] Many of these and other embodiments of the invention and their advantages and features will be described in more detail in conjunction with the text and accompanying drawings below.

Description of specific embodiments

[0028] According to the present invention, there is provided a technique related to the field of semiconductor processing equipment. In particular, the present invention includes methods and devices for distributing fluids on semiconductor substrates. As a mere example, the method and equipment were applied to two processing chambers of a coat / developer module sharing a central fluid distribution bank. However, it goes without saying that the present invention has a very wide range of applications.

[0029] FIG. 7 is a plan view of an embodiment of the Track Lithography Tool 710 showing a number of aspects of the invention that can be used advantageously. One embodiment of the track lithography 710 shown in FIG. 7 is a front-end module (sometimes referred to as a factory interface) 750, a central module 850, and a rear module (sometimes referred to as a scanner interface) 900. And include. The front-end module 750 generally includes one or more pod assemblies or FOUP805 (eg, items 805A-D), a front-end robot 808, and a front-end processing rack 752. The central module 850 generally includes a first central processing rack 852, a second central processing rack 854, and a central robot 807. The rear module 900 generally includes a rear processing rack 902 and a backend robot 809. In one embodiment, the track lithography tool 710 is with a front-end robot 808 that is designed to access the processing modules in the front-end processing rack 752; front-end processing rack 752, first central processing rack 852, second. With the central robot 807, which is designed to access the processing modules in the central processing rack 854 and / or the rear processing rack 902; It includes a back-end robot 809 that accesses the processing modules in the rear processing rack 902 and, in some cases, exchanges boards with the stepper / scanner 705. In one embodiment, the shuttle robot 810 is a substrate between two or more adjacent processing modules held in one or more processing racks (eg, front-end processing rack 752, first central processing rack 852, etc.). It is designed to be handed over. In one embodiment, the front-end enclosure 804 is used to control the environment around the front-end robot 808 and between the pod assembly 805 and the front-end processing rack 752.

[0030] FIG. 7 also includes further details of the conceivable process chamber structure found in aspects of the present invention. For example, the front-end module 750 generally includes one or more pod assemblies or FOUP805, a front-end robot 808, and a front-end processing rack 752. One or more Pod Assemblies 805 are generally adapted to accept one or more substrates "W" or one or more cassettes 806 capable of accommodating wafers processed within the Track Lithography Tool 710. The front-end processing rack 752 contains multiple processing modules (eg, bake plate 790, chill plate 780, etc.) that are designed to perform the various processing steps found in the substrate processing sequence. In one embodiment, the front-end robot 808 is adapted to pass substrates between cassettes mounted within the pod assembly 805 and between one or more processing modules held within the front-end processing rack 752.

The central module 850 generally includes a central robot 807, a first central processing rack 852, and a second central processing rack 854. The first central processing rack 852 and the second central processing rack 854 are designed to perform various processing steps found in the substrate processing sequence (eg, coater / developer module 100, bake). Includes module 790, chill plate 780, etc.). In one embodiment, the central robot 807 is adapted to pass the substrate between the front-end processing rack 752, the first central processing rack 852, the second central processing rack 854 and / or the rear processing rack 902. .. In one embodiment, the central robot 807 is positioned at a central position between the first central processing rack 852 and the second central processing rack 854 of the central module 850.

[0032] The rear module 900 generally includes a rear robot 809 and a rear processing rack 902. The rear processing rack 902 includes processing modules (eg, coater / developer module 760, bake module 790, chill plate 780, etc.) that are designed to perform the various processing steps found in the substrate processing sequence. There is. In one embodiment, the rear robot 809 is designed to pass the substrate between the rear processing rack 900 and the stepper / scanner 705. The Stepper / Scanner 705, which may be purchased from Canon USA in San Jose, CA, Nikon Precision in Belmont, California, and ASMLUS in Tempe, Arizona, is used, for example, in the manufacture of integrated circuits (ICs). It is a lithography projection device to be used. The Scanner / Stepper Tool 705 exposes the photosensitive material (resist) deposited on the substrate in the cluster tool to some form of electromagnetic radiation into individual layers of integrated circuit (IC) devices formed on the substrate surface. Form the corresponding circuit pattern.

[0033] In one embodiment, the controller 801 is used to control all the components within the cluster tool 710 and the processes that take place within the cluster tool 710. The controller 801 generally communicates with the stepper / scanner 705 to monitor and control the aspects of the process taking place within the cluster tool 810, as well as to control all aspects of the entire board processing sequence. It has become. Controller 801 is generally a microprocessor-based controller that receives inputs from users and / or from various sensors in one of the processing chambers and follows various inputs and software instructions held in the controller's memory. It is configured to adequately control the components of the processing chamber. The controller 801 generally includes a memory and a CPU (not shown) used by the controller to hold various programs, process the programs, and execute the programs when needed. Memory (not shown) is connected to the CPU and is readily available memory such as random access memory (RAM) or read-only memory (ROM), floppy disk, hard disk, or any other form of digital. It may be one or more of storage devices, local storage, or remote storage. Software instructions and data can be coded and stored in memory for instructions to the CPU. A support circuit (not shown) is also connected to the CPU to support the processor in the conventional manner. Examples of support circuits include caches, power supplies, clock circuits, input / output circuits, subsystems, etc., all of which are well known in the art. A program (or computer instruction) that can be read by controller 801 determines which tasks can be performed in the processing chamber. Preferably, the program is software that can be read by controller 801 and is defined.

[0034] In addition, FIG. 7 shows a coater / developer module 100 mounted in a second central processing rack 854, which may be configured to perform photoresist coating or developing steps in both processing chambers 110, 111. Is shown. This structure is beneficial because it can share some of the common components found in the two processing chambers 110, 111, thereby reducing system cost, complexity and tool footprint. is there. As shown in FIG. 7, and as described in more detail below, two spin chucks 130 and 131 are provided in the processing chambers 110 and 111, respectively. A shared central fluid distribution bank 112 is located between the two processing chambers, and the distribution arm assembly 118 can handle both spin chucks by selecting nozzles from the central fluid distribution bank. In an embodiment of the invention, the central robot 807 can independently access both processing chambers 110, 111.

[0035] FIG. 1A is a simplified perspective view of a fluid distribution device according to an embodiment of the present invention. The fluid distributor 100 is shown as including the frame 105. Additional components are provided by embodiments of the present invention, but for clarity, all components are not shown. For example, the intake and exhaust ports and power feeds that are commonly present on the sides of the frame are not shown in FIG. 1A. Further details on some of the components are given in Figure 2.

[0036] As shown in FIG. 1A, two separate processing chambers 110, 111 are located within frame 105 on the left and right sides of the central fluid distribution bank 112, respectively. In some coat / developer modules, processing chambers 110, 111 are referred to as processing stations. Here, the terms processing chamber and processing station are used interchangeably. As a mere example, the present invention is applied to a coater / developer module in which a pair of coat / developing balls are arranged horizontally on both sides of a central fluid distribution bank, but this is not essential in the present invention. In certain embodiments, the coat module is a photoresist module that uses a photoresist that is combined with different photoresists and solvents of different concentrations. As will be apparent to those of skill in the art, the fluid distributed by the central fluid distribution bank may be supplied in the form of liquid, vapor, mist or droplets.

[0037] In another embodiment, the processing chamber is a processing module in which the coating process may be performed using, for example, organic and inorganic fluids, mixed organic / inorganic fluids, water soluble fluids and the like. As a mere example, these fluids include bottom anti-reflective coating (BARC), resist, top anti-reflective coating (TARC), development, shrink coat, PIQ® (polyisodroquinazoline dione), spin-on glass, spin-on. It may be utilized in processes involving spin-on materials, including dielectrics, spin-on hard masks, and the like. Further, a chemical plating process, an electrochemical plating process, and a process using another fluid including a fluid used in wet clean and the like are also included in the scope of the present invention.

[0038] In the embodiment shown in FIG. 1A, processing chambers 110, 111 generally include all of the processing components described in US Provisional Application No. 60 / 639,109, along with a coater module or processor module. Also, the two chambers share a central fluid distribution bank 112. The central fluid distribution bank contains many distribution nozzles 114. Each of the spin chucks 130 and 131 is coupled to a motor (not shown) via a shaft (not shown) and rotates about an axis perpendicular to the surface of the spin chuck. In some embodiments, spin chucks 130, 131 include a sealing surface connected to a vacuum source that holds the substrate while it is being rotated.

[0039] A controller (not shown) is provided and connected to the motor so that the timing and rotation speed of the spin chuck can be controlled in a predetermined manner. In some embodiments, the rotational speed may vary or be constant over time. In one embodiment, the rotary motor is adapted to rotate a 300 mm semiconductor substrate between about 1 rpm (RPM) and about 5,000 RPM with an acceleration of up to about 50,000 RPM / s. Those skilled in the art are aware of many modifications, changes and alternatives.

[0040] The distribution arm assembly 118 is driven in three dimensions by motors 105, 106, 107. The motor 105 is used to move the distribution arm assembly along the guide rail 119 in a first direction, sometimes referred to as the longitudinal direction. The motor is selected to move the distribution arm assembly accurately and repeatedly at a given speed. In one embodiment, the movement of the distribution arm assembly along the guide rail is sufficient for the distribution arm assembly to reach the center of both wafers. In some embodiments, motion stoppers, position feedback, and interlocks are provided, as is well known to those of skill in the art.

[0041] Motor 106 is used to move the extension arm 117 in a second (vertical) direction, sometimes referred to as the vertical direction. The motor is selected to move the extension arm accurately and repeatably at a given speed. In one embodiment, vertical movement of the extension arm is sufficient for the gripper assembly to reach the distribution nozzle and lift the distribution nozzle above the top edge of the cup, the extension arm access door, and other obstacles. is there. In some embodiments, motion stoppers, position feedback, and interlocks are provided, as is well known to those of skill in the art.

[0042] Motor 107 is used to move the gripper assembly 108 in a third direction, sometimes referred to as the lateral direction. As shown in FIG. 1A, the gripper assembly 107 can be moved along the extension arm 220 and in a first position above the nozzle holder assembly 117 and in any second position above the nozzle holder assembly 116. It is indicated by. The motor is selected to move the gripper assembly accurately and repeatedly at a given speed. In one embodiment, lateral movement of the gripper assembly is sufficient for the gripper assembly to reach both nozzle banks. In embodiments where one vertically oriented nozzle bank is utilized, the movement of the gripper assembly is sufficient for the gripper assembly to reach all nozzles in the bank. In some embodiments, motion stoppers, position feedback, and interlocks are provided, as is well known to those of skill in the art.

[0043] FIG. 1B is a simplified perspective view of a fluid distribution device according to another embodiment of the present invention. As shown in FIG. 1B, distribution arm access shutters 122 and 123 are provided inside the frame 105. The distribution arm access shutter 122 is located between the first processing chamber 110 and the central fluid distribution bank 112. The distribution arm access shutter 123 is located between the central fluid distribution bank and the second processing chamber 111. In an embodiment of the invention, the distribution arm access shutter can move between open and closed positions and is positioned between these positions. As shown in FIG. 1B, the distribution arm access shutter 122 is approximately halfway between the open and closed positions. The distribution arm access shutter 123 is shown in the closed position. When the distribution arm access shutter is in the open position, the distribution arm assembly can move freely between the processing chamber and the central fluid distribution bank.

[0044] FIG. 2 is a simplified schematic plan view of the fluid distribution device according to the embodiment of the present invention. With reference to FIG. 2, cups 140, 141 are made from a material characterized by suitable rigidity and solvent resistance. For example, in some embodiments of the invention, the cups 140, 141 are made of a plastic material (eg, polytetrafluoroethylene (PTFE), perfluoroalkoxy (PFA), polypropylene, or polyvinylidene fluoride (PVDF)). Manufactured from ceramic materials, metals coated with plastic materials (eg aluminum or SST coated with either PVDF or Harar), or other materials compatible with the processing fluid supplied by the fluid distribution system 112. Will be done.

[0045] Lift assemblies (not shown) generally include actuators (not shown) such as air cylinders or servomotors and guides (not shown) such as linear ball bearing slides. The rotatable spin chucks 130 and 131 are moved up and down to a desired position. Therefore, the lift assembly uses an external robot located outside the housing 100 to replace the board, thus positioning the board mounted on the rotatable spinchak in the cup during processing and cupping the board. It is designed to be lifted above the top of the. A robot blade (not shown) attached to the external robot enters the device 100 via the robot access shutters 120 and 121.

As shown in FIG. 2, the pre-wet nozzle 115 is located at the tip of the extension arm assembly 118. In some embodiments, the pre-wet nozzle is piped via a component coupled to an extension arm. In these embodiments, a single pre-wet nozzle resides on the extension arm, simplifying the structure of each of the individual distribution nozzles. In particular, in some embodiments, the pre-wet nozzle is not included as part of each distribution nozzle. As further fully described below, the extension arm is a telescopic arm and thus allows the pre-wet nozzle 115 to be controllably positioned at a desired distance from the guide mechanism 119. The backside rinse (BSR) nozzle 138 is also included on the ball site located below the substrate positioned on the spin chucks 130, 131. The BSR nozzle supplies a solvent that is applied to the back surface of the substrate during the cleaning step. In one embodiment, an edge bead removal (EBR) arm 150 is provided at the corner of each processing chamber. As shown in FIG. 2, the EBR arm rotates about a pivot 152 located at the base end of the EBR arm and positions the tip of the EBR arm at a position on the edge of the substrate mounted on the spin chuck. To do. The EBR fluid is distributed through a nozzle located at the tip of the EBR arm to remove the edge beads present on the substrate.

The gas flow distribution system is adapted to provide a uniform flow of gas through the housing 100 and the processing chambers 110, 111. In certain embodiments, the gas flow distribution system supplies temperature and / or humidity controlled air through supply port 160. The cup exhaust 162 removes air from the processing chamber. The cup drain 164 removes fluid from the cup. As shown in Figure 2, four ports are shown in relation to temperature and / or humidity controlled air, cup exhaust and cup drain. This example is given because in some embodiments the four distribution systems are stacked vertically to reduce the system footprint. Thus, for example, each of the illustrated cup exhausts is coupled to the cup in one of the four distribution systems.

[0048] The various air and fluid processing components shown in FIG. 2 are shown as four separate ports, which are not required in the present invention. In other embodiments, the air and fluid processing components are provided in different numbers depending on the overall system structure. Also, the ports are shown to be uniformly sized within each group, which is not essential in the present invention. In addition, in other embodiments, separate ports are combined with larger shared ports. Those skilled in the art are aware of many modifications, changes and alternatives.

Also, as will be apparent to those of skill in the art, the supply of temperature and humidity controlled gases, such as air, to the processing chamber generally extends to the monitoring and control of various airflow parameters. As a mere example, in one embodiment of the invention, the environment of the chamber is monitored and parameters including solvent partial pressure and vapor concentration, air flow velocity, air flow rate, especially differential pressure are controlled to achieve the desired air temperature. And humidity is achieved. Further, in some embodiments, in addition to the chamber environment, electrostatic discharge from the membrane present on the substrate is controlled. Therefore, the coating properties can be controlled by controlling the processing chamber environment and substrate parameters, especially factors such as chuck spin rate.

[0050] Also, each of the two chambers includes a robot access shutter 120/121 to alternate between sealing for the access port and access for the robot arm to pass through the access port. The robot access shutter is opened when the substrate is ready for processing and a processing chamber is available to process the substrate. A robot arm (not shown) on which the substrate is supported moves the substrate from a position outside the processing chamber to a position on one spin chuck by being moved through an access port. Using a method well known to those skilled in the art, the robot arm places the substrate on the spin chuck and exits the processing chamber, while the robot access shutter is closed.

Using the robot access shutters 120, 121, the robot can independently and alternately load the substrates into the processing chambers 110, 111. In some embodiments, the robot access shutter 121 is opened and the substrate is loaded into the processing chamber 111 while the coating / developing process takes place in the processing chamber 110. Alternatively, the robot access shutter 120 allows independent access to the processing chamber 110 while the coating / developing process takes place within the processing chamber 111. By using an embodiment of the present invention, the loading and processing of the substrate is performed simultaneously in the two processing chambers, so that the system throughput is increased.

[0052] As shown in FIG. 2, each of the two processing chambers also includes distribution arm access shutters 122, 123 located between the spin chucks 130, 131 and the central fluid distribution bank 112, respectively. .. The distribution arm access shutter is not provided in the embodiment shown in FIG. 1, but in some embodiments the distribution arm access shutter is shielded to separate the processing chamber from the central fluid distribution bank during system operation. I do. Generally, the distribution arm access shutter is opened to allow the distribution arm assembly 118 to be moved into the processing chamber and closed after the distribution step is completed and the distribution arm assembly returns to the central fluid distribution bank area. Be done. In general, the coating process involves accelerating the substrate to a desired rotational speed, distributing a coating fluid such as a resist over a few seconds, and rotating the substrate continuously for tens of seconds. As a mere example, in one embodiment of the invention, the substrate is rotated until it reaches a speed of 500 RPM, the resist is distributed for about 3 seconds, and the substrate is maintained at a rotation speed of 1800 RPM for about 60 seconds. In this embodiment, after the resist fluid has been distributed, the distribution arm returns to the central fluid distribution bank and the distribution arm access shutter is closed while the substrate continues to rotate for about 55 seconds.

[0053] In some embodiments of the invention, the distribution arm access shutters 122, 123 not only separate from the liquid present in the central fluid distribution bank, but also further particle control within each processing chamber. Also do. For example, in one embodiment, the distribution arm access shutter provides a seal for the processing chamber that limits the flow of suspended particles from the central fluid distribution bank into the processing chamber. Therefore, the distribution arm access shutter minimizes crosstalk between processing chambers and prevents contaminants from moving across the chamber boundaries. The distribution arm access shutter also substantially limits the flow between the processing chambers, thereby reducing the flow of air between each processing chamber and the central fluid distribution bank. In general, for other reasons, the distribution arm access shutter is made of a chemically resistant material, such as aluminum, to provide an acceptable service life.

[0054] Although shown in FIG. 1B as sliding vertically between the open and closed positions, this is not essential in the present invention. In another embodiment, the distribution arm access shutter is moved between various positions in a linear orbit, a rotary orbit, an oblique orbit, or the like. In some embodiments, the distribution arm access shutter is operated by pneumatics, solenoids or motors, depending on the particular application. Generally, the movement of the distribution arm access shutter is controlled with one or more interlocks. In certain embodiments, the interlock operates using mechanical, electrical, or software switches or controls. Those skilled in the art are aware of many modifications, changes and alternatives.

[0055] Further, according to the embodiment of the present invention, the temperature and / or humidity in the vicinity of each substrate is independently controlled. In some coating processes, the parameters associated with finish coating are the temperature of the coating process, the humidity in the vicinity of the substrate, or a function of both. An embodiment of the present invention provides independent temperature and / or humidity control in processing chambers 110, 111. Thus, for coating processes that require different temperature and / or humidity settings in a particular process, embodiments of the present invention provide the necessary control. As a mere example, in the processing chamber 110, the coating process may require control of the temperature and humidity of the ambient environment of the substrate to be coated, while the developing process may only require temperature control. In yet other embodiments, temperature, humidity, or both of these may be controlled independently within the two processing chambers.

[0056] In some embodiments, the temperature and / or humidity in the processing chamber may be controlled before, during, and after the distribution operation by the use of the robot arm access door. In a process that is designed to operate at a given temperature and / or humidity, the access door can be opened to allow entry of the distribution arm, partially closed during the fluid distribution step, and the distribution arm. Can be fully opened again so that can exit the processing chamber and can be completely closed during the end of the distribution process.

[0057] The central fluid distribution bank 112 includes a plurality of nozzles 114 housed within one or more nozzle holder assemblies 116. As more fully described in US Provisional Application No. 60 / 639,109, fluid distribution systems used in coater or processor modules are the surfaces of a substrate on which one or more processing fluids are mounted on a spin chuck 130. May include one or more fluid source assemblies (not shown) that feed into. In some embodiments of the invention, the home position of the distribution arm is within the central fluid distribution bank region. Therefore, during the substrate loading and unloading operations through the robot access doors 120, 121, the distribution arm is located at the home position within the central fluid distribution bank area.

[0058] As shown in FIG. 1, in one embodiment of the present invention, two distribution nozzle banks are provided. Each nozzle 114 housed within the nozzle holder assembly 116 is generally connected to piping elements, including supply tubes, pumps, filters, suction back valves, fluid sources, etc., as well as one type of processing fluid. Is to be distributed. In certain embodiments, the processing fluid is a photoresist, solvent, coating, developer and the like. Those skilled in the art are aware of many modifications, changes and alternatives. Since the distribution arm can be positioned either within the left or right processing chamber, each central fluid distribution bank can handle both processing chambers, thereby providing the redundancy required within each processing chamber. (Duplicate) is reduced.

[0059] As will be appreciated by those skilled in the art, the nozzle structures utilized in the various processes will generally vary depending on the characteristics of the particular application. As a mere example, a resist nozzle bank generally contains 4 to 10 nozzles. In certain embodiments of the invention, the resist nozzle bank comprises more than 10 nozzles. In general, resist nozzles are designed to dispense a variety of chemicals, including resists, anti-reflective coatings, and spin-on materials (eg, SOG and SOD). On the other hand, the developing nozzle bank generally contains 1 to 3 nozzles. In some embodiments, four or more developing nozzles are included in the developing nozzle bank. Also, some developing nozzle banks include many rinse lines suitable for a particular application.

[0060] The structure of the nozzle, whether resist or developed, may share similarities in structure to suit a particular application. Further, the time during which the distribution operation is performed generally changes with the resist operation occurring over a period of several seconds, while the developing operation may occur over a period of several hundred seconds. Accordingly, embodiments of the present invention provide a central fluid distribution bank with nozzles suitable for the function of a particular distribution assembly.

As shown in FIGS. 1 and 2, the central fluid distribution bank contains a large number of distribution nozzles. In the embodiments shown in FIGS. 1A, 1B and 2, the distribution nozzles are composed of two groups of nozzles, specifically a first group of five nozzles housed within the nozzle holder assembly 116. , A second group of five nozzles housed within the nozzle holder assembly 117. As shown, the distribution nozzles are arranged vertically within the nozzle holder assembly. That is, the longitudinal dimension of the nozzle holder assembly is aligned parallel to the line connecting the center of the spin chuck 130 to the center of the spin chuck 131. In an embodiment in which the spin chucks are centered inside their corresponding processing chambers, the nozzle holder assembly is aligned parallel to the line connecting the center of the first processing chamber and the center of the second processing chamber. To. Another reference frame that can reference the nozzle holder assembly is the length of the guide mechanism 119. As shown in FIG. 1, the nozzle holder assemblies 116, 117 are aligned parallel to the length of the guide mechanism 119.

[0062] FIGS. 1-3 show a structure in which each nozzle holder assembly 116 includes five nozzles 114, but in other embodiments, the nozzle holder assembly 116 deviates from the basic scope of the present invention. It may include a smaller number of nozzles or a larger number of nozzles without any problem. For example, in one embodiment, two banks are provided, including eight nozzles per bank. Also, FIG. 1 shows that the nozzle holder assembly is aligned parallel to the length of the guide mechanism 119, which is not essential in the present invention. In an alternative embodiment, the nozzle holder assembly is aligned perpendicular to the length of the guide mechanism. Also, in one particular embodiment, a single bank containing eight nozzles is provided. In this particular embodiment, the single nozzle bank is arranged with the nozzle holder assembly aligned perpendicular to the length of the guide mechanism. These alternative embodiments will be described in more detail below.

[0063] As shown in FIG. 1, all of the distribution nozzles provided in the nozzle distribution bank are arranged in one plane parallel to the plane containing the spin chuck. However, this is not essential in the present invention. In an alternative embodiment (not shown), the distribution nozzles are stacked vertically, the first number of nozzles are arranged in the first plane, and the second number of nozzles are arranged in the second plane. Will be done. Also, in some embodiments, the nozzles are stacked vertically and staggered laterally to provide access to nozzles suitable for a particular application.

[0064] FIG. 3A is a simplified schematic plan view of the fluid distribution device in the first operating mode according to the embodiment of the present invention. In a particular embodiment of the invention, the fluid distributor is a coater / developer module. As shown in FIG. 3A, the distribution arm assembly 118, sometimes referred to as the nozzle arm assembly, is positioned on the right processing chamber to distribute the processing fluid onto the substrate 210 held on the spin chuck 130. .. The distribution arm assembly 118 may include an arm 220 and a nozzle holding mechanism 222. The distribution arm assembly 118 is attached to an actuator 224 that is designed to move the distribution arm assembly 118 and position it at an arbitrary position along the guide mechanism 226. In one embodiment, the system controller (not shown) can accurately position the nozzle 114 above the substrate 210 during processing and the nozzle holding mechanism can pick up and remove the nozzle 114 from the nozzle holder assembly 116. The distribution arm assembly 118 is designed to be moved vertically so that the distribution arm assembly 118 may be moved vertically. As described above, the distribution arm access shutter 123 moves vertically and closes, and separates one processing chamber 111 from the central fluid distribution bank 112 and the other process module 110 during processing to separate the two of the processing substrates. It is designed to prevent the next pollution.

[0065] FIG. 3B is a simplified schematic plan view of the fluid distributor in the second mode of operation according to another embodiment of the present invention. As shown in FIG. 3B, the distribution arm assembly 118 is positioned on the left processing chamber 110 to distribute the processing fluid onto the substrate 310 held on the spin chuck 130. The distribution arm access shutter 122 moves vertically to close and separates the processing chamber 110 from the central fluid distribution bank 112 and the other processing chamber 111 during processing to prevent secondary contamination of the substrate during processing. It has become.

[0066] FIG. 6 is a simplified schematic plan view of the fluid distribution device according to another embodiment of the present invention. As shown in FIG. 6, the fluid distribution device shares some commonalities with the device shown in FIG. For example, the device shown in FIG. 6 includes a central fluid distribution bank 612 with many distribution nozzles, a home area 614, and two processing chambers located on either side of the central fluid distribution bank and home area. .. As shown in FIG. 6, the central fluid distribution bank contains a single nozzle holder assembly 616, in which case the long dimensions of the nozzle holder assembly connect the center of the processing chamber 610 to the center of the processing chamber 611. It is almost perpendicular to the line to be used.

[0067] Also, the assembly shown in FIG. 6 accesses the nozzle holder assembly housed in the shared central fluid distribution bank, selects one distribution nozzle 618 from the nozzle holder assembly, and selects the distribution nozzle. Includes two nozzle arm assemblies 620, 622 that are designed to be removable. Each distribution arm assembly is driven by a motor (not shown) to translate the selected distribution nozzle to the desired position on the surface of the associated substrate. For example, the distribution arm assembly 620 is associated with the spin chuck 630 and the distribution arm assembly 622 is associated with the spin chuck 632. As shown in FIG. 6, the distribution arm assembly 622 is located in the home area and is not coupled to the distribution nozzle. The distribution arm assembly 620, on the other hand, is coupled to a distribution nozzle that was originally located at location 640 in the nozzle holder assembly. Further, the distribution arm assembly 620 has been moved to a position for colliding the coating fluid distributed from the distribution nozzle with the center of the substrate 650.

[0068] In the embodiment shown in FIG. 6, the distribution arm access shutter is divided to allow the distribution arm assembly to be individually accessed for the home position and the central fluid distribution bank. Further embodiments include additional movable or immovable dividers, as will be apparent to those skilled in the art. As a mere example, the immovable partition 660 located between the central fluid distribution bank 612 and the home position 614 provides environmental separation between the central fluid distribution bank and the home area. In the embodiment shown in FIG. 6, each distribution nozzle is piped to supply different fluid solutions. Alternatively, multiple nozzles may share the same pump to distribute the same fluid, for example a particular resist. Therefore, the fluid distributor shown in FIG. 6 can perform a wide variety of coating and developing processes.

[0069] FIG. 4A is a simplified flowchart showing a method of operating a fluid distribution device according to an embodiment of the present invention. The method comprises providing a central fluid distribution bank with a large number of distribution nozzles in step 410. In certain embodiments, the central fluid distribution bank comprises 16 nozzles that supply 16 different resists. In another embodiment, 16 nozzles are provided, but each nozzle supplies one resist. In this case, the concentration of the solvent is different for each nozzle. In other embodiments, the central fluid distribution bank comprises a smaller number or a larger number of nozzles depending on the particular application. The method also includes providing a first processing chamber located on the first side of the central fluid distribution bank and a second processing chamber located on the second side of the central fluid distribution bank. (Step 412). In this case, the first side is the side opposite to the second side. Further, the method also includes providing a distribution arm assembly that is located at the home position in step 414. In an embodiment of the invention, the home position is within the central fluid distribution bank region and the distribution arm assembly is adapted to translate between the central fluid distribution bank and the first and second processing chambers. .. The home position is not limited to a specific location within the central fluid distribution bank area, but it goes without saying that it is a general location near the distribution nozzle.

[0070] In step 416, one distribution nozzle is selected from a plurality of distribution nozzles located within the central fluid distribution bank, and the selected nozzles are coupled to the distribution arm assembly. In an embodiment of the invention, the step of selecting a first distribution nozzle comprises detachably coupling the nozzle to the distribution arm using a gripper assembly incorporated within the extension arm of the distribution arm assembly. I'm out. As mentioned above, the distribution arm assembly is designed to move in three dimensions, which allows the distribution arm assembly to lift a nozzle selected from the nozzle holder assembly and process the nozzle in any way. Can be moved to the chamber. In one embodiment, vertical translation is utilized to remove the selected nozzle from the nozzle holder assembly and position the nozzle at a predetermined distance from the substrate surface prior to the fluid distribution step. Those skilled in the art are aware of many modifications, changes and alternatives. In step 418, the distribution arm assembly is translated by the operation of the motor coupled to the distribution arm assembly. The distribution arm assembly is moved to position the distribution nozzle in a first position within the first processing chamber.

[0071] In some embodiments, the method comprises positioning the nozzle in a first distribution position located on a central region of the substrate mounted on the spin chuck 130, which is the present invention. It is not essential in the invention. An alternative embodiment utilizes other locations within the processing chamber 110.

[0072] The spin chuck is rotated so as to bring the substrate rotation speed to a predetermined value. In one embodiment, the spin chuck accelerates the substrate with an acceleration of up to about 50,000 RPM / s, thereby bringing the substrate from a stationary position to a rotational speed of about 5,000 RPM. Alternatively, the acceleration is in the range of about 10 RPM / s to about 50,000 RPM / s and the rotational speed is in the range of about 1 RPM to about 5,000 RPM. Of course, acceleration and rotational speed depend on the particular application.

[0073] In embodiments where solvent pre-wet is utilized, the first position is selected to position the solvent pre-wet nozzle present on the distribution arm assembly at the distribution position. In certain embodiments, the distribution position is where the solvent pre-wet nozzle is positioned on the center of the substrate. After the solvent pre-wet nozzle is positioned, the solvent is distributed onto the rotating substrate. The distribution arm assembly is then activated to move the distribution arm assembly, position the distribution nozzle on the center of the substrate, and then distribute the fluid from the distribution nozzle.

[0074] In step 420, the coating fluid is distributed from the selected distribution nozzle, generally on the center of the substrate mounted on the spin chuck 130. The spin chuck is rotated during the dispensing operation to spread the coating fluid over the surface of the substrate. The rotation speed may be variable or constant depending on the time. Those skilled in the art are aware of many modifications, changes and alternatives. In step 422, the distribution arm is returned to the home position and the selected distribution nozzle is returned to the central fluid distribution bank.

[0075] FIG. 4B is a simplified flowchart showing a method of operating the fluid distribution device according to another embodiment of the present invention. Steps 450 to 460 in FIG. 4B are comparable to steps 410 to 420 in FIG. 4A. In the alternative embodiment shown in FIG. 4B, instead of returning the distribution arm assembly to the central fluid distribution bank and the selected distribution nozzle back to the central fluid distribution bank, it was mounted on the spin chuck 131 in step 462. The distribution arm assembly is translated to a third position located on the central region of the second substrate. In embodiments where solvent prewetting is utilized, the second position is selected so that the solvent can be distributed onto the center of the second substrate and the coating fluid can be distributed from the distribution nozzle prior to adjusting the distribution nozzle position. ..

[0076] In a manner similar to the first distribution operation, the spin chuck 131 is rotated so that the substrate rotation speed reaches a predetermined value. The distribution parameters may be the same as or different from the distribution parameters used during the first distribution step, depending on the application. In step 464, any pre-wet solvent and coating fluid is dispensed from the selected dispensing nozzle, generally on the central portion of the substrate mounted on the spin chuck 131. A spin chuck is rotated during the dispensing operation to spread the coating fluid over the surface of the substrate. The rotation speed may be variable or constant depending on the time. Those skilled in the art are aware of many modifications, changes and alternatives. After the second distribution step, in step 466 the distribution arm assembly is returned to its home position on the central fluid distribution bank and the selected distribution nozzle is returned to the central fluid distribution bank.

[0077] The previous embodiment utilizes one selected distribution nozzle for the first distribution step and the second distribution step, which is not essential in the present invention. In another embodiment, a step is inserted between steps 460 and 462 such that the first distribution nozzle is selected in the first distribution step and the second distribution nozzle is selected in the second distribution step. Will be done. Also, in yet another alternative embodiment, the method of distributing the fluid onto the substrate is not stopped after the second distribution step and is continued over three or more distribution steps. Distributing steps may alternate between processing chambers, or the same or different coating fluids may be used to characterize a series of dispensing steps within a processing chamber. Possible variations in home position for multiple distribution nozzles, multiple processing chambers, and distribution arm assemblies within the central fluid distribution bank area are apparent to those of skill in the art.

The substrate can be loaded into the two processing chambers using any suitable robot. For example, in one embodiment, the central robot is adapted to alternately deliver substrates to both processing chambers in one embodiment of the invention. In some embodiments, the distribution arm assembly is positioned at the home position within the central fluid distribution bank area while the substrate is loaded into the processing chamber by the central robot. During the robot loading and unloading process, the distribution arm access door is generally kept closed, which limits the movement of air and suspended particles between the processing chamber and the central fluid distribution back area.

The aforementioned sequence of steps provides a method according to an embodiment of the invention for distributing a fluid onto a semiconductor substrate. As illustrated, the method uses a combination of steps, including a method utilizing a central fluid distribution bank shared by two processing chambers according to an embodiment of the invention. Also, without departing from the scope of the claims described herein, a plurality of steps may be added, one or more steps may be eliminated, or one or more steps may be provided in different sequences. Alternatives can be given. Further details of the method can be found throughout the specification.

[0080] FIG. 5 is a simplified flowchart showing how to operate the fluid distribution device according to still another embodiment of the present invention. The method comprises providing a central fluid distribution bank in step 510. The central fluid distribution bank has many distribution nozzles. In certain embodiments, the central fluid distribution bank comprises 16 nozzles that supply 16 different resists. In another embodiment, 16 nozzles are provided, but each nozzle supplies a single resist. In this case, the concentration of the solvent is different for each nozzle. In other embodiments, the central fluid distribution bank comprises a smaller number or a larger number of nozzles depending on the particular application. The method also provides a first processing chamber located on the first side of the central fluid distribution bank (step 512) and a second processing chamber located on the second side of the central fluid distribution bank. It also includes providing (step 514). In certain embodiments, the first processing chamber and the second processing chamber are located on either side of the central fluid distribution bank.

[0081] In addition, the method provides a distribution arm assembly in the home position that is designed to translate between the central fluid distribution bank and the first and second processing chambers (step 516). It also includes selecting one distribution nozzle from multiple distribution nozzles. In embodiments of the present invention, the step of selecting a distribution nozzle comprises detachably coupling the nozzle to the distribution arm using a gripper assembly incorporated within the extension arm of the distribution arm assembly ( Step 518). Also, in some embodiments, the gripper assembly is translated vertically and laterally after connecting the nozzle to the gripper assembly. In one embodiment, vertical translation is utilized to separate the tube coupled to the selected distribution nozzle from the tube coupled to other distribution nozzles in the nozzle holder assembly, whereby the total number of particles is reduced. It will be reduced. Those skilled in the art are aware of many modifications, changes and alternatives.

[0082] In one particular embodiment, the first and second processing chambers are controlled to provide a separate temperature and humidity environment for each processing chamber. Therefore, in one embodiment, a distribution arm access shutter is provided between the central fluid distribution bank and both processing chambers, thereby providing environmental control for the processing chambers. In step 520, the first distribution arm access shutter located between the central fluid distribution bank and the first processing chamber is opened. When the first distribution arm access shutter opens, it provides a path for the distribution arm assembly to move the selected nozzle from the central fluid distribution bank to the first position in the first processing chamber (step 522). ). Generally, the first distribution position is a position where the distribution nozzle is arranged on the central region of the substrate mounted on the spin chuck 130, but this is not essential in the present invention. Other embodiments utilize other locations within the processing chamber 110, such as the location where the solvent pre-wet nozzle is positioned on the center of the substrate.

[0083] The spin chuck is rotated so as to bring the substrate rotation speed to a predetermined value. In one embodiment, the spin chuck accelerates the substrate with an acceleration of up to about 50,000 RPM / s, thereby bringing the substrate from a stationary position to a rotational speed of about 5,000 RPM. Alternatively, the acceleration is in the range of about 10 RPM / s to about 50,000 RPM / s and the rotational speed is in the range of about 1 RPM to about 5,000 RPM. Of course, acceleration and rotational speed depend on the particular application.

[0084] In step 524, the coating fluid is distributed from the distribution nozzle, generally on the center of the substrate mounted on the spin chuck 130. The spin chuck is rotated during the dispensing operation to spread the coating fluid over the surface of the substrate. The rotation speed may be variable or constant depending on the time. Those skilled in the art are aware of many modifications, changes and alternatives. In step 526 the distribution arm assembly is translated to the home position. In certain embodiments, the time that the substrate is rotated after fluid distribution is less than the translation time for the distribution arm assembly to move from the distribution position to the central fluid distribution bank region. Therefore, in this particular embodiment, the distribution arm assembly exits the first processing chamber after the distribution step and the first distribution arm access shutter is closed before the completion of the spin step.

[0085] In step 530, the second distribution arm access shutter located between the central fluid distribution bank and the second processing chamber is opened. When the second distribution arm access shutter opens, it provides a path for the distribution arm assembly to move the selected nozzle from the central fluid distribution bank to a second position within the second processing chamber (step 532). ). Generally, the second distribution position is a position where the distribution nozzle is located on the central region of the substrate mounted on the spin chuck 131, but this is not essential in the present invention. Other embodiments utilize other locations within the processing chamber 111, such as the location where the solvent pre-wet nozzle is positioned on the center of the substrate. As described in connection with the processing chamber 110, the spin chuck 131 is rotated to bring the substrate rotation speed to a predetermined value.

[0086] In step 534, the coating fluid is distributed from the distribution nozzle, generally on the center of the substrate mounted on the spin chuck 131. The spin chuck is rotated during the dispensing operation to spread the coating fluid over the surface of the substrate. The rotation speed may be variable or constant depending on the time. Those skilled in the art are aware of many modifications, changes and alternatives. In step 536 the distribution arm assembly is translated to the home position. In certain embodiments, the time that the substrate is rotated after fluid distribution is less than the translation time for the distribution arm assembly to move from the distribution position to the central fluid distribution bank region. Therefore, in this particular embodiment, the distribution arm assembly exits the second processing chamber after the distribution step and the second distribution arm access shutter is closed before the completion of the spin step (step 538). In some embodiments, at step 540, the selected distribution nozzle is removed from the distribution arm assembly.

The above sequence of steps provides a method of distributing a fluid onto many semiconductor substrates according to one embodiment of the present invention. As illustrated, the method uses a combination of steps, including a method utilizing a central fluid distribution bank shared by two environmentally controlled processing chambers according to one embodiment of the invention. Also, without departing from the scope of the claims described herein, a plurality of steps may be added, one or more steps may be eliminated, or one or more steps may be provided in different sequences. You can give choices. Further details of the method can be found throughout the specification.

[0088] In another embodiment, the distribution arm access shutter is opened, partially closed and reopened during each coating process. In this particular embodiment, the distribution arm access shutter is partially closed after the distribution arm has entered the processing chamber, and the distribution arm has been distributed to the side of the processing chamber adjacent to the central fluid distribution bank after the fluid has been distributed. Is moved. In this embodiment, during the coating process, the distribution arm access shutter remains partially closed while the distribution arm waits on the side of the processing chamber for the coating process to be completed. After the coating process is complete, the distribution arm access shutter is opened and the distribution arm returns to the central fluid distribution bank area. In this case, the first distribution nozzle is returned to the central fluid distribution bank and the distribution arm access shutter is closed again. In this particular embodiment, the time the distribution arm access shutter is open and the time the processing chamber is exposed to the central fluid distribution bank area is minimized, thereby the central fluid distribution bank area or Secondary contamination from any of the other processing chambers is reduced.

[0089] The previous embodiment utilizes one selected distribution nozzle for the first distribution step and the second distribution step, which is not essential in the present invention. In another embodiment, a step is inserted between steps 528 and 530 such that the first distribution nozzle is selected in the first distribution step and the second distribution nozzle is selected in the second distribution step. Will be done. Also, in yet another alternative embodiment, the method of distributing the fluid onto the substrate is not stopped after the second distribution step and is continued over three or more distribution steps. Distributing steps may alternate between processing chambers, or the same or different coating fluids may be used to characterize a series of dispensing steps within a processing chamber. Possible variations in home position for multiple distribution nozzles, multiple processing chambers, and distribution arm assemblies within the central fluid distribution bank area are apparent to those of skill in the art.

[0090] FIG. 8 is a simplified timing diagram showing the operation of the fluid distribution device according to the embodiment of the present invention. This figure is merely an example of a process flow and does not limit the scope of the claims described herein. Also, the figure shown in FIG. 8 is not drawn at a constant magnification and merely represents a series of timed events related to each other. FIG. 8 (A) shows the movement of the distribution arm assembly along the guide rail 119 shown in FIG. With reference to FIG. 2 and FIG. 8 (B), the left side of the distribution arm assembly (to handle the processing chamber 110) by plotting the lateral velocity of the distribution arm assembly as a function of time as plus and minus velocities, respectively ) And to the right (to handle the processing chamber 111).

[0091] In the embodiment shown in FIG. 8 (A), time t₀At, the distribution arm assembly is translated and stopped from the home position to the left for a predetermined time. As will be apparent to those skilled in the art, the predetermined time and moving speed are associated with each other depending on the distance from the home position to the distribution position within the processing chamber 110. For clarity, the movement of the distribution nozzle and distribution arm assembly in the plane orthogonal to and perpendicular to the guide rail (with respect to FIG. 2) is not shown in (A) of FIG. As you can see, these movements are included as described above.

[0092] As shown in (B) of FIG. 8, the processing chamber 110 (PC).₁The rotational speed of the spin chuck in) is shown as a function of time. In one embodiment, the rotation of the chuck in the processing chamber 110 is not started until the distribution arm assembly is positioned in the desired position and stopped. In other embodiments, the spin process is initiated while the distribution arm assembly is still in motion. Also, as mentioned above, in some embodiments, the distribution arm assembly moves from a first position where the solvent for the pre-wet process is distributed to a second position where the resist or other fluid is distributed. Will be moved. In the embodiment shown in FIG. 8 (B), the spin process for the spin chuck in the processing chamber 110 takes time t before the distribution arm assembly stops moving.₁Starts at. The spin chuck is accelerated and has a constant rotational speed R over a first predetermined time during the distribution process.₁A second rotational speed R that is maintained at a higher speed over a second predetermined time.₂Accelerate to. Of course, the rotation speed and time are determined by the specific application.

[0093] FIG. 8 (C) shows the amount of fluid distributed from the distribution nozzle as a function of time. As can be seen by comparing (A) and (C) in FIG. 8, the distribution arm assembly was placed in the processing chamber 110 (PC) during this distribution step.₁) Is located inside. As shown in (C) of FIG. 8, the spin chuck in the processing chamber 110 has a first velocity R.₁The fluid distribution step is performed while rotating in. For clarity, further distribution steps such as solvent prewetting are omitted from this figure. Also, during the fluid distribution step, the amount of fluid distributed is shown to be constant over time, which is not essential in the present invention, as will be appreciated by those skilled in the art. In an alternative embodiment, the time-based distribution follows other functional relationships, which increases and / or decreases the time-based distribution, eg, to suit a particular process.

[0094] FIGS. 8 (D) and 8 (E) show the processing chamber 111 (PC).₂) Indicates the rotation speed of the spin chuck and the amount of fluid distributed from the distribution nozzle according to the time. With reference to (A) in FIGS. 2 and 8, time t₃The distribution arm assembly is now translated to the right from the left processing chamber 110, thereby moving the distribution nozzle to the desired position within the processing chamber 111. As shown, the time used to move the distribution arm assembly from the processing chamber 110 to the processing chamber 111 is greater than the time originally required to move the distribution arm assembly from the home position to the processing chamber 111. long. In some embodiments, this increase in time is due to the movement of the distribution arm assembly, which moves at approximately equal speeds but over long distances. Of course, in alternative embodiments, speed, distance, and time are associated, as will be apparent to those skilled in the art. In addition, the time t shown in (A) of FIG.₃The translation of the distribution arm assembly in is shown to occur at a constant rate. In another embodiment, the movement of the distribution arm assembly is stopped at the home position, the distribution nozzles are replaced as described above, and the movement continues to the left. Those skilled in the art are aware of many modifications, changes and alternatives.

[0095] time t₄Then, the spin chuck in the processing chamber 111 has the first rotation speed R.₃Rotated up to, also time t₅After the fluid is distributed in, the rotational speed is Velocity R₄Will be further increased. As shown, the spin process in the two processing chambers overlaps. Therefore, in some embodiments of the invention, the use of a shared distribution structure increases system throughput, although there are other advantages. Time t₆Now the distribution arm assembly is translated to the home position.

[0096] The examples and embodiments described herein are for illustrative purposes only. In light of this, various modifications or modifications will be recalled to those skilled in the art, and those modifications or modifications should be included within the ideas and scope of this application and the appended claims. The present invention shall not be limited except as indicated by the appended claims.

<figref num="1A">It is a simplified perspective view of the fluid distribution apparatus which concerns on one Embodiment of this invention.</figref><figref num="1B">It is a simplified perspective view of the fluid distribution apparatus which concerns on other embodiment of this invention.</figref><figref num="2">It is a simplified schematic plan view of the fluid distribution apparatus which concerns on one Embodiment of this invention.</figref><figref num="3A">It is a simplified schematic plan view of the fluid distribution apparatus in the 1st operation mode which concerns on one Embodiment of this invention.</figref><figref num="3B">It is a simplified schematic plan view of the fluid distribution apparatus in the 2nd operation mode which concerns on other embodiment of this invention.</figref><figref num="4A">It is a simplified flowchart which shows the method of operating the fluid distribution apparatus which concerns on one Embodiment of this invention.</figref><figref num="4B">It is a simplified flowchart which shows the method of operating the fluid distribution apparatus which concerns on other embodiment of this invention.</figref><figref num="5">It is a simplified flowchart which shows the method of operating the fluid distribution apparatus which concerns on still another Embodiment of this invention.</figref><figref num="6">It is a simplified schematic plan view of the fluid distribution apparatus which concerns on other embodiment of this invention.</figref><figref num="7">It is a top view of one Embodiment of the track lithography tool which shows many aspects of this invention.</figref><figref num="8">It is a simplified timing diagram which shows the operation of the fluid distribution apparatus which concerns on one Embodiment of this invention.</figref>